Imaging unit, endoscope, and method for manufacturing imaging unit

Abstract

The invention provides an imaging unit, an endoscope, and a method for manufacturing the imaging unit. An image pickup unit includes a semiconductor package, a planar circuit board, an irregularly-shaped circuit board having a recessed portion in which an interval between a first wall surface and a second wall surface of the recessed portion becomes smaller toward a bottom surface, a plurality of electronic components, and a resin filling the recessed portion, the irregularly-shaped circuit board having the recessed portion, the first distance being larger than the second distance, and the second distance being smaller than the first distance. Wherein the first distance is a first distance between a first electronic component of the plurality of electronic components and the first wall surface; the second distance is the largest distance among the distances between each of a plurality of electronic components other than the first electronic component and a wall surface close to the electronic component among the first wall surface and the second wall surface.

Description

Technical Field

[0001] The present invention relates to a camera unit having a plurality of electronic components installed between a planar circuit substrate and a special-shaped circuit substrate, an endoscope having a camera unit having a plurality of electronic components installed between a planar circuit substrate and a special-shaped circuit substrate, and a method for manufacturing a camera unit having a plurality of electronic components installed between a planar circuit substrate and a special-shaped circuit substrate. Background Art

[0002] Japanese Patent Application Publication No. 2017-23234 discloses an imaging unit of an endoscope using a special-shaped circuit substrate as a three-dimensional circuit device. The imaging unit includes: a semiconductor package; a planar circuit substrate that is bonded to the semiconductor package and has a plurality of electronic components mounted thereon; and a special-shaped circuit substrate that is bonded to the planar circuit substrate and has the plurality of electronic components housed in a cutout. Summary of the invention

[0003] The imaging unit of the embodiment of the present invention comprises: a semiconductor package, the semiconductor package having a first surface and a second surface on the opposite side of the first surface, the semiconductor package including an imaging element, and a plurality of first electrodes being arranged on the second surface; a planar circuit substrate, the planar circuit substrate having a third surface and a fourth surface on the opposite side of the third surface, a plurality of second electrodes being arranged on the third surface, a plurality of third electrodes and a plurality of fourth electrodes being arranged on the fourth surface, the plurality of second electrodes being respectively bonded to the plurality of first electrodes; and an irregularly shaped circuit substrate, the irregularly shaped circuit substrate having a fifth surface and a first side surface and a second side surface perpendicular to the fifth surface, the fifth surface being divided into a first front surface and a second front surface by a recess having openings on the first side surface and the second side surface, the recess having a first wall surface, a second wall surface, and bottom surface, the special-shaped circuit substrate is provided with a plurality of fifth electrodes on the fifth surface, and the plurality of fifth electrodes are respectively joined to the plurality of third electrodes; a plurality of electronic components, the plurality of electronic components are respectively joined to the plurality of fourth electrodes of the planar circuit substrate, and the plurality of electronic components are accommodated in the recess; and a resin filling the recess, in the special-shaped circuit substrate, the interval between the first wall surface and the second wall surface becomes smaller as it approaches the bottom surface, and the first distance is greater than the second distance, wherein the first distance is the distance between the first electronic component closest to the first side surface among the plurality of electronic components and the first wall surface, and the second distance is the largest distance among the distances between each of the plurality of electronic components other than the first electronic component and the wall surface close to the electronic component among the first wall surface and the second wall surface.

[0004] An endoscope according to an embodiment of the present invention has a camera unit at the front end of the insertion portion, the camera unit comprising: a semiconductor package, the semiconductor package having a first surface and a second surface on the opposite side of the first surface, the semiconductor package including an image pickup element, and a plurality of first electrodes being arranged on the second surface; a planar circuit substrate, the planar circuit substrate having a third surface and a fourth surface on the opposite side of the third surface, a plurality of second electrodes being arranged on the third surface, a plurality of third electrodes and a plurality of fourth electrodes being arranged on the fourth surface, the plurality of second electrodes being respectively bonded to the plurality of first electrodes; and an irregularly shaped circuit substrate, the irregularly shaped circuit substrate having a fifth surface and a first side surface and a second side surface perpendicular to the fifth surface, the fifth surface being divided into a first front surface and a second front surface by having a recessed portion having an opening on the first side surface and the second side surface respectively, the recess having a first A first wall surface, a second wall surface and a bottom surface, the special-shaped circuit substrate is provided with a plurality of fifth electrodes on the fifth surface, the plurality of fifth electrodes are respectively bonded to the plurality of third electrodes; a plurality of electronic components, the plurality of electronic components are respectively bonded to the plurality of fourth electrodes of the planar circuit substrate, the plurality of electronic components are accommodated in the recess; and a resin filling the recess, in the special-shaped circuit substrate, the interval between the first wall surface and the second wall surface becomes smaller as it approaches the bottom surface, the first distance is greater than the second distance, wherein the first distance is the distance between a first electronic component closest to the first side surface among the plurality of electronic components and the first wall surface, and the second distance is the largest distance among the distances between each of the plurality of electronic components other than the first electronic component and the wall surface close to the electronic component among the first wall surface and the second wall surface.

[0005] The manufacturing method of the imaging unit according to the embodiment of the present invention comprises the following steps:

[0006] The steps of manufacturing semiconductor packages, planar circuit substrates and special-shaped circuit substrates, wherein:

[0007] The semiconductor package has a first surface and a second surface on the opposite side of the first surface, and includes an imaging element, a plurality of first electrodes are arranged on the second surface, the planar circuit substrate has a third surface and a fourth surface on the opposite side of the third surface, a plurality of second electrodes are arranged on the third surface, the plurality of second electrodes are respectively bonded to the plurality of first electrodes, a plurality of third electrodes and a plurality of fourth electrodes are arranged on the fourth surface, the special-shaped circuit substrate has a fifth surface and a first side surface and a second side surface perpendicular to the fifth surface, the fifth surface is divided into a first front surface and a second front surface by a recess having openings on the first side surface and the second side surface respectively, the recess has a first wall surface, a second wall surface and a bottom surface, the interval between the first wall surface and the second wall surface becomes smaller as it approaches the bottom surface, and the plurality of fifth electrodes are arranged on the fifth surface;

[0008] The step of bonding a plurality of electronic components to the plurality of fourth electrodes of the planar circuit substrate, wherein:

[0009] The first distance is greater than the second distance, wherein the first distance is the distance between a first electronic component closest to the first side surface among the plurality of electronic components and the first wall surface, and the second distance is the largest distance among the distances between each of the plurality of electronic components other than the first electronic component and a wall surface close to the electronic component among the first wall surface and the second wall surface;

[0010] The steps of respectively bonding the plurality of first electrodes of the semiconductor package to the plurality of second electrodes of the planar circuit substrate, and respectively bonding the plurality of third electrodes of the planar circuit substrate to the plurality of fifth electrodes of the special-shaped circuit substrate;

[0011] A step of injecting resin from between the first electronic component and the first wall surface; and

[0012] The step of curing the resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view of the imaging unit according to the first embodiment.

[0014] Figure 2 It is an exploded view of the imaging unit according to the first embodiment.

[0015] Figure 3 This is a back view of the planar circuit board of the image pickup unit according to the first embodiment.

[0016] Figure 4 It is a side view of the imaging unit according to the first embodiment.

[0017] Figure 5This is a flowchart of the method for manufacturing the image pickup unit according to the first embodiment.

[0018] Figure 6 It is a perspective view for explaining the method of manufacturing the image pickup unit according to the first embodiment.

[0019] Figure 7 It is a cross-sectional view for explaining the method of manufacturing the image pickup unit according to the first embodiment.

[0020] Figure 8 It is a cross-sectional view of the image pickup unit according to the first embodiment.

[0021] Fig. 9 This is a back view of a planar circuit board of an image pickup unit according to Modification 1 of the first embodiment.

[0022] Fig.10 It is a diagram showing a configuration example of an endoscope according to a second embodiment. DETAILED DESCRIPTION

[0023] <First Embodiment>

[0024] use Figures 1 to 4 The imaging unit 1 according to the present embodiment will be described.

[0025] The drawings based on the embodiments are schematic. The relationship between the thickness and width of each part of the drawings, the ratio of the thickness of each part, etc. are different from the actual. The drawings also contain parts with different size relationships and ratios. The illustrations and labeling of some structural elements are omitted. The direction of light incidence is called "front", and the opposite direction of "front" is called "rear".

[0026] The imaging unit 1 of the present embodiment includes a semiconductor package 10 , a planar circuit board 20 , a special-shaped circuit board 30 , a plurality of electronic components 40 , and a resin 50 .

[0027] The semiconductor package 10 includes a glass cover 12 and an imaging element 11. The glass cover 12 has a first surface 10SA. The rear surface of the glass cover 12 is bonded to the front surface of the imaging element 11, and the imaging element 11 has a second surface 10SB as a rear surface. The imaging element 11 using silicon as a base material is a complementary metal oxide semiconductor (CMOS) light-receiving element or a charge coupled device (CCD).

[0028] A plurality of first electrodes 13 are disposed on the second surface 10SB. The first electrodes 13 are, for example, solder bumps. A driving signal and power are provided to the imaging element 11 via the plurality of first electrodes 13. Furthermore, the subject image received by the imaging element 11 is converted into an electrical signal and output as an imaging signal via the plurality of first electrodes 13.

[0029] Alternatively, the semiconductor package 10 may include a stacked element in the imaging element 11, the stacked element being formed by stacking a plurality of semiconductor elements for processing imaging signals once, and a plurality of first electrodes 13 being disposed on the rear surface of the stacked element. Alternatively, a lens unit formed by stacking a plurality of optical elements may be disposed on the first surface 10SA of the semiconductor package 10.

[0030] The planar circuit substrate 20 has a third surface 20SA and a fourth surface 20SB on the opposite side of the third surface 20SA. A plurality of second electrodes 21 are disposed on the third surface 20SA. Figure 4 As shown, the plurality of second electrodes 21 are respectively bonded to the plurality of first electrodes 13 of the semiconductor package 10. A plurality of third electrodes 22 and a plurality of fourth electrodes 23 are provided on the fourth surface 20SB.

[0031] On each of the plurality of fourth electrodes 23, a plurality of electronic components 40 are surface mounted. The plurality of electronic components 40 are, for example, substantially rectangular parallelepiped chip capacitors. A substantially rectangular parallelepiped is a rectangular parallelepiped whose corners are chamfered to form a curved surface. In the imaging unit 1, the plurality of electronic components 40 are all chip capacitors of size 0603 (long side 0.6 mm, short side 0.3 mm).

[0032] The special-shaped circuit substrate 30 has a fifth surface 30SA, a first side surface 30SS1 and a second side surface 30SS2 which are respectively perpendicular to the fifth surface 30SA, and a sixth surface 30SB which is opposite to the fifth surface 30SA. The special-shaped circuit substrate 30 is a molded circuit device (MID: Molded Interconnect Device) manufactured by injection molding and provided with wiring and the like on the surface. The base material of the MID is epoxy resin, liquid crystal polymer, polyimide, polycarbonate, etc. The special-shaped circuit substrate 30 as a MID can be easily manufactured into a complex shape.

[0033] The fifth surface 30SA of the special-shaped circuit substrate 30 is divided into a first front surface 30SA1 and a second front surface 30SA2 by having a recess T30 with an opening on the first side surface 30SS1 and the second side surface 30SS2. The recess T30 is a groove having a first wall surface T30S1, a second wall surface T30S2, and a bottom surface T30SB. In other words, the special-shaped circuit substrate 30 includes: a first arm having a first front surface 30SA1; and a second arm having a second front surface 30SA2, and the inner side surfaces of the two arm portions are the first wall surface T30S1 and the second wall surface T30S2. The width W at the opening of the recess T30, that is, the distance between the first front surface 30SA1 and the second front surface 30SA2, is 1.2 mm.

[0034] A plurality of fifth electrodes 31 are disposed on the fifth surface 30SA (the first front surface 30SA1 and the second front surface 30SA2 ). The plurality of fifth electrodes 31 are bonded to the plurality of third electrodes 22 of the planar circuit board 20 , respectively.

[0035] The plurality of electronic components 40 disposed on the fourth surface 20SB of the planar circuit board 20 are housed in the recessed portion T30 of the special-shaped circuit board 30 .

[0036] A plurality of wiring layers 32 are respectively arranged on the third side surface 30SS3 and the fourth side surface 30SS4 perpendicular to the first side surface 30SS1 and the second side surface 30SS2 of the special-shaped circuit substrate 30. The plurality of wiring layers 32 are extended from each side of the plurality of fifth electrodes 31. Signal cables (not shown) are respectively connected to the ends of the plurality of wiring layers 32.

[0037] The resin 51 is disposed in the gap between the semiconductor package 10 and the planar circuit substrate 20, that is, the joint portion where the first electrode 13 and the second electrode 21 are joined. In order to efficiently fill the gap with the resin 51, a cutout C20 is provided on the third surface 20SA. The uncured and liquid resin 51 is injected into the gap from the cutout C20 using a nozzle (not shown), and spreads between the semiconductor package 10 and the planar circuit substrate 20 by using interfacial tension.

[0038] The resin 50 is disposed in the recessed portion T30 of the variant-shaped circuit substrate 30 , that is, in the joint portion where the fourth electrode 23 and the plurality of electronic components 40 are joined.

[0039] The resin 50 is injected into the recess T30 as an uncured liquid resin 50 similarly to the resin 51. However, it is not easy to fill the resin 50 between the small multiple electronic components 40 accommodated in the smaller recess T30. For example, if the multiple electronic components 40 are arranged symmetrically in the upper and lower parts and the left and right parts, the multiple electronic components 40 will hinder the flow of the resin 50. Therefore, there is a possibility that a cavity without the resin 50 is generated, resulting in reduced reliability. In addition, the time required for the injection of the resin 50 may be prolonged. Furthermore, when the resin 50 is injected using the nozzle, since the opening that becomes the injection hole is small, the resin 50 may overflow around the recess T30, resulting in an increase in the external dimensions of the camera unit 1.

[0040] The image pickup unit 1 has the following features in terms of the arrangement of the plurality of electronic components 40 housed in the recess T30 .

[0041] The first electronic component 41 closest to the first side surface 30SS1 is arranged so that its long side is parallel to the first side surface 30SS1. The first distance L1 (0.4 mm) between the first electronic component 41 and the first wall surface T30S1 is greater than the third distance L3 (0.2 mm) between the first electronic component 41 and the second wall surface T30S2. That is, the camera unit 1 ensures an opening on the first side surface 30SS1 side that becomes an injection hole when the resin 50 is injected.

[0042] The plurality of electronic components 42 to 45 other than the first electronic component 41 are arranged such that their long sides are perpendicular to the first side surface 30SS1 .

[0043] The largest distance among the distances between each of the plurality of electronic components 42 to 45 other than the first electronic component 41 and a wall surface close to the electronic component among the first wall surface T30S1 and the second wall surface T30S2 is referred to as a second distance L2.

[0044] The electronic components 42 and 44 are closer to the first wall surface T30S1 than the second wall surface T30S2. The distance between the electronic components 42 and 44 and the first wall surface T30S1 is the second distance L2 (0.2 mm). In addition, the electronic components 43 and 45 are closer to the second wall surface T30S2 than the first wall surface T30S1. The distance between the electronic components 43 and 45 and the second wall surface T30S2 is the same as the second distance L2.

[0045] Furthermore, the maximum distance among the distances between the plurality of electronic components 40 (41 to 45) is referred to as the fourth distance L4. The distance between the electronic component 42 and the electronic component 43 is the fourth distance L4 (0.25 mm). The distance between the electronic component 44 and the electronic component 45 is also the fourth distance L4. The distance between the electronic component 43 and the electronic component 45 and the distance between the electronic component 44 and the electronic component 42 are also 0.2 mm, which is smaller than the fourth distance L4.

[0046] Furthermore, a fifth distance L5 that is a distance between the plurality of electronic components 40 ( 41 to 45 ) and the bottom surface T30SB of the recess T30 is 0.25 mm.

[0047] In the imaging unit 1 having the above-described structure, the first distance L1 (0.4 mm) between the first electronic component 41 and the first wall surface T30S1 is wider than the widths of the other gaps (the second distance L2, the third distance L3, the fourth distance L4, and the fifth distance L5) in the internal space of the recess T30.

[0048] In addition, if Figure 4 As shown, the first wall surface T30S1 and the second wall surface T30S2 of the recess T30 of the special-shaped circuit substrate 30 are inclined relative to the fifth surface 30SA. That is, the angle θ between the first wall surface T30S1 and the second wall surface T30S2 relative to the fifth surface 30SA is 100 degrees, which is more than 90 degrees. In other words, the interval W between the first wall surface T30S1 and the second wall surface T30S2 (the width of the recess T30 as a cutout) becomes smaller as it approaches the bottom surface T30SB.

[0049] As described later, in the imaging unit 1, the resin 50 injected between the first electronic component 41 and the first wall surface T30S1 efficiently spreads in the inner space of the recess T30 due to the interfacial tension. Therefore, the imaging unit 1 is less likely to have a cavity without the resin 50 in the recess T30, and thus has high reliability.

[0050] <Method of Manufacturing Image Capture Unit>

[0051] according to Figure 5 A method for manufacturing the imaging unit 1 will be described with reference to the flowchart of FIG.

[0052] <Step S10>

[0053] A semiconductor package 10, a planar circuit substrate (planar wiring board) 20, and a special-shaped circuit substrate (three-dimensional wiring board) 30 are manufactured.

[0054] The semiconductor package 10 has a first surface 10SA and a second surface 10SB opposite to the first surface 10SA. The semiconductor package 10 includes an imaging element 11 and a cover glass 12, and a plurality of first electrodes 13 are disposed on the second surface 10SB.

[0055] The planar circuit board 20 has a third surface 20SA and a fourth surface 20SB opposite to the third surface 20SA. A plurality of second electrodes 21 are disposed on the third surface 20SA, and the plurality of second electrodes 21 are respectively bonded to the plurality of first electrodes 13. A plurality of third electrodes 22 and a plurality of fourth electrodes 23 are disposed on the fourth surface 20SB.

[0056] The special-shaped circuit substrate has a fifth surface 30SA and a first side surface 30SS1 and a second side surface 30SS2 perpendicular to the fifth surface 30SA. The fifth surface 30SA is divided into a first front surface 30SA1 and a second front surface 30SA2 by having a recessed portion T30 with an opening on the first side surface 30SS1 and the second side surface 30SS2. The recessed portion T30 as a cutout has a first wall surface T30S1, a second wall surface T30S2, and a bottom surface T30SB. The interval W between the first wall surface T30S1 and the second wall surface T30S2 becomes smaller as it approaches the bottom surface T30SB. A plurality of fifth electrodes 31 are arranged on the fifth surface 30SA.

[0057] In addition, the angle θ between the first wall surface T30S1 and the second wall surface T30S2 relative to the fifth surface 30SA is preferably greater than 90 degrees and less than 120 degrees, and particularly preferably greater than 95 degrees and less than 110 degrees. If the angle θ is within the above range, the required number of electronic components 40 can be accommodated in the recess T30, and the resin 50 can be efficiently filled into the recess T30.

[0058] <Step S20>

[0059] The plurality of electronic components 40 are bonded to the plurality of fourth electrodes 23 of the planar circuit substrate 20 .

[0060] The first electronic component 41 is the closest to the first side surface 30SS1 among the plurality of electronic components 40. As already described, in the configuration of the plurality of electronic components 40, the first distance L1 between the first electronic component 41 and the first wall surface T30S1 is wider than the widths of the other plurality of gaps (the second distance L2, the third distance L3, the fourth distance L4, the fifth distance L5) in the internal space of the recess T30.

[0061] <Step S30>

[0062] The plurality of first electrodes 13 of the semiconductor package 10 are respectively bonded to the plurality of second electrodes 21 of the planar circuit substrate 20. The plurality of third electrodes 22 of the planar circuit substrate 20 are respectively bonded to the plurality of fifth electrodes 31 of the special-shaped circuit substrate 30.

[0063] In addition, the semiconductor package 10 and the planar circuit substrate 20 may be bonded together before step S20 .

[0064] <Step S40>

[0065] like Figure 6 As shown, the resin 50 is injected into the recess T30 from between the first electronic component 41 and the first wall surface T30S1 using the nozzle 55 .

[0066] The first distance L1 (0.4 mm) between the first electronic component 41 and the first wall surface T30S1 is wider than the widths of the other multiple gaps (the second distance L2, the third distance L3, the fourth distance L4, and the fifth distance L5) in the internal space of the recess T30. Figure 7 As shown, the resin 50 spreads toward the plurality of gaps in the inner space of the recess T30 due to interfacial tension.

[0067] In order to efficiently inject the resin 50, the first distance L1 is preferably greater than 0.3 mm. Since the resin 50 is easily expanded by interfacial tension, the second distance L2, the third distance L3, the fourth distance L4, and the fifth distance L5 are preferably less than 0.3 mm.

[0068] <Step S50>

[0069] The resin 50 is subjected to a curing process. For example, a thermal curing method or a method of combining ultraviolet curing and thermal curing is used for the curing process.

[0070] According to this manufacturing method, the resin 50 can be filled not only reliably but also in a short time. Furthermore, there is no risk that the resin 50 overflows around the recess T30 during injection and increases the external dimensions of the image pickup unit 1 .

[0071] Although description is omitted, in step S40 , the resin 51 is injected into the gap between the semiconductor package 10 and the planar circuit substrate 20 , and in step S50 , the resin 51 is cured.

[0072] It is efficient to continuously perform the injection of the resin 50 and the injection of the resin 51. Therefore, the cutout C20 of the planar circuit board 20, which serves as the injection port of the resin 51, is preferably located on the first side surface 30SS1 side where the injection port of the resin 50 is located.

[0073] In addition, the resin 50 and the resin 51 are preferably the same resin. In the imaging unit 1 in which the resin 50 is disposed in the gap between the semiconductor package 10 and the planar circuit substrate 20, the resin 50 is filled in the notch C20 at the corner of the third surface 20SA of the planar circuit substrate 20 on the first side surface 30SS1 side.

[0074] That is, the imaging unit 1 preferably has a cutout filled with the resin 50 at a corner of the third surface 20SA of the planar circuit board 20 on the first side surface 30SS1 side.

[0075] <Modification of First Embodiment>

[0076] Similar to the imaging unit 1, the imaging units 1A and 1B of the modified example of the first embodiment have the same effects as the imaging unit 1. Therefore, the same reference numerals as those of the imaging unit 1 are given to the components having the same functions as the imaging unit 1, and the description thereof is omitted.

[0077] <Modification 1 of the First Embodiment>

[0078] exist Figure 8 In the camera unit 1A of the present variation shown, the bottom surface T30SB of the recess T30 of the special-shaped circuit substrate 30 is inclined relative to the fifth surface 30SA. That is, the distance between the plurality of electronic components 40 and the bottom surface T30SB, i.e., the fifth distance L5 (depth H30 of the recess T30), continuously decreases as it moves from the first side surface 30SS1 side toward the second side surface 30SS2 side.

[0079] Therefore, in the image pickup unit 1A, the resin 50 injected from the first side surface 30SS1 side is more likely to spread toward the second side surface 30SS2 side than in the image pickup unit 1 .

[0080] <Modification 2 of the First Embodiment>

[0081] exist Fig. 9 In the image pickup unit 1B of the present modification shown, a plurality of electronic components 40 having different sizes are provided, and the first electronic component 41 is the largest among the plurality of electronic components 40 .

[0082] Electronic components 41, 42, and 43 are chip capacitors of size 0603 (long side 0.6 mm, short side 0.3 mm). Electronic components 44 to 46 are chip capacitors of size 0402 (long side 0.4 mm, short side 0.2 mm).

[0083] The basic arrangement of the plurality of electronic components 40 in the imaging unit 1B is set under the same conditions as the arrangement of the plurality of electronic components 40 in the imaging unit 1. However, the electronic component closest to the first side surface 30SS1 is the largest first electronic component 41 among the plurality of electronic components 40 (41 to 46).

[0084] Furthermore, the first distance L1 (0.4 mm) between the first electronic component 41 and the first wall surface T30S1 is wider than the widths of the other plurality of gaps (the second distance L2, the third distance L3, the fourth distance L4, and the fifth distance L5) in the internal space of the recess T30.

[0085] The imaging unit of the present invention may include three or more electronic components 40 of different sizes. Furthermore, the electronic components 40 are not limited to chip capacitors, but may include chip inductors, IC chips, and other electronic components with different functions.

[0086] <Second Embodiment>

[0087] Fig.10 The endoscope 5 (5A, 5B) of the present embodiment shown includes: an insertion portion 9B having a camera unit 1 (1A, 1B) disposed at its distal end 9A; an operation portion 9C disposed on the proximal end side of the insertion portion 9B; and a universal cable 9D extending from the operation portion 9C.

[0088] The endoscope 5 includes the imaging unit 1 ( 1A, 1B) which is highly reliable and can be easily manufactured. Therefore, the endoscope 5 is highly reliable and can be easily manufactured.

[0089] The present invention is not limited to the above-described embodiments and modifications, and various changes, combinations, and applications are possible without departing from the gist of the invention.

Claims

1. A camera unit, comprising: A semiconductor package having a first surface and a second surface opposite to the first surface, the semiconductor package including an imaging element, and a plurality of first electrodes disposed on the second surface; A planar circuit substrate, the planar circuit substrate having a third surface and a fourth surface opposite to the third surface, a plurality of second electrodes being arranged on the third surface, a plurality of third electrodes and a plurality of fourth electrodes being arranged on the fourth surface, the plurality of second electrodes being respectively bonded to the plurality of first electrodes; A special-shaped circuit substrate, the special-shaped circuit substrate having a fifth surface and a first side surface and a second side surface perpendicular to the fifth surface, the fifth surface being divided into a first front surface and a second front surface by a recess having an opening on the first side surface and the second side surface, the recess having a first wall surface, a second wall surface and a bottom surface, the special-shaped circuit substrate being provided with a plurality of fifth electrodes on the fifth surface, the plurality of fifth electrodes being respectively joined to the plurality of third electrodes; a plurality of electronic components, the plurality of electronic components being respectively bonded to the plurality of fourth electrodes of the planar circuit substrate, the plurality of electronic components being accommodated in the recess; as well as The resin filling the recessed portion, In the special-shaped circuit substrate, the distance between the first wall surface and the second wall surface decreases as it approaches the bottom surface. The first distance is greater than the second distance, wherein the first distance is the distance between a first electronic component among the multiple electronic components that is closest to the first side and the first wall, and the second distance is the largest distance among the distances between each of the multiple electronic components other than the first electronic component and the walls of the first wall and the second wall that are close to the electronic component.

2. The imaging unit according to claim 1, wherein: The first distance is greater than a third distance between the first electronic component and the second wall surface.

3. The imaging unit according to claim 2, wherein: The first distance is greater than a fourth distance which is the largest among a plurality of distances between the plurality of electronic components.

4. The imaging unit according to claim 3, wherein: The first distance is greater than a fifth distance which is the largest of a plurality of distances between the plurality of electronic components and the bottom surface of the recess.

5. The imaging unit according to claim 4, wherein: In the recessed portion, the bottom surface is inclined relative to the fifth surface in a state in which the fifth distance decreases from the first side surface to the second side surface.

6. The imaging unit according to claim 1, wherein: The first electronic component is arranged such that its long sides are parallel to the first side surface, and each of the plurality of electronic components other than the first electronic component is arranged such that its long sides are perpendicular to the first side surface.

7. The imaging unit according to claim 1, wherein: The plurality of electronic components are of the same size.

8. The imaging unit according to claim 1, wherein: The imaging unit includes the plurality of electronic components having different sizes. The first electronic component is the largest among the plurality of electronic components.

9. The imaging unit according to claim 1, wherein: A cutout filled with the resin is provided at a corner of the third surface of the planar circuit substrate on the first side surface side.

10. An endoscope comprising an imaging unit at a front end portion of an insertion portion, The camera unit comprises: A semiconductor package having a first surface and a second surface opposite to the first surface, the semiconductor package including an imaging element, and a plurality of first electrodes disposed on the second surface; A planar circuit substrate, the planar circuit substrate having a third surface and a fourth surface opposite to the third surface, a plurality of second electrodes being arranged on the third surface, a plurality of third electrodes and a plurality of fourth electrodes being arranged on the fourth surface, the plurality of second electrodes being respectively bonded to the plurality of first electrodes; A special-shaped circuit substrate, the special-shaped circuit substrate having a fifth surface and a first side surface and a second side surface perpendicular to the fifth surface, the fifth surface being divided into a first front surface and a second front surface by a recess having an opening on the first side surface and the second side surface, the recess having a first wall surface, a second wall surface and a bottom surface, the special-shaped circuit substrate being provided with a plurality of fifth electrodes on the fifth surface, the plurality of fifth electrodes being respectively joined to the plurality of third electrodes; a plurality of electronic components, the plurality of electronic components being respectively bonded to the plurality of fourth electrodes of the planar circuit substrate, the plurality of electronic components being accommodated in the recess; as well as The resin filling the recessed portion, In the special-shaped circuit substrate, the distance between the first wall surface and the second wall surface decreases as it approaches the bottom surface. The first distance is greater than the second distance, wherein the first distance is the distance between a first electronic component among the multiple electronic components that is closest to the first side and the first wall, and the second distance is the largest distance among the distances between each of the multiple electronic components other than the first electronic component and the walls of the first wall and the second wall that are close to the electronic component.

11. A method for manufacturing a camera unit, comprising the following steps: The steps of manufacturing semiconductor packages, planar circuit substrates and special-shaped circuit substrates, wherein: The semiconductor package has a first surface and a second surface opposite to the first surface, and includes an imaging element, and a plurality of first electrodes are arranged on the second surface. The planar circuit substrate has a third surface and a fourth surface on the opposite side of the third surface, a plurality of second electrodes are arranged on the third surface, the plurality of second electrodes are respectively bonded to the plurality of first electrodes, and a plurality of third electrodes and a plurality of fourth electrodes are arranged on the fourth surface. The special-shaped circuit substrate has a fifth surface and a first side surface and a second side surface perpendicular to the fifth surface, the fifth surface is divided into a first front surface and a second front surface by a recess having openings on the first side surface and the second side surface respectively, the recess has a first wall surface, a second wall surface and a bottom surface, the interval between the first wall surface and the second wall surface decreases as it approaches the bottom surface, and a plurality of fifth electrodes are arranged on the fifth surface; The step of bonding a plurality of electronic components to the plurality of fourth electrodes of the planar circuit substrate, wherein: The first distance is greater than the second distance, wherein the first distance is the distance between a first electronic component closest to the first side surface among the plurality of electronic components and the first wall surface, and the second distance is the largest distance among the distances between each of the plurality of electronic components other than the first electronic component and a wall surface close to the electronic component among the first wall surface and the second wall surface; The steps of respectively bonding the plurality of first electrodes of the semiconductor package to the plurality of second electrodes of the planar circuit substrate, and respectively bonding the plurality of third electrodes of the planar circuit substrate to the plurality of fifth electrodes of the special-shaped circuit substrate; A step of injecting resin from between the first electronic component and the first wall surface; and The step of curing the resin.

Images