Printed circuit board, camera module and electronic equipment

Abstract

The invention discloses a printed circuit board, a camera module and electronic equipment, the printed circuit board comprises a circuit board body, the circuit board body comprises a light-transmitting area and a non-light-transmitting area, and the non-light-transmitting area is arranged around the light-transmitting area; the light-transmitting area of the circuit board body is respectively connected with a filter film and an image sensor and is used for transmitting light passing through the filter film to the image sensor; and a component, wherein the component is arranged in the non-light-transmitting area.

Description

Technical Field

[0001] The present application belongs to the field of photographing technology, and specifically relates to a printed circuit board, a camera module and an electronic device. Background Art

[0002] At present, with the continuous development of mobile terminal devices such as smart phones, the competition for imaging capabilities of mobile terminal devices is becoming increasingly fierce. The number of camera modules has become more and more, and their size has become larger and larger, resulting in the camera modules occupying more and more internal space of the entire device.

[0003] In the process of implementing this application, the applicant found that there are at least the following problems in the prior art: In order to achieve better shooting effects while taking into account the demand for thinness and lightness of mobile terminal devices, it is a problem that currently needs to be paid attention to and solved.

[0004] Application Contents

[0005] The present application aims to provide a printed circuit board, a camera module and an electronic device, which at least solve the problem of achieving better shooting effects while taking into account the requirements for thinness and lightness of mobile terminal devices.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application provides a printed circuit board, comprising:

[0008] A circuit board body, the circuit board body comprising a light-transmitting area and a non-light-transmitting area, the non-light-transmitting area being arranged around the light-transmitting area; the light-transmitting area of ​​the circuit board body is respectively connected to a filter film and an image sensor, for transmitting light passing through the filter film to the image sensor;

[0009] Components are arranged in the non-light-transmitting area.

[0010] In a second aspect, an embodiment of the present application provides a camera module, including an image sensor and the above-mentioned printed circuit board;

[0011] The image sensor is connected to the light emitting side of the circuit board body and is opposite to the light transmitting area of ​​the circuit board body.

[0012] In a third aspect, an embodiment of the present application provides an electronic device, including:

[0013] case;

[0014] The camera module mentioned above is arranged on the shell.

[0015] In the embodiment of the present application, since the circuit board body has a light-transmitting area, a filter film can be arranged in the light-transmitting area of ​​the circuit board body, so that the light-transmitting area of ​​the circuit board body can transmit the light passing through the filter film to the image sensor, so as to form an image through the image sensor and realize the shooting function of the camera module. In the embodiment of the present application, the filter film is arranged in the light-transmitting area of ​​the circuit board body, so that the circuit board body can serve as the base of the filter film, thereby simplifying the structure of the filter and realizing the thinning of the camera module. On this basis, while increasing the camera module, the thickness of the electronic device can be avoided from increasing, and the shooting effect of the camera module can be ensured while taking into account the thinness requirements of the electronic device.

[0016] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is a schematic diagram of a cross-sectional structure of a printed circuit board according to an embodiment of the present application;

[0019] Figure 2 is a top view of a printed circuit board according to an embodiment of the present application;

[0020] Figure 3 is a schematic diagram of the structure of the printed circuit board and the image sensor assembled according to an embodiment of the present application;

[0021] Figure 4 It is a schematic diagram of the cross-sectional structure of a camera module according to an embodiment of the present application.

[0022] Reference numerals:

[0023] 1. Circuit board body; 11. Light-transmitting area; 12. Non-light-transmitting area; 13. Glass substrate; 14. Dielectric material layer; 141. Through hole; 15. First wiring layer; 16. Second wiring layer; 17. Third wiring layer; 18. Fourth wiring layer; 21. First threading hole; 22. Second threading hole; 23. First connecting part; 24. Second connecting part; 3. Components; 4. Filter film; 5. Image sensor; 51. Pixel area; 6. Lens group; 7. Focus motor; 8. Bracket. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0025] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] Combine the following Figure 1 - Figure 4 A printed circuit board, a camera module, and an electronic device according to embodiments of the present application are described.

[0029] In a first aspect, the present application discloses a printed circuit board, such as Figure 1As shown, the printed circuit board includes: a circuit board body 1, the circuit board body 1 includes a light-transmitting area 11 and a non-light-transmitting area 12, and the non-light-transmitting area 12 is arranged around the light-transmitting area 11; the light-transmitting area 11 of the circuit board body 1 is respectively connected to the filter film 4 and the image sensor 5, for transmitting the light passing through the filter film 4 to the image sensor 5; components 3, and the components 3 are arranged in the non-light-transmitting area 12.

[0030] In the embodiment of the present application, since the circuit board body 1 has a light-transmitting area 11, the filter film 4 can be arranged in the light-transmitting area 11 of the circuit board body 1, so that the light-transmitting area 11 of the circuit board body 1 can transmit the light passing through the filter film 4 to the image sensor 5, so as to form an image through the image sensor 5, thereby realizing the shooting function of the camera module. In the embodiment of the present application, the filter film 4 is arranged in the light-transmitting area 11 of the circuit board body 1, so that the circuit board body 1 can serve as the base of the filter film 4, thereby simplifying the structure of the filter and realizing the thinning of the camera module. On this basis, while increasing the camera module, the thickness of the electronic device can be avoided from increasing, and the shooting effect of the camera module can be ensured while taking into account the thinness requirements of the electronic device.

[0031] In the embodiment of the present application, the printed circuit board is a PCB circuit board, which is a carrier for the electrical connection of the electronic components 3. It is made by printing, based on a universal substrate, and forms point-to-point connections and printed components according to a predetermined design. The printed circuit board may include a single-sided board, a double-sided board, a multi-layer board, and a high-density interconnect board (HDI) according to the circuit hierarchy. The printed circuit board in the present application is applied to the camera module, and the printed circuit board in the present application can also be directly applied to the electronic device as a support body to provide mechanical support and electrical connection for the electronic components 3.

[0032] For example, when the printed circuit board in the present application is applied in a camera module, the printed circuit board can be arranged between the light filtering structure and the image sensor 5, and is used to transmit the light filtered by the light filtering structure to the image sensor 5 for imaging, thereby realizing the shooting function of the camera module.

[0033] Specifically, the printed circuit board may include a circuit board body 1, the circuit board body 1 may include a light-transmitting area 11 and a non-light-transmitting area 12, the non-light-transmitting area 12 may be arranged around the light-transmitting area 11, and the non-light-transmitting area 12 and the light-transmitting area 11 may be combined to form a "U" shape. The light-transmitting area 11 of the circuit board body 1 may transmit light, and the non-light-transmitting area 12 of the circuit board body 1 may block the transmission of light.

[0034] Specifically, the circuit board body 1 may include a light incident side and a light exiting side, and light may be emitted from the light incident side to the circuit board body 1, and from the light exiting side to the circuit board body 1. Further, the light incident side of the circuit board body 1 may be connected to the filter film 4, and the light exiting side may be connected to the image sensor 5, and the filter film 4 may be connected to the light transmission area 11 of the circuit board body 1, so that the light may be first filtered by the filter film 4, and then pass through the circuit board body 1 to the image sensor 5 for imaging.

[0035] Alternatively, the filter film 4 can also cover the light-emitting side of the light-transmitting area 11, the filter film 4 and the image sensor 5 are located on the same side of the circuit board body 1, the filter film 4 is arranged on the side of the image sensor 5 facing the circuit board body 1, and the filter film 4 can be spaced apart from the image sensor 5. In this way, the light can first pass through the circuit board body 1, and then be filtered by the filter film 4 and then emitted to the image sensor 5 for imaging.

[0036] Specifically, since the circuit board body 1 has the light-transmitting area 11, the circuit board body 1 can serve as the base of the filter film 4. There is no need to set a separate base for the filter film 4, which can reduce the space occupied by the filter and reduce the use of a connecting frame for fixing and supporting the filter. This can reduce the thickness of the camera module and simplify the structure of the camera module.

[0037] In some optional embodiments, the filter film 4 may be connected to the circuit board body 1 by splicing, that is, the filter film 4 may not be integrated into the printed circuit board.

[0038] In some other optional embodiments, the filter film 4 covers the light incident side or the light emitting side of the light transmission area 11 and can be integrated into the printed circuit board.

[0039] In the embodiment of the present application, the filter film 4 is covered on the light incident side of the light-transmitting area 11, so that the filter film 4 can be integrated with the circuit board body 1. The printed circuit board can integrate the function of filtering stray light without the need to set up a separate filter, which is convenient for simplifying the structure and occupied space of the camera module.

[0040] Specifically, the filter film 4 can be an IR cut-off coating. The filter film 4 is arranged on the light incident side of the light-transmitting area 11, so that the printed circuit board can realize infrared filtering function, which is used to filter near-infrared and infrared light, and can play the same role as a filter.

[0041] Specifically, the light-transmitting area 11 of the circuit board body 1 has good light transmittance and can be directly used as the substrate of the filter film 4. The filter film 4 can be prepared on the light-incident side surface of the light-transmitting area 11 of the circuit board body 1 by vacuum evaporation coating or coating, so that the printed circuit board integrates the function of filtering stray light to achieve the infrared filtering function, thereby eliminating the filter and the connecting frame for fixing and supporting the filter, thereby reducing the thickness of the camera module and simplifying the structure.

[0042] Specifically, the printed circuit board may further include components 3, which may be arranged in the non-light-transmitting area 12 of the circuit board body 1, so as to avoid the components 3 interfering with the transmission of light and ensure the imaging effect. Among them, the components 3 may specifically include chip devices such as resistors, capacitors, inductors, and Hall elements. The components 3 may be arranged on the light-incoming side and / or light-outgoing side of the circuit board body 1, and the embodiments of the present application do not specifically limit this.

[0043] Specifically, Figure 1 and Figure 2 As shown, the middle part of the circuit board body 1 is a light-transmitting area 11, which is a pure substrate and no circuits and components 3 are arranged. The surroundings of the circuit board body 1 are non-light-transmitting areas 12, which can be used to arrange circuits and components 3.

[0044] Specifically, PCB solder resist may be arranged on both side surfaces of the circuit board body 1 , and the PCB solder resist may cover the layout area and wiring area of ​​the circuit board body 1 to protect the components 3 and wiring on the circuit board body 1 .

[0045] Optionally, the circuit board body 1 includes a glass substrate 13 and a dielectric material layer 14, the glass substrate 13 includes a light incident side and a light emitting side; the dielectric material layer 14 is stacked on the glass substrate 13 and cooperates with the non-middle area of ​​the glass substrate 13 to form a non-light-transmitting area 12; the dielectric material layer 14 has a through hole 141 opposite to the middle area of ​​the glass substrate 13 to form a light-transmitting area 11.

[0046] In the embodiment of the present application, a glass substrate 13 and a dielectric material layer 14 are used to prepare the circuit board body 1, so as to ensure the light transmittance of the circuit board body 1 and the reliability of arranging the components 3 on the circuit board body 1.

[0047] Specifically, the material of the glass substrate 13 can be glass, so that the glass substrate 13 has a flat characteristic and good thermal stability, which is convenient for realizing a more sophisticated circuit layout and lower thermal stress, and is helpful to the reliability of the image sensor 5 to a certain extent.

[0048] Specifically, the dielectric material layer 14 may be made of PCB dielectric materials, such as glass fiber reinforced plastic (FR-4), cellulose reinforced plastic (CEM-3), graphene, metal substrate, polytetrafluoroethylene (PTFE), etc.

[0049] Specifically, the dielectric material layer 14 is connected to the glass substrate 13, and the matrix material in the dielectric material layer 14 is non-transparent, so the dielectric material can cover a portion of the glass substrate 13. In the process of preparing the circuit board body 1, a dielectric material base layer can be prepared first, and then the dielectric material base layer can be laser / mechanically slotted to remove excess dielectric to form a dielectric material layer 14 with a through hole 141. The through hole 141 penetrates the dielectric material layer 14 to expose the glass substrate 13 through the through hole 141. In this way, the dielectric material layer 14 covers the non-middle area of ​​the glass substrate 13 to form a non-light-transmitting area 12, and the through hole 141 is opposite to the middle area of ​​the glass substrate 13 to form a light-transmitting area 11. Among them, the area of ​​the glass substrate 13 opposite to the through hole 141 is the middle area, and the part of the glass substrate 13 other than the middle area is the non-middle area.

[0050] Specifically, the dielectric material layer 14 is an annular structure, and the inner periphery of the dielectric material layer 14 is surrounded to form a through hole 141 , so that the through hole 141 of the dielectric material layer 14 can be opposite to the middle area of ​​the glass substrate 13 , so that the non-light-transmitting area 12 is arranged around the light-transmitting area 11 .

[0051] Specifically, the image sensor 5 can be fixed on the light-emitting side of the circuit board body 1 by using a flip chip process, or can also be attached to the light-emitting side of the circuit board body 1 by welding.

[0052] Furthermore, the image sensor 5 can be connected to the glass substrate 13 to receive the transmitted light. Figure 3 and Figure 4 As shown, at least a portion of the image sensor 5 can be located in the through hole 141. In this way, the space arrangement at the through hole 141 can be reasonably utilized to reduce the space occupied by the image sensor 5 in the thickness direction of the camera module, further reduce the thickness of the camera module, and help optimize the overall thickness and appearance of the electronic device.

[0053] Specifically, the thickness of the dielectric material layer 14 can be arranged according to actual needs, the depth of the through hole 141 is consistent with the thickness of the dielectric material layer 14, and the thickness of the image sensor 5 can be equal to or less than the depth of the through hole 141, so that the image sensor 5 can be arranged entirely in the through hole 141, so that the camera module can save the thickness of one image sensor 5. Alternatively, the thickness of the image sensor 5 can also be greater than the depth of the through hole 141, and at least part of the image sensor 5 can be arranged in the through hole 141, so that the camera module can save the thickness of one dielectric material layer 14.

[0054] Optionally, a first routing layer 15 is arranged at the edge of the light incident side of the glass substrate 13; a second routing layer 16 is arranged between the glass substrate 13 and the dielectric material layer 14; a third routing layer 17 is arranged on the side of the dielectric material layer 14 away from the glass substrate 13, and the third routing layer 17 is located in the non-light-transmitting area 12.

[0055] In the embodiment of the present application, by arranging the first routing layer 15, the second routing layer 16 and the third routing layer 17, it is convenient to realize the wiring of the circuit board body 1, realize the mutual connection between the components 3, and realize the mutual connection with external devices.

[0056] Specifically, the dielectric material layer 14 may include one layer, two layers, or three layers. As shown in the figure, a fourth wiring layer 18 may be arranged between two adjacent dielectric material layers 14 .

[0057] Specifically, the first wiring layer 15 is arranged at the edge of the light incident side of the glass substrate 13 , so that the first wiring layer 15 can be prevented from interfering with the light-transmitting area 11 of the circuit board body 1 .

[0058] Specifically, Figure 1 and Figure 2 As shown, when preparing the circuit board body 1, the substrate material is transparent glass with good light transmittance, and the first wiring layer 15 and the second wiring layer 16 are arranged on both sides of the glass substrate 13. On the basis of the glass substrate 13, the third wiring layer 17 and the fourth wiring layer 18 are obtained by laminating the semi-cured sheet (PP sheet) and adding layers, and the different wiring layers are separated by the cured dielectric material layer 14, so that the circuit board body 1 can be obtained, so that the circuit board body 1 has a light-transmitting area 11 and a non-light-transmitting area 12.

[0059] Optionally, a first threading hole 21 is provided in the light-transmitting area 11 near the non-light-transmitting area 12 ; and a second threading hole 22 is provided in the non-light-transmitting area 12 .

[0060] In the embodiment of the present application, both the first threading hole 21 and the second threading hole 22 can be used to thread a wiring harness, so as to facilitate connection between the component 3 and the image sensor 5 through the circuit board body 1 .

[0061] Specifically, Figure 2 As shown, the first threading hole 21 penetrates the glass substrate 13, and the second threading hole 22 penetrates the glass substrate 13 and the dielectric material layer 14 respectively, and the first threading hole 21 and the second threading hole 22 are both used for threading wiring. For example, the first component 3 can be arranged on the side of the glass substrate 13 away from the dielectric material layer 14, and the second component 3 can be arranged on the side of the dielectric material layer 14 away from the glass substrate 13. The first component 3 is electrically connected to the first wiring layer 15, and the first component 3 can be electrically connected to the second wiring layer 16 and the image sensor 5 through the wiring passing through the first threading hole 21, and the first component 3 can be electrically connected to the second component 3, the second wiring layer 16, the third wiring layer 17 and the fourth wiring layer 18 through the wiring passing through the second threading hole 22.

[0062] Optionally, the non-light-transmitting area 12 is arranged with a first connecting portion 23 , which is welded to the component 3 ; a second connecting portion 24 is arranged on the light-emitting side of the light-transmitting area 11 near the non-light-transmitting area 12 , and the second connecting portion 24 is used to connect to the image sensor 5 .

[0063] In the embodiment of the present application, the component 3 can be connected through the first connection portion 23, so as to ensure the reliability of the electrical signal transmission between the component 3 and the circuit board body 1. The image sensor 5 can be connected through the second connection portion 24, so as to ensure the reliability of the electrical signal transmission between the circuit board body 1 and the image sensor 5.

[0064] Specifically, the first connection portion 23 may be a pad, so that the component 3 can be fixed on the circuit board body 1 by welding. Alternatively, the first connection portion 23 may also be a conductive adhesive, so that the component 3 can be fixed on the circuit board body 1 by bonding.

[0065] Specifically, the second connection portion 24 may also be a pad, and a solder ball may be arranged on the image sensor 5. By soldering the solder ball to the pad, the image sensor 5 may be soldered to the glass substrate 13. At the same time, the image sensor 5 may be fixed by an underfill to ensure the reliability of the electrical connection between the image sensor 5 and the circuit board body 1. The image sensor 5 is arranged on the glass substrate 13 by a flip-chip process, that is, the photosensitive surface of the image sensor 5 faces the glass substrate 13.

[0066] The printed circuit board described in the embodiment of the present application has at least the following advantages:

[0067] In the embodiment of the present application, since the circuit board body has a light-transmitting area, a filter film can be arranged in the light-transmitting area of ​​the circuit board body, so that the light-transmitting area of ​​the circuit board body can transmit the light passing through the filter film to the image sensor, so as to form an image through the image sensor and realize the shooting function of the camera module. In the embodiment of the present application, the filter film is arranged in the light-transmitting area of ​​the circuit board body, so that the circuit board body can serve as the base of the filter film, thereby simplifying the structure of the filter and realizing the thinning of the camera module. On this basis, while increasing the camera module, the thickness of the electronic device can be avoided from increasing, and the shooting effect of the camera module can be ensured while taking into account the thinness requirements of the electronic device.

[0068] In the second aspect, an embodiment of the present application further discloses a camera module, including an image sensor 5 and the above-mentioned printed circuit board; the image sensor 5 is connected to the light-emitting side of the circuit board body 1 and is opposite to the light-transmitting area 11 of the circuit board body 1.

[0069] In the embodiment of the present application, the light passing through the light-transmitting area 11 of the circuit board body 1 can be directed toward the image sensor 5 to facilitate imaging.

[0070] Specifically, the image sensor 5 is connected to the light-emitting side of the circuit board body 1, so that the image sensor 5 can be fixed on the circuit board body 1 by flip-chip mounting. Specifically, the image sensor 5 is an important component of the camera module. According to the different components, it can be divided into two categories: charge coupled device (CCD) and metal oxide semiconductor (CMOS).

[0071] Specifically, the filter film 4 is arranged on the light incident side of the circuit board body 1, and the image sensor 5 can be arranged on the light emitting side of the circuit board body 1. The filter film 4 and the image sensor 5 are respectively arranged on both sides of the circuit board body 1, and the image sensor 5 is connected to the circuit board body 1 by flip-chip, so that the filter film 4 does not need to provide a safe distance for the gold wire binding of the image sensor 5, which is conducive to reducing the thickness of the camera module.

[0072] Specifically, in the field of chip manufacturing, "gold wire binding" refers to the technology of using gold wire to connect the internal circuit of the chip to the external pin during the semiconductor packaging process. This technology uses the high conductivity and good mechanical properties of gold wire to ensure the reliable connection between the internal circuit of the chip and the external circuit. In conventional processes, the image sensor is connected to the printed circuit board as a photosensitive chip by gold wire binding. In the embodiment of the present application, the image sensor can be connected to the circuit board body 1 through a flip-chip process. The flip-chip process refers to turning the mold 180 degrees during the use of the mold, so that the part that originally contacts the product becomes a part that does not contact the product, thereby extending the service life of the mold. Moreover, the flip-chip process is a gold-wire-free package, so that the image sensor is directly fixed on the circuit board body, the heat conduction is faster and more direct, and the adverse reactions caused by poor soldering or poor contact of the gold wire can be avoided. The application process of the flip-chip process is simple. Compared with the positive packaging process, the flip-chip process has a higher packaging density and lower cost.

[0073] Optionally, the image sensor 5 includes a connection side, on which a pixel area 51 is arranged; the connection side is connected to the light-transmitting area 11 so that the pixel area 51 receives light incident from the light-transmitting area 11 .

[0074] In the embodiment of the present application, the pixel area 51 of the image sensor 5 may be opposite to the light-transmitting area 11 , so that the pixel area 51 can receive light for imaging.

[0075] Specifically, the pixel area 51 of the image sensor 5 is arranged on the photosensitive surface, and the pixel area 51 is opposite to the light-transmitting area 11, so that the photosensitive surface is opposite to the light-transmitting area 11, and the photosensitive surface receives light and can perform photoelectric conversion. As a photoelectric sensor, the image sensor 5 works based on the photoelectric effect. When light irradiates the pixel area 51 of the image sensor 5, electrons are excited and a current is generated. The magnitude of this current is proportional to the intensity of the light, thereby realizing the conversion of optical signals to electrical signals. Among them, the pixel area 51 includes a pixel array, and each pixel can independently sense the light intensity to form an image.

[0076] Optionally, the camera module also includes a lens group 6, which is arranged on the light incident side of the circuit board body 1 and is opposite to and spaced from the light transmitting area 11 of the circuit board body 1; the light collected by the lens group 6 enters from the light incident side of the circuit board body 1, and the light passing through the light transmitting area 11 is emitted from the light exit side of the circuit board body 1 to the image sensor 5.

[0077] In the embodiment of the present application, the lens group 6 and the light-transmitting area 11 are arranged opposite to each other and at an interval, so that the light collected by the lens group 6 can be emitted to the image sensor 5 through the light-transmitting area 11, thereby improving the reliability of imaging.

[0078] Specifically, the lens group 6 can be used to take photos or videos, etc.

[0079] Optionally, the camera module also includes a reflector, and the lens group 6 may include a first lens and a second lens; the position of the reflector may include a first position and a second position, and when the reflector is in the first position, the reflector may block the light emitted toward the circuit board body 1 through the first lens, so that the light may be emitted toward the circuit board body 1 through the second lens; when the reflector is in the second position, the reflector may block the light emitted toward the circuit board body 1 through the second lens, and may reflect the light passing through the first lens to the circuit board body 1.

[0080] In the embodiment of the present application, the position of the reflector can be adjusted to switch the first lens and the second lens, so that multiple lenses can share one image sensor and the thickness of the camera module can be reduced.

[0081] Specifically, the camera module also includes a shell and a bracket 8, a focus motor 7, a magnet, a coil and a Hall element arranged in the shell; the shell is used as the appearance of the camera module to protect and support the internal components of the camera module. The focus motor 7 is connected to the lens group 6 to drive the lens group 6 to move and realize the focus function of the camera module. The bracket 8 can be connected to the circuit board body 1 and the focus motor 7 respectively to support the focus motor 7. The magnet can be connected to the inner wall of the shell through an adapter, and the Hall element can be connected to the circuit board and opposite to the magnet, so as to sense the displacement of the lens group 6 through the magnet and output an analog signal corresponding to the magnetic field strength. After processing this analog signal, the current of the coil can be calculated, and then the position of the lens group 6 can be adjusted to maintain it at the focal length position, and the anti-shake function of the camera module can also be realized.

[0082] In the embodiment of the present application, based on the light transmittance of the circuit board body 1, it can be used as the base of the filter film 4, eliminating the infrared IR filter of the camera module and the connecting frame for connecting the infrared IR filter, and can cooperate well with the flip-chip process of the image sensor 5, thereby achieving the simplification of the structure of the camera module and the thinning in the thickness direction.

[0083] The camera module described in the embodiments of the present application has at least the following advantages:

[0084] In the embodiment of the present application, since the circuit board body has a light-transmitting area, a filter film can be arranged in the light-transmitting area of ​​the circuit board body, so that the light-transmitting area of ​​the circuit board body can transmit the light passing through the filter film to the image sensor, so as to form an image through the image sensor and realize the shooting function of the camera module. In the embodiment of the present application, the filter film is arranged in the light-transmitting area of ​​the circuit board body, so that the circuit board body can serve as the base of the filter film, thereby simplifying the structure of the filter and realizing the thinning of the camera module. On this basis, while increasing the camera module, the thickness of the electronic device can be avoided from increasing, and the shooting effect of the camera module can be ensured while taking into account the thinness requirements of the electronic device.

[0085] In a third aspect, an embodiment of the present application further discloses an electronic device, comprising: a housing; and a camera module such as the above, wherein the camera module is disposed in the housing.

[0086] The electronic devices described in the embodiments of the present application include, but are not limited to, mobile phones, tablets, smart wearable devices and other devices that include camera modules.

[0087] Specifically, the electronic device can take pictures through the camera module. Since the camera module includes the above-mentioned printed circuit board, the thickness of the camera module can be reduced, which increases the stacking space of the electronic device, is beneficial to optimizing the overall thickness and appearance of the electronic device, and is beneficial to achieving the lightweight and thinness of the electronic device.

[0088] Specifically, the housing is a protective shell of the electronic device, used to protect the camera module. The electronic device may also include a main board and a flexible circuit board disposed in the housing, and the flexible circuit board may be electrically connected to the main board and the printed circuit board respectively to achieve mutual connection between the main board and the printed circuit board.

[0089] The electronic device described in the embodiments of the present application has at least the following advantages:

[0090] In the embodiment of the present application, since the circuit board body has a light-transmitting area, a filter film can be arranged in the light-transmitting area of ​​the circuit board body, so that the light-transmitting area of ​​the circuit board body can transmit the light passing through the filter film to the image sensor, so as to form an image through the image sensor and realize the shooting function of the camera module. In the embodiment of the present application, the filter film is arranged in the light-transmitting area of ​​the circuit board body, so that the circuit board body can serve as the base of the filter film, thereby simplifying the structure of the filter and realizing the thinning of the camera module. On this basis, while increasing the camera module, the thickness of the electronic device can be avoided from increasing, and the shooting effect of the camera module can be ensured while taking into account the thinness requirements of the electronic device.

[0091] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0092] The above are only preferred embodiments of the present application, and are not intended to limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

[0093] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A printed circuit board, characterized in that: include: A circuit board body (1), the circuit board body (1) comprising a light-transmitting area (11) and a non-light-transmitting area (12), the non-light-transmitting area (12) being arranged around the light-transmitting area (11); the light-transmitting area (11) of the circuit board body (1) is respectively connected to a filter film (4) and an image sensor (5), and is used for transmitting light passing through the filter film (4) to the image sensor (5); A component (3), wherein the component (3) is arranged in the non-light-transmitting area (12).

2. The printed circuit board according to claim 1, characterized in that: The circuit board body (1) comprises a glass substrate (13) and a dielectric material layer (14); the glass substrate (13) comprises a light incident side and a light emitting side; The dielectric material layer (14) is stacked on the glass substrate (13) and cooperates with the non-middle area of ​​the glass substrate (13) to form the non-light-transmitting area (12); The dielectric material layer (14) has a through hole (141) opposite to the middle area of ​​the glass substrate (13) to form the light-transmitting area (11).

3. The printed circuit board according to claim 2, characterized in that: A first wiring layer (15) is arranged at the edge of the light incident side of the glass substrate (13); A second wiring layer (16) is arranged between the glass substrate (13) and the dielectric material layer (14); A third wiring layer (17) is arranged on a side of the dielectric material layer (14) away from the glass substrate (13), and the third wiring layer (17) is located in the non-light-transmitting area (12).

4. The printed circuit board according to claim 1, characterized in that: A first threading hole (21) is provided at a position of the light-transmitting area (11) close to the non-light-transmitting area (12); The non-light-transmitting area (12) is provided with a second threading hole (22).

5. The printed circuit board according to claim 1, characterized in that: The non-light-transmitting area (12) is provided with a first connecting portion (23), and the first connecting portion (23) is connected to the component (3) by welding; A second connecting portion (24) is arranged at a position of the light-emitting side of the light-transmitting area (11) close to the non-light-transmitting area (12), and the second connecting portion (24) is used for connecting to an image sensor (5).

6. A camera module, characterized in that: Comprising an image sensor (5) and a printed circuit board as claimed in any one of claims 1 to 5; The image sensor (5) is connected to the light-emitting side of the circuit board body (1) and is opposite to the light-transmitting area (11) of the circuit board body (1).

7. The camera module according to claim 6, characterized in that: The image sensor (5) comprises a connection side, on which a pixel area (51) is arranged; The connection side is connected to the light-transmitting area (11), so that the pixel area (51) receives light incident from the light-transmitting area (11).

8. The camera module according to claim 6, characterized in that: The camera module further comprises a lens group (6), wherein the lens group (6) is arranged on the light incident side of the circuit board body (1) and is arranged opposite to and spaced from the light transmission area (11) of the circuit board body (1); The light collected by the lens group (6) enters from the light incident side of the circuit board body (1), and the light passing through the light transmission area (11) is emitted toward the image sensor (5) from the light exit side of the circuit board body (1).

9. The camera module according to claim 8, characterized in that: The camera module also includes a reflector, and the lens group (6) includes a first lens and a second lens; The position of the reflector includes a first position and a second position. When the reflector is in the first position, the reflector blocks the light emitted from the first lens to the circuit board body (1); when the reflector is in the second position, the reflector blocks the light emitted from the second lens to the circuit board body (1) and reflects the light emitted from the first lens to the circuit board body (1).

10. An electronic device, characterized in that: include: case; The camera module according to any one of claims 6 to 9, wherein the camera module is arranged in the housing.

Images