Power module and charging equipment

Abstract

The embodiment of the invention provides a power module and charging equipment. The power module comprises a bottom shell, a circuit board assembly fixed inside the bottom shell, and a liquid cooling plate assembly fixed outside the bottom shell. The circuit board assembly comprises a circuit board and a plurality of power devices, and the plurality of power devices are fixed on the surface of the circuit board. The liquid cooling plate assembly is located on the sides, away from the circuit board, of the multiple power devices, and the liquid cooling plate assembly is used for being in heat conduction connection with the multiple power devices through the bottom shell, so that liquid cooling heat dissipation of the multiple power devices is achieved. Therefore, the heat dissipation effect of the power device in the power module can be improved, and the heat dissipation cost of the power module can be reduced, so that the heat dissipation requirement of the power device during high-power work can be met, the service life of the power module during high-power work is prolonged, and the reliability of the power module during high-power work is improved.

Description

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on March 5, 2024, with application number 202410255098.9 and patent name “Power Module and Charging Device”, the entire contents of which are incorporated by reference in this application. Technical Field

[0002] The present application relates to the technical field of heat dissipation of charging equipment, and more specifically, to a power module and a charging equipment. Background Art

[0003] At present, with the increasing popularity of electric vehicles, more and more cities are beginning to build supercharging cities, which can quickly recharge electric vehicles at a speed of one kilometer per second through high-power supercharging equipment.

[0004] However, when the charging equipment performs high-power supercharging on the electric vehicle, the heat generated by the power devices in the charging equipment increases significantly. If this heat cannot be discharged in time, it is easy to affect the normal high-power supercharging of the electric vehicle by the charging equipment. However, the heat dissipation system in the existing charging equipment has a poor heat dissipation effect on the power devices, and the cost of the heat dissipation system is high, which makes it difficult to meet the heat dissipation requirements of the power devices when working at high power. Summary of the invention

[0005] The present application provides a power module and a charging device, which can improve the heat dissipation effect of the power device in the power module and reduce the heat dissipation cost of the power module, thereby meeting the heat dissipation requirements of the power device when working at high power, and improving the service life and reliability of the power module when working at high power. This is conducive to enabling the charging device to achieve a charging speed of one kilometer per second, that is, to charge an electric vehicle with enough electricity to travel one kilometer in one second, thereby bringing users a charging experience of "a cup of coffee, full charge and departure".

[0006] In a first aspect, a power module is provided, the power module comprising a bottom shell, a circuit board assembly and a liquid cooling plate assembly, the circuit board assembly is fixed inside the bottom shell, and the liquid cooling plate assembly is fixed outside the bottom shell. The circuit board assembly comprises a circuit board and a plurality of power devices, and the plurality of power devices are fixed on the surface of the circuit board. The liquid cooling plate assembly is located on a side of the plurality of power devices away from the circuit board, and the liquid cooling plate assembly is used to be thermally connected to the plurality of power devices through the bottom shell.

[0007] In an embodiment of the present application, a liquid cooling plate assembly fixed to the outside of the bottom shell is thermally connected to a circuit board assembly fixed to the inside of the bottom shell through the bottom shell. On the one hand, the cooling medium in the liquid cooling plate assembly can exchange heat with the power device through the bottom shell to achieve liquid cooling of the power device. Compared with traditional air cooling, liquid cooling has higher efficiency, so that good heat dissipation of the power device can be achieved. On the other hand, the bottom shell serves as an isolation structure between the liquid cooling plate assembly and the circuit board assembly to achieve water and electricity isolation between the liquid cooling plate assembly and the circuit board assembly, thereby avoiding the influence of leakage of the cooling medium in the liquid cooling plate assembly on the circuit board assembly, and ensuring the safety and stability of the liquid cooling plate assembly for liquid cooling of the power device. Furthermore, the heat dissipation effect of the power device is improved, which is conducive to meeting the heat dissipation requirements of the power device when working at high power, and improving the service life and reliability of the power module when working at high power.

[0008] Therefore, when the power module is applied to the charging equipment, it is conducive to the charging equipment to achieve a charging speed of one kilometer per second, thereby bringing users a charging experience of "a cup of coffee, a full charge". In addition, the use of liquid cooling for the power module is also conducive to the charging equipment meeting the construction requirements of the full liquid cooling super charging station, that is, it is conducive to meeting the requirements of liquid cooling for the power module and charging gun of each charging device in the charging station.

[0009] In addition, the bottom shell of the power module not only plays the role of outer shell protection, but also supports and fixes the circuit board and realizes water and electricity isolation between the liquid cooling plate assembly and the circuit board assembly, so that the power module does not need to set up a separate support structure for the circuit board assembly and an isolation structure for water and electricity isolation. In addition, the structure of the heat dissipation system composed of the bottom shell and the liquid cooling plate assembly is simplified, the use of components in the power module is reduced, and the heat dissipation cost of the power module is reduced.

[0010] In one implementation, the liquid-cooled plate assembly includes a liquid-cooled top plate and a liquid-cooled bottom plate. The liquid-cooled top plate and the liquid-cooled bottom plate are arranged in sequence along the direction from the circuit board to the multiple power devices. The surface of the liquid-cooled top plate facing the circuit board is thermally connected to the outer surface of the bottom shell, and the surface of the liquid-cooled top plate facing away from the circuit board is fixedly connected to the liquid-cooled bottom plate, and a liquid-cooled channel is formed between the liquid-cooled top plate and the liquid-cooled bottom plate, and the liquid-cooled channel is used to accommodate a cooling medium. In other words, the position of the fixed connection between the liquid-cooled top plate and the liquid-cooled bottom plate for forming the liquid-cooled channel, and the position of the fixed connection between the liquid-cooled top plate and the bottom shell are both located outside the bottom shell, so that the cooling medium in the liquid-cooled channel and the circuit board assembly inside the bottom shell can be isolated through the bottom shell, thereby realizing water and electricity isolation between the circuit board assembly and the liquid-cooled plate assembly.

[0011] In one implementation, multiple power devices include a first power device, and the position of the liquid-cooled top plate corresponding to the first power device is recessed toward the circuit board to form a groove structure, and the bottom of the groove structure extends into the interior of the bottom shell and is thermally connected to one end of the first power device facing the liquid-cooled top plate.

[0012] It should be understood that since the height of the first power device among the multiple power devices is relatively small and the distance between the first power device and the bottom shell is relatively far, it is difficult for the liquid-cooled top plate outside the bottom shell to be thermally connected to the first power device through the bottom shell. Therefore, in an embodiment of the present application, by providing a groove structure that is recessed toward the circuit board on the liquid-cooled top plate, and the bottom of the groove structure extends into the bottom shell, the first power device can be directly thermally connected to the liquid-cooled top plate. This can not only achieve liquid cooling and heat dissipation of the first power device by the liquid-cooled plate assembly, but also because the first power device is directly thermally connected to the liquid-cooled top plate, it can improve the transfer efficiency of the heat from the first power device to the cooling medium, thereby accelerating the heat dissipation process of the first power device by the liquid-cooled plate assembly and improving the heat dissipation effect of the first power device.

[0013] In one implementation, the power module further includes a heat conductor, and the groove bottom of the groove structure is thermally connected to an end of the first power device facing the liquid-cooled top plate through the heat conductor.

[0014] In the embodiment of the present application, by arranging the heat conducting member between the groove bottom of the groove structure and the first power device, the first power device can be closely contacted with the groove bottom of the groove structure through the heat conducting member, so that the first power device and the groove bottom of the groove structure have a relatively large contact area. This is conducive to improving the transfer efficiency of the heat of the first power device to the groove structure of the liquid cooling top plate, thereby accelerating the heat dissipation process of the liquid cooling plate assembly to the first power device and improving the heat dissipation effect of the first power device.

[0015] In one implementation, the liquid cooling plate assembly further includes a boss structure and a spoiler tooth. The boss structure is fixed to the surface of the liquid cooling base plate facing the circuit board and extends in the direction of the circuit board. The boss structure and the groove structure are arranged correspondingly, and there is a gap between the boss structure and the groove structure to form a liquid cooling channel. The spoiler tooth is located in the liquid cooling channel and fixed to the end surface of the boss structure facing the circuit board.

[0016] In the embodiment of the present application, by providing a boss structure at the position corresponding to the groove structure of the liquid cooling bottom plate, it is helpful to reduce the distance between the liquid cooling top plate at the position of the groove structure and the liquid cooling bottom plate, thereby reducing the size of the liquid cooling channel formed at the position of the groove structure. This is helpful to improve the ability of the spoiler teeth to repeatedly disturb the cooling medium in the liquid cooling channel at the position of the groove structure, thereby enhancing the effect of local strengthening of cooling medium heat dissipation at the position corresponding to the first power device in the liquid cooling channel, and improving the heat dissipation efficiency of the liquid cooling plate assembly to the first power device.

[0017] In one implementation, the power module further includes a partition, which is located inside the bottom shell, and is used to divide the space inside the bottom shell into a plurality of accommodating chambers. The plurality of power devices include a plurality of second power devices, which are located in the accommodating chambers, and the second power devices are thermally connected to the inner side wall of the accommodating chamber and the bottom shell. In other words, the partition forms the side wall of the accommodating chamber, and the bottom shell forms the bottom of the accommodating chamber.

[0018] In the embodiment of the present application, the second power device with a larger height among the multiple power devices is arranged in the accommodating cavity, and the second power device is thermally connected to the inner side wall of the accommodating cavity and the bottom shell. This enables the heat of the second power device to be not only directly transferred to the liquid-cooled top plate through the bottom shell, but also to be first transferred to the bottom shell and then to the liquid-cooled top plate through the inner side wall of the accommodating cavity, thereby improving the transfer efficiency of the heat of the second power device to the liquid-cooled top plate, accelerating the heat dissipation process of the liquid-cooled plate assembly to the second power device, and improving the heat dissipation effect of the second power device.

[0019] In one implementation, the accommodating cavity contains a thermally conductive adhesive, the second power device is embedded in the thermally conductive adhesive and is thermally connected to the inner side wall of the accommodating cavity and the bottom shell through the thermally conductive adhesive. In this way, the second power device can be in close contact with the bottom shell and the inner side wall of the accommodating cavity. This can improve the transfer efficiency of the heat on the second power device to the liquid-cooled top plate, thereby improving the heat dissipation efficiency of the power module.

[0020] In one implementation, the bottom shell includes a bottom plate and a surrounding plate, the bottom plate is located between the circuit board and the liquid-cooled top plate, the surface of the bottom plate facing away from the circuit board is thermally connected to the surface of the liquid-cooled top plate facing the circuit board, the surrounding plate is fixed to the surface of the bottom plate facing the circuit board, and the surrounding plate and the bottom plate enclose a space inside the bottom shell. One end of the partition is fixed to the surface of the bottom plate facing the circuit board, the other end of the partition extends in the direction of the circuit board, and the other end of the partition does not contact the circuit board. In other words, there is a gap between the other end of the partition and the surface of the circuit board for arranging power devices. In this way, it is possible to avoid occupying the space on the surface of the circuit board due to the contact between the other end of the partition and the surface of the circuit board, thereby facilitating the arrangement of multiple power devices in the power module on the surface of the circuit board.

[0021] In one implementation, the power module further includes a fastener, one end of which is fixed to the circuit board, and the other end of which is fixed to the bottom plate. Along the direction in which the circuit board and the plurality of power devices are arranged, the projections of the fastener and the partition do not overlap.

[0022] In the embodiment of the present application, the circuit board assembly is fixed to the inside of the bottom shell by fasteners, that is, the bottom shell is also used to support and fix the circuit board assembly. This can make it possible to not set up a separate support structure for the circuit board assembly in the power module. In turn, the structure of the power module is simplified, the use of components in the power module is reduced, and the cost of the power module is reduced.

[0023] In one implementation, the first power device includes a power switch tube, and the plurality of second switch devices include an inductor, a capacitor, and a transformer. The power switch tube, the inductor, the capacitor, and the transformer are electrically connected through a circuit board to form an AC-DC conversion circuit or a DC-DC conversion circuit. That is, the power module provided in the embodiment of the present application can be an AC-DC power module or a DC-DC power module.

[0024] In one implementation, the liquid cooling plate assembly further includes a liquid inlet joint and a liquid outlet joint. The liquid inlet joint and the liquid outlet joint are fixed to the surface of the liquid cooling top plate facing the circuit board and are connected to the liquid cooling channel respectively. The liquid inlet joint is used to allow the cooling medium to flow into the liquid cooling channel, and the liquid outlet joint is used to allow the cooling medium in the liquid cooling channel to flow out of the liquid cooling channel.

[0025] In the embodiment of the present application, after the cooling medium in the liquid cooling channel absorbs the heat generated by the power device, the cooling medium carrying the heat can flow out of the liquid cooling channel through the liquid outlet joint and then flow into the external cooling system, so that the external cooling system can cool the cooling medium carrying the heat, and the cooled cooling medium flows into the liquid cooling channel again through the liquid inlet joint. In this way, the cooling medium is circulated, thereby achieving continuous heat dissipation of multiple power devices by the liquid cooling plate assembly.

[0026] In one implementation, the bottom shell, the liquid-cooled top plate and the liquid-cooled bottom plate are all made of sheet metal materials through a stamping process, and the bottom shell and the liquid-cooled top plate are fixedly connected by welding.

[0027] In the embodiment of the present application, sheet metal materials are used to prepare the bottom shell, liquid-cooled top plate and liquid-cooled bottom plate through a stamping process. On the one hand, the thermal conductivity of the sheet metal material is relatively high, and compared with the die-casting process, the bottom shell, liquid-cooled bottom plate and liquid-cooled top plate formed by stamping are not prone to pores, which is conducive to making the bottom shell, liquid-cooled bottom plate and liquid-cooled top plate have good thermal conductivity. In this way, the heat generated by multiple power devices during operation can be quickly transferred to the liquid-cooled plate assembly outside the bottom shell through the bottom shell to achieve liquid cooling of the circuit board assembly. In turn, the heat dissipation effect of the power module is improved.

[0028] On the other hand, compared with the die-casting process, the sheet metal stamping process does not use a die-casting mold, the process is simpler and the cost is lower. In addition, compared with the die-casting process, the bottom shell prepared by sheet metal stamping has higher toughness, which is conducive to reducing the difficulty of structural adjustment of the bottom shell and reducing the processing cost.

[0029] In addition, the weld that fixes the liquid-cooled top plate and the bottom shell is located outside the bottom shell, which can effectively isolate the circuit board assembly inside the bottom shell from the liquid cooling channel outside the bottom shell, thereby achieving water and electricity isolation between the circuit board assembly and the liquid cooling assembly. Moreover, compared with mechanical fixation between the liquid-cooled top plate and the bottom shell by fasteners such as screws, the embodiment of the present application fixes the liquid-cooled top plate and the bottom shell by welding, which can reduce the use of components in the power module, thereby reducing the heat dissipation cost of the power module.

[0030] In a second aspect, a charging device is provided, which includes an AC-DC power module and at least one charging interface. The AC-DC power module is electrically connected to at least one charging interface, and the AC-DC power module is used to convert AC power into DC power and output it to at least one charging interface, and at least one charging interface is used to provide DC power to the electric vehicle. Among them, the AC-DC power module includes a circuit board assembly, a liquid cooling plate assembly and a bottom shell, the circuit board assembly is arranged inside the bottom shell, and the liquid cooling plate assembly is arranged outside the bottom shell. The circuit board assembly includes a circuit board and a plurality of power devices, and the plurality of power devices are fixed to the surface of the circuit board. The liquid cooling plate assembly is located on the side of the plurality of power devices away from the circuit board, and the liquid cooling plate assembly is fixed to the outer surface of the bottom shell, and the liquid cooling plate assembly is used to be thermally connected to the plurality of power devices through the bottom shell.

[0031] In a third aspect, a charging device is provided, the charging device comprising an AC-DC power module, a DC-DC power module, a DC bus and at least one charging interface, the AC-DC power module is electrically connected to the input end of the DC-DC power module through the DC bus, the output end of the DC-DC power module is electrically connected to at least one charging interface, the AC-DC power module is used to convert AC power into DC power and then output it to the DC bus, the DC-DC power module is used to convert the DC power obtained from the DC bus and output it to at least one charging interface, and at least one charging interface is used to provide the electric vehicle with the converted DC power. Among them, each power module in the AC-DC power module and the DC-DC power module comprises a circuit board assembly, a liquid cooling plate assembly and a bottom shell, the circuit board assembly is arranged inside the bottom shell, and the liquid cooling plate assembly is arranged outside the bottom shell. The circuit board assembly comprises a circuit board and a plurality of power devices, and the plurality of power devices are fixed on the surface of the circuit board. The liquid cooling plate assembly is located on the side of the plurality of power devices away from the circuit board, and the liquid cooling plate assembly is fixed to the outer surface of the bottom shell, and the liquid cooling plate assembly is used to be thermally connected to the plurality of power devices through the bottom shell.

[0032] For the beneficial effects of the second and third aspects that are not detailed, please refer to the beneficial effects of the first aspect mentioned above, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a structural schematic diagram of a charging system provided in an embodiment of the present application.

[0034] Figure 2 yes Figure 1 Schematic diagram of the connection structure of the charging system shown.

[0035] Figure 3 It is a schematic diagram of the three-dimensional structure of a power module provided in an embodiment of the present application.

[0036] Figure 4 yes Figure 3 Schematic diagram of the exploded structure of the power module shown.

[0037] Figure 5 It is a schematic diagram of the assembly structure of a circuit board assembly and a bottom shell in a power module provided in an embodiment of the present application.

[0038] Figure 6 It is a schematic diagram of the structure of a bottom shell in a power module provided in an embodiment of the present application.

[0039] Figure 7 It is a structural schematic diagram of a liquid cooling plate assembly in a power module provided in an embodiment of the present application.

[0040] Figure 8 yes Figure 7A schematic diagram of the structure of the liquid cooling top plate in the liquid cooling plate assembly is shown.

[0041] Fig. 9 yes Figure 7 A schematic diagram of the structure of the liquid cooling base plate in the liquid cooling plate assembly is shown. DETAILED DESCRIPTION

[0042] To facilitate understanding of the embodiments of the present application, the following points are explained before introducing the embodiments of the present application.

[0043] The directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside" and "outside" in the embodiments of the present application are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present application.

[0044] The "perpendicular" mentioned in this application is not perpendicular in the strict sense, but within the allowable error range. The "parallel" is not parallel in the strict sense, but within the allowable error range.

[0045] In the embodiments of the present application, the same reference numerals represent the same component or the same part. In the embodiments of the present application, for multiple identical parts, only one of the parts may be marked with a reference numeral in the drawings as an example. For other identical parts or components, the reference numerals are also applicable. In addition, the sizes and dimensions of the parts shown in the drawings are only exemplary.

[0046] The embodiment of the present application provides a power module, the power module includes a bottom shell, a circuit board assembly and a liquid cooling plate assembly. The circuit board assembly is fixed inside the bottom shell. The circuit board assembly includes a circuit board and a plurality of power devices, and the plurality of power devices are fixed on the surface of the circuit board. The liquid cooling plate assembly is fixed outside the bottom shell, and the liquid cooling plate assembly is located on a side of the plurality of power devices away from the circuit board. The liquid cooling plate assembly is used to be thermally connected to the plurality of power devices through the bottom shell.

[0047] In the power module provided in the embodiment of the present application, the liquid cooling plate assembly fixed on the outside of the bottom shell is thermally connected to the circuit board assembly fixed on the inside of the bottom shell through the bottom shell. On the one hand, this can enable the cooling medium in the liquid cooling plate assembly to exchange heat with the power device, thereby realizing liquid cooling of the power device. Compared with traditional air cooling, liquid cooling has higher efficiency and can achieve good heat dissipation of the power device. On the other hand, this can enable the bottom shell to serve as an isolation structure between the liquid cooling plate assembly and the circuit board assembly, thereby realizing water and electricity isolation between the liquid cooling plate assembly and the circuit board assembly, thereby avoiding the influence of the cooling medium leakage in the liquid cooling plate assembly on the circuit board assembly, and ensuring the safety and stability of the liquid cooling plate assembly for liquid cooling of the power device. Furthermore, the heat dissipation effect of the power device is improved, which is conducive to meeting the heat dissipation requirements of the power device when working at high power, and improving the service life and reliability of the power module when working at high power.

[0048] In addition, the bottom shell of the power module not only plays the role of outer shell protection, but also supports and fixes the circuit board and realizes water and electricity isolation between the liquid cooling plate assembly and the circuit board assembly, so that the power module does not need to set up a separate support structure for the circuit board assembly and an isolation structure for water and electricity isolation. In addition, the structure of the heat dissipation system composed of the bottom shell and the liquid cooling plate assembly is simplified, the use of components in the power module is reduced, and the heat dissipation cost of the power module is reduced.

[0049] The embodiment of the present application also provides a charging device, which includes an alternating current-direct current (AC-DC) power module and at least one charging interface. The AC-DC power module may be the power module described above. The AC-DC power module is electrically connected to at least one charging interface, and the AC-DC power module is used to convert alternating current into direct current and output it to at least one charging interface. At least one charging interface is used to provide alternating current to an electric vehicle to charge the electric vehicle.

[0050] As mentioned above, the AC-DC power module has a good heat dissipation effect, which can meet the heat dissipation requirements of the AC-DC power module when working at high power, and can meet the heat dissipation requirements of the AC-DC power module when working at high power, which is conducive to enabling the charging equipment to achieve a charging speed of one kilometer per second, that is, to achieve 1 second to charge the electric vehicle for 1 kilometer of driving, thereby bringing users a charging experience of "one kilometer per second, full charge to start". In addition, the use of liquid cooling for the AC-DC power module is also conducive to enabling the charging equipment to meet the construction requirements of a fully liquid-cooled super-charging charging station, that is, it is conducive to meeting the requirements of liquid cooling for the power modules and charging guns of each charging equipment in the charging station.

[0051] The embodiment of the present application also provides a charging device, which includes an AC-DC power module, a direct current-direct current (DC-DC) power module, a DC bus and at least one charging interface. Among them, the AC-DC power module and the DC-DC power module can be the power modules described above. The AC-DC power module is electrically connected to the input end of the DC-DC power module through the DC bus, and the output end of the DC-DC power module is electrically connected to at least one charging interface. The AC-DC power module is used to convert alternating current into direct current and then output it to the DC bus. The DC-DC power module is used to perform power conversion on the direct current obtained from the DC bus and output it to at least one charging interface, and at least one charging interface is used to provide the electric vehicle with direct current after power conversion to charge the electric vehicle.

[0052] As mentioned above, the heat dissipation effect of AC-DC power modules and DC-DC power modules is good, which can meet the heat dissipation requirements of AC-DC power modules and DC-DC power modules when working at high power, which is conducive to enabling charging equipment to achieve a charging speed of one kilometer per second, thereby bringing users a charging experience of "one kilometer per second, full charge". In addition, the use of liquid cooling for AC-DC power modules and DC-DC power modules is also conducive to enabling charging equipment to meet the construction requirements of full liquid cooling super charging stations, that is, it is conducive to meeting the requirements of liquid cooling for the power modules and charging guns of each charging equipment in the charging station.

[0053] The charging device provided in the embodiment of the present application can be applied to a charging system including an electric vehicle. In the charging system, the charging device can use the electric energy from the power grid to charge the electric vehicle. Figure 1 and Figure 2 The charging system provided in the embodiment of the present application is first described in detail.

[0054] Figure 1 It is a structural schematic diagram of a charging system 10 provided in an embodiment of the present application. Figure 2 yes Figure 1 The connection structure diagram of the charging system 10 is shown.

[0055] Combination Figure 1 and Figure 2The charging system 10 includes a charging device 11 and an electric vehicle 12. The charging device 11 includes a charging host 111, at least one charging terminal 112 and at least one charging gun 113, that is, the charging device 11 can be a split charging device. Among them, the charging host 111 includes multiple AC-DC power modules 1111, multiple DC-DC power modules 1112, a DC bus 1113, a power distribution device 1114 and at least one charging interface. Multiple AC-DC power modules 1111 are connected in parallel between the external power grid 20 and the DC bus 1113. The input ends of multiple DC-DC power modules 1112 are electrically connected to the DC bus 1113, and the output ends of multiple DC-DC power modules 1112 are electrically connected to the input end of the power distribution device 1114. The output end of the power distribution device 1114 is electrically connected to at least one charging interface. In a specific implementation, each charging interface can be electrically connected to a charging terminal 112, and each charging terminal 112 is electrically connected to at least one charging gun 113.

[0056] Among them, multiple AC-DC power modules 1111 are used to receive alternating current from the external power grid 20, and convert the alternating current into direct current and output it to the direct current bus 1113. Multiple DC-DC power modules 1112 are used to obtain direct current from the direct current bus 1113, and further convert the obtained direct current into direct current suitable for the electric vehicle 12 and transmit it to the power distribution device 1114. The power distribution device 1114 is used to dynamically distribute the direct current output by the multiple DC-DC power modules 1112 according to the actual charging power required by the electric vehicle 12, and transmit the distributed charging power to the electric vehicle 12 through the charging gun 113 connected to the charging terminal 112, so as to charge the electric vehicle 12.

[0057] The charging terminal 112 outputs the received DC power to the electric vehicle 12 through the electrically connected charging gun 113 to charge the electric vehicle 12. Exemplarily, the charging terminal 112 includes a housing, a human-machine interaction interface, a charging control unit, a metering and billing unit, etc., and is used to perform information exchange, energy transmission, metering and billing, etc. with the electric vehicle 12.

[0058] The electric vehicle 12 is a vehicle that is driven by electric energy. The electric vehicle 12 may be a pure electric vehicle (pure EV / battery EV), a hybrid electric vehicle (HEV), a range extended electric vehicle (REEV), or a plug-in hybrid electric vehicle (PHEV).

[0059] It should be understood that the embodiment of the present application is described by taking the charging device 11 as a split-type charging device as an example. In some other embodiments, the charging device 11 may also be an integrated charging device. Specifically, the charging device 11 may directly set the human-computer interaction interface, the charging control unit, and the metering and billing unit in the charging host 111, so that the charging device 11 may not include the charging terminal 112, but include the charging host 111, and at least one charging gun 113 electrically connected to the charging host 111.

[0060] It should also be understood that the present application embodiment is described by taking the charging device 11 as an example including the AC-DC power module 1111 and the DC-DC power module 1112. In some other embodiments, the charging device 11 may only include the AC-DC power module 1111, but not the DC-DC power module 1112.

[0061] Combine the following Figures 3 to 9 The specific structure of the power module provided in the embodiment of the present application is described in detail.

[0062] Figure 3 It is a schematic diagram of the three-dimensional structure of a power module 300 provided in an embodiment of the present application. Figure 4 yes Figure 3 FIG. 3 is a schematic diagram of an exploded structure of a power module 300. It should be understood that in the embodiment of the present application, the power module 300 may be Figure 2 The AC-DC power module 1111 shown, or the power module 300 may also be Figure 2 The DC-DC power module 1112 is shown.

[0063] Combination Figure 3 and Figure 4 The power module 300 includes a bottom shell 310 , a circuit board assembly 320 and a liquid cooling plate assembly 330 .

[0064] The bottom shell 310 has a receiving space, the circuit board assembly 320 is located in the receiving space, and the liquid cooling plate assembly 330 is located outside the receiving space. That is, the circuit board assembly 320 is fixed inside the bottom shell 310, and the liquid cooling plate assembly 330 is fixed outside the bottom shell 310. The circuit board assembly 320 is used to convert the received alternating current into direct current, or the circuit board assembly 320 is used to perform voltage conversion on the received direct current, such as step-up and / or step-down conversion on the received direct current. The liquid cooling plate assembly 330 is used to be thermally connected to the circuit board assembly 320 through the bottom shell 310.

[0065] In this way, the cooling medium circulating in the liquid cooling plate assembly 330 can exchange heat with the circuit board assembly 320 through the bottom shell 310 to take away the heat generated by the circuit board assembly 320, thereby achieving liquid cooling of the circuit board assembly 320. Compared with the commonly used air cooling method, the liquid cooling method is more efficient, thereby improving the heat dissipation effect of the circuit board assembly 320, which is conducive to meeting the heat dissipation requirements of the circuit board assembly 320 when working at high power.

[0066] In addition, in the above embodiment, the bottom shell 310 can be used as the outer shell of the power module 300 to protect the circuit board assembly 320, and can also be used as an isolation structure between the circuit board assembly 320 and the liquid cooling plate assembly 330 to achieve water and electricity isolation between the circuit board assembly 320 and the liquid cooling plate assembly 330. On the one hand, this can avoid the influence of the cooling medium leakage in the liquid cooling plate assembly 330 on the circuit board assembly 320, so as to ensure the safety and stability of the liquid cooling plate assembly 330 for the circuit board assembly 320. On the other hand, this can make the power module 300 not have to set up an isolation structure separately to achieve water and electricity isolation between the circuit board assembly 320 and the liquid cooling plate assembly 330, thereby reducing the use of components in the power module 300 and reducing the heat dissipation cost of the power module 300.

[0067] The following is a detailed introduction to the various structures in the power module 300 mentioned above in conjunction with the accompanying drawings.

[0068] Figure 5 It is a schematic diagram of an assembly structure of a bottom shell 310 and a circuit board assembly 320 provided in an embodiment of the present application. Figure 6 yes Figure 5 The bottom shell 310 is shown in another direction.

[0069] In some embodiments, in combination Figures 3 to 6The bottom shell 310 includes a bottom plate 311 and a surrounding plate 312, and the bottom plate 311 includes a first bottom plate surface 3111 and a second bottom plate surface 3112 that are arranged opposite to each other. The first bottom plate surface 3111 is used to fix one end of the surrounding plate 312, so that the first bottom plate surface 3111 and the surrounding plate 312 are enclosed to form a receiving space of the bottom shell 310, and the other end of the surrounding plate 312 forms an opening 313. In other words, the shape of the bottom shell 310 is a groove shape. The overall shape of the groove shape can be, for example, a rectangular parallelepiped, a cube, or a cylinder.

[0070] In a specific implementation, the circuit board assembly 320 can be installed in the receiving space of the bottom shell 310 through the opening 313. Figures 3 to 5 The power module 300 further includes a cover plate 340, which is disposed on the opening 313 to open or close the opening 313. The cover plate 340 and the opening 313 may be a detachable connection structure, for example, the cover plate 340 and the enclosure 312 may be fixedly connected by bolts or screws.

[0071] In addition, the second bottom plate surface 3112 is used to fix and thermally connect the liquid cooling plate assembly 330, so that the liquid cooling plate assembly 330 can be thermally connected to the circuit board assembly 320 in the bottom shell 310 through the bottom plate 311. The specific method of thermally connecting the liquid cooling plate assembly 330 and the circuit board assembly 320 will be described below and will not be repeated here.

[0072] Exemplarily, the bottom shell 310 can be made of sheet metal material by a stamping process. Specifically, the bottom plate 311 and the enclosure 312 can be integrally formed by a sheet metal material by a stamping process. The sheet metal material can be, for example, a steel plate, a stainless steel plate, an aluminum alloy plate, or a copper alloy plate.

[0073] It should be understood that if the die-casting process is used to prepare the bottom shell 310, on the one hand, the cost of the die-casting process is relatively high. In addition, the thermal conductivity of the material used in the die-casting process is relatively low, and the bottom shell 310 formed by die-casting is prone to produce pores, which easily leads to poor thermal conductivity of the bottom shell 310, resulting in a low heat conduction rate of the liquid cooling plate assembly 330 through the bottom shell 310 and the circuit board assembly 320 for heat exchange, and a low heat dissipation efficiency of the circuit board assembly 320.

[0074] On the other hand, in order to meet the power increase demand of the power module 300, the size of the power devices in the circuit board assembly 320 and the arrangement of the power devices are constantly adjusted. Correspondingly, in order to accommodate the circuit board assembly 320, the structure of the bottom shell 310 also needs to be adjusted accordingly. However, the die-cast bottom shell 310 has high hardness and brittleness, and the structural adjustment of the die-cast bottom shell 310 often requires the adjustment of the structure of the die-casting mold first. This makes the processing difficulty and cost of the structural adjustment of the bottom shell 310 greater.

[0075] Therefore, in the embodiment of the present application, the bottom shell 310 is prepared by a stamping process using sheet metal material. On the one hand, the thermal conductivity of the sheet metal material is relatively high, and the bottom shell 310 formed by stamping is not prone to produce pores, which is conducive to making the bottom shell 310 have good thermal conductivity. In this way, the heat generated by the circuit board assembly 320 during operation can be quickly transferred to the liquid cooling plate assembly 330 outside the bottom shell 310 through the bottom shell 310 to achieve liquid cooling of the circuit board assembly 320, and can also be directly transferred to the outside of the bottom shell 310 through the bottom shell 310 to achieve natural heat dissipation of the circuit board assembly 320. In turn, the heat dissipation efficiency of the circuit board assembly 320 is improved.

[0076] On the other hand, compared with the die-casting process, the sheet metal stamping process does not use a die-casting mold, the process is simpler, and the cost is lower. In addition, the bottom shell 310 prepared by the sheet metal stamping process has higher toughness. Therefore, compared with the die-casting process, preparing the bottom shell 310 by the sheet metal stamping process is more conducive to reducing the processing difficulty of the structural adjustment of the bottom shell 310 and reducing the processing cost.

[0077] Combination Figure 4 and Figure 5 In some embodiments, the circuit board assembly 320 includes a circuit board 321 and a plurality of power devices 322. The circuit board 321 and the base plate 311 are arranged opposite to each other. The circuit board 321 includes a first circuit board surface 3211 and a second circuit board surface 3212 arranged opposite to each other, the first circuit board surface 3211 faces the base plate 311, and the second circuit board surface 3212 faces away from the base plate 311. The plurality of power devices 322 are fixed to the first circuit board surface 3211.

[0078] In a specific implementation, the circuit board 321 can be installed in the bottom case 310 in a flip-chip manner, so that the multiple power devices 322 can be located between the circuit board 321 and the bottom plate 311, so that the multiple power devices 322 are thermally connected to the liquid cooling plate assembly 330 fixed to the outside of the bottom plate 311 through the bottom plate 311. That is, in the embodiment of the present application, there is a gap between the first circuit board surface 3211 of the circuit board 321 and the bottom plate 311, so as to facilitate the placement of the multiple power devices 322.

[0079] In the embodiment of the present application, the circuit board 321 may refer to a printed circuit board (PCB), a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a circuit board, an aluminum substrate, a high-frequency board, an impedance board, etc. For ease of description and understanding, the embodiment of the present application is described by taking the circuit board 321 as a printed circuit board as an example.

[0080] In some embodiments, such as Figure 5As shown, the plurality of power devices 322 may include a plurality of first power devices 322a and a plurality of second power devices 322b. The plurality of first power devices 322a may include power switch tubes. The plurality of second power devices 322b may include devices with heat dissipation such as capacitors, inductors and transformers. The height of the first power device 322a is less than the height of the second power device 322b.

[0081] Exemplarily, the power switch tube may refer to various types of power switch tubes such as a metal oxide semiconductor field effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated gate bipolar transistor (IGBT), and a silicon carbide (SiC) transistor.

[0082] In a specific implementation, the power switch tube, inductor, capacitor and transformer are electrically connected through the circuit board 321 to form an AC-DC conversion circuit or a DC-DC conversion circuit. The AC-DC conversion circuit is used to convert alternating current into direct current, and the DC-DC conversion circuit is used to convert the voltage of direct current.

[0083] In some embodiments, the combination Figure 4 and Figure 5 In order to make the second power devices 322b with a higher height thermally connected to the liquid cooling plate assembly 330 through the bottom plate 311, the power module 300 further includes a partition 350. The partition 350 is located in the bottom shell 310 and is used to divide the receiving space of the bottom shell 310 into a plurality of receiving cavities R1. The plurality of second power devices 322b are located in the plurality of receiving cavities R1. For example, one second power device 322b is disposed in one receiving cavity R1, or a plurality of second power devices 322b are disposed in the same receiving cavity R1.

[0084] The second power device 322b located in the accommodating cavity R1 is thermally connected to the inner side wall of the accommodating cavity R1 and the bottom shell 310. Specifically, one end of the partition 350 is fixed and thermally connected to the first bottom plate surface 3111 of the bottom plate 311 facing the circuit board 321, and the other end of the partition 350 extends toward the circuit board 321, so that the partition 350 divides the accommodating space enclosed by the bottom plate 311 and the surrounding plate 312 into a plurality of accommodating cavities R1.

[0085] Thus, the partition 350 forms the side wall of the accommodating cavity R1, and the bottom plate 311 forms the bottom of the accommodating cavity R1. One end of the second power device 322b facing the bottom plate 311 is thermally connected to the first bottom plate surface 3111 of the bottom plate 311, and the outer peripheral surface of the second power device 322b is thermally connected to the inner side wall of the accommodating cavity R1, that is, the partition 350.

[0086] In this way, the heat generated by the second power device 322b during operation can not only be directly transferred to the bottom plate 311 through one end of the second power device 322b facing the bottom plate 311, but can also be first transferred to the partition 350 through the outer peripheral surface of the second power device 322b, and then transferred to the bottom plate 311. Afterwards, the bottom plate 311 can transfer the absorbed heat to the liquid cooling plate assembly 330 through the second circuit board surface 3212 away from the circuit board 321, so that the liquid cooling plate assembly 330 can achieve liquid cooling and heat dissipation of the second power device 322b. In addition, the transfer efficiency of the heat on the second power device 322b to the liquid cooling plate assembly 330 is improved, and the heat dissipation effect of the power module 300 is improved.

[0087] It should be understood that, since the shapes and / or sizes of the plurality of second power devices 322b are different, the shapes and / or sizes of the plurality of accommodating chambers R1 may be different. In a specific implementation, the shape of the inner side wall of the accommodating chamber R1 matches the shape of the outer peripheral surface of the second power device 322b located in the accommodating chamber R1, so that the second power device 322b can be installed in the accommodating chamber R1, and the outer peripheral surface of the second power device 322b can be closely attached to the inner side wall of the accommodating chamber R1. This can make the outer peripheral surface of the second power device 322b have a larger contact area with the inner side wall of the accommodating chamber R1, thereby improving the transfer efficiency of the heat on the second power device 322b to the liquid cooling plate assembly 330.

[0088] It should also be understood that in the embodiment of the present application, the second power device 322b and the first bottom plate surface 3111 of the bottom plate 311, and the second power device 322b and the inner wall of the accommodating cavity R1 can be in direct thermal contact, or can also be in indirect thermal contact.

[0089] For example, in some embodiments, each accommodating cavity R1 is accommodated in a thermally conductive adhesive, and the second power device 322b is embedded in the thermally conductive adhesive. The end of the second power device 322b facing the bottom plate 311 is thermally connected to the first bottom plate surface 3111 through the thermally conductive adhesive, and the outer peripheral surface of the second power device 322b is thermally connected to the inner side wall of the accommodating cavity R1 through the thermally conductive adhesive. The thermally conductive adhesive can be, for example, a thermally conductive gel or a potting adhesive.

[0090] It should be noted that the second power device 322b being embedded in the thermal conductive adhesive may refer to at least a portion of the second power device 322b being covered by the thermal conductive adhesive.

[0091] It should be understood that, in a specific implementation, it is difficult to achieve close contact between the surface of the second power device 322b facing the base plate 311 and the first base plate surface 3111, as well as between the outer peripheral surface of the second power device 322b and the inner side wall of the accommodating cavity R1, resulting in gaps between the surface of the second power device 322b facing the base plate 311 and the first base plate surface 3111, as well as between the outer peripheral surface of the second power device 322b and the inner side wall of the accommodating cavity R1, thereby affecting the heat transfer efficiency of the second power device 322b to the base plate 311 and the inner side surface of the accommodating cavity R1.

[0092] Therefore, in the embodiment of the present application, by filling the accommodating cavity R1 with thermal conductive glue, the gap between the surface of the second power device 322b facing the bottom plate 311 and the first bottom plate surface 3111, and the gap between the outer peripheral surface of the second power device 322b and the inner side wall of the accommodating cavity R1 is filled with thermal conductive glue, so as to achieve close contact between the second power device 322b and the first bottom plate surface 3111, and between the second power device 322b and the inner side wall of the accommodating cavity R1. This can improve the transfer efficiency of the heat on the second power device 322b to the bottom plate 311, thereby improving the heat dissipation efficiency of the power module 300.

[0093] In some embodiments, in combination Figure 4 and Figure 5 , when the other end of the partition 350 extends toward the circuit board 321, the other end of the partition 350 does not contact the circuit board 321. In other words, there is a gap between the other end of the partition 350 and the first circuit board surface 3211 of the circuit board 321 facing the bottom plate 311. In this way, it is possible to avoid occupying the space of the first circuit board surface 3211 due to the other end of the partition 350 contacting the first circuit board surface 3211, thereby facilitating the arrangement of the multiple power devices 322 in the power module 300 on the first circuit board surface 3211.

[0094] In some embodiments, the partition 350 can be made of sheet metal material through a stamping process, or the partition 350 can be made through a plastic molding process. Compared with the process of making the partition 350 through a profile molding process, the process of making the partition 350 is simpler, less difficult to process, and less costly.

[0095] Exemplarily, when both the partition 350 and the bottom plate 311 are made of sheet metal materials through a stamping process, one end of the partition 350 and the first bottom plate surface 3111 of the bottom plate 311 may be fixed by welding.

[0096] In some embodiments, such as Figure 5As shown, in order to fix the circuit board assembly 320 inside the bottom case 310, the power module 300 further includes a fastener 360. One end of the fastener 360 is fixed to the circuit board 321, and the other end of the fastener 360 is fixed to the bottom plate 311. That is, the fastener 360 extends along the direction in which the circuit board 321 and the plurality of power devices 322 are arranged. The fastener 360 can be, for example, a pressure rivet stud or a pressure rivet screw.

[0097] In the embodiment of the present application, the circuit board assembly 320 is fixed to the inside of the bottom shell 310 by the fastener 360, that is, the bottom shell 310 is also used to support and fix the circuit board assembly 320. This can make it possible to not separately set up a supporting structure for the circuit board assembly 320 in the power module 300. In turn, the structure of the power module 300 is simplified, the use of components in the power module 300 is reduced, and the cost of the power module 300 is reduced.

[0098] Furthermore, in some embodiments, along the direction in which the circuit board 321 and the plurality of power devices 322 are arranged, the projection of the fastener 360 does not overlap with the partition 350. That is, the other end of the fastener 360 is not mounted on the partition 350, but directly mounted on the bottom plate 311.

[0099] It should be understood that when the other end of the fastener 360 is installed at the other end of the partition 350 extending toward the circuit board 321, it is usually necessary to machine the surface of the other end of the partition 350 so that the surface difference meets the installation requirements of the fastener 360. This results in greater difficulty and higher processing cost for the partition 350. Therefore, in the embodiment of the present application, by installing the fastener 360 and the partition 350 separately, it is helpful to reduce the difficulty and cost of processing the partition 350.

[0100] The above introduces the specific manner in which the second power device 322b with a higher height is thermally connected to the liquid cooling plate assembly 330 through the base plate 311. The following will continue to introduce the specific manner in which the first power device 322a with a lower height is thermally connected to the liquid cooling plate assembly 330 through the base plate 311, as well as the specific structure of the liquid cooling plate assembly 330, in conjunction with the accompanying drawings.

[0101] Figure 7 3 is a schematic structural diagram of a liquid cooling plate assembly 330 provided in an embodiment of the present application.

[0102] In some embodiments, in combination Figures 4 to 7The liquid cooling plate assembly 330 is fixed to the second bottom plate surface 3112 of the bottom plate 311, that is, the liquid cooling plate assembly 330 is located on the side of the plurality of power devices 322 away from the circuit board 321. The liquid cooling plate assembly 330 includes a liquid cooling top plate 331 and a liquid cooling bottom plate 332. Along the direction from the circuit board 321 to the plurality of power devices 322, that is, along the direction from the circuit board 321 to the bottom plate 311, the liquid cooling top plate 331 and the liquid cooling bottom plate 332 are arranged in sequence.

[0103] in, Figure 8 yes Figure 7 The structural schematic diagram of the liquid cooling top plate 331 is shown in FIG. Fig. 9 yes Figure 7 A schematic structural diagram of the liquid cooling base plate 332 is shown.

[0104] Combination Figures 5 to 9 In some embodiments, a first liquid-cooled top plate surface 3311 of the liquid-cooled top plate 331 facing the circuit board 321 is fixed and thermally connected to a second bottom plate surface 3112 of the bottom plate 311 facing away from the circuit board 321. A second liquid-cooled top plate surface 3312 of the liquid-cooled top plate 331 facing away from the circuit board 321 is fixedly connected to the liquid-cooled bottom plate 332, and a liquid-cooled channel is formed between the liquid-cooled top plate 331 and the liquid-cooled bottom plate 332, and the liquid-cooled channel is used to accommodate a cooling medium.

[0105] Exemplarily, the first liquid-cooled bottom plate surface 3321 of the liquid-cooled bottom plate 332 facing the circuit board 321 is recessed in a direction away from the circuit board 321 to form a plurality of flow channels 3322. The liquid-cooled top plate 331 is covered on the first liquid-cooled bottom plate surface 3321 of the liquid-cooled bottom plate 332 to seal the plurality of flow channels 3322, thereby forming a liquid-cooled channel between the liquid-cooled top plate 331 and the liquid-cooled bottom plate 332.

[0106] In this way, the heat generated by the second power device 322b located in the accommodating cavity R1 during operation can be transferred to the liquid-cooled top plate 331 through the second bottom plate surface 3112 of the bottom plate 311, and then transferred to the cooling medium in the liquid-cooled channel through the liquid-cooled top plate 331. As a result, the cooling medium in the liquid-cooled channel can perform heat exchange with the second power device 322b to take away the heat generated by the second power device 322b, thereby achieving liquid cooling of the second power device 322b.

[0107] In some embodiments, the first liquid-cooled top plate surface 3311 of the liquid-cooled top plate 331 and the second bottom plate surface 3112 of the bottom plate 311, as well as the second liquid-cooled top plate surface 3312 of the liquid-cooled top plate 331 and the first liquid-cooled bottom plate surface 3321 of the liquid-cooled bottom plate 332 can be fixed by welding.

[0108] In the above embodiment, the welds for fixing the liquid-cooled top plate 331 and the bottom shell 310, and the welds for realizing flow channel sealing between the liquid-cooled top plate 331 and the liquid-cooled bottom plate 332 are both located outside the bottom shell 310, which can enable the bottom shell 310 to effectively isolate the circuit board assembly 320 inside the bottom shell 310 and the liquid cooling channel outside the bottom shell 310, thereby realizing water and electricity isolation between the circuit board assembly 320 and the liquid-cooled plate assembly 330.

[0109] In addition, compared with the mechanical fixation between the liquid-cooled top plate 331 and the bottom shell 310 by fasteners such as screws, the embodiment of the present application fixes the liquid-cooled top plate 331 and the bottom shell 310 by welding, which can reduce the use of components in the power module 300, thereby reducing the heat dissipation cost of the power module 300.

[0110] In some embodiments, the liquid-cooled top plate 331 and the liquid-cooled bottom plate 332 can be made of sheet metal materials by a stamping process, such as steel plates, stainless steel plates, aluminum alloys, or copper alloys.

[0111] In the above embodiment, on the one hand, compared with the die-casting process for preparing the liquid-cooled top plate 331 and the liquid-cooled bottom plate 332, the sheet metal material stamping process can make the liquid-cooled top plate 331 and the liquid-cooled bottom plate 332 have good thermal conductivity. In this way, the heat generated by the second power device 322b can be quickly transferred to the cooling medium in the liquid cooling channel through the liquid-cooled top plate 331, thereby improving the heat dissipation efficiency of the circuit board assembly 320. On the other hand, compared with the die-casting process, the sheet metal material stamping process is simpler and has lower cost.

[0112] Exemplarily, the liquid-cooled top plate 331 , the liquid-cooled bottom plate 332 and the bottom shell 310 can be prepared using the same sheet metal material through a stamping process, thereby enhancing the strength of the welding between the liquid-cooled top plate 331 and the liquid-cooled bottom plate 332 , and between the liquid-cooled top plate 331 and the bottom shell 310 .

[0113] Further, in some embodiments, in combination Figure 7 and Figure 8 The liquid cooling plate assembly 330 further includes a liquid inlet joint 333 and a liquid outlet joint 334. The liquid inlet joint 333 and the liquid outlet joint 334 are fixed to the first liquid cooling top plate surface 3311 of the liquid cooling top plate 331 facing the circuit board 321, and the liquid inlet joint 333 and the liquid outlet joint 334 are connected to the liquid cooling channel respectively. The liquid inlet joint 333 is used for the cooling medium to flow into the liquid cooling channel, and the liquid outlet joint 334 is used for the cooling medium in the liquid cooling channel to flow out of the liquid cooling channel. In this way, the circulation of the cooling medium in the liquid cooling channel is realized.

[0114] In a specific implementation, in one example, the liquid-cooled top plate 331 includes two mounting through holes (not shown in the figure), and the two mounting through holes penetrate the liquid-cooled top plate 331 along the direction in which the circuit board 321 and the plurality of power devices 322 are arranged. The liquid inlet joint 333 includes a first liquid inlet 3331 and a first liquid outlet (not shown in the figure) that are connected, and the liquid outlet joint 334 includes a second liquid inlet (not shown in the figure) and a second liquid outlet 3342 that are connected. Among them, the first liquid inlet 3331 of the liquid inlet joint 333 is used to connect to the output end of the external cooling system, and the first liquid outlet of the liquid inlet joint 333 is connected to the liquid cooling channel through a mounting through hole on the liquid-cooled top plate 331, so that the cooling medium in the external cooling system flows into the liquid cooling channel through the liquid inlet joint 333.

[0115] Similarly, the second liquid inlet of the liquid outlet joint 334 is connected to the liquid cooling channel through another mounting through hole on the liquid cooling top plate 331, and the second liquid outlet 3342 of the liquid outlet joint 334 is used to connect to the liquid inlet of the external cooling system, so that the cooling medium in the liquid cooling channel flows out of the liquid cooling channel through the liquid outlet joint 334, and then flows into the external cooling system. In addition, the circulation of the cooling medium between the external cooling system and the liquid cooling channel is realized.

[0116] It should be understood that the external cooling system may refer to a cooling system located outside the power module 300 , which is capable of providing a cooling medium to the liquid cooling channel and reducing the temperature of the cooling medium provided to the liquid cooling channel.

[0117] In the embodiment of the present application, after the heat generated by the second power device 322b is transferred to the cooling medium in the liquid cooling channel, the cooling medium carrying the heat can flow out to the external cooling system through the liquid outlet joint 334. The external cooling system can cool the cooling medium carrying the heat, and the cooled cooling medium flows into the liquid cooling channel again through the liquid inlet joint 333. In this way, the recycling of the cooling medium is achieved.

[0118] Exemplarily, the liquid inlet connector 333 and the liquid outlet connector 334 may be water nozzle structures.

[0119] In some embodiments, in combination Figures 5 to 8 The bottom plate 311 includes a bottom plate mounting through hole 3114a and a bottom plate mounting through hole 3114b, and the enclosure 312 includes an enclosure mounting through hole 3121a and an enclosure mounting through hole 3121b. The first liquid inlet interface 3331 of the liquid inlet joint 333 passes through the bottom plate mounting through hole 3114a to extend into the interior of the bottom shell 310, and the first liquid inlet interface 3331 is connected to the enclosure mounting through hole 3121a, so that the first liquid inlet interface 3331 is connected to the external cooling system through the enclosure mounting through hole 3121a.

[0120] Similarly, the second liquid outlet 3342 of the liquid outlet connector 334 passes through the bottom plate mounting hole 3114b and extends into the bottom shell 310, and the second liquid outlet 3342 is connected to the enclosure mounting hole 3121b, so that the second liquid outlet 3342 is connected to the external cooling system through the enclosure mounting hole 3121b.

[0121] In some examples, along the direction in which the circuit board 321 and the plurality of power devices 322 are arranged, the projection of the liquid inlet joint 333 and the projection of the liquid outlet joint 334 are located within the projection of the bottom shell 310. That is, along the direction perpendicular to the arrangement of the circuit board 321 and the bottom plate 311, the liquid inlet joint 333 and the liquid outlet joint 334 are not exposed to the bottom shell 310 through the enclosure mounting through hole 3121a and the enclosure mounting through hole 3121b. This is conducive to the regular design of the overall structure of the power module 300.

[0122] In other examples, along the direction in which the circuit board 321 and the plurality of power devices 322 are arranged, the projections of the first liquid inlet 3331 of the liquid inlet joint 333 and the second liquid outlet 3342 of the liquid outlet joint 334 are both located outside the projection of the bottom shell 310. That is, along the direction perpendicular to the arrangement of the circuit board 321 and the bottom plate 311, the first liquid inlet 3331 of the liquid inlet joint 333 is exposed to the bottom shell 310 through the enclosure mounting through hole 3121a, and the second liquid outlet 3342 of the liquid outlet joint 334 is exposed to the bottom shell 310 through the enclosure mounting through hole 3121b. This can facilitate the assembly of the first liquid inlet 3331 and the second liquid outlet 3342 with pipelines respectively, and then connect to the external cooling system through the pipelines.

[0123] In combination with the specific structure of the liquid cooling plate assembly 330 , the specific manner in which the first power device 322 a mentioned above is thermally connected to the liquid cooling plate assembly 330 through the bottom plate 311 is introduced below.

[0124] In some embodiments, in combination Figures 5 to 8 Since the distances between the circuit board 321 and the liquid-cooled top plate 331 are substantially the same, and the height of the first power device 322a is less than the height of the second power device 322b, in order to achieve thermal connection between the first power device 322a and the second power device 322b and the liquid-cooled top plate 331, the position of the liquid-cooled top plate 331 corresponding to the first power device 322a is recessed toward the circuit board 321 to form a groove structure 3313. The opening of the groove structure 3313 faces the liquid-cooled bottom plate 332, and the bottom of the groove structure 3313 extends into the interior of the bottom shell 310 and is thermally connected to one end of the first power device 322a facing the liquid-cooled top plate 331.

[0125] Specifically, a through hole 3113 is provided at a position corresponding to the bottom plate 311 and the first power device 322a, and the bottom of the groove structure 3313 passes through the through hole 3113 on the bottom plate 311 and extends into the interior of the bottom shell 310 to be thermally connected to one end of the first power device 322a facing the liquid-cooled top plate 331.

[0126] In this way, the heat generated by the first power device 322a during operation is transferred to the groove structure 3313 of the liquid-cooled top plate 331 through one end of the first power device 322a toward the liquid-cooled top plate 331, and then transferred to the cooling medium in the liquid-cooled channel to achieve liquid-cooled heat dissipation of the first power device 322a, thereby ensuring the heat dissipation effect of the first power device 322a.

[0127] Further, in some embodiments, in combination Figure 7 and Figure 8 The power module 300 further includes a heat conductor 370. The groove bottom of the groove structure 3313 is heat-conductingly connected to one end of the first power device 322a facing the liquid-cooled top plate 331 through the heat conductor 370. The heat conductor 370 may be, for example, an aluminum block.

[0128] Exemplarily, the heat conductor 370 includes a first heat conductor surface 371 and a second heat conductor surface 372 arranged opposite to each other. The first heat conductor surface 371 is used for heat-conductingly connecting to the bottom of the groove structure 3313, and the second heat conductor surface 372 is used for heat-conductingly connecting to the surface of the first power device 322a facing the liquid-cooled top plate 331. The first heat conductor surface 371 can be fixed and heat-conductingly connected to the bottom of the groove structure 3313 by welding, for example.

[0129] It should be understood that in a specific implementation, the surface of the first power device 322a facing the liquid-cooled top plate 331 and the outer surface of the bottom of the groove structure 3313 may be difficult to be in close contact due to the difference in shape, resulting in a smaller contact area between the first power device 322a and the groove structure 3313, thereby affecting the transfer efficiency of heat from the first power device 322a to the liquid-cooled top plate 331.

[0130] In the embodiment of the present application, one end of the first power device 322a facing the liquid-cooled top plate 331 is thermally connected to the bottom of the groove of the groove structure 3313 through the heat conductor 370. The shape of the first heat conductor surface 371 of the heat conductor 370 is designed to match the outer surface of the bottom of the groove of the groove structure 3313, and the shape of the second heat conductor surface 372 of the heat conductor 370 is designed to match the surface of the first power device 322a facing the liquid-cooled top plate 331, so that the surface of the first power device 322a facing the liquid-cooled top plate 331 and the outer surface of the bottom of the groove of the groove structure 3313 are in close contact with the surface of the heat conductor 370. This can make the first power device 322a have a relatively large contact area with the bottom of the groove of the groove structure 3313 through the heat conductor 370, thereby ensuring the transfer efficiency of the heat of the first power device 322a to the groove structure 3313 of the liquid-cooled top plate 331.

[0131] In some embodiments, in combination Figure 7 and Fig. 9 The liquid cooling plate assembly 330 may further include a spoiler tooth 335, the number of the spoiler tooth 335 is multiple, and the multiple spoiler teeth 335 are located in the liquid cooling channel. Figure 4 , Figure 7 and Fig. 9 , along the direction in which the circuit board 321 and the plurality of power devices 322 are arranged, that is, along the direction in which the liquid-cooled top plate 331 and the liquid-cooled bottom plate 332 are arranged, the projection of the plurality of spoiler teeth 335 overlaps with the projection of at least some of the plurality of power devices 322. In other words, the plurality of spoiler teeth 335 correspond to at least some of the plurality of power devices 322.

[0132] In this way, when the cooling medium flows in the liquid cooling channel, the spoiler teeth 335 can repeatedly disturb the cooling medium, so that local enhancement of the cooling medium heat dissipation is formed at the position corresponding to the power device 322 in the liquid cooling channel, thereby improving the heat dissipation efficiency of the liquid cooling plate assembly 330 for multiple power devices 322.

[0133] Further, in some embodiments, in combination Figure 4 , Figure 7 and Fig. 9 The liquid cooling plate assembly 330 further includes a boss structure 336, which is fixed to a first liquid cooling bottom plate surface 3321 of the liquid cooling bottom plate 332 facing the circuit board 321 and extends in the direction of the circuit board 321. The boss structure 336 is disposed correspondingly to the groove structure 3313.

[0134] The boss structure 336 extends into the groove structure 3313 through the opening of the groove structure 3313, and there is a gap between the boss structure 336 and the groove structure 3313, so that a liquid cooling channel is formed between the liquid cooling top plate 331 and the liquid cooling bottom plate 332. The spoiler tooth 335 is located in the liquid cooling channel and is fixed to the end surface 3361 of the boss structure 336 facing the circuit board 321. For example, the spoiler tooth 335 can be fixed to the end surface 3361 of the boss structure 336 facing the circuit board 321 by welding.

[0135] It should be understood that since the groove structure 3313 is formed at the position corresponding to the first power device 322a of the liquid-cooled top plate 331, the distance between the liquid-cooled top plate 331 and the liquid-cooled bottom plate 332 at the position of the groove structure 3313 is relatively far, which results in a larger size of the liquid-cooled channel formed at the position of the groove structure 3313. The spoiler teeth 335 have a poor ability to repeatedly disturb the cooling medium in the larger-sized liquid-cooled channel, resulting in a poor local enhancement effect of the cooling medium heat dissipation.

[0136] Therefore, in the embodiment of the present application, by providing the boss structure 336 at the position corresponding to the liquid cooling bottom plate 332 and the groove structure 3313, it is helpful to reduce the distance between the liquid cooling top plate 331 at the position of the groove structure 3313 and the liquid cooling bottom plate 332, thereby reducing the size of the liquid cooling channel formed at the position of the groove structure 3313. This is helpful to improve the ability of the spoiler teeth 335 to repeatedly disturb the cooling medium in the liquid cooling channel at the position of the groove structure 3313, thereby enhancing the effect of local strengthening of cooling medium heat dissipation at the position corresponding to the first power device 322a in the liquid cooling channel, and improving the heat dissipation efficiency of the liquid cooling plate assembly 330 for the first power device 322a.

[0137] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A power module, characterized in that: The power module includes a circuit board, an integrally formed bottom shell, a cover plate, a liquid-cooled top plate and a liquid-cooled bottom plate, the integrally formed bottom shell includes a bottom plate and a surrounding plate, the bottom plate and the surrounding plate together form a cavity, the circuit board is located in the cavity, a plurality of power devices are fixed on the surface of the circuit board facing the bottom plate, and the cover plate covers the opening of the cavity; The bottom plate, the liquid-cooled top plate and the liquid-cooled bottom plate are arranged in sequence along the direction from the circuit board to the bottom plate, and the bottom plate and the liquid-cooled top plate, and the liquid-cooled top plate and the liquid-cooled bottom plate are fixedly connected by welding respectively; A liquid cooling channel is formed between the liquid cooling top plate and the liquid cooling bottom plate, and the liquid cooling channel is used for circulating cooling liquid.

2. The power module according to claim 1, characterized in that: The bottom plate includes a first opening, the liquid-cooled top plate protrudes toward the circuit board through the first opening to form a first protruding structure, and the first protruding structure is thermally connected to a first power device among the plurality of power devices on a surface facing the circuit board.

3. The power module according to claim 2, characterized in that: The power module further includes a heat conductive member, which is fixed to a surface of the first protruding structure facing the circuit board, and the first protruding structure is thermally connected to the first power device via the heat conductive member.

4. The power module according to claim 2 or 3, characterized in that: The power module also includes a boss structure and spoiler teeth; wherein, The first protruding structure includes a notch, the notch faces the liquid-cooling bottom plate, one end of the boss structure is fixed to the surface of the liquid-cooling bottom plate facing the liquid-cooling top plate, the other end of the boss structure extends into the notch, and there is a gap between the boss structure and the first protruding structure; The spoiler tooth is located in the interval, and the spoiler tooth and the boss structure, and the spoiler tooth and the first protrusion structure are fixedly connected by welding.

5. The power module according to claim 2 or 3, characterized in that: The first protruding structure includes a notch, the notch faces the liquid cooling bottom plate, the liquid cooling bottom plate protrudes toward the notch to form a second protruding structure, a portion of the second protruding structure extends into the notch, and there is a gap between the second protruding structure and the first protruding structure; The power module further includes a spoiler tooth, wherein the spoiler tooth is located in the interval, and the spoiler tooth and the first protruding structure, and the spoiler tooth and the second protruding structure are fixedly connected by welding.

6. The power module according to any one of claims 2 to 5, characterized in that: The power module further includes a partition, and the partition is located in the cavity; wherein, One end of the partition is connected to the bottom plate, and the other end of the partition extends toward the circuit board. The partition and the area of ​​the bottom plate where the first opening is not provided form a sub-cavity, and the sub-cavity is filled with thermal conductive adhesive, and a portion of the second power device among the multiple power devices extends into the thermal conductive adhesive; Along the direction in which the circuit board and the bottom plate are arranged, the length of the second power device is greater than the length of the first power device.

7. The power module according to claim 6, characterized in that: The other end of the partition does not contact the circuit board.

8. The power module according to any one of claims 1 to 7, characterized in that: The power module further includes a columnar structure and a nut structure, and the base plate and the circuit board respectively include mounting holes; wherein, One end of the columnar structure is fixed in the mounting hole of the bottom plate, the other end of the columnar structure passes through the mounting hole of the circuit board and extends outside the mounting hole of the circuit board, and the outer peripheral side of the other end of the columnar structure includes a thread; The nut structure is located on a side of the circuit board away from the bottom plate and is sleeved outside the other end of the columnar structure. The inner circumference of the nut structure includes a thread groove, and the thread groove is matched with the thread.

9. The power module according to any one of claims 1 to 8, characterized in that: Along a direction perpendicular to the arrangement of the circuit board and the bottom plate, the length of the bottom plate is respectively greater than the length of the liquid-cooling top plate and the length of the liquid-cooling bottom plate.

10. The power module according to any one of claims 1 to 9, characterized in that: The power module further includes a liquid inlet pipe and a liquid outlet pipe, the outer peripheral side of the enclosure includes two second openings, and the liquid cooling top plate includes two third openings; wherein, The liquid inlet of the liquid inlet pipeline faces one of the second openings to communicate with the outside of the cavity through the one of the second openings, and the liquid outlet of the liquid inlet pipeline extends into the liquid cooling channel through one of the third openings; The liquid outlet of the liquid outlet pipe faces another second opening to communicate with the outside of the cavity through the other second opening, and the liquid inlet of the liquid outlet pipe passes through another third opening and extends into the liquid cooling channel.

11. The power module according to any one of claims 1 to 10, characterized in that: Along the direction in which the circuit board and the bottom plate are arranged, a thickness of any one of the integrally formed bottom shell, the liquid-cooled top plate and the liquid-cooled bottom plate is greater than or equal to 0.8 mm and less than or equal to 2.5 mm.

12. The power module according to any one of claims 1 to 11, characterized in that: The integrally formed bottom shell, the liquid-cooled top plate and the liquid-cooled bottom plate are respectively prepared by sheet metal processing.

13. A charging device, characterized in that: The charging device comprises a power module and a charging gun as claimed in any one of claims 1 to 12, wherein the charging gun is used to transmit the electric energy output by the power module to the electric vehicle.

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