Electronic device including connection member of internal structure

Abstract

According to one embodiment, an electronic device may include: a display; a conductive plate supporting the display; a bracket spaced apart from the conductive plate and including a structure in which at least a portion is removed; a connection member spanning the structure along one side of the bracket and having a portion in contact with the conductive plate; and a conductive tape disposed between the connecting member and the bracket. The connection member includes a first conductive portion and a second conductive portion supporting the first conductive portion and electrically connecting the conductive plate and the bracket, the first conductive portion being partially insertable into the structure by a pressure applied by the conductive plate.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a connection member of an internal structure. Background Art

[0002] The electronic device may include various structures therein. A spacing portion may be included between the structure and the electronic component or between the structure and another structure. The electronic device may include a connecting member disposed between the spacing portions and supporting the structure or the electronic component.

[0003] The connection member may have different structures according to the structure or electronic component supported by the connection member. Summary of the invention

[0004] Technical Solution

[0005] According to an embodiment, an electronic device may include a display. The electronic device may include: a conductive plate supporting the display. The electronic device may include: a bracket including a structure at least partially removed inwardly from a surface facing the conductive plate and spaced apart from the conductive plate. The electronic device may include: a connecting member spanning the structure along the one surface of the bracket, a portion of the connecting member being in contact with the conductive plate. The electronic device may include: a conductive tape disposed between the connecting member and the bracket. The connecting member may include: a first conductive portion overlapping the structure when the display is viewed from above, at least a portion of the first conductive portion being in contact with the conductive plate. The connecting member may include: a second conductive portion extending from the first conductive portion along the surface of the bracket and having an end attached to the bracket by a conductive tape. The connecting member may electrically connect the conductive plate to the bracket. The first conductive portion may be partially inserted into the structure by pressing the conductive plate.

[0006] According to an embodiment, an electronic device may include: a conductive plate; a display, whose surface facing the inside of the electronic device contacts the conductive plate. The electronic device may include: a bracket including a structure at least partially removed inward from one surface facing the display. The electronic device may include: a support member disposed between the display and the bracket to form a gap between the display and the bracket. The electronic device may include: a connecting member spanning the structure along the one surface of the bracket, a portion of the connecting member contacting the conductive plate. The electronic device may include: a first conductive tape disposed between the connecting member and the bracket; and a second conductive tape disposed between the portion of the connecting member and the conductive plate. According to an embodiment, the connecting member may include: a first conductive portion overlapping the structure when the display is viewed from above, the first conductive portion contacting the conductive plate through the second conductive tape. The connecting member may include: a second conductive portion extending from the first conductive portion along the surface of the bracket and having an end attached to the bracket through the second conductive tape. The connecting member may electrically connect the conductive plate to the bracket. According to an embodiment, the first conductive portion may be partially inserted into the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0008] Figure 2 is a diagram illustrating an electronic device according to an embodiment.

[0009] Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

[0010] Figure 4 is a cross-sectional view cutting a portion of an exemplary electronic device according to an embodiment.

[0011] Figure 5a and Figure 5b is a plan view illustrating an exemplary connection member provided on a bracket according to an embodiment.

[0012] Figure 5c An exemplary electronic device including a connecting member disposed between a bracket and a display module according to an embodiment Figure 5a A-A' is a cross-sectional view cut.

[0013] Figure 6 is a cross-sectional view of an exemplary connection member according to an embodiment.

[0014] Figure 7a and Figure 7bis a cross-sectional view of an exemplary electronic device including a connection member disposed between a modified bracket and a display module according to an embodiment.

[0015] Figure 8a and Figure 8b 2 are diagrams illustrating exemplary configurations of connection members provided on brackets including various materials according to an embodiment. DETAILED DESCRIPTION

[0016] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0017] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (eg, display module 160).

[0018] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0019] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0020] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0021] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0022] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0023] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0024] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0025] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0026] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0027] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0028] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0029] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0030] The camera module 180 may capture still images or moving images. According to embodiments, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0031] The power management module 188 may manage power supply to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as, for example, at least a portion of a power management integrated circuit (PMIC).

[0032] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM The wireless communication module 192 may communicate with the external electronic device 104 through a wireless communication network 194 (e.g., a wireless fidelity (Wi-Fi) direct connection, or an infrared data association (IrDA)) or a second network 199 (e.g., a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may use user information (e.g., an international mobile subscriber identity (IMSI)) stored in the user identification module 196 to identify or authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199).

[0034] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0035] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element, and the radiating element is formed of a conductive material or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other components other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

[0036] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0037] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0038] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the external electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the external electronic device 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0039] Figure 2 is a diagram illustrating an electronic device according to an embodiment.

[0040] Reference Figure 2 According to the electronic device 200 of the embodiment (eg, Figure 1The electronic device 101 may include a housing 210 that forms the exterior of the electronic device 200. For example, the housing 210 may include a front surface 200A, a rear surface 200B, and a side surface 200C that surrounds a space between the first surface 200A and the second surface 200B. In an embodiment, the housing 210 may refer to a structure (e.g., Figure 3 frame structure 240).

[0041] The electronic device 200 according to the embodiment may include a substantially transparent front plate 202. In the embodiment, the front plate 202 may form at least a portion of the first surface 200A. In the embodiment, the front plate 202 may include, for example, a glass plate or a polymer plate including various coatings, but is not limited thereto.

[0042] The electronic device 200 according to an embodiment may include a substantially opaque back plate 211. In an embodiment, the back plate 211 may form at least a portion of the second surface 200B. In an embodiment, the back plate 211 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of the above materials.

[0043] The electronic device 200 according to the embodiment may include a side frame structure (or side member) 218 ​​(eg, Figure 3 In an embodiment, the side frame structure 218 may be coupled to the front plate 202 and / or the rear plate 211 to form at least a portion of the third surface 200C of the electronic device 200. For example, the side frame structure 218 may form the entirety of the third surface 200C of the electronic device 200, and for another example, the side frame structure 218 may form the third surface 200C of the electronic device 200 together with the front plate 202 and / or the rear plate 211.

[0044] When the third surface 200C of the electronic device 200 is partially formed by the front plate 202 and / or the rear plate 211, the front plate 202 and / or the rear plate 211 may include an area that is bent from its periphery toward the rear plate 211 and / or the front plate 202 and extends seamlessly. The extension area of ​​the front plate 202 and / or the rear plate 211 may be located at both ends of the long side of the electronic device 200, for example, but is not limited to the above example.

[0045] In an embodiment, the side frame structure 218 may include metal and / or polymer. In an embodiment, the rear plate 211 and the side frame structure 218 may be integrally formed and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the rear plate 211 and the side frame structure 218 may be formed in a separate configuration and / or may include different materials.

[0046] In an embodiment, the electronic device 200 may include at least one of a display 201, an audio module 203, 204, 207, a sensor module (not shown), a camera module 205 or 212, a flash 213, a key input device 217, a light emitting device (not shown), and / or a connector hole 208. In another embodiment, the electronic device 200 may omit at least one of the above components (e.g., the key input device 217 or the light emitting device), or may further include other components.

[0047] In an embodiment, the display 201 (e.g., Figure 1 The display module 160 of the front panel 202 may be visually exposed through a majority of the front panel 202. For example, at least a portion of the display 201 may be visible through the front panel 202 forming the first surface 200A. In an embodiment, the display 201 may be disposed on a rear surface of the front panel 202.

[0048] In an embodiment, the outline of the display 201 may be formed substantially the same as the outline of the front plate 202 adjacent to the display 201. In an embodiment, in order to expand the area where the display 201 is visually exposed, the distance between the outer side of the display 201 and the outer side of the front plate 202 may be formed substantially the same.

[0049] In an embodiment, the display 201 (or the first surface 200A of the electronic device 200) may include a screen display area 201A. In an embodiment, the display 201 may provide visual information to the user through the screen display area 201A. In the illustrated embodiment, when the first surface 200A is viewed from the front, the screen display area 201A is shown to be spaced apart from the outside of the first surface 200A and located on the inside of the first surface 200A, but is not limited thereto. In another embodiment, when the first surface 200A is viewed from the front, at least a portion of the periphery of the screen display area 201A may substantially overlap with the periphery of the first surface 200A (or the front plate 202).

[0050] In an embodiment, the screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user. Here, the meaning of "the screen display area 201A includes the sensing area 201B" can be understood to mean that at least a portion of the sensing area 201B can overlap the screen display area 201A. For example, the sensing area 201B, like other areas of the screen display area 201A, can refer to an area in which visual information can be displayed by the display 201 and the biometric information (e.g., fingerprint) of the user can be obtained. In another embodiment, the sensing area 201B can be formed in the key input device 217.

[0051] In an embodiment, the display 201 may include a first camera module 205 (eg, Figure 1 In an embodiment, an opening may be formed in the area of ​​the display 201, and the first camera module 205 (e.g., a perforated camera) may be at least partially disposed in the opening to face the first surface 200A. In this case, the screen display area 201A may surround at least a portion of the periphery of the opening. In another embodiment, the first camera module 205 (e.g., an under-screen camera (UDC)) may be disposed below the display 201 to overlap with an area of ​​the display 201. In this case, the display 201 may provide visual information to the user through the area, and in addition, the first camera module 205 may obtain an image corresponding to a direction facing the first surface 200A through the area of ​​the display 201.

[0052] In an embodiment, the display 201 can be coupled to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus or a proximity touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus.

[0053] In an embodiment, audio modules 203, 204, and 207 (e.g., Figure 1 The audio module 170 ) may include microphone holes 203 and 204 and a speaker hole 207 .

[0054] In an embodiment, the microphone holes 203 and 204 may include a first microphone hole 203 formed in a partial area of ​​the third surface 200C and a second microphone hole 204 formed in a partial area of ​​the second surface 200B. A microphone for obtaining external sound may be provided inside the microphone holes 203 and 204. The microphone may include a plurality of microphones to detect the direction of the sound.

[0055] In an embodiment, the second microphone hole 204 formed in a partial area of ​​the second surface 200B may be disposed adjacent to the camera modules 205 and 212. For example, the second microphone hole 204 may obtain sound according to the operation of the camera modules 205, 212, and 213. However, it is not limited thereto.

[0056] In an embodiment, the speaker hole 207 may include an external speaker hole 207 and a receiver hole for calling. The external speaker hole 207 may be formed on a portion of the third surface 200C of the electronic device 200. In another embodiment, the external speaker hole 207 may be implemented as one hole with the microphone hole 203. The receiver hole for calling may be formed on another portion of the third surface 200C. For example, the receiver hole for calling may be formed on the opposite side of the external speaker hole 207 on the third surface 200C. For example, based on Figure 2 , the external speaker hole 207 may be formed on the third surface 200C corresponding to the lower end of the electronic device 200, and the receiver hole for calling may be formed on the third surface 200C corresponding to the upper end of the electronic device 200. However, the present disclosure is not limited thereto, and in another embodiment, the receiver hole for calling may be formed at a position other than the third surface 200C. For example, the receiver hole for calling may be formed by the space between the front plate 202 (or the display 201) and the side frame structure 218.

[0057] In an embodiment, the electronic device 200 may include at least one speaker configured to output sound to the outside of the housing 210 through the external speaker hole 207 and / or the receiver hole for a call.

[0058] In an embodiment, a sensor module (e.g., Figure 1 The sensor module 176 of the electronic device 200 may generate an electrical signal or a data value corresponding to an internal operating state or an external environmental state of the electronic device 200. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and an illumination sensor.

[0059] In an embodiment, camera modules 205 and 212 (e.g., Figure 1 The camera module 180 may include a first camera module 205 disposed to face the first surface 200A of the electronic device 200, a second camera module 212 disposed to face the second surface 200B, and a flash 213.

[0060] In an embodiment, the second camera module 212 may include a plurality of cameras (eg, dual cameras, triple cameras, or quad cameras). However, the second camera module 212 is not necessarily limited to include a plurality of cameras, and may include one camera.

[0061] In an embodiment, the first camera module 205 and the second camera module 212 may include one or more lenses, image sensors, and / or image signal processors.

[0062] In an embodiment, the flash 213 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one side of the electronic device 200 .

[0063] In an embodiment, the key input device 217 (e.g., Figure 1 The input module 150 may be provided on the third surface 200C of the electronic device 200. In another embodiment, the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 not included may be implemented on the display 201 in other forms such as soft keys.

[0064] In an embodiment, the connector hole 208 may be formed on the third surface 200C of the electronic device 200 to accommodate a connector of an external device. Figure 1 The connection end 178 of the embodiment may be disposed in the connector hole 208. The electronic device 200 according to the embodiment may include an interface module (eg, Figure 1 interface 177).

[0065] In an embodiment, the electronic device 200 may include a light emitting device. For example, the light emitting device may be disposed on the first surface 200A of the housing 210. The light emitting device may provide status information of the electronic device 200 in the form of light. In another embodiment, the light emitting device may provide a light source when operating the first camera module 205. For example, the light emitting device may include an LED, an IRLED, and / or a xenon lamp.

[0066] Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

[0067] Hereinafter, redundant descriptions of configurations having the same reference numerals as those described above will be omitted.

[0068] Reference Figure 3 , the electronic device 200 according to the embodiment may include a display 201 , a front plate 202 , a rear plate 211 , a frame structure 240 , a first printed circuit board 250 , a second printed circuit board 252 , a cover plate 260 , and a battery 270 .

[0069] In an embodiment, the frame structure 240 may include a portion of the frame structure 240 that forms the exterior of the electronic device 200 (eg, Figure 2The frame structure 240 may include a side wall 241 and a support portion 243 extending inwardly from the side wall 241. In an embodiment, the frame structure 240 may be disposed between the display 201 and the rear plate 211. In an embodiment, the side wall 241 of the frame structure 240 may surround the space between the rear plate 211 and the front plate 202 (and / or the display 201), and the support portion 243 of the frame structure 240 may extend from the side wall 241 into the space. According to an embodiment, the side surface (e.g., Figure 2 The side wall 241 of the side surface 200C of the electronic device 200 may include a speaker hole (eg, Figure 2 The speaker hole 207 may penetrate the side wall 241. An audio signal output from a speaker disposed inside the electronic device 200 may be transmitted to the outside of the electronic device 200 through the speaker hole 207.

[0070] In an embodiment, the frame structure 240 may support or accommodate other components included in the electronic device 200. For example, the display 201 may be disposed on one surface of the frame structure 240 facing one direction (e.g., +Z direction), and the display 201 may be supported by the support portion 243 of the frame structure 240. For another example, the first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module (e.g., Figure 2 The first printed circuit board 250, the second printed circuit board 252, the battery 270 and the second camera module 212 may be disposed on the other surface of the frame structure 240 facing the direction opposite to the one direction (e.g., the -Z direction). The first printed circuit board 250, the second printed circuit board 252, the battery 270 and the second camera module 212 may be respectively placed in grooves defined by the sidewall 241 and / or the support portion 243 of the frame structure 240.

[0071] In an embodiment, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 may be coupled to the frame structure 240, respectively. For example, the first printed circuit board 250 and the second printed circuit board 252 may be fixedly disposed on the frame structure 240 by a coupling member such as a screw. For example, the battery 270 may be fixedly disposed in the frame structure 240 by an adhesive member (e.g., a double-sided tape). However, it is not limited to the above example.

[0072] In an embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the rear plate 211. In an embodiment, the cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on a surface of the first printed circuit board 250 facing the -Z direction.

[0073] In an embodiment, the cover plate 260 may at least partially overlap the first printed circuit board 250 when viewed along the Z axis. In an embodiment, the cover plate 260 may cover at least a partial area of ​​the first printed circuit board 250. Thus, the cover plate 260 may protect the first printed circuit board 250 from physical impact or prevent a connector coupled to the first printed circuit board 250 from being separated.

[0074] In an embodiment, the cover plate 260 may be fixedly disposed on the first printed circuit board 250 by a coupling member (eg, a screw), or may be coupled to the frame structure 240 together with the first printed circuit board 250 by a coupling member.

[0075] In an embodiment, the display 201 may be disposed between the frame structure 240 and the front plate 202. For example, the front plate 202 may be disposed on one side (e.g., +Z direction) of the display 201, and the frame structure 240 may be disposed on the other side (e.g., -Z direction) of the display 201.

[0076] In an embodiment, the front plate 202 may be coupled to the display 201. For example, the front plate 202 and the display 201 may be adhered to each other with an optical adhesive member (eg, optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0077] In an embodiment, the front plate 202 may be coupled to the frame structure 240. For example, the front plate 202 may include a peripheral portion extending outside the display 201 when viewed in the Z-axis direction, and may be adhered to the frame structure 240 by an adhesive member (e.g., double-sided tape) disposed between the peripheral portion of the front plate 202 and the frame structure 240 (e.g., the side wall 241). However, the present disclosure is not limited to the above examples.

[0078] In an embodiment, a processor (e.g., Figure 2 processor 120), memory (e.g., Figure 2 Memory 130) and / or interfaces (e.g., Figure 2The interface 177) may be equipped in the first printed circuit board 250 and / or the second printed circuit board 252. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In an embodiment, the first printed circuit board 250 and the second printed circuit board 252 may be operably or electrically connected to each other by a connecting member (e.g., a flexible printed circuit board).

[0079] In an embodiment, the battery 270 (e.g., Figure 2 The battery 189 of the electronic device 200 can provide power to at least one component of the electronic device 200. For example, the battery 270 can include a rechargeable battery or a fuel cell. At least a portion of the battery 270 can be disposed on substantially the same plane as the first printed circuit board 250 and / or the second printed circuit board 252.

[0080] The electronic device 200 according to an embodiment may include an antenna module (eg, Figure 2 Antenna module 197). In an embodiment, the antenna module may be disposed between the rear plate 211 and the battery 270. The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit / receive power with an external device.

[0081] In an embodiment, a first camera module (eg, Figure 2 The first camera module 205 (eg, the front camera) may be disposed on at least a portion of the frame structure 240 (eg, the support portion 243) so that the lens may be viewed through the front panel 202 (eg, Figure 2 A partial area of ​​the front surface 200A) receives external light.

[0082] In an embodiment, the second camera module 212 (e.g., a rear camera) may be disposed between the frame structure 240 and the rear plate 211. In an embodiment, the second camera module 212 may be electrically connected to the first printed circuit board 250 via a connecting member (e.g., a connector). In an embodiment, the second camera module 212 may be disposed so that the lens may receive external light through the camera region 284 of the rear plate 211 of the electronic device 200.

[0083] In an embodiment, the camera area 284 may be formed on a surface of the rear plate 211 (eg, Figure 2 In an embodiment, the camera region 284 may be formed to be at least partially transparent so that external light may be incident into the lens of the second camera module 212. In an embodiment, at least a portion of the camera region 284 may protrude from the surface of the rear plate 211 to a predetermined height. However, the present disclosure is not limited thereto, and in another embodiment, the camera region 284 may form a substantially same plane as the surface of the rear plate 211.

[0084] In an embodiment, the housing 210 of the electronic device 200 may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device 200. In this regard, at least some of the front plate 202, the frame structure 240, and / or the rear plate 211 that form the exterior of the electronic device 200 may be referred to as the housing 210 of the electronic device 200.

[0085] Figure 4 is a cross-sectional view cutting a portion of an exemplary electronic device according to an embodiment.

[0086] Reference Figure 4 , the electronic device 200 may include a frame structure 240 , a display module 410 , and a connection member 430 .

[0087] According to an embodiment, the frame structure 240 may include a side wall 241 and a support portion 243. The support portion 243 may extend from the side wall 241 into the electronic device 200. The support portion 243 may support electronic components in the electronic device 200. For example, the support portion 243 may support the display module 410. An adhesive member may be included between the support portion 243 and the display module 410. A gap 499 may be formed between the support portion 243 and the display module 410 by the adhesive member.

[0088] The display module 410 may include a conductive plate 401, a display 201, and a front plate 202. The front plate 202 may transmit light emitted from the display 201 to the outside. For example, the front plate 202 may include at least some transparent parts. The front plate 202 may include an area where a light shielding material is applied along the edge. The front plate 202 may include a transparent material glass or a polymer material. The display 201 may transmit light to the outside through the front plate 202. The display 201 may provide visual information to the user by providing light to the outside. For example, the display 201 may display visual information on the display area by providing color in units of pixels. The display 201 may include a light emitting diode or a backlight to provide light. The display 201 may include a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, a micro LED display, or a quantum dot LED (QLED) display. The display module 410 may include a conductive plate 401 disposed on the rear surface of the display 201. The conductive plate 401 may support components (e.g., the display 201, the light guide plate, or the light emitting diode) constituting the display module 410. The conductive plate 401 may be formed of a metallic material having rigidity so as to support the components. The conductive plate 401 may include stainless steel (SUS).

[0089] According to an embodiment, the support portion 243 may include a bracket 420 formed by a plate supporting an electronic component in the electronic device 200. The bracket 420 may include a conductive material. According to an embodiment, the bracket 420 may include a conductive material and a non-conductive material. For example, the bracket 420 may be formed integrally by a conductive material and a non-conductive material by double injection. The electronic device 200 may include a gap 499 between the conductive plate 401 and the bracket 420 so as to reduce the pool-like aggregation phenomenon of the display 201 as an LCD. When the liquid crystal in the display 201 is deformed by pressing the surface of the display 201 using the LCD, the pool-like aggregation phenomenon may occur. For example, in the case where the display area of ​​the display 201 is pressed from the outside, a partial yellow tint (or yellow dots) or white spots (white dots) may be displayed in the display area by an external force. The abnormal phenomenon of the display area may be defined as a bruise or a pool-like aggregation phenomenon. For example, the abnormal phenomenon in the display area occurring directly below the pressurized area may be defined as a bruise, and the abnormal phenomenon in the display area occurring in the peripheral area where the external force is applied may be defined as a pool-like aggregation. The conductive plate 401 and the bracket 420 may have a capacitance value between two parallel conductive materials (e.g., the conductive plate 401 and the bracket 420) through the gap 499. When the electronic device 200 is assembled, the electronic device 200 may have different capacitance values ​​according to the assembly deviation and tolerance of the components. Based on the different capacitance values, the antenna (e.g., Figure 1 The radiation performance of the antenna module 197) may not be constant.

[0090] According to an embodiment, the electronic device 200 may include a connecting member 430 disposed between the display module 410 and the bracket 420. The connecting member 430 may electrically connect the conductive plate 401 of the display module 410 to the bracket 420. The potentials of the bracket 420 and the conductive plate 401 connected by the connecting member 430 may be the same. For example, the conductive plate 401 connected to the bracket 420 operating as a grounding portion may be grounded. By grounding the conductive plate 401, the radiation performance of the antenna installed inside the electronic device 200 may be improved.

[0091] According to an embodiment, the connecting member 430 may include a conductive material so as to electrically connect the conductive plate 401 to the bracket 420. The connecting member 430 may be in contact with the conductive plate 401 and may be in contact with the bracket 420. In the case where the display 201 is an LCD, the connecting member 430 may include a conductive pad with contractility for connecting the bracket to the conductive plate 401 supporting the display 201. For example, the connecting member 430 may include an elastic material. For example, the connecting member 430 may include a porous material (e.g., a sponge) or a polymer material having elasticity therein (e.g., a polymer foam). The connecting member 430 may include a conductive material surrounding the elastic material. The conductive material may include a conductive tape or a conductive fiber.

[0092] According to an embodiment, the thickness of the uncompressed connection member 430 may be thicker than the space of the gap 499. For example, the space between the conductive plate 401 and the bracket 420 (i.e., the space of the gap 499) may be smaller than the distance from one surface of the connection member 430 in contact with the conductive plate 401 to the other surface of the connection member 430 facing the structure 501.

[0093] According to an embodiment, the gap 499 may be about 0.2 mm to 0.4 mm. The thickness of the connecting member 430 may be about 0.3 mm to 0.5 mm. The connecting member 430 may be disposed between the gaps 499 and compressed, or may be elastically supported by a structure (e.g., a groove or an opening) formed in the bracket 420.

[0094] According to an embodiment, in the case where the connection member 430 is compressed, in the case where the display 201 is an LCD, the display 201 may include white spots or a partial yellow tint (or yellow spots) in the display area. The connection member 430 may need a structure that reduces the repulsive force in order to reduce defects in the display area of ​​the display 201. Figures 5a to 8b The structure may include a structure of a connection member 430 elastically supporting the conductive plate 401 of the display 201 .

[0095] According to the above embodiment, the electronic device 200 can reduce defects in the display 201 by including the connection member 430 elastically supporting the display 410. The electronic device 200 can maintain the radiation performance of the antenna by electrically connecting the conductive plate 401 with the bracket 420 via the connection member 430.

[0096] Figure 5a and Figure 5b is a plan view illustrating an exemplary connection member provided on a bracket according to an embodiment. Figure 5c An exemplary electronic device including a connecting member disposed between a bracket and a display module according to an embodiment Figure 5a A cross-sectional view taken along line A-A'.

[0097] Reference Figure 5a to Figure 5c , the electronic device 200 may include a bracket 420 and a connecting member 530 (eg, Figure 4 The bracket 420 may include a structure 501 at least partially removed from one surface 420a facing the display module 410 or the conductive plate 401 into the bracket 420. The structure 501 may include a groove (e.g., a recess) recessed from one surface 420a of the bracket 420 or a hole penetrating the bracket 420.

[0098] According to an embodiment, the connection member 530 may contact the conductive plate 401 and may pass over the structure 501 along one surface 420a of the bracket 420. The connection member 530 may include a first conductive portion 531, a core 532, and a second conductive portion 533.

[0099] According to an embodiment, a portion of the first conductive portion 531 may be in contact with the conductive plate 401. The first conductive portion 531 may include an upper surface 531a facing the +Z axis direction, a lower surface 531b facing the -Z axis direction, and a side surface 531c disposed between the upper surface 531a and the lower surface 531b. For example, the upper surface 531a of the first conductive portion 531 may be in contact with the conductive plate 401. When the display 201 is observed from above, the first conductive portion 531 may overlap with the structure 501 including a groove or a through hole. For example, the first conductive portion 531 may be disposed to correspond to the structure 501. A portion of the lower surface 531b and the side surface 531c of the first conductive portion 531 may be inserted into the structure 501. For example, a portion of the side surface 531c of the first conductive portion 531 may be inserted into the interior of the structure 501 including the groove or the through hole. The lower surface 531b of the first conductive portion 531 may be inserted into the interior of the structure 501. After assembling the electronic device 200, a portion of the lower surface 531b or the side surface 531c of the first conductive portion 531 may be inserted into the structure 501 by pressing the conductive plate 401. When the first conductive portion 531 is attached to the bracket 420, a portion of the lower surface 531b or the side surface 531c of the first conductive portion 531 may be inserted into the interior of the structure 501 by the weight of the first conductive portion 531. In addition to a portion of the side surface 531c of the first conductive portion 531, the remaining portion of the side surface 531c may be further inserted into the structure 501 by pressing the conductive plate 401 by assembling the electronic device 200. According to an embodiment, at least a portion of the side surface 531c of the first conductive portion 531 may face the inner surface of the structure 501. The side surface 531c of the first conductive portion 531 may be spaced apart from the inner surface of the structure 501. For example, a portion of the side surface 531c of the first conductive portion 531 inserted into the structure 501 may face the inner surface of the structure 501. A portion of the side surface 531c of the first conductive portion 531 inserted into the structure 501 may be spaced apart from the inner surface of the structure 501. When the display 201 is viewed from above, the edge 501a of the structure 501 may surround an edge of the side surface 531c of the first conductive portion 531 or a lower surface 531b of the first conductive portion 531.

[0100] According to an embodiment, the first conductive portion 531 may protrude from the second conductive portion 533 in contact with the bracket 420 toward the display 201 or the conductive plate 401. The core 532 may be included in the inside of the first conductive portion 531. The shape of the first conductive portion 531 may be defined by the core 532. The first conductive portion 531 may be surrounded along the outer surface of the core 532. The first conductive portion 531 may include a shape corresponding to the outer surface of the core 532. The core 532 may be formed to be thicker than the distance d2 in the Z-axis direction of the gap 499. For example, the thickness of the core 532 in the Z-axis direction may be thicker than the distance d2 of the gap 499 in the Z-axis direction. The core 532 may be formed in a rectangular parallelepiped, but is not limited thereto, and the core 532 may include a polygonal surface, an elliptical surface, or a circular surface in contact with the conductive plate 401. The first conductive portion 531 may have a polygonal column shape, an elliptical column shape, or a circular column shape based on the shape of the core 532. The core 532 may have a specified shape. The core 532 may include an elastic material or a rigid material according to the position to be set.

[0101] According to an embodiment, the first conductive portion 531 may be integrally formed with the core 532. The first conductive portion 531 and the core 532 may be formed of the same material. For example, the first conductive portion 531 and the core 532 may include a conductive material. The first conductive portion 531 and the core 532 may be formed of a metal.

[0102] According to an embodiment, the core 532 may be formed of a partially hollow metal. For example, the core 532 may be configured to have a rigidity sufficient to maintain the shape of the first conductive portion 531. According to an embodiment, the core 532 may be formed of a porous material, and the first conductive portion 531 may be formed of a metal. For example, the core 532 may be formed of a material having elasticity.

[0103] According to an embodiment, the second conductive portion 533 may contact the lower surface 531b of the first conductive portion 531. The second conductive portion 533 may include a supporting portion 533a and a wing 533b. The supporting portion 533a may contact the first conductive portion 531. The wing 533b may extend from the supporting portion 533a along one surface of the bracket 420. The second conductive portion 533 may have a strip shape such as a glue strip. The width of the second conductive portion 533 in the Y-axis direction may be equal to or greater than the width of the first conductive portion 531 in the Y-axis direction. The second conductive portion 533 may support the first conductive portion 531. Both ends of the second conductive portion 533 may contact one surface 420a of the bracket 420 facing the display module 410. For example, the second conductive portion 533 may include a supporting portion 533a and a wing 533b. The supporting portion 533a may contact the first conductive portion 531. The supporting portion 533a and the first conductive portion 531 may be adhered to each other by a conductive adhesive. The support portion 533a may support the first conductive portion 531. The wing portion 533b may extend from two edges of the edge of the support portion 533a facing opposite directions from each other. For example, the wing portion 533b may extend from the support portion 533a and be attached to one surface 420a of the bracket 420. The wing portion 533b may be adhered to the bracket 420 by a conductive adhesive.

[0104] According to an embodiment, the connecting member 430 may electrically connect the conductive plate 401 with the bracket 420. For example, the first conductive portion 531 may be adhered to the conductive plate 401 by a conductive adhesive and may be electrically connected. The second conductive portion 533 may be adhered to the bracket 420 by a conductive adhesive and may be electrically connected. The first conductive portion 531 and the second conductive portion 533 may be connected to each other by a conductive adhesive. The second conductive portion 533 may be attached to a metal portion of one surface 420a of the bracket 420. The connecting member 430 may electrically connect the conductive plate 401 electrically connected to the first conductive portion 531 with the bracket 420 electrically connected to the second conductive portion 533. According to an embodiment, the first conductive portion 531 and the second conductive portion 533 may be formed of conductive fibers. The second conductive portion 533 may have elasticity by being formed to have a thickness of about 0.05 mm.

[0105] According to an embodiment, the electronic device 200 may include an adhesive member (or support member) 540. The adhesive member 540 may be disposed between the conductive plate 401 and the bracket 420. The adhesive member 540 may attach a portion of the conductive plate 401 and a portion of the bracket 420. For example, the adhesive member 540 may attach the conductive plate 401 and the bracket 420 in a state where the conductive plate 401 and the bracket 420 are spaced apart from each other to have a gap 499. The conductive plate 401 and the bracket 420 may be spaced apart from each other by another structure inside the electronic device 200, and the adhesive member 540 may attach the conductive plate 401 and the bracket 420. The distance d1 of the connecting member 530 in the Z-axis direction may be greater than the distance d2 of the gap 499 in the Z-axis direction. The distance d2 of the gap 499 may be determined based on the height of the adhesive member 540. In terms of spacing the conductive plate 401 and the bracket 420 apart and supporting the conductive plate 401, the adhesive member 540 may be referred to as a support member. The support may have a height of about 0.3 mm to 0.5 mm. A portion of the connection member 530 that is thicker than the distance d2 of the gap 499 may be disposed in the structure 501. A distance d3 in the Z-axis direction of the portion of the connection member 530 disposed within the structure 501 may be a difference between the distance d1 of the connection member 530 in the Z-axis direction and the distance d2 of the gap in the Z-axis direction. Since the connection member 530 is not compressed, the connection member 530 may have a relatively small repulsive force transmitted to the display 201.

[0106] Reference Figure 5b , the connecting member 430 may include a third conductive portion 535b. When the display 201 is viewed from above, the third conductive portion 535b may span at least a portion of the overlapping region between the second conductive portion 533 and the structure 501. According to an embodiment, the third conductive portion 535b may be formed integrally with the second conductive portion 533. The third conductive portion 535b may extend in a direction substantially perpendicular to the extension direction of the second conductive portion 533. The third conductive portion 535b may extend from the edge 501a of the structure 501 along one surface 420a of the bracket 420. A portion of the third conductive portion 535b may contact one surface 420a of the bracket 420. For example, both ends of the third conductive portion 535b may be attached to one surface 420a of the bracket 420 by a conductive tape. The third conductive portion 535b may be electrically connected to the bracket 420 by a conductive tape. The third conductive portion 535b may be formed integrally with the first conductive portion 531 and the second conductive portion 533. The third conductive portion 535b may be formed of the same material as the first conductive portion 531 and the second conductive portion 533. For example, the third conductive portion 535b may include conductive fibers.

[0107] According to the above-described embodiment, the electronic device 200 can elastically support the display 201 or the conductive plate 401 by the connection member 430 provided on the structure 501 including the groove or the through hole. The connection member 430 can electrically connect the conductive plate 401 with the bracket 420 based on the electrical connection between the first conductive portion 531 and the conductive plate 401 and the electrical connection between the second conductive portion 533 and the bracket 420. The electronic device 200 can remove the capacitance that affects the radiation performance of the antenna module through the electrically connected conductive plate 401 and the bracket 420.

[0108] According to an embodiment, the connecting member 530 can reduce unexpected phenomena (e.g., yellowing, white spots, or wavy patterns) displayed on the display 201 of the display module 410 while providing a stable electrical connection structure. The connecting member 530 can be provided on the structure 501 to elastically support the display 201. In the structure 501, a portion of the first conductive portion 531 and the core 532 can be provided. The first conductive portion 531 and the core 532 can be elastically supported on the bracket 420. The first conductive portion 531 and the core 532 can flow within the structure 501. The connecting member 530 can provide a relatively low repulsive force to the display module 410 based on the flow of the first conductive portion 531 and the core 532. With the relatively low repulsive force, the electronic device 200 can reduce defects displayed in the display area of ​​the display 201.

[0109] Figure 6 is a cross-sectional view of an exemplary connection member according to an embodiment.

[0110] Reference Figure 6 , the connection member 530 may include a first conductive portion 531 , a core 532 , and a second conductive portion 533 .

[0111] According to an embodiment, the first conductive portion 531 may be formed in a square column shape. The first conductive portion 531 may be formed in a hollow square column shape. The first conductive portion 531 may have a thickness of about 0.03 mm to 0.05 mm. The first conductive portion 531 may be formed of conductive fibers. For example, the first conductive portion 531 may be formed by weaving or bundling a plurality of conductive fibers. The core 532 may be disposed inside the first conductive portion 531. The first conductive portion 531 and the core 532 may be disposed on a conductive plate (e.g., Figure 4 The conductive plate 401) and the bracket (for example, Figure 4 The conductive plate 401 is provided between the conductive plate 401 and the support 420, and can be referred to as a conductive pad in terms of electrically connecting the conductive plate 401 to the support 420. The core 532 can form an outer shape of a conductive pad formed by the first conductive portion 531 and the core 532. For example, the outer shape of the first conductive portion 531 can substantially correspond to the shape of the core 532.

[0112] According to an embodiment, the inner surface of the first conductive part 531 can be attached to the outer surface of the core 532. For example, the bonding member 601 can be between the inner surface of the first conductive part 531 and the core 532. The bonding member 601 can be applied along the outer surface of the core 532, and the first conductive part 531 can be attached to the core 532. According to an embodiment, the combined height of the core 532 and the bonding member 601 can be approximately 0.3mm to about 0.5mm. The core 532 can be formed by a polymer material (such as, a foam or sponge made of a porous material). However, the present disclosure is not limited thereto. For example, the core 532 can be formed by the same material as the first conductive part 531.

[0113] According to an embodiment, the first conductive portion 531 may be integrally formed with the core 532. For example, the first conductive portion 531 may be formed in a filled column shape. The first conductive portion 531 and the core 532 may be formed of one member and may be formed of a metal material having rigidity.

[0114] According to an embodiment, the second conductive part 533 may support a conductive pad formed by the first conductive part 531 and the core 532. For example, the first conductive part 531 may be disposed on the second conductive part 533. According to an embodiment, the second conductive part 533 may be formed of conductive fibers. For example, the second conductive part 533 may be formed by weaving or bundling a plurality of conductive fibers. The thickness of the second conductive part 533 may be about 0.05 mm.

[0115] According to an embodiment, the connection member 530 may include a first conductive tape 602 for electrically connecting the first conductive portion 531 and the second conductive portion 533 to each other. The first conductive tape 602 may be disposed between the first conductive portion 531 and the second conductive portion 533. The first conductive tape 602 may electrically connect the first conductive portion 531 and the second conductive portion 533, and may attach the first conductive portion 531 to the second conductive portion 533.

[0116] According to an embodiment, the connection member 530 may provide conductive tapes 603, 604, and 605, and the conductive tapes 603, 604, and 605 are used to connect the connection member 530 with the electronic device (eg, Figure 4 Provide physical and electrical connections between structures or electronic components within the electronic device 200).

[0117] According to an embodiment, one surface of the second conductive tape 603 may be disposed on the first conductive portion 531. The other surface of the second conductive tape 603 may be disposed on the conductive plate 401. The second conductive tape 603 may be interposed between the conductive plate 401 and the first conductive portion 531 to electrically connect the conductive plate 401 including a conductive material to the first conductive portion 531.

[0118] According to an embodiment, one surface of the third conductive tape 604 and 605 may be disposed on the second conductive portion 533. The other surface of the third conductive tape 604 and 605 may be disposed on the bracket 420. The third conductive tape 604 and 605 may be interposed between the bracket 420 and the second conductive portion 533 to electrically connect the bracket 420 including the conductive material with the second conductive portion 533.

[0119] Figure 7a and Figure 7b is a cross-sectional view of an exemplary electronic device including a connection member disposed between a modified bracket and a display module according to one embodiment.

[0120] Reference Figure 7a and Figure 7b , the electronic device 200 may include a display module 410, a bracket 420, and a connecting member 530 (eg, Figure 4 The bracket 420 may include a groove 701 or a through hole 702 which is at least partially removed from one surface 420 a facing the display 201 to the inside of the bracket 420 .

[0121] According to an embodiment, the connection member 530 may contact the conductive plate 401 and may cross the groove 701 or the through hole 702 along one surface 420a of the bracket 420. The connection member 530 may include a first conductive portion 531, a core 532, and a second conductive portion 533.

[0122] According to an embodiment, the first conductive portion 531 may be in contact with the conductive plate 401. When the display 201 is viewed from above, the first conductive portion 531 may overlap with the groove 701 or the through hole 702. For example, a portion of the first conductive portion 531 may be inserted into the groove 701 or the through hole 702. For example, a portion of the first conductive portion 531 may be inserted into the inside of the groove 701 or the through hole 702. When the display 201 is viewed from above, the edge of the groove 701 may surround the side surface of the first conductive portion 531 or the edge of one surface of the first conductive portion 531 that contacts the second conductive portion 533.

[0123] According to an embodiment, the first conductive portion 531 may protrude from the second conductive portion 533 contacting the bracket 420 toward the display 201 or the conductive plate 401. A core 532 may be included in the first conductive portion 531.

[0124] According to an embodiment, the second conductive portion 533 may extend from the edge of the first conductive portion 531 along one surface 420a of the bracket 420. The second conductive portion 533 may extend with a width like a tape. The second conductive portion 533 may be arranged across the groove 701 or the through hole 702. For example, one end of the second conductive portion 533 may be attached to one surface 420a of the bracket 420, and the second conductive portion 533 may extend from one end of the second conductive portion 533 toward the groove 701 or the through hole 702. The extended second conductive portion 533 may cross the groove 701 or the through hole 702 and extend to the other end of the second conductive portion 533. The other end of the second conductive portion 533 may face a direction opposite to the direction faced by one end of the second conductive portion 533, and may be attached to one surface 420a of the bracket 420. The width of the second conductive portion 533 may be equal to or wider than the width of the first conductive portion 531. The second conductive portion 533 may support the first conductive portion 531. The second conductive portion 533 may include a supporting portion 533a and a wing 533b. The supporting portion 533a may support the first conductive portion 531. The wing 533b may extend from the edge of the supporting portion 533a along one surface 420a of the bracket 420. The wing 533b may be formed at both ends of the second conductive portion 533. For example, the wing 533b may be formed of a plurality of parts, a portion of the wing 533b may be disposed at one end of the second conductive portion 533, and another portion of the wing 533b may be disposed at the other end of the second conductive portion 533.

[0125] According to an embodiment, the connection member 430 may electrically connect the conductive plate 401 with the bracket 420. For example, the connection member 430 may electrically connect the conductive plate 401 electrically connected to the first conductive portion 531 and the bracket 420 electrically connected to the second conductive portion 533.

[0126] According to an embodiment, the electronic device 200 may include a support member. The support member may be disposed between the conductive plate 401 and the bracket 420. The support member may be configured to space the conductive plate 401 from the bracket 420.

[0127] According to the embodiment, the electronic device 200 has been described as having the groove 701 or the through hole 702 , but may include various structures. For example, the electronic device 200 may include a structure capable of providing elasticity instead of the groove 701 or the through hole 702 .

[0128] Reference Figure 7aAccording to an embodiment, the connection member 530 including the first conductive portion 531, the core 532, and the second conductive portion 533 may be spaced apart from the bottom surface 701a of the groove 701. The connection member 530 may be configured to be spaced apart from the bottom surface 701a of the groove 701 even when an external force is applied from the outside. The connection member 530, which remains spaced apart from the bottom surface 701a even when pressed by an external force, may reduce a repulsive force toward the display 201 and the conductive plate 401.

[0129] Reference Figure 7b The electronic device 200 according to the embodiment may further include a printed circuit board 710. The printed circuit board 710 may be disposed on a portion of the bracket 420. The printed circuit board 710 may be disposed on the other surface 420b of the bracket 420 facing the one surface 420a.

[0130] According to an embodiment, the bracket 420 may further include a seating groove 703 for seating the printed circuit board 710. The seating groove 703 may be recessed from the other surface 420b of the bracket 420 toward the display 201. The seating groove 703 may be connected to the through hole 702. A portion of the printed circuit board 710 seated in the seating groove 703 may be exposed in a direction toward the display 201 through the through hole 702.

[0131] According to an embodiment, the connection member 530 including the first conductive portion 531, the core 532, and the second conductive portion 533 may be spaced apart from the one surface 710a of the printed circuit board 710 inside the through hole 702. The connection member 530 may be configured to be spaced apart from the one surface 710a of the printed circuit board 710 even when an external force is applied from the outside. The connection member 530, which remains spaced apart from the one surface 710a of the printed circuit board 710 even when pressed by an external force, may reduce a repulsive force toward the display 201 and the conductive plate 401.

[0132] According to the above embodiment, the connecting member 530 can electrically connect the first conductive part 531 with the conductive plate 401, and can electrically connect the second conductive part 533 with the bracket 420 to provide a stable current flow structure. The electronic device 200 can improve the radiation performance of the antenna by reducing the capacitance of the first conductive part 531 and the conductive plate 401 via the connecting member 530. The connecting member 530 can reduce the unintended pattern displayed on the display 201 of the display module 410 while providing a stable current structure. The connecting member 530 can be provided on a structure such as a groove 701 to stably support the display 201. In the groove 701, a part of the first conductive part 531, the core 532, and the second conductive part 533 can be provided. The first conductive part 531 and the core 532 can be elastically supported on the bracket 420 based on the second conductive part 533. For example, when an external force (e.g., a touch or press of a finger) applied from the outside of the display module 410 is applied, the first conductive part 531 and the core 532 can move to the inner space of the groove 701. The connection member 530 may provide a relatively low repulsive force to the display module 410 through the movement of the first conductive portion 531 and the core 532. For example, in the case where the first conductive portion 531 and the core 532 of the connection member 530 are disposed on one surface 420a of the bracket 420, the connection member 530 may not move inside the bracket 420 due to the pressure of an external force, and thus may provide a high repulsive force to the display module 410. In the display region of the display module 410 to which a high repulsive force is applied, yellowing, white spots, or a wavy pattern may be displayed.

[0133] Figure 8a and Figure 8b 2 are diagrams illustrating exemplary arrangements of connection members provided on a bracket including various materials according to an embodiment.

[0134] Reference Figure 8a and Figure 8b , the electronic device 200 may include a bracket 420 and a connecting member 530. The bracket 420 may include a non-conductive region 810 and a conductive region 820. The non-conductive region 810 may include a non-conductive material (e.g., a polymer material or a plastic material). The conductive region 820 may include a conductive material (e.g., a metal). Although the bracket 402 has been described as including various materials, it is not limited thereto and may include only the conductive region 820.

[0135] According to an embodiment, the conductive region 820 of the bracket 420 may be electrically connected to a ground portion of the electronic device 200. The second conductive portion (eg, Figure 5a The second conductive portion 533 may include a plurality of wings (eg, Figure 5aThe plurality of wings may include a first wing 833a and a second wing 833b. The first wing 833a and the second wing 833b may be attached to the bracket 420 by third conductive tapes 604 and 605.

[0136] According to an embodiment, when the bracket 420 is viewed from above, at least a portion of the first wing 833a and the second wing 833b may overlap with the conductive region 820 of the bracket 420. The first wing 833a may be attached to the conductive region 820 of the bracket 420 through one of the third conductive tapes 604 and 605. The second wing 833b may be attached to the conductive region 820 of the bracket 420 through the other of the third conductive tapes 604 and 605.

[0137] The connecting member 530 including the wings 833a and 833b attached to the conductive region 820 of the bracket 420 by the third conductive tapes 604 and 605 can be electrically connected to the conductive region 820. The connecting member 530 can connect the conductive region 820 of the bracket 420 to the conductive plate (e.g., Figure 4 The conductive plate 401 is electrically connected.

[0138] Reference Figure 8b According to an embodiment, when the bracket 420 is viewed from above, one of the first wing 833a and the second wing 833b may overlap with the conductive region 820 of the bracket 420, and the other may overlap with the non-conductive region 810 of the bracket 420. For example, the first wing 833a may be attached to the conductive region 820 of the bracket 420 by one of the third conductive tapes 604 and 605. The second wing 833b may be attached to the non-conductive region 810 of the bracket 420 by the other of the third conductive tapes 605 and 605. According to an embodiment, the third conductive tape 605 attached to the non-conductive region 810 may be replaced with an adhesive material. For example, the adhesive material may be a tape to which an adhesive material not including conductive particles is applied.

[0139] The connecting member 530 including the first wing 833a attached to the conductive region 820 of the bracket 420 by the third conductive tapes 604 and 605 can be electrically connected to the conductive region 820. The connecting member 530 can connect the conductive region 820 of the bracket 420 to the conductive plate (e.g., Figure 4 The conductive plate 401 is electrically connected.

[0140] According to the above-described embodiment, the connecting member 530 may electrically connect the first conductive portion 531 to the conductive plate 401, and may electrically connect the second conductive portion 533 to the bracket 420, so as to provide a stable current flow structure. In order to electrically connect the second conductive portion 533 to the bracket 420, at least one of the wings 833a and 833b may be attached to the conductive region 820 of the bracket 420 by a conductive tape. The electronic device 200 may improve the radiation performance of the antenna by reducing the capacitance of the first conductive portion 531 and the conductive plate 401 via the connecting member 530.

[0141] According to the electronic device (eg, Figure 5c The electronic device 200 may include a display (eg, Figure 5c The electronic device may include a conductive plate (e.g., Figure 5c The conductive plate 401 can support the display. The electronic device can also include a bracket (e.g., Figure 5c The bracket 420 may include a structure in which at least a portion of the bracket is recessed inward from a surface facing the display (e.g., Figure 5c The bracket may be spaced apart from the conductive plate. According to an embodiment, the electronic device may further include a connecting member (eg, Figure 5c A portion of the connecting member may be in contact with the conductive plate, and the connecting member may span the structure along one surface of the bracket. The electronic device may further include a conductive tape (e.g., Figure 6 The conductive tape may be interposed between the connecting member and the bracket. According to an embodiment, the connecting member may include a first conductive portion (eg, Figure 5c The first conductive portion 531 and the second conductive portion (eg, Figure 5c The second conductive part 533 of the bracket can be provided. At least a portion of the first conductive part can be in contact with the conductive plate. When the display is viewed from above, the first conductive part can be arranged in the structure. The second conductive part can be arranged on one surface of the bracket starting from the first conductive part, and the end can be fixed to the bracket by a conductive tape. The connecting member can be arranged to electrically connect the conductive plate to the frame. According to an embodiment, the first conductive part can be partially inserted into the structure by pressing the conductive plate.

[0142] According to the above embodiment, the electronic device can elastically support the display or the conductive plate by the connecting member provided on the structure having the groove or the through hole. The connecting member can also electrically connect the conductive plate to the bracket based on the electrical connection between the first conductive part and the conductive plate and the electrical connection between the second conductive part and the bracket. The electronic device can remove the capacitance that affects the radiation performance of the antenna module through the electrically connected conductive plate and the bracket.

[0143] According to an embodiment, at least a portion of a side surface of the first conductive portion may face an inner surface of the structure. According to an embodiment, the side surface of the first conductive portion may be spaced apart from the inner surface of the structure.

[0144] According to the above embodiment, a part of the first conductive portion can be inserted into the interior of the structure so that the connecting member can elastically support the display or the conductive plate. The electronic device can reduce defects displayed on the display area of ​​the display through the connecting member.

[0145] According to an embodiment, a gap between the conductive plate and the bracket may be smaller than a thickness of the first conductive portion.

[0146] According to the above-described embodiment, the thickness of the first conductive portion or the connecting member may be formed to be smaller than the space between the bracket and the conductive plate, thereby stably maintaining the electrical connection.

[0147] According to an embodiment, a portion of the second conductive portion that contacts the first conductive portion may be disposed inside the structure and may elastically support the first conductive portion.

[0148] The second conductive portion may elastically support the first conductive portion, thereby reducing the influence of an external force on the display.

[0149] According to an embodiment, the electronic device may include a support member (eg, Figure 5c According to an embodiment, for the flow of the display, the support member may form a gap by spacing between the conductive plate and the bracket (eg, Figure 5c gap 499).

[0150] According to an embodiment, the first conductive portion may include a core (eg, Figure 5c The first conductive portion may be formed of conductive fibers.

[0151] According to the above-described embodiment, the first conductive portion may be formed of conductive fibers to provide a shape corresponding to the core along an outer surface of the core.

[0152] According to an embodiment, the core may include a metal material to support the conductive plate and maintain the shape of the first conductive portion.

[0153] According to the above-described embodiment, the core may have rigidity by including a metal material.The core may be formed integrally with the first conductive portion, or may be bonded to the first conductive portion.

[0154] According to an embodiment, the core may include an elastic material that may be deformed by an external force.

[0155] According to the above-described embodiment, the core may be formed of an elastic material to elastically support the display or the conductive plate. By including the core, the electronic device may reduce defects of the display due to external force.

[0156] According to an embodiment, the second conductive portion may include a conductive fiber configured to be electrically connected to the support.

[0157] According to the above-described embodiment, the second conductive portion including the conductive fiber may be configured to be deformable by an external force, and thus the display or the conductive plate may be elastically supported by the first conductive portion.

[0158] According to an embodiment, the connecting member may further include a third conductive portion. When the display is viewed from above, the third conductive portion may span the structure. The third conductive portion may span the second conductive portion. According to an embodiment, the connecting member may include another conductive tape. The other conductive tape may connect the wing of the third conductive portion to a surface of the bracket.

[0159] The electronic device according to the above-described embodiment can reduce resistance by including the third conductive portion. The third conductive portion can also elastically support the first conductive portion together with the second conductive portion.

[0160] According to an embodiment, the first conductive portion may be interposed between the conductive plate and the second conductive portion. According to an embodiment, the connecting member may electrically connect the conductive plate with the bracket through the first conductive portion and the second conductive portion.

[0161] The electronic device may improve the performance of a wireless signal transmitted from an antenna by electrically connecting the bracket to the conductive plate via the first conductive portion and the second conductive portion.

[0162] According to an embodiment, the structure may include a groove recessed from one surface of the bracket by removing a portion of the bracket, and portions of the first and second conductive portions inserted into the groove may be spaced apart from a bottom surface of the groove.

[0163] According to the above-described embodiment, the connection member of the electronic device can be kept in a floating state while being spaced apart from the bottom surface. The connection member can elastically support the display or the conductive plate. The connection member elastically supporting the display module can reduce defects in the display area of ​​the display that can be displayed by external force.

[0164] According to an embodiment, the structure may be a through hole extending from one surface of the support to another surface of the support. The electronic device may include a printed circuit board (e.g., Figure 7b The printed circuit board 710 may be disposed at one end of the through hole formed on the other surface. The portion of the first conductive portion and the second conductive portion inserted into the through hole may be spaced apart from the printed circuit board.

[0165] According to the above-described embodiment, the connection member of the electronic device can be kept in a floating state while being spaced apart from the printed circuit board. The connection member can elastically support the display or the conductive plate. The connection member elastically supporting the display module can reduce defects in the display area of ​​the display that can be displayed by external force.

[0166] According to an embodiment, the first conductive portion may be attached to the conductive plate by another conductive tape different from the conductive tape and disposed between the conductive plate and the first conductive portion. The first conductive portion may be electrically connected to the conductive plate.

[0167] According to an embodiment, the first conductive portion may be moved to the inside of the structure by an external force applied toward the display.

[0168] According to the above-mentioned embodiment, the connecting member of the electronic device can be constructed in a state that can be moved to the inside of the structure. The connecting member constructed in a movable state can elastically support the display or the conductive plate. The connecting member elastically supporting the display module can reduce the defects of the display area of ​​the display that can be displayed by external force.

[0169] According to an embodiment, an electronic device (e.g., Figure 5c The electronic device 200 may include a conductive plate (eg, Figure 5c The electronic device may include a display (eg, Figure 5c The surface of the display facing the inside of the electronic device may contact the conductive plate. The electronic device may include: a bracket (eg, Figure 5c The electronic device may further include a support member (e.g., Figure 5c The adhesive member 540) is disposed between the display and the bracket to form a gap between the display and the bracket.

[0170] According to an embodiment, the electronic device may include a connecting member spanning the structure along one surface of the bracket, and a portion of the connecting member is in contact with the conductive plate. According to an embodiment, the connecting member may further include a first conductive tape (e.g., Figure 6 According to an embodiment, the connection member may further include a second conductive tape (eg, Figure 6 The second conductive tape 603).

[0171] According to an embodiment, when the display is viewed from above, the connection member may include a first conductive portion (eg, Figure 5c The connecting member may further include: a second conductive portion (eg, Figure 5c The second conductive portion 533 of the bracket extends from the first conductive portion along one surface of the bracket and has an end attached to the bracket by a second conductive tape. The connecting member can electrically connect the conductive plate to the bracket.

[0172] According to an embodiment, a portion of the first conductive portion may be inserted into the structure.

[0173] According to the above embodiment, the electronic device can elastically support the display or the conductive plate by the connecting member provided on the structure having the groove or the through hole. The connecting member can also electrically connect the conductive plate to the bracket based on the electrical connection between the first conductive part and the conductive plate and the electrical connection between the second conductive part and the bracket. The electronic device can remove the capacitance that affects the radiation performance of the antenna module through the electrically connected conductive plate and the bracket.

[0174] According to an embodiment, a height of the support may be smaller than a distance from one surface of the first conductive portion in contact with the conductive plate to another surface of the first conductive portion facing the structure.

[0175] According to the above-described embodiment, the thickness of the first conductive portion or the connecting member may be formed to be smaller than the space between the bracket and the conductive plate, thereby stably maintaining the electrical connection.

[0176] According to an embodiment, at least a portion of a side surface of the first conductive portion may face an inner surface of the structure and may be spaced apart from the inner surface of the structure.

[0177] The second conductive portion may elastically support the first conductive portion, thereby reducing the influence of an external force on the display.

[0178] The electronic device according to various embodiments disclosed in this document may be various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. The electronic device according to the embodiments of this document is not limited to those electronic devices described above.

[0179] Various embodiments and the terms used herein are not intended to limit the technical features described herein to specific embodiments, but should be understood to include various changes, equivalents or alternative forms of the embodiments. For the description of the accompanying drawings, similar reference numerals may be used for similar or related components. , the noun corresponding to the singular form of the project may include one or more things, unless otherwise clearly indicated in the relevant context. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one of the items listed together in the phrases and all possible combinations thereof. Terms such as "first" and "first" or "second" or "second" may be used to simply distinguish the corresponding component from another component, and are not limited in other aspects (e.g., importance or order). If a certain component (for example, a first) is referred to as being "coupled to" or "connected to" another (for example, a second) component, with or without the terms "functionally" or "communicatively", it means that the certain component may be directly (for example, wired), wirelessly, or via a third element.

[0180] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a minimum unit or part of a component of an integrated configuration or a component that performs one or more functions. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0181] Various embodiments of this document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (or external memory) readable by a device (e.g., electronic device 101). For example, a processor (e.g., a processor) of a device (e.g., electronic device 101) may call and execute at least one of the one or more instructions stored from the storage medium. This enables the device to operate according to at least one command called to perform at least one function. One or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), and the term does not distinguish between the case of storing data semi-permanently and the case of temporarily storing data.

[0182] According to an embodiment, the method according to various embodiments disclosed in this document may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a device-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be downloaded through an application store (e.g., PlayStore). TM ) directly or online (e.g., downloading or uploading), or distributed between two user devices (e.g., smart phones). In the case of online distribution, at least some of the computer program products may be temporarily stored or temporarily created on a device-readable storage medium such as a memory in a manufacturer's server, a server in an application store, or a relay server.

[0183] According to various embodiments, each of the above-mentioned components (e.g., modules or programs) may include a single object or multiple objects, and some of the multiple objects may be separated and set in other components. According to various embodiments, one or more components or operations in the above-mentioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into one component. In this case, the integrated component may perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding components in the multiple components before integration. According to various embodiments, the operations performed by modules, programs or other components may be performed sequentially, in parallel, repeatedly or heuristically, performed in different orders, omitted, or one or more other operations may be added.

Claims

1. An electronic device (101, 200), comprising: Display (201); A conductive plate (410) supporting the display (201); A support (420) comprising a surface and a structure (501) at least partially removed from the surface, wherein the surface faces the conductive plate (410) and is spaced apart from the conductive plate (410); a connecting member (430, 530) spanning the structure (501) along the surface and connecting the conductive plate to the bracket, the connecting member (430, 530) comprising a first conductive portion and a second conductive portion; and Conductive tape (604, 605) is between the connecting member (430, 530) and the bracket (420), wherein the first conductive portion (531) overlaps the structure (501), is at least partially inserted into the structure, and is at least partially in contact with the conductive plate (410), when viewed from a first direction toward the display (201); and The second conductive portion (533) extends from the first conductive portion (531) along the surface of the bracket (420), and has an end portion attached to the bracket (420) via the conductive tape (604; 605).

2. The electronic device (101; 200) as claimed in claim 1, in, At least a portion of a side surface of the first conductive portion (531) faces the inner surface of the structure (501).

3. The electronic device (101; 200) as claimed in claim 2, in, A side surface of the first conductive portion (531) is spaced apart from an inner surface of the structure (501).

4. The electronic device (101; 200) as claimed in claim 1, in, The distance between the conductive plate (410) and the bracket (420) is smaller than the distance between the surface of the first conductive part (531) in contact with the conductive plate (410) and another surface of the first conductive part (531), the other surface being opposite to the surface of the first conductive part (531) in contact with the conductive plate (410).

5. The electronic device (101; 200) as claimed in claim 1, in, A portion of the second conductive portion (533) that contacts the first conductive portion (531) is disposed within the structure (501).

6. The electronic device (101; 200) according to claim 1, further comprising: A support member (540) is provided between the conductive plate (410) and the bracket (420). Wherein, the support member (540) is configured to provide a gap (499) between the conductive plate (410) and the bracket (420).

7. The electronic device (101; 200) as claimed in claim 1, in, The first conductive portion (531) includes a core (533) providing the shape of the first conductive portion (531) and conductive fibers surrounding at least a portion of the core (533).

8. The electronic device (101; 200) as claimed in claim 7, in, The core (533) includes a metal material that supports the conductive plate (410).

9. The electronic device (101; 200) as claimed in claim 7, in, The core (533) comprises a deformable elastic material.

10. The electronic device (101; 200) as claimed in claim 1, in, The second conductive portion (533) includes conductive fibers configured to be electrically connected to the support (420).

11. The electronic device (101; 200) as claimed in claim 1, in, The connecting member (430; 530) further includes: a third conductive portion (535) spanning a region of the structure (501) that overlaps with the second conductive portion (533) when the display (201) is viewed from the first direction; and another conductive tape, attaching both ends of the third conductive portion (535) to the surface of the bracket (420).

12. The electronic device (101; 200) as claimed in claim 1, in, The first conductive portion (531) is located between the conductive plate (410) and the second conductive portion (533), and The connecting member (430, 530) electrically connects the conductive plate (410) and the bracket (420) via a first conductive portion (531) and a second conductive portion (533).

13. The electronic device (101; 200) as claimed in claim 1, in, The structure (501) includes a groove (701) recessed from the surface of the support (420), and Part of the first conductive portion (531) and the second conductive portion (533) are disposed in the groove (701) and are spaced apart from the inner surface of the groove (701).

14. The electronic device (101; 200) as claimed in claim 1, in, The structure (501) includes a through hole (702) extending from the surface of the bracket (420) to another surface of the bracket (420) opposite to the surface of the bracket (420).

15. The electronic device (101; 200) according to claim 14, further comprising: a printed circuit board (710) disposed at an end of the through hole (702) formed on the other surface, Part of the first conductive portion (531) and the second conductive portion (533) are disposed in the through hole (702) and are spaced apart from the printed circuit board (710).

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