Photodetector, electronic device, and optical element

Abstract

A photodetector is provided. The photodetector includes: a light guide including a plurality of structures, each structure having a size equal to or smaller than a wavelength of incident light; a first material; a second material, wherein a combination of the first material and the second material is disposed over and / or between the plurality of structures and wherein refractive indices of the first material and the second material are both different from refractive indices of the plurality of structures; and a photoelectric converter that photoelectrically converts light emitted via the light guide.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of Japanese Priority Patent Application JP2022-168356 filed on October 20, 2022, and the entire contents are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to photodetectors, electronic devices, and optical components. Background Art

[0003] An image sensor provided with a color separating lens array including a plurality of nanoposts has been proposed (Patent Document 1). Citation list Patent Literature

[0004] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2021-69119 Summary of the invention Technical problem to be solved by the invention

[0005] A means of detecting light is needed to prevent quality degradation.

[0006] It is desirable to provide a photodetector capable of preventing quality degradation. Solutions to technical problems

[0007] A photodetector according to an embodiment of the present disclosure includes: a light guide, the light guide including a plurality of structures, each of the structures having a size equal to or smaller than the wavelength of incident light; a first material; a second material, wherein a combination of the first material and the second material is disposed above and / or between the plurality of structures, and wherein the refractive indexes of the first material and the second material are both different from the refractive indexes of the plurality of structures; and a photoelectric converter, which photoelectrically converts light incident through the light guide. An optical element according to an embodiment of the present disclosure includes: a plurality of structures, each of which has a size equal to or smaller than the wavelength of incident light; a first material and a second material, wherein a combination of the first material and the second material is disposed above and / or between the plurality of structures, and wherein the refractive indexes of the first material and the second material are both different from the refractive indexes of the plurality of structures. An electronic device according to an embodiment of the present disclosure includes an optical system and a photodetector that receives light transmitted via the optical system. The photodetector includes: a light guide including a plurality of structures, each of which has a size equal to or smaller than the wavelength of incident light; a first material; a second material, wherein a combination of the first material and the second material is disposed above and / or between the plurality of structures, and wherein the refractive index of the first material and the second material is different from the refractive index of the plurality of structures; and a photoelectric converter that photoelectrically converts light incident via the light guide. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] [ Figure 1 ] Figure 1 is a block diagram showing an example of a schematic configuration of an imaging device, which is an example of a photodetector according to an embodiment of the present disclosure. [ Figure 2 ] Figure 2 is a diagram illustrating an example of a pixel portion of an imaging device according to an embodiment of the present disclosure. [ Figure 3 ] Figure 3 is a diagram showing a configuration example of a pixel of an imaging device according to an embodiment of the present disclosure. [ Figure 4 ] Figure 4 is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to an embodiment of the present disclosure. [ Figure 5A ] Figure 5A is a diagram illustrating an example of a planar configuration of a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Figure 5B ] Figure 5B is a diagram illustrating an example of a planar configuration of a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Fig. 6A ] Fig. 6A is a diagram showing a configuration example of an imaging device according to a comparative example. [ Figure 6B ] Figure 6B is a diagram showing a configuration example of an imaging device according to a comparative example. [ Fig. 7A ] Fig. 7A is a diagram illustrating a configuration example of an imaging device according to an embodiment of the present disclosure. [ Figure 7B ] Figure 7B is a diagram illustrating a configuration example of an imaging device according to an embodiment of the present disclosure. [ Figure 8 ] Figure 8 is a diagram showing a configuration example of an imaging device according to a comparative example. [ Fig. 9 ] Fig. 9 is a diagram illustrating a configuration example of an imaging device according to an embodiment of the present disclosure. [ Fig.10 ] Fig.10 is an explanatory diagram of a configuration example of a light guide portion of an imaging device according to an embodiment of the present disclosure. [ Fig.11A ] Fig.11A is a diagram of an example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig. 11B ] Fig. 11B is a diagram illustrating an example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig. 11C ] Fig. 11C is a diagram illustrating an example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.11D ] Fig.11D is a diagram illustrating an example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.11E ] Fig.11E is a diagram illustrating an example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.11F ] Fig.11F is a diagram illustrating an example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig. 12A ] Fig. 12A is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig. 12B ] Fig. 12B is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig. 12C ] Fig. 12C is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.12D ] Fig.12D is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.12E ] Fig.12E is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.12F ][ Fig.12F is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Figure 12G] Figure 12G is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.12H ] Fig.12H is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.12I ] Fig.12I is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.12J ] Fig.12J is a diagram illustrating another example of a method of manufacturing an imaging device according to an embodiment of the present disclosure. [ Fig.13 ] Fig.13 : is a diagram showing a configuration example of a light guide portion of an imaging device according to Modification 1 of the present disclosure. [ Fig.14 ] Fig.14 : is a diagram showing a configuration example of a light guide portion of an imaging device according to Modification 2 of the present disclosure. [ Fig.15 ] Fig.15 : is a diagram showing a configuration example of an imaging device according to Modification 3 of the present disclosure. [ Fig.16 ] Fig.16 is a block diagram showing a configuration example of an electronic device including an imaging device. [ Fig.17 ] Fig.17 is a block diagram showing a schematic configuration example of a vehicle control system. [ Fig.18 ] Fig.18 1 is a diagram for assisting in explaining an example of the installation positions of the vehicle exterior information detection unit and the imaging unit. [ Fig.19 ] Fig.19 is a diagram showing a schematic configuration example of an endoscopic surgery system. [ Fig. 20 ] Fig. 20 is a block diagram showing an example of the functional configuration of a camera head and a camera control unit (CCU). DETAILED DESCRIPTION

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that the description will be given in the following order. 1. Implementation Plan 2. Modifications 3. Application examples 4. Application Examples <1. Implementation Plan>

[0010] Figure 1 is a block diagram showing an example of a schematic configuration of an imaging device, which is an example of a photodetector according to an embodiment of the present disclosure. Figure 2 is a diagram showing an example of a pixel portion of an imaging device according to an embodiment of the present disclosure. A photodetector is a device capable of detecting incident light. An imaging device 1 as a photodetector is capable of receiving light transmitted through an optical system to generate a signal. The imaging device 1 (photodetector) includes a plurality of pixels P, each pixel P including a photoelectric conversion portion and configured to photoelectrically convert incident light to generate a signal.

[0011] The photoelectric conversion section of each pixel P of the imaging device 1 is, for example, a photodiode, and is configured to be able to photoelectrically convert light. Figure 2 As shown, the imaging device 1 includes a region (pixel section 100) in which a plurality of pixels P are two-dimensionally arranged in a matrix as an imaging region. The pixel section 100 is a pixel array in which a plurality of pixels P are arranged, and can also be referred to as a light receiving region.

[0012] The imaging device 1 receives incident light (image light) from a subject via an optical system (not shown) including an optical lens. The imaging device 1 captures an image of the subject formed by the optical lens. The imaging device 1 is capable of photoelectrically converting the received light to generate a pixel signal. For example, the imaging device 1 is a CMOS (Complementary Metal Oxide Semiconductor) image sensor. The imaging device 1 can be used in electronic devices such as a digital camera, a video camera, or a mobile phone.

[0013] It should be noted that if Figure 2 As shown, the incident direction of light from the subject is defined as the Z-axis direction; the left-right direction on the plane orthogonal to the Z-axis direction is defined as the X-axis direction; and the up-down direction on the plane orthogonal to the Z-axis and the X-axis is defined as the Y-axis direction. Figure 2 The direction of the arrow in can be used as a standard for expressing direction in some cases.

[0014] like Figure 1 In the example shown, the imaging device 1 includes, for example, a pixel driving section 111, a signal processing section 112, a control section 113, a processing section 114, etc. in the peripheral area of ​​the pixel section 100 (pixel array). In addition, the imaging device 1 is provided with a plurality of control lines L1 and a plurality of signal lines L2.

[0015] The imaging device 1 is provided with a control line L1 which is a signal line capable of transmitting a signal to control the pixel P. In the pixel portion 100, for example, a plurality of control lines L1 are wired for each pixel row constructed by a plurality of pixels P arranged in a horizontal direction (row direction). The control line L1 is configured to transmit a control signal to read a signal from the pixel P. The control line L1 may be referred to as a pixel driving line that transmits a signal to drive the pixel P.

[0016] In addition, the imaging device 1 is provided with a signal line L2 which is a signal line capable of transmitting a signal from a pixel P. In the pixel section 100, for example, the signal line L2 is wired for each pixel column configured by a plurality of pixels P arranged in a vertical direction (column direction). The signal line L2 is a vertical signal line and is configured to transmit an output signal from the pixel P.

[0017] The pixel driving section 111 is composed of a shift register, an address decoder, etc. The pixel driving section 111 is configured to be able to drive each pixel P of the pixel section 100. The pixel driving section 111 generates a signal for controlling the pixel P and outputs the signal to each pixel P of the pixel section 100 via a control line L1.

[0018] As described later, for example, the pixel driving section 111 generates a signal for controlling a transfer transistor of the pixel P, a signal for controlling a reset transistor, etc., and supplies the signal to each pixel P through a control line L1. The pixel driving section 111 may also be referred to as a pixel control section configured to be able to control each pixel P.

[0019] The signal processing section 112 is configured to be able to perform signal processing on the input pixel signal. The signal processing section 112 includes, for example, a load circuit section, an AD (analog-to-digital) conversion section, a horizontal selection switch, etc. The signal output by each pixel P selected and scanned by the pixel driving section 111 is input to the signal processing section 112 via the signal line L2. The signal processing section 112 can perform signal processing such as CDS (Correlated Double Sampling) and AD conversion on the signal of the pixel P. The signal of each pixel P transmitted through each signal line L2 is subjected to signal processing by the signal processing section 112 and output to the processing section 114.

[0020] The processing unit 114 is configured to be able to perform signal processing on the input signal. The processing unit 114 is composed of, for example, a circuit that performs various signal processing on the pixel signal. The processing unit 114 may include a processor and a memory. The processing unit 114 performs signal processing on the pixel signal input from the signal processing unit 112, and outputs the processed pixel signal. For example, the processing unit 114 may perform various types of signal processing such as noise reduction processing or color scale correction processing.

[0021] The control section 113 is configured to be able to control each section of the imaging device 1. The control section 113 can receive a clock, operation mode command data, etc. provided from the outside, and output data such as internal information of the imaging device 1. The control section 113 includes a timing generator configured to generate various timing signals. The control section 113 controls the driving of peripheral circuits such as the pixel driving section 111 and the signal processing section 112 based on the various timing signals (pulse signals, clock signals, etc.) generated by the timing generator. It should be noted that the control section 113 and the processing section 114 can be integrally configured.

[0022] The pixel driving section 111 , the signal processing section 112 , the control section 113 , the processing section 114 and the like may be provided in one semiconductor substrate or may be provided in a plurality of semiconductor substrates respectively. The imaging device 1 may have a structure constituted by stacking a plurality of substrates (stacked structure). [Pixel composition]

[0023] Figure 3 1 is a diagram showing an example of the configuration of a pixel of an imaging device according to an embodiment. The pixel P includes a photoelectric conversion unit 12, a transfer transistor 13, an FD (floating diffusion unit) 14, and a readout circuit 18. The readout circuit 18 is configured to be able to output a signal based on the charge that has undergone photoelectric conversion. For example, the readout circuit 18 includes an amplification transistor 15, a selection transistor 16, and a reset transistor 17. It should be noted that the readout circuit 18 may include the FD 14.

[0024] The transfer transistor 13, the amplifying transistor 15, the selecting transistor 16 and the resetting transistor 17 are all MOS transistors (MOSFET) including a gate, a source and a drain. Figure 3 In the example shown, the transfer transistor 13, the amplification transistor 15, the selection transistor 16, and the reset transistor 17 are each formed of an NMOS transistor. It should be noted that the transistor of the pixel P may be formed of a PMOS transistor.

[0025] The photoelectric conversion unit 12 is configured to generate charges by photoelectric conversion. The photoelectric conversion unit 12 is, for example, a photodiode (PD) embedded and formed in a semiconductor substrate and converts incident light into charges. The photoelectric conversion unit 12 performs photoelectric conversion to generate charges corresponding to the amount of received light.

[0026] The transfer transistor 13 is configured to be able to transfer the charge photoelectrically converted by the photoelectric conversion section 12 to the FD 14. Figure 3 As shown, the transfer transistor 13 is controlled by a signal TRG to electrically couple or decouple the photoelectric conversion section 12 and the FD 14 to each other. The transfer transistor 13 can transfer the charge photoelectrically converted and accumulated by the photoelectric conversion section 12 to the FD 14.

[0027] The FD 14 is an accumulation section and is configured to be able to accumulate the transferred charge. The FD 14 can accumulate the charge photoelectrically converted by the photoelectric conversion section 12. The FD 14 can also be called a holding section capable of holding the transferred charge. The FD 14 accumulates and converts the transferred charge into a voltage corresponding to the capacity of the FD 14.

[0028] The amplifying transistor 15 is configured to generate and output a signal based on the charge accumulated in the FD 14. Figure 3 As shown, the gate of the amplifier transistor 15 is electrically coupled to the FD 14 to allow the voltage converted by the FD 14 to be input thereto. The drain of the amplifier transistor 15 is coupled to the power supply line to obtain the power supply voltage VDD, and the source of the amplifier transistor 15 is coupled to the signal line L2 via the selection transistor 16. The amplifier transistor 15 can generate a signal based on the charge accumulated in the FD 14, that is, generate a signal based on the voltage of the FD 14 and output the generated signal to the signal line L2.

[0029] The selection transistor 16 is configured to control the output of the pixel signal. The selection transistor 16 is controlled by the signal SEL and is configured to output the signal from the amplifier transistor 15 to the signal line L2. The selection transistor 16 can control the output timing of the pixel signal. It should be noted that the selection transistor 16 can be provided between the power supply line to which the power supply voltage VDD is to be provided and the amplifier transistor 15. In addition, the selection transistor 16 can also be omitted as needed.

[0030] The reset transistor 17 is configured to be able to reset the voltage of the FD 14. Figure 3 In the example shown, the reset transistor 17 is electrically coupled to the power supply line to obtain the power supply voltage VDD, and is configured to be able to reset the charge of the pixel P. The reset transistor 17 can be controlled by the signal RST to reset the charge accumulated in the FD 14 and reset the voltage of the FD 14. It should be noted that the reset transistor 17 can discharge the charge accumulated in the photoelectric conversion portion 12 via the transfer transistor 13.

[0031] The pixel driving unit 111 (see Figure 1 ) A control signal is supplied to the gate of the transfer transistor 13, the selection transistor 16, the reset transistor 17, etc. of each pixel P via the above-mentioned control line L1 to make the transistor enter an ON state (conductive state) or an OFF state (non-conductive state). The plurality of control lines L1 of the imaging device 1 include a wiring for transmitting a signal TRG to control the transfer transistor 13, a wiring for transmitting a signal SEL to control the selection transistor 16, a wiring for transmitting a signal RST to control the reset transistor 17, etc.

[0032] The transfer transistor 13, the selection transistor 16, the reset transistor 17, etc. are turned on or off by the pixel driving section 111. The pixel driving section 111 controls the readout circuit 18 of each pixel P so that each pixel P outputs a pixel signal to the signal line L2. The pixel driving section 111 can perform control so that the pixel signal of each pixel P is read to the signal line L2. It should be noted that the pixel driving section 111 and the control section 113 can also be collectively referred to as a pixel control section.

[0033] Figure 4 is a diagram illustrating an example of a cross-sectional configuration of an imaging device according to the embodiment. Figure 5A and Figure 5B 1 and 2 are diagrams showing examples of a planar configuration of a light guide portion of an imaging device according to an embodiment of the present invention. Figure 4 As shown, the imaging device 1 has a configuration in which, for example, a light guiding section 30 , an insulating layer 20 , a light receiving section 10 , and a plurality of wiring layers 90 are stacked in the Z-axis direction.

[0034] The light receiving unit 10 includes a semiconductor substrate 11 having a first surface 11S1 and a second surface 11S2 facing each other. The semiconductor substrate 11 is composed of, for example, a silicon substrate. The insulating layer 20, the light guide 30, etc. are arranged on the first surface 11S1 side of the semiconductor substrate 11. The multilayer wiring layer 90 is arranged on the second surface 11S2 side of the semiconductor substrate 11. The light guide 30 is arranged on the incident side of the light from the optical system, and the multilayer wiring layer 90 is arranged on the side opposite to the incident side of the light. The imaging device 1 is a so-called back-illuminated imaging device.

[0035] In the light receiving section 10, a plurality of photoelectric conversion sections 12 are provided between the first surface 11S1 and the second surface 11S2 of the semiconductor substrate 11. For example, the plurality of photoelectric conversion sections 12 are buried and formed in the semiconductor substrate 11. In addition, the semiconductor substrate 11 is also provided with a separation section 50.

[0036] The separation section 50 is provided between the photoelectric conversion sections 12 adjacent to each other to separate the photoelectric conversion sections 12 from each other. The separation section 50 is provided to surround the photoelectric conversion section 12 in the semiconductor substrate 11. The separation section 50 has a groove (groove section) provided at a boundary between the pixels P (or the photoelectric conversion sections 12) adjacent to each other.

[0037] As an example, an insulating film (e.g., a silicon oxide film) is provided in the groove of the separation portion 50. It should be noted that polysilicon or a metal material or the like may be buried in the groove of the separation portion 50. In addition, an air gap (cavity) may be provided in the groove of the separation portion 50. Providing the separation portion 50 can suppress light leakage to the surrounding pixels P.

[0038] The multilayer wiring layer 90 has a configuration in which, for example, a plurality of wirings are stacked with an interlayer insulating layer (interlayer insulating film) interposed therebetween. The wiring layer of the multilayer wiring layer 90 is formed of a material such as aluminum (Al), copper (Cu), etc. The wiring layer can be formed using polycrystalline silicon (Poly-Si). For example, the interlayer insulating layer is formed of silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), etc.

[0039] The semiconductor substrate 11 and the multilayer wiring layer 90 are provided with, for example, the above-mentioned readout circuit 18. It should be noted that the above-mentioned pixel driving unit 111, signal processing unit 112, control unit 113 and processing unit 114 may be formed in a substrate different from the semiconductor substrate 11, or in the semiconductor substrate 11 and the multilayer wiring layer 90.

[0040] The insulating layer 20 is provided between the layer having the light guide portion 30 and the light receiving portion 10. The insulating layer 20 includes an insulating film 21 and an insulating film 22. The insulating film 21 is provided on the first surface 11S1 of the semiconductor substrate 11. The insulating film 22 is stacked on the insulating film 21 and is located on the insulating film 21.

[0041] The insulating layer 20 is formed of, for example, an oxide film, a nitride film, an oxynitride film, etc. The insulating film 21 and the insulating film 22 of the insulating layer 20 may be respectively composed of silicon oxide (SiO), TEOS, silicon nitride (SiN), silicon oxynitride (SiON), etc., or may be composed of other insulating materials. The insulating layer 20 may also be referred to as a planarization layer (planarization film). Figure 4 In the illustrated example, the light shielding portion 55 is provided within the insulating film 22 of the insulating layer 20 .

[0042] The light shielding portion 55 (light shielding film) is composed of a light shielding member and is provided at a boundary between a plurality of pixels P adjacent to each other. The light shielding portion 55 is formed on the insulating film 21 and Figure 4 In the example shown, the light shielding portion 55 is located above the separation portion 50. The light shielding portion 55 is composed of, for example, a metal material (aluminum (Al), tungsten (W), copper (Cu), etc.) that blocks light. The light shielding portion 55 is provided around the photoelectric conversion portion 12 to suppress light leakage to surrounding pixels. It should be noted that the light shielding portion 55 may be composed of a material that absorbs light.

[0043] It should be noted that the imaging device 1 may include a fixed charge film between the photoelectric conversion section 12 and the insulating layer 20. The fixed charge film is composed of, for example, an oxide film (metal oxide film, etc.). In addition, the fixed charge film may be formed on the photoelectric conversion section 12 and between the photoelectric conversion section 12 and the separation section 50. The fixed charge film is, for example, a film having negative fixed charge, and suppresses the generation of dark current at the interface of the semiconductor substrate 11.

[0044] In addition, if Figure 4As shown in FIG. 1 , the imaging device 1 includes an antireflection film 26 and a protective film 60. For example, the antireflection film 26 is made of an insulating material such as silicon nitride (SiN) or silicon oxide (SiO). Figure 4 In the example shown, the anti-reflection film 26 is provided on the insulating film 22 to reduce (suppress) reflection. Note that the light guide portion 30 or the insulating layer 20 may include the anti-reflection film 26 .

[0045] like Figure 4 As shown, the protective film 60 is provided on the light guide portion 30. The protective film 60 is a passivation film (protective layer) and is formed to cover all of the plurality of light guide portions 30. The protective film 60 is composed of, for example, an inorganic material. As an example, the protective film 60 is composed of a silicon oxide film or a silicon nitride film.

[0046] The light guide portion 30 includes a plurality of structures 31 and is configured to guide incident light to the light receiving portion 10. Light from the subject to be measured is incident on the light guide portion 30. Each of the plurality of structures 31 is a fine (micro) structure having a size equal to or smaller than a predetermined wavelength of the incident light. For example, the size of each structure 31 is equal to or smaller than the wavelength of visible light. The size of each structure 31 may be equal to or smaller than the wavelength of infrared light.

[0047] The light guide 30 includes a variety of materials ( Figure 4 The combination of the first member 41 and the second member 42 is disposed above the plurality of structures 31 and / or around the plurality of structures 31. The combination of the first member 41 and the second member 42 is disposed between the plurality of structures 31. The combination of the first member 41 and the second member 42 is embedded between the plurality of structures 31. The first member 41 and the second member 42 are both filling members and are disposed between the plurality of structures 31. The first member 41 and the second member 42 may also be referred to as a first filling member and a second filling member, respectively.

[0048] In addition, if Figure 4 As shown, the light guide 30 includes an anti-reflection film 35. For example, the anti-reflection film 35 is formed using an insulating material such as silicon nitride (SiN) or silicon oxide (SiO). The anti-reflection film 35 is provided on each of the plurality of structures 31 to reduce (suppress) reflection.

[0049] The first member 41 and the second member 42 can be made of different materials. In the present embodiment, the first member 41 is made of an inorganic material and is arranged to contact the plurality of structures 31. The second member 42 is made of an organic material and is arranged on the first member 41. The first member 41 is formed to cover the plurality of structures 31 and the anti-reflection film 35, and the second member 42 is formed to cover the first member 41. The second member 42 is stacked on the first member 41 and is in contact with the first member 41.

[0050] The light guide 30 is an optical element (optical component) that guides (propagates) light. The light guide 30 (light guide) propagates light to the photoelectric converter 12 using a plurality of structures 31 as fine structures. The light guide 30 is provided for each pixel P or for each plurality of pixels P.

[0051] like Figure 4 As shown, each of the plurality of structures 31 is, for example, a columnar (pillar-shaped) structure. Figure 4 As shown in the schematic diagram of FIG. 1 , the plurality of structures 31 are arranged side by side in the left-right direction (X-axis direction) on a plane with at least one of the first member 41 and the second member 42 interposed therebetween. In each pixel P of the imaging device 1, the plurality of structures 31 can be arranged at intervals equal to or smaller than a predetermined wavelength of incident light, for example, at intervals equal to or smaller than the wavelength of visible light (or infrared light).

[0052] The refractive index of each structure 31 is different from that of the surrounding material. The refractive index of each structure 31 is different from that of the first member 41 and the second member 42 which are the surrounding materials of the plurality of structures 31. For example, the refractive index of each structure 31 is higher than that of the surrounding material.

[0053] For example, the refractive index of each structure 31 is higher than that of the first member 41. In addition, the refractive index of each structure 31 is higher than that of the second member 42. Each structure 31 may be composed of a material having a higher refractive index than that of the first member 41 and the second member 42.

[0054] The refractive index of the first member 41 is higher than the refractive index of the second member 42. The difference between the refractive index of each structure 31 and the refractive index of the first member 41 is, for example, 0.3 or more. It should be noted that the difference between the refractive index of each structure 31 and the refractive index of the second member 42 is also, for example, 0.3 or more.

[0055] As an example, each structure 31 is formed using titanium oxide. Each structure 31 can be formed of a single substance, oxide, nitride, oxynitride or composite material of titanium, hafnium, zirconium, tantalum, aluminum, niobium, indium, etc. In addition, each structure 31 can be formed using silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, silicon carbide oxide or other silicon compounds.

[0056] Each structure 31 can be formed using amorphous silicon (a-Si), polycrystalline silicon, germanium (Ge), etc. In addition, each structure 31 can be composed of an organic substance such as siloxane. For example, each structure 31 can be composed of a siloxane-based resin, a styrene-based resin, an acrylic-based resin, etc. Each structure 31 can be composed of a material containing fluorine in any of these resins. Each structure 31 can be formed using a material in which microbeads (filler) having a refractive index higher than that of the resin are filled in any of these resins.

[0057] The material of each structure 31 can be selected according to, for example, the difference in refractive index with the surrounding material, the wavelength range of the incident light to be measured, etc. For example, in the case where the imaging device 1 guides infrared light, each structure 31 can be composed of amorphous silicon (a-Si), polycrystalline silicon, or germanium (Ge).

[0058] As described above, the first member 41 is composed of an inorganic material. The first member 41 is formed of an inorganic material such as an oxide, a nitride or an oxynitride. For example, the first member 41 is composed of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, silicon carbide oxide, etc. It should be noted that the first member 41 can be composed of a metal compound such as titanium or hafnium, depending on the difference in refractive index with each of the multiple structures 31, the wavelength range of the incident light to be measured, etc.

[0059] As described above, the second member 42 is made of an organic material. For example, the second member 42 is made of an organic substance such as siloxane. The second member 42 can be made of a siloxane-based resin, a styrene-based resin, an acrylic-based resin, etc. The second member 42 can be made of any fluorine-containing material in these resins. The second member 42 can be formed by a material in which microbeads having a refractive index higher than that of the resin are filled in any of these resins.

[0060] Due to the difference between the refractive index of each structure 31 and the refractive index of the surrounding material, the light guide 30 causes a phase delay of the incident light, which may affect the wavefront. For example, the light guide 30 uses each structure 31, the first component 41 and the second component 42 to provide a phase delay for the incident light, thereby being able to adjust the propagation direction of the light.

[0061] The size (dimension), shape, refractive index, pitch (arrangement interval), etc. of each structure 31 are determined to allow light of any wavelength range included in the incident light to propagate in a desired direction. Figure 4 In the example shown, the size, shape, refractive index and spacing of each of the plurality of structures 31, as well as the refractive index of the first member 41 and the second member 42, etc. can be adjusted. Figure 5A or Figure 5BAs shown in the example of , a plurality of structures 31 may be arranged for each pixel P or for each plurality of pixels P.

[0062] The light guide 30 is an optical element using materials (technology) and can be called a light guide element capable of guiding light. The light propagation direction of the light guide 30 can be adjusted by the materials (optical constants) of each structure 31, the first member 41, the second member 42, etc., and the shape, height, pitch (arrangement interval), etc. of each structure 31.

[0063] Light from the subject is incident on the photoelectric conversion section 12 of each pixel P via the light guide section 30. The photoelectric conversion section 12 can receive the light incident via the light guide section 30 and perform photoelectric conversion to generate a charge corresponding to the amount of light received. Therefore, the imaging device 1 generates, for example, a visible light image, an infrared image, etc. using a pixel signal obtained by the photoelectric conversion section 12 through photoelectric conversion. In the imaging device 1, the light guide section 30 can appropriately guide light to the photoelectric conversion section 12, so that the degradation of the sensitivity to the incident light can be suppressed.

[0064] In this way, in the present embodiment, the first member 41 and the second member 42 are provided between the plurality of structures 31. This can prevent the plurality of structures 31 from collapsing and prevent the characteristics of the light guide 30 from being degraded. Next, a comparative description of the imaging device 1 according to the present embodiment and the comparative example will be further given.

[0065] The first comparative example relates to a case where the plurality of structures 31 of the imaging device 1 include only organic materials as filler materials. In the case of the first comparative example, Fig. 6A and Figure 6B As shown, the organic filler is disposed between the plurality of structures 31. In this case, as shown in FIG. Fig. 6A As shown, due to hygroscopicity, water may accumulate between the plurality of structures 31. Figure 6B As shown, the plurality of structures 31 may be tilted due to thermal expansion of the organic material.

[0066] In the present embodiment, as described above, the first member 41 including an inorganic material is disposed in contact with the plurality of structures 31, and the second member 42 including an organic material is disposed above and around the first member 41. Fig. 7A As shown in FIG. 1 , embedding the first member 41 as a film containing an inorganic material between the plurality of structures 31 can prevent water from entering and accumulating between the plurality of structures 31. Figure 7B As schematically shown, disposing the first member 41 in contact with the plurality of structures 31 can enhance the strength of the plurality of structures 31 and prevent the plurality of structures 31 from collapsing due to thermal expansion.

[0067] The second comparative example relates to a case where the plurality of structures 31 of the imaging device 1 include an inorganic material as a filler. Figure 8 As schematically shown in FIG. 2 , when a chuck 200 is used to transport an imaging device 1 in the form of a semiconductor chip, the inorganic filling material generates a large pressure, which may cause the imaging device 1 to be scratched or broken.

[0068] In this embodiment, if Fig. 9 As shown in the example of FIG. 1 , the first member 41 including an inorganic material and the second member 42 including an organic material are provided around the plurality of structures 31 in the pixel portion 100 and in the region outside the pixel portion 100. In the case where the chuck 200 is used to transport the imaging device 1, the second member 42 including an organic material can be used as a buffer layer, thereby being able to prevent scratches or cracks from occurring on the imaging device 1.

[0069] Fig.10 is an explanatory diagram of a configuration example of a light guide portion of an imaging device according to the embodiment. Fig.10 The configuration example when the light guide portion 30 guides light with a wavelength of 940 nm is shown. The plurality of structures 31 are composed of amorphous silicon (a-Si). The thickness (height) of the plurality of structures is represented by h1 and is 720 nm to 880 nm. In addition, the anti-reflection film 35 is composed of a SiN thin film. The thickness (film thickness) h2 of the anti-reflection film 35 is 90 nm to 110 nm.

[0070] The first member 41 is composed of a SiO film. The thickness h3 of the portion of the first member 41 located above the antireflection film 35 is 135nm to 165nm. The second member 42 is composed of a fluorine-containing silicone resin. The thickness H4 of the portion of the second member 42 located above the first member 41 is 80nm to 100nm. In addition, the protective film 60 is composed of a SiO film. The thickness h5 of the protective film 60 is 145nm to 180nm.

[0071] As described above, in this embodiment, the first member 41 including an inorganic material and the second member 42 including an organic material are arranged in the light guide portion 30 in a combined form. This can reduce reflection in the plurality of structures 31. For example, Fig.10 In the example shown, the reflectivity for incident light having a wavelength of 940 nm is approximately 16%.

[0072] FIG. 11A to FIG. 11F 1 and 2 are diagrams showing an example of a method for manufacturing an imaging device according to an embodiment of the present invention. Fig.11A As shown in FIG. 1 , an antireflection film 26 and the like are formed on the semiconductor substrate 11 in which elements such as the photoelectric conversion unit 12 and the like are formed. Then, an a-Si film 71 (amorphous silicon film) is formed on the antireflection film 26. Then, as shown in FIG. Fig. 11BAs shown, a SiN film is formed on the a-Si film 71 as the antireflection film 35 .

[0073] Next, if Fig. 11C As shown in FIG. 4 , a SiO thin film is formed as the first member 41, and then a resist film 81 is formed by photolithography and etching. Then, as shown in FIG. Fig.11D As shown, dry etching or wet etching is performed on the first member 41, the anti-reflection film 35, and the a-Si film 71. This removes the redundant portion of the a-Si film 71, thereby forming a plurality of structures 31.

[0074] Next, if Fig.11E As shown in FIG. 4 , a SiO film is formed by atomic layer deposition ALD to form the first member 41. Then, as shown in FIG. Fig.11F As shown in FIG. 1 , a second member 42 is formed by using a resin material. Then, a protective film 60 is formed on the second member 42. By the above manufacturing method, a Figure 4 Or the imaging device 1 shown in other figures.

[0075] FIG. 12A to FIG. 12J Each is a diagram illustrating another example of the method of manufacturing the image forming apparatus according to the embodiment. FIG. 12A to FIG. 12J The manufacturing method of the light guide portion 30 is described respectively. First, Fig. 12A As shown, a transparent inorganic filling member 72 is formed on the anti-reflection film 26 as a material of the first member 41 .

[0076] Next, if Fig. 12B As shown in FIG. 8 , a resist film 82 is formed by photolithography and etching. Then, as shown in FIG. Fig. 12C As shown, the inorganic filling member 72 is selectively removed by etching to form the first member 41 .

[0077] Next, if Fig.12D As shown, the pillar material is formed into a film and then, as Fig.12E As shown, chemical mechanical polishing (CMP) or etching is performed to form a plurality of structures 31. Fig.12F As shown in FIG. 3 , an antireflection film 35 is formed. Then, as shown in FIG. Figure 12G As shown, a resist film 83 is formed on the antireflection film 35 by photolithography and etching.

[0078] Next, if Fig.12H As shown in FIG. 3 , the antireflection film 35 is selectively removed by etching. Fig.12I As shown, the first member 41 is formed. Then, as Fig.12J As shown, the second member 42 is formed. By the above manufacturing method, it is also possible to manufacture Figure 4 Or the imaging device 1 shown in other figures. It should be noted that the above manufacturing method is only exemplary, and other manufacturing methods can also be used. [Function and Effect]

[0079] The photodetector according to the present embodiment includes a light guiding portion (light guide 30) including a plurality of structures (structures 31) each having a size equal to or smaller than the wavelength of incident light; a first material (first member 41); a second material (second member 42), wherein a combination of the first material and the second material is disposed above and / or between the plurality of structures and wherein the refractive indexes of the first material and the second material are both different from the refractive indexes of the structures; and a photoelectric conversion portion (photoelectric converter 12) which photoelectrically converts light incident via the light guiding portion.

[0080] In the photodetector (imaging device 1) according to the present embodiment, the first member 41 and the second member 42 are provided between the plurality of structures 31. Therefore, it is possible to prevent the plurality of structures from collapsing and prevent the characteristics of the light guide 30 from deteriorating. The photodetector according to the present embodiment can prevent quality degradation.

[0081] Next, a modification of the present disclosure will be described. Hereinafter, constituent elements similar to those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted as appropriate. <2. Modifications> (2-1. Modification 1)

[0082] Fig.13 1 is a diagram showing a configuration example of a light guide portion of an imaging device according to a modification example 1 of the present disclosure. The light guide portion 30 may be configured using a plurality of first members 41 and a plurality of second members 42. For example, Fig.13 In the example shown, the light guide 30 may include a first member 41a and a first member 41b. The first member 41a and the first member 41b are each made of, for example, an inorganic material. The first member 41a and the first member 41b may be made of different inorganic materials.

[0083] exist Fig.13 In the example shown, the first member 41a is arranged to contact the plurality of structures 31. The first member 41b is arranged on the first member 41a and is formed to cover the first member 41a. The second member 42 is stacked on the first member 41b and is in contact with the first member 41b. In addition, in this modification, it is also possible to achieve effects similar to those of the aforementioned embodiment. (2-2. Modification 2)

[0084] Fig.14 2 is a diagram showing an example of the configuration of a light guide portion of an imaging device according to Modification 2. Fig.14In the example shown, the light guide portion 30 may include a second member 42a and a second member 42b. The second member 42a and the second member 42b are respectively formed of, for example, organic materials. The second member 42a and the second member 42b may be formed of different organic materials.

[0085] exist Fig.14 In the example shown, the second member 42a is provided so as to be in contact with the first member 41. The second member 42b is provided on the second member 42a and is formed so as to cover the second member 42a. In addition, in this modification, effects similar to those of the aforementioned embodiment can also be achieved. (2-3. Modification 3)

[0086] Fig.15 is a diagram showing a configuration example of an imaging device according to Modification 3. Fig.15 As schematically shown in FIG. 1 , the photoelectric conversion unit 12 of the imaging device 1 may have an irregular shape (e.g., a quadrangular pyramid shape) on the first surface 11S1 of the semiconductor substrate 11. That is, the imaging device 1 includes the photoelectric conversion unit 12 having a groove structure in the shape of an inverted quadrangular pyramid on the light receiving surface and has a moth-eye structure.

[0087] The imaging device 1 according to the present modification has a structure in which minute irregularities are formed in a region above the photoelectric conversion section 12 of each pixel P. The photoelectric conversion section 12 includes a plurality of concave and convex portions and can be said to have an irregular structure. In this case, light can be effectively guided to the photoelectric conversion section 12, so that the sensitivity to incident light can be improved. (2-4. Modification 4)

[0088] In the above-mentioned embodiments and modifications, the configuration example of the light guide 30 including the plurality of structures 31 has been described. The shapes of the plurality of structures 31 of the light guide 30 are not limited to the above-mentioned examples. The shapes of the plurality of structures 31 can be appropriately modified, for example, they can be quadrilaterals in a plan view. In addition, the shapes of the plurality of structures 31 can also be polygonal, elliptical, cross-shaped, or other shapes. (2-5. Modification 5)

[0089] The imaging device 1 may include a lens portion and a color filter. The lens portion is disposed above the light guide portion 30, for example, to guide light incident from above to one side of the light guide portion 30. The color filter is configured to selectively transmit light of a specific wavelength range of the incident light. For example, the color filter is disposed between the light guide portion 30 and the photoelectric conversion portion 12. For example, the color filter is a color filter of a three-primary color system of red, blue and green (RGB). In addition, a color filter of a complementary color system such as cyan (Cy), magenta (Mg) or yellow (Ye) may also be arranged. (2-6. Modification 6)

[0090] The light guide 30 as an optical element can be configured as a light diffuser (light diffuser) capable of dispersing light by designing a plurality of structures. In this case, the light guide 30 may also be referred to as a light splitter (e.g., a color splitter). In addition, for example, the light guide 30 may be configured as a lens or a plurality of lenses that converge light. In addition, the light guide 30 may also be configured as a filter that selectively transmits light of a specific wavelength range of incident light. The photodetector and the optical element (light guide 30) according to the present disclosure are applicable to various devices. <3. Application examples>

[0091] For example, the above-described imaging device 1 and the like are applicable to any type of electronic equipment having an imaging function including a camera system such as a digital camera or video camera, a mobile phone, and the like. Fig.16 The schematic structure of the electronic device 1000 is shown.

[0092] The electronic device 1000 includes a lens group 1001 , an imaging device 1 , a digital signal processor (DSP) circuit 1002 , a frame memory 1003 , a display section 1004 , a recording section 1005 , an operation section 1006 , and a power supply section 1007 . They are connected to each other via a bus 1008 .

[0093] The lens group 1001 receives incident light (image light) from a subject and forms an image on an imaging surface of the imaging device 1. The imaging device 1 converts the light amount of the incident light formed as an image on the imaging surface by the lens group 1001 into an electrical signal pixel by pixel, and supplies the electrical signal to the DSP circuit 1002 as a pixel signal.

[0094] The DSP circuit 1002 is a signal processing circuit that processes a signal supplied from the imaging device 1. The DSP circuit 1002 outputs image data obtained by processing the signal from the imaging device 1. The frame memory 1003 temporarily stores the image data processed by the DSP circuit 1002 frame by frame.

[0095] The display portion 1004 includes, for example, a panel type display device such as a liquid crystal panel or an organic electroluminescence (EL) panel, and records image data of a moving image or a still image captured by the imaging device 1 on a recording medium such as a semiconductor memory or a hard disk.

[0096] The operation section 1006 outputs operation signals for various functions of the electronic device 1000 according to user operations. The power supply section 1007 appropriately supplies various power supplies for the operation of these power supply targets to the DSP circuit 1002, frame memory 1003, display section 1004, recording section 1005 and operation section 1006. <4. Application examples> (Application example for mobile objects)

[0097] The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure can be implemented as a device installed on any type of mobile body selected such as automobiles, electric vehicles, hybrid vehicles, motorcycles, bicycles, personal mobile devices, airplanes, drones, ships, and robots.

[0098] Fig.17 : is a block diagram showing an example of a schematic configuration of a vehicle control system as an example of a moving body control system to which the technology according to the embodiment of the present disclosure can be applied.

[0099] The vehicle control system 12000 includes a plurality of electronic control units connected to each other via a communication network 12001. Fig.17 In the example shown, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. In addition, as the functional configuration of the integrated control unit 12050, a microcomputer 12051, a sound and image output unit 12052, and an in-vehicle network interface (I / F) 12053 are shown.

[0100] The drive system control unit 12010 controls the operation of devices related to the drive system of the vehicle according to various types of programs. For example, the drive system control unit 12010 serves as a control device for the following devices: a drive force generating device such as an internal combustion engine or a drive motor for generating a vehicle drive force, a drive force transmitting mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a vehicle braking force.

[0101] The body system control unit 12020 controls the operation of various types of devices provided on the vehicle body according to various types of programs. For example, the body system control unit 12020 is used as a control device for a keyless entry system, a smart key system, a power window device, or various lights such as a headlight, a reverse light, a brake light, a turn signal light, or a fog light. In this case, it is possible to input a radio wave transmitted from a mobile device that replaces the key or a signal of various types of switches to the body system control unit 12020. The body system control unit 12020 receives the input of these radio waves or signals, and controls the door lock device, the power window device, or the light, etc. of the vehicle.

[0102] The vehicle exterior information detection unit 12030 detects information outside the vehicle including the vehicle control system 12000. For example, the vehicle exterior information detection unit 12030 is connected to the imaging unit 12031. The vehicle exterior information detection unit 12030 instructs the imaging unit 12031 to provide an image of the vehicle exterior, and receives the image from the imaging unit 12031. Based on the received image, the vehicle exterior information detection unit 12030 processes the received image to detect an object such as a person, a vehicle, an obstacle, a sign, or characters on the road surface, or processes the received image to detect the distance to the above-mentioned object.

[0103] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image, or can output the electrical signal as distance measurement information. In addition, the light received by the imaging unit 12031 may be visible light, or may be invisible light such as infrared rays.

[0104] The in-vehicle information detection unit 12040 detects information about the interior of the vehicle. The in-vehicle information detection unit 12040 is connected to, for example, a driver state detection unit 12041 that detects the driver's state. The driver state detection unit 12041 includes, for example, a camera that takes a picture of the driver. Based on the detection information input from the driver state detection unit 12041, the in-vehicle information detection unit 12040 can calculate the driver's fatigue level or the driver's concentration level, or can determine whether the driver is dozing off.

[0105] The microcomputer 12051 can calculate the control target value of the driving force generating device, the steering mechanism or the braking device based on the information outside or inside the vehicle obtained by the vehicle outside information detection unit 12030 or the vehicle inside information detection unit 12040, and output the control command to the driving system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of the advanced driver assistance system (ADAS), including collision avoidance or impact mitigation of the vehicle, following driving based on the vehicle-to-vehicle distance, speed keeping driving, vehicle collision warning or vehicle lane departure warning, etc.

[0106] In addition, by controlling the driving force generating device, steering mechanism or braking device, etc. based on information outside or inside the vehicle obtained by the external information detection unit 12030 or the internal information detection unit 12040, the microcomputer 12051 is able to perform collaborative control aimed at achieving automatic driving (for example, operating the vehicle without driver input).

[0107] In addition, based on the information outside the vehicle obtained by the vehicle exterior information detection unit 12030, the microcomputer 12051 can output a control command to the body system control unit 12020. For example, the microcomputer 12051 can perform cooperative control aimed at preventing glare by controlling the headlights to change from high beam to low beam, for example, according to the position of the preceding vehicle or the oncoming vehicle detected by the vehicle exterior information detection unit 12030.

[0108] The audio and video output unit 12052 sends an output signal of at least one of audio and video to an output device capable of visually or auditorily notifying the vehicle's passengers or the outside of the vehicle of the information. Fig.17 In the example of , as the output device, an audio speaker 12061, a display portion 12062, and an instrument panel 12063 are shown. For example, the display portion 12062 may include at least one of an in-vehicle display and a head-up display.

[0109] Fig.18 12031 is a diagram showing an example of the installation position of the imaging unit 12031.

[0110] exist Fig.18 In the figure, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104 and 12105.

[0111] The imaging units 12101, 12102, 12103, 12104 and 12105 are, for example, arranged at positions on the front nose, rearview mirror, rear bumper and rear door of the vehicle 12100 and at positions on the upper part of the windshield in the vehicle compartment. The imaging unit 12101 arranged at the front nose and the imaging unit 12105 arranged at the upper part of the windshield in the vehicle compartment mainly obtain images in front of the vehicle 12100. The imaging units 12102 and 12103 arranged at the rearview mirror mainly obtain images on both sides of the vehicle 12100. The imaging unit 12104 arranged at the rear bumper or rear door mainly obtains images behind the vehicle 12100. The imaging unit 12105 arranged at the upper part of the windshield in the vehicle compartment is mainly used to detect vehicles in front, pedestrians, obstacles, traffic lights, traffic signs or lanes, etc.

[0112] By the way, Fig.18 An example of the imaging range of the imaging units 12101 to 12104 is shown. The imaging range 12111 indicates the imaging range of the imaging unit 12101 provided at the front nose. The imaging ranges 12112 and 12113 respectively indicate the imaging ranges of the imaging units 12102 and 12103 provided at the rearview mirror. The imaging range 12114 indicates the imaging range of the imaging unit 12104 provided at the rear bumper or the rear door. For example, by superimposing the image data captured by the imaging units 12101 to 12104, a bird's-eye view image of the vehicle 12100 observed from above is obtained.

[0113] At least one of the imaging units 12101 to 12104 may have a function of obtaining distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera composed of a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.

[0114] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can determine the distance of each three-dimensional object within the imaging ranges 12111 to 12114 and the time change of the distance (relative speed with respect to the vehicle 12100), thereby extracting the nearest three-dimensional object as the leading vehicle, in particular, the three-dimensional object that exists on the driving path of the vehicle 12100 and travels in the same direction as the vehicle 12100 at a predetermined speed (e.g., equal to or greater than 0 km / h). In addition, the microcomputer 12051 can pre-set the inter-vehicle distance to be maintained with the leading vehicle, and perform automatic braking control (including follow-up stop control) or automatic acceleration control (including follow-up start control) and the like. Therefore, cooperative control such as automatic driving that aims to enable the vehicle to operate autonomously without relying on the input of the driver can be performed.

[0115] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12501 can classify the three-dimensional object data of the three-dimensional object into the three-dimensional object data of two-wheeled vehicles, standard vehicles, large vehicles, pedestrians, electric poles and other three-dimensional objects, extract the classified three-dimensional object data, and use the extracted three-dimensional object data to automatically avoid obstacles. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 as obstacles that the driver of the vehicle 12100 can visually identify and obstacles that the driver of the vehicle 12100 is difficult to visually identify. Then, the microcomputer 12051 determines a collision risk indicating the degree of risk of collision with each obstacle. In the case where the collision risk is equal to or higher than the set value and therefore there is a possibility of collision, the microcomputer 12051 outputs a warning to the driver via the audio speaker 12061 or the display unit 12062, and performs forced deceleration or evasive steering via the drive system control unit 12010. Therefore, the microcomputer 12051 can assist driving to avoid collisions.

[0116] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. The microcomputer 12051 is capable of identifying pedestrians, for example, by determining whether there are pedestrians in the camera images of the imaging units 12101 to 12104. For example, such identification of pedestrians is performed by the following steps: a step of extracting feature points in the images of the imaging units 12101 to 12104 as infrared cameras; and a step of performing pattern matching processing on a series of feature points representing the contour of the object to determine whether it is a pedestrian. If the microcomputer 12051 determines that there are pedestrians in the camera images of the imaging units 12101 to 12104 and thus identifies the pedestrians, the sound image output unit 12052 controls the display unit 12062 so that the square contour line for emphasis is displayed in a manner superimposed on the identified pedestrian. The sound image output unit 12052 may also control the display unit 12062 so that an icon representing a pedestrian or the like is displayed at a desired position.

[0117] An example of a mobile body control system to which the technology according to the embodiment of the present disclosure can be applied has been described above. For example, the technology according to the embodiment of the present disclosure can be applied to the imaging section 12031 and the like in the above-mentioned configuration. Specifically, the imaging device 1 and the like can be applied to the imaging section 12031. Applying the technology according to the embodiment of the present disclosure to the imaging section 12031 can obtain an image with high definition, thereby enabling high-precision control to be performed using the image in the mobile body control system. (Application example of endoscopic surgery system)

[0118] The technology according to the embodiment of the present disclosure (the present technology) can be applied to various products. For example, the technology according to the embodiment of the present disclosure can be applied to an endoscopic surgery system.

[0119] Fig.19 : is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to an embodiment of the present disclosure (the present technology) can be applied.

[0120] exist Fig.19 , a state is shown in which a surgeon (doctor) 11131 is using an endoscopic surgery system 11000 to perform surgery on a patient 11132 on a bed 11133. As shown in the figure, the endoscopic surgery system 11000 includes an endoscope 11100, other surgical tools 11110 such as a pneumoperitoneum tube 11111 and an energy device 11112, a support arm device 11120 on which the endoscope 11100 is supported, and a cart 11200 loaded with various devices for endoscopic surgery.

[0121] The endoscope 11100 includes a lens barrel 11101 and a camera head 11102 connected to the proximal end of the lens barrel 11101, and the lens barrel 11101 has a region of a predetermined length from its distal end for insertion into a body cavity of a patient 11132. In the example shown, the endoscope 11100 is configured as an endoscope configured as a rigid endoscope having a rigid lens barrel 11101. However, the endoscope 11100 may also be configured as a flexible endoscope having an elastic lens barrel 11101.

[0122] The lens barrel 11101 has an opening at its distal end for mounting an objective lens. The light source device 11203 is connected to the endoscope 11100 so that the light generated by the light source device 11203 is guided to the distal end of the lens barrel 11101 through a light guide extending inside the lens barrel 11101 and irradiated toward an observation target in the body cavity of the patient 11132 through the objective lens. It should be noted that the endoscope 11100 may be a forward-looking endoscope, or may be an oblique-looking endoscope or a side-looking endoscope.

[0123] An optical system and an imaging element are provided inside the camera head 11102, so that the reflected light (observation light) from the observation target is focused on the imaging element by the optical system. The imaging element performs photoelectric conversion on the observation light to generate an electrical signal corresponding to the observation light, that is, an image signal corresponding to the observation image. The image signal is transmitted to the camera control unit (CCU) 11201 as raw data.

[0124] The CCU 11201 includes a central processing unit (CPU) or a graphics processing unit (GPU) or the like, and centrally controls the operations of the endoscope 11100 and the display device 11202. In addition, the CCU 11201 receives an image signal from the camera 11102, and performs various image processing for displaying an image based on the image signal, such as development processing (demosaic processing), on the image signal.

[0125] The display device 11202 displays an image based on an image signal that has been image-processed by the CCU 11201 under the control of the CCU 11201 .

[0126] The light source device 11203 includes, for example, a light source such as a light emitting diode (LED), and supplies irradiation light for imaging a surgical area to the endoscope 11100 .

[0127] The input device 11204 is an input interface for the endoscopic surgery system 11000. The user can input various types of information or instructions to the endoscopic surgery system 11000 through the input device 11204. For example, the user can input instructions to change the imaging conditions (type of irradiation light, magnification or focal length, etc.) of the endoscope 11100.

[0128] The treatment tool control device 11205 controls the driving of the energy device 11112 for cauterizing or cutting tissue, sealing blood vessels, etc. The pneumoperitoneum device 11206 delivers gas into the body cavity of the patient 11132 through the pneumoperitoneum tube 11111 to inflate the body cavity to ensure the field of view of the endoscope 11100 and to ensure the working space of the surgeon. The recorder 11207 is a device capable of recording various types of information related to the operation. The printer 11208 is a device capable of printing various types of information related to the operation in various forms such as text, images, or charts.

[0129] It should be noted that the light source device 11203 that provides the irradiation light when the surgical area is to be imaged to the endoscope 11100 may include a white light source such as an LED, a laser light source, or a combination thereof. In the case where the white light source includes a combination of red, green, and blue (RGB) laser light sources, since the output intensity and output timing of each color (each wavelength) can be controlled with high precision, the white balance adjustment of the image being captured can be performed by the light source device 11203. In addition, in this case, if the laser beams from each RGB laser light source are irradiated onto the observation target in a time-sharing manner, and the driving of the imaging element of the camera 11102 is controlled synchronously with the irradiation timing, it is also possible to capture images corresponding to each of R, G, and B in a time-sharing manner. According to this method, a color image can be obtained even if a color filter is not provided for the imaging element.

[0130] In addition, the light source device 11203 can be controlled so that the intensity of the light to be output changes at predetermined intervals. By controlling the drive of the camera device of the camera 11102 in synchronization with the timing of the change in light intensity to acquire images in a time-sharing manner and synthesize these images, it is possible to create an image with a high dynamic range without underexposed shadows and overexposed highlights.

[0131] In addition, the light source device 11203 can be configured to provide light of a predetermined wavelength band that can be used for special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in human tissue to irradiate light of a narrower wavelength band than the irradiation light (i.e., white light) during ordinary observation, it is possible to perform narrow-band light observation (narrow-band light imaging) for imaging predetermined tissues (e.g., blood vessels in the surface layer of the mucosa, etc.) with high contrast. Alternatively, in special light observation, fluorescence observation for obtaining an image by fluorescence generated by irradiation with excitation light can be performed. In fluorescence observation, it is possible to observe fluorescence from body tissue by irradiating excitation light onto body tissue (autofluorescence observation), or to obtain a fluorescence image by locally injecting a reagent such as indocyanine green (ICG) and irradiating excitation light corresponding to the fluorescence wavelength of the reagent onto human tissue. The light source device 11203 can be configured to provide narrow-band light and / or excitation light suitable for special light observation as described above.

[0132] Fig. 20 It shows Fig.19 A block diagram of an example of the functional configuration of the camera 11102 and CCU 11201 is shown.

[0133] The camera 11102 includes a lens unit 11401, an imaging unit 11402, a driving unit 11403, a communication unit 11404, and a camera control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera 11102 and the CCU 11201 are connected to each other through a transmission cable 11400 for communication.

[0134] The lens unit 11401 is an optical system provided at a connection position with the lens barrel 11101. Observation light taken from the distal end of the lens barrel 11101 is guided to the camera head 11102 and introduced into the lens unit 11401. The lens unit 11401 includes a combination of a plurality of lenses including a zoom lens and a focus lens.

[0135] The imaging unit 11402 includes an imaging element. The number of imaging elements included in the imaging unit 11402 may be one (single-board type) or multiple (multi-board type). For example, in the case where the imaging unit 11402 is configured as a multi-board type, image signals corresponding to each of R, G, and B are generated by the imaging element, and these image signals can be synthesized to obtain a color image. The imaging unit 11402 may also be constructed to have a pair of imaging elements for acquiring a right-eye image signal and a left-eye image signal for three-dimensional (3D) display. If 3D display is performed, the surgeon 11131 can more accurately understand the depth of living tissue in the surgical area. It should be noted that in the case where the imaging unit 11402 is configured as a multi-board type imaging unit, multiple systems of the lens unit 11401 are provided corresponding to each imaging element.

[0136] In addition, the imaging unit 11402 does not have to be arranged on the camera head 11102. For example, the imaging unit 11402 can be arranged inside the lens barrel 11101, immediately behind the objective lens.

[0137] The driving unit 11403 includes an actuator, and moves the zoom lens and the focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera control unit 11405. Therefore, the magnification and focus of the image captured by the camera unit 11402 can be appropriately adjusted.

[0138] The communication unit 11404 includes a communication device for sending and receiving various types of information to and from the CCU 11201. The communication unit 11404 sends an image signal acquired from the camera unit 11402 to the CCU 11201 through the transmission cable 11400 as raw data.

[0139] In addition, the communication unit 11404 receives a control signal for driving the camera 11102 from the CCU 11201, and provides the control signal to the camera control unit 11405. The control information includes, for example, information related to imaging conditions, such as information specifying a frame rate of an image to be captured, information specifying an exposure value when capturing an image, and / or information specifying a magnification and a focus of an image to be captured.

[0140] It should be noted that imaging conditions such as frame rate, exposure value, magnification or focus may be specified by the user or may be automatically set based on the acquired image signal by the control unit 11413 of the CCU 11201. In the latter case, the endoscope 11100 includes an automatic exposure (AE) function, an automatic focus (AF) function, and an automatic white balance (AWB) function.

[0141] The camera control unit 11405 controls the driving of the camera 11102 based on the control signal received from the CCU 11201 through the communication unit 11404 .

[0142] The communication unit 11411 includes a communication device for sending various types of information to the camera 11102 and receiving various types of information from the camera 11102. Through the transmission cable 11400, the communication unit 11411 receives an image signal sent thereto from the camera 11102.

[0143] In addition, the communication unit 11411 sends a control signal for driving the camera 11102 to the camera 11102. The image signal and the control signal can be transmitted through electrical communication, optical communication, or the like.

[0144] The image processing unit 11412 performs various image processing on the image signal in the form of raw data sent thereto from the camera 11102 .

[0145] The control unit 11413 performs various types of control processing related to the imaging of the operation area and the like by the endoscope 11100 and the display of the captured image. For example, the control unit 11413 generates a control signal for driving the camera head 11102.

[0146] In addition, the control unit 11413 controls the display device 11202 to display a captured image of the surgical area, etc., based on the image signal that has been image-processed by the image processing unit 11412. Therefore, the control unit 11413 can use various image recognition technologies to recognize various objects in the captured image. For example, the control unit 11413 can recognize surgical tools such as forceps, specific living areas, bleeding, fog when the energy device 11112 is used, etc. by detecting the shape, color, etc. of the edge of the object contained in the captured image. When the control unit 11413 controls the display device 11202 to display the captured image, the control unit 11413 can use the recognition result to display various types of surgical support information in a manner overlapping with the image of the surgical area. When the surgical support information is displayed in an overlapping manner and presented to the surgeon 11131, the burden of the surgeon 11131 can be reduced, and the surgeon 11131 can perform the operation with confidence.

[0147] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 to each other is an electric signal cable capable of being used for electric signal communication, an optical fiber capable of being used for optical communication, or a composite cable capable of being used for electric communication and optical communication.

[0148] Here, although in the illustrated example, communication is performed by wired communication using the transmission cable 11400, communication between the camera 11102 and the CCU 11201 may be performed by wireless communication.

[0149] An example of an endoscopic surgical system to which the technology according to the embodiments of the present disclosure can be applied has been described above. The technology according to the embodiments of the present disclosure is applicable to, for example, the imaging unit 11402 provided in the camera head 11102 of the endoscope 11100 of the above-described structure. Applying the technology according to the embodiments of the present disclosure to the imaging unit 11402 enables the imaging unit 11402 to have high sensitivity, thereby enabling the endoscope 11100 to have high definition.

[0150] Although the present disclosure has been described above with reference to the embodiments, variations, applicable examples and application examples, the present disclosure is not limited to the above embodiments and the like and may be variously modified in many ways. For example, although the above variations have been described as variations of the above embodiments, the configurations of the various variations may be combined as appropriate.

[0151] In the above-mentioned embodiments and the like, the imaging device is exemplified and described; however, for example, it is sufficient that the photodetector of the present disclosure receives incident light and converts the light into electric charge. The output signal may be a signal of image information or a signal of distance measurement information. The photodetector (imaging device) is suitable for image sensors, distance measurement sensors, and the like.

[0152] The photodetector according to the present disclosure can also be used as a distance measuring sensor capable of distance measurement by a time-of-flight (TOF) method. The photodetector (imaging device) can also be used as a sensor capable of detecting events, for example, an event-driven sensor (also referred to as an event vision sensor (EVS), an event-driven sensor (EDS), a dynamic vision sensor (DVS), etc.).

[0153] The photodetector according to an embodiment of the present disclosure includes: a light guide including a plurality of structures, each having a size equal to or smaller than the wavelength of incident light; a first material; a second material, wherein a combination of the first material and the second material is disposed above and / or between the plurality of structures and wherein the refractive indexes of the first material and the second material are both different from the refractive indexes of the plurality of structures; and a photoelectric converter that photoelectrically converts light incident via the light guide. Therefore, it is possible to prevent the plurality of structures from collapsing and prevent the characteristics of the light guide from deteriorating. The photodetector according to an embodiment of the present disclosure can prevent quality degradation.

[0154] An optical element according to an embodiment of the present disclosure includes: a plurality of structures, each having a size equal to or smaller than the wavelength of incident light; and a first material and a second material, wherein a combination of the first material and the second material is disposed above and / or between the plurality of structures. The refractive index of each of the first material and the second material is different from the refractive index of the plurality of structures. Therefore, it is possible to prevent the plurality of structures from collapsing and prevent the characteristics of the optical element from deteriorating. According to an embodiment of the present disclosure, it is possible to prevent the quality of the optical element from deteriorating.

[0155] It should be noted that the effects described herein are merely exemplary and are not limited to the description, and other effects may also be included. In addition, the present disclosure may also have the following configurations. (1) A photodetector comprising: a light guide portion comprising a plurality of structures and a first medium and a second medium arranged to fill between the plurality of structures adjacent to each other, wherein a size of each of the structures is equal to or smaller than a wavelength of incident light, and a refractive index of each of the first medium and the second medium is different from a refractive index of the structures; and The photoelectric conversion unit photoelectrically converts the light incident through the light guide unit. (2) The photodetector according to (1), wherein The first medium is provided in contact with the structure and contains an inorganic material, and The second medium is provided to cover the first medium and contains an organic material. (3) The photodetector according to (1) or (2), wherein The first medium is arranged to cover the plurality of structures, and The second medium is arranged to cover the first medium. (4) The photodetector according to any one of (1) to (3), wherein the refractive index of the structure is higher than the refractive index of the first medium. (5) The photodetector according to any one of (1) to (4), wherein a difference between a refractive index of the structure and a refractive index of the first medium is 0.3 or more. (6) The photodetector according to any one of (1) to (5), wherein a refractive index of the first medium is higher than a refractive index of the second medium. (7) The photodetector according to any one of (1) to (6), wherein the light guiding portion includes the plurality of structures having different sizes, shapes, or arrangement pitches. (8) The photodetector according to any one of (1) to (7), wherein the light guiding portion includes the plurality of structures each having a columnar shape. (9) The photodetector according to any one of (1) to (8), wherein a size of the structure is equal to or smaller than a wavelength of visible light or equal to or smaller than a wavelength of infrared light. (10) An optical element, comprising: a plurality of structures, each of which has a size equal to or smaller than a wavelength of incident light; and The first medium and the second medium are arranged to be filled between the plurality of structures adjacent to each other, and the refractive index of the first medium and the second medium are different from the refractive index of the structures. (11) The optical element according to (10), wherein The first medium is disposed in contact with the structure and comprises an inorganic material, and The second medium is provided to cover the first medium and contains an organic material. (12) The optical element according to (10) or (11), wherein The first medium is arranged to cover the plurality of structures, and The second medium is arranged to cover the first medium. (13) The optical element according to any one of (10) to (12), wherein a refractive index of the structure is higher than a refractive index of the first medium. (14) The optical element according to any one of (10) to (13), wherein a difference between a refractive index of the structure and a refractive index of the first medium is 0.3 or more. (15) The optical element according to any one of (10) to (14), wherein a refractive index of the first medium is higher than a refractive index of the second medium. (16) The optical element according to any one of (10) to (15), wherein the plurality of structures includes a plurality of structures having different sizes, shapes, or arrangement pitches. (17) The optical element according to any one of (10) to (16), wherein the plurality of structures include a structure having a columnar shape. (18) The optical element according to any one of (10) to (17), wherein a size of the structure is equal to or smaller than a wavelength of visible light or equal to or smaller than a wavelength of infrared light. (19) An electronic device comprising: Optical systems; and a photodetector that receives light transmitted through the optical system, The photodetector comprises: a light guide portion comprising a plurality of structures and a first medium and a second medium arranged to fill between the plurality of structures adjacent to each other, wherein a size of each of the structures is equal to or smaller than a wavelength of incident light, and a refractive index of each of the first medium and the second medium is different from a refractive index of the structures; and The photoelectric conversion unit photoelectrically converts the light incident through the light guide unit. (20) A photodetector comprising: A light guide comprising a plurality of structures, each of which has a size equal to or smaller than a wavelength of incident light; First material; Second material; wherein the combination of the first material and the second material is disposed above and / or between the plurality of structures and wherein the refractive index of the first material and the second material are both different from the refractive index of the plurality of structures; and A photoelectric converter photoelectrically converts the light incident through the light guide. (twenty one) The photodetector according to (20), wherein The first material contacts the plurality of structures and includes an inorganic material, and The second material covers the first material and includes an organic material. (twenty two) The photodetector according to (20) or (21), wherein The first material covers the plurality of structures, and The second material covers the first material. (twenty three) The photodetector according to (20) to (22), wherein the refractive index of the plurality of structures is higher than the refractive index of the first material. (twenty four) The photodetector according to (20) to (23), wherein a difference between a refractive index of the plurality of structures and a refractive index of the first material is 0.3 or more. (25) The photodetector according to (20) to (24), wherein the refractive index of the first material is higher than the refractive index of the second material. (26) The photodetector according to (20) to (25), wherein the plurality of structures include structures having different sizes, different shapes, or arranged at different intervals. (27) The photodetector according to (20) to (26), wherein each of the plurality of structures has a columnar shape. (28) The photodetector according to (20) to (27), wherein a size of each of the plurality of structures is equal to or smaller than a wavelength of visible light or equal to or smaller than a wavelength of infrared light. (29) An optical element comprising A plurality of structures, each of which has a size equal to or smaller than a wavelength of incident light; First material; and Second material; wherein the combination of the first material and the second material is disposed above and / or between the plurality of structures, and The refractive indexes of the first material and the second material are different from the refractive indexes of the plurality of structures. (30) The optical element according to (29), wherein The first material contacts the plurality of structures and includes an inorganic material, and The second material covers the first material and includes an organic material. (31) An optical element according to (29) or (30), wherein The first material covers the plurality of structures, and The second material covers the first medium. (32) The optical element according to (29) to (31), wherein the refractive index of the plurality of structures is higher than the refractive index of the first material. (33) The optical element according to (29) to (32), wherein a difference between a refractive index of the plurality of structures and a refractive index of the first material is 0.3 or more. (34) An optical element according to (29) to (33), wherein a refractive index of the first material is higher than a refractive index of the second material. (35) The optical element according to (29) to (34), wherein the plurality of structures include structures having different sizes, different shapes, or arranged at different pitches. (36) The optical element according to (29) to (35), wherein each of the plurality of structures has a columnar shape. (37) The optical element according to (29) to (36), wherein a size of each of the plurality of structures is equal to or smaller than a wavelength of visible light or equal to or smaller than a wavelength of infrared light. (38) An electronic device comprising: Optical systems; and a photodetector that receives light transmitted through the optical system, The photodetector comprises: A light guide comprising a plurality of structures, each of which has a size equal to or smaller than a wavelength of incident light; First material; Second material; wherein the combination of the first material and the second material is disposed above and / or between the plurality of structures and The refractive index of the first material and the refractive index of the second material are both different from the refractive index of the plurality of structures; and A photoelectric converter photoelectrically converts the light incident through the light guide. (39) The electronic device according to (38), wherein The first material contacts the plurality of structures and includes an inorganic material, and The second material covers the first material and includes an organic material.

[0156] It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alterations may be made according to design requirements and other factors as long as they are within the scope of the appended claims or the equivalents thereof. [reference numerals list] 1 Imaging device 10 Light receiving part 12 Photoelectric conversion unit 20 Insulation Layer 21, 22 Insulation film 26,35 Anti-reflective film 30 Light guide 31 Structure 41 First Component 42 Second component

Claims

1. A photodetector, comprising: A light guide comprising a plurality of structures, each of which has a size equal to or smaller than a wavelength of incident light; First material; Second material; wherein the combination of the first material and the second material is disposed above and / or between the plurality of structures, and wherein the refractive index of the first material and the second material are both different from the refractive index of the plurality of structures; and A photoelectric converter photoelectrically converts the light incident through the light guide.

2. The photodetector according to claim 1, wherein The first material contacts the plurality of structures and includes an inorganic material, and The second material covers the first material and includes an organic material.

3. The photodetector according to claim 2, wherein The first material covers the plurality of structures, and The second material covers the first material. The photodetector according to claim 2 , wherein a refractive index of the plurality of structures is higher than a refractive index of the first material. 5 . The photodetector according to claim 4 , wherein a difference between a refractive index of the plurality of structures and a refractive index of the first material is 0.3 or more. The photodetector of claim 2 , wherein the first material has a higher refractive index than the second material. 7 . The photodetector according to claim 1 , wherein the plurality of structures include structures having different sizes, different shapes, or arranged at different intervals. 8 . The photodetector according to claim 1 , wherein each of the plurality of structures has a columnar shape. 9 . The photodetector according to claim 1 , wherein a size of each of the plurality of structures is equal to or smaller than a wavelength of visible light or equal to or smaller than a wavelength of infrared light.

10. An optical element, comprising: A plurality of structures, each of which has a size equal to or smaller than a wavelength of incident light; First material; as well as Second material; wherein the combination of the first material and the second material is disposed above and / or between the plurality of structures, and The refractive indexes of the first material and the second material are different from the refractive indexes of the plurality of structures.

11. The optical element according to claim 10, wherein The first material contacts the plurality of structures and includes an inorganic material, and The second material covers the first material and includes an organic material.

12. The optical element according to claim 11, wherein The first material covers the plurality of structures, and The second material covers the first medium. The optical element according to claim 11 , wherein a refractive index of the plurality of structures is higher than a refractive index of the first material. The optical element according to claim 13 , wherein a difference between a refractive index of the plurality of structures and a refractive index of the first material is 0.3 or more.

15. The optical element according to claim 11, wherein a refractive index of the first material is higher than a refractive index of the second material. 16 . The optical element according to claim 10 , wherein the plurality of structures include structures having different sizes, different shapes, or arranged at different intervals. The optical element according to claim 10 , wherein each of the plurality of structures has a columnar shape. 18 . The optical element according to claim 10 , wherein a size of each of the plurality of structures is equal to or smaller than a wavelength of visible light or equal to or smaller than a wavelength of infrared light.

19. An electronic device comprising: Optical system; as well as a photodetector that receives light transmitted through the optical system, The photodetector comprises: A light guide comprising a plurality of structures, each of which has a size equal to or smaller than a wavelength of incident light; First material; Second material; wherein the combination of the first material and the second material is disposed above and / or between the plurality of structures, and The refractive index of the first material and the refractive index of the second material are both different from the refractive index of the plurality of structures; and A photoelectric converter photoelectrically converts the light incident through the light guide.

20. The electronic device according to claim 19, wherein: The first material contacts the plurality of structures and includes an inorganic material, and The second material covers the first material and includes an organic material.

Images