Cutting method of FPC

Abstract

The invention discloses a cutting method of an FPC, the FPC is composed of a first PET layer, a metal wire layer and a second PET layer, the metal wire layer is arranged between the first PET layer and the second PET layer, the method comprises the following steps: carrying out laser cutting along a preset cutting line on the surface of the first PET layer by using a first laser beam to expose the metal wire layer; performing laser cutting on the metal wire layer by using a second laser beam so as to cut off the metal wire layer; and performing laser cutting on the second PET layer by using the first laser beam so as to cut off the second PET layer. By the adoption of the technical scheme, the problem that the surface of the PET layer is fused when the FPC is cut can be solved, and the deformation warping degree of the cut face is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of FPC production and processing, and particularly to a cutting method for FPC. Background Art

[0002] FPC (Flexible Printed Circuit) is a very thin and flexible electronic circuit board, which is widely used in fields such as mobile communication devices, touch screens, and LED light strips. The traditional processing method for FPC flexible circuit boards generally uses mechanical cutting. However, this processing method has problems such as low cutting accuracy, burr generation, and non-smooth cutting surfaces, and can no longer meet the requirements of modern high precision.

[0003] Currently, although laser cutting has been used to replace traditional mechanical cutting, the existing laser cutting methods often cut the PET (Polyethylene terephthalate) layer and the metal wire layer of the FPC simultaneously, which easily causes melting on the surface of the PET layer or problems such as deformation and warping of the cutting surface. Summary of the Invention

[0004] The purpose of the embodiments of the present invention is to provide a cutting method for FPC, which can solve the problem of melting on the surface of the PET layer when cutting FPC and reduce the degree of deformation and warping of the cutting surface.

[0005] To achieve the above purpose, the embodiments of the present invention provide a cutting method for FPC. The FPC is composed of a first PET layer, a metal wire layer, and a second PET layer. The metal wire layer is disposed between the first PET layer and the second PET layer. The method includes:

[0006] Using a first laser beam to perform laser cutting along a preset cutting line on the surface of the first PET layer to expose the metal wire layer;

[0007] Using a second laser beam to perform laser cutting on the metal wire layer to cut off the metal wire layer;

[0008] Using the first laser beam to perform laser cutting on the second PET layer to cut off the second PET layer.

[0009] Further, the first laser beam is generated by a first laser, and the output power of the first laser is 45 - 50W, and the output pulse frequency is 1500 - 1800kHz.

[0010] Further, the wavelength of the first laser beam is 243 - 455nm, and the energy is 0.12 - 0.167J / mm2 。

[0011] Further, the cutting speed of the first laser beam is 200 - 300 mm / s.

[0012] Further, the cutting depth of the first laser beam is 100 - 250 μm.

[0013] Further, the second laser beam is generated by a second laser. The output power of the second laser is 90 - 100 W, and the output pulse frequency is 2500 - 3000 kHz.

[0014] Further, the wavelength of the second laser beam is 532 nm, and the energy is 0.45 - 0.5 J / mm 2 。

[0015] Further, the cutting speed of the second laser beam is 100 - 150 mm / s.

[0016] Further, the cutting depth of the second laser beam is 400 - 500 μm.

[0017] Compared with the prior art, the embodiment of the present invention provides a method for cutting an FPC. The FPC is composed of a first PET layer, a metal wire layer, and a second PET layer. The metal wire layer is disposed between the first PET layer and the second PET layer. The method includes: using a first laser beam to perform laser cutting along a preset cutting line on the surface of the first PET layer to expose the metal wire layer; using a second laser beam to perform laser cutting on the metal wire layer to cut off the metal wire layer; using the first laser beam to perform laser cutting on the second PET layer to cut off the second PET layer. The embodiment of the present invention can solve the problem of surface melting of the PET layer during the cutting of the FPC, and reduce the degree of deformation and warping of the cutting surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a flowchart of a preferred embodiment of a method for cutting an FPC provided by the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] An embodiment of the present invention provides a method for cutting an FPC. The FPC is composed of a first PET layer, a metal wire layer, and a second PET layer. The metal wire layer is disposed between the first PET layer and the second PET layer; see Figure 1 As shown, it is a flowchart of a preferred embodiment of a method for cutting an FPC provided by the present invention. The method includes steps S11 to S13:

[0021] Step S11: Use a first laser beam to perform laser cutting along a preset cutting line on the surface of the first PET layer to expose the metal wire layer;

[0022] Step S12: Use a second laser beam to perform laser cutting on the metal wire layer to cut off the metal wire layer;

[0023] Step S13: Use the first laser beam to perform laser cutting on the second PET layer to cut off the second PET layer.

[0024] It should be noted that the intermediate layer of the FPC to be cut is the metal wire layer, and the upper and lower surfaces of the metal wire layer are both wrapped by PET layers. That is, the FPC is composed of a first PET layer, a metal wire layer, and a second PET layer stacked in sequence. And when cutting the PET layer and the metal wire layer of the FPC simultaneously, problems such as melting on the surface of the PET layer and deformation and warping of the cutting surface are likely to occur. Therefore, the embodiment of the present invention uses laser cutting technology to perform layered cutting on the FPC to solve the above problems.

[0025] In specific implementation, first, cut the first PET layer, that is: along the preset cutting line on the surface of the first PET layer, use a first laser beam to perform laser cutting on the first PET layer. The purpose of this step is to cut off the first PET layer to expose the metal wire layer (for example, expose the copper wire on the surface of the metal wire layer); then, cut the metal wire layer, that is: along the cutting track of the first PET layer, use a second laser beam to perform laser cutting on the metal wire layer. The purpose of this step is to cut off the metal wire layer to expose the second PET layer; finally, cut the second PET layer, that is: along the cutting track of the metal wire layer, use a first laser beam to perform laser cutting on the second PET layer. The purpose of this step is to cut off the second PET layer to complete the cutting of the FPC.

[0026] It can be understood that the first PET layer and the second PET layer are respectively located on the upper and lower surfaces of the metal wire layer. In actual cutting, the first PET layer can be cut first and then the second PET layer, or the second PET layer can be cut first and then the first PET layer. The embodiment of the present invention does not make specific limitations.

[0027] In one alternative embodiment, the first laser beam is generated by a first laser, the output power of the first laser being 45 to 50 W and the output pulse frequency being 1500 to 1800 kHz.

[0028] Specifically, in combination with the above embodiment, the first laser beam for cutting the PET layer is generated by a first laser, the output power of the first laser being in the range of 45 W to 50 W and the output pulse frequency being in the range of 1500 kHz to 1800 kHz.

[0029] Exemplarily, the value of the output power of the first laser can be 45 W, 46 W, 47 W, 48 W, 49 W or 50 W, and can also be set according to actual requirements, which is not specifically limited in the embodiments of the present invention.

[0030] Exemplarily, the value of the output pulse frequency of the first laser can be 1500 kHz, 1550 kHz, 1600 kHz, 1650 kHz, 1700 kHz, 1750 kHz or 1800 kHz, and can also be set according to actual requirements, which is not specifically limited in the embodiments of the present invention.

[0031] In one alternative embodiment, the wavelength of the first laser beam is 243 to 455 nm and the energy is 0.12 to 0.167 J / mm 2 .

[0032] Specifically, in combination with the above embodiment, the wavelength of the first laser beam for cutting the PET layer is in the range of 243 nm to 455 nm, and when cutting the PET layer, the first laser beam can be irradiated under the energy condition of 0.12 J / mm 2 ~0.167 J / mm 2 of energy.

[0033] Exemplarily, the value of the wavelength of the first laser beam can be 243 nm, 248 nm, 355 nm, 405 nm or 455 nm, and can also be set according to actual requirements, which is not specifically limited in the embodiments of the present invention.

[0034] Exemplarily, the value of the energy of the first laser beam can be 0.12 J / mm 2 , 0.13 J / mm 2 , 0.14 J / mm 2 , 0.15 J / mm 2 , 0.16 J / mm 2 or 0.167 J / mm 2 , and can also be set according to actual requirements, which is not specifically limited in the embodiments of the present invention.

[0035] In one optional embodiment, the cutting speed of the first laser beam is 200 - 300 mm / s.

[0036] Specifically, in combination with the above embodiments, when cutting the PET layer, the cutting speed of the first laser beam is in the range of 200 mm / s to 300 mm / s.

[0037] Exemplarily, the value of the cutting speed of the first laser beam can be 200 mm / s, 210 mm / s, 220 mm / s, 230 mm / s, 240 mm / s, 250 mm / s, 260 mm / s, 270 mm / s, 280 mm / s, 290 mm / s or 300 mm / s, and can also be set according to actual requirements. The embodiments of the present invention do not make specific limitations.

[0038] In one optional embodiment, the cutting depth of the first laser beam is 100 - 250 μm.

[0039] Specifically, in combination with the above embodiments, when cutting the PET layer, the cutting depth of the first laser beam is in the range of 100 μm to 250 μm.

[0040] Exemplarily, the value of the cutting depth of the first laser beam can be 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, 210 μm, 220 μm, 230 μm, 240 μm or 250 μm, and can also be set according to actual requirements. The embodiments of the present invention do not make specific limitations.

[0041] In one optional embodiment, the second laser beam is generated by a second laser, and the output power of the second laser is 90 - 100 W, and the output pulse frequency is 2500 - 3000 kHz.

[0042] Specifically, in combination with the above embodiments, the second laser beam for cutting the metal wire layer is generated by a second laser, and the output power of this second laser is in the range of 90 W to 100 W, and the output pulse frequency is in the range of 2500 kHz to 3000 kHz.

[0043] Exemplarily, the value of the output power of the second laser can be 90 W, 91 W, 92 W, 93 W, 94 W, 95 W, 96 W, 97 W, 98 W, 99 W or 100 W, and can also be set according to actual requirements. The embodiments of the present invention do not make specific limitations.

[0044] Exemplarily, the output pulse frequency of the second laser can be 2500 kHz, 2550 kHz, 2600 kHz, 2650 kHz, 2700 kHz, 2750 kHz, 2800 kHz, 2850 kHz, 2900 kHz, 2950 kHz or 3000 kHz, and can also be set according to actual requirements. The embodiments of the present invention do not make specific limitations.

[0045] In one optional embodiment, the wavelength of the second laser beam is 532 nm, and the energy is 0.45 - 0.5 J / mm 2 .

[0046] Specifically, in combination with the above embodiments, the wavelength of the second laser beam for cutting the metal wire layer is 532 nm, the second laser beam is a green laser, and the energy of a single focused spot of the second laser beam is within 0.45 J / mm 2 ~0.5 J / mm 2 range.

[0047] Exemplarily, the value of the energy of a single focused spot of the second laser beam can be 0.45 J / mm 2 , 0.46 J / mm 2 , 0.47 J / mm 2 , 0.48 J / mm 2 , 0.49 J / mm 2 or 0.5 J / mm 2 , and can also be set according to actual requirements. The embodiments of the present invention do not make specific limitations.

[0048] In one optional embodiment, the cutting speed of the second laser beam is 100 - 150 mm / s.

[0049] Specifically, in combination with the above embodiments, when cutting the metal wire layer, the cutting speed of the second laser beam is within the range of 100 mm / s to 150 mm / s.

[0050] Exemplarily, the value of the cutting speed of the second laser beam can be 100 mm / s, 110 mm / s, 120 mm / s, 130 mm / s, 140 mm / s or 150 mm / s, and can also be set according to actual requirements. The embodiments of the present invention do not make specific limitations.

[0051] In one optional embodiment, the cutting depth of the second laser beam is 400 - 500 μm.

[0052] Specifically, in combination with the above embodiments, when cutting the metal wire layer, the cutting depth of the second laser beam is within the range of 400 μm to 500 μm.

[0053] Exemplarily, the cutting depth of the second laser beam can be 400μm, 410μm, 420μm, 430μm, 440μm, 450μm, 460μm, 470μm, 480μm, 490μm or 500μm, or it can be set according to actual requirements, and the embodiments of the present invention do not make specific limitations.

[0054] Combining all the above embodiments, the implementation process of this solution is described below through the first specific embodiment, including: (1) Cutting the first PET layer: Using the first laser to generate a first laser beam, along the preset cutting line on the surface of the first PET layer, using the first laser beam to perform laser cutting on the first PET layer to cut off the first PET layer and expose the metal wire layer; wherein, the output power of the first laser is 45W, the output pulse frequency of the first laser is 1500kHz, the wavelength of the first laser beam is 243nm, the energy of the first laser beam is 0.12J / mm 2 , the cutting speed of the first laser beam is 200mm / s, and the cutting depth of the first laser beam is 100μm; (2) Cutting the metal wire layer: Using the second laser to generate a second laser beam, along the cutting trajectory of the first PET layer, using the second laser beam to perform laser cutting on the metal wire layer to cut off the metal wire layer and expose the second PET layer; wherein, the output power of the second laser is 90W, the output pulse frequency of the second laser is 2500kHz, the wavelength of the second laser beam is 532nm, the energy of the second laser beam is 0.45J / mm 2 , the cutting speed of the second laser beam is 100mm / s, and the cutting depth of the second laser beam is 400μm; (3) Cutting the second PET layer: Using the first laser to generate a first laser beam, along the cutting trajectory of the metal wire layer, using the first laser beam to perform laser cutting on the second PET layer to cut off the second PET layer and complete the cutting of the FPC; wherein, the output power of the first laser is 45W, the output pulse frequency of the first laser is 1500kHz, the wavelength of the first laser beam is 243nm, the energy of the first laser beam is 0.12J / mm 2 , the cutting speed of the first laser beam is 200mm / s, and the cutting depth of the first laser beam is 100μm.

[0055] Combining all the above embodiments, the implementation process of this solution is described below through a second specific embodiment, including: (1) Cutting the first PET layer: Using the first laser to generate a first laser beam, along the preset cutting line on the surface of the first PET layer, using the first laser beam to perform laser cutting on the first PET layer to cut off the first PET layer and expose the metal wire layer; wherein, the output power of the first laser is 47W, the output pulse frequency of the first laser is 1650kHz, the wavelength of the first laser beam is 355nm, and the energy of the first laser beam is 0.14J / mm 2 , the cutting speed of the first laser beam is 250mm / s, and the cutting depth of the first laser beam is 180μm; (2) Cutting the metal wire layer: Using the second laser to generate a second laser beam, along the cutting trajectory of the first PET layer, using the second laser beam to perform laser cutting on the metal wire layer to cut off the metal wire layer and expose the second PET layer; wherein, the output power of the second laser is 95W, the output pulse frequency of the second laser is 2750kHz, the wavelength of the second laser beam is 532nm, and the energy of the second laser beam is 0.47J / mm 2 , the cutting speed of the second laser beam is 125mm / s, and the cutting depth of the second laser beam is 450μm; (3) Cutting the second PET layer: Using the first laser to generate a first laser beam, along the cutting trajectory of the metal wire layer, using the first laser beam to perform laser cutting on the second PET layer to cut off the second PET layer and complete the cutting of the FPC; wherein, the output power of the first laser is 47W, the output pulse frequency of the first laser is 1650kHz, the wavelength of the first laser beam is 355nm, and the energy of the first laser beam is 0.14J / mm 2 , the cutting speed of the first laser beam is 250mm / s, and the cutting depth of the first laser beam is 180μm.

[0056] Combining all the above embodiments, the implementation process of this solution is described below through a third specific embodiment, including: (1) Cutting the first PET layer: Using the first laser to generate a first laser beam, along the preset cutting line on the surface of the first PET layer, using the first laser beam to perform laser cutting on the first PET layer to cut off the first PET layer and expose the metal wire layer; wherein, the output power of the first laser is 50W, the output pulse frequency of the first laser is 1800kHz, the wavelength of the first laser beam is 455nm, and the energy of the first laser beam is 0.167J / mm 2, the cutting speed of the first laser beam is 300 mm / s, and the cutting depth of the first laser beam is 250 μm; (2) Cutting the metal wire layer: Using the second laser to generate the second laser beam, along the cutting trajectory of the first PET layer, using the second laser beam to perform laser cutting on the metal wire layer to cut off the metal wire layer and expose the second PET layer; wherein, the output power of the second laser is 100 W, the output pulse frequency of the second laser is 3000 kHz, the wavelength of the second laser beam is 532 nm, and the energy of the second laser beam is 0.5 J / mm 2 , the cutting speed of the second laser beam is 150 mm / s, and the cutting depth of the second laser beam is 500 μm; (3) Cutting the second PET layer: Using the first laser to generate the first laser beam, along the cutting trajectory of the metal wire layer, using the first laser beam to perform laser cutting on the second PET layer to cut off the second PET layer and complete the cutting of the FPC; wherein, the output power of the first laser is 50 W, the output pulse frequency of the first laser is 1800 kHz, the wavelength of the first laser beam is 455 nm, and the energy of the first laser beam is 0.167 J / mm 2 , the cutting speed of the first laser beam is 300 mm / s, and the cutting depth of the first laser beam is 250 μm.

[0057] In summary, a cutting method for an FPC provided by an embodiment of the present invention, the FPC is composed of a first PET layer, a metal wire layer, and a second PET layer, and the metal wire layer is disposed between the first PET layer and the second PET layer. The method includes: using the first laser beam to perform laser cutting along a preset cutting line on the surface of the first PET layer to expose the metal wire layer; using the second laser beam to perform laser cutting on the metal wire layer to cut off the metal wire layer; using the first laser beam to perform laser cutting on the second PET layer to cut off the second PET layer. The embodiment of the present invention can solve the problem of surface melting of the PET layer during the cutting of the FPC and reduce the degree of warping and deformation of the cutting surface.

[0058] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and deformations can be made, and these improvements and deformations should also be regarded as the protection scope of the present invention.

Claims

1. A method for cutting an FPC, characterized in that: The FPC is composed of a first PET layer, a metal wire layer and a second PET layer, wherein the metal wire layer is arranged between the first PET layer and the second PET layer, and the method comprises: Using a first laser beam to perform laser cutting along a preset cutting line on the surface of the first PET layer to expose the metal wire layer; Using a second laser beam to laser cut the metal wire layer to cut off the metal wire layer; The second PET layer is laser cut by using the first laser beam to cut off the second PET layer.

2. The FPC cutting method according to claim 1, characterized in that: The first laser beam is generated by a first laser, the output power of the first laser is 45-50W, and the output pulse frequency is 1500-1800kHz.

3. The FPC cutting method according to claim 1, characterized in that: The wavelength of the first laser beam is 243-455 nm, and the energy is 0.12-0.167 J / mm 2 .

4. The FPC cutting method according to claim 1, characterized in that: The cutting speed of the first laser beam is 200-300 mm / s.

5. The FPC cutting method according to claim 1, characterized in that: The cutting depth of the first laser beam is 100-250 μm.

6. The FPC cutting method according to claim 1, characterized in that: The second laser beam is generated by a second laser, the output power of the second laser is 90-100W, and the output pulse frequency is 2500-3000kHz.

7. The FPC cutting method according to claim 1, characterized in that: The wavelength of the second laser beam is 532nm, and the energy is 0.45-0.5J / mm 2 .

8. The FPC cutting method according to claim 1, characterized in that: The cutting speed of the second laser beam is 100-150 mm / s.

9. The FPC cutting method according to claim 1, characterized in that: The cutting depth of the second laser beam is 400-500 μm.

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