Semi-broken OCA structure and manufacturing method thereof

By designing a semi-break OCA structure, the size of the light release film is larger than that of the OCA colloid and expanded outward, solving the problem that the OCA colloid is prone to take away the light release film when tearing it off in the prior art, improving the tearing efficiency and reducing the defective rate.

CN120020190APending Publication Date: 2025-05-20STARRY ELECTRONIC TECH SHENZHEN CO LTD
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Patent Information

Application Number
CN202311548908.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-11-17
Publication Date
2025-05-20

AI Technical Summary

Technical Problem

The light release film layer and colloidal layer of the existing OCA optical glue are similar in size, which can easily cause the problem of tearing and adhesive tape when tearing, low film tearing efficiency and high product quality defect rate.

Method used

A semi-break OCA structure is designed, in which the size of the light release film is larger than that of the OCA colloid, the size of each side of the light release film is expanded by 3 mm, and the size of the heavy release film is equal to the OCA colloid. Through this structure, the light release film extends to the outer edge of the OCA colloid when tearing it off, so as to achieve separation between the light release film and the OCA colloid.

Benefits of technology

Improves the efficiency of tearing the film, reduces the product defect rate, ensures that the OCA colloid will not come into contact with other items before use, and avoids adhesion problems.

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Abstract

The invention relates to the technical field of full lamination, and discloses a half-broken OCA structure, which comprises an OCA colloid, a light release film and a heavy release film, the OCA colloid is arranged between the light release film and the heavy release film, the size of the light release film is greater than that of the OCA colloid, and the size of the heavy release film is equal to that of the OCA colloid. According to the half-broken OCA structure and the manufacturing method thereof, the size of the light release film is set to be larger than that of the OCA colloid, and the size of each side of the light release film is outwards expanded by 3mm than that of each side of the OCA colloid, so that the problem that the size of the light release film layer is the same as that of the OCA colloid, so that the size of the light release film layer in the process of tearing off the light release film layer when the OCA colloid is used is solved; according to the technical scheme, the problems that in the prior art, when a light release film is torn off, the light release film extends to the edge outside an OCA colloid and is lifted up, the light release film and the OCA colloid can be separated, the film tearing efficiency is improved, and the reject ratio of products is reduced are solved.
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Description

Technical Field

[0001] The present invention relates to the technical field of full lamination, and specifically relates to a semi - broken OCA structure and a manufacturing method thereof. Background Art

[0002] OCA is a special adhesive for bonding transparent optical elements (such as lenses, etc.). It is required to be colorless and transparent, with a light transmittance of more than 95%, good bonding strength, curable at room temperature or medium temperature, and having characteristics such as small curing shrinkage.

[0003] OCA optical adhesive is usually a special adhesive for bonding transparent optical elements. OCA optical adhesive is one of the important raw materials for touch screens and is currently the best adhesive for touch screens. OCA optical adhesive is usually a double - sided laminated tape without a substrate. It is made by acrylic adhesive and then laminated with a peelable film on each side. Its usage requirements are colorless and transparent, with a light transmittance of more than 90%, good bonding strength, curable at room temperature or medium temperature, and having the characteristic of small curing shrinkage.

[0004] Common OCA optical adhesives mostly adopt a sandwich - type structure design, with the OCA colloid sandwiched between a light release film and a heavy release film. However, the size of the light release film layer is the same as that of the OCA colloid, resulting in problems such as easy tape - sticking during the process of removing the light release film layer when using the OCA colloid, low film - removing efficiency, and high product quality defect rate. In view of this, the present application proposes a semi - broken OCA structure and a manufacturing method thereof. Summary of the Invention

[0005] (1) Technical Problems to be Solved

[0006] Aiming at the deficiencies of the prior art, the present invention provides a semi - broken OCA structure and a manufacturing method thereof, which have advantages such as being convenient for removing the light release film, and solve the problems that the size of the light release film layer is the same as that of the OCA optical adhesive layer, resulting in easy tape - sticking during the process of removing the light release film layer when using the OCA optical adhesive, low film - removing efficiency, and high product quality defect rate.

[0007] (2) Technical Solutions

[0008] To achieve the above - mentioned purpose of being convenient for removing the light release film, etc., the present invention provides the following technical solution: A semi - broken OCA structure includes an OCA colloid, a light release film, and a heavy release film. The OCA colloid is between the light release film and the heavy release film. The size of the light release film is larger than that of the OCA colloid, and the size of the heavy release film is equal to that of the OCA colloid.

[0009] Further, the OCA colloid extends 2.0 mm beyond the size of the VA area of the CG. The size of the OCA colloid is reduced by more than 0.3 mm compared to the outer dimension of the LCM. The size of the OCA colloid extends 0.30 mm to 0.5 mm beyond the size of the upper polarizer of the LCM. The distance between the OCA colloid and the IC of the LCM is at least 0.5 mm.

[0010] Further, the light release film covers one side of the OCA colloid. The size of each side of the light release film extends 3 mm beyond the size of each side of the OCA colloid.

[0011] Further, the heavy release film covers the side of the OCA colloid away from the light release film. Each side of the heavy release film coincides with the side of the OCA colloid.

[0012] Further, the material of the OCA colloid is selected from the Mitsubishi G6.2 series, and the thickness of the OCA colloid is 0.2 mm.

[0013] A manufacturing method of a semi - cut OCA structure includes the following steps:

[0014] 1) Install a frame on the workbench with an inner diameter equal to the outer diameter of the heavy release film;

[0015] 2) Place the heavy release film inside the frame, and then lay the heavy release film flat on the workbench so that the bottom surface of the heavy release film fits the surface of the workbench;

[0016] 3) Use a glue brush to evenly apply the OCA colloid of the Mitsubishi G6.2 series on the upper surface of the heavy release film;

[0017] 4) Irradiate the OCA colloid with an ultraviolet lamp with a wavelength of 300 - 400 nm and an energy of 1600 - 3000 mJ / cm2 for 1 - 2 minutes to cure the OCA colloid, making the OCA colloid full and without bubbles on the surface;

[0018] 5) Cover the upper surface of the OCA colloid with the light release film;

[0019] 6) Gently roll a rubber roller on the upper surface of the light release film to make the light release film fit smoothly with the OCA colloid.

[0020] (III) Beneficial effects

[0021] Compared with the prior art, the present invention provides a semi - cut OCA structure and its manufacturing method, having the following beneficial effects:

[0022] 1. The semi - cut OCA structure and its manufacturing method. By setting the size of the light release film to be larger than the size of the OCA colloid, and the size of each side of the light release film is 3 mm larger than the size of each side of the OCA colloid, it solves the problem that the size of the light release film layer is the same as that of the OCA colloid, resulting in the problem of tape - sticking during the process of tearing off the light release film layer when using the OCA colloid, low film - tearing efficiency, and high product defect rate. When tearing off the light release film, by lifting the edge of the light release film extending beyond the OCA colloid, the light release film can be separated from the OCA colloid, increasing the film - tearing efficiency and reducing the product defect rate.

[0023] 2. The semi - cut OCA structure and its manufacturing method. By setting a light release film and a heavy release film on both sides of the OCA colloid, the OCA colloid will not come into contact with other items before use, solving the problem that the OCA colloid is prone to contact with other items before use, resulting in the OCA colloid sticking to other positions and making the OCA colloid scrapped. The light release film and the heavy release film play a protective role for the OCA colloid and will not stick to other items before use. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 FIG. is a schematic structural diagram of a semi - cut OCA structure and its manufacturing method proposed by the present invention;

[0025] Figure 2 FIG. is a view of the direction of the heavy release film of a semi - cut OCA structure and its manufacturing method proposed by the present invention;

[0026] Figure 3 FIG. is a view of the direction of the light release film of a semi - cut OCA structure and its manufacturing method proposed by the present invention.

[0027] In the figure: 1. OCA colloid; 2. Light release film; 3. Heavy release film. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0029] Please refer to Figures 1 - 3 , a semi - cut OCA structure, including an OCA colloid 1, a light release film 2, and a heavy release film 3. The OCA colloid 1 is between the light release film 2 and the heavy release film 3. The size of the light release film 2 is larger than the size of the OCA colloid 1, and the size of the heavy release film 3 is equal to the size of the OCA colloid 1.

[0030] Among them, the OCA colloid 1 extends 2.0 mm outward from the size of the VA area of the CG, and the size of the OCA colloid 1 is reduced by more than 0.3 mm from the outer dimension of the LCM. In order to increase the width of the OCA colloid 1 to block and reduce the risk of light leakage, the OCA colloid 1 must completely cover the upper polarizer of the LCM. The size of the OCA colloid 1 extends 0.30 mm to 0.5 mm outward from the size of the upper polarizer of the LCM. In order to avoid structural interference between the OCA colloid 1 and the IC when using a thin glass sheet, the distance between the OCA colloid 1 and the IC of the LCM is at least 0.5 m.

[0031] Secondly, the material of the OCA colloid 1 is selected from the Mitsubishi G6.2 series, and the thickness of the OCA colloid 1 is 0.2 mm.

[0032] At the same time, the light release film 2 covers one side of the OCA colloid 1. The size of each side of the light release film 2 extends 3 mm outward from the size of each side of the OCA colloid 1, and the thickness of the light release film 2 is 0.05 mm.

[0033] Among them, the heavy release film 3 covers the side of the OCA colloid 1 away from the light release film 2. Each side of the heavy release film 3 coincides with the side of the OCA colloid 1, and the thickness of the heavy release film 3 is 0.01 mm.

[0034] A manufacturing method of a semi-cut OCA structure includes the following steps:

[0035] 1) Install a frame on the workbench with an inner diameter equal to the outer diameter of the heavy release film;

[0036] 2) Place the heavy release film inside the frame, and then lay the heavy release film flat on the workbench so that the bottom surface of the heavy release film fits the surface of the workbench;

[0037] 3) Use a glue brush to evenly apply the OCA colloid of the Mitsubishi G6.2 series on the upper surface of the heavy release film;

[0038] 4) Irradiate the OCA colloid 1 - 2 min with an ultraviolet lamp with a wavelength of 300 - 400 nm and an energy of 1600 - 3000 mJ / cm2 to cure the OCA colloid, making the OCA colloid full and without bubbles on the surface;

[0039] 5) Cover the light release film on the upper surface of the OCA colloid;

[0040] 6) Gently roll a rubber roller on the upper surface of the light release film to make the light release film fit the OCA colloid flatly.

[0041] Working principle: When in use, manually place the CG on the feeding conveyor line. Clean the OCA-attached surface of the CG twice with alcohol and lint-free cloth to ensure that there is no dust on the OCA-attached surface of the CG. Grab the OCA colloid 1 to the working surface of the film tearing machine, and then the film tearing machine tears the light release film 2 to separate it from the OCA colloid 1. Then, use the OCA attaching machine to attach the OCA colloid 1 to the OCA-attached surface of the CG. Manually place the LCM on the feeding conveyor line, and use the manipulator to load the CG with the OCA colloid 1 onto the working surface of the film tearing machine. Then, the film tearing machine tears the heavy release film 3 to separate it from the OCA colloid 1. Use the vacuum laminating machine to pre-laminate and vacuum laminate the CG and the LCM with the OCA colloid 1.

[0042] In summary, for this semi-disconnected OCA structure and its manufacturing method, by setting the size of the light release film 2 to be larger than the size of the OCA colloid 1, when separating the light release film 2 from the OCA colloid 1, it is very convenient to separate the light release film 2 from the OCA colloid 1 from the edge extending from the light release film 2, which increases the film tearing efficiency and reduces the product defect rate.

[0043] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0044] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semi-disconnected OCA structure, comprising an OCA colloid (1), a light release film (2) and a heavy release film (3), characterized in that: The OCA colloid (1) is located between the light release film (2) and the heavy release film (3); the size of the light release film (2) is larger than the size of the OCA colloid (1), and the size of the heavy release film (3) is equal to that of the OCA colloid (1).

2. The half-disconnected OCA structure according to claim 1, characterized in that: The OCA colloid (1) is 2.0 mm larger than the size of the VA region of the CG, the size of the OCA colloid (1) is more than 0.3 mm smaller than the outer size of the LCM, the size of the OCA colloid (1) is between 0.30 mm and 0.5 mm larger than the size of the upper polarizer of the LCM, and the distance between the OCA colloid (1) and the IC of the LCM is at least 0.5 mm.

3. The half-disconnected OCA structure according to claim 1, characterized in that: The light release film (2) covers one side of the OCA colloid (1), and the size of each side of the light release film (2) is 3 mm larger than the size of each side of the OCA colloid (1).

4. The half-disconnected OCA structure according to claim 1, characterized in that: The heavy release film (3) covers the side of the OCA colloid (1) away from the light release film (2), and each side of the heavy release film (3) overlaps with the side of the OCA colloid (1).

5. The half-disconnected OCA structure according to claim 1, characterized in that: The material of the OCA colloid (1) is Mitsubishi G6.2 series, and the thickness of the OCA colloid (1) is 0.2 mm.

6. A method for manufacturing a semi-disconnected OCA structure, characterized in that: The following steps are involved: 1) Install a frame with an inner diameter equal to the outer diameter of the heavy release film on the workbench; 2) placing the heavy release film inside the frame, and then laying the heavy release film flat on the workbench so that the bottom surface of the heavy release film fits the surface of the workbench; 3) Use a glue brush to evenly apply Mitsubishi G6.2 series OCA colloid on the upper surface of the heavy release film; 4) Irradiate the OCA colloid with an ultraviolet lamp with a wavelength of 300-400nm and an energy of 1600-3000mJ / cm2 for 1-2min to solidify the OCA colloid, so that the OCA colloid becomes full and plump without bubbles on the surface; 5) Cover the upper surface of the OCA colloid with a light release film; 6) Use a rubber roller to gently roll the upper surface of the light release film to make the light release film fit evenly with the OCA colloid.