Adjusting device and semiconductor process equipment

Abstract

The embodiment of the invention provides an adjusting device and semiconductor process equipment, and the device comprises a first connecting piece, a second connecting piece, and at least three spacing adjusters. The first connecting piece and the second connecting piece are arranged at an interval, the interval adjuster comprises third connecting pieces and a slider, one end of each third connecting piece is rotationally connected with the first connecting piece, the other end of each third connecting piece is connected with the slider, and the connecting parts, connected with the third connecting pieces, of the first connecting piece are not collinear; the number of the sliding rails is equal to that of the spacing adjusters, and the sliders are slidably connected with the sliding rails in a one-to-one correspondence manner; one of the first connecting piece and the second connecting piece is used for being connected with a magnetron assembly, and the other one of the first connecting piece and the second connecting piece is used for being connected with a rotation driving device for driving the magnetron assembly to rotate; the distance adjuster is used for adjusting the distance between the first connecting piece and the second connecting piece.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processes, and in particular, to an adjusting device and a semiconductor process equipment. Background Art

[0002] In the process of implementing a semiconductor process, especially in a magnetron sputtering process, a magnetron assembly is required to sputter a target, so as to generate a thin film on a wafer. In magnetron sputtering technology, the levelness of the magnetron assembly and the distance from the magnetron assembly to the target have a great influence on the uniformity of the thin film.

[0003] Exemplarily, for some common metal thin films, targets such as titanium (Ti), nickel (Ni), silver (Ag), etc. can be used to generate them through a magnetron sputtering process. During the implementation of the magnetron sputtering process, the initial standard distance from the target to the magnetron is generally 1.25 + 0.25 mm. When the levelness of the magnetron is good, it can ensure that the magnetic field passing through the target by the magnetron is sufficiently uniform, and a more uniform thin layer can be formed during magnetron sputtering.

[0004] For the above reasons, according to process requirements, it is necessary to make the magnetron assembly and the target in a substantially parallel state. In the related art, the magnetron assembly is installed on a magnetron assembly mounting plate through threaded connectors, and a plurality of thimbles are provided between the magnetron assembly and the magnetron assembly mounting plate, so that the attitude of the magnetron assembly can be adjusted by manually adjusting the height of the thimbles, so that the magnetron assembly and the target are in a substantially parallel state. This manual operation method of adjusting the thimbles has problems of large adjustment error and cumbersome operation. Summary of the Invention

[0005] Embodiments of the present application provide an adjusting device and a semiconductor process equipment to solve the problems existing in the background art.

[0006] In a first aspect, embodiments of the present application provide an adjusting device.

[0007] The adjustment device provided by the embodiment of the present application is used to adjust the magnetron assembly of a semiconductor process equipment. The adjustment device includes: a first connecting member, a second connecting member, and at least three spacing adjusters; the first connecting member and the second connecting member are arranged at intervals, and each spacing adjuster includes a third connecting member and a slider. One end of the third connecting member is rotatably connected to the first connecting member, and the other end is connected to the slider. The connecting parts of the first connecting member connected to the third connecting members are not collinear. The second connecting member is provided with a plurality of sliding rails, and the number of the sliding rails is equal to the number of the spacing adjusters. The sliders are slidably connected to the sliding rails in a one-to-one correspondence; one of the first connecting member and the second connecting member is used to connect to the magnetron assembly, and the other of the first connecting member and the second connecting member is used to connect to a rotation driving device that drives the magnetron assembly to rotate; the spacing adjuster is used to adjust the spacing between the first connecting member and the second connecting member.

[0008] Optionally, the slider includes a driving element, and the driving element is used to drive the slider to slide relative to the sliding rail to adjust the inclination angle of the third connecting member relative to the first connecting member.

[0009] Optionally, the slider further includes a roller, the driving element is a rotary motor, the rotary motor is drivingly connected to the roller, and the roller is in rolling contact with the second connecting member.

[0010] Optionally, the slider further includes a pulley and a transmission belt. The transmission belt is respectively in belt driving connection with the pulley and the roller, and the rotary motor is drivingly connected to the pulley.

[0011] Optionally, when the rotary motor receives a first control signal, the rotary motor rotates forward; when the rotary motor receives a second control signal, the rotary motor rotates in reverse.

[0012] Optionally, the sliding rail is provided with a strip-shaped hole extending along its own extending direction, and the driving element is provided with a convex portion, and the convex portion is embedded in the strip-shaped hole.

[0013] Optionally, a rotary docking portion is provided on a side of the second connecting member facing away from the first connecting member, and the rotary docking portion is used to be drivingly connected to the rotation driving device.

[0014] In a second aspect, the embodiment of the present application provides a semiconductor process equipment.

[0015] The semiconductor process equipment provided by the embodiment of the present application includes any one of the adjustment devices provided by the embodiment of the present application.

[0016] Optionally, the semiconductor process equipment further includes a cavity, a target mounting plate, and a magnetron assembly; the target mounting plate is disposed at the top of the cavity, and the magnetron assembly is disposed above the target mounting plate through the adjusting device.

[0017] Optionally, the semiconductor process equipment further includes a rotation driving device, and the rotation driving device is drivingly connected to the rotation docking portion of the second connecting member.

[0018] The above at least one technical solution adopted in the embodiments of the present application can achieve the following beneficial effects:

[0019] In the embodiments of the present application, the inclination angle of the third connecting member relative to the first connecting member can be adjusted by driving the slider to slide relative to the slide rail, and further the distance between the portion of the distance adjuster connected to the first connecting member and the second connecting member can be adjusted, so as to achieve the effect of adjusting the attitude of the magnetron assembly. Thus, by adjusting the attitude of the magnetron assembly, the magnetron assembly and the target can be made substantially parallel. In this way, it is convenient to adjust the distance between the first connecting member and the second connecting member more precisely by finely adjusting the inclination angle of the third connecting member relative to the first connecting member, and further the attitude of the magnetron assembly relative to the target can be adjusted more accurately. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 Schematic diagram of an adjusting device, a magnetron assembly, and a rotation driving device provided by an embodiment of the present application;

[0022] Figure 2 Partial schematic diagram of an adjusting device provided by an embodiment of the present application;

[0023] Figure 3 Schematic diagram of a second connecting member provided by an embodiment of the present application;

[0024] Figure 4 Schematic diagram of a semiconductor process equipment provided by an embodiment of the present application;

[0025] Figure 5 Schematic diagram of an upper electrode provided by an embodiment of the present application;

[0026] Figure 6Schematic diagram of an upper electrode of a target mounting plate and a target removed according to an embodiment of the present application;

[0027] Figure 7 Flowchart of an adjustment method for a magnetron assembly according to an embodiment of the present application.

[0028] Explanation of reference numerals:

[0029] 10 - Semiconductor process equipment; 20 - Target; 100 - Adjusting device; 110 - First connecting member; 120 - Second connecting member; 121 - Slide rail; 1211 - Slot; 122 - Rotary docking portion; 130 - Spacing adjuster; 131 - Third connecting member; 132 - Slider; 1321 - Driving element; 1322 - Roller; 1323 - Pulley; 1324 - Transmission belt; 1325 - Protrusion; 210 - Magnetron assembly; 220 - Rotary driving device; 310 - Cover; 311 - End face; 320 - Target mounting plate; 330 - Magnetron setting cavity; 410 - Cavity; 420 - Process cavity; 430 - Base; 440 - Lining; 450 - Cover ring; 460 - Cold pump. Detailed implementation manners

[0030] To make the objectives, technical solutions, and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and the corresponding drawings. Apparently, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0031] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "mounted", "connected", and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a direct connection, or an indirect connection through an intermediate medium, and it may be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0032] In addition, although the terms used in the present application are selected from well-known and commonly used terms, some of the terms mentioned in the specification of the present application may be selected by the applicant according to his or her judgment, and their detailed meanings are described in the relevant parts of the description herein.

[0033] In addition, it is required to understand the present application not only through the actual terms used, but also through the meaning implied by each term.

[0034] The technical solutions provided by the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0035] An adjustment device is provided in an embodiment of the present application. The adjustment device provided in the embodiment of the present application is used to adjust the magnetron assembly of a semiconductor process equipment. Referring to Figures 1 to 3 , the adjustment device 100 provided in the embodiment of the present application includes: a first connecting member 110, a second connecting member 120, and at least three spacing adjusters 130. Exemplarily, the first connecting member 110 is a first plate body, and the second connecting member 120 is a second plate body.

[0036] The first connecting member 110 and the second connecting member 120 are arranged at intervals. The spacing adjuster 130 includes a third connecting member 131 and a slider 132. One end of the third connecting member 131 is rotatably connected to the first connecting member 110, and the other end is connected to the slider 132. The connecting parts of the first connecting member 110 connected to the respective third connecting members 131 are not collinear. The second connecting member 120 is provided with a plurality of slide rails 121, and the number of the slide rails 121 is equal to the number of the spacing adjusters 130. The sliders 132 are slidably connected to the slide rails 121 one by one.

[0037] One of the first connecting member 110 and the second connecting member 120 is used to connect to the magnetron assembly 210, and the other of the first connecting member 110 and the second connecting member 120 is used to connect to the rotation driving device 220 that drives the magnetron assembly 210 to rotate. The spacing adjuster 130 is used to adjust the spacing between the first connecting member 110 and the second connecting member 120.

[0038] In this way, in the embodiment of the present application, by driving the slider 132 to slide relative to the slide rail 121, the inclination angle of the third connecting member 131 relative to the first connecting member 110 can be adjusted, and then the spacing between the connecting parts of the spacing adjuster 130 connected to the first connecting member 110 and the second connecting member 120 can be adjusted, so as to achieve the effect of adjusting the posture of the magnetron assembly 210. Thus, by adjusting the posture of the magnetron assembly 210, the magnetron assembly 210 can be made to be approximately parallel to the target. In this way, it is convenient to finely adjust the inclination angle of the third connecting member 131 relative to the first connecting member 110, so as to more precisely adjust the spacing between the first connecting member 110 and the second connecting member 120, and then the posture of the magnetron assembly 210 relative to the target can be more accurately adjusted.

[0039] Exemplarily, in some embodiments, the second connecting member 120 is provided with a support. A screw is threadedly connected to the support, and the screw is in transmission connection with the slider 132. Thus, by rotating the screw, the slider 132 can be driven to slide relative to the slide rail 121.

[0040] Exemplarily, in some embodiments, the second connecting member 120 is provided with a support. The adjusting device 100 includes a telescopic driver. For example, the telescopic driver can be a linear motor. One end of the telescopic driver is connected to the support, and the other end is drivingly connected to the slider 132. Thus, the slider 132 can be driven by the telescopic driver to slide relative to the slide rail 121.

[0041] To enable those skilled in the art to better implement the solutions provided by the embodiments of the present application, the following provides relatively detailed examples for reference by those skilled in the art.

[0042] Reference Figures 1 to 3 , in some embodiments, the slider 132 includes a driving element 1321. The driving element 1321 is used to drive the slider 132 to slide relative to the slide rail 121 to adjust the inclination angle of the third connecting member 131 relative to the first connecting member 110. Thus, by adjusting the inclination angle of the third connecting member 131 relative to the first connecting member 110, the distance between the part of the spacing adjuster 130 connected to the first connecting member 110 and the second connecting member 120 can be adjusted, so as to achieve the purpose of adjusting the attitude of the magnetron assembly 210.

[0043] Reference Figure 2 , in some embodiments, the slider 132 further includes a roller 1322. The driving element 1321 is a rotary motor. The rotary motor is drivingly connected to the roller 1322, and the roller 1322 is in rolling contact with the second connecting member 120. In this way, during the process of the rotary motor driving the roller 1322 to rotate, the roller 1322 is in rolling contact with the second connecting member 120, so that the slider 132 can move relative to the second connecting member 120 under the limitation of the slide rail 121.

[0044] In some embodiments, the rotary motor can receive a control signal to rotate forward or backward to adjust the distance between the first connecting member 110 and the second connecting member 120 as required. Exemplarily, when the rotary motor receives a first control signal, the rotary motor rotates forward. When the rotary motor receives a second control signal, the rotary motor rotates backward.

[0045] In some embodiments, the slider 132 further includes a pulley 1323 and a transmission belt 1324. The transmission belt 1324 is respectively in belt driving connection with the pulley 1323 and the roller 1322. The rotary motor is drivingly connected to the pulley 1323. In this way, the rotary motor can be used to drive the pulley 1323 to rotate, and then the power of the pulley 1323 can be transmitted to the roller 1322 through the transmission belt 1324, so as to drive the roller 1322 to roll relative to the second connecting member 120.

[0046] Exemplarily, the rotating electric machine can be a micromotor. The micromotor includes: a stator, a rotor, a motor shaft, a rotary encoder, a sensor, etc. The micromotor can rotate forward and backward, so that the slider 132 can move forward or backward relative to the slide rail 121. In addition, the micromotor also rotates based on the received control signal. For example, when the micromotor receives the first control signal, the micromotor can rotate forward. When the micromotor receives the second control signal, the micromotor can rotate backward. Exemplarily, the control signal can be emitted by a remote controller, so that the position of the slider 132 can be adjusted by operating the remote controller, thereby achieving the effect of adjusting the distance between the first connecting member 110 and the second connecting member 120.

[0047] In some embodiments, the number of slide rails 121 is 4, and the number of spacing adjusters 130 correspondingly is 4. Exemplarily, two of the slide rails 121 extend along a first straight line, and the other two slide rails 121 extend along a second straight line, and the first straight line and the second straight line are parallel.

[0048] In some embodiments, the slide rail 121 is provided with a strip-shaped hole 1211 extending along its own extending direction, and the driving element 1321 is provided with a protruding portion 1325, and the protruding portion 1325 is embedded in the strip-shaped hole 1211. In this way, the driving element 1321 can be slidably connected to the slide rail 121 by embedding the protruding portion 1325 in the strip-shaped hole 1211.

[0049] Reference Figure 1 and Figure 3 , in some embodiments, a rotary docking portion 122 is provided on the side of the second connecting member 120 facing away from the first connecting member 110, and the rotary docking portion 122 is used for driving connection with the rotary driving device 220. For example, the rotary driving device 220 includes a driving shaft, and the driving shaft can be inserted into the rotary docking portion 122 to drive the adjusting device 100 and the magnetron assembly 210 to rotate.

[0050] The embodiment of the present application provides a semiconductor processing apparatus. Reference Figures 4 to 6 , the semiconductor processing apparatus 10 provided by the embodiment of the present application includes any one of the adjusting devices 100 provided by the embodiment of the present application.

[0051] In some embodiments, the semiconductor processing apparatus 10 further includes a cavity 410, a target mounting plate 320, and a magnetron assembly 210. The target mounting plate 320 is disposed on the top of the cavity 410, and the magnetron assembly 210 is disposed above the target mounting plate 320 through the adjusting device 100. A process chamber 420 is surrounded between the target mounting plate 320 and the cavity 410.

[0052] In some embodiments, the semiconductor processing equipment 10 further includes a cover body 310. The cover body 310 is disposed above the target mounting plate 320. A magnetron setting cavity 330 is defined between the target mounting plate 320 and the cover body 310. The first connecting member 110, the second connecting member 120, and the magnetron assembly 210 are all disposed in the magnetron setting cavity 330, and the magnetron assembly 210 faces the target mounting plate 320.

[0053] In some embodiments, the semiconductor processing equipment 10 further includes a rotation driving device 220. The rotation driving device 220 is drivingly connected to the rotation docking portion 122 of the second connecting member 120.

[0054] In some embodiments, a target 20 is provided on the side of the target mounting plate 320 facing the process chamber. The semiconductor processing equipment 10 further includes a susceptor 430 for carrying a wafer. The semiconductor processing equipment 10 further includes a liner 440 and a cover ring 450. The liner 440 is connected to the chamber wall of the chamber 410, and the cover ring 450 is connected to the liner 440. The cover ring 450 is provided with a through hole, and the susceptor 430 can be received in the through hole. A plasma region is defined among the susceptor 430, the cover ring 450, the liner 440, the chamber 410, the target mounting plate 320, and the target 20. Exemplarily, the susceptor 430 can be lifted and lowered. The semiconductor processing equipment 10 further includes a cryopump 460.

[0055] Before implementing the semiconductor process, the cryopump 460 can adsorb air and water molecules in the process chamber 420, so that a relatively high vacuum degree can be formed in the process chamber 420. Then, a manipulator can place the wafer on the susceptor 430. Further, the susceptor 430 can be driven to rise to the process position. Further, argon gas can be introduced into the process chamber 420. A high-density plasma can be formed near the cathode of the magnetron assembly 210. Argon ions are accelerated by the Lorentz force and fly towards the target surface of the target 20 at a high speed, bombarding the target surface at a high speed, so that the atoms sputtered from the target 20 follow the principle of momentum conversion and fly towards the wafer with a relatively high kinetic energy to deposit a film, forming a dense conductive thin film layer.

[0056] It should be noted here that during the implementation of the semiconductor process by the semiconductor processing equipment 10, as the target 20 is sputtered, the target 20 will gradually become thinner, and at this time the magnetic field intensity passing through the target 20 will gradually weaken. Therefore, gradually increasing the distance between the magnetron assembly 210 and the wafer will improve the sputtering efficiency and uniformity of the target 20. Thus, during the implementation of the semiconductor process by the semiconductor processing equipment 10, it is necessary to adjust the target magnetic distance based on the process requirements of the semiconductor process to compensate for the consumption of the target 20. Wherein, the target magnetic distance is the distance between the magnetron assembly 210 and the target 20 mounted on the target mounting plate 320.

[0057] It should also be noted that if the solution in the background art is adopted, after the target 20 is consumed and thinned, the target magnetic distance can only be manually adjusted by regularly disassembling the upper electrode assembly. With the solution in the background art, it is impossible to adjust the target magnetic distance without disassembling the upper electrode assembly.

[0058] However, with the solution provided in the embodiment of the present application, without disassembling the upper electrode assembly, the distance between the first connecting member 110 and the second connecting member 120 can be adjusted by controlling the driving element 1321 to act through the controller, so as to achieve the purpose of adjusting the target magnetic distance.

[0059] Specifically, in some embodiments, the semiconductor processing equipment 10 further includes a controller, and the controller is controllably connected to the driving element 1321 of the spacing adjuster 130. Thus, the controller can be used to send a control signal to the driving element 1321 to adjust the distance between the first connecting member 110 and the second connecting member 120.

[0060] In a specific embodiment, the controller is configured to adjust the target magnetic distance based on a preset rule during the implementation of the semiconductor process by the semiconductor processing equipment, so that the target magnetic distance matches the process requirements of the semiconductor process. Wherein, the target magnetic distance is the distance between the magnetron assembly 210 and the target 20 installed on the target mounting plate 320.

[0061] It should be noted that the preset rule can be determined based on experiments. Exemplarily, the corresponding relationship between the duration of the semiconductor process implementation and the consumption of the target 20 can be determined through experiments. Furthermore, based on the corresponding relationship between the duration of the semiconductor process implementation and the consumption of the target 20, the current thickness of the target 20 can be determined. Thus, the required adjustment amount of the magnetron assembly 210 can be determined based on the current thickness of the target 20. Furthermore, the spacing adjuster 130 can be controlled to move based on the required adjustment amount of the magnetron assembly 210 to adjust the target magnetic distance, so as to achieve the purpose of compensating for the consumption of the target 20.

[0062] It can be seen from this that with the solution provided in the embodiment of the present application, the target magnetic distance can be adjusted based on the process requirements of the semiconductor process without disassembling the upper electrode assembly. In this way, the time for stopping the machine to adjust the target magnetic distance can be saved. And the adjustment process basically does not require manual operation, which can reduce the labor intensity of the operator.

[0063] The embodiment of the present application provides an adjustment method for a magnetron assembly, which is applied to any one of the semiconductor processing equipment 10 provided in the embodiment of the present application. Refer to Figures 4 to 7 , the adjustment method of the magnetron assembly includes:

[0064] Step 510, remove the upper electrode from the semiconductor processing equipment 10, where the upper electrode includes an adjusting device 100, a cover body 310, and a target mounting plate 320.Figure 5 This is a schematic diagram of the upper electrode.

[0065] Step 520: Remove the target mounting plate 320.

[0066] Step 530: Determine the distances between at least three locations on the end face 311 of the cover 310 for connecting the target mounting plate 320 and the magnetron assembly 210, and determine whether the deviation between the distances is greater than a preset value. Among them, when the deviation between the distances is less than or equal to the preset value, it can be considered that the magnetron assembly 210 is substantially parallel to the end face 311. Furthermore, after installing the target mounting plate 320 provided with the target 20 on the end face 311, the target 20 is also substantially parallel to the magnetron assembly 210.

[0067] Step 540: When the deviation between the distances is greater than the preset value, determine the displacement of the slider 132 based on the distances.

[0068] Step 550: Drive the slider 132 to move based on the determined displacement of the slider 132.

[0069] Repeat steps 530 to 550 until the deviation between the distances is less than the preset value.

[0070] In this way, the initial target magnetic distance can be adjusted so that under the initial conditions, the parallelism between the target 20 and the magnetron assembly 210 meets the process requirements.

[0071] In addition, further, during the implementation of the semiconductor process, based on the corresponding relationship between the duration of the semiconductor process implementation and the consumption of the target 20, determine the current thickness of the target 20, and thus adjust the target magnetic distance to make the target magnetic distance match the process requirements of the semiconductor process.

[0072] In this way, the target magnetic distance can be adjusted based on the process requirements of the semiconductor process without disassembling the upper electrode assembly. It can save the time for shutting down the machine to adjust the target magnetic distance; and since the adjustment process basically does not require manual operation, it can reduce the labor intensity of the operator.

[0073] To facilitate the understanding of the magnetron adjustment method by those skilled in the art, the following provides a more detailed example for reference by those skilled in the art.

[0074] Remove the upper electrode from the semiconductor process equipment 10. Then turn the upper electrode over so that the target 20 faces upward. Further, remove the target mounting plate 320 together with the target 20. Place the reference bar on the end face 311. For example, the reference bar is an aluminum bar. Use a vernier caliper to detect the distances between multiple locations of the magnetron assembly 210 and the reference bar. Thus, indirectly determine the distance between the end face 311 and the magnetron assembly 210.

[0075] Further, it is determined whether the deviation between the distances between the end face 311 and the magnetron assembly 210 is greater than a preset value. When the deviation between the distances between the end face 311 and the magnetron assembly 210 is greater than the preset value, it is considered that the magnetron assembly 210 is not parallel to the end face 311, and the attitude of the magnetron assembly 210 needs to be adjusted to make the end face 311 and the magnetron assembly 210 substantially parallel.

[0076] When the slider 132 includes a driving element 1321 for driving the slider 132 to slide relative to the slide rail 121 to adjust the inclination angle of the third connecting member 131 relative to the first connecting member 110, the displacement of the slider 132 relative to the slide rail 121 can be subdivided. For example, the displacement of the slider 132 relative to the slide rail 121 is divided into 1000 steps. For every ten steps the slider 132 moves, the magnetron assembly 210 rises (or falls) by 0.1 mm. There are a total of four groups of slide rails, and the sliders 132 corresponding to the slide rails can be freely controlled to raise or lower the magnetron assembly 210.

[0077] Exemplarily, the distance of 1.25 mm between the end face 311 and the magnetron assembly 210 can be used as the standard distance. Subtracting the standard distance of 1.25 mm from the actually measured distance can obtain the distance that needs to be compensated. Then, the distance that needs to be compensated is converted into the number of steps that need to rise or fall. The movement of each driving element 1321 can be independently controlled by operating the remote control. Then, the displacement of the slider 132 relative to the slide rail 121 can be determined based on the compensated distance.

[0078] In addition, in some embodiments, during the implementation of the semiconductor process, the controller can be used to control the operation of the distance adjuster 130 to achieve the effect of adjusting the distance between the magnetron assembly 210 and the target 20. Or, during the implementation of the semiconductor process, based on the corresponding relationship between the duration of the semiconductor process implementation and the consumption of the target 20, the current thickness of the target 20 can be determined, and thus, the target magnetic distance can be adjusted to match the process requirements of the semiconductor process.

[0079] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0080] Although embodiments of the present application have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the embodiments of the present application. The scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. An adjusting device (100) for adjusting a magnetron assembly (210) of a semiconductor process equipment, characterized in that: The adjustment device (100) comprises: a first connecting member (110), a second connecting member (120) and at least three spacing adjusters (130); The first connecting member (110) and the second connecting member (120) are arranged at intervals, the spacing adjuster (130) comprises a third connecting member (131) and a slider (132), one end of the third connecting member (131) is rotatably connected to the first connecting member (110), and the other end is connected to the slider (132), the connection parts of the first connecting member (110) connected to each of the third connecting members (131) are not collinear, the second connecting member (120) is provided with a plurality of slide rails (121), the number of the slide rails (121) is equal to the number of the spacing adjusters (130), and the sliders (132) are slidably connected to the slide rails (121) in a one-to-one correspondence; One of the first connecting member (110) and the second connecting member (120) is used to connect to the magnetron assembly (210), and the other of the first connecting member (110) and the second connecting member (120) is used to connect to a rotation drive device (220) that drives the magnetron assembly (210) to rotate; the spacing adjuster (130) is used to adjust the spacing between the first connecting member (110) and the second connecting member (120).

2. The adjustment device (100) according to claim 1, characterized in that The slider (132) comprises a driving element (1321), and the driving element (1321) is used to drive the slider (132) to slide relative to the slide rail (121) so as to adjust the inclination angle of the third connecting member (131) relative to the first connecting member (110).

3. The adjustment device (100) according to claim 2, characterized in that The slider (132) further comprises a roller (1322), the driving element (1321) is a rotary motor, the rotary motor is drivingly connected to the roller (1322), and the roller (1322) is in rolling contact with the second connecting member (120).

4. The adjustment device (100) according to claim 3, characterized in that The slider (132) further comprises a pulley (1323) and a transmission belt (1324), wherein the transmission belt (1324) is respectively connected to the pulley (1323) and the roller (1322) in a belt-driven manner, and the rotating motor is drivingly connected to the pulley (1323).

5. The adjustment device (100) according to claim 4, characterized in that: When the rotating motor receives the first control signal, the rotating motor rotates forward; when the rotating motor receives the second control signal, the rotating motor rotates reversely.

6. The adjustment device (100) according to claim 2, characterized in that: The slide rail (121) is provided with a strip-shaped hole (1211) extending along its own extension direction, and the driving element (1321) is provided with a protrusion (1325), and the protrusion (1325) is embedded in the strip-shaped hole (1211).

7. The adjustment device (100) according to claim 1, characterized in that A rotational docking portion (122) is provided on a side of the second connecting member (120) facing away from the first connecting member (110), and the rotational docking portion (122) is used for driving connection with the rotation driving device (220).

8. A semiconductor process equipment, characterized in that: The invention comprises a cavity (410), a target mounting plate (320), a magnetron assembly (210), and an adjustment device (100) as described in any one of claims 1 to 7, wherein the target mounting plate (320) is arranged on the top of the cavity (410), and the magnetron assembly (210) is arranged above the target mounting plate (320) through the adjustment device (100).

9. The semiconductor process equipment according to claim 8, characterized in that: The semiconductor process equipment further comprises a rotation driving device (220), wherein the rotation driving device (220) is drivingly connected to the rotation docking portion (122) of the second connecting member (120).

10. The semiconductor process equipment according to claim 8, characterized in that: The semiconductor process equipment further comprises a controller, wherein the controller is connected to the driving element (1321) of the spacing adjuster (130); The controller is used to adjust the target magnetic distance based on preset rules during the process of implementing a semiconductor process in the semiconductor process equipment, so that the target magnetic distance matches the process requirements of the semiconductor process; wherein the target magnetic distance is the distance between the magnetron assembly (210) and the target material (20) installed on the target material mounting plate (320).

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