Heat dissipation device

Abstract

The invention provides heat dissipation equipment. The heat dissipation equipment comprises a heat dissipation carrier plate, a microneedle injector, a plurality of piezoelectric assemblies and a pump, the heat dissipation carrier plate comprises a first surface and a second surface which are opposite to each other, and the first surface is configured to abut against a to-be-cooled assembly. The microneedle injector comprises a third surface and a plurality of needle holes, a space is defined between the third surface and the second surface, and the needle holes are distributed in the third surface and communicated with the space. The piezoelectric assemblies are separated from each other and are connected between the heat dissipation carrier plate and the microneedle injector, and the needle hole is located between the piezoelectric assemblies. The pump is connected with the microneedle injector and is in signal connection with the piezoelectric assembly.

Description

Technical Field

[0001] This application relates to a heat dissipation device, and more particularly to a heat dissipation device utilizing the characteristics of fluid state change. Background Art

[0002] With the continuous improvement of people's living standards, the importance of servers in people's lives has become increasingly high. Facing the huge demand for servers, major manufacturers are also committed to enhancing the market competitiveness of their brands.

[0003] For example, when a server is operating, if the heat energy generated by it is excessive, it may affect the operating efficiency of the server or even cause damage to the server. Therefore, how to effectively dissipate heat from the server under reliable conditions is undoubtedly a topic that the industry attaches great importance to. Summary of the Invention

[0004] One objective of this application is to provide a heat dissipation device that can continuously dissipate heat from the component to be cooled with high efficiency.

[0005] According to an embodiment of this application, a heat dissipation device includes a heat dissipation carrier plate, a micro-needle syringe, a plurality of piezoelectric components, and a pump. The heat dissipation carrier plate includes opposite first and second surfaces, and the first surface is configured to abut against the component to be cooled. The micro-needle syringe includes a third surface and a plurality of needle holes. A space is defined between the third surface and the second surface, and the needle holes are distributed on the third surface and communicate with the space. The piezoelectric components are separated from each other and are connected between the heat dissipation carrier plate and the micro-needle syringe, and the needle holes are located between the piezoelectric components. The pump is connected to the micro-needle syringe and is signal-connected to the piezoelectric components.

[0006] In one or more embodiments of this application, the above-mentioned needle holes are arranged in a matrix.

[0007] In one or more embodiments of this application, the above-mentioned pump is a peristaltic pump.

[0008] In one or more embodiments of this application, the second surface is hydrophilic.

[0009] In one or more embodiments of this application, the heat dissipation device further includes a fan module. The fan module is configured to blow air towards the space.

[0010] In one or more embodiments of this application, the piezoelectric components define opposite first and second openings. The space communicates with the first and second openings, and the fan module is configured to blow air towards the space through the first opening. The heat dissipation device further includes an external heat exchanger and an exhaust pipeline. The external heat exchanger is configured to condense hot air. The exhaust pipeline is connected to the second opening and the external heat exchanger.

[0011] In one or more embodiments of the present application, the above heat dissipation device further includes a liquid collecting tank. The liquid collecting tank is connected to an external heat exchanger and a micro-needle syringe.

[0012] In one or more embodiments of the present application, a first distance is provided between the above third surface and the second surface, and the range of the first distance is between 2.997 millimeters and 5.191 millimeters.

[0013] In one or more embodiments of the present application, each of the above needle holes has a diameter, and the diameter is 2.997 millimeters.

[0014] In one or more embodiments of the present application, the second distance is provided between two adjacent ones of the above needle holes, and the range of the second distance is between 4.238 millimeters and 5.994 millimeters.

[0015] The above embodiments of the present application have at least the following advantages:

[0016] (1) When the volume of the water droplet shrinks due to evaporation and no longer touches the third surface of the micro-needle syringe, the supporting force provided by the water droplet to the micro-needle syringe due to surface tension also disappears, so that the weight of the micro-needle syringe will be mainly supported by the piezoelectric component, causing the piezoelectric component to bear a greater pressure. When the pressure borne by the piezoelectric component changes, its voltage also changes accordingly. At this time, the piezoelectric component will send a voltage signal to the pump, so that the pump drives the micro-needle syringe to squeeze water into the space to form a water droplet, and allows the newly formed water droplet to continue to absorb the heat energy emitted from the component to be cooled. In this way, the heat dissipation device can continuously dissipate heat from the component to be cooled.

[0017] (2) Since the water droplet undergoes a state change and evaporates into a gas after absorbing the heat energy emitted from the component to be cooled, it can dissipate heat from the component to be cooled with high efficiency.

[0018] (3) When the external heat exchanger condenses the evaporation gas formed by heating the water droplet, the condensed liquid water will be collected by the liquid collecting tank and flow to the micro-needle syringe when the pump is started and form a water droplet in the space again. In this way, the water can form a fluid cycle in the heat dissipation device, so as to facilitate the continuous operation of the heat dissipation device. Description of the Drawings

[0019] FIG. 1 is a partial cross-sectional schematic view of a heat dissipation device according to an embodiment of the present application.

[0020] FIG. 2 is a cross-sectional view of FIG. 1 along line A-A.

[0021] FIG. 3 is a cross-sectional view of FIG. 1 along line B-B, where the water droplet is omitted.

[0022] FIG. 4 is a cross-sectional view of FIG. 1 along line C-C.

[0023] Description of Component Labels

[0024] 100 Heat Dissipation Device

[0025] 110 Heat Dissipation Carrier Board

[0026] 111 First Surface

[0027] 112 Second Surface

[0028] 120 Microneedle Syringe

[0029] 121 Third Surface

[0030] 130 Piezoelectric Component

[0031] 140 Pump

[0032] 150 Fan Module

[0033] 160 External Heat Exchanger

[0034] 170 Exhaust Pipeline

[0035] 180 Liquid Collection Tank

[0036] 200 Component to be Heat Dissipated

[0037] Line Segments A-A, B-B, C-C

[0038] AF Airflow

[0039] DA Diameter

[0040] DD Air Supply Direction

[0041] D1 First Distance

[0042] D2 Second Distance

[0043] GS Gas

[0044] OP1 First Opening

[0045] OP2 Second Opening

[0046] PH Pinhole

[0047] SP Space

[0048] WD Water Drop

[0049] WL Liquid Moisture

[0050] Z Range Detailed Implementation Manner

[0051] The following will disclose multiple embodiments of the present application with diagrams. For the sake of clear illustration, many practical details will be described together in the following narrative. However, it should be understood that these practical details are not used to limit the present application. That is to say, in some embodiments of the present application, these practical details are unnecessary. In addition, for the purpose of simplifying the diagrams, some conventional structures and components will be shown in a simple schematic manner in the diagrams, and in all the diagrams, the same reference numerals will be used to represent the same or similar components. And if possible in implementation, the features of different embodiments can be applied interactively.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used herein include their ordinary meanings, which can be understood by those skilled in the art. Furthermore, the definitions of the above terms in commonly used dictionaries should be interpreted as consistent with the meanings in the relevant fields of the present application in the context of this specification. Unless specifically defined otherwise, these terms will not be construed as idealized or overly formal meanings.

[0053] Please refer to FIGS. 1 to 2. FIG. 1 is a partial cross-sectional schematic diagram showing a heat dissipation device 100 according to an embodiment of the present application. FIG. 2 is a cross-sectional view of FIG. 1 along line A-A. In this embodiment, as shown in FIGS. 1 to 2, a heat dissipation device 100 is applicable to promote heat exchange from heat-generating electronic components (such as a processor) in a server, and includes a heat dissipation carrier plate 110, a micro-needle syringe 120, a plurality of piezoelectric components 130, and a pump 140. The heat dissipation carrier plate 110 includes opposite first and second surfaces 111 and 112. The first surface 111 of the heat dissipation carrier plate 110 is configured to abut against the component to be dissipated, that is, for example, the above-mentioned heat-generating electronic component. The micro-needle syringe 120 includes a third surface 121. A space SP is defined between the third surface 121 of the micro-needle syringe 120 and the second surface 112 of the heat dissipation carrier plate 110. The space SP is suitable for accommodating a plurality of water droplets WD, and the water droplets WD can simultaneously contact the third surface 121 and the second surface 112 and provide a certain supporting force to the micro-needle syringe 120 due to their surface tension. The piezoelectric components 130 are separated from each other and connected between the heat dissipation carrier plate 110 and the micro-needle syringe 120. A space SP is also defined between the piezoelectric components 130, that is, the water droplets WD are also located between the piezoelectric components 130. The pump 140 is connected to the micro-needle syringe 120 and is signal-connected to the piezoelectric components 130. In practical applications, the pump 140 can be a peristaltic pump, but the present application is not limited thereto.

[0054] In practical applications, when using the heat dissipation device 100 to dissipate heat from the component to be cooled 200, the user places the first surface 111 of the heat dissipation carrier plate 110 against the component to be cooled 200. The heat energy of the component to be cooled 200 is transmitted through the heat dissipation carrier plate 110 to the water droplet WD, causing the temperature of the water droplet WD to rise and even evaporate into a gas GS, thereby achieving the effect of dissipating heat from the component to be cooled 200. When the volume of the water droplet WD shrinks due to evaporation and no longer contacts the third surface 121 of the micro-needle syringe 120, the supporting force provided by the water droplet WD to the micro-needle syringe 120 due to surface tension also disappears, causing the weight of the micro-needle syringe 120 to be mainly supported by the piezoelectric component 130, resulting in the piezoelectric component 130 bearing a greater pressure. When the pressure borne by the piezoelectric component 130 changes, its voltage also changes accordingly. At this time, the piezoelectric component 130 sends a voltage signal to the pump 140, causing the pump 140 to drive the micro-needle syringe 120 to squeeze water into the space SP to form a water droplet WD, and allowing the newly formed water droplet WD to continue to absorb the heat energy emitted from the component to be cooled 200. In this way, the heat dissipation device 100 can continuously dissipate heat from the component to be cooled 200. In practical applications, the piezoelectric component 130 can be a piezoelectric washer, but the present application is not limited thereto.

[0055] Furthermore, since the water droplet WD undergoes a state change and evaporates into a gas GS after absorbing the heat energy emitted from the component to be cooled 200, it can dissipate heat from the component to be cooled 200 with high efficiency.

[0056] Specifically, as shown in Figure 1, a first distance D1 is provided between the third surface 121 of the micro-needle syringe 120 and the second surface 112 of the heat dissipation carrier plate 110. Preferably, the first distance D1 ranges between 2.997 mm and 5.191 mm to facilitate the water droplet WD in the space SP to contact both the third surface 121 and the second surface 112 simultaneously. Furthermore, the second surface 112 of the heat dissipation carrier plate 110 is hydrophilic, so that the water extruded from the micro-needle syringe 120 can form water droplets on the second surface 112. In practical applications, the user can perform a suitable surface treatment on the second surface 112 of the heat dissipation carrier plate 110, such as chemically etching the second surface 112 or adding a hydrophilic coating to the second surface 112, to enhance the hydrophilicity of the second surface 112, but the present application is not limited thereto.

[0057] Please refer to FIG. 3. FIG. 3 is a cross-sectional view showing FIG. 1 along line B-B, where the water droplets WD are omitted. In the present embodiment, as shown in FIG. 3, the microneedle syringe 120 includes a plurality of needle holes PH, and the needle holes PH are distributed on the third surface 121 and communicate with the space SP. Further, the needle holes PH are located between the piezoelectric components 130 and are arranged in a matrix. Therefore, the water droplets WD formed by extruding from the needle holes PH of the microneedle syringe 120 can also be arranged in a matrix. Moreover, the distance between two adjacent needle holes PH is the second distance D2. Preferably, the range of the second distance D2 is between 4.238 mm and 5.994 mm to optimize the utilization of the space SP.

[0058] Moreover, as shown in FIG. 3, each needle hole PH includes a diameter DA. Preferably, the diameter DA is the same as the inner diameter of a conventional injection needle No. 9, that is, the diameter DA can be 2.997 mm, so that the moisture extruded from the needle holes PH of the microneedle syringe 120 can form water droplets by the hanging drop method.

[0059] Further, in the present embodiment, as shown in FIG. 1, the heat dissipation device 100 further includes a fan module 150. The fan module 150 is configured to blow air towards the space SP, that is, to provide an air flow AF to the space SP, so as to facilitate taking away the hot gas GS in the space SP, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0060] More specifically, as shown in FIG. 3, a relative first opening OP1 and a second opening OP2 are defined between the piezoelectric components 130. As shown in FIGS. 1 and 3, the space SP communicates with the first opening OP1 and the second opening OP2, and the fan module 150 is configured to blow air towards the space SP through the first opening OP1.

[0061] Moreover, as shown in FIG. 1, the heat dissipation device 100 further includes an external heat exchanger 160 and an exhaust pipeline 170. The external heat exchanger 160 is configured to condense the hot air, and the exhaust pipeline 170 connects the second opening OP2 and the external heat exchanger 160. Specifically, to avoid the negative impact of the high-humidity gas GS on the electronic systems or devices accommodating the heat dissipation device 100, the evaporation gas GS formed by heating the water droplets WD can be transmitted from the space SP through the second opening OP2 and through the exhaust pipeline 170 to the external heat exchanger 160, so that the external heat exchanger 160 can condense it.

[0062] Furthermore, as shown in FIG. 1, the heat dissipation device 100 further includes a liquid collecting tank 180, and the liquid collecting tank 180 is connected between the external heat exchanger 160 and the microneedle syringe 120. When the external heat exchanger 160 condenses the evaporation gas GS formed by heating the water droplets WD, the condensed liquid water WL will be collected by the liquid collecting tank 180 and flow to the microneedle syringe 120 when the pump 140 is started, and then form water droplets WD again in the space SP. In this way, water can form a fluid cycle in the heat dissipation device 100, so that the heat dissipation device 100 can continue to operate.

[0063] Please refer to FIG. 4. FIG. 4 is a cross-sectional view of FIG. 1 along the line C-C. In the present embodiment, as shown in FIG. 4, when the fan module 150 (see FIG. 1 for the fan module 150) blows air toward the space SP through the first opening OP1, the air flow AF will flow through between the water droplets WD along the air supply direction DD, so as to take away the hot gas GS (see FIG. 1 for the gas GS) in the space SP along with the air flow AF. On the other hand, in the range Z between two adjacent water droplets WD arranged along the air supply direction DD, the Bernoulli effect will be generated due to the flow of the air flow AF, that is, the range Z will be in a low pressure or even vacuum state, which is conducive to increasing the rate at which the water droplets WD undergo a phase change and evaporate into the gas GS, thereby enhancing the heat dissipation efficiency of the heat dissipation device 100.

[0064] In summary, the technical solutions disclosed in the above embodiments of the present application at least include the following advantages:

[0065] (1) When the volume of the water droplet shrinks due to evaporation and no longer contacts the third surface of the microneedle syringe, the supporting force provided by the water droplet to the microneedle syringe due to surface tension also disappears, so that the weight of the microneedle syringe will be mainly supported by the piezoelectric component, causing the piezoelectric component to bear a greater pressure. When the pressure borne by the piezoelectric component changes, its voltage also changes accordingly. At this time, the piezoelectric component will send a voltage signal to the pump, so that the pump drives the microneedle syringe to squeeze water into the space to form water droplets, and allows the newly formed water droplets to continue to absorb the heat energy emitted from the component to be cooled. In this way, the heat dissipation device can continuously dissipate heat from the component to be cooled.

[0066] (2) Since the water droplets undergo a phase change and evaporate into a gas after absorbing the heat energy emitted from the component to be cooled, high-efficiency heat dissipation can be performed on the component to be cooled.

[0067] (3) When the external heat exchanger condenses the evaporation gas formed by heating the water droplets, the condensed liquid water will be collected by the liquid collecting tank and flow to the microneedle syringe when the pump is started, and then form water droplets again in the space. In this way, water can form a fluid cycle in the heat dissipation device, so that the heat dissipation device can continue to operate.

[0068] In an embodiment of the present application, the server of the present application can be used for artificial intelligence (AI) operations and edge computing, and can also be used as a 5G server, a cloud server, or a vehicle-to-everything (V2X) server.

[0069] Although the present application has been disclosed as above in an implementation manner, it is not intended to limit the present application. Any person skilled in this art can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be subject to that defined by the appended claims.

Claims

1. A heat dissipation device, characterized in that: Include: A heat dissipation carrier, comprising a first surface and a second surface opposite to each other, wherein the first surface is configured to abut against a component to be dissipated; A microneedle syringe, comprising a third surface and a plurality of needle holes, wherein a space is defined between the third surface and the second surface, and the plurality of needle holes are distributed on the third surface and connected to the space; A plurality of piezoelectric components are separated from each other and connected between the heat dissipation carrier and the microneedle syringe, and the plurality of needle holes are located between the plurality of piezoelectric components; as well as A pump is connected to the micro-needle syringe and is signal-connected to the plurality of piezoelectric components.

2. The heat dissipation device according to claim 1, characterized in that: The plurality of pinholes are distributed in a matrix.

3. The heat dissipation device according to claim 1, characterized in that: The pump is a peristaltic pump.

4. The heat dissipation device according to claim 1, characterized in that: The second surface is hydrophilic.

5. The heat dissipation device according to claim 1, characterized in that: Also includes: A fan module is configured to supply air toward the space.

6. The heat dissipation device according to claim 5, characterized in that: The plurality of piezoelectric components define a first opening and a second opening opposite to each other, the space is connected to the first opening and the second opening, the fan module is configured to supply air toward the space through the first opening, and the heat dissipation device further comprises: an external heat exchanger configured to condense a hot air; and An exhaust pipeline connects the second opening and the external heat exchanger.

7. The heat dissipation device according to claim 6, characterized in that: Also includes: A liquid collecting tank is connected to the external heat exchanger and the microneedle injector.

8. The heat dissipation device according to claim 1, characterized in that: The third surface is spaced apart from the second surface by a first distance, and the first distance ranges from 2.997 mm to 5.191 mm.

9. The heat dissipation device according to claim 1, characterized in that: Each of the plurality of pinholes comprises a diameter, wherein the diameter is 2.997 mm.

10. The heat dissipation device according to claim 1, characterized in that: Two adjacent pinholes among the plurality of pinholes are spaced apart by a second distance, and the second distance ranges from 4.238 mm to 5.994 mm.

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