Chip category sorting machine and sorting method thereof

Abstract

The invention provides a chip category sorting machine and a sorting method thereof, the chip category sorting machine comprises a large plate, a plurality of groups of multi-layer tray mechanisms and six groups of stacking tray mechanisms, and the plurality of groups of multi-layer tray mechanisms are arranged on one side of the large plate. The method has the beneficial effects that the upper limit of the number of HardBins of a traditional test sorting machine is broken through, 95 Bins can be set at most for sorting, the method is compatible with the HardBin and SoftBin and is used in the next procedure of traditional test sorting, after the traditional test sorting machine completes chip testing in the previous procedure, chips can enter a Bin sorting link and are sorted in a chip category sorting machine, and the chip sorting efficiency is improved. And the sorting work can be finished at one time.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip sorting, and in particular relates to a chip type sorting machine and a sorting method thereof. Background Art

[0002] With the rapid development of chip technology, in the field of semiconductor testing, the number of Bin types for a chip is increasing. However, due to the limited number of discharge mechanisms, traditional test sorting machines can only sort out a few HardBins (HardBin is a classification based on whether the chip meets hard standards (such as electrical performance, functional integrity, etc.) during the test process. It is a strict classification method, usually used for final product grading. If a parameter of the chip (such as voltage, frequency) exceeds the specification range, it will be classified as unqualified, that is, Fail HardBin. Qualified chips may also be divided into different grades according to their performance), and some chips have tested SoftBin (SoftBin is a classification based on certain non-critical characteristics or trends exhibited by the chip during the test process. It is a relatively flexible classification method, usually used for process monitoring and data analysis. The test results do not necessarily directly affect the final grade of the chip. If a parameter of the chip is close to the specification limit but does not exceed it, it may be classified as SoftBin for subsequent analysis) as many as 40 types. The upper limit of the number of HardBins in traditional test sorting machines can no longer meet the sorting needs. After one sorting, all Bins (chips are classified according to their test results, and the classification standard can be HardBin or SoftBin) cannot be sorted out. At this time, the chip needs to be put back into the test sorting machine for a second round of sorting. Usually, three or more rounds of sorting are required to completely sort all Bins. The time cost is high and the efficiency is low. At this time, a chip category sorting machine is needed. Summary of the invention

[0003] In view of this, the present invention aims to provide a chip type sorting machine to solve at least one problem existing in the above-mentioned prior art.

[0004] To achieve the above object, the technical solution of the present invention is achieved as follows: A chip category sorting machine comprises a large plate, several groups of multi-layer tray mechanisms and 6 groups of stacking tray mechanisms, wherein the several groups of multi-layer tray mechanisms are arranged on one side of the large plate, and 6 groups of stacking tray mechanisms are arranged above the other side of the large plate, and the 6 groups of stacking tray mechanisms respectively comprise, from left to right, one IC entry mechanism for sorting, one empty tray exit mechanism, one empty tray entry mechanism and three automatic tray exit stacking mechanisms.

[0005] Furthermore, the number of the multi-layer tray mechanisms is 4 groups.

[0006] Furthermore, a material box is arranged inside each of the multi-layer material tray mechanisms, and each material box is provided with 23 layers of material trays, and each layer of material trays can receive chips of one type of Bin.

[0007] Furthermore, each of the multi-layer tray mechanisms is provided with an in-and-out conveying track, which is used to convey the trays. The IC entry mechanism for sorting, the empty tray exit mechanism, the empty tray entry mechanism and the automatic tray exit stacking mechanism are respectively provided with tray tracks, and the in-and-out conveying track and the tray track are both arranged above the large plate.

[0008] Furthermore, it also includes an XY moving component, which is installed above one end of the in-and-out conveying track. The XY moving component is used to sort chips. The XY moving component can completely cover the in-and-out conveying tracks of 4 groups of multi-layer tray mechanisms, the tray tracks of the IC entry mechanism to be sorted, and the tray tracks of 3 automatic tray output stacking mechanisms through movement in the X and Y directions.

[0009] Furthermore, it also includes a code reader, which is installed above the large board through a fixed bracket, and the installation position of the code reader is located in the middle of the material tray track of the IC to be sorted entering the mechanism.

[0010] Furthermore, it also includes an X-axis moving component, which is installed above the large plate and located above 6 groups of stacking tray mechanisms. The X-axis moving component can grab empty trays from the tray track of the empty tray entry mechanism and place them into the tray tracks of 3 automatic tray output stacking mechanisms.

[0011] To achieve the above object, the technical solution of the present invention is achieved as follows: In a first aspect, the present invention provides a chip type sorting machine sorting method, comprising the following steps: S1. Place empty trays in the material boxes of the four groups of multi-layer tray mechanisms, place the trays of chips to be sorted into the IC entry mechanism, and place several layers of empty trays into the empty tray entry mechanism; S2. After the machine is started, the tray of chips to be sorted is transported to the inside of the machine through the tray track of the IC entry mechanism. After the tray is in place, the barcode reader identifies the Tray ID information, and after computer analysis, it is resolved to the Bin distribution coordinates in the tray; S3. While the barcode reader identifies the Tray ID, the material box of the multi-layer tray mechanism moves up and down so that a certain layer of the material box stays at the entrance and exit of the tray track, and then the material tray of this layer is conveyed out of the material box and translated to the end of the track. At the same time, the empty tray entry mechanism conveys the empty tray into the machine (i.e., the end of the mechanism's track), and the X-axis moving component grabs the empty tray from the tray track of the empty tray entry mechanism and places it on the tray track of the three automatic tray output stacking mechanisms; S4, the XY moving component picks up a Bin chip from the chip tray to be sorted, and transports it to the target empty tray for placement. After transporting one Bin, it transports another Bin. If the target empty tray is a multi-layer tray mechanism, when one Bin is placed, the XY moving component will place the chip on other multi-layer tray mechanisms. At the same time, the track will transport the placed Bin tray back to the material box. The tray returns to the material box, and the material box performs a lifting movement to send the next tray to the track entrance and exit. Then the next tray is transported to the end of the track for placement of the next Bin. The tray transporting, lifting, and chip placement actions of the four multi-layer tray mechanisms are performed alternately.

[0012] Compared with the prior art, the chip category sorting machine and the sorting method described in the present invention have the following advantages: The chip category sorting machine and the sorting method described in the present invention break through the upper limit of the number of HardBins of traditional test sorting machines. The present invention can set up to 95 Bins for sorting, is compatible with HardBin and SoftBin, and is used as the next process of traditional test sorting. When the traditional test sorting machine completes the chip test in the previous process, the chip can enter the Bin sorting link and be sorted in the chip category sorting machine, so that the sorting work can be completed at one time. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 It is a schematic top view of the overall structure described in an embodiment of the present invention.

[0014] Description of reference numerals: 1. Empty tray ejection mechanism; 2. Empty tray entry mechanism; 3. IC entry mechanism for sorting; 4. Automatic tray ejection and stacking mechanism; 5. Large board; 6. X-axis moving component; 7. XY-axis moving component; 8. Multi-layer tray mechanism; 9. Barcode reader. DETAILED DESCRIPTION

[0015] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0016] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0017] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0018] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0019] like Figures 1 to 2 As shown, a chip category sorting machine includes 4 groups of multi-layer tray mechanisms 8 and 6 groups of stacking tray mechanisms. The multi-layer tray mechanism 8 is internally provided with a manually removable material box. The 6 groups of stacking tray mechanisms are respectively 1 IC to be sorted entry mechanism 3, 1 empty tray out tray mechanism 1, 1 empty tray entry mechanism 2 and 3 automatic out tray stacking mechanisms 4.

[0020] In a preferred embodiment of the present invention, the 4 groups of multi-layer tray mechanisms 8 are provided with in-and-out conveying tracks, which are used to convey the trays. The in-and-out conveying tracks are placed on the plane of the large plate 5 and are fixed to the large plate 5. The tracks of the 6 groups of stacked tray mechanisms are also placed on the plane of the large plate 5 and are fixed to the large plate 5.

[0021] In a preferred embodiment of the present invention, an XY-direction moving assembly 7 is further included, and the XY-direction moving assembly 7 can completely cover the in-and-out conveying tracks of the four groups of multi-layer tray mechanisms 8, the tray tracks of the IC entry mechanism 3 to be sorted, and the tray tracks of the three automatic tray-out stacking mechanisms 4 through movement in the X and Y directions. The XY-direction moving assembly 7 is used to sort the chips, and has the advantage that only one XY-direction moving assembly 7 is needed to pick up the chips from the IC entry mechanism 3 to be sorted, and transport them to the multi-layer tray mechanism 8 or the automatic tray-out stacking mechanism 4.

[0022] In a preferred embodiment of the present invention, a code reader 9 is further included. The code reader 9 is installed on the large board 5 through a fixed bracket, and the installation position is located in the middle of the material tray track of the IC to be sorted entering mechanism 3.

[0023] A chip sorting method comprises the following steps: 1. Place empty trays in the material boxes of the 4 sets of multi-layer tray mechanisms 8, place the trays of chips to be sorted in the IC entry mechanism 3, and place several layers of empty trays in the empty tray entry mechanism 2; 2. After the machine is started, the sorting chip tray is transferred to the inside of the machine through the tray track of the IC to be sorted entry mechanism 3. After the tray is in place, the barcode reader 9 identifies the Tray ID information and resolves it to the Bin distribution coordinates in the tray through computer analysis.

[0024] 3. While the barcode reader 9 identifies the Tray ID, the material box of the multi-layer tray mechanism 8 moves up and down to make a certain layer stay at the entrance and exit of the track, and then the tray of this layer is taken out of the material box and translated to the end of the track. At the same time, the empty tray entry mechanism 2 conveys the empty tray into the machine (i.e. the end of the track of the mechanism), and the X-direction moving component 6 grabs the empty tray from the tray track of the empty tray entry mechanism 2 and places it on the tray tracks of the three automatic tray output stacking mechanisms 4.

[0025] 4. The XY moving component 7 picks up a type of Bin chip from the chip tray 3 to be sorted, and transports it to the target empty tray for placement. After transporting one Bin, it transports another Bin. If the target empty tray is a multi-layer tray mechanism 8, after one Bin is placed, the XY moving component 7 will place the chip on other multi-layer tray mechanisms 8. At the same time, the track will transport the placed Bin tray back to the material box. The tray returns to the material box, and the material box performs lifting and lowering movements to send the next tray to the track entrance and exit, and then the next tray is transported to the end of the track for placement of the next Bin. The tray transporting, lifting, and chip placement actions of the four multi-layer tray mechanisms 8 are performed alternately.

[0026] Advantages of the present invention: Breaking through the upper limit of the number of HardBins in traditional test sorting machines, the present invention can set up to 95 types of Bins for sorting, is compatible with HardBin and SoftBin, and is used as the next process of traditional test sorting. When the traditional test sorting machine completes the chip test in the previous process, the chip can enter the Bin sorting link and be sorted in the chip category sorting machine, so that the sorting work can be completed at one time.

[0027] Example 1 The chip classification sorting machine is used to sort the chips according to dozens of Bins. The machine includes: a code reader 9, an IC entry mechanism 3 for sorting, an empty tray discharging mechanism 1, an empty tray entry mechanism 2, 3 automatic tray discharging and stacking mechanisms 4, 4 sets of multi-layer tray mechanisms 8, 1 X-direction moving component 6, 1 XY-direction moving component 7, a code reader 9 and a large board 5. The code reader 9 is used to read Tray ID. The IC entry mechanism 3 for sorting can place the chips to be sorted, the empty tray discharging mechanism 1 can receive the empty tray from the IC entry mechanism 3 for sorting, the empty tray entry mechanism 2 can place the empty tray to be entered, the automatic tray discharging and stacking mechanism 4 receives the empty tray from the empty tray entry mechanism 2 and receives chips of one type of Bin, the multi-layer tray mechanism 8 is used to place the material box, each material box can place 23 layers of material trays, and each layer of material tray can receive chips of one type of Bin, the Y-direction moving component is used to transport the material tray, and the XY-direction moving component 7 is used to sort the chips. The chip type sorting machine of the present invention can realize the function of sorting chips of dozens of bins at one time through the automatic tray stacking mechanism 4 and the multi-layer tray mechanism 8, solving the problem that the conventional test sorting machine can sort a small number of chips. It has the characteristics of small footprint and large number of bins sorted at one time.

[0028] A chip type sorting machine, the working process is as follows: 1. Place empty trays into the material boxes of the 4 groups of multi-layer tray mechanisms 8, place the trays of chips to be sorted into the IC entry mechanism 3, and place empty trays into the empty tray entry mechanism 2.

[0029] 2. The tray carrying the chips to be sorted is transported to the inside of the machine, i.e. the end of the track, through the tray track of the IC entry mechanism 3 to wait for sorting. After the tray is in place, the barcode reader 9 triggers the photo taking, identifies the Tray ID information, and uploads the ID information to the computer. The computer calculates and analyzes and resolves the Bin distribution coordinates of the chips in the tray.

[0030] 3. The empty tray is transported to the inside of the machine, i.e. the end of the track, through the track of the empty tray entry mechanism 2. After it is in place, the X-axis moving component 6 takes the empty tray away by clamping and translating and places it at the end of the tray track of the automatic tray output stacking mechanism 4, waiting for the placement of chips.

[0031] 4. The multi-layer tray mechanism 8 The material box makes a certain layer stay at the track entrance and exit through the lifting movement, and then the empty tray of this layer comes out of the material box and is conveyed to the end of the track to wait for the chip to be placed.

[0032] 5. When all sorting conditions are ready, the XY moving component 7 will move horizontally to the top of the tray of chips to be sorted, and suck a bin in the tray through the suction head.

[0033] 6. If the target placement position of the bin sucked by the XY moving component 7 is one of the three automatic tray stacking mechanisms 4, the XY moving component 7 will directly translate to the target position to place the chip. If the target placement position is the multi-layer tray mechanism 8, the XY moving component 7 will directly translate to the top of the in-and-out conveying track of the multi-layer tray mechanism 8 to place the chip.

[0034] 7. When the tray at the end of the in-and-out conveying track of one of the multi-layer tray mechanisms 8 has completed the placement of one bin, the tray is transferred back to the material box, the material box is raised and lowered, the next layer of trays is switched, and it is transferred to the end of the track to wait for the placement of chips. While the mechanism switches the trays, the XY moving component 7 turns to other mechanisms to continue placing the remaining bins, alternating.

[0035] 8. In summary, the three automatic tray stacking mechanisms 4 can be assigned three types of Bins, each multi-layer tray mechanism 8 can be assigned 23 types of Bins, and there are a total of four groups of multi-layer tray mechanisms 8, thereby achieving the purpose of sorting up to 95 types of Bins at one time.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip type sorting machine, characterized by: The invention comprises a large plate (5), a plurality of groups of multi-layer tray mechanisms (8) and six groups of stacking tray mechanisms. The plurality of groups of multi-layer tray mechanisms (8) are arranged on one side of the large plate (5), and six groups of stacking tray mechanisms are arranged above the other side of the large plate (5). The six groups of stacking tray mechanisms respectively comprise one IC entry mechanism (3) for being sorted, one empty tray exit mechanism (1), one empty tray entry mechanism (2) and three automatic tray exit and stacking mechanisms (4) which are arranged in sequence from left to right.

2. A chip type sorting machine according to claim 1, characterized in that: The number of the multi-layer material tray mechanisms (8) is 4 groups.

3. A chip type sorting machine according to claim 1, characterized in that: Each of the multi-layer material tray mechanisms (8) is provided with a material box inside, each material box is provided with 23 layers of material trays, and each layer of material trays can receive chips of one type of Bin.

4. A chip type sorting machine according to claim 1, characterized in that: Each of the multi-layer tray mechanisms (8) is provided with an in-and-out conveying track, which is used to convey the trays. The IC entry mechanism (3) for sorting, the empty tray exit mechanism (1), the empty tray entry mechanism (2) and the automatic tray exit stacking mechanism (4) are respectively provided with tray tracks. The in-and-out conveying track and the tray track are both arranged above the large plate (5).

5. The chip type sorting machine according to claim 1, characterized in that: The device also includes an XY moving assembly (7), which is installed above one end of the in-and-out conveying track. The XY moving assembly (7) is used to sort the chips. The XY moving assembly (7) can completely cover the in-and-out conveying tracks of four groups of multi-layer tray mechanisms (8), the tray tracks of the IC to be sorted entry mechanism (3), and the tray tracks of three automatic tray output stacking mechanisms (4) through movement in the X and Y directions.

6. A chip type sorting machine according to claim 1, characterized in that: It also includes a code reader (9), which is installed above the large plate (5) through a fixed bracket, and the installation position of the code reader (9) is located in the middle of the material tray track of the IC to be sorted entry mechanism (3).

7. The chip type sorting machine according to claim 1, characterized in that: It also includes an X-direction moving component (6), which is installed above the large plate (5) and is located above the six groups of stacking tray mechanisms. The X-direction moving component (6) can grab empty trays from the tray track of the empty tray entry mechanism (2) and place them into the tray tracks of the three automatic tray output stacking mechanisms (4).

8. A chip type sorting machine sorting method, applied to a chip type sorting machine according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1, placing empty trays into the material boxes of the four groups of multi-layer tray mechanisms (8), placing trays of chips to be sorted into the IC entry mechanism (3), and placing several layers of empty trays into the empty tray entry mechanism (2); S2. After the machine is started, the tray of chips to be sorted is transported to the inside of the machine through the tray track of the IC entry mechanism (3). After the tray is in place, the barcode reader (9) identifies the Tray ID information, and after computer analysis, resolves it to the Bin distribution coordinates in the tray; S3, while the barcode reader (9) identifies the Tray ID, the material box of the multi-layer material tray mechanism (8) moves up and down so that a certain layer of the material box stays at the entrance and exit of the track, and then the material tray of this layer is transferred out of the material box and translated to the end of the track; at the same time, the empty material tray entry mechanism (2) transports the empty tray from the material tray track into the machine, and the X-direction moving component (6) grabs the empty tray from the material tray track of the empty material tray entry mechanism (2) and places it on the material tray tracks of the three automatic tray output stacking mechanisms (4); S4, the XY moving component (7) picks up a Bin chip from the chip tray to be sorted, and moves it to the target empty tray for placement. After completing the moving of one Bin, it moves another Bin; If the target empty tray is a multi-layer tray mechanism (8), when one Bin is placed, the XY moving component (7) will place the chip on the other multi-layer tray mechanism (8); at the same time, the track will transport the placed Bin tray back to the material box, and the tray returns to the material box, the material box performs a lifting movement, and sends the next tray to the track entrance and exit, and then the next tray is transported to the end of the track to place the next Bin. The tray transporting action, lifting action, and chip placement action of the four multi-layer tray mechanisms (8) are performed alternately.

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