Metallized ceramic substrate structure and cutting method

Abstract

The invention discloses a metalized ceramic substrate structure and a cutting method, and relates to the technical field of ceramic substrate processing, the cutting method of the structure comprises the following steps: selecting a proper laser and a proper filter, and optimizing parameters of a laser cutting machine; dotting and line forming are carried out on the etched metalized ceramic substrate through a laser cutting machine; proper cutting parameters are selected, so that a laser dotting melting pit is of a spherical surface structure; the metalized ceramic substrate subjected to dotting and line forming is pulled into two parts through an edge pulling tool, and the section of each part is in an arc transition shape. The cutting method adopted by the invention is not only suitable for etched metallized ceramic substrates such as A < l > N-DBC, Al < N >-AMB and Al < 2 > O < 3 >-DBC, but also suitable for metallized ceramic substrates prepared through various technologies such as DBC, AMB, DPC, DBA and LAM, which shows that the method has wide applicability and can meet the cutting requirements of various metallized ceramic substrates.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic substrate processing, in particular to a metallized ceramic substrate structure and a cutting method. Background Art

[0002] Metallized ceramic substrates are high-performance electronic packaging materials and are widely used in electronic devices, but their reliability issues have always restricted their application. Currently, the industry mainly adopts two strategies to improve reliability:

[0003] Metal surface etching optimization: Etching a tiny structure "d imple" on the copper surface of the metallized ceramic substrate, which can be divided into two forms: complete etching and incomplete etching. This method effectively disperses the stress between the metal and ceramic interface by changing the metal surface morphology, thereby improving the overall reliability of the substrate.

[0004] Metal edge stepping treatment: Etching or processing the copper pattern edge of the metallized ceramic substrate to form a single-step or high-step step structure. This treatment can further relieve the internal stress between the metal and the ceramic and enhance the substrate's ability to resist deformation.

[0005] However, the above methods only optimize the metal layer and do not touch the most vulnerable ceramic part of the metallized ceramic substrate. Most failures of metallized ceramic substrates are caused by ceramic fracture, so in-depth optimization and structural design of the ceramic are required.

[0006] During the cutting process, although traditional laser cutting technology can achieve high-precision cutting, there is often a tip molten pit structure on the ceramic cross-section after cutting. In this state, even if there is a small micro-deformation, stress concentration will occur at the tip, thereby forming cracks and accelerating the fracture of the ceramic.

[0007] Based on this, a metallized ceramic substrate structure and a cutting method are now provided, which can eliminate the disadvantages of the existing structure. Summary of the invention

[0008] The purpose of the present invention is to provide a metallized ceramic substrate structure and a cutting method to solve the problem in the background technology that a tip molten pit structure often exists on the ceramic cross section after cutting. In this state, even when there is a very small micro-deformation, stress concentration will be formed at the tip, thereby forming cracks and accelerating the fracture of the ceramic.

[0009] To achieve the above object, the present invention provides the following technical solutions:

[0010] A method for cutting a metallized ceramic substrate structure comprises the following steps:

[0011] S1: Select the appropriate laser and filter to optimize the parameters of the laser cutting machine;

[0012] S2: Marking dots and lines on the etched metallized ceramic substrate using a laser cutting machine;

[0013] S3: Select appropriate cutting parameters to make the laser-marked molten pit present a spherical structure;

[0014] S4: The metallized ceramic substrate that has been dotted and lined is bent into two parts by a bending tool, so that the cross section of each part has an arc transition shape.

[0015] Preferably, in a metallized ceramic substrate structure, in step S2, the etched metallized ceramic substrate is Al N-DBC, Al N-AMB and Al 2O3-DBC;

[0016] Among them, in step S2, the metallized ceramic substrate is not limited to being prepared by DBC, AMB, DPC, DBA, LAM processes, as well as chemical plating / electroplating, thick film printing, thin film evaporation / sputtering diversified technologies.

[0017] Preferably, in a metallized ceramic substrate structure, in step S3, the spherical description of the molten pit generally refers to any transitional curved surface with a smooth arc shape, rather than a perfect spherical surface in a strict sense, wherein the molten pit is particularly in the form of a hemispherical surface;

[0018] The molten pit is particularly in the form of a hemispherical surface.

[0019] Among them, the arc-shaped transition surface not only includes standard surfaces such as spherical surfaces, ellipsoidal surfaces, hyperboloids, and paraboloids, but also includes approximate surface forms such as spherical surfaces, ellipsoidal surfaces, hyperboloidal surfaces, and paraboloidal surfaces with smooth transitions and no abrupt turns.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The cutting method adopted by the present invention is not only applicable to metallized ceramic substrates that have been etched such as Al N-DBC, Al N-AMB and Al 2O3-DBC, but also applicable to metallized ceramic substrates prepared by various processes such as DBC, AMB, DPC, DBA, LAM, etc., which shows the wide applicability of the method and can meet the cutting needs of various metallized ceramic substrates.

[0022] 2. The metallized ceramic substrate structure produced by the present invention is provided with a number of molten pits with spherical curved surface structures. When the deformation degree of the ceramic is certain, there will be more molten pits to share the deformation, which will cause the deformation of each molten pit to become smaller. In addition, the spherical curved surface structure of the molten pit improves the durability and stability of the substrate under extreme temperature conditions by dispersing stress and reducing the tip effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a flowchart of an embodiment of the cutting method for the metallized ceramic substrate of the present invention.

[0024] Figure 2 This is a schematic structural diagram of the metallized ceramic substrate of the present invention.

[0025] Figure 3 This is a schematic structural diagram of the metallized ceramic substrate after being broken.

[0026] Figure 4 This is a comparison diagram of the arc-shaped appearance of the melting pit incision and the tip appearance of the melting pit incision of the present invention.

[0027] Annotation of reference numerals: 1. Metallized ceramic substrate; 2. Melting pit. Detailed implementation manners

[0028] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0029] In one embodiment, as Figure 1 shown, a cutting method for a metallized ceramic substrate structure includes the following steps:

[0030] S1: Select a suitable laser and filter, and optimize the parameters of the laser cutting machine;

[0031] S2: Punch dots into lines on the etched metallized ceramic substrate 1 by a laser cutting machine;

[0032] S3: Select suitable cutting parameters to make the melting pits 2 formed by laser dotting present a spherical structure;

[0033] S4: Use a flanging tool to break the metallized ceramic substrate 1 that has been punched into lines into two parts, so that the cross-section of each part contains a shape with an arc transition.

[0034] In one embodiment, as Figure 2 — Figure 4 shown, for a metallized ceramic substrate structure, in step S2, the etched metallized ceramic substrate 1 is AlN-DBC, AlN-AMB and Al2O3-DBC;

[0035] Among them, in step S2, the metallized ceramic substrate 1 is not limited to being prepared by DBC, AMB, DPC, DBA, LAM processes, as well as diversified technologies such as electroless plating / electroplating, thick film printing, and thin film evaporation / sputtering.

[0036] In one embodiment, as Figure 2 — Figure 4As shown, a metallized ceramic substrate structure, in step S3, the spherical surface description of the molten pit 2 generally refers to all transition surfaces with smooth arc shapes, rather than a perfect spherical surface in a strict sense;

[0037] The melting pit 2 is particularly in the form of a hemispherical surface.

[0038] In one embodiment, Figure 2 — Figure 4 As shown, a metallized ceramic substrate structure, the arc-shaped transition surface not only covers standard surfaces such as spherical surfaces, ellipsoidal surfaces, hyperboloids, and paraboloids, but also includes approximate surface shapes such as spherical surfaces, ellipsoidal surfaces, hyperboloidal surfaces, and paraboloids with smooth transitions and no abrupt turns.

[0039] Embodiment 1:

[0040] This embodiment adopts a cutting method of a metallized ceramic substrate structure. Specifically, the metallized ceramic substrate 1 in this embodiment is AlN-DBC. The specific steps are as follows:

[0041] S1: Select CO2 laser and filter to control the marking speed at 260mm / s and the dot depth at 0.1mm~0.2mm.

[0042] S2: Dot lines on the etched Al N-DBC substrate. The specifications of Al N-DBC are 138*190*0.635mm.

[0043] S3: Select appropriate cutting parameters to make the laser-marked molten pit present a hemispherical structure.

[0044] S4: The ceramic substrate that has been dotted is bent into small units by a bend tool, so that the laser cut section of each small unit has a hemispherical transition shape.

[0045] Embodiment 2:

[0046] This embodiment adopts a cutting method of a metallized ceramic substrate structure. Specifically, the metallized ceramic substrate 1 in this embodiment is AlN-AMB. The specific steps are as follows:

[0047] S1: Select CO2 laser and filter to control the marking speed at 220mm / s and the dot depth in the range of 0.20mm to 0.30mm.

[0048] S2: Dot lines on the etched Al N-AMB substrate. The specifications of Al N-AMB are 138*190*0.635mm.

[0049] S3: Select appropriate cutting parameters to make the laser-marked molten pit present a hemispherical structure.

[0050] S4: The ceramic substrate that has been dotted is bent into small units by a bend tool, so that the laser cut section of each small unit has a hemispherical transition shape.

[0051] Embodiment three:

[0052] This embodiment adopts a cutting method of a metallized ceramic substrate structure. Specifically, the metallized ceramic substrate 1 in this embodiment is Al 2O3-DBC. The specific steps are as follows:

[0053] S1: Select a picosecond laser and filter to control the marking speed at 400 mm / s and the dot depth in the range of 0.10 mm to 0.20 mm.

[0054] S2: Dot lines on the etched Al 2O3-DBC substrate. The specifications of Al 2O3-DBC are 138*190*0.38mm.

[0055] S3: Select appropriate cutting parameters to make the laser-marked molten pit present a hemispherical structure.

[0056] S4: The ceramic substrate that has been dotted is bent into small units by a bending tool, so that the laser-cut section of each small unit has a semi-spherical transition shape.

[0057] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A method for cutting a metallized ceramic substrate structure, characterized in that: The following steps are involved: S1: Select the appropriate laser and filter to optimize the parameters of the laser cutting machine; S2: using a laser cutting machine to mark dots and lines on the etched metallized ceramic substrate (1); S3: Select appropriate cutting parameters so that the laser-marked molten pit (2) presents a spherical structure; S4: using a bend tool to bend the metallized ceramic substrate (1) which has been dotted into lines, into two parts, so that the cross section of each part has an arc transition shape.

2. A metallized ceramic substrate structure, characterized in that: According to the method for cutting a metallized ceramic substrate according to claim 1, in step S2, the etched metallized ceramic substrate (1) is AlN-DBC, AlN-AMB and Al2O3-DBC; In step S2, the metallized ceramic substrate (1) is not limited to being prepared by DBC, AMB, DPC, DBA, LAM processes, as well as chemical plating / electroplating, thick film printing, thin film evaporation / sputtering diversified technologies.

3. A metallized ceramic substrate structure, characterized in that: According to the method for cutting a metallized ceramic substrate according to claim 1, in step S3, the spherical surface description of the molten pit (2) generally refers to any transitional curved surface with a smooth arc shape, rather than a perfect spherical surface in a strict sense; The melting pit (2) is particularly in the form of a hemispherical surface.

4. The metallized ceramic substrate structure according to claim 3, characterized in that: The arc-shaped transition surface not only includes standard surfaces such as spherical surfaces, ellipsoidal surfaces, hyperboloidal surfaces, and paraboloidal surfaces, but also includes approximate surface forms such as spherical surfaces, ellipsoidal surfaces, hyperboloidal surfaces, and paraboloidal surfaces that have smooth transitions and no abrupt turns.

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