Cutting fluid dewatering mechanism for photovoltaic silicon wafer cutting machine

By introducing a heat compensation mechanism into the cutting fluid water removal device of the photovoltaic silicon wafer cutting machine, and using the combination of the stirring rod and the second sliding reciprocating screw, uniform preheating of the cutting fluid is achieved, solving the problems of long heating time and low water removal efficiency in the prior art, and improving the water removal efficiency and production efficiency.

CN120023928AInactive Publication Date: 2025-05-23JIANGSU DEBI MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202510407878.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-02
Publication Date
2025-05-23
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The cutting fluid water removal device of the existing photovoltaic silicon wafer cutting machine takes a long time to heat the water-containing cutting fluid, and the water removal efficiency is low, resulting in waste of resources and low production efficiency.

Method used

A cutting fluid water removal mechanism for a photovoltaic silicon wafer cutting machine is designed, and a heat compensation mechanism is used to achieve uniform preheating of the cutting fluid and improve the water removal efficiency through the cooperation of the stirring rod and the second sliding reciprocating screw.

Benefits of technology

Through the use of the thermal compensation mechanism, the heating time of cutting fluid is significantly shortened, the water removal efficiency is improved, resource waste is reduced, and production efficiency is improved.

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Abstract

The invention discloses a cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine, and relates to the related field of photovoltaic silicon wafer cutting machines, the cutting fluid dewatering mechanism comprises a treatment box installed in the photovoltaic silicon wafer cutting machine, and the left side and the right side of the bottom of the treatment box are connected with a water inlet pipe and a water outlet pipe respectively; the bottom position of the treatment box is further divided into two spaces through a partition plate, and a main steam exhaust port is formed in the top position of the treatment box; a stirring rod is rotationally arranged at the circle center position of the heating cylinder in a penetrating manner; and the gas reminding mechanism can quickly discharge residual gas at the bottom of the heat preservation groove, and can remind workers according to the sharp degree of gas discharge sound. According to the cutting fluid dewatering mechanism for the photovoltaic silicon wafer cutting machine, the thermal compensation mechanism is arranged, water-containing cutting fluid between the treatment box and the cavity of the heating barrel can be fully preheated through operation of the thermal compensation mechanism, it is guaranteed that the water-containing cutting fluid is evenly preheated, and then the efficiency is higher in the dewatering process.
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Description

Technical Field

[0001] The invention relates to the technical field related to photovoltaic silicon wafer cutting machines, and in particular to a cutting fluid dewatering mechanism for photovoltaic silicon wafer cutting machines. Background Art

[0002] The online recovery technology of mortar in silicon wafer cutting has begun to rise in China. More and more manufacturers have begun to purchase equipment to recycle mortar by themselves, but the moisture in the recovered cutting fluid will increase with the number of recycling times. Although different models have different requirements for the upper limit of the water content of the cutting fluid, the lower the water content in the cutting fluid, the higher the product qualification rate. Now many manufacturers specializing in recycling mortar use distillation equipment to distill the separated cutting fluid, but the existing distillation equipment is relatively expensive, and has low thermal energy utilization, serious waste, and is time-consuming, which is not conducive to use.

[0003] The cutting fluid dehydration device used for silicon wafer cutting machines in the prior art has a complex structure and high production cost. In addition, the dehydration efficiency of the cutting fluid dehydration device in the prior art is low. The supplied cutting fluid is dehydrated in a distillation chamber. Since the distillation chamber is large in size, the temperature rise of the cutting fluid in the distillation chamber is relatively slow, resulting in low dehydration efficiency of the cutting fluid dehydration device in the prior art. In order to overcome the above-mentioned defects, reference can be made to a cutting fluid dehydration structure for a silicon wafer cutting machine disclosed in the prior art (application number CN201510639958.X, application date 2015-09-30 Chinese patent). The dehydration structure is connected to the heating steam pipe through the exhaust pipe, and the drain pipe is connected to the heating water pipe. The heating steam pipe and the heating water pipe are both coiled in the preheating box. The water vapor discharged from the heating box and the heated cutting fluid are led into the heating steam pipe and the heating water pipe, and the cutting fluid in the preheating box is preheated, saving energy. At the same time When the cutting fluid in the preheating box is preheated, the water vapor in the heating steam pipe and the cutting fluid in the heating water pipe will be cooled by the cutting fluid in the preheating box, and the water vapor and cutting fluid discharged from the exhaust nozzle and the water discharge nozzle are at low temperatures; and a cutting fluid dehydration device for a silicon wafer cutting machine disclosed in the prior art (application number CN201510643956.8, application date 2015-09-30 Chinese patent) can be referred to. The dehydration device is coiled in the inner cavity through the exhaust pipe and the water outlet pipe. During actual use, the dehydrated cutting fluid and water vapor are discharged from the water outlet pipe and the exhaust pipe respectively. The exhaust pipe and the water outlet pipe coiled in the inner cavity can preheat the unheated cutting fluid in the inner cavity, and the temperature of the water vapor in the exhaust pipe and the cutting fluid in the water outlet pipe is reduced during the preheating process, thereby improving the dehydration efficiency of the cutting fluid and avoiding scalding the operator by the cutting fluid or water vapor, thereby improving the safety performance of the cutting fluid dehydration device.

[0004] Although the above device can solve the problem of speeding up the work of cutting fluid, in actual work, especially when heating the cutting fluid containing water, a lot of time is needed to heat it. When the liquid is replaced again, a lot of time will be wasted by distillation.

[0005] Therefore, we propose a cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine in order to solve the above-mentioned problems. Summary of the invention

[0006] The purpose of the present invention is to provide a cutting fluid dehydration mechanism for a photovoltaic silicon wafer cutting machine to solve the problem that the dehydration devices currently on the market proposed in the above background technology require a lot of time to heat the water-containing cutting fluid during actual operation, and a lot of time is wasted when the liquid is replaced by distillation.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine, comprising a processing box installed inside the photovoltaic silicon wafer cutting machine, the left and right sides of the bottom of the processing box are respectively connected with a water inlet pipe and a water outlet pipe, the bottom position of the processing box is also separated by a partition into two spaces, and the top position of the processing box is provided with a main exhaust port; a heating cylinder is fixedly installed at the bottom inner position of the processing box, a heating element is installed at the inner position of the heating cylinder, a stirring rod is rotatably arranged through the center position of the heating cylinder, the rotation of the stirring rod can realize the operation of a thermal compensation mechanism, and the thermal compensation mechanism can realize that the hot gas inside the heating cylinder is transported to the cavity of the processing box near the water inlet pipe through the outlet pipe; a gas discharge port is opened at the upper end position of the heating cylinder, the outer side of the gas discharge port corresponds to the insulation tank opened at the upper position inside the processing box, and an exhaust reminder mechanism is arranged inside the insulation tank, and the exhaust reminder mechanism can quickly discharge the gas remaining at the bottom of the insulation tank, and can remind the staff according to the sharpness of the gas discharge sound.

[0008] Preferably, the thermal compensation mechanism includes a second sliding reciprocating screw fixed at the top position of the stirring rod, the outer side of the second sliding reciprocating screw extends into the interior of the air cartridge and is connected to the inner side of the connecting sleeve, a square piston block is fixed at the top position of the connecting sleeve, a one-way air inlet valve is provided on the outer side of the upper end of the air cartridge, and the air cartridge is connected to one end of the air outlet pipe at a side position below the one-way air inlet valve.

[0009] Preferably, the water inlet pipe is connected to the water supply system to supply cutting fluid into the processing box, the water outlet pipe leads the dehydrated cutting fluid to the target position, the left and right sides of the heating cylinder are respectively provided with an inlet and an outlet controlled by a solenoid valve, a one-way air outlet valve is provided inside the air outlet pipe, and the air outlet pipe is arranged as a hose, and the outer end of the air outlet pipe is located between the inner side of the processing box and the outer wall of the heating cylinder.

[0010] Preferably, the water inlet pipe includes an impeller rotatably arranged inside the water inlet pipe, and a first sliding reciprocating screw is fixed at the center position of the impeller, and a threaded connecting sleeve is threadedly connected to the outer position of the first sliding reciprocating screw, and the front and rear sides of the threaded connecting sleeve are rotatably connected to one end of a movable rod, and the other end of the movable rod is fixed to the outer end position of the outlet pipe.

[0011] Preferably, the air outlet pipe forms a swing structure between the processing box and the heating cylinder through a movable rod, and two groups of the air outlet pipes are symmetrically arranged about the center of the processing box.

[0012] Preferably, the exhaust reminder mechanism includes a piston disk that is fitted onto the inner wall of the insulation tank, and two groups of through grooves are symmetrically opened inside the bottom of the piston disk about the center position of the piston disk, and a spiral screw rod passes through the through groove, and the outer side of the spiral screw rod is fixed to the head end position of the reset spring, and the tail end of the reset spring is fixed to the inner wall of the processing box, and the spiral screw rod is arranged at one end inside the piston disk and is spirally connected to the rotating gear, and the outer side of the rotating gear is meshed with the teeth of the closing block, and the closing block is slidably arranged inside the through groove.

[0013] Preferably, the through groove is arranged in an arc shape, and the through groove passes through a closed structure between a closing block and a piston disc, the through groove is opened through the inside of the piston disc, and the bottom outer side of the rotating gear is rotatably arranged inside the piston disc.

[0014] Preferably, the two groups of closing blocks move in the same direction, and the outer sides of the closing blocks are fitted to the inside of the through grooves via sealing pads.

[0015] Preferably, a top block is fixed to the upper end of the piston disc, the top block and the protruding position of the elastic piston rod are in the same vertical line, the outer side of the elastic piston rod is slidably arranged on both sides of the auxiliary channel, and the auxiliary channel is connected to the secondary exhaust port.

[0016] Preferably, the auxiliary channel is provided on the inner wall of the processing box, the secondary exhaust port is provided on the outer wall of the processing box, and the projection of the elastic piston rod forms an elastic sliding structure with the channels on both sides of the auxiliary channel through the movement of the top block.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: the cutting fluid dewatering mechanism for the photovoltaic silicon wafer cutting machine is provided with a thermal compensation mechanism, and the operation of the thermal compensation mechanism can fully preheat the aqueous cutting fluid between the processing box and the heating cylinder cavity, and ensure that the aqueous cutting fluid is preheated uniformly, thereby achieving a higher efficiency in the dewatering process. The specific contents are as follows: 1. A stirring rod is provided, and the stirring rod rotates inside the heating cylinder to uniformly heat the aqueous cutting fluid inside the heating cylinder, and the rotation of the stirring rod drives the second sliding reciprocating screw to rotate inside the air storage cylinder, so that the threaded connection sleeve and the piston block continuously move back and forth, and the hot air inside the heating cylinder is replaced to the bottom of the cavity close to the water inlet pipe through the one-way air inlet valve, so that the hot air preheats the aqueous cutting fluid, and the liquid inlet through the water inlet pipe can make the air outlet pipe swing back and forth, so that the aqueous cutting fluid can be well and evenly preheated.

[0018] 2. A piston plate is provided. The movement of the piston plate can change the sound of gas delivery. Initially, the gas pushes the movement of the piston plate, causing the slot to open slowly. The smaller the gap, the harsher the sound. When a sharp sound is heard, the staff needs to stay away from one side of the secondary exhaust port and the main exhaust port to avoid burns. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the main structure of the present invention; Figure 2 This is a schematic diagram of the main cross-sectional structure of the processing box of the present invention; Figure 3 It is a schematic diagram of the partial cross-sectional structure of the heating tube of the present invention; Figure 4 This is a schematic diagram of the main structure of the heating element of the present invention; Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in the middle; Figure 6 This is a schematic diagram of the front cross-sectional structure of the square groove of the present invention; Figure 7 This is a schematic diagram of the structure of the piston disc of the present invention when viewed from above; Figure 8 It is a schematic diagram of the top cross-sectional structure of the piston disc of the present invention; Fig. 9 It is a schematic diagram of the main structure of the top block of the present invention.

[0020] In the figure: 1. treatment box; 2. water inlet pipe; 201. impeller; 202. first sliding reciprocating screw; 203. threaded connecting sleeve; 204. movable rod; 3. water outlet pipe; 4. partition; 5. heating cylinder; 6. heating element; 7. stirring rod; 8. second sliding reciprocating screw; 9. air storage cylinder; 10. connecting sleeve; 11. piston block; 12. one-way air inlet valve; 13. air outlet pipe; 14. steam discharge port; 15. insulation tank; 16. piston plate; 17. through groove; 18. spiral screw; 19. reset spring; 20. rotating gear; 21. closing block; 22. through groove; 23. top block; 24. elastic piston rod; 25. auxiliary channel; 26. secondary exhaust port; 27. main exhaust port. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. See also Figure 1-Figure 9 The present invention provides the following technical solution: a cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine.

[0022] Embodiment 1: In order to solve the problem that the dewatering device currently on the market takes a lot of time to heat the water-containing cutting fluid, and when the liquid is replaced by distillation, a lot of time is wasted, please refer to the attached Figure 1 -Attached Figure 6, comprising a processing box 1 installed inside the photovoltaic silicon wafer cutting machine, the left and right sides of the bottom of the processing box 1 are respectively connected with a water inlet pipe 2 and a water outlet pipe 3, the bottom position of the processing box 1 is also separated by a partition 4 into two spaces, and the top position of the processing box 1 is provided with a main exhaust port 27; a heating cylinder 5 is fixedly installed at the bottom inner position of the processing box 1, a heating element 6 is installed at the inner position of the heating cylinder 5, a stirring rod 7 is rotatably provided at the center position of the heating cylinder 5, the rotation of the stirring rod 7 can realize the operation of the thermal compensation mechanism, and the thermal compensation mechanism can realize the hot air ventilation inside the heating cylinder 5 The steam is transported to the cavity of the treatment box 1 near the water inlet pipe 2 through the outlet pipe 13; a steam discharge port 14 is opened at the upper end of the heating cylinder 5, and the outer side of the steam discharge port 14 corresponds to the insulation tank 15 opened at the upper position inside the treatment box 1; the thermal compensation mechanism includes a second sliding reciprocating screw 8 fixed at the top position of the stirring rod 7, and the outer side of the second sliding reciprocating screw 8 extends into the interior of the gas storage cylinder 9 and is connected to the inner side of the connecting sleeve 10. A square piston block 11 is fixed at the top position of the connecting sleeve 10, and a square piston block 11 is fixed at the top of the gas storage cylinder 9. There is a one-way air inlet valve 12, and the air storage cylinder 9 is connected to one end of the air outlet pipe 13 near the side below the one-way air inlet valve 12; the water inlet pipe 2 is connected to the water supply system to supply cutting fluid to the processing box 1, and the water outlet pipe 3 leads the dehydrated cutting fluid to the target position. The left and right sides of the heating cylinder 5 are respectively provided with an inlet and an outlet controlled by a solenoid valve. A one-way air outlet valve is provided inside the air outlet pipe 13, and the air outlet pipe 13 is a hose setting, and the outer end of the air outlet pipe 13 is between the inner side of the processing box 1 and the outer wall of the heating cylinder 5; the water inlet pipe 2 includes a rotating setting An impeller 201 is inside the water inlet pipe 2, and a first sliding reciprocating screw 202 is fixed at the center position of the impeller 201. A threaded connecting sleeve 203 is threadedly connected to the outer position of the first sliding reciprocating screw 202. The front and rear sides of the threaded connecting sleeve 203 are rotatably connected to one end of a movable rod 204, and the other end of the movable rod 204 is fixed to the outer end position of the outlet pipe 13; the outlet pipe 13 forms a swing structure between the processing box 1 and the heating tube 5 through the movable rod 204, and two groups of outlet pipes 13 are symmetrically arranged about the center position of the processing box 1.

[0023] First, the aqueous cutting fluid discharged by the photovoltaic silicon wafer cutting machine is transported through the water inlet pipe 2, and then the aqueous cutting fluid is transported to the cavity connected to one side of the water inlet pipe 2. At this time, the aqueous cutting fluid is allowed to enter the interior of the heating cylinder 5 by opening the solenoid valve, and then the heating element 6 inside the heating cylinder 5 is started, so that the heating cylinder 5 heats the aqueous cutting fluid. The water in the heated aqueous cutting fluid will be discharged through the gas discharge port 14, and the cutting fluid will be discharged through the outlet of the heating cylinder 5, and can be transported to the traction position through the water outlet pipe 3. In order to speed up the processing effect of the aqueous cutting fluid in the later stage, the motor connected to the bottom of the stirring rod 7 is started, and the output end of the motor can drive the stirring rod 7 and the second sliding reciprocating screw 8 to rotate inside the heating cylinder 5, so that the stirring rod 7 stirs the aqueous cutting fluid inside the heating cylinder 5. In addition, during the rotation of the second sliding reciprocating screw 8 inside the gas storage cylinder 9, the sliding connecting sleeve 10 inside the gas storage cylinder 9 can be moved in the square by the piston block 11. The square groove is set on the inner wall of the gas cylinder 9, wherein the outer wall of the piston block 11 is fitted with the inner wall of the square groove in the gas cylinder 9. The gas cylinder 9 is filled with hot air through the one-way air inlet valve 12, and the hot air will be transported to the cavity containing the aqueous cutting fluid, so that the air outlet pipe 13 fills the cavity with heat. At this time, the aqueous cutting fluid can be preheated conveniently. In addition, when the aqueous cutting fluid is transported through the water inlet pipe 2, the aqueous cutting fluid will drive the impeller 201 to rotate inside the water inlet pipe 2. Then, the impeller 201 can drive the first sliding reciprocating screw 202 to rotate, so that the threaded connection sleeve 203 threadedly connected to the outer side of the first sliding reciprocating screw 202 moves back and forth. Since the outer side of the threaded connection sleeve 203 is rotatably arranged on one side of the movable rod 204, and the other end of the movable rod 204 is fixed to the outer side of the air outlet pipe 13, the air outlet pipe 13 can swing back and forth between the processing box 1 and the heating cylinder 5, so that the water-containing cutting fluid in the cavity can be fully heated.

[0024] Embodiment 2: In order to remind the staff, the main exhaust port 27 and the secondary exhaust port 26 can refer to the attached Figure 1 , Attachment Figure 2 and attached Figure 7 -Attached Fig. 9An exhaust reminder mechanism is provided at the internal position of the heat preservation tank 15. The exhaust reminder mechanism can quickly discharge the gas remaining at the bottom of the heat preservation tank 15, and can remind the staff according to the sharpness of the gas exhaust sound. The exhaust reminder mechanism includes a piston disk 16 that is fitted to the inner wall of the heat preservation tank 15. Two groups of through grooves 17 are symmetrically opened inside the bottom of the piston disk 16 about the center position of the piston disk 16. A spiral screw 18 is penetrated inside the through groove 17. The outer side of the spiral screw 18 is fixed to the head end position of the return spring 19, and the tail end of the return spring 19 is fixed to the inner wall of the processing box 1. One end of the spiral screw 18 is arranged inside the piston disk 16 and is spirally connected to the rotating gear 20. The outer side of the rotating gear 20 is meshed with the teeth of the closing block 21. The closing block 21 is slidably arranged inside the through groove 22; the through groove 22 is The through groove 22 is arranged in an arc shape, and the through groove 22 passes through the closed structure between the closing block 21 and the piston disc 16. The through groove 22 is opened through the inside of the piston disc 16, and the bottom outer side of the rotating gear 20 is rotatably arranged inside the piston disc 16; the movement direction of the two groups of closing blocks 21 is the same, and the outer side of the closing block 21 is fitted to the inside of the through groove 22 through a sealing gasket; a top block 23 is also fixed at the upper end position of the piston disc 16, and the protruding position of the top block 23 and the elastic piston rod 24 are in the same vertical line, and the outer side of the elastic piston rod 24 is slidably arranged on both sides of the auxiliary channel 25, and the auxiliary channel 25 is connected with the secondary exhaust port 26; the auxiliary channel 25 is opened on the inner wall of the processing box 1, and the secondary exhaust port 26 is opened on the outer wall of the processing box 1, and the convex block of the elastic piston rod 24 forms an elastic sliding structure with the channels on both sides of the auxiliary channel 25 through the movement of the top block 23.

[0025] When the heating element 6 heats the aqueous cutting fluid, the water is vaporized to generate water vapor, which is transported to the inside of the heat preservation groove 15 through the gas discharge port 14, so that the water vapor squeezes one side of the piston disc 16. A large amount of water vapor will accumulate inside the heat preservation groove 15, and the water vapor will push the piston disc 16 to move, so that the piston disc 16 slides inside the heat preservation groove 15, so that the spiral screw 18 moves inside the through groove 17, and because the spiral screw 18 and the rotating gear 20 are spirally connected and have a large pitch, the rotating gear 20 set inside the piston disc 16 is driven to rotate, so that the rotating gear 20 The movable gear 20 can drive the closing block 21 to move during the rotation process, so that the closing block 21 can slowly open the through slot 22. When the through slot 22 opens a gap, water vapor will flow through the gap, and a sharp sound will be generated, which can remind the surrounding staff to leave. When it contains a large amount of water vapor, the piston disc 16 moves to the maximum position, and the top block 23 fixed on the top of the piston disc 16 squeezes the convex block on one side of the elastic piston rod 24, so that the elastic piston rod 24 slides in the cavity on both sides of the auxiliary channel 25, thereby accelerating the flow of water vapor on one side of the secondary exhaust port 26, thereby accelerating the discharge of water vapor.

[0026] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine, comprising a processing box (1) installed inside the photovoltaic silicon wafer cutting machine, wherein the bottom left and right sides of the processing box (1) are respectively connected to a water inlet pipe (2) and a water outlet pipe (3), the bottom of the processing box (1) is also divided into two spaces by a partition (4), and the top of the processing box (1) is provided with a main exhaust port (27); Features: A heating cylinder (5) is fixedly installed inside the bottom end of the processing box (1), and a heating element (6) is installed inside the heating cylinder (5). A stirring rod (7) is rotatably arranged through the center of the heating cylinder (5). The rotation of the stirring rod (7) can realize the operation of a heat compensation mechanism. The heat compensation mechanism can realize that the hot gas inside the heating cylinder (5) is transported to the cavity of the processing box (1) near the water inlet pipe (2) through the gas outlet pipe (13); a gas discharge port (14) is opened at the upper end of the heating cylinder (5), and the outer side of the gas discharge port (14) corresponds to the heat preservation tank (15) opened at the upper part of the processing box (1). An exhaust reminder mechanism is arranged inside the heat preservation tank (15), and the exhaust reminder mechanism can quickly discharge the gas remaining at the bottom of the heat preservation tank (15).

2. The cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine according to claim 1, characterized in that: The thermal compensation mechanism comprises a second sliding reciprocating screw (8) fixed at the top position of the stirring rod (7); the outer side of the second sliding reciprocating screw (8) extends into the interior of the gas storage cylinder (9) and is connected to the inner side of the connecting sleeve (10); the gas storage cylinder (9) is fixed to the inner top of the heating cylinder (5); a square piston block (11) is fixed to the top of the connecting sleeve (10); a one-way air intake valve (12) is arranged on the outer side of the upper end of the gas storage cylinder (9); and the gas storage cylinder (9) is connected to one end of the air outlet pipe (13) at a position below the one-way air intake valve (12).

3. The cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine according to claim 2, characterized in that: The water inlet pipe (2) is connected to the water supply system to supply cutting fluid into the processing box (1); the water outlet pipe (3) guides the cutting fluid after dehydration to the target position; the left and right sides of the heating cylinder (5) are respectively provided with an inlet and an outlet controlled by a solenoid valve; a one-way air outlet valve is provided inside the air outlet pipe (13); the air outlet pipe (13) is provided in the form of a hose, and the outer end of the air outlet pipe (13) is located between the inner side of the processing box (1) and the outer wall of the heating cylinder (5).

4. The cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine according to claim 1, characterized in that: The water inlet pipe (2) comprises an impeller (201) rotatably arranged inside the water inlet pipe (2), and a first sliding reciprocating screw (202) is fixed at the center position of the impeller (201), a threaded connection sleeve (203) is threadedly connected at the outer position of the first sliding reciprocating screw (202), and the front and rear sides of the threaded connection sleeve (203) are both rotatably connected to one end of a movable rod (203), and the other end of the movable rod (203) is fixed to the outer end position of the air outlet pipe (13).

5. The cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine according to claim 4, characterized in that: The air outlet pipe (13) forms a swing structure between the processing box (1) and the heating cylinder (5) through a movable rod (203), and two groups of the air outlet pipe (13) are symmetrically arranged about the center of the processing box (1).

6. The cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine according to claim 1, characterized in that: The exhaust reminder mechanism comprises a piston disk (16) which is fitted on the inner wall of the heat preservation groove (15); two groups of through grooves (17) are symmetrically opened inside the bottom of the piston disk (16) about the center position of the piston disk (16); a spiral screw (18) is passed through the inside of the through groove (17); the outer side of the spiral screw (18) is fixed to the head end position of the return spring (19); the tail end of the return spring (19) is fixed to the inner wall of the processing box (1); one end of the spiral screw (18) which is arranged inside the piston disk (16) is spirally connected to the rotating gear (20); the outer side of the rotating gear (20) is meshed with the teeth of the closing block (21); the closing block (21) is slidably arranged inside the through groove (22).

7. The cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine according to claim 6, characterized in that: The through groove (22) is arranged in an arc shape, and the through groove (22) passes through a closed structure between a closing block (21) and a piston plate (16). The through groove (22) is opened through the inside of the piston plate (16), and the bottom outer side of the rotating gear (20) is rotatably arranged inside the piston plate (16).

8. The cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine according to claim 6, characterized in that: The moving directions of the two groups of closing blocks (21) are the same, and the outer sides of the closing blocks (21) are fitted to the inside of the through groove (22) via a sealing gasket.

9. The cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine according to claim 6, characterized in that: A top block (23) is also fixed at the upper end of the piston disc (16), and the top block (23) and the protruding position of the elastic piston rod (24) are located on the same vertical line. The outer side of the elastic piston rod (24) is slidably arranged at the two sides of the auxiliary channel (25), and the auxiliary channel (25) is connected to the secondary exhaust port (26).

10. The cutting fluid dewatering mechanism for a photovoltaic silicon wafer cutting machine according to claim 9, characterized in that: The auxiliary channel (25) is provided on the inner wall of the processing box (1), the secondary exhaust port (26) is provided on the outer wall of the processing box (1), and the projection of the elastic piston rod (24) forms an elastic sliding structure with the channels on both sides of the auxiliary channel (25) through the movement of the top block (23).

Citation Information

Patent Citations

  • Cutting fluid dehydrating structure for silicon wafer cutting machine

    CN105235083A

  • Cutting fluid dewatering device for silicon slice cutting machine

    CN105235084A