Plastic packaging device for semiconductor device

Abstract

The invention relates to the technical field of plastic packaging devices, and provides a semiconductor device plastic packaging device which comprises a forming plate arranged between an upper mold and a lower mold, the forming plate is provided with a forming hole and a runner hole, and the upper mold and the lower mold are configured to block the top and the bottom of the forming hole in a one-to-one correspondence mode. The runner hole is communicated with the molding space, so that a molding space for molding a to-be-plastically packaged product is formed; the runner plate is arranged in the runner hole in a lifting manner and is used for guiding the molten plastic package material to the forming space; and the pushing piece is movably arranged on the lower die and is configured to push the runner plate to ascend after moving, so that the top surface of the runner plate and the top surface of the forming plate are coplanar, and the plastic packaging material which is originally remained in the corner is exposed on a relatively flat surface and is directly scraped off. By means of the technical scheme, the technical problems that in the cleaning process of a plastic packaging device after forming and discharging in the related technology, in the cleaning process, plastic packaging materials remaining in corners of a groove flow channel are cleaned through sheet-shaped objects, operation is tedious, and cleaning is not thorough easily are solved.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the technical field of plastic packaging devices, and in particular, to a plastic packaging device for a semiconductor device. Background Art

[0002] The semiconductor device manufacturing process is divided into front-end and back-end processes, among which the plastic encapsulation process is mainly completed in the back-end process of semiconductor manufacturing. This process is to extrude the hot molten plastic encapsulation material into the mold cavity, so that the molten plastic encapsulation material wraps the product to be encapsulated to produce a plastic encapsulation body.

[0003] At present, for special types of plastic-sealed bodies, such as a row of identical plastic-sealed bodies connected together, the large-scale automated equipment used for mass production on the market is not suitable for the plastic-sealing process because a lot of cost is spent on the mold structure, and such special types of plastic-sealed bodies are usually produced in small batches, while large-scale automated equipment is generally suitable for mass production of plastic-sealed bodies with uniform specifications.

[0004] The products to be encapsulated in the row-shaped plastic encapsulation body are generally the base plate and the chips and bonding wires welded thereon. Due to the particularity of its row-shaped shape, in order to ensure that the molten plastic encapsulation material can completely wrap the products to be encapsulated, a runner plate will be added between the upper and lower molds. The molten plastic encapsulation material will flow into the cavity along the wider groove flow channel between the runner plate, the upper mold and the lower mold, so that the molten plastic encapsulation material can synchronously and evenly wrap one side of the row-shaped product to be encapsulated, rather than just flowing in from a single small flow port in the cavity, to avoid the bonding wires on the products to be encapsulated being affected by the molten plastic encapsulation fluid and damaged.

[0005] Specifically, the plastic sealing device adapted to the above-mentioned row-shaped plastic sealing body undergoes the following steps during operation: 1. First place the product to be plastic-sealed into the cavity of the lower mold, and then place the plastic-sealing material into the barrel of the upper mold; 2. The upper die is driven by external force to drop vertically and fit closely with the lower die; 3. The plastic sealing material is melted by high temperature and becomes molten plastic sealing material. Under the action of its own gravity, it flows to the runner of the runner plate and finally fills the cavity. It cools and solidifies into a continuous plastic sealing body.

[0006] However, the above-mentioned plastic sealing device has the following disadvantages during operation: After the plastic sealing is completed, there will be residual plastic sealing material on the runner plate, that is, in the wider groove flow channel between the runner plate, the upper mold and the lower mold. If it is not cleaned in time, it will affect the quality of the subsequent plastic sealing body. The residual position is usually in the corner of the groove flow channel, so the residual plastic sealing material in the corner is currently scraped off with sheet objects, but this method is difficult to clean and will lead to cumbersome operation, time-consuming and labor-intensive. Summary of the invention

[0007] To overcome the above - mentioned deficiencies, embodiments of the present disclosure provide a semiconductor device encapsulation apparatus, which solves the technical problems in the related art that during the cleaning process after forming and blanking of the encapsulation apparatus, using sheet - like articles to clean the residual encapsulation material in the corners of the groove channels is cumbersome and prone to incomplete cleaning.

[0008] According to one aspect, at least one embodiment of the present disclosure provides a semiconductor device encapsulation apparatus, including: An upper mold and a lower mold; A forming plate, the forming plate is disposed between the upper mold and the lower mold, the forming plate has a forming hole and a runner hole, the upper mold and the lower mold are used to seal the top and bottom of the forming hole to form a forming space for forming the product to be encapsulated, and the runner hole communicates with the forming space; A runner plate, the runner plate is arranged to be lifted and lowered in the runner hole, and is used to guide the molten encapsulation material from the runner hole to the forming space; A pusher, the pusher is movably arranged on the upper mold or the lower mold, and the pusher is configured to move and then push the runner plate to rise so that the top surface of the runner plate is coplanar with the top surface of the forming plate.

[0009] For example, in a semiconductor device encapsulation apparatus provided by at least one embodiment of the present disclosure, the lower mold has a flow - dividing protrusion, the runner plate has an avoidance hole, the flow - dividing protrusion penetrates through the avoidance hole, and the flow - dividing protrusion is used to divide the molten encapsulation material on the runner plate into the forming space.

[0010] For example, in a semiconductor device encapsulation apparatus provided by at least one embodiment of the present disclosure, both the flow - dividing protrusion and the avoidance hole are plural, and the plural flow - dividing protrusions penetrate through the plural avoidance holes one by one, and the plural flow - dividing protrusions are configured to be arranged at intervals along the length direction of the product to be encapsulated.

[0011] For example, in a semiconductor device encapsulation apparatus provided by at least one embodiment of the present disclosure, the runner plate further has a material - receiving position for receiving the solid encapsulation material, and plural flow - dividing protrusions are arranged around the material - receiving position, and both the plural flow - dividing protrusions and the hole wall of the runner hole are used to abut against the outer wall of the solid encapsulation material to limit the position of the solid encapsulation material.

[0012] For example, in a semiconductor device encapsulation apparatus provided by at least one embodiment of the present disclosure, the upper mold has a feeding channel in the vertical direction, and the semiconductor device encapsulation apparatus further includes: A piston member, the piston member is arranged to be lifted and lowered in the feeding channel, and the piston member is configured to descend and then extrude the solid encapsulation material at the material - receiving position.

[0013] For example, in a semiconductor device molding device provided by at least one embodiment of the present disclosure, there are two pushers, which are symmetrically arranged on both sides of the flow channel plate, each of which is arranged on the lower mold for horizontal movement, and each of which has a pushing slope, and the pushing slope is configured to push the flow channel plate up after following the movement of the pusher.

[0014] For example, in a semiconductor device plastic packaging device provided in at least one embodiment of the present disclosure, the semiconductor device plastic packaging device further includes: The stripping lift piece is lifted and lowered on the lower mold and is located below the molding space. The stripping lift piece is frame-shaped, and the cross-sectional area of ​​the stripping lift piece is configured to be smaller than the cross-sectional area of ​​the product to be plastic-sealed. The stripping lift piece is configured to lift up the product to be plastic-sealed after rising.

[0015] For example, in a semiconductor device plastic packaging device provided in at least one embodiment of the present disclosure, the semiconductor device plastic packaging device further includes: An upper shell and a lower shell, wherein the upper shell is arranged to be lifted relative to the lower shell, and the upper shell is configured to abut against the lower shell after being lowered to form a closed cavity, and the upper mold and the lower mold are both arranged in the closed cavity; A protective gas tank is connected to the closed cavity and is used to transport protective gas to the closed cavity.

[0016] For example, in a semiconductor device plastic packaging device provided by at least one embodiment of the present disclosure, the upper mold and the lower mold both have heating channels that are connected in sequence, and the semiconductor device plastic packaging device further includes: A limiting portion, the limiting portion is arranged on the top of the inner wall of the heating channel of the upper mold; A heating rod, wherein the heating rod is slidably disposed in the heating channel, and one end of the heating rod is disposed on the top wall of the upper shell; A limit block is arranged at the bottom of the heating rod, and the limit block is configured to lift up the limit portion following the rising heating rod so as to keep the upper mold away from the lower mold.

[0017] For example, in a semiconductor device plastic packaging device provided in at least one embodiment of the present disclosure, the semiconductor device plastic packaging device further includes: A heating element and a temperature sensor are provided in both the upper mold and the lower mold.

[0018] The beneficial effects of the embodiments of the present disclosure are: 1. Effectively clean the residual plastic sealing material: In the plastic sealing device suitable for the production of continuous plastic sealing bodies, in order to avoid the difficulty in cleaning the plastic sealing material in the corners of the groove flow channel, this device is provided with a liftable flow channel plate and a movable push piece. After the plastic sealing is completed, the push piece moves to push the flow channel plate up so that the top surface of the flow channel plate is coplanar with the top surface of the molding plate. In this way, the plastic sealing material originally remaining in the corner will be exposed on a relatively flat surface and can be directly scraped off. Compared with the traditional method of scraping the corners, it is more convenient to clean and easier to clean comprehensively. It does not affect the normal flow of the molten plastic sealing material into the cavity along the flow channel plate, and it is synchronously and evenly wrapped from one side of the continuous-row plastic sealing product to be plastic-sealed, avoiding the situation where the bonding wire is damaged by the molten plastic sealing material fluid due to only flowing in from a single small flow port in the cavity, which meets the production requirements of continuous-row plastic sealing bodies.

[0019] 2. Simplified structure: The working process of this device is relatively simple. After normal plastic packaging demolding, the cleaning of residual plastic packaging materials can be completed through the simple cooperation of the push piece and the runner plate, which reduces the complexity and time cost of manual operation. The structure of this device does not require complex and expensive large-scale automated equipment mold structure, which also effectively reduces the production cost for small-batch production of special models of continuous plastic packaging bodies. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments of the present disclosure. Obviously, the drawings described below are only some exemplary embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on the contents of the exemplary embodiments of the present disclosure and these drawings without creative work.

[0021] Figure 1 An exploded view of a semiconductor device plastic packaging device in one embodiment of the present disclosure; Figure 2 for Figure 1 The lower mold and the forming plate match diagram in the embodiment; Figure 3 for Figure 1 An exploded view of the lower mold and the forming plate in the embodiment of the present invention; Figure 4 for Figure 1 A diagram showing a flow channel plate rising state in an embodiment of the present invention; Figure 5 for Figure 1 The forming plate and the flow channel plate are matched in the embodiment; Figure 6 for Figure 1 A schematic diagram of the structure of the flow channel plate in the embodiment of FIG. Figure 7 for Figure 1A schematic diagram of the structure of the forming plate in the embodiment of FIG. Figure 8 for Figure 1 A schematic structural diagram of a piston member in an embodiment of the present invention; Fig. 9 for Figure 1 The upper shell and the lower shell match diagram in the embodiment; Fig.10 for Figure 1 A schematic structural diagram of the lower housing in an embodiment of the present invention; Fig.11 This is a schematic structural diagram of a heating rod in another embodiment of the present disclosure; Fig.12 for Fig.11 A diagram showing a heating rod rising state in the embodiment of the present invention; Fig.13 for Fig.10 Enlarged view of middle part B; Fig.14 for Fig.11 A schematic structural diagram of a stripping top member in an embodiment of the present invention; Fig.15 for Figure 5 Enlarged view of part A in the middle.

[0022] In the figure: 1. product to be plastic-sealed, 2. solid plastic-sealing material, 3. upper mold, 301. feeding channel, 302. heating channel, 4. lower mold, 401. diverter protrusion, 5. molding plate, 501. molding hole, 502. flow channel hole, 6. molding space, 7. flow channel plate, 701. avoidance hole, 702. material receiving position, 8. pusher, 801. pushing slope, 9. piston member, 10. upper shell, 11. lower shell, 12. closed cavity, 13. protective gas tank, 14. limiting part, 15. heating rod, 16. limiting block, 17. heating element, 18. temperature sensor, 19. stripping top member, 20. avoidance groove, 21. positioning protrusion, 22. pusher block, 23. slope, 24. controller, 25. wiring hole. DETAILED DESCRIPTION

[0023] The present disclosure is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure, rather than to limit the present disclosure.

[0024] In order to simplify the drawings, only the parts related to the disclosure are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically shown, or only one of them is marked. In this article, "one" not only means "only one", but also means "more than one", and "several" includes "two" and "more than two".

[0025] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

[0026] In the present disclosure, unless otherwise expressly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0027] In the description of this embodiment, terms such as "up", "down", "left", and "right" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0028] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0029] like Figure 1~Figure 4 As shown, it shows a semiconductor device molding device in an embodiment of the present disclosure, including: an upper mold 3 and a lower mold 4; a molding plate 5 is arranged between the upper mold 3 and the lower mold 4, the molding plate 5 has a molding hole 501 and a flow hole 502, the upper mold 3 and the lower mold 4 are used to seal the top and bottom of the molding hole 501 to form a molding space 6 for molding the product 1 to be molded, and the flow hole 502 is connected to the molding space 6; the flow plate 7 is arranged in the flow hole 502 for lifting and lowering, and is used to guide the molten molding material from the flow hole 502 to the molding space 6; the push piece 8 is movably arranged on the upper mold 3 or the lower mold 4, and the push piece 8 is configured to push the flow plate 7 to rise after moving, so that the top surface of the flow plate 7 is coplanar with the top surface of the molding plate 5.

[0030] By utilizing the elevating flow channel plate 7 and the movable push piece 8, the residual plastic sealing material in the flow channel of the groove of the flow channel plate 7 is transferred to the flat surface, making the cleaning action more convenient and efficient. The entire plane can be directly scraped off with a sheet, and there is no need to scrape off the residual plastic sealing material in the corners bit by bit. In addition, the molding structure (flow channel plate 7, etc.) for the continuous plastic sealing body is not changed, and the guiding effect of the flow channel plate 7 can still be utilized to achieve uniform wrapping of the molten plastic sealing material around the product to be plastic-sealed, thereby avoiding damage to the bonding wire.

[0031] Working process: First, the mold is opened and the material is loaded: the upper mold 3 is connected to a driving device such as a press to provide vertical downward pressure, so that the upper mold 3 can be accurately lowered to fit with the lower mold 4 to complete the mold closing action, and the upper mold 3 can be pulled up and reset after the plastic sealing is completed; after lifting the upper mold 3, the corresponding molding plate 5 of the row-shaped plastic sealing body model is installed on the lower mold 4, and the product 1 to be plastic sealed is placed in the molding hole 501, and then the solid plastic sealing material 2 is placed in the barrel of the upper mold 3. At this time, the push piece 8 is located at the initial position on the lower mold 4 and does not push the runner plate 7.

[0032] Mold closing and plastic sealing: the upper mold 3 is driven by an external force (usually powered by a driving device such as a press) to vertically descend and fit tightly with the lower mold 4. During this process, the upper mold 3 and the lower mold 4 are respectively blocked on the top plane and the bottom plane of the molding hole 501, thereby forming a molding space 6 for molding the product 1 to be plastic-sealed; then, the heating device such as the spiral electric heating element 17 that cooperates with the barrel of the upper mold 3 is energized to heat the plastic sealing material in the barrel, so that it melts into molten plastic sealing material, and flows to the flow channel plate 7 under the action of its own gravity. At this time, the top surface of the static flow channel plate 7 is not coplanar with the top surface of the molding plate 5, forming a groove for the molten plastic sealing material to flow along the groove to the molding space 6, and synchronously and evenly wrap the side of the row-shaped product 1 to be plastic-sealed, and finally cool after a certain period of time. The molten plastic sealing material cools and solidifies in the molding space 6, fully wraps the product 1 to be plastic-sealed, and completes the molding of the row-shaped plastic sealing body.

[0033] Demolding and cleaning: The upper mold 3 rises and resets under the action of external force, exposing the row-shaped plastic sealing body between the molding plate 5 and the lower mold 4, which is taken out manually or sucked out using a suction cup; then the push piece 8 starts to move, pushing the flow channel plate 7 up until the top surface of the flow channel plate 7 is coplanar with the top surface of the molding plate 5, exposing the plastic sealing material remaining in the corner to a relatively flat surface, and finally the sheet is scraped off the plane manually or by a mechanical arm configured with a suction cup to complete the cleaning action.

[0034] Specifically, the push member 8 can be driven by a nut screw or a cylinder, and can be arranged at a position directly below the flow channel plate 7 on the lower mold 4, and can be directly moved to lift the flow channel plate 7. However, in actual arrangement, it is found that arranging such a power source structure in the lower mold 4 will still lead to a complex structure and a large volume, which is difficult to arrange inside and may even affect the strength of the lower mold 4. Therefore, the push member 8 can also adopt the inclined surface of the wedge block, utilize the guiding effect, convert the horizontal movement into the lifting movement, and additionally arrange a resettable spring.

[0035] What is more worth considering is that Figure 5~Figure 7 As shown, if the push piece 8 is arranged on the top surface of the lower mold 4 in a horizontally movable manner, an avoidance groove 20 is required to be opened at the corresponding position on the bottom surface of the forming plate 5 to avoid the position of the push piece 8. While ensuring that the forming plate 5 is stably installed on the lower mold 4, the push piece 8 can also move in the avoidance groove 20. Since the avoidance groove 20 is connected to the flow channel hole 502, it can contact the flow channel plate 7 and push it to rise.

[0036] like Figure 1 to Figure 7 As shown, in some examples, the lower mold 4 has a diverter protrusion 401 , the runner plate 7 has an avoidance hole 701 , the diverter protrusion 401 passes through the avoidance hole 701 , and the diverter protrusion 401 is used to divert the molten plastic packaging material on the runner plate 7 to the molding space 6 .

[0037] Due to the special structure of the product 1 to be plastic-sealed in the row-shaped plastic-sealed body, in order to further improve the uniformity of synchronous and comprehensive wrapping from one side, the form of the wider groove flow channel directly flowing into the molding space 6 is changed to a form in which several groups of flow outlets are evenly arranged from one side to flow into the molding space 6. This can effectively avoid excessive accumulation of plastic sealing material in some areas and insufficient filling in some areas, thereby improving the uniformity of the material distribution.

[0038] Moreover, for delicate components such as bonding wires on the row-shaped product 1 to be plastic-encapsulated, the form in which several groups of flow outlets flow toward the molding space 6 can achieve a more uniform flow of the plastic encapsulating material, and can reduce the risk of damage to the bonding wires due to excessive impact force of the local plastic encapsulating material fluid, thereby avoiding the problem of directly impacting the bonding wires in the traditional way.

[0039] Therefore, in order to realize several groups of diversion ports, a diversion protrusion 401 is added to the lower mold 4 to provide a stable support for the diversion protrusion 401 instead of being suspended on other components. In order to ensure the smooth progress of the molding process and avoid interference between the flow channel plate 7 and the diversion protrusion 401, and at the same time play a diversion role, a avoidance hole 701 that is adapted to the shape of the diversion protrusion 401 and corresponds to each other is opened on the flow channel plate 7. After the molding plate 5 is installed on the lower mold 4, the diversion protrusion 401 just passes through the avoidance hole 701, and the top surface is coplanar with the top surface of the molding plate 5, so that after the flow channel plate 7 rises, its top surface is coplanar with the top surface of the molding plate 5. Preferably, the top surface of the diversion protrusion 401 should be coplanar with the top surface of the molding plate 5, so as to jointly form a relatively flat surface that is convenient for cleaning residual plastic sealing material; and when the diversion protrusion 401 works, the molten plastic sealing material on the flow channel plate 7 is directly diverted into several streams into the molding space 6.

[0040] like Figure 1 to Figure 6 As shown, in some examples, there are multiple diverter protrusions 401 and multiple avoidance holes 701, and multiple diverter protrusions 401 pass through multiple avoidance holes 701 one by one, and multiple diverter protrusions 401 are configured to be arranged at intervals along the length direction of the product 1 to be plastic-sealed.

[0041] Since the products 1 to be plastic-sealed in the row-shaped plastic-sealed body are in the shape of long strips and have a certain length, and a plurality of diverter protrusions 401 and corresponding avoidance holes 701 are arranged at intervals along the length direction, the molten plastic-sealing material can be reasonably diverted over the entire length range according to the long strip structural characteristics of the product. If only a single one is provided, uneven distribution in the distal area may occur. The above-mentioned improvement can effectively avoid this problem and ensure that the entire row of products 1 to be plastic-sealed can be evenly plastic-sealed.

[0042] In simple terms, the spaced-apart diversion protrusions 401 are like a plurality of small “diversion stations” for dispersing the molten plastic packaging material. Compared with the diversion method of concentrating the molten plastic packaging material in one place, the uniformity of the distribution of the plastic packaging material in the molding space 6 can be significantly improved.

[0043] Moreover, the increase in quantity will enable the plastic packaging material to approach and wrap delicate components such as bonding wires in a more gentle and uniform manner during the flow process, thereby ensuring product quality.

[0044] In addition, it is worth considering that Fig.15As shown, the forming hole 501 of the forming plate 5 can never be exactly the same size as the product 1 to be encapsulated, and some gaps will remain. The encapsulation operation itself is a step that requires high precision. If the gap difference is large, it may affect the product quality, so it is necessary to add a positioning structure. The positioning structure currently used is usually completed by other equipment, with a complex structure and relatively complex operation. In order to avoid the above situation, the bottom plate is used to quickly complete the positioning, so the inner wall of the forming hole 501 and the side wall of the flow channel plate 7 are integrally formed or welded with positioning protrusions 21, so that the overall position can be quickly fixed from all sides of the bottom plate of the product 1 to be encapsulated, thereby meeting the position accuracy requirements.

[0045] like Figure 1 to Figure 8 As shown, in some examples, the flow channel plate 7 also has a receiving position 702 for receiving the solid plastic encapsulation material 2, and a plurality of diverter protrusions 401 are arranged around the receiving position 702, and the hole walls of the plurality of diverter protrusions 401 and the flow channel holes 502 are used to abut against the outer wall of the solid plastic encapsulation material 2 to limit the position of the solid plastic encapsulation material 2.

[0046] A material receiving position 702 connected to the barrel of the upper mold 3 is arranged on the flow channel plate 7. The received solid plastic encapsulating material 2 can be directly guided by the flow channel plate 7 after melting to avoid the two being disconnected. It is also necessary to additionally arrange components for controlling the opening and closing of the connecting port. In addition, in order to ensure that the solid plastic encapsulating material 2 is stably positioned at the material receiving position 702, a plurality of diverter protrusions 401 arranged at intervals along the length direction of the product 1 to be encapsulated are arranged around the material receiving position 702. The solid plastic encapsulating material 2 on the material receiving position 702 can just abut the side wall of the diverter protrusion 401 and the inner wall of the flow channel hole 502, and the fitting surface is generally arc-shaped, so that the position of the solid plastic encapsulating material 2 can be limited from all sides, and after being converted into molten plastic encapsulating material under the action of the heating device of the upper mold 3, it can flow directly to the molding space 6 along the diverter channel between each diverter protrusion 401, or between the diverter protrusion 401 and the inner wall of the flow channel hole 502.

[0047] Specifically, Figure 4 , 6 As shown, the receiving position 702 can be set in the middle position of several diversion protrusions 401 arranged at intervals along the length direction of the product 1 to be plastic-sealed, so as to ensure a more uniform diversion. The shape of the overall flow channel plate 7 should be adapted to the flow channel hole 502. The receiving position 702 can also be a circular plane, and some anti-slip textures can be designed on it as needed to increase the friction with the bottom of the solid plastic sealing material 2 to prevent it from sliding in the receiving position 702.

[0048] like Figure 8~Figure 10 As shown, in some examples, the upper mold 3 has a vertical feeding channel 301, and a semiconductor device molding device further includes: a piston member 9 is lifted and lowered in the feeding channel 301, and the piston member 9 is configured to squeeze the solid molding material 2 at the receiving position 702 after descending.

[0049] The piston member 9 is designed to actively descend in the feeding channel 301 (barrel), abut against the solid plastic sealing material 2 on the receiving position 702 and extrude it. During the entire extrusion process, the piston member 9 is in close contact with the molten plastic sealing material throughout the entire process, and the gas on the surface of the product is discharged from the mold, thereby improving the product quality.

[0050] Specifically, the upper mold 3 provides space for the piston member 9 to be installed and move. The size and shape of the feeding channel 301 must be precisely matched with the cylindrical piston member 9 to ensure that the piston member 9 can be smoothly lifted and lowered therein. At the same time, the sealing of the channel must be ensured. The vertical feeding channel 301 is located directly above the material receiving position 702 to ensure that the extrusion effect works normally. The driving device is the power source for the movement of the piston member 9.

[0051] In addition, after the plastic packaging is completed, the piston member 9 is controlled to rise and the feeding channel 301 can be pulled out, and the solid plastic packaging material 2 can be directly put into the receiving position 702 from the feeding channel 301, or the solid plastic packaging material 2 can be directly placed on the receiving position 702 after demolding.

[0052] like Figure 1~Figure 4 As shown, in some examples, there are two push members 8, which are symmetrically arranged on both sides of the flow channel plate 7, each push member 8 is arranged on the lower mold 4 for horizontal movement, and each push member 8 has a pushing inclined surface 801, and the pushing inclined surface 801 is configured to push the flow channel plate 7 to rise after following the movement of the push member 8.

[0053] The two pushers 8 are symmetrically arranged on both sides of the flow channel plate 7. When the flow channel plate 7 is pushed up, balanced thrust can be provided from both sides, so that the flow channel plate 7 can be stably raised. Compared with the push by a single pusher 8, it can effectively prevent the flow channel plate 7 from tilting, getting stuck or even getting stuck due to uneven force during the rising process.

[0054] Specifically, Figure 3 As shown, the push piece 8 may have a push slope 801 on one side close to the flow channel plate 7 and all around, and the push slope 801 on the side close to the flow channel plate 7 is preferably adapted to the shape of the flow channel plate 7. In addition, the reciprocating movement of the push piece 8 can be completed by a spring built into the lower mold 4, that is, an external force squeezes the two push pieces 8 close to the lifting flow channel plate 7, and then the two push pieces 8 are moved away from each other under the action of the spring.

[0055] like Fig.14 As shown, in some examples, a semiconductor device molding device further includes: a stripping top piece 19 is lifted and lowered on the lower mold 4 and is located below the molding space 6; the stripping top piece 19 is frame-shaped, and the cross-sectional area of ​​the stripping top piece 19 is configured to be smaller than the cross-sectional area of ​​the product 1 to be molded; the stripping top piece 19 is configured to lift up the product 1 to be molded after rising.

[0056] In order to improve the efficiency of demoulding, a demoulding top piece is arranged on the lower mold 4 for lifting and lowering. After rising, the formed plastic-sealed body can be ejected. In particular, the frame-shaped design whose cross-sectional area is smaller than the product to be plastic-sealed can act evenly on the bottom periphery of the product to avoid damage to the product due to local uneven force, stabilize the demoulding, and avoid damage to sensitive and easily damaged parts such as the bonding wires around it.

[0057] The specific lifting structure is the same as that of the push piece 8, so as to avoid the structural complexity caused by the power source and other problems. There are push blocks 22 for horizontal movement on both sides of the stripping top piece 19. The push blocks 22 have inclined surfaces 23 close to the side of the stripping top piece 19 and the bottom of the stripping top piece 19. An additional spring is also arranged to connect the push blocks 22 and the lower mold 4. After the external force squeezes the two push blocks 22 together, the inclined surface 23 is used to lift the stripping top piece 19, and then the two push blocks 22 are moved away from each other under the action of the spring, and the stripping top piece 19 then descends synchronously.

[0058] like Figure 8~Figure 10 As shown, in some examples, a semiconductor device molding device further includes: an upper shell 10 is arranged to be raised and lowered relative to a lower shell 11, and the upper shell 10 is configured to abut against the lower shell 11 after being lowered to form a closed cavity 12, and the upper mold 3 and the lower mold 4 are both arranged in the closed cavity 12; the protective gas tank 13 is connected to the closed cavity 12, and is used to transport protective gas to the closed cavity 12.

[0059] Plastic sealing under a protective gas atmosphere can effectively reduce the generation of bubbles in the plastic sealing material and avoid affecting the processing quality of the product. Therefore, before plastic sealing, the upper shell 10 and the lower shell 11 are first merged, the other opening of the closed cavity 12 is opened, and a protective gas (such as nitrogen) is filled therein. When the nitrogen fills the closed cavity 12, the opening and the pipeline valve of the protective gas tank 13 are sealed, and then the plastic sealing body is heated and extruded, thereby enhancing the reliability and stability of the product.

[0060] Specifically, the hydraulic components can be used to achieve precise control of the lifting and lowering motion of the upper housing 10, and can be combined with the driving device of the piston component 9, such as Fig. 9 , 10 As shown, the lower shell 11 is installed on the workbench, the upper shell 10 is lifted and lowered on the workbench by hydraulic parts, and the piston part 9 is lifted and lowered by small hydraulic parts and is set on the connecting frame of the upper shell 10, and the upper mold 3 and the lower mold 4 can be combined by manually fixing bolts and locking, or the upper mold 3 and the upper shell 10 are connected by bolts to achieve automatic mold closing, or the upper mold 3 is further lifted and lowered by small hydraulic parts and is set on the connecting frame of the upper shell 10, and it can be designed according to actual production conditions.

[0061] In addition, in the closed cavity 12, the temperature increase will cause the internal nitrogen to expand. In order to prevent the shell from being damaged due to the thermal expansion of the nitrogen, a buffer hole and a pressure relief hole connected to the outside world can be opened on the side wall of the lower shell 11. The area of ​​the buffer hole should be larger than the area of ​​the pressure relief hole, and a number of small pressure relief holes are arranged around the buffer hole.

[0062] The function of the pressure relief hole is that when the shell cavity is filled with nitrogen, the excess volume of nitrogen after expansion will be discharged from the pressure relief valve arranged in the pressure relief hole to balance the air pressure; if the gas expands too quickly, so that the excess volume of gas is not discharged from the pressure relief hole in time, the buffer hole will begin to play a role. Since there is a buffer pad made of elastic and high-temperature resistant material embedded inside, the excess volume of gas will squeeze the buffer pad toward the outside of the shell, and the buffer pad will bulge outward like a balloon to avoid the shell from being squeezed and damaged, increase protective measures, and improve the service life of the equipment.

[0063] like Figure 11~Figure 12 As shown, in some examples, the upper mold 3 and the lower mold 4 both have heating channels 302 connected in sequence, and a semiconductor device molding device also includes: a limit portion 14 is arranged on the top of the inner wall of the heating channel 302 of the upper mold 3; the heating rod 15 is slidably arranged in the heating channel 302, and one end of the heating rod 15 is arranged on the inner top wall of the upper shell 10; the limit block 16 is arranged at the bottom of the heating rod 15, and the limit block 16 is configured to follow the rising heating rod 15 to lift the limit portion 14 to keep the upper mold 3 away from the lower mold 4.

[0064] The heating device is designed to be able to pass through the heating channel 302 of the upper mold 3 and the lower mold 4, and is connected to the lifting upper shell 10, so as to improve the cooling and curing process. Instead of directly adding a fan in the conventional way, the heating rod 15 is basically separated from the upper and lower molds 4 by the rising upper shell 10, so as to avoid the heating rod 15 being cooled and cured in the upper and lower molds 4, which makes it difficult to disperse the heat, thereby improving the cooling and curing effect.

[0065] And with the support of the limiting part 14 and the limiting block 16, the upper shell 10 continues to rise. When the heating rod 15 is about to separate from the upper and lower molds 4, the limiting block 16 abuts against the limiting part 14, and the limiting part 14 can be lifted to lift the upper mold 3 and complete the automatic separation from the lower mold 4, and an additional power source structure is omitted.

[0066] During specific operation, the heating rod 15 is located at the bottom of the heating channel 302 of the lower mold 4, and the upper mold 3 and the lower mold 4 are in a closed state. At this time, the heating rod 15 is heated by the controller to heat the upper and lower molds 4 to melt the solid plastic sealing material 2; cooling and solidification, at this time, the heating rod 15 has already turned off the heating state, and starts to slide upward with the upper shell 10 until the limit block 16 at the bottom contacts the limit part 14, the heating rod 15 is basically separated from the upper mold 3 and the lower mold 4, stops rising, and quickly completes the natural cooling and solidification process, or adds a small fan to enhance the cooling effect; finally, it continues to rise, and under the lifting action of the limit block 16, the upper mold 3 and the lower mold 4 are separated, and demolding is convenient.

[0067] The heating channel 302 is vertical, and the axial direction of the heating channel 302 is colinear with the axial direction of the heating rod 15. The limit portion 14 and the limit block 16 are both annular. The diameter of the heating rod 15 is equal to the inner diameter of the limit portion 14, and the outer diameter of the limit block 16 is not larger than the outer diameter of the limit portion 14, so as to ensure that the above-mentioned action is completed stably and facilitate early processing.

[0068] like Figure 8 , Fig.13 As shown, in some examples, a semiconductor device plastic packaging device further includes: a heating element 17 and a temperature sensor 18 are disposed in both the upper mold 3 and the lower mold 4 .

[0069] In addition to the above-mentioned structural form of the heating rod 15, a fixed heating element 17 can also be respectively arranged in the upper mold 3 and the lower mold 4, and a corresponding temperature sensor 18 (in the form of a thermocouple, etc.) can be built in. The controller 24 can be used to accurately and independently control the temperatures of the upper mold 3 and the lower mold 4, thereby improving the flexibility of temperature control. The controller 24 is electrically connected to the heating rod 15, and the wires of the temperature sensor 18 can be connected to the outside through the wiring hole 25 of the lower shell 11.

[0070] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure rather than to limit it. Although the present disclosure has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present disclosure may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present disclosure, which should be included in the scope of the claims of the present disclosure.

Claims

1. A semiconductor device plastic packaging device, characterized in that: include: An upper die (3) and a lower die (4); a molding plate (5), the molding plate (5) being arranged between the upper mold (3) and the lower mold (4), the molding plate (5) having a molding hole (501) and a flow channel hole (502), the upper mold (3) and the lower mold (4) being used to seal the top and bottom of the molding hole (501) to form a molding space (6) for molding the product (1) to be plastic-sealed, the flow channel hole (502) being connected to the molding space (6); A flow channel plate (7), the flow channel plate (7) being arranged in a lifting manner in the flow channel hole (502) and being used to guide the molten plastic sealing material from the flow channel hole (502) to the molding space (6); A push piece (8), the push piece (8) being movably arranged on the upper mold (3) or the lower mold (4), the push piece (8) being configured to push the flow channel plate (7) upward after movement, so that the top surface of the flow channel plate (7) is coplanar with the top surface of the molding plate (5).

2. A semiconductor device plastic packaging device according to claim 1, characterized in that: The lower mold (4) has a diversion protrusion (401), the runner plate (7) has an avoidance hole (701), the diversion protrusion (401) passes through the avoidance hole (701), and the diversion protrusion (401) is used to divert the molten plastic sealing material on the runner plate (7) to the molding space (6).

3. A semiconductor device plastic packaging device according to claim 2, characterized in that: There are a plurality of the diverter protrusions (401) and the avoidance holes (701), and the plurality of the diverter protrusions (401) are connected through the plurality of the avoidance holes (701) in a one-to-one correspondence, and the plurality of the diverter protrusions (401) are arranged at intervals along the length direction of the product to be plastic-sealed (1).

4. A semiconductor device plastic packaging device according to claim 3, characterized in that: The flow channel plate (7) further comprises a receiving position (702) for receiving the solid plastic encapsulation material (2), a plurality of diversion protrusions (401) are arranged around the receiving position (702), and the plurality of diversion protrusions (401) and the hole wall of the flow channel hole (502) are used to abut against the outer wall of the solid plastic encapsulation material (2) to limit the position of the solid plastic encapsulation material (2).

5. A semiconductor device plastic packaging device according to claim 4, characterized in that: The upper mold (3) has a vertical feeding channel (301), and the semiconductor device plastic packaging device further comprises: A piston member (9), the piston member (9) being arranged in the feeding channel (301) in a lifting manner, and the piston member (9) being configured to squeeze the solid plastic packaging material (2) at the receiving position (702) after descending.

6. The semiconductor device plastic packaging device according to claim 1, characterized in that: There are two push members (8), which are symmetrically arranged on both sides of the flow channel plate (7), and each push member (8) is arranged on the lower mold (4) to move horizontally, and the push member (8) has a push inclined surface (801), and the push inclined surface (801) is configured to push the flow channel plate (7) upward after following the movement of the push member (8).

7. The semiconductor device plastic packaging device according to claim 1, characterized in that: The semiconductor device plastic packaging device further comprises: A stripping lift piece (19), the stripping lift piece (19) is lifted and arranged on the lower mold (4) and is located below the molding space (6); the stripping lift piece (19) is frame-shaped, and the cross-sectional area of ​​the stripping lift piece (19) is configured to be smaller than the cross-sectional area of ​​the product to be plastic-sealed (1); the stripping lift piece (19) is configured to lift up the product to be plastic-sealed (1) after rising.

8. A semiconductor device plastic packaging device according to any one of claims 1 to 7, characterized in that: The semiconductor device plastic packaging device further comprises: an upper shell (10) and a lower shell (11), wherein the upper shell (10) is arranged to be lifted relative to the lower shell (11), and the upper shell (10) is configured to abut against the lower shell (11) after being lowered to form a closed cavity (12), and the upper mold (3) and the lower mold (4) are both arranged in the closed cavity (12); A protective gas tank (13), the protective gas tank (13) being connected to the closed chamber (12) and being used for conveying protective gas to the closed chamber (12).

9. A semiconductor device plastic packaging device according to claim 8, characterized in that: The upper mold (3) and the lower mold (4) both have heating channels (302) that are connected in sequence. The semiconductor device plastic packaging device further includes: a limiting portion (14), the limiting portion (14) being arranged on the top of the inner wall of the heating channel (302) of the upper mould (3); a heating rod (15), the heating rod (15) being slidably disposed in the heating channel (302), and one end of the heating rod (15) being disposed on the inner top wall of the upper shell (10); A limit block (16), the limit block (16) being arranged at the bottom of the heating rod (15), the limit block (16) being configured to follow the rising heating rod (15) to lift up the limit portion (14) so ​​as to move the upper mold (3) away from the lower mold (4).

10. The semiconductor device plastic packaging device according to claim 9, characterized in that: The semiconductor device plastic packaging device further comprises: A heating element (17) and a temperature sensor (18), wherein the heating element (17) and the temperature sensor (18) are both arranged in the upper mold (3) and the lower mold (4).

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