A charged-in-tank electroplating device and process

Abstract

The present invention discloses a charged-in-cylinder electroplating device and process, including a frame; symmetrically arranged support frames are disposed at positions away from the middle inside the frame; a copper tank is connected inside the support frames; an oil cylinder is arranged at a position corresponding to the space between the two support frames inside the frame, a movable platform is arranged at a position corresponding to the upper part of the oil cylinder inside the frame, a chain is arranged between the movable platform and the oil cylinder, and lifting arms are arranged above both sides of the movable platform; before the electroplating of the circuit board starts, the electric cylinder will push the combined fixture forward to separate the belt conductive contact head from the fixture conductive contact head. After the separation of the belt conductive contact head from the fixture conductive contact head, an open circuit will be formed, so that the combined fixture and the circuit board no longer carry current. When the circuit board needs to be protected, a weak current will be applied to the circuit board. When the circuit board is moving, the circuit board no longer carries a weak current. Compared with the method of continuously energizing in the copper tank, more costs can be saved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electroplating, and particularly relates to an electroplating device and process for charging into the tank while electrified. Background Art

[0002] A circuit board is an essential component in electronic devices, also known as a printed circuit board or printed wiring board. It consists of electronic components such as integrated circuits, crystal oscillators, and trimming capacitors. Through specific layouts and connections, it realizes the functions of the circuit and provides mechanical support for the electronic components.

[0003] Circuit board electroplating refers to the process of depositing a metal thin film on the surface or inner hole walls of a circuit board through an electrochemical method. Its main purpose is to enhance the electrical conductivity of the circuit board, improve corrosion resistance and wear resistance, thereby enhancing the overall performance and reliability of the circuit board.

[0004] The existing mainstream method for electroplating circuit boards is mainly based on direct current electroplating technology. Its core is to continuously apply a constant current to the electroplating tank through an external power supply, so that metal ions in the electrolyte are evenly deposited on the surface of the circuit board as the cathode to form a conductive layer.

[0005] Although the above method for electroplating circuit boards can electroplate circuit boards, during the specific operation process, when electroplating the circuit board, it is necessary to energize the electroplating solution in the copper tank. And during the process of taking out the electroplated circuit board and putting the unplated circuit board into the copper tank after the circuit board electroplating is completed, the electrolyte in the copper tank is still energized. Continuously energizing the electrolyte does not affect the electroplating of the circuit board, but it will increase the cost of the circuit board during the electroplating process. Summary of the Invention

[0006] The purpose of the present invention is to solve the problem of high cost during electroplating of circuit boards in the prior art, and provides an electroplating device and process for charging into the tank while electrified.

[0007] The purpose of the present invention can be achieved by the following technical solutions:

[0008] A charged-in-tank electroplating device, comprising a frame; support frames symmetrically arranged at positions in the frame away from the middle; a copper tank connected within the support frames; characterized in that: an oil cylinder is arranged at a position in the frame corresponding to the space between the two support frames, a movable platform is arranged at a position in the frame corresponding to the upper side of the oil cylinder, a chain is arranged between the movable platform and the oil cylinder, lifting arms are arranged above both sides of the movable platform, a combined fixture is suspended below one end of the lifting arm away from the column, a fixture support square pipe is connected above the combined fixture, a fixture conductive contact head is connected to the upper surface of the fixture support square pipe near the frame, and a support is connected to the frame at a position corresponding to the fixture conductive contact head; a pair of symmetrically arranged guide wheels are rotatably connected within the support, a steel wire rope is slidably connected above the inner sides of the two guide wheels, one end of the steel wire rope close to the fixture conductive contact head is connected to a first slider, a conductive contact head is connected to the first slider near the fixture conductive contact head, the other end of the steel wire rope away from the fixture conductive contact head is connected to a second slider, and a counterweight is connected to one side of the second slider away from the frame; a rectifier is arranged above the frame corresponding to the slide rail.

[0009] Preferably, a cathode carbon brush is connected to the support frame above the position corresponding to the rectifier, an anode titanium mesh is arranged in the copper tank below the position corresponding to the cathode carbon brush, the cathode of the rectifier is connected to the first slider and the second slider, and the anode of the rectifier is connected to the anode titanium mesh.

[0010] Preferably, a second roller is rotatably connected to one side of the lifting arm close to the movable platform, and symmetrically arranged L-shaped plates are connected to the movable platform at positions corresponding to the first rollers, and the second rollers are in contact with the L-shaped plates.

[0011] Preferably, symmetrically arranged columns are connected to the frame at positions corresponding to the lifting arms close to the movable platform, and the lifting arms are slidably connected within the columns.

[0012] Preferably, symmetrically arranged engaging plates are connected to one end of the lifting arm close to the movable platform at positions corresponding to the columns close to the lifting arm, and the engaging plates are slidably connected to the columns.

[0013] Preferably, symmetrically arranged first rollers are rotatably connected to one side of the lifting arm close to the column, the first rollers are in contact with the inner wall of the column, symmetrically arranged limiting grooves are formed at positions corresponding to both ends of the first rollers on the column, and the ends of the first rollers are slidably connected within the limiting grooves.

[0014] Preferably, the conductive contact head is located directly below the fixture conductive contact head.

[0015] Preferably, a bearing is connected to the outside of the conductive contact head.

[0016] Preferably, slide rails are connected to the frame at positions corresponding to the first slider and the second slider, and the first slider and the second slider are both slidably connected within the slide rails.

[0017] The present invention also provides an electroplating process with charged entry into the cylinder, comprising the following steps:

[0018] S1: Start the oil cylinder, and with the cooperation of the chain, lower the movable platform. The lowering of the movable platform drives the combined fixture and the fixture conductive contact head to descend.

[0019] S2: During the descent of the fixture conductive contact head, it will contact the belt conductive contact head. After the fixture conductive contact head contacts the belt conductive contact head, a closed circuit will be formed, causing the combined fixture and the circuit board to carry a weak current.

[0020] S3: After the fixture conductive contact head contacts the belt conductive contact head, the boom and the fixture conductive contact head will continue to descend. During the descent of the fixture conductive contact head, it will drive the belt conductive contact head to descend synchronously. The descent of the belt conductive contact head will drive the first slider to descend. With the cooperation of the wire rope and the guide pulley, it will drive the second slider and the counterweight to rise. When the boom drives the combined fixture to descend into the copper tank and reach the lowest point, the circuit board will contact the electroplating solution in the copper tank.

[0021] S4: Before the electroplating of the circuit board starts, the electric cylinder will push the combined fixture forward to separate the belt conductive contact head from the fixture conductive contact head. After the belt conductive contact head is separated from the fixture conductive contact head, an open circuit will be formed, causing the combined fixture and the circuit board to no longer carry current.

[0022] S5: With the cooperation of the counterweight, the guide pulley and the wire rope, the counterweight will drive the second slider to descend, and the wire rope will pull the first slider and the belt conductive contact head to rise to the initial position.

[0023] Advantages of the present invention:

[0024] By starting the oil cylinder, with the cooperation of the chain, the movable platform is lowered. The lowering of the movable platform drives the combined fixture and the fixture conductive contact head to descend. During the descent of the fixture conductive contact head, it will contact the belt conductive contact head. After the fixture conductive contact head contacts the belt conductive contact head, a closed circuit will be formed, causing the combined fixture and the circuit board to carry a weak current. Thus, when the circuit board enters the copper tank, it will have a current protection layer, preventing the electroplating solution in the copper tank from attacking the chemical copper layer on the circuit board, causing via breakage of the circuit board and resulting in poor quality of the circuit board. The current protection layer can protect the circuit board, thereby ensuring the quality of the circuit board.

[0025] After the hanging tool conductive contact head contacts with the belt conductive contact head, the boom and the hanging tool conductive contact head will continue to descend. During the descent of the hanging tool conductive contact head, it will drive the belt conductive contact head to descend synchronously. The descent of the belt conductive contact head will drive the first slider to descend. With the cooperation of the wire rope and the guide wheel, it will drive the second slider and the counterweight to rise. When the boom drives the combined hanging tool to descend into the copper tank and reach the lowest point, the circuit board will contact the electroplating solution in the copper tank. Before the electroplating of the circuit board starts, the electric cylinder will push the combined hanging tool forward to separate the belt conductive contact head from the hanging tool conductive contact head. After the belt conductive contact head and the hanging tool conductive contact head are separated, an open circuit will be formed, so that the combined hanging tool and the circuit board will no longer carry current. When the circuit board needs to be protected, a weak current will be applied to the circuit board. When the circuit board is moving, the circuit board will no longer carry a weak current. Compared with the method of continuously energizing in the copper tank, more costs can be saved.

[0026] Because a counterweight is connected to the second slider, with the cooperation of the counterweight, the guide wheel and the wire rope, the counterweight will drive the second slider to descend, and the wire rope will pull the first slider and the belt conductive contact head to rise to the initial position, so as to prepare for the protection of the next group of circuit boards and enable continuous electroplating of the circuit boards without affecting the electroplating efficiency of the circuit boards. Brief Description of the Drawings

[0027] The present invention will be further described below with reference to the accompanying drawings.

[0028] Figure 1 is a side sectional view of the present invention;

[0029] Figure 2 is Figure 1 a partial enlarged view of A in

[0030] Figure 3 is Figure 1 a partial enlarged view of B in

[0031] Figure 4 is Figure 1 a partial enlarged view of C in

[0032] Figure 5 is a side sectional view of the copper tank in the present invention;

[0033] Figure 6 is a three-dimensional view of the hanging tool conductive contact head in the present invention;

[0034] Figure 7 is a schematic diagram of the slide rail in the present invention;

[0035] Figure 8 is a schematic diagram of the rectifier in the present invention.

[0036] In the figure: 1. Frame; 2. Second roller; 3. Combined fixture; 4. Fixture conductive contact head; 5. Rectifier; 6. Cathode carbon brush;

[0037] 11. Support frame; 12. Copper trough; 13. Oil cylinder; 14. Movable platform; 15. Chain; 16. Boom; 17. Column; 18. Clamping plate; 19. First roller; 191. Limit groove;

[0038] 21. L-shaped plate;

[0039] 31. Fixture support square pipe;

[0040] 41. Support; 42. Guide wheel; 43. Steel wire rope; 44. First slider; 45. Second slider; 46. With conductive contact head; 47. Bearing; 48. Counterweight; 49. Slide rail;

[0041] 61. Anode titanium mesh; 62. Anode support rod. Specific implementation mode

[0042] Next, in combination with the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection scope of the present invention.

[0043] Please refer to Figure 1 As shown, a charged-in-cylinder electroplating device includes a frame 1. Symmetrically arranged support frames 11 are provided at positions in the frame 1 away from the middle. The support frames 11 are used to fix the position of the copper trough 12.

[0044] The copper trough 12 is connected inside the support frame 11. The copper trough 12 is used for assisting in electroplating the circuit board.

[0045] An oil cylinder 13 is provided at a position in the frame 1 corresponding to the space between the two support frames 11. The oil cylinder 13 is used to drive the chain 15 to rotate.

[0046] A movable platform 14 is provided at a position in the frame 1 corresponding to the upper side of the oil cylinder 13. The movable platform 14 is used to drive the boom 16 to lift and lower.

[0047] A chain 15 is provided between the movable platform 14 and the oil cylinder 13. Through the cooperation of the oil cylinder 13 and the chain 15, the movable platform 14 is lifted and lowered.

[0048] Booms 16 are provided above both sides of the movable platform 14. The booms 16 are used to lift the combined fixture 3.

[0049] Please refer to Figure 4As shown, a second roller 2 is rotatably connected to the side of the boom 16 close to the movable platform 14. The second roller 2 is used to assist the movement of the boom 16 and reduce the friction between the boom 16 and the movable platform 14.

[0050] Symmetrically arranged L-shaped plates 21 are connected to the position of the movable platform 14 corresponding to the first rollers 19. The second roller 2 is in contact with the L-shaped plates 21. The L-shaped plates 21 are used to support the second roller 2. With the cooperation of the L-shaped plates 21, the second roller 2 and the movable platform 14, the boom 16 can be driven to lift and lower.

[0051] Symmetrically arranged columns 17 are connected to the position of the frame 1 corresponding to the side of the boom 16 close to the movable platform 14. The boom 16 is slidably connected inside the columns 17. Through the cooperation of the columns 17, the position of the boom 16 can be preliminarily limited.

[0052] Symmetrically arranged engaging plates 18 are connected to the position of the boom 16 close to the columns 17 corresponding to the side of the columns 17 close to the boom 16. The engaging plates 18 are slidably connected to the columns 17. Through the cooperation of the engaging plates 18, the position of the boom 16 can be limited, so that the boom 16 can only move vertically.

[0053] Symmetrically arranged first rollers 19 are rotatably connected to the side of the boom 16 close to the columns 17. The first rollers 19 are in contact with the inner walls of the columns 17. The first rollers 19 are used to reduce the friction between the boom 16 and the columns 17, so that the boom 16 can lift and lower more smoothly.

[0054] Symmetrically arranged limiting grooves 191 are formed at the positions of the columns 17 corresponding to both ends of the first rollers 19. The ends of the first rollers 19 are slidably connected inside the limiting grooves 191. Through the cooperation of the first rollers 19 and the limiting grooves 191, the position of the boom 16 can be limited, so that the boom 16 can only move vertically.

[0055] Please refer to Figure 1 - Figure 3 and Figure 6 - Figure 8 As shown, a combined hanger 3 is suspended below one end of the boom 16 far from the column 17. The combined hanger 3 is used to clamp and fix a circuit board so that the circuit board can be electroplated.

[0056] A hanger support square tube 31 is connected above the combined hanger 3. The hanger support square tube 31 is used to support the combined hanger 3 and at the same time assist the hanger conductive contact head 4 to contact the belt conductive contact head 46, so that the combined hanger 3 is provided with a weak current.

[0057] A hanger conductive contact head 4 is connected to the upper surface of the hanger support square tube 31 close to the frame 1. The hanger conductive contact head 4 is used to assist the combined hanger 3 to be provided with a weak current.

[0058] The frame 1 is connected with a support 41 corresponding to the position of the fixture conductive contact head 4. A pair of symmetrically arranged guide wheels 42 are rotatably connected inside the support 41, and the guide wheels 42 are used to guide the movement of the wire rope 43.

[0059] The wire rope 43 is slidably connected above the inner sides of the two guide wheels 42, and the wire rope 43 is used to connect the first slider 44 and the second slider 45.

[0060] One end of the wire rope 43 close to the fixture conductive contact head 4 is connected with the first slider 44. A belt conductive contact head 46 is connected to the position of the first slider 44 close to the fixture conductive contact head 4. By lowering the fixture conductive contact head 4 to contact the belt conductive contact head 46, the circuit board can be provided with a weak current, thereby protecting the circuit board.

[0061] The belt conductive contact head 46 is located directly below the fixture conductive contact head 4. Through this setting method, after the fixture conductive contact head 4 is lowered, it can be ensured that the fixture conductive contact head 4 contacts the belt conductive contact head 46.

[0062] A bearing 47 is connected to the outside of the belt conductive contact head 46. The bearing 47 is used to reduce the friction between the belt conductive contact head 46 and the fixture conductive contact head 4. When the electric cylinder pushes the combined fixture 3 to move horizontally, the resistance can be reduced, making the combined fixture 3 move more smoothly.

[0063] The other end of the wire rope 43 away from the fixture conductive contact head 4 is connected with the second slider 45. A counterweight 48 is connected to the side of the second slider 45 away from the frame 1. The counterweight 48 is used to lower the second slider 45, so that the first slider 44 and the belt conductive contact head 46 rise.

[0064] The frame 1 is connected with slide rails 49 corresponding to the positions of the first slider 44 and the second slider 45. Both the first slider 44 and the second slider 45 are slidably connected inside the slide rails 49. Through the cooperation of the slide rails 49, the positions of the first slider 44 and the second slider 45 can be limited, so that the first slider 44 and the second slider 45 can only move vertically, preventing the first slider 44 and the second slider 45 from shifting.

[0065] A rectifier 5 is arranged above the slide rails 49 of the frame 1. The rectifier 5 is used to provide current during the electroplating process.

[0066] Please refer to Figure 5 As shown, a cathode carbon brush 6 is connected to the position of the rectifier 5 corresponding to the upper part of the support frame 11. The cathode carbon brush 6 is used to conduct current to the circuit board during the electroplating process of the circuit board, ensuring uniform current distribution.

[0067] An anode titanium mesh 61 is arranged below the cathode carbon brush 6 in the copper tank 12. The anode titanium mesh 61 is used for conducting electricity, electrolyzing copper powder to generate copper ions, and maintaining uniform current distribution.

[0068] It should be noted here that the anodic titanium mesh 61 is used in the copper tank 12 because the anodic titanium mesh 61 will not react with the electroplating solution in the copper tank 12. During use, it can remain stable, will not contaminate the electroplating solution, so that the replacement frequency of the anodic titanium mesh 61 can be reduced during use, and the electroplating cost can be reduced; during the use of the anodic titanium mesh 61, no metal ions or impurities will precipitate, avoiding contamination of the electroplating solution.

[0069] The cathode of the rectifier 5 is connected to the first slider 44 and the second slider 45, and the anode of the rectifier 5 is connected to the anodic titanium mesh 61. Through this setting method, it is ensured that the circuit board can be protected before entering the copper tank 12.

[0070] An anodic support rod 62 is connected at the position corresponding to the anodic titanium mesh 61 in the copper tank 12. The anodic titanium mesh 61 is connected to the anodic support rod 62, and the anodic support rod 62 is used to fix the position of the anodic titanium mesh 61.

[0071] Working principle:

[0072] By starting the oil cylinder 13, the movable platform 14 is lowered under the cooperation of the chain 15. The lowering of the movable platform 14 drives the combined fixture 3 and the fixture conductive contact head 4 to descend. During the descent of the fixture conductive contact head 4, it will contact the belt conductive contact head 46. After the fixture conductive contact head 4 contacts the belt conductive contact head 46, a closed circuit will be formed, making the combined fixture 3 and the circuit board carry a weak current. Thus, when the circuit board enters the copper tank 12, it will have a current protection layer, preventing the electroplating solution in the copper tank 12 from attacking the chemical copper layer on the circuit board, causing via breakage of the circuit board and resulting in poor quality of the circuit board. The current protection layer can protect the circuit board, thus ensuring the quality of the circuit board;

[0073] After the fixture conductive contact head 4 contacts the belt conductive contact head 46, the boom 16 and the fixture conductive contact head 4 will continue to descend. During the descent of the fixture conductive contact head 4, it will drive the belt conductive contact head 46 to descend synchronously. The descent of the belt conductive contact head 46 will drive the first slider 44 to descend. Under the cooperation of the steel wire rope 43 and the guide wheel 42, it will drive the second slider 45 and the counterweight 48 to rise. When the boom 16 drives the combined fixture 3 to descend to the lowest point in the copper tank 12, the circuit board will contact the electroplating solution in the copper tank 12. Before the electroplating of the circuit board starts, the electric cylinder will push the combined fixture 3 forward, making the belt conductive contact head 46 separate from the fixture conductive contact head 4. After the belt conductive contact head 46 separates from the fixture conductive contact head 4, an open circuit will be formed, making the combined fixture 3 and the circuit board no longer carry current. When the circuit board needs to be protected, the circuit board will carry a weak current, and when the circuit board is moving, the circuit board will no longer carry a weak current. Compared with the method of continuously energizing in the copper tank 12, more costs can be saved;

[0074] Since a counterweight 48 is connected to the second slider 45, with the cooperation of the counterweight 48, the guide wheel 42 and the steel wire rope 43, the counterweight 48 will drive the second slider 45 to descend, and the steel wire rope 43 will pull the first slider 44 and the conductive contact head 46 to rise to the initial position, so as to prepare for the next group of circuit board protection, enable continuous electroplating of the circuit board, and will not affect the electroplating efficiency of the circuit board.

[0075] A charged-in-tank electroplating process includes the following steps:

[0076] S1: Start the oil cylinder 13, and with the cooperation of the chain 15, lower the movable platform 14. The lowering of the movable platform 14 drives the combined fixture 3 and the fixture conductive contact head 4 to descend.

[0077] S2: During the descent of the fixture conductive contact head 4, it will contact the conductive contact head 46 with a belt. After the fixture conductive contact head 4 contacts the conductive contact head 46 with a belt, a closed circuit will be formed, causing the combined fixture 3 and the circuit board to carry a weak current.

[0078] S3: After the fixture conductive contact head 4 contacts the conductive contact head 46 with a belt, the boom 16 and the fixture conductive contact head 4 will continue to descend. During the descent of the fixture conductive contact head 4, it will drive the conductive contact head 46 with a belt to descend synchronously. The descent of the conductive contact head 46 with a belt will drive the first slider 44 to descend. With the cooperation of the steel wire rope 43 and the guide wheel 42, it will drive the second slider 45 and the counterweight 48 to rise. When the boom 16 drives the combined fixture 3 to descend into the copper tank 12 and reach the lowest point, the circuit board will contact the electroplating solution in the copper tank 12.

[0079] S4: Before the electroplating of the circuit board starts, the electric cylinder will push the combined fixture 3 forward to separate the conductive contact head 46 with a belt from the fixture conductive contact head 4. After the conductive contact head 46 with a belt is separated from the fixture conductive contact head 4, an open circuit will be formed, causing the combined fixture 3 and the circuit board to no longer carry current.

[0080] S5: With the cooperation of the counterweight 48, the guide wheel 42 and the steel wire rope 43, the counterweight 48 will drive the second slider 45 to descend, and the steel wire rope 43 will pull the first slider 44 and the conductive contact head 46 with a belt to rise to the initial position.

[0081] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0082] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electroplating device with charged cylinder entry, comprising a frame (1); symmetrically arranged support frames (11) are arranged at positions away from the middle inside the frame (1); a copper tank (12) is connected inside the support frames (11); and it is characterized in that: An oil cylinder (13) is arranged inside the frame (1) corresponding to the position between the two support frames (11), a movable platform (14) is arranged inside the frame (1) corresponding to the position above the oil cylinder (13), a chain (15) is arranged between the movable platform (14) and the oil cylinder (13), lifting arms (16) are arranged above both sides of the movable platform (14), a combined hanger (3) is suspended below one end of the lifting arm (16) away from the column (17), a hanger support square pipe (31) is connected above the combined hanger (3), a hanger conductive contact head (4) is connected to the upper surface of the hanger support square pipe (31) near the frame (1), and a support (41) is connected to the frame (1) corresponding to the position of the hanger conductive contact head (4); Symmetrically arranged guide wheels (42) are rotatably connected inside the support (41), a steel wire rope (43) is slidably connected above the inner sides of the two guide wheels (42), one end of the steel wire rope (43) close to the hanger conductive contact head (4) is connected to a first slider (44), a belt conductive contact head (46) is connected to the first slider (44) near the hanger conductive contact head (4), the other end of the steel wire rope (43) away from the hanger conductive contact head (4) is connected to a second slider (45), and a counterweight block (48) is connected to one side of the second slider (45) away from the frame (1); A rectifier (5) is arranged above the frame (1) corresponding to the slide rail (49); the cathode of the rectifier (5) is connected to the first slider (44) and the second slider (45), and the anode of the rectifier (5) is connected to the anode titanium mesh (61).

2. The electroplating device with charged cylinder entry according to claim 1, characterized in that, A cathode carbon brush (6) is connected above the support frame (11) corresponding to the rectifier (5), and an anode titanium mesh (61) is arranged below the cathode carbon brush (6) inside the copper tank (12).

3. The electroplating device for charging into the cylinder according to claim 2, characterized in that, A second roller (2) is rotatably connected to one side of the lifting arm (16) close to the movable platform (14), and symmetrically arranged L-shaped plates (21) are connected to the movable platform (14) corresponding to the position of the first roller (19), and the second roller (2) is in contact with the L-shaped plates (21).

4. The electroplating device with charged cylinder entry according to claim 3, characterized in that, Symmetrically arranged columns (17) are connected inside the frame (1) corresponding to the position of the lifting arm (16) close to the movable platform (14), and the lifting arm (16) is slidably connected inside the columns (17).

5. The electroplating device for charging into the cylinder according to claim 4, characterized in that, Symmetrically arranged clamping plates (18) are connected to one end of the lifting arm (16) close to the movable platform (14) corresponding to the position of the column (17) close to the lifting arm (16), and the clamping plates (18) are slidably connected to the column (17).

6. The electroplating device for charging into the cylinder according to claim 5, wherein, Symmetrically arranged first rollers (19) are rotatably connected to one side of the lifting arm (16) close to the column (17), the first rollers (19) are in contact with the inner wall of the column (17), symmetrically arranged limiting grooves (191) are formed at both ends of the column (17) corresponding to the first rollers (19), and the ends of the first rollers (19) are slidably connected inside the limiting grooves (191).

7. The electroplating device for charging into the cylinder according to claim 6, characterized in that, The said conductive contact head (46) is located directly below the conductive contact head (4) of the hanger.

8. The electroplating device with charged cylinder entry according to claim 7, characterized in that, A bearing (47) is connected to the outside of the said conductive contact head (46).

9. The electroplating device with charged cylinder entry according to claim 8, wherein, The frame (1) is connected with slide rails (49) corresponding to the positions of the first slider (44) and the second slider (45). The first slider (44) and the second slider (45) are both slidably connected within the slide rails (49).

10. A charged-in-tank electroplating process, applicable to a charged-in-tank electroplating device as described in any one of claims 1-9, characterized in that, It includes the following steps: S1: Start the oil cylinder (13), and with the cooperation of the chain (15), lower the movable platform (14). The lowering of the movable platform (14) drives the combined hanger (3) and the conductive contact head (4) of the hanger to descend. S2: During the descent of the conductive contact head (4) of the hanger, it will contact the conductive contact head (46) with a belt. After the conductive contact head (4) of the hanger contacts the conductive contact head (46) with a belt, a closed circuit will be formed, enabling the combined hanger (3) and the circuit board to carry a weak current. S3: After the conductive contact head (4) of the hanger contacts the conductive contact head (46) with a belt, the boom (16) and the conductive contact head (4) of the hanger will continue to descend. During the descent of the conductive contact head (4) of the hanger, it will drive the conductive contact head (46) with a belt to descend synchronously. The descent of the conductive contact head (46) with a belt will drive the first slider (44) to descend. With the cooperation of the wire rope (43) and the guide pulley (42), it will drive the second slider (45) and the counterweight (48) to rise. When the boom (16) drives the combined hanger (3) to descend into the copper tank (12) and reaches the lowest point, the circuit board will contact the electroplating solution in the copper tank (12). S4: Before the electroplating of the circuit board starts, the electric cylinder will push the combined hanger (3) forward to separate the conductive contact head (46) with a belt from the conductive contact head (4) of the hanger. After the conductive contact head (46) with a belt is separated from the conductive contact head (4) of the hanger, an open circuit will be formed, causing the combined hanger (3) and the circuit board to no longer carry current. S5: With the cooperation of the counterweight (48), the guide pulley (42) and the wire rope (43), the counterweight (48) will drive the second slider (45) to descend, and the wire rope (43) will pull the first slider (44) and the conductive contact head (46) with a belt to rise to the initial position.

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