Spectrometer

Abstract

The spectrograph comprises a light source module, a spectrum modulation module, a probe module and a circuit module, the light source module, the spectrum modulation module and the probe module are all connected with the circuit module through electric connecting wires, and the light source module is connected with the spectrum modulation module through a first single-mode optical fiber. The spectrum modulation module is connected with the probe module through a second single-mode optical fiber; the light source module is used for providing an input light signal for the spectrum modulation module through a first single-mode optical fiber under the driving of an electric signal of the circuit module; the spectrum modulation module is used for performing phase modulation on the input optical signal under the driving of the electric signal of the circuit module to obtain a modulated optical signal, and providing the modulated optical signal to the probe module through a second single-mode optical fiber; the probe module is used for detecting an object to be detected according to the modulated light signal to obtain an electric signal and feeding back the electric signal to the circuit module through an electric connecting wire; the circuit module is used for processing the electric signals provided by the probe module to obtain spectrum detection information.

Description

Technical Field

[0001] The present application relates to the technical field of spectrometers, and in particular, to a spectrometer. Background Art

[0002] Near-infrared spectroscopy is an important means of analyzing material composition and is widely used in the fields of rapid detection of material composition and online monitoring of industrial production. In addition, non-invasive detection of human biological information such as blood lactate concentration and blood glucose concentration based on near-infrared spectroscopy is also an emerging detection technology with large-scale application needs.

[0003] With the continuous advancement of spectral analysis technology, spectrometers are gradually developing towards miniaturization, and their integration is also increasing. The computational reconstruction spectrometer based on planar optical waveguide chips is a high-resolution, small-size miniature spectrometer solution that can be widely used in various portable and wearable application scenarios.

[0004] For example, there is currently a spectral sensor module solution that integrates and packages the light source chip, spectral chip, and detector chip through micro-assembly, so that the packaging volume of the spectral sensor module reaches the millimeter level and can be used in smart wearable application scenarios. However, this spectral sensor module solution has serious drawbacks such as poor performance and complex packaging / testing / manufacturing processes.

[0005] Therefore, there is an urgent need for a miniature spectrometer with better performance and simpler packaging / testing / manufacturing process. Summary of the invention

[0006] The present application aims to solve one of the technical problems in the related art to a certain extent. To this end, the present application provides a spectrometer.

[0007] As a first aspect of the present application, a spectrometer is provided, the spectrometer comprising a light source module, a spectrum modulation module, a probe module and a circuit module, wherein the light source module, the spectrum modulation module and the probe module are all connected to the circuit module via electrical connecting wires, the light source module is connected to the spectrum modulation module via a first single-mode optical fiber, and the spectrum modulation module is connected to the probe module via a second single-mode optical fiber;

[0008] The light source module is used to provide an input optical signal to the spectrum modulation module through the first single-mode optical fiber under the drive of the electrical signal of the circuit module;

[0009] The spectrum modulation module is used to, under the drive of the electrical signal of the circuit module, perform phase modulation on the input optical signal to obtain a modulated optical signal, and provide the modulated optical signal to the probe module through the second single-mode optical fiber;

[0010] The probe module is used to detect the object to be detected according to the modulated optical signal to obtain an electrical signal, and feed the electrical signal back to the circuit module through the electrical connection line;

[0011] The circuit module is used to drive the light source module and the spectrum modulation module with electrical signals through the electrical connection line, and to obtain spectrum detection information by processing the electrical signals provided by the probe module.

[0012] Optionally, the spectral module, the spectral modulation module and the probe module are respectively arranged on different electrical adapter boards, and the spectral module, the spectral modulation module and the probe module are electrically connected to the corresponding electrical adapter boards through their respective electrical signal pins, and each electrical adapter board is connected to the circuit module through the electrical connecting line.

[0013] Optionally, at least one of the light source module, the spectrum modulation module and the probe module is packaged together with the circuit module.

[0014] Optionally, the spectrometer also includes a multi-core fiber fan-in module, the light source module includes a single light source chip, the light source module and the spectrum modulation module each include a plurality, each of the light source modules and the spectrum modulation modules are connected one-to-one through each of the first single-mode optical fibers, each of the spectrum modulation modules is connected to the input end of the multi-core fiber fan-in module through each of the second single-mode optical fibers, and the output end of the multi-core fiber fan-in module is connected to the probe module through the second single-mode optical fiber.

[0015] Optionally, the light source module includes a plurality of light source chips packaged together.

[0016] Optionally, the probe module includes a beam converter and a photodetector, the beam converter is used to convert the modulated light signal into an output light signal, the photodetector is used to receive a reflected light signal generated when the output light signal is irradiated on the object to be tested, and obtain the electrical signal based on the reflected light signal.

[0017] Optionally, the beam converter includes an optical fiber and a fiber collimator, and the type of lens in the fiber collimator includes a collimating lens or a self-focusing lens.

[0018] Optionally, the spectrum modulation module includes a spectrum modulation chip, the spectrum modulation chip includes a plurality of cascaded active tunable spectrum units, and the plurality of active tunable spectrum units include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer (MZI).

[0019] Optionally, the spectrum modulation chip further includes a phase modulation structure respectively arranged on each of the active tunable spectrum units;

[0020] The circuit module is also used to perform electrical signal control on each of the phase modulation structures through the electrical connection line;

[0021] The phase modulation structure is used to perform phase modulation on the input optical signal passing through the corresponding active tunable spectrum unit under the control of the electrical signal of the circuit module.

[0022] Optionally, the light source module includes a super luminescent diode (SLED).

[0023] The spectrometer provided in the present application uses a single-mode optical fiber to construct an optical interface, independently encapsulates a light source module, a spectrum modulation module and a probe module, and electrically connects the light source module, the spectrum modulation module and the probe module to the circuit module. At the same time, the light source module and the spectrum modulation module are connected by a first single-mode optical fiber, and the spectrum modulation module and the probe module are connected by a second single-mode optical fiber. In this way, the light source module, the spectrum modulation module and the probe module can be driven and controlled by the circuit module. Through the single-mode optical fiber, the optical signal is transmitted and the electrical signal is fed back through the electrical connection line to complete the spectrum detection of the object to be measured. In addition, the distance between each module is no longer restricted, so that it can be further freely assembled, so that the overall packaging form of the spectrometer is more free, the packaging freedom of the spectrometer can be improved, and the spectrometer can be suitable for various application scenarios of different sizes with different miniaturization requirements of the spectrometer, and the complexity of the packaging / testing / manufacturing process is reduced. In the application scenario where the miniaturization requirements of the portable spectrometer are small, the problem of mutual interference in the packaging process and the problem of thermal crosstalk during use can be avoided, which is conducive to heat dissipation, thereby improving the performance of the spectrometer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present application is further described below in conjunction with the accompanying drawings:

[0025] Figure 1 is a schematic diagram of an implementation of a spectrometer provided in an embodiment of the present application;

[0026] Figure 2 is a schematic diagram of another implementation of the spectrometer provided in the embodiment of the present application;

[0027] Figure 3 It is a schematic diagram of an implementation method in which a plurality of light source modules and a plurality of spectrum modulation modules provided in an embodiment of the present application are connected in a one-to-one correspondence;

[0028] Figure 4 is a schematic diagram of an implementation of a probe module provided in an embodiment of the present application;

[0029] Figure 5is a schematic diagram of another implementation of the probe module provided in the embodiment of the present application;

[0030] Figure 6 Schematic diagram of the architecture of the spectrum modulation chip provided in the embodiment of the present application;

[0031] Figure 7 is a schematic diagram of an implementation of a spectrum modulation chip provided in an embodiment of the present application;

[0032] Figure 8 is a schematic diagram of another implementation of the spectrum modulation chip provided in the embodiment of the present application;

[0033] Fig. 9 It is a schematic diagram of another implementation of the spectral modulation chip provided in the examples of the present application. DETAILED DESCRIPTION

[0034] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments based on the embodiments are intended to be used to explain the present application and cannot be understood as limiting the present application.

[0035] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] In the description of the present invention, unless otherwise specified, “plurality” means two or more, and “several” means one or more.

[0038] References to "one embodiment" or "an example" or "an example" in this specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment itself may be included in at least one embodiment disclosed in the present application. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily refer to the same embodiment.

[0039] Near-infrared spectroscopy is an important means of analyzing material composition and is widely used in the fields of rapid detection of material composition and online monitoring of industrial production. In addition, non-invasive detection of human biological information such as blood lactate concentration and blood glucose concentration based on near-infrared spectroscopy is also an emerging detection technology with large-scale application needs.

[0040] With the continuous advancement of spectral analysis technology, spectrometers are gradually developing towards miniaturization, and their integration is also increasing. The computational reconstruction spectrometer based on planar optical waveguide chips is a high-resolution, small-size miniature spectrometer solution that can be widely used in various portable and wearable application scenarios.

[0041] For example, there is currently a spectral sensor module solution that integrates and packages the light source chip, spectral chip, and detector chip through micro-assembly, so that the packaging volume of the spectral sensor module reaches the millimeter level and can be used in smart wearable application scenarios. However, this spectral sensor module solution has serious drawbacks such as poor performance and complex packaging / testing / manufacturing processes.

[0042] After conducting an in-depth and detailed study on the above-mentioned spectral sensing module solution, the applicant of this application found that although it packages the light source chip, spectral chip, and detector chip together, which can make the packaging volume of the spectral sensing module reach the millimeter level, its poor performance and complex packaging / testing / manufacturing process are serious drawbacks caused by this packaging method. On the one hand, the size of the spectral sensing module is extremely small, so only a smaller heat sink can be used, which is not conducive to heat dissipation and thus not conducive to improving the optical power; on the other hand, the distance between the chips is very close, and there is thermal crosstalk between them, making it difficult to independently and accurately control the temperature of each chip, thereby reducing the signal-to-noise ratio of the sensor; on the other hand, this packaging method must have higher process requirements, making the packaging / testing / manufacturing process more complicated, thereby reducing the manufacturing yield.

[0043] Based on the above key findings, the applicant of this application has innovatively proposed that, compared with wearable application scenarios, most portable application scenarios do not have such extreme requirements for the miniaturization of spectrometers. If the packaging freedom among the light source chip, the spectrum chip, and the detector chip can be improved, the spectrometer can be suitable for various application scenarios with different sizes of spectrometer miniaturization requirements, and the complexity of the packaging / testing / manufacturing process can be reduced. In application scenarios with smaller requirements for miniaturization of spectrometers such as portable ones, it can also avoid mutual interference in the packaging process and thermal crosstalk during use, which is conducive to heat dissipation and thus improves the performance of the spectrometer.

[0044] The applicant of the present application further proposed that a single-mode optical fiber can be used to construct an optical interface, and the light source module, the spectrum modulation module and the probe module can be independently packaged. The light source module, the spectrum modulation module and the probe module are all electrically connected to the circuit module. At the same time, a first single-mode optical fiber is used to connect the light source module and the spectrum modulation module, and a second single-mode optical fiber is used to connect the spectrum modulation module and the probe module. Each module transmits optical signals through a single-mode optical fiber under the control of the circuit module, thereby making the overall packaging form of the spectrometer more flexible.

[0045] As a first aspect of the embodiment of the present application, Figure 1 As shown, a spectrometer is provided, the spectrometer comprising a light source module, a spectrum modulation module, a probe module and a circuit module, wherein the light source module, the spectrum modulation module and the probe module are all connected to the circuit module through electrical connecting lines, the light source module is connected to the spectrum modulation module through a first single-mode optical fiber, and the spectrum modulation module is connected to the probe module through a second single-mode optical fiber;

[0046] The light source module is used to provide an input optical signal to the spectrum modulation module through the first single-mode optical fiber under the drive of the electrical signal of the circuit module;

[0047] The spectrum modulation module is used to, under the drive of the electrical signal of the circuit module, perform phase modulation on the input optical signal to obtain a modulated optical signal, and provide the modulated optical signal to the probe module through the second single-mode optical fiber;

[0048] The probe module is used to detect the object to be detected according to the modulated optical signal to obtain an electrical signal, and feed the electrical signal back to the circuit module through the electrical connection line;

[0049] The circuit module is used to drive the light source module and the spectrum modulation module with electrical signals through the electrical connection line, and to obtain spectrum detection information by processing the electrical signals provided by the probe module.

[0050] It can be understood that "first" and "second" are only used to distinguish the single-mode optical fiber connecting the light source module and the spectrum modulation module from the single-mode optical fiber connecting the spectrum modulation module and the probe module. The embodiment of the present application does not specifically limit whether the specifications and parameters of the first single-mode optical fiber and the second single-mode optical fiber are the same or different.

[0051] It can be understood that the light source module, the spectrum modulation module and the probe module are packaging modules of the light source chip, the spectrum modulation chip and the detector chip respectively, and the spectrum modulation chip can be a planar single-mode optical waveguide chip.

[0052] The wavelength band of the light source provided by the light source module may be determined according to the actual application scenario or the type of the object to be measured, and the embodiments of the present application do not impose any special limitation on this.

[0053] The circuit module may include a driving submodule and a signal processing submodule, wherein the driving submodule specifically implements the electric signal driving of the light source module and the spectrum modulation module through the electrical connection line, and the signal processing submodule specifically implements the processing according to the electric signal provided by the probe module to obtain the spectrum detection information. Moreover, the functions of the circuit module in the embodiment of the present application are not limited to this, and the circuit module may also include other submodules for realizing functions such as temperature control, data transmission, and power management.

[0054] The spectrometer provided in the embodiment of the present application uses a single-mode optical fiber to construct an optical interface, independently encapsulates a light source module, a spectrum modulation module and a probe module, and electrically connects the light source module, the spectrum modulation module and the probe module to the circuit module. At the same time, the light source module and the spectrum modulation module are connected by a first single-mode optical fiber, and the spectrum modulation module and the probe module are connected by a second single-mode optical fiber. In this way, the light source module, the spectrum modulation module and the probe module can transmit optical signals through single-mode optical fibers and feedback electrical signals through electrical connecting wires under the drive and control of the circuit module to complete the spectrum detection of the object to be measured. In addition, the distance between each module is no longer restricted, so that it can be further freely assembled, so that the overall packaging form of the spectrometer is more free, the packaging freedom of the spectrometer can be improved, and the spectrometer can be suitable for various application scenarios with different sizes of spectrometer miniaturization requirements, and the complexity of the packaging / testing / manufacturing process is reduced. In application scenarios where the miniaturization requirements of portable spectrometers are small, the problem of mutual interference in the packaging process and the problem of thermal crosstalk during use can be avoided, which is conducive to heat dissipation and thus improves the performance of the spectrometer.

[0055] The applicant of the present application further proposes that for application scenarios with low requirements for miniaturization of the spectrometer, the spectrum module, spectrum modulation module, probe module and circuit module do not need to be assembled together. In this case, the spectrum module, spectrum modulation module and probe module can be respectively arranged on different electrical adapter boards, and electrically connected to the circuit module through the electrical adapter boards. Accordingly, in some embodiments, such as Figure 2 As shown, the spectral module, the spectral modulation module and the probe module are respectively arranged on different electrical adapter boards, and the spectral module, the spectral modulation module and the probe module are electrically connected to the corresponding electrical adapter boards through their own electrical signal pins, and each electrical adapter board is connected to the circuit module through the electrical connecting line.

[0056] The spectrometer provided in the embodiment of the present application arranges the spectral module, spectral modulation module and probe module on different electrical adapter boards respectively, electrically connects the spectral module, spectral modulation module and probe module to the corresponding electrical adapter boards through their respective electrical signal pins, and connects each electrical adapter board to the circuit module through electrical connecting lines, so that the spectrometer can be suitable for application scenarios with low requirements for miniaturization of the spectrometer, reduces the complexity of the packaging / testing / manufacturing process, avoids mutual interference problems in the packaging process and thermal crosstalk problems during use, is conducive to heat dissipation, and thus improves the performance of the spectrometer.

[0057] The applicant of the present application further proposes that for application scenarios with high requirements for miniaturization of the spectrometer, part or all of the light source module, the spectrum modulation module, and the probe module can be directly packaged together with the circuit module. Accordingly, in some embodiments, at least one of the light source module, the spectrum modulation module, and the probe module is packaged together with the circuit module.

[0058] Among them, for the modules in the light source module, spectral modulation module and probe module that are not packaged together with the circuit module, they can be set on the electrical adapter board, their electrical signal pins can be electrically connected to the electrical adapter board, and the electrical adapter board can be connected to the circuit module through electrical connecting lines.

[0059] The spectrometer provided in the embodiment of the present application packages at least one of the light source module, the spectral modulation module and the probe module together with the circuit module, so that the spectrometer can be suitable for application scenarios with high requirements for miniaturization of the spectrometer, and can take into account the requirements for miniaturization of the spectrometer, reduce the complexity of the packaging / testing / manufacturing process, and improve the performance of the spectrometer.

[0060] The applicant of the present application further proposes that, in order to improve the spectral modulation effect, the light source module and the spectral modulation module may include multiple modules, and each light source module and each spectral modulation module are connected one by one through each first single-mode optical fiber. Accordingly, in some embodiments, the spectrometer further includes a multi-core optical fiber fan-in module, the light source module includes a single light source chip, and the light source module and the spectral modulation module each include multiple modules, such as Figure 3 As shown, each of the light source modules and each of the spectral modulation modules are connected one-to-one through each of the first single-mode optical fibers, each of the spectral modulation modules is connected to the input end of the multi-core optical fiber fan-in module through each of the second single-mode optical fibers, and the output end of the multi-core optical fiber fan-in module is connected to the probe module through the second single-mode optical fiber.

[0061] The applicant of the present application also proposes that, in addition to packaging a single light source chip as a light source module and using multiple light source modules and multiple spectrum modulation modules, packaging multiple light source chips together as a light source module and providing an input optical signal to a single spectrum modulation module through a single first single-mode optical fiber can also achieve an improved spectrum modulation effect. Accordingly, in some embodiments, the light source module includes multiple light source chips packaged together.

[0062] The applicant of the present application further proposes that, in addition to the photodetector, the probe module can also use a beam converter to change the spatial distribution of the light beam so as to adapt to various application scenarios requiring the directionality of the light beam. Accordingly, in some embodiments, the probe module includes a beam converter and a photodetector, the beam converter is used to convert the modulated light signal into an output light signal, and the photodetector is used to receive the reflected light signal generated by the output light signal irradiating the object to be tested, and convert the reflected light signal into the electrical signal.

[0063] In the embodiments of the present application, for application scenarios with low requirements on the directionality of the light beam, optical fiber can be used for direct irradiation, that is, the optical fiber can be directly used as a light beam converter.

[0064] For application scenarios with higher requirements on beam directionality, such as application scenarios with requirements for collimation, beam expansion, etc., a fiber collimator can also be used, and the type of lens in the fiber collimator can include a collimating lens or a self-focusing lens (Grinlens). Accordingly, in some embodiments, the beam converter includes an optical fiber and a fiber collimator, and the type of lens in the fiber collimator includes a collimating lens or a self-focusing lens.

[0065] like Figure 4The figure shows a schematic diagram of an implementation of the probe module provided in the embodiment of the present application, wherein the probe module includes a beam converter and a photodetector, the beam converter includes an optical fiber and a fiber collimator, and the type of lens in the fiber collimator includes a collimating lens. The modulated light signal enters the fiber collimator via the optical fiber, is output after being collimated by the collimating lens, and is irradiated to the surface of the object to be measured to generate a reflected light signal, and the photodetector receives the reflected light signal and converts it into an electrical signal.

[0066] like Figure 5 As shown, it is a schematic diagram of another embodiment of the probe module provided in the embodiment of the present application, wherein the probe module includes a beam converter and a photodetector, the beam converter includes an optical fiber and a fiber collimator, and the type of lens in the fiber collimator includes a self-focusing lens. The modulated light signal enters the fiber collimator via the optical fiber, is output after being refracted by the self-focusing lens, and is irradiated to the surface of the object to be measured to generate a reflected light signal, and the photodetector receives the reflected light signal and converts it to obtain an electrical signal.

[0067] It should be noted that Figure 4 , Figure 5 What is shown is only an exemplary description. The embodiment of the present application is not limited to the number of photoelectric detectors in the probe module being 2, and can be specifically set according to the actual application scenario.

[0068] like Figure 6 As shown, in some embodiments, the spectral modulation module includes a spectral modulation chip, and the spectral modulation chip includes a plurality of cascaded active tunable spectral units, and the plurality of active tunable spectral units include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer MZI.

[0069] In some embodiments, the spectral modulation chip also includes a phase modulation structure respectively arranged on each of the active tunable spectral units; the circuit module is also used to perform electrical signal control on each of the phase modulation structures through the electrical connection line; the phase modulation structure is used to phase modulate the input optical signal passing through the corresponding active tunable spectral unit under the electrical signal control of the circuit module.

[0070] like Figure 7 As shown, it is a schematic diagram of an implementation of the spectral modulation chip provided in an embodiment of the present application, wherein four Mach-Zehnder interferometers MZI are cascaded in the spectral modulation chip, and two phase modulation structures are arranged on each Mach-Zehnder interferometer MZI.

[0071] like Figure 8As shown, it is a schematic diagram of another implementation of the spectral modulation chip provided in an embodiment of the present application, wherein three Mach-Zehnder interferometers MZI and one microring resonator are cascaded in the spectral modulation chip, and two phase modulation structures are arranged on each Mach-Zehnder interferometer MZI, and one phase modulation structure is arranged on each microring resonator.

[0072] like Fig. 9 As shown, it is a schematic diagram of another implementation of the spectral modulation chip provided in the embodiment of the present application, wherein four micro-ring resonators are cascaded in the spectral modulation chip, and a phase modulation structure is arranged on each micro-ring resonator.

[0073] It can be seen that the embodiment of the present application does not impose any special limitation on the number of phase modulation structures provided on each active tunable spectrum unit, and the number may be 1 or 2.

[0074] It should be noted that Figure 6 , Figure 7 , Figure 8 , Fig. 9 What is shown is only an exemplary description. The embodiments of the present application are not limited to the number of multiple active tunable spectral units cascaded in the spectral modulation chip being 3 or 4, and can be specifically set according to the modulation principle actually required by the spectrometer.

[0075] In some embodiments, the light source module includes a superluminescent diode (SLED).

[0076] The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Those skilled in the art should understand that the present application includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification that does not deviate from the functional and structural principles of the present application will be included in the scope of the claims.

Claims

1. A spectrometer, comprising a light source module, a spectrum modulation module, a probe module and a circuit module, characterized in that: The light source module, the spectrum modulation module and the probe module are all connected to the circuit module through electrical connection lines, the light source module is connected to the spectrum modulation module through a first single-mode optical fiber, and the spectrum modulation module is connected to the probe module through a second single-mode optical fiber; The light source module is used to provide an input optical signal to the spectrum modulation module through the first single-mode optical fiber under the drive of the electrical signal of the circuit module; The spectrum modulation module is used to, under the drive of the electrical signal of the circuit module, perform phase modulation on the input optical signal to obtain a modulated optical signal, and provide the modulated optical signal to the probe module through the second single-mode optical fiber; The probe module is used to detect the object to be detected according to the modulated optical signal to obtain an electrical signal, and feed the electrical signal back to the circuit module through the electrical connection line; The circuit module is used to drive the light source module and the spectrum modulation module with electrical signals through the electrical connection line, and to obtain spectrum detection information by processing the electrical signals provided by the probe module.

2. The spectrometer according to claim 1, characterized in that The spectral module, the spectral modulation module and the probe module are respectively arranged on different electrical adapter boards, and the spectral module, the spectral modulation module and the probe module are electrically connected to the corresponding electrical adapter boards through their respective electrical signal pins, and each electrical adapter board is connected to the circuit module through the electrical connecting line.

3. The spectrometer according to claim 1, characterized in that At least one of the light source module, the spectrum modulation module and the probe module is packaged together with the circuit module.

4. The spectrometer according to claim 1, characterized in that The spectrometer also includes a multi-core fiber fan-in module, the light source module includes a single light source chip, the light source module and the spectrum modulation module each include a plurality, each of the light source modules and the spectrum modulation modules are connected one-to-one through each of the first single-mode optical fibers, each of the spectrum modulation modules is connected to the input end of the multi-core fiber fan-in module through each of the second single-mode optical fibers, and the output end of the multi-core fiber fan-in module is connected to the probe module through the second single-mode optical fiber.

5. The spectrometer according to claim 1, characterized in that: The light source module includes a plurality of light source chips packaged together.

6. The spectrometer according to any one of claims 1 to 5, characterized in that: The probe module includes a beam converter and a photodetector. The beam converter is used to convert the modulated light signal into an output light signal. The photodetector is used to receive a reflected light signal generated when the output light signal is irradiated onto the object to be tested, and obtain the electrical signal based on the reflected light signal.

7. The spectrometer according to claim 6, characterized in that The beam converter comprises an optical fiber and an optical fiber collimator. The type of lens in the optical fiber collimator comprises a collimating lens or a self-focusing lens.

8. The spectrometer according to any one of claims 1 to 5, characterized in that: The spectrum modulation module comprises a spectrum modulation chip, and the spectrum modulation chip comprises a plurality of cascaded active tunable spectrum units, and the plurality of active tunable spectrum units comprise any one of the following or a combination thereof: a microring resonator, and a Mach-Zehnder interferometer (MZI).

9. The spectrometer according to claim 8, characterized in that The spectrum modulation chip further includes a phase modulation structure respectively arranged on each of the active tunable spectrum units; The circuit module is also used to perform electrical signal control on each of the phase modulation structures through the electrical connection line; The phase modulation structure is used to perform phase modulation on the input optical signal passing through the corresponding active tunable spectrum unit under the control of the electrical signal of the circuit module.

10. The spectrometer according to any one of claims 1 to 5, characterized in that: The light source module includes a super luminescent diode (SLED).

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