Module assembly type test socket

Abstract

The present invention relates to a module-assembled test socket in which a plurality of socket modules are assembled into one test socket, in each of the socket modules, a frame supports anisotropic conductive sheets, and a coupling protrusion and a coupling groove are formed in the frame. The plurality of socket modules are coupled to form a test socket by sequentially assembling the coupling groove portions of the other adjacent socket modules to the coupling protrusion portions of the socket modules.

Description

Technical Field

[0001] The present invention relates to a test socket, and more particularly to a module assembly type test socket for connecting electronic components such as semiconductor packages to transmit electrical signals. Background Art

[0002] Currently, in various fields such as the electronics industry and the semiconductor industry, various connectors for transmitting electrical signals are being used.

[0003] The manufacturing process of semiconductor equipment includes pre-process, post-process and testing process, wherein the testing process is used to test whether the semiconductor equipment is working properly, so as to select high-quality products and defective products.

[0004] One of the key components used in the testing process is the so-called test socket, i.e., the test socket. The test socket is installed on a printed circuit board electrically connected to a tester for integrated circuit testing, and is used to check semiconductor devices. The test socket has a contact pin that electrically connects the terminal (lead) of the semiconductor device to the terminal of the printed circuit board. The tester generates an electrical signal for testing the semiconductor device to be connected to the test socket, and after outputting it to the semiconductor device, the electrical signal input through the semiconductor device is used to test whether the semiconductor device is working properly, and the semiconductor device is determined to be a good product or a defective product based on the result.

[0005] Representative types of test sockets include pogo pin sockets and rubber sockets.

[0006] Pogo pin sockets are made by assembling separately manufactured pogo pins into a housing. Due to problems such as package ball damage and cost increase, the demand for rubber sockets has increased recently in semiconductor testing processes compared to pogo pin sockets.

[0007] The rubber socket has the following structure, that is, the conductive part is arranged inside the insulating part composed of elastic material such as silicon, so that they are insulated from each other, and the conductive part is in the form of a plurality of conductive particles contained inside the elastic material such as silicon. This rubber socket has the following advantages, that is, the characteristic of the rubber socket is that it has conductivity only in the thickness direction, and since mechanical means such as welding or springs are not used, it has good durability and can achieve simple electrical connection. In addition, since it can absorb mechanical shock or deformation, it can achieve flexible connection with semiconductor equipment, etc.

[0008] Figure 1 This is a perspective view showing a conventional rubber socket-type test socket used in a semiconductor device test process. Figure 2 The figure is a cross-sectional view briefly showing a conventional test socket.

[0009] Figure 1 and Figure 2 The test socket 40 shown includes: an isotropic conductive sheet 20, including a plurality of conductive parts 22 and an insulating part 21, wherein the conductive parts 22 are in contact with the terminals 11 of the device to be tested 10, and the insulating part 21 is used to support and insulate the plurality of conductive parts 22 in a manner that the conductive parts 22 are spaced apart from each other; and a frame 30, which is used to support the isotropic conductive sheet 20 at the supporting part 31. The conductive part 22 is in the form of a plurality of conductive particles contained in an elastic insulating material, and the insulating part 21 is composed of an elastic insulating material. This test socket 40 is installed in a tester 50, and if the device to be tested 10 is pressurized by a pressurizing device (not shown), the terminal 11 of the device to be tested applies pressure to the upper end of the elastic conductive part 22, so that the conductive part 22 becomes an energized state that can be energized, and the pad 51 of the tester 50 is electrically connected to the terminal 11 of the device to be tested 10 by contacting the lower end of the conductive part 22 with the pad 51 of the tester 50, so that the tester transmits the test signal to the device to be tested, so that the device to be tested can be tested.

[0010] As such, the conventional test socket 40 composed of a rubber socket is manufactured by integrally molding the hetero-conductive sheet 20 and the frame 30, in which one conductive portion 22 is structurally connected to an adjacent conductive portion 22 via the insulating portion 21. Therefore, when the conductive portion 22 of a specific portion of the test socket is damaged due to high resistance, damage, etc., the entire test socket needs to be replaced, which increases the manufacturing cost, thereby increasing the manufacturing time required for replacement and reducing the efficiency of the test process.

[0011] In addition, the height of the terminal 11 of the device to be inspected 10 may vary due to tolerance, and the device to be inspected 10 with a relatively large area or a relatively thin package may have a middle portion that is tilted upward relative to the edge after manufacturing, or may be slightly twisted in other forms. Figure 2 FIG. 4 exemplarily shows a state in which the middle portion of the device to be inspected 10 is tilted upward.

[0012] Therefore, in the testing process of the device to be tested 10 in which there is a height difference between the terminals 11 of the device to be tested, if the device to be tested 10 applies pressure to the test socket 40 which is manufactured by integrally forming the hetero-conductive sheet 20 and the frame 30, the conductive part 22 in contact with the terminal 11 of the device to be tested will be compressed, while the other parts will not be compressed and will maintain the existing height or try to expand. Therefore, there are different degrees of compression according to the height of the terminal 11, so that concentrated stress is generated at the upper end of the conductive part 22 which is subjected to relatively large pressure. If this phenomenon occurs repeatedly, the conductive part 22 which generates concentrated stress will be damaged, thereby causing the problem of shortening the service life of the test socket 40.

[0013] Furthermore, when the height difference of the terminals 11 of the device to be inspected is large, it is difficult to adjust the compression degree of each of the conductive parts 22 according to the height difference of the terminals 11. Figure 2 As exemplarily shown in part (b), in the "A" part where the terminal 11 and the conductive part 22 first come into contact, although the terminal 11 and the conductive part 22 are in contact, in the "B" part, there is a problem of poor contact due to the lack of contact between the terminal 11 and the conductive part 22.

[0014] Prior art literature

[0015] Patent Literature

[0016] Patent Document 0001: Korean Patent Publication No. 2006-0062824 (June 12, 2006) Summary of the invention

[0017] The present invention is proposed in view of the above problems, and an object of the present invention is to provide a modular assembly type test socket that can partially replace a test socket and can work stably even when there is a height difference between terminals of a device to be tested.

[0018] The modular assembly test socket formed by combining a plurality of socket modules of the present invention for solving the above-mentioned purpose is characterized in that each square socket module comprises: an anisotropic conductive sheet formed into a square at a corner portion of one side, comprising a conductive portion and an insulating portion, wherein the conductive portion is in the form of a plurality of conductive particles contained in an elastic insulating material, and the insulating portion is used to support and insulate the conductive portions; a frame in the form of a flat plate, used to support two adjacent side surfaces of the anisotropic conductive sheet; a coupling protrusion formed at the corner portion of the frame adjacent to the one side corner, having a coupling protrusion; and a coupling groove formed by protruding from the frame at the other corner portion adjacent to the one side corner, having a coupling groove, wherein the plurality of the socket modules are composed of a first socket module, a second socket module, a third socket module and a fourth socket module in a clockwise direction, wherein the coupling protrusion and the coupling groove are arranged at positions corresponding to each other, and the adjacent plurality of the socket modules are combined by an assembly method in which the coupling groove is buckled onto the coupling protrusion, so that the other side surfaces of the anisotropic conductive sheet are in contact with each other.

[0019] The thickness of the insulating portion of at least one of the socket modules may be different from the thickness of the insulating portions of the other socket modules.

[0020] The thickness of the conductive portion of at least one of the socket modules may be different from the thickness of the conductive portions of the other socket modules.

[0021] The frames of the first socket module and the third socket module and the frames of the second socket module and the fourth socket module may have the same shape.

[0022] The thickness of a portion where the coupling protrusion and the coupling groove are coupled may be the same as the thickness of the frame.

[0023] A tray may be combined at the lower side of the plurality of frames. The tray is square in shape and has an edge formed around it for supporting the plurality of frames.

[0024] The side surface to which the plurality of anisotropic conductive sheets are in contact may be wavy.

[0025] In the modular assembly test socket of the present invention, a plurality of socket modules are assembled into one test socket, and only a damaged socket module can be replaced with a new socket module for use, thereby reducing the manufacturing cost of the test socket and significantly reducing the test cost of semiconductor packaging.

[0026] Furthermore, in the modular assembly test socket of the present invention, replaceable socket modules can be manufactured and prepared in advance, so damaged socket modules can be quickly replaced, thereby shortening the manufacturing period required for manufacturing new test sockets and improving the efficiency of the test process.

[0027] Furthermore, in the modular assembly test socket of the present invention, even in a test process where there is a height difference between the terminals of the device to be tested, a socket module having a conductive portion thickness corresponding to the height of the terminals can be provided, so that the conductive portion of the terminals located at a lower height can be prevented from being damaged by concentrated stress, thereby increasing the service life of the test socket, and poor contact caused by the terminals located at a higher height not properly contacting the conductive portion can be prevented, thereby improving the accuracy of the test.

[0028] Furthermore, in the modular assembly test socket of the present invention, in a hybrid device to be tested having both ball grid array (BGA) terminals and land grid array (LGA) terminals, a socket module having a conductive portion having a thickness corresponding to the terminal is provided, so that a stable connection can be achieved without causing poor contact, thereby improving the accuracy of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. 1 is a perspective view showing a conventional test socket.

[0030] Figure 2 The present invention is a cross-sectional view schematically showing a test process using a conventional test socket.

[0031] Figure 3 FIG. 1 is a diagram showing a plurality of socket modules according to an embodiment of the present invention.

[0032] Figure 4 FIG. 1 is a diagram showing a module-assembled test socket formed by assembling a plurality of socket modules according to an embodiment of the present invention.

[0033] Figure 5 FIG. 1 is a diagram showing a module assembly type test socket supported by a tray according to an embodiment of the present invention.

[0034] Figure 6 The figure shows a modified example of the side shape of a plurality of hetero-conductive sheets in contact with each other in a module assembly type test socket according to an embodiment of the present invention.

[0035] Figure 7 A diagram illustrating a process of replacing a damaged socket module according to an embodiment of the present invention.

[0036] Figure 8 The figure shows that a modular assembly type test socket according to an embodiment of the present invention is applied to a device to be tested whose terminals have height differences.

[0037] Fig. 9 The figure shows that a modular assembly type test socket according to an embodiment of the present invention is applied to a hybrid device under test having both ball grid array package terminals and land grid array package terminals.

[0038] Description of Reference Numerals

[0039] 10: Equipment to be inspected 11: Terminal

[0040] 20, 110, 210, 310, 410: Anisotropic conductive sheets

[0041] 21, 112, 351, 361: Insulation

[0042] 22, 111, 151, 251, 261, 352, 362: Conductive part

[0043] 30, 120, 220, 320, 420: Frame

[0044] 40, 500, 600: test socket

[0045] 50: Tester 51: Pad

[0046] 100: First socket module

[0047] 130, 230, 330, 430: Joint protrusion

[0048] 131: coupling protrusion 140: coupling groove

[0049] 141: Combination slot 200: Second socket module

[0050] 300: third socket module 400: fourth socket module

[0051] 550: Pallet DETAILED DESCRIPTION

[0052] Hereinafter, a modular assembly type test socket according to the present invention will be described in detail with reference to the accompanying drawings.

[0053] In the present invention, the device to be tested is located on the upper side of the test socket, and the tester is located on the lower side. Therefore, the "upper surface", "upper face", "upper side", "upper end", "lower surface", "lower face", "lower side", "lower end", etc. of certain structural elements will be described based on this. In addition, the same reference numerals are used for the same structural elements, and their descriptions are omitted.

[0054] Figure 3 FIG. 2 is a diagram showing a plurality of socket modules according to an embodiment of the present invention. Figure 4 FIG. 1 is a diagram showing a module-assembled test socket formed by assembling a plurality of socket modules according to an embodiment of the present invention.

[0055] As shown in the figure, a modular assembly test socket 500 of an embodiment of the present invention is formed by combining a plurality of socket modules, and is characterized in that each socket module in a square shape comprises: an anisotropic conductive sheet 110, which is formed into a square shape at a corner portion of one side, and comprises a conductive portion 111 and an edge portion 112, wherein the conductive portion 111 is in the form of a plurality of conductive particles contained in an elastic insulating material, and the insulating portion 112 is used to support and insulate the conductive portions; a frame 120, which is in the form of a flat plate, and is used to support two adjacent side surfaces of the anisotropic conductive sheet; a coupling protrusion 130, which is formed at a corner portion adjacent to one side; The frame of the corner part has a coupling protrusion 131; and a coupling groove part 140, which is protruded by the frame at the other corner part adjacent to one side corner, and has a coupling groove 141. The multiple socket modules are composed of a first socket module 100, a second socket module 200, a third socket module 300 and a fourth socket module 400 in a clockwise direction. The coupling protrusion and the coupling groove are arranged at corresponding positions. The adjacent multiple socket modules are combined by an assembly method of buckling the coupling groove part 140 onto the coupling protrusion part 130, so that the other side surfaces of the hetero-conductive sheets are in contact with each other.

[0056] In this test socket 500, the upper side of the conductive part 111 is connected to the terminal 11 of the device to be tested, and the lower side of the conductive part 111 is connected to the pad 51 of the tester to transmit electrical signals, so that the device to be tested can be checked by the tester, or the device to be tested can be electrically connected to various electronic devices to transmit electrical signals. In the following, the modular assembly type test socket 500 of one embodiment of the present invention is installed in the tester and performs the function of transmitting electrical signals between the tester and the device to be tested.

[0057] The plurality of socket modules include a first socket module 100, a second socket module 200, a third socket module 300 and a fourth socket module 400 in a clockwise direction. If the first socket module 100 to the fourth socket module 400 are assembled, the following can be completed: Figure 1 A test socket is shown.

[0058] Each socket module is roughly square in shape. The shapes of the multiple socket modules may differ to some extent according to the installation positions. However, since they have the same structural elements, the first socket module 100 will be taken as an example for description below.

[0059] The first socket module 100 includes an isotropic conductive sheet 110 and a frame 120 for supporting the isotropic conductive sheet.

[0060] The anisotropic conductive sheet 110 is formed into a square at one corner of the socket module, and includes a conductive portion 111 and an insulating portion 112. The conductive portion 111 is in the form of a plurality of conductive particles contained in an elastic insulating material, and the insulating portion 112 is used to support and insulate the conductive portions.

[0061] The conductive part 111 may be in the form of a plurality of conductive particles arranged in the elastic insulating material along the vertical direction of the conductive part, that is, arranged along the thickness direction, so that the upper end can be connected to the terminal 11 of the device to be tested 10, and the lower end is connected to the pad 51 of the tester 50. The conductive part 111 is formed at positions corresponding to the terminals 11, and the terminals 11 are arranged at positions corresponding to the plurality of devices to be tested 10 that are connected.

[0062] The elastic insulating material constituting the conductive part 111 can be a heat-resistant polymer material with a cross-linked structure, for example, silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer rubber, polyurethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, soft liquid epoxy resin rubber, etc.

[0063] Furthermore, the conductive particles constituting the conductive part 111 may be magnetic so as to be able to react by a magnetic field. For example, magnetic metal particles such as iron, nickel, and cobalt, or their alloy particles, or particles containing these metals, or these particles as core particles and the surface of the core particles is plated with a metal with good conductivity such as gold, silver, palladium, and rhodium, or inorganic material particles such as non-magnetic metal ions, glass beads, and polymer particles as core particles and the surface of the core particles is plated with a conductive magnet such as nickel and cobalt, or the core particles are plated with a conductive magnet and a metal with good conductivity, etc. to be used as conductive particles.

[0064] The conductive part 111 may have a shape that protrudes downward more than the lower surface of the insulating part 112 described later, so as to be more easily connected to the pad 51 of the tester. In addition, the conductive part 111 may have a portion that protrudes upward more than the upper surface of the insulating part 112 (see Fig. 9 The conductive portion 111 may be provided with a protruding shape on both the upper and lower surfaces of the insulating portion 112, so as to be more easily connected to the terminal 11 of the device to be inspected in the form of a land grid array package (LGA).

[0065] The insulating portion 112 is used to insulate and support the conductive portion 111, and is formed of an elastic insulating material and constitutes the appearance of the heterogeneous conductive sheet, and plays a supporting role when the conductive portion 111 is subjected to a contact load. The elastic insulating material constituting the insulating portion 112 may be the same as the elastic insulating material constituting the conductive portion 111. The heterogeneous conductive sheet 110 is provided with the conductive portion 111 inside the insulating portion 112, and can be supported by the support portion 121 provided on the frame 120.

[0066] Moreover, in at least one socket module, the thickness of the conductive part (i.e., the length in the vertical direction) may be different from the thickness of the conductive part of other socket modules. This is because when there is a difference in the height of the terminals of the device to be inspected, the thickness of the conductive part corresponding to the terminal at a higher position increases, and the thickness of the conductive part corresponding to the terminal at a lower position decreases, so as to prevent a part of the conductive part from being subjected to excessive compression force or poor contact due to the height difference of the terminals of the device to be inspected, thereby ensuring that the conductive part is in stable contact with the terminal.

[0067] Furthermore, in at least one socket module, the thickness of the insulating portion may be different from the thickness of the insulating portion of the other socket modules. For example, when the thickness of the conductive portion needs to be quite large, if the thickness of the insulating portion is unchanged, the conductive portion may protrude excessively from the insulating portion, resulting in reduced durability of the conductive portion, but if the thickness of the insulating portion is increased in proportion to the thickness of the conductive portion, a conductive portion having a sufficient thickness can be stably formed within the insulating portion while a portion of it protrudes, thereby preventing the durability of the conductive portion from being reduced.

[0068] The frame 120 is used to support the anisotropic conductive sheet 110 and to arrange the test socket on the tester when the test socket is installed on the tester. The frame 120 is in the shape of a plate and is used to support two adjacent side surfaces of the anisotropic conductive sheet 110 .

[0069] The frame 120 may be made of a non-elastic insulating material or a metal material. Engineering plastics such as polyimide or other non-elastic insulating materials may be used as the non-elastic insulating material, and aluminum, stainless steel (SUS), iron, nickel and other materials may be used as the metal material.

[0070] The frame 120 is provided with a coupling protrusion 130 and a coupling groove 140 for assembling with another socket module.

[0071] The coupling protrusion 130 is formed on the frame 120 at the corner portion adjacent to the corner portion of one side where the hetero-conductive thin sheet 110 is supported. The coupling protrusion 130 is in the form of a coupling protrusion 131 protruding from the frame 120 thinned by cutting the upper surface of the frame 120 by a predetermined thickness. The coupling protrusion 130 can be cut by cutting means such as laser to cut off the portion other than the portion where the coupling protrusion 131 is to be formed on the frame 120. Therefore, the overall thickness of the coupling protrusion 130 (i.e., the thickness from the lower surface of the frame to the upper surface of the coupling protrusion) is the same as the thickness of the frame 120.

[0072] The coupling groove portion 140 and the other corner portions adjacent to the corner portion on one side supported by the hetero-conductive thin sheet 110 are formed by protrusion of the frame 120. The coupling groove portion 140 is in the form of a frame thinned by cutting the lower surface of the protruding portion by a predetermined thickness and penetrated by the coupling groove 141. The coupling groove portion 140 can be formed by cutting the lower surface of the frame by cutting means such as laser and then penetrating to form the coupling groove 141. When the coupling protrusion portion 130 is coupled to the coupling groove portion 140, the coupling groove 141 is formed at a position corresponding to the coupling protrusion 131 in the adjacent socket module, so that the coupling groove 141 is accurately buckled to the coupling protrusion 131.

[0073] The thickness of the remaining frame portion in the combining groove portion 140 is the same as the thickness of the frame portion cut off in the combining protrusion portion 130, and the combining protrusion portion 130 and the combining groove portion 140 have corresponding sizes. Therefore, when the combining groove portion 140 is combined with the combining protrusion portion 130, the combining groove portion 140 is precisely buckled into the combining protrusion portion 130, and the thickness of the combined portion is the same as the thickness of the frame 120.

[0074] Although the second socket module 200 has the same structural elements as the first socket module 100, there are the following differences compared with the first socket module 100, namely, a hetero-conductive sheet 210 is formed in the portion connected to the hetero-conductive sheet 110 of the first socket module 100, a coupling protrusion 230 is formed in the portion connected to the coupling groove 140 of the first socket module 100, and a coupling groove 240 is formed in the portion connected to the third socket module 300.

[0075] The third socket module 300 has the same structural elements as the first socket module 100 , and the frames of the two socket modules may have the same shape.

[0076] Furthermore, the fourth socket module 400 has the same structural elements as the second socket module 200 , and the frames of the second socket module 200 and the fourth socket module 400 may have the same shape.

[0077] like Figure 3 and Figure 4 As shown, the adjacent multiple socket modules are connected to each other by buckling the coupling grooves of other socket modules to the coupling protrusions of one socket module while the other side surfaces of the heterogeneous conductive sheet are in contact with each other. For example, the adjacent multiple socket modules can be connected by making the other side surfaces 115 of the heterogeneous conductive sheet that are not coupled to the frame contact each other, and then assembling the coupling protrusion 230 of the second socket module 200 to the coupling groove 140 of the first socket module 100, assembling the coupling protrusion 330 of the third socket module 300 to the coupling groove 240 of the second socket module 200, assembling the coupling protrusion 430 of the fourth socket module 400 to the coupling groove 340 of the third socket module 300, and assembling the coupling protrusion 130 of the first socket module 100 to the coupling groove 440 of the fourth socket module 400, so as to complete a test socket 500. It is obvious to those skilled in the art that the assembly sequence is not limited to the above description.

[0078] Figure 5 FIG. 6 is a diagram showing a modular assembly type test socket 600 supported by a tray according to an embodiment of the present invention. Figure 5 Part (a) is a diagram showing a state before a plurality of socket modules and a tray are assembled. Figure 5Part (b) is a diagram showing a plurality of socket modules and a tray assembled into a test socket.

[0079] As shown in the figure, the tray 550 is square and has an edge portion 552 formed around it. The edge portion 552 of the tray 550 is combined with the lower side of the frame of the plurality of socket modules to fix the shape of the plurality of frames and perform a supporting function. The tray 550 can be made of a non-elastic insulating material or a metal material, and can be made of the same material as the frame.

[0080] In the module assembly type test socket 600 combined with the tray, the tray 550 is arranged and combined on the lower side of the module assembly type test socket 500 as described above. The test socket 500 and the tray 550 can be combined as follows. A frame combination hole 151 is formed in the frame of each socket module, and a tray combination hole 551 is formed at a position corresponding to the tray 550, and the above-mentioned multiple combination holes are combined using screws or the like. In addition to these combination methods, various methods can also be used.

[0081] The test socket 600 can more firmly support a plurality of assembly-type frames by additionally adopting the tray 550 , and thus can be used without separating the module assembly-type test sockets, thereby further improving the durability of the test socket.

[0082] Figure 6 The figure shows a modified example of the side shape of a plurality of hetero-conductive sheets in contact with each other in a module assembly type test socket according to an embodiment of the present invention.

[0083] In the module assembly type test socket 500 as described above, the surface 115 where the opposite conductive sheets provided in each socket module contact each other is in a planar form. Figure 7 As shown, the contacting surface 115 of the heterogeneous conductive sheets arranged in each socket module can be formed into a wave shape, so that the multiple heterogeneous conductive sheets can be firmly combined with each other. If the multiple heterogeneous conductive sheets can be firmly combined with each other, they can also be formed into a zigzag shape or other various shapes.

[0084] The modular assembly test socket of an embodiment of the present invention can be effectively applied in various situations. In the following, for the convenience of description, a cross-sectional view of a test socket is used as an example for description, and therefore, only a part of the socket module is shown.

[0085] Figure 7 The figure shows the process of replacing a damaged socket module according to one embodiment of the present invention. During the use of the modular assembly test socket, if a part of the conductive part is damaged due to concentrated stress or the like, resulting in increased resistance, etc., only the socket module including the conductive part can be replaced for use.

[0086] As shown in the figure, for example, in the test socket formed by assembling the socket module 150 and the socket module 160, if the partial conductive part 151 formed in the socket module 150 is damaged, then unlike the existing practice, it is not necessary to replace the entire test socket, but only the damaged socket module 150 can be separated, and the pre-manufactured new socket module 170 can be assembled on the corresponding part, and the test socket formed by assembling the replaced socket module 170 and the previous socket module 160 can be used for testing.

[0087] Therefore, in the test socket of an embodiment of the present invention, only the damaged socket module can be replaced as a new socket module, thereby reducing the manufacturing cost of the test socket and significantly reducing the test cost of semiconductor packages.

[0088] Furthermore, in the test socket of an embodiment of the present invention, replaceable socket modules can be manufactured and prepared in advance, so damaged socket modules can be quickly replaced, thereby shortening the manufacturing period required for manufacturing new test sockets, thereby improving the efficiency of the test process.

[0089] Figure 8 The figure shows that a modular assembly type test socket according to an embodiment of the present invention is applied to a device to be tested whose terminals have height differences.

[0090] The terminals 11 of the device to be tested 10 have height differences due to tolerances. The device to be tested 10 with a relatively large area or a relatively thin package may have a warpage after manufacturing, such as a shape in which the middle portion is tilted upward relative to the edge, or a shape that is slightly twisted in other forms. The modular assembly test socket of the present invention can also be effectively applied to semiconductor packages with warpage.

[0091] As shown in the figure, for example, when the middle part of the device to be inspected 10 is warped in an upward shape compared to the edge, a socket module 250 with a thicker conductive part 251 can be set in the middle part, and a socket module 260 with a thinner conductive part 261 can be set in the edge part, so as to cope with the height difference of the terminal 11 of the device to be inspected.

[0092] Therefore, in a modular assembly test socket of one embodiment of the present invention, even in a test process where there is a height difference between the terminals of the device to be tested, a socket module in which the thickness of the conductive part corresponds to the height of the terminal can be set. This can prevent the conductive part from being damaged due to concentrated stress on the terminals located at a lower height, thereby increasing the service life of the test socket, and can prevent poor contact caused by the terminals located at a higher height not properly contacting the conductive part, thereby improving the accuracy of the test.

[0093] Fig. 9The figure shows that a modular assembly type test socket according to an embodiment of the present invention is applied to a hybrid device under test having both ball grid array package and land grid array package terminals.

[0094] In semiconductor packaging, there is a hybrid semiconductor package that has both ball grid array (BGA) terminals and land grid array (LGA) terminals. The ball grid array terminals of this semiconductor package (device to be tested) are in a protruding form, while the land grid array terminals are in a pad form, resulting in a height difference between the terminals. Therefore, in the test process of the semiconductor package, the ball grid array terminals can be stably connected to the conductive part of the test socket, but the land grid array terminals may not be properly connected to the conductive part.

[0095] In a module-assembled test socket of an embodiment of the present invention, as exemplarily shown in the figure, in a hybrid device to be inspected having both a ball grid array package terminal 11 and a planar grid array package terminal 12, a test socket assembled by setting a conventional socket module 250 in a portion corresponding to the ball grid array package terminal and setting a socket module 360 ​​with a thicker conductive portion 362 in a portion corresponding to the planar grid array package terminal can easily cope with the shape differences of the terminals of the device to be inspected.

[0096] That is, in the portion of the socket module 360 ​​corresponding to the planar grid array package terminal, the thickness of the insulating portion 361 is greater than the thickness of the insulating portion 251 of the socket module 250 corresponding to the ball grid grid array package terminal, and therefore, the thickness of the conductive portion 362 is also greater than the thickness of the conductive portion 252 of the socket module 250 corresponding to the ball grid grid array package terminal, so that the conductive portion 362 can be connected to the planar grid array package terminal 12. In addition, in the conductive portion 362 of the socket module 360, a portion 363 protruding upward from the upper surface of the insulating portion 361 can be additionally formed, so that the planar grid array package terminal 12 of the device to be inspected can be easily connected to the protruding portion 363 of the conductive portion 362, thereby further improving the connection force.

[0097] Therefore, in a modular assembly test socket according to an embodiment of the present invention, in a hybrid device to be tested having both ball grid array package terminals and planar grid array package terminals, a socket module having a conductive portion having a thickness corresponding to the terminal is provided, so that a stable connection can be achieved without causing poor contact, thereby improving the accuracy of the test.

[0098] Although the present invention is shown and described in conjunction with the preferred embodiments for illustrating the principles of the present invention, the present invention is not limited to the structures and functions shown and described. On the contrary, it should be understood by those skilled in the art that various changes and modifications may be made to the present invention without departing from the concept and scope of the attached invention claims.

Claims

1. A modular assembly test socket, formed by combining a plurality of socket modules, characterized in that: Each square-shaped socket module includes: The anisotropic conductive sheet is formed into a square shape at one corner portion, and includes a conductive portion and an insulating portion. The conductive portion is in the form of a plurality of conductive particles contained in an elastic insulating material, and the insulating portion is used to support and insulate the conductive portions. A frame in the shape of a plate, used to support two adjacent side surfaces of the anisotropic conductive sheet; A coupling protrusion, the frame being formed at a corner portion adjacent to the one side corner, and having a coupling protrusion; and The coupling groove part is formed by the frame protruding from the other corner part adjacent to the one side corner, and has a coupling groove. The plurality of socket modules are composed of a first socket module, a second socket module, a third socket module and a fourth socket module in a clockwise direction, and the combination protrusion and the combination groove are arranged at positions corresponding to each other. The adjacent plurality of socket modules are assembled together by buckling the coupling grooves onto the coupling protrusions, so that the other side surfaces of the hetero-conductive sheets are in contact with each other.

2. The modular assembly test socket according to claim 1, characterized in that: The thickness of the insulating portion of at least one of the socket modules is different from the thickness of the insulating portions of the other socket modules.

3. The modular assembly test socket according to claim 1, characterized in that: The thickness of the conductive portion of at least one of the socket modules is different from the thickness of the conductive portions of the other socket modules.

4. The modular assembly test socket according to claim 1, characterized in that: The frames of the first socket module and the third socket module and the frames of the second socket module and the fourth socket module have the same shape.

5. The modular assembly test socket according to claim 1, characterized in that: The thickness of a portion where the coupling protrusion and the coupling groove are coupled is the same as the thickness of the frame.

6. The modular assembly test socket according to claim 1, characterized in that: A tray is combined at the lower side of the plurality of frames. The tray is square in shape and has an edge portion formed around it for supporting the plurality of frames.

7. The modular assembly test socket according to claim 1, characterized in that: The side surface to which the plurality of anisotropic conductive sheets are in contact is wavy.

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