An intelligent monitoring system and method for VCSEL chips

Abstract

The present invention discloses an intelligent supervision system and method for VCSEL chips, which relates to the field of chip intelligent supervision technology, including: obtaining historical test records corresponding to several VCSEL chips of the same specification, extracting marked test records from the test records; using the chip corresponding to the marked test record as the marked chip to obtain a first health value of the marked chip; and according to the first health value, obtaining a target value of the marked chip, and then establishing a first set; obtaining all target sampling chips obtained by the current sampling rule to establish a second set; and judging whether to issue an early warning prompt for the current sampling rule according to the first set and the second set. The present invention judges whether the sampling rule is reasonable by analyzing the historical test records of the chip in combination with the actual status and the numerical values of various performance tests, thereby improving the reliability of sample sampling and reducing the difference between the test results and the actual overall level.

Description

Technical Field

[0001] The present invention relates to the technical field of intelligent chip supervision, and in particular to an intelligent supervision system and method applied to VCSEL chips. Background Art

[0002] Vertical-cavity surface-emitting laser (VCSEL) chips, due to their unique advantages, are widely used in a variety of fields, including 3D sensing and optical communications. Common applications include fingerprint recognition, facial recognition, and defect detection. However, with the expansion of application scenarios and the growth of demand, higher requirements are being placed on the performance, stability, and reliability of VCSEL chips. Traditional regulatory methods are unable to meet these requirements, and intelligent regulation has emerged. VCSEL chips need to be tested after manufacturing, but current test sampling often relies on manual or simple random sampling. This is not only highly subjective, but also fails to consider the actual state and various characteristic parameters of the chip during sampling. This results in a lack of representativeness of the sample and an inability to fully demonstrate the performance characteristics of the chip. This leads to a deviation between the final test results and the actual overall level. Summary of the Invention

[0003] The purpose of the present invention is to provide an intelligent monitoring system and method for VCSEL chips to solve the problems raised in the prior art.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] An intelligent monitoring method for VCSEL chips includes the following steps:

[0006] Step S100: Obtain historical test records corresponding to several VCSEL chips of the same specification. A test record is a record generated after various performance tests of the chip are performed. The values corresponding to each performance test in the test record are analyzed, and a marked test record is extracted from the test record.

[0007] Step S200: The chip corresponding to the marker test record is used as the marker chip. After the marker chip is tested, the electrical characteristics of the marker chip are tested during actual operation to obtain a first health value of the marker chip. The value of each performance indicator of the marker chip during actual operation is obtained, and a target value of the marker chip is obtained based on the first health value. Then, a first set is established based on the target value of each marker chip.

[0008] Step S300: Acquire all target sampling chips obtained by the current sampling rule, and analyze the values of various performance tests of the target sampling chips during actual operation after the test is completed to establish a second set;

[0009] In this solution, the current sampling rules are chip sampling methods determined based on actual conditions, including but not limited to manual sampling, random sampling, etc., and this current sampling rule is exactly what this solution needs to study and analyze to determine whether it is reasonable.

[0010] Step S400: Calculate the warning coefficient of the current sampling method according to the first set and the second set, and determine whether to issue a warning prompt for the current sampling rule according to the warning coefficient.

[0011] Furthermore, step S100 includes:

[0012] Step S110: Acquire several historical test records. The test records are records generated after various performance tests of the chip, wherein the chip performance tests include optical performance tests, electrical performance tests, and thermal performance tests. Each tested chip is numbered, and the chip number, test time, and performance values after each performance test corresponding to each test record are extracted.

[0013] Obtain the normal value range of each performance item of the chip; if the performance value corresponding to a certain performance item in a test record is within the normal value range corresponding to the certain performance item, the test result of the certain performance item in the test record is deemed to be qualified;

[0014] Step S120: Obtain the normal value range [0, A1] of the chip leakage current, where A1 is the maximum current value preset by the system; extract several test moments in the test time corresponding to a test record R, and use the chip corresponding to the test record R as C. Use a measuring instrument with leakage current measurement function to capture the leakage current value of chip C at each test moment, and mark the test moments when the leakage current value is within the normal value range;

[0015] Leakage current refers to the tiny current that flows along a path where no current should flow when the chip is in a non-conducting state. A large leakage current indicates that the chip is highly hazardous. Marked test records are records showing normal performance after measurement. In this embodiment, leakage current is used for judgment, which improves the reliability of extracting marked test records.

[0016] If the ratio of the number of marked test moments to the total number of test moments is greater than the preset ratio threshold, and the test results of each performance in a test record R are qualified, then the test record R will be used as the marked test record, and all marked test records will be obtained.

[0017] Furthermore, step S200 includes:

[0018] Step S210: Obtain the actual equipment E that is put into operation corresponding to a certain marking chip X X, extraction equipment E X The device startup and shutdown time recorded in the system log of , and the duration between adjacent startup and shutdown times is accumulated to obtain the total power-on time of chip X during operation; X The above moment is the starting point, and the moment when the total power-on time reaches the set running time is the detection time;

[0019] For chip X, starting from the detection time, the subsequent period is P X The value of the electrical characteristic item at each moment in the period is detected to obtain the normal fluctuation range [a, b] of the electrical characteristic item of chip X, where a is the minimum fluctuation value and b is the maximum fluctuation value, and the period P is X The values of the electrical characteristic items within the normal fluctuation range are added together as P1, and then the first health value of chip X is obtained: D X =P1 / P X ;

[0020] Step S220: Time period P X The optical performance item, electrical performance item, and thermal performance item values of the chip are detected at each moment, and a first mark is performed at the moment when the value of the optical performance item is greater than a preset first numerical threshold, and the first marked moments are summarized to obtain a first marked duration F1. A second mark is performed at the moment when the value of the electrical performance item is greater than a preset second numerical threshold, and the second marked moments are summarized to obtain a second marked duration F2. A third mark is performed at the moment when the value of the thermal performance item is greater than a preset third numerical threshold, and the third marked moments are summarized to obtain a third marked duration F3.

[0021] According to F1, F2, F3, time period P X and the first health value D X , the target value of chip X is , k1 is the first correlation coefficient; obtain the field type of the equipment actually put into operation corresponding to each marker chip, and add the target values of the marker chips corresponding to the equipment with the same field type to obtain the average value as the first field value corresponding to each field type, and normalize the first field value, and establish the first set according to each normalized first field value.

[0022] It should be noted that in actual use, the damage degree of the chip and the use of each performance on the chip are different in the field type corresponding to each device. The field types here include fingerprint recognition, face recognition, defect detection, etc., so it is necessary to analyze the chips that are actually put into use after they are manufactured. Among them, the damage degree is determined by the health value D X Determine, the usage is determined by the sum of the marking time; when the chip health value D XThe smaller the value, and the larger the sum of the marking durations, the larger the target value for the chip. In this solution, the first domain value is determined by the target value. When the first domain value corresponding to a certain domain type is large, it means that the domain type should be given more attention. That is, when sampling, the number of chips belonging to this domain type should be sampled more than that of other domain types. This also explains the reliability of the analysis of the number of chips of different domain types in step S300 and the determination of whether the current sampling rules are reasonable based on the first and second sets in step S400.

[0023] Furthermore, step S300 includes:

[0024] Step S310: Obtain the actual running device E corresponding to a target sampling chip Y Y According to step S210, the detection time is obtained, and the detection time is taken as the starting point, and the subsequent period is P Y The value of the electrical characteristic item at each moment in the period P is detected and the Y The values of the electrical characteristic items within the normal fluctuation range are added together as P2, and then the second health value D of chip Y is obtained. Y =P2 / P Y ;

[0025] Step S320: According to the field type of the device corresponding to each target sampling chip, the total number of chips of various field types is obtained; and the total number of all chips corresponding to a certain field type is taken as N, and the second health values of all chips are added together to obtain the average value M, and then the second field value of a certain field type is obtained as D=K2*N / M, K2 is the second correlation coefficient, and the second field value is normalized, and the second set is established in descending order of the normalized second field values.

[0026] Furthermore, step S400 includes: extracting elements of the same field type as the second set in the first set, and establishing a third set according to the sorting order of the extracted elements in the second set; then, according to the numerical values of each element in the second set and the third set, calculating the Pearson correlation coefficient between the two sets, and using the Pearson correlation coefficient as a warning coefficient. If the warning coefficient is less than the preset warning threshold, a warning prompt is issued for the current sampling rule.

[0027] An intelligent monitoring system for VCSEL chips, comprising a mark test record extraction module, a first set establishment module, a second set establishment module and an early warning prompt module;

[0028] Marked test record extraction module: used to obtain historical test records corresponding to several VCSEL chips of the same specifications. Test records are records generated after various performance tests of the chip. The module analyzes the values of each performance test in the test records and extracts marked test records from the test records.

[0029] A first set establishment module is configured to use the chip corresponding to the marker test record as the marker chip, test the electrical characteristics of the marker chip during actual operation after the test is completed, and obtain a first health value of the marker chip; obtain the value of each performance indicator of the marker chip during actual operation, and obtain a target value of the marker chip based on the first health value; and then establish a first set based on the target value of each marker chip;

[0030] The second set establishment module is used to obtain all target sampling chips obtained through the current sampling rules, and analyze the values of various performance tests of the target sampling chips during the actual operation after the test is completed to establish the second set;

[0031] Early warning prompt module: used to calculate the early warning coefficient of the current sampling method based on the first set and the second set, and determine whether to issue an early warning prompt for the current sampling rule based on the early warning coefficient.

[0032] Further, the marked test record extraction module includes a test record extraction unit and a marked test record extraction unit;

[0033] Test record extraction unit: used to obtain several historical test records. Test records are records generated after testing various performance of the chip; obtain the normal value range of each performance of the chip, and judge the test results of each performance in the test record;

[0034] Marked test record extraction unit: used for analyzing the numerical value of each performance test corresponding to the test record and extracting the marked test record from the test record.

[0035] Furthermore, the second set establishing module includes a second health value calculating unit and a second set establishing unit;

[0036] A second health value calculation unit is used to obtain the actual operating device corresponding to a target sampling chip and obtain the detection time, and then calculate the second health value of the target sampling chip;

[0037] The second set establishing unit is used to obtain the total number of chips of various field types according to the field type of the device corresponding to each target sampling chip; and then obtain the second field value of each field type, and then establish the second set.

[0038] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention provides an intelligent monitoring system and method for VCSEL chips, including: obtaining historical test records corresponding to several VCSEL chips of the same specification, extracting marked test records from the test records; using the chip corresponding to the marked test record as the marked chip to obtain a first health value of the marked chip; and according to the first health value, obtaining a target value of the marked chip, thereby establishing a first set; obtaining all target sampling chips obtained by the current sampling rule to establish a second set; and judging whether to issue an early warning prompt for the current sampling rule based on the first set and the second set. The present invention judges whether the sampling rule is reasonable by analyzing the historical test records of the chip in combination with the actual status and the numerical values of various performance tests, thereby improving the reliability of sample sampling and reducing the difference between the test results and the actual overall level. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a flow chart of an intelligent monitoring method for VCSEL chips according to the present invention;

[0040] Figure 2 This is a structural diagram of an intelligent monitoring system applied to VCSEL chips in the present invention. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] Example: Figure 1 As shown, the present invention provides a technical solution for an intelligent monitoring method for VCSEL chips, comprising the following steps:

[0043] Step S100: Obtain historical test records corresponding to several VCSEL chips of the same specification. A test record is a record generated after various performance tests of the chip are performed. The values corresponding to each performance test in the test record are analyzed, and a marked test record is extracted from the test record.

[0044] Step S110: Acquire several historical test records. The test records are records generated after various performance tests of the chip, wherein the chip performance tests include optical performance tests, electrical performance tests, and thermal performance tests. Each tested chip is numbered, and the chip number, test time, and performance values after each performance test corresponding to each test record are extracted.

[0045] Obtain the normal value range of each performance item of the chip; if the performance value corresponding to a certain performance item in a test record is within the normal value range corresponding to the certain performance item, the test result of the certain performance item in the test record is deemed to be qualified;

[0046] Step S120: Obtain the normal value range [0, A1] of the chip leakage current, where A1 is the maximum current value preset by the system; extract several test moments in the test time corresponding to a test record R, and use the chip corresponding to the test record R as C. Use a measuring instrument with leakage current measurement function to capture the leakage current value of chip C at each test moment, and mark the test moments when the leakage current value is within the normal value range;

[0047] Leakage current refers to the tiny current that appears on a path where no current should flow when the chip is in a non-conducting state. When the leakage current is large, it means that the chip is more dangerous. The mark test record is a record of normal performance after measurement. In this embodiment, leakage current is used for judgment, which improves the reliability of mark test record extraction.

[0048] If the ratio of the number of marked test moments to the total number of test moments is greater than the preset ratio threshold, and the test results of each performance in a test record R are qualified, then the test record R will be used as the marked test record, and all marked test records will be obtained.

[0049] Step S200: The chip corresponding to the marker test record is used as the marker chip. After the marker chip is tested, the electrical characteristics of the marker chip are tested during actual operation to obtain a first health value of the marker chip. The value of each performance indicator of the marker chip during actual operation is obtained, and a target value of the marker chip is obtained based on the first health value. Then, a first set is established based on the target value of each marker chip.

[0050] Step S210: Obtain the actual equipment E that is put into operation corresponding to a certain marking chip X X , extraction equipment E X The device startup and shutdown time recorded in the system log of , and the duration between adjacent startup and shutdown times is accumulated to obtain the total power-on time of chip X during operation; X The above moment is the starting point, and the moment when the total power-on time reaches the set running time is the detection time;

[0051] For chip X, starting from the detection time, the subsequent period is P XThe value of the electrical characteristic item at each moment in the period is detected to obtain the normal fluctuation range [a, b] of the electrical characteristic item of chip X, where a is the minimum fluctuation value and b is the maximum fluctuation value, and the period P is X The values of the electrical characteristic items within the normal fluctuation range are added together as P1, and then the first health value of chip X is obtained: D X =P1 / P X ;

[0052] In this embodiment, the electrical characteristic item is one of temperature, voltage or current. Because temperature, voltage and current have a great influence on the performance of the chip, high temperature and low temperature will accelerate the aging and damage of the chip, and too high or too low voltage and current will also cause chip damage, thereby affecting the chip life. Therefore, when the electrical characteristic item is not within the normal fluctuation range, it means that the chip health value is low.

[0053] Step S220: Time period P X The optical performance item, electrical performance item, and thermal performance item values of the chip are detected at each moment, and a first mark is performed at the moment when the value of the optical performance item is greater than a preset first numerical threshold, and the first marked moments are summarized to obtain a first marked duration F1. A second mark is performed at the moment when the value of the electrical performance item is greater than a preset second numerical threshold, and the second marked moments are summarized to obtain a second marked duration F2. A third mark is performed at the moment when the value of the thermal performance item is greater than a preset third numerical threshold, and the third marked moments are summarized to obtain a third marked duration F3.

[0054] In this embodiment, since the chip is a VCSEL, the optical performance item is the power of light emitted by the chip; the electrical performance item is the current passing through the chip; and the thermal performance item is the value of a temperature sensor deployed on the chip.

[0055] According to F1, F2, F3, time period P X and the first health value D X , the target value of chip X is , k1 is the first correlation coefficient; obtain the field type of the equipment actually put into operation corresponding to each marker chip, and add the target values of the marker chips corresponding to the equipment with the same field type to obtain the average value as the first field value corresponding to each field type, and normalize the first field value, and establish the first set according to each normalized first field value.

[0056] It should be noted that in actual use, the damage degree of the chip and the use of each performance on the chip are different in the field type corresponding to each device. The field types here include fingerprint recognition, face recognition, defect detection, etc., so it is necessary to analyze the chips that are actually put into use after they are manufactured. Among them, the damage degree is determined by the health value DX Determine, the usage is determined by the sum of the marking time; when the chip health value D X The smaller the value, and the larger the sum of the marking durations, the larger the target value for the chip. In this solution, the first domain value is determined by the target value. When the first domain value corresponding to a certain domain type is large, it means that the domain type should be given more attention. That is, when sampling, the number of chips belonging to this domain type should be sampled more than that of other domain types. This also explains the reliability of the analysis of the number of chips of different domain types in step S300 and the determination of whether the current sampling rules are reasonable based on the first and second sets in step S400.

[0057] Step S300: Acquire all target sampling chips obtained by the current sampling rule, and analyze the values of various performance tests of the target sampling chips during actual operation after the test is completed to establish a second set;

[0058] Step S310: Obtain the actual running device E corresponding to a target sampling chip Y Y According to step S210, the detection time is obtained, and the detection time is taken as the starting point, and the subsequent period is P Y The value of the electrical characteristic item at each moment in the period P is detected and the Y The values of the electrical characteristic items within the normal fluctuation range are added together as P2, and then the second health value D of chip Y is obtained. Y =P2 / P Y ;

[0059] Step S320: According to the field type of the device corresponding to each target sampling chip, the total number of chips of various field types is obtained; and the total number of all chips corresponding to a certain field type is taken as N, and the second health values of all chips are added together to obtain the average value M, and then the second field value of a certain field type is obtained as D=K2*N / M, K2 is the second correlation coefficient, and the second field value is normalized, and the second set is established in descending order of the normalized second field values.

[0060] Step S400: Calculate the warning coefficient of the current sampling method according to the first set and the second set, and determine whether to issue a warning prompt for the current sampling rule according to the warning coefficient.

[0061] Extract elements of the same field type as the second set from the first set, and establish a third set according to the sorting order of the extracted elements in the second set; then, based on the values of each element in the second set and the third set, calculate the Pearson correlation coefficient between the two sets, and use the Pearson correlation coefficient as the warning coefficient. If the warning coefficient is less than the preset warning threshold, a warning prompt will be issued for the current sampling rule.

[0062] The calculation of the Pearson correlation coefficient is a state of the art technique, and the actual calculation steps are not described here. The value range of the Pearson correlation coefficient is r∈[-1,1]. When r=1, it indicates that there is a completely positive linear correlation between the two variables; when r=0, it means that there is no linear correlation between the two variables; and when r=1, it indicates that there is a completely negative linear correlation between the two variables. In this embodiment, the warning threshold is 0.5. That is, when the value of the Pearson correlation coefficient is less than 0.5, the current sampling rule is considered unreasonable, a warning prompt is issued for the current sampling rule, and the relevant technical personnel are informed.

[0063] The present invention also provides an intelligent monitoring system for VCSEL chips, comprising a mark test record extraction module, a first set establishment module, a second set establishment module and an early warning prompt module;

[0064] Marked test record extraction module: used to obtain historical test records corresponding to several VCSEL chips of the same specifications. Test records are records generated after various performance tests of the chip. The module analyzes the values of each performance test in the test records and extracts marked test records from the test records.

[0065] A first set establishment module is configured to use the chip corresponding to the marker test record as the marker chip, test the electrical characteristics of the marker chip during actual operation after the test is completed, and obtain a first health value of the marker chip; obtain the value of each performance indicator of the marker chip during actual operation, and obtain a target value of the marker chip based on the first health value; and then establish a first set based on the target value of each marker chip;

[0066] The second set establishment module is used to obtain all target sampling chips obtained through the current sampling rules, and analyze the values of various performance tests of the target sampling chips during the actual operation after the test is completed to establish the second set;

[0067] Early warning prompt module: used to calculate the early warning coefficient of the current sampling method based on the first set and the second set, and determine whether to issue an early warning prompt for the current sampling rule based on the early warning coefficient.

[0068] Wherein, the marked test record extraction module includes a test record extraction unit and a marked test record extraction unit;

[0069] Test record extraction unit: used to obtain several historical test records. Test records are records generated after testing various performance of the chip; obtain the normal value range of each performance of the chip, and judge the test results of each performance in the test record;

[0070] Marked test record extraction unit: used for analyzing the numerical value of each performance test corresponding to the test record and extracting the marked test record from the test record.

[0071] The second set establishment module includes a second health value calculation unit and a second set establishment unit;

[0072] A second health value calculation unit is used to obtain the actual operating device corresponding to a target sampling chip and obtain the detection time, and then calculate the second health value of the target sampling chip;

[0073] The second set establishing unit is used to obtain the total number of chips of various field types according to the field type of the device corresponding to each target sampling chip; and then obtain the second field value of each field type, and then establish the second set.

[0074] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. An intelligent monitoring method for VCSEL chips, characterized in that: The following steps are involved: Step S100: Obtain historical test records corresponding to several VCSEL chips of the same specification, wherein the test records are records generated after various performance tests of the chips are performed, analyze the values corresponding to each performance test in the test records, and extract marked test records from the test records; Step S200: The chip corresponding to the marker test record is used as the marker chip. After the marker chip is tested, the electrical characteristics of the marker chip are tested during actual operation to obtain a first health value of the marker chip. The value of each performance indicator of the marker chip during actual operation is obtained, and a target value of the marker chip is obtained based on the first health value. Then, a first set is established based on the target value of each marker chip. Step S300: Acquire all target sampling chips obtained by the current sampling rule, and analyze the values of various performance tests of the target sampling chips during actual operation after the test is completed to establish a second set; Step S400: Calculate the warning coefficient of the current sampling method according to the first set and the second set, and determine whether to issue a warning prompt for the current sampling rule according to the warning coefficient.

2. The intelligent monitoring method for VCSEL chips according to claim 1, characterized in that: Step S100 includes: Step S110: Acquire several historical test records, wherein the test records are records generated after various performance tests of the chip, wherein the chip performance tests include optical performance tests, electrical performance tests, and thermal performance tests; number each tested chip, and extract the chip number, test time, and performance values after each performance test corresponding to each test record; Obtain the normal value range of each performance item of the chip; if the performance value corresponding to a certain performance item in a test record is within the normal value range corresponding to the certain performance item, then the test result of the certain performance item in the test record is deemed to be qualified; Step S120: Obtain the normal value range [0, A1] of the chip leakage current, where A1 is the maximum current value preset by the system; extract several test moments in the test time corresponding to a test record R, and use the chip corresponding to the test record R as C. Use a measuring instrument with leakage current measurement function to capture the leakage current value of chip C at each test moment, and mark the test moments when the leakage current value is within the normal value range; If the ratio of the number of marked test moments to the total number of test moments is greater than the preset ratio threshold, and the test results of each performance in the test record R are qualified, then the test record R will be used as the marked test record, and all marked test records will be obtained.

3. The intelligent monitoring method for VCSEL chips according to claim 2, characterized in that: Step S200 includes: Step S210: Obtain the actual equipment E that is put into operation corresponding to a certain marking chip X X , extraction equipment E X The device startup and shutdown time recorded in the system log of , and the duration between adjacent startup and shutdown times is accumulated to obtain the total power-on time of chip X during operation; X The above moment is the starting point, and the moment when the total power-on time reaches the set running time is the detection time; For chip X, starting from the detection time, the subsequent period is P X The value of the electrical characteristic item at each moment in the period is detected to obtain the normal fluctuation range [a, b] of the electrical characteristic item of chip X, where a is the minimum fluctuation value and b is the maximum fluctuation value, and the period P is X The values of the electrical characteristic items within the normal fluctuation range are added together as P1, and then the first health value of the chip X is obtained: D X =P1 / P X ; Step S220: Time period P X The optical performance item, electrical performance item, and thermal performance item values of the chip are detected at each moment, and a first mark is performed at the moment when the value of the optical performance item is greater than a preset first numerical threshold, and the first marked moments are summarized to obtain a first marked duration F1. A second mark is performed at the moment when the value of the electrical performance item is greater than a preset second numerical threshold, and the second marked moments are summarized to obtain a second marked duration F2. A third mark is performed at the moment when the value of the thermal performance item is greater than a preset third numerical threshold, and the third marked moments are summarized to obtain a third marked duration F3. According to F1, F2, F3, time period P X and the first health value D X , the target value of chip X is , k1 is the first correlation coefficient; obtain the field type of the equipment actually put into operation corresponding to each marker chip, and add the target values of the marker chips corresponding to the equipment with the same field type to obtain the average value as the first field value corresponding to each field type, and normalize the first field value, and establish the first set according to each normalized first field value.

4. The intelligent monitoring method for VCSEL chips according to claim 3, characterized in that: Step S300 includes: Step S310: Obtain the actual running device E corresponding to a target sampling chip Y Y According to step S210, the detection time is obtained, and the detection time is taken as the starting point, and the subsequent period is P Y The value of the electrical characteristic item at each moment in the period P is detected and the Y The values of the electrical characteristic items within the normal fluctuation range are added together as P2, and then the second health value D of the chip Y is obtained. Y =P2 / P Y ; Step S320: According to the field type of the device corresponding to each target sampling chip, the total number of chips of various field types is obtained; and the total number of all chips corresponding to a certain field type is taken as N, and the second health values of all the chips are added together to obtain the average value M, and then the second field value of the certain field type is obtained as D=K2*N / M, K2 is the second correlation coefficient, and the second field value is normalized, and the second set is established in descending order of the normalized second field values.

5. The intelligent monitoring method for VCSEL chips according to claim 1, characterized in that: Step S400 includes: extracting elements of the same field type as the second set from the first set, and establishing a third set according to the sorting order of the extracted elements in the second set; then, based on the numerical values of each element in the second set and the third set, calculating the Pearson correlation coefficient between the two sets, and using the Pearson correlation coefficient as a warning coefficient. If the warning coefficient is less than a preset warning threshold, a warning prompt is issued for the current sampling rule.

6. An intelligent monitoring system for executing the intelligent monitoring method for VCSEL chips according to any one of claims 1 to 5, characterized in that: The system includes a marking test record extraction module, a first set establishment module, a second set establishment module and an early warning prompt module; Marked test record extraction module: used to obtain historical test records corresponding to several VCSEL chips of the same specifications. The test records are records generated after various performance tests of the chips, analyze the values corresponding to each performance test in the test records, and extract marked test records from the test records; A first set establishment module is configured to use the chip corresponding to the marker test record as the marker chip, test the electrical characteristics of the marker chip during actual operation after the test is completed, and obtain a first health value of the marker chip; obtain the value of each performance indicator of the marker chip during actual operation, and obtain a target value of the marker chip based on the first health value; and then establish a first set based on the target value of each marker chip; The second set establishment module is used to obtain all target sampling chips obtained through the current sampling rules, and analyze the values of various performance tests of the target sampling chips during the actual operation after the test is completed to establish the second set; Early warning prompt module: used to calculate the early warning coefficient of the current sampling method based on the first set and the second set, and determine whether to issue an early warning prompt for the current sampling rule based on the early warning coefficient.

7. An intelligent monitoring system according to claim 6, characterized in that: The marked test record extraction module includes a test record extraction unit and a marked test record extraction unit; Test record extraction unit: used to obtain several historical test records, which are records generated after testing various performance of the chip; obtain the normal value range of each performance of the chip, and judge the test results of each performance in the test record; Marked test record extraction unit: used for analyzing the numerical value of each performance test corresponding to the test record and extracting the marked test record from the test record.

8. An intelligent monitoring system according to claim 7, characterized in that: The second set establishing module includes a second health value calculating unit and a second set establishing unit; A second health value calculation unit is used to obtain the actual operating device corresponding to a target sampling chip and obtain the detection time, and then calculate the second health value of the target sampling chip; The second set establishing unit is used to obtain the total number of chips of various field types according to the field type of the device corresponding to each target sampling chip; and then obtain the second field value of each field type, and then establish the second set.

Images