X-ray imaging method and array pinhole imaging device

Abstract

The invention discloses an X-ray imaging method and an array pinhole imaging device, and the device comprises an array pinhole plate which is provided with a plurality of pinhole groups which are arranged in parallel, and each pinhole group comprises a plurality of pinholes; the positioning assembly comprises an installation position, and the array pinhole plate is arranged on the installation position and used for conducting fine adjustment positioning on the array pinhole plate; the framing camera assembly is provided with a plurality of micro-strips which correspond to light paths of the pinhole groups and are used for imaging, and the micro-strips correspond to the pinhole groups one by one; the vacuum assembly is arranged between the positioning assembly and the framing camera assembly and used for providing a vacuum environment for the interior of the device; the array pinhole plate is also provided with a plurality of attenuation slices, and the attenuation slices cover one side of the pinholes. Wherein the attenuation sheets comprise at least two kinds of attenuation sheets with different thicknesses, and the attenuation sheets with different thicknesses are arranged on different pinholes. According to the invention, at least two pieces of image information of X-rays with different energies can be obtained through single imaging, so that important data support is provided for reconstruction of three-dimensional space information of a target region.

Description

Technical Field

[0001] The present application relates to the field of X-ray imaging, and in particular to an X-ray imaging method and an array pinhole imaging device. Background Art

[0002] In recent decades, as the driving capabilities of ion beams, pulsed power sources, and lasers continue to improve, pushing temperature, pressure, and density to more extreme directions, high energy density physics has also become one of the most concerned frontier interdisciplinary research fields. When a strong driving source compresses and heats the target, the temperature, density, and pressure of the target will continue to rise, changing from a solid state to a dense plasma state with high energy density. In this state, due to the high pressure and high density of the internal atoms or molecules, as well as the plasma shielding effect, it is a very challenging task to diagnose the state of matter in the center of the target. However, in this complex, dense, extreme environment, the plasma will radiate X-rays, which can penetrate highly ionized matter including plasma, making them very suitable for detecting the internal structure of matter, especially in the dynamic stage of high energy density experiments. X-ray imaging based on the pinhole principle has the advantages of simple imaging principle and easy operation. The pinhole array can also realize multiple images on a single detector. It is one of the important diagnostic methods for experimental research on high-energy density plasma and laboratory astronomical plasma. It has been widely used in related fields and has achieved important results: for example, in inertial confinement fusion (ICF) research, self-emission X-ray imaging can provide information about the shape, volume and temperature of plasma. In heavy ion beam driven high energy density physics research, X-ray imaging can diagnose the intensity distribution of heavy ion beam irradiation solid target online, which has important application value for heavy ion beam research on the state equation of high energy density matter.

[0003] X-rays emitted by high energy density plasmas are usually transient and show significant spatial variations. Traditionally, X-ray imaging data is obtained using time-integrating detectors such as IP plates (image plates, IP) or time-gated detectors such as X-ray CCD cameras. X-ray CCD cameras provide information about X-ray dynamics and have relatively high spectral resolution, but they are bulky, expensive, and have a small detection surface. If valuable energy information is needed, multiple imaging operations need to be performed.

[0004] Moreover, in order to obtain different X-ray image information during multiple imaging processes, it is necessary to continuously replace equipment components. After replacing different equipment components, the equipment needs to be realigned through a dedicated collimation instrument. Not only is it difficult to replace equipment components, but the alignment is also relatively complicated. This undoubtedly increases the complexity of the equipment and the experimental process, and increases the cost of equipment manufacturing and use. Summary of the invention

[0005] The present application provides an X-ray imaging method and an array pinhole imaging device, which achieves efficient acquisition of X-ray images of different energies in a single measurement by arranging attenuation sheets of multiple thicknesses on an array pinhole plate.

[0006] In a first aspect, an array pinhole imaging device is provided, the device comprising:

[0007] The array pinhole plate is provided with a plurality of pinhole groups arranged in parallel, each pinhole group includes a plurality of pinholes;

[0008] A positioning assembly, comprising a mounting position, on which the array pinhole plate is arranged, for fine-tuning the positioning of the array pinhole plate;

[0009] A framing camera assembly is provided with a plurality of microstrips for imaging corresponding to the optical paths of the pinhole groups, wherein the microstrips correspond to the pinhole groups one by one; and

[0010] A vacuum assembly, disposed between the positioning assembly and the framing camera assembly, for providing a vacuum environment inside the device;

[0011] The array pinhole plate is also provided with a plurality of attenuation sheets, and the attenuation sheets cover one side of the pinholes; wherein the attenuation sheets include at least two attenuation sheets of different thicknesses, and the attenuation sheets of different thicknesses are arranged on different pinholes.

[0012] In one embodiment, the positioning assembly includes a first reset plate and a second reset plate;

[0013] The middle parts of the first reset plate and the second reset plate are respectively provided with mounting holes, and the array pinhole plate can be mounted and fixed on the mounting holes of the first reset plate and the second reset plate.

[0014] In one embodiment, the first reset plate and the second reset plate are reset by magnetic attraction.

[0015] In one embodiment, the same pinhole group shares the same attenuation sheet, and the attenuation sheets corresponding to the pinhole groups have different thicknesses.

[0016] In one embodiment, the same pinhole group is provided with at least two attenuation sheets with different thicknesses;

[0017] In one embodiment, the vacuum assembly is provided with a first flange on a side connected to the framing camera assembly;

[0018] The device also includes a laser alignment module, which includes a first alignment plate, a second alignment plate and a laser;

[0019] The first collimation plate is adapted to the mounting position;

[0020] The second collimating plate is adapted to fit the first flange.

[0021] In a second aspect, the present application also discloses an X-ray imaging method, which is applied to the array pinhole imaging device as described above;

[0022] The array pinhole plate of the device comprises at least a first pinhole and a second pinhole, one side of the first pinhole is covered with an attenuation sheet of a first thickness, and one side of the second pinhole is covered with an attenuation sheet of a second thickness, and the first thickness is different from the second thickness;

[0023] The method comprises:

[0024] Acquire a first image through the first pinhole and a second image through the second pinhole simultaneously or sequentially through a framing camera assembly;

[0025] The first image and the second image are processed to obtain processed image information.

[0026] In one embodiment, the processing the first image and the second image to obtain processed image information includes:

[0027] calculating a difference between the first image and the second image;

[0028] Image information of different position areas corresponding to different X-ray energies is obtained based on the difference.

[0029] In one embodiment, the device further comprises a positioning assembly, the positioning assembly comprises a mounting position, the array pinhole plate is arranged on the mounting position, and is used for fine-tuning the positioning of the array pinhole plate; the vacuum assembly is provided with a first flange on a side connected to the framing camera assembly;

[0030] The device also includes a laser alignment module, which includes a first alignment plate, a second alignment plate and a laser;

[0031] Before simultaneously or sequentially acquiring the first image through the first pinhole and the second image through the second pinhole through the framing camera assembly, the method further includes:

[0032] Installing the first collimation plate on the mounting position of the positioning assembly;

[0033] installing a second collimating plate on the first flange;

[0034] The laser is collimated by cooperating with the first collimating plate and the second collimating plate.

[0035] In one embodiment, the method further comprises:

[0036] After the alignment between the first collimator plate and the second collimator plate is achieved, the first collimator plate is replaced with an array pinhole plate, and the second collimator plate is replaced with a framing camera assembly;

[0037] The steps of simultaneously or sequentially acquiring a first image through a first pinhole and a second image through a second pinhole by a framing camera assembly are performed.

[0038] In one embodiment, the first pinhole is located in a first pinhole group, and the second pinhole is located in a second pinhole group; or

[0039] The first pinhole and the second pinhole are in the same pinhole group.

[0040] In one embodiment, the attenuation sheet is an attenuation sheet having the same metal type and different thicknesses; or

[0041] The attenuation sheets are attenuation sheets containing different metal types and having different thicknesses.

[0042] As can be seen from the above, the X-ray imaging method and array pinhole imaging device in the present application utilize the cooperation of the array pinhole plate, the positioning assembly and the framing camera assembly to facilitate the alignment of the array pinhole plate, thereby solving the problem of low imaging efficiency. In addition, a number of attenuation plates of different thicknesses are arranged on the array pinhole plate and arranged on different pinholes, so that at least two image information of X-rays of different energies can be obtained in a single imaging, thereby providing important data support for the reconstruction of the three-dimensional spatial information of the target area. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 A schematic diagram of the exploded structure of the array pinhole imaging device provided in an embodiment of the present application.

[0044] Figure 2 This is a schematic diagram of the structure of the array pinhole imaging device in the first usage state provided in an embodiment of the present application.

[0045] Figure 3 A schematic diagram of the structure of the array pinhole plate and the positioning assembly provided in an embodiment of the present application.

[0046] Figure 4 This is a schematic diagram of the structure of the second usage state of the array pinhole imaging device provided in an embodiment of the present application.

[0047] Figure 5 Schematic diagram of the collimation principle of the array pinhole imaging device provided in an embodiment of the present application.

[0048] Figure 6 Schematic diagram of the installation method of the attenuation plate of the array pinhole plate provided in the embodiment of the present application.

[0049] Figure 7 A schematic diagram of the flow of the X-ray imaging method provided in an embodiment of the present application.

[0050] Among them, 1. array pinhole plate; 121. first attenuation plate; 122. second attenuation plate; 2. positioning assembly; 21. fine-tuning mechanism; 22. first reset plate; 23. second reset plate; 221. mounting position; 222. magnet; 223. countersunk screw hole; 3. framing camera assembly; 4. vacuum assembly; 51. first flange; 52. second flange; 53. third flange; 61. first collimation plate; 62. second collimation plate; 63. collimation laser; 7. adjustment pipeline; first pinhole 121; second pinhole 122. DETAILED DESCRIPTION

[0051] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0052] Example 1

[0053] See also Figure 1-2 , the figure shows the explosion structure and the first usage state of an array pinhole imaging device provided in an embodiment of the present application.

[0054] like Figure 1-2 As shown, the array pinhole imaging device includes an array pinhole plate 1, a positioning component 2, a framing camera component 3 and a vacuum component 4.

[0055] The array pinhole plate 1 is provided with a plurality of pinhole groups arranged in parallel, each pinhole group includes a plurality of pinholes, wherein each pinhole on the array pinhole plate 1 can cooperate with the framing camera assembly 3 to complete the X-ray imaging work.

[0056] In one embodiment, the pinholes of the array pinhole plate 1 can be set to a diameter of 0.05mm-0.10mm, for example, 0.05mm, 0.06mm, 0.07mm or 0.1mm, and the specific pinhole diameter can be determined according to the X-ray imaging hardware requirements. The number of arrays can correspond to the image sensor of the framing camera. For example, the framing camera has 4 microstrips corresponding to the image sensor, and the array can be set to at least 4 rows of pinholes to construct a 4*N pinhole array.

[0057] In one embodiment, the pinholes can be arranged in an array of 4*3. In addition, the size of the array pinhole plate 1 can be designed according to demand, for example, the size of the array pinhole plate 1 is set to 32*32mm, so as to facilitate the adaptation and use of other parts of the device.

[0058] The positioning component 2 includes a mounting position 221, and the array pinhole plate 1 is arranged on the mounting position 221, which is used to fine-tune the positioning of the array pinhole plate 1. In one embodiment, the mounting position 221 may include a through hole whose size corresponds to the size of the array pinhole plate 1, so that the array pinhole plate 1 can be embedded in the mounting position 221, and the positioning of the array pinhole plate 1 is achieved by limiting the mounting position 221. In another embodiment, the mounting position 221 may also include a mounting structure for mounting with the array pinhole plate 1, and the positioning component 2 can position the array pinhole plate 1 through the mounting structure. Of course, the specific implementation method of the positioning component 2 can be determined according to actual conditions.

[0059] Please refer to Figure 3 , the figure shows the structure of the array pinhole plate 1 and the positioning component 2.

[0060] The array pinhole plate 1 includes a plurality of pinholes, and the positioning assembly 2 includes a first reset plate 22 and a second reset plate 23. The middle of the first reset plate 22 and the second reset plate 23 are respectively provided with mounting holes, and the shape and size of the mounting holes correspond to the array pinhole plate 1, so that the array pinhole plate 1 is conveniently placed and fixed in the mounting holes to achieve positioning. Through the positioning effect between the first reset plate 22 and the second reset plate 23, the array pinhole plate 1 can be positioned more accurately, thereby ensuring the imaging quality.

[0061] Furthermore, the first reset plate 22 and the second reset plate 23 are reset by magnetic attraction. Specifically, a plurality of magnets 222 may be provided between the first reset plate 22 and the second reset plate 23, and the magnets 222 are evenly distributed on the first reset plate 22 and / or the second reset plate 23, and the first reset plate 22 and the second reset plate 23 can be positioned by the magnetic attraction of the magnets 222. More preferably, the magnets 222 may be provided on the first reset plate 22, and a plurality of grooves matching the specifications of the magnets 222 may be provided on the second reset plate 23, and the magnets 222 may be embedded in the grooves when the first reset plate 22 and the second reset plate 23 are reset, so that the reset accuracy can be further improved, and the magnetic attraction design can facilitate disassembly and assembly, thereby improving disassembly and assembly efficiency.

[0062] In some embodiments, please combine Figure 1 The positioning assembly 2 may further be provided with countersunk screw holes 223 at the four corners of the first reset plate 22 and the second reset plate 23, and further positioning is performed between the first reset plate 22 and the second reset plate 23 through the countersunk screw holes 223.

[0063] More specifically, if the first reset plate 22 is plate A and the second reset plate 23 is plate B, the two plates are magnetically adsorbed together and can be disassembled at any time. The length and width of the two plates are 60mm*60mm respectively. There are four M4 countersunk screw holes 223 at the four corners of plate A with a depth of 6mm. There are four 4.5mm countersunk screw holes 223 at the four corners of plate B. The total thickness of the two plates is 16mm. Among them, a 32*32mm rectangular hole with a thickness of 7mm can be opened in the middle of plate A, and a 32*32mm rectangular hole with a thickness of 7mm can be opened in the middle of plate B. The function of the rectangular hole is to place the array pinhole plate 1 and the collimation plate. In addition, a 30*30mm boss is built at both ends of the two plates to prevent the array pinhole plate 1 from loosening and falling. The above specifications are only one of the implementation methods. The specific values ​​and settings can be determined according to actual conditions.

[0064] In order to further improve the collimation accuracy and imaging effect, the positioning component 2 may also include a fine-tuning mechanism, and the fine-tuning mechanism 21 includes an adjuster for adjusting the pitch, which is arranged between the first reset plate 22, the second reset plate 23 and the vacuum component 4, and is used to fine-tune the position of the first reset plate 22 and the second reset plate 23 relative to the vacuum component 4, so as to ensure the collimation of the optical path. The fine-tuning mechanism 21 can adopt an AMC-2B coaxial system reflector frame, with three adjusters, an aperture of 50.8mm, a black anodized surface, three built-in mounting threaded holes for fixing, an adjustable pitch of ±3, a material of 6061-T6 aluminum alloy, a specification of the adjuster of M6*0.25, an adjustment accuracy of 0.2 degrees / turn, and an adjustable linear movement range of ±3mm. The reset plate can be fine-tuned by the positioning component 2, and it plays a role in collimation fine-tuning during the collimation process, thereby improving the accuracy of the equipment collimation.

[0065] The framing camera assembly 3 is provided with a plurality of microstrips for imaging corresponding to the optical path of the pinhole group, and the microstrips correspond to the pinhole group one by one. One side of the framing camera assembly 3 can be assembled with the framing camera, and the device is connected and fixed to the framing camera. The microstrips provided in the framing camera assembly 3 correspond to the image sensor in the framing camera, and ensure that the pinholes on the array pinhole plate 1 and the image sensor of the framing camera are located in the same optical path, thereby ensuring the imaging quality of the framing camera.

[0066] Specifically, the framing camera may have a structure for mounting and fixing with the framing camera, and the structure may include a sealing member for sealing connection, and fasteners for mounting with the framing camera, such as screws / screw holes or buckles, etc. The specific structure may be determined according to the structure of the framing camera, as long as the device can be fixed with the framing camera.

[0067] The framing camera is the core component of the whole system. It can effectively receive the signal transmitted by the pinhole plate. By adjusting the microstrip time of the framing camera, the time resolution of the system can be achieved. The framing camera consists of 4 frames, corresponding to four rows of pinholes. The single-frame imaging area is 66mm*12mm, the single-frame gating time is 5ns, and the relative delay between the two frames is 3ps-10ns. The delay can also be set without setting. The time resolution and non-time resolution of the plasma in the target area can be achieved through framing imaging control. Of course, the size of the single-frame imaging area of ​​the framing camera can be determined according to the hardware specifications of different framing cameras.

[0068] The vacuum component 4 is disposed between the positioning component 2 and the framing camera component 3, and is used to provide a vacuum environment inside the device. The vacuum component 4 can ensure that the space between the pinhole and the framing camera in the device is in a vacuum state, reduce the influence of the air inside the device on the imaging, and ensure that the framing camera can reach the vacuum condition for normal operation.

[0069] For details, please combine Figure 1 The vacuum assembly 4 includes a three-way chamber and flanges located on both sides of the three-way chamber for connecting the positioning assembly 2 and the framing camera assembly 3. The bottom of the three-way chamber is used to connect a molecular pump, which can maintain the vacuum environment between the positioning assembly 2 and the framing camera assembly 3 at 10E. -4 mbar or lower, thereby ensuring that the vacuum environment inside the device meets the working and imaging requirements of the framing camera.

[0070] In some embodiments, the three-way chamber is composed of a 75mm adjustment pipe 7, a second flange 52 of CF100-69mm, a 69-80-122mm three-way chamber, a first flange 51 and a third flange 53 of CF100-80mm, wherein the front end of the 75mm adjustment pipe 7 has four M2 screw holes, which are connected to the collimation fine-tuning plate by screws. In order to ensure that the framing camera is completely parallel to the array pinhole plate 1, the second flange 52 is a slip-on flange. The first flange 51 is a special flange for coupling with the framing camera. The third flange 53 is used to connect the molecular pump to ensure the vacuum degree of the chamber. The material of the entire chamber can be hard aluminum material. It can be understood that the structural parameters of the above-mentioned three-way chamber are only one of the implementation methods, which can be arbitrarily set according to the experimental requirements and the hardware specifications of the device, and this application does not limit this. In addition, the adjustment pipe 7 is provided with a connecting hole, and the adjustment pipe 7 is connected to another adjustment pipe 7 or the fine-tuning mechanism 21 through the connecting hole, which can be adjusted and replaced according to the optical path requirements, so that the optical path adjustment of the device is more convenient and accurate.

[0071] Among them, the array pinhole plate 1 is further provided with a plurality of attenuation sheets, and the attenuation sheets cover one side of the pinholes; among them, the attenuation sheets include at least two kinds of attenuation sheets with different thicknesses, and the attenuation sheets with different thicknesses are arranged on different pinholes. The attenuation sheets are used to filter X-rays in different energy ranges and pass the X-rays in the required energy range into the framing camera, so that the framing camera can image the X-rays in the corresponding energy range.

[0072] In some embodiments, the attenuation sheets can be arranged on the array pinhole plate 1 by various means, such as pasting, magnetic attraction, clamping or screw fixation. The attenuation sheets can be selected with various different thicknesses and materials according to the X-rays in the required filtered energy range. For example, materials such as Al, Be, Au, Cu, Ag or Fe are used, and the thickness can be selected as attenuation sheets between 1 and 150 microns to filter the X-rays in the corresponding energy range, so that the framing camera can obtain images of different energy ranges inside the plasma.

[0073] Embodiment 2

[0074] Please refer to Figure 4-5 , which shows the second use state and the collimation principle of the array pinhole imaging device provided by the embodiment of the present application. In order to improve the imaging effect, the device can also use a corresponding laser collimation module. The laser collimation module includes a first collimation plate 61, a second collimation plate 62 and a laser. The first collimation plate 61 is adapted to the installation position 221; the second collimation plate 62 is adapted to the first flange 51. Among them, both the first collimation plate 61 and the second collimation plate 62 have through holes for the laser to pass through at the center. When collimation is required, the first collimation plate 61 is installed on the installation position 221 of the positioning component 2, and the second collimation plate 62 is installed on the first flange 51. By irradiating the first collimation plate 61 and the second collimation plate 62 with the laser, the positioning component 2 and the framing camera component 3 can be quickly collimated by using the first collimation plate 61 and the second collimation plate 62. The installation method of the first collimation plate 61 of the above laser collimation module corresponds to that of the array pinhole plate 1, and the installation method of the second collimation plate 62 corresponds to that of the framing camera component 3. In this way, the device does not need to add additional connection structures to the device, does not need to replace too many parts, improves the experimental efficiency and reduces the use cost. And after the device is collimated by the laser collimation module, compared with the error problem caused by the difficult position matching when installing an additional collimation device, its collimation accuracy is higher, and it can more ensure the imaging effect of the plasma in the target area.

[0075] When working, the device can provide at least two different working modes, including time-resolved mode and non-time-resolved mode. Among them, for the time-resolved mode, the first step is to align the array pinhole plate 1, positioning component 2 and framing camera component 3 in the device through the collimated laser to ensure that the collimated laser can pass through the pinhole to reach the target; the second step is to remove the collimation system and replace it with the framing camera and array pinhole plate 1 in its original position. Note that in this mode, no filter film is added to the array pinhole. The system avoids interference from visible light by adding a filter film in front of the detector. The successful debugging of these two steps can be considered as the completion of system debugging. Next, the vacuum system starts to work. The vacuum condition of the entire chamber is required to be 10E in the experiment. -4 The third step is to adjust the laser or ion beam to react with the target to produce X-rays; the fourth step is that the X-rays will form an image after passing through the array pinholes. The size of the image is determined by the object-image distance ratio, and then the image is detected by the rear-end framing camera. The framing camera provides four frames, each frame corresponds to three pinholes, and the gating time is 5ns. A certain time delay can be adjusted between adjacent frames, and the adjustable range is 200ps-10ns. By adjusting the time of adjacent frames, the evolution of plasma over time can be obtained, thereby obtaining information such as the shape and volume of plasma in the target area.

[0076] For the non-time-resolved mode, the basic steps to achieve it are similar to those for the time-resolved mode, except that in the second step, attenuation sheets of different thicknesses are added in front of the array pinhole plate 1 to filter X-rays of different energies, and in the fourth step, the static function of the framing camera is used, and no time delay is set for the four frames. Because under the condition of high-power laser / ion beam targeting, wide-band X-rays can be generated, which can carry spatial information, and the spatial position can be imaged through the pinhole. Without adding filters, the image formed by each pinhole is consistent, but gradually adding filters of different thicknesses means that X-rays of different energies can be filtered (for example, the transmittance of X-rays with an energy of 1.5keV through metal beryllium of 5 microns, 10 microns, 20 microns, and 50 microns is 85%, 72%, 51%, and 19% respectively; while 1keV X-rays basically cannot pass through 50 microns of beryllium), then it can present differentiated images, which actually represent the X-rays emitted at different locations. By using image processing methods to process differentiated images, important data support can be provided for the reconstruction of the three-dimensional spatial information of the target area. Of course, the selection of materials and thickness of attenuation sheets is diverse. If you want to filter high-energy X-rays, you need to select high-Z (such as Au, Ag, Cu, etc.) and thicker attenuation sheets. If you want to filter low-energy X-rays, you need to select low-Z (such as Be, Al, etc.) and thinner attenuation sheets. Typically, the thickness of the selected attenuation sheet is generally in the micrometer range, and attenuation sheets of different thicknesses can be selected according to different requirements.

[0077] For further information, please refer to Figure 6 , the figure shows the installation method of the attenuation plate of the array pinhole plate 1 provided in the embodiment of the present application. In one embodiment, the same pinhole group 11 is provided with at least two attenuation plates of different thicknesses. Each pinhole group 11 can transmit X-rays of different energies, so that the imaging in the same pinhole group 11 can simultaneously reflect the plasma distribution of different states in the target area, so that a single imaging can obtain an image with a rich enough range. In another embodiment, the same pinhole group 11 shares the same attenuation plate, and the thickness of the attenuation plates corresponding to each pinhole group is different. If it is necessary to obtain X-ray imaging of different energy ranges, the attenuation plates at different pinhole positions can be replaced, thereby achieving the purpose of improving the experimental efficiency.

[0078] In addition, the attenuation sheet can also be set as a whole, and different thicknesses can be set at the corresponding pinhole positions to achieve imaging of X-rays of different energies. If different experiments are required, they can be achieved by replacing the attenuation sheet, making the experiment easier to perform, improving the experimental efficiency and ensuring the experimental effect. It can be understood that the setting method of the attenuation sheet can be determined according to the actual experimental needs.

[0079] In one embodiment, a certain delay can be set for the imaging between the pinholes in the pinhole group, and the delay can be used to achieve X-ray imaging of different energies at different times, so that an image with a time-resolved effect can be obtained in a single imaging.

[0080] The array pinhole imaging device in the present application utilizes the cooperation of the array pinhole plate 1, the positioning component 2 and the framing camera component 3 to facilitate the alignment of the array pinhole plate 1, thereby solving the problem of low imaging efficiency. In addition, a number of attenuation plates of different thicknesses are arranged on the array pinhole plate 1 and arranged on different pinholes, so that at least two image information of X-rays of different energies can be obtained in a single imaging, thereby providing important data support for the reconstruction of the three-dimensional spatial information of the target area.

[0081] Example 3

[0082] Please combine Figure 7 , the figure shows the process of the X-ray imaging method provided in an embodiment of the present application.

[0083] The X-ray imaging method is applied to an array pinhole imaging device, which can be as follows: Figure 1-6 The array pinhole imaging device of any embodiment.

[0084] The array pinhole plate 1 of the device comprises at least a first pinhole 121 and a second pinhole 122, one side of the first pinhole 121 is covered with a first thickness attenuation sheet, one side of the second pinhole 122 is covered with a second thickness attenuation sheet, and the first thickness is different from the second thickness.

[0085] The method includes:

[0086] 101 . Acquire a first image through a first pinhole 121 and a second image through a second pinhole 122 simultaneously or sequentially through a framing camera assembly 3 .

[0087] 102. Process the first image and the second image to obtain processed image information.

[0088] Among them, the framing camera assembly 3 can obtain X-ray imaging with different energies through the first pinhole 121 and the second pinhole 122 covered with attenuation sheets of different thicknesses, and use two different X-ray imaging to obtain the image information of the corresponding target area plasma, so as to realize that X-rays of different energies emitted from different regional positions present differentiated images, providing key measurement data for the reconstruction of the target area spatial information.

[0089] In some embodiments, a laser alignment module can be used to achieve more convenient alignment. The array pinhole imaging device also includes a positioning component 2, which includes a mounting position 221. The array pinhole plate 1 is arranged on the mounting position 221 for fine-tuning the positioning of the array pinhole plate 1. The vacuum component 4 is provided with a first flange 51 on the side connected to the framing camera component 3. The device also includes a laser alignment module, which includes a first alignment plate 61, a second alignment plate 62 and a laser. Before simultaneously or sequentially acquiring a first image through the first pinhole 121 and a second image through the second pinhole 122 through the framing camera component 3, it also includes: installing the first alignment plate 61 on the mounting position 221 of the positioning component 2; installing the second alignment plate 62 on the first flange 51.

[0090] Compared with traditional X-ray imaging equipment that requires additional connection structures, the X-ray imaging method of the present application does not require the replacement of too many parts, thereby improving experimental efficiency and reducing usage costs. Moreover, after the device is aligned by a laser alignment module, compared with the error problem caused by the difficulty in position matching when installing additional alignment equipment, its alignment accuracy is higher and can better ensure the imaging effect of the plasma in the target area.

[0091] Furthermore, in order to improve the collimation efficiency, the method further comprises:

[0092] After the alignment between the first collimator plate 61 and the second collimator plate 62 is achieved, the first collimator plate 61 is replaced with the array pinhole plate 1, and the second collimator plate 62 is replaced with the framing camera assembly 3. The steps of simultaneously or sequentially acquiring the first image through the first pinhole 121 and the second image through the second pinhole 122 by the framing camera assembly 3 are performed.

[0093] Designing the first collimator plate 61 and the array pinhole plate 1, and the second collimator plate 62 and the framing camera assembly 3 to be replaceable can not only improve the replacement efficiency, but also because the collimator plates and the components can be adapted to each other, after the alignment between the first collimator plate 61 and the second collimator plate 62 is completed, they can be used without further adjustment after the array pinhole plate 1 and the framing camera assembly 3 are installed, thereby ensuring the collimation effect between the array pinhole plate 1 and the framing camera assembly 3.

[0094] In some embodiments, the first pinhole 121 is located in the first pinhole 121 group 11, and the second pinhole 122 is located in the second pinhole 122 group; or the first pinhole 121 and the second pinhole 122 are the same pinhole group 11. Each pinhole group 11 can transmit X-rays of different energies, so that the imaging in the same pinhole group 11 can simultaneously reflect the plasma distribution of different energies in the target area, so that a single imaging can obtain an image with a sufficiently rich energy range. In another embodiment, the same pinhole group 11 shares the same attenuation plate, and the thickness of the attenuation plate corresponding to each pinhole group is different. If it is necessary to obtain X-ray imaging of different energy ranges, the attenuation plates at different pinhole positions can be replaced, thereby achieving the purpose of improving the experimental efficiency.

[0095] For image processing, the first image and the second image are processed to obtain processed image information, including: calculating the difference between the first image and the second image; and obtaining image information of different position areas corresponding to different X-ray energies based on the difference.

[0096] In this embodiment, after passing through the attenuation sheet, X-rays of different energies will have different images, and the images formed by different pinholes can be superimposed, removed, or even processed by using artificial intelligence to evolve based on the image information. By processing X-ray images of different energies, the three-dimensional spatial information of the target area can be reconstructed, thereby facilitating subsequent analysis of the experiment. It is understandable that those skilled in the art can use existing image processing technology to implement image analysis and processing according to experimental requirements, and this application does not limit the specific processing method.

[0097] During the imaging process, assemble the various subassemblies together, and place the two collimating plates at the positions of the array pinhole plate 1 and the framing camera assembly 3. Turn on the collimating laser 63 at the rear end of the second collimating plate 62, and adjust its positioning knob so that the light beam it emits passes through the through holes of the first collimating plate 61 and the second collimating plate 62 and hits the target to be measured, which is considered a successful collimation adjustment. Remove the first collimating plate 61, the second collimating plate 62, and the collimating laser 63, replace the array pinhole plate 1 and the framing camera in their original positions, connect the vacuum molecular pump and the mechanical pump, and wait for the vacuum to be suitable to carry out the array pinhole imaging experiment. If you want to carry out the above-mentioned time-resolved imaging experiment, adjust the microstrip time module of the framing camera after the vacuum is suitable. If the above-mentioned non-time-resolved imaging experiment is to be carried out, when other conditions remain unchanged, it is only necessary to paste attenuation sheets of different thicknesses in front of the pinholes on the array pinhole plate 1, and filter X-rays of different energies through the attenuation sheets to obtain differentiated images of X-rays of different energies emitted from different areas. The obtained images are processed by image subtraction, and the contrast of the processed images is enhanced by performing a secondary wavelet transform.

[0098] The X-ray imaging method of the present application is based on an improved array pinhole imaging device, which can obtain at least two image information of X-rays of different energies in a single imaging, greatly improving the experimental efficiency. The improvement of the collimation system makes the imaging effect of the device more reliable, thereby providing important data support for the reconstruction of the three-dimensional spatial information of the target area.

[0099] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0100] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0101] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the construction completion methods of the present application. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the construction completion methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present application should be included in the protection scope of the claims of the present application.

Claims

1. An array pinhole imaging device, characterized in that: The device comprises: The array pinhole plate is provided with a plurality of pinhole groups arranged in parallel, each pinhole group includes a plurality of pinholes; A positioning assembly, comprising a mounting position, on which the array pinhole plate is arranged, for fine-tuning the positioning of the array pinhole plate; A framing camera assembly is provided with a plurality of microstrips for imaging corresponding to the optical paths of the pinhole groups, wherein the microstrips correspond to the pinhole groups one by one; and A vacuum assembly, disposed between the positioning assembly and the framing camera assembly, for providing a vacuum environment inside the device; The array pinhole plate is also provided with a plurality of attenuation sheets, and the attenuation sheets cover one side of the pinholes; wherein the attenuation sheets include at least two attenuation sheets of different thicknesses, and the attenuation sheets of different thicknesses are arranged on different pinholes.

2. The array pinhole imaging device according to claim 1, characterized in that: The positioning assembly includes a first reset plate and a second reset plate; The middle parts of the first reset plate and the second reset plate are respectively provided with mounting holes, and the array pinhole plate can be mounted and fixed on the mounting holes of the first reset plate and the second reset plate.

3. The array pinhole imaging device according to claim 2, characterized in that: The first reset plate and the second reset plate are reset by magnetic attraction.

4. The array pinhole imaging device according to claim 1, characterized in that: The same pinhole group shares the same attenuation sheet, and the attenuation sheets corresponding to the pinhole groups have different thicknesses.

5. The array pinhole imaging device according to claim 1, characterized in that: The same pinhole group is provided with at least two attenuation plates with different thicknesses.

6. The array pinhole imaging device according to claim 1, characterized in that: The vacuum assembly is provided with a first flange on one side connected to the framing camera assembly; The device also includes a laser alignment module, which includes a first alignment plate, a second alignment plate and a laser; The first collimation plate is adapted to the mounting position; The second collimation plate is adapted to the first flange; The laser cooperates with the first collimating plate and the second collimating plate to align the array pinhole plate and the framing camera assembly.

7. An X-ray imaging method, characterized in that: The method is applied to the array pinhole imaging device according to any one of claims 1 to 8; The array pinhole plate of the device comprises at least a first pinhole and a second pinhole, one side of the first pinhole is covered with an attenuation sheet of a first thickness, and one side of the second pinhole is covered with an attenuation sheet of a second thickness, and the first thickness is different from the second thickness; The method comprises: Acquire a first image through the first pinhole and a second image through the second pinhole simultaneously or sequentially through a framing camera assembly; The first image and the second image are processed to obtain processed image information.

8. The X-ray imaging method according to claim 7, characterized in that: The processing of the first image and the second image to obtain processed image information includes: calculating a difference between the first image and the second image; Image information of different position areas corresponding to different X-ray energies is obtained based on the difference.

9. The X-ray imaging method according to claim 7, characterized in that: The device further comprises a positioning assembly, wherein the positioning assembly comprises a mounting position, the array pinhole plate is arranged on the mounting position, and is used for fine-tuning the positioning of the array pinhole plate; the vacuum assembly is provided with a first flange on a side connected to the framing camera assembly; The device also includes a laser alignment module, which includes a first alignment plate, a second alignment plate and a laser; Before simultaneously or sequentially acquiring the first image through the first pinhole and the second image through the second pinhole through the framing camera assembly, the method further includes: Installing the first collimation plate on the mounting position of the positioning assembly; installing a second collimating plate on the first flange; The laser is collimated by cooperating with the first collimating plate and the second collimating plate.

10. The X-ray imaging method according to claim 9, characterized in that: The method further comprises: After the alignment between the first collimator plate and the second collimator plate is achieved, the first collimator plate is replaced with an array pinhole plate, and the second collimator plate is replaced with a framing camera assembly; The steps of simultaneously or sequentially acquiring a first image through a first pinhole and a second image through a second pinhole by a framing camera assembly are performed.

11. The X-ray imaging method according to any one of claims 8 to 10, characterized in that: The first pinhole is located in a first pinhole group, and the second pinhole is located in a second pinhole group; or The first pinhole and the second pinhole are in the same pinhole group.

12. The X-ray imaging method according to any one of claims 8 to 10, characterized in that: The attenuation sheets are attenuation sheets of different thicknesses containing the same metal type; or The attenuation sheets are attenuation sheets containing different metal types and having different thicknesses.

Images