Display module and preparation method thereof

Abstract

The embodiment of the invention discloses a display module and a preparation method thereof, and according to the preparation method of the display module, a driving chip and a flexible circuit board are bound to a driving substrate in a mode of carrying out double-sided simultaneous binding on the front surface and the back surface of the driving substrate, so that the binding time is saved, and a narrow frame can be realized.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a method for preparing the same. Background Art

[0002] The driver chip is bound to the narrow frame technology of the display panel. The frame on one side of the binding side is mainly limited by the binding area of ​​the driver chip and the flexible circuit board. The existing technical solution is to bind both the driver chip and the flexible circuit to the ground side of the frame area, which cannot be further compressed.

[0003] In the process of research and practice of the prior art, the inventors of the present application found that the back-side binding of the flexible circuit board can further compress the frame, but the driver chip and the flexible circuit board need to be bound in sequence, resulting in low efficiency in assembling the display module. Summary of the invention

[0004] The embodiments of the present application provide a display module and a method for preparing the same, which can improve the assembly efficiency of the display module.

[0005] The present invention provides a method for preparing a display module, which comprises the following steps:

[0006] A display panel is provided, the display panel comprising a driving substrate, a first binding area and a second binding area are arranged on the driving substrate, the first binding area is arranged on the front side of the driving substrate, the second binding area is arranged on the back side of the driving substrate, and in the thickness direction of the driving substrate, the first binding area and the second binding area at least partially overlap;

[0007] The driving chip and the flexible circuit board are bound to the first binding area and the second binding area at the same time, the driving chip is bound to the first binding area, and one side of the flexible circuit board is bound to the second binding area.

[0008] Optionally, in some embodiments of the present application, before the step of simultaneously binding the driver chip and the flexible circuit board in the first binding area and the second binding area, the step further includes:

[0009] The display panel is placed on a stage, and the portion of the drive substrate having the first binding area and the second binding area exceeds the stage and is suspended;

[0010] Disposing a first conductive adhesive in the first binding area, and pre-binding the driving chip to the first binding area through the first conductive adhesive, wherein the first conductive adhesive is in a pre-cured state;

[0011] A second conductive adhesive is disposed in the second binding area, and the flexible circuit board is pre-bound to the second binding area through the second conductive adhesive, and the second conductive adhesive is in a pre-cured state.

[0012] Optionally, in some embodiments of the present application, a set time interval is set between the step of pre-binding the driver chip and the step of pre-binding the flexible circuit board.

[0013] Optionally, in some embodiments of the present application, the step of simultaneously binding the driver chip and the flexible circuit board in the first binding area and the second binding area includes the following steps:

[0014] The first pressing head is used to heat press the driving chip and the second pressing head is used to heat press the flexible circuit board at the same time, so that the first conductive adhesive and the second conductive adhesive are both in a fully fixed state, and the set pressure of the first pressing head is equal to the set pressure of the second pressing head.

[0015] Optionally, in some embodiments of the present application, before the step of simultaneously using the first pressing head to heat press the driver chip and the second pressing head to heat press the flexible circuit board, the following steps are also included:

[0016] Disposing a first buffer layer on a side of the driver chip away from the driver substrate;

[0017] A second buffer layer is disposed on a side of the flexible circuit board away from the driving substrate, and in a top view, a plane area of ​​the driving chip is smaller than a plane area of ​​the flexible circuit board in the second binding area.

[0018] Optionally, in some embodiments of the present application, the flexible circuit board includes a binding portion and a redundant portion located on an opposite side of the binding portion, the binding portion is configured to be bound and connected to the first binding area, the redundant portion is configured to relieve the pressure of the second pressure head, and the second buffer layer continuously covers the binding portion and the redundant portion;

[0019] In the step of simultaneously using the first press head to heat press the driver chip and the second press head to heat press the flexible circuit board, the first press head heat presses the driver chip through the first buffer layer, and the second press head heat presses the flexible circuit board through the second buffer layer, so that the pressure applied to the driver chip is greater than the pressure applied to the flexible circuit board.

[0020] Optionally, in some embodiments of the present application, the elastic modulus of the second buffer layer is smaller than the elastic modulus of the first buffer layer.

[0021] Optionally, in some embodiments of the present application, the actual pressure exerted on the driver chip by the first pressure head is between 60 MPa and 80 MPa, and the actual pressure exerted on the flexible circuit board by the second pressure head is between 3 MPa and 6 MPa.

[0022] Optionally, in some embodiments of the present application, the set temperature of the first pressing head and the second pressing head is the same, and the hot pressing time of the first pressing head and the second pressing head is the same.

[0023] Accordingly, the embodiment of the present application further provides a display module, which includes:

[0024] The display panel comprises a driving substrate, wherein the driving substrate is provided with a first binding area and a second binding area, wherein the first binding area is provided on a front surface of the driving substrate, and the second binding area is provided on a back surface of the driving substrate, and in a thickness direction of the driving substrate, the first binding area and the second binding area at least partially overlap;

[0025] a driving chip, bound to the first binding area; and

[0026] The flexible circuit board is bound to the second binding area.

[0027] Optionally, in some embodiments of the present application, the flexible circuit board includes a binding portion and a redundant portion located on an opposite side of the binding portion, the binding portion is bound to the first binding area, and the redundant portion is located outside the first binding area.

[0028] The method for preparing the display module of the embodiment of the present application uses a method of binding the driver chip and the flexible circuit board to the driver substrate by binding both the front and back sides of the driver substrate at the same time, which not only saves the binding time, but also can achieve a narrow frame. In addition, compared with the step-by-step binding of the driver chip and the flexible circuit board, the simultaneous binding of the driver chip and the flexible circuit board can avoid the high temperature of the later binding step affecting the binding effect of the previous binding step, so that the driver chip or flexible circuit board bound in the front is peeled off. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic diagram of a process for preparing a display module provided in an embodiment of the present application;

[0030] Figure 2 is a schematic diagram of step B01 of the method for preparing a display module provided in an embodiment of the present application;

[0031] Figure 3 is a schematic diagram of step B02 of the method for preparing a display module provided in an embodiment of the present application;

[0032] Figure 4is a schematic diagram of step B03 of the method for preparing a display module provided in an embodiment of the present application;

[0033] Figure 5 is a schematic diagram of step B04 of the method for preparing a display module provided in an embodiment of the present application;

[0034] Figure 6 is a schematic diagram of step B05 of the method for preparing a display module provided in an embodiment of the present application;

[0035] Figure 7 is a schematic diagram of step B06 of the method for preparing a display module provided in an embodiment of the present application;

[0036] Figure 8 It is a structural schematic diagram of a display module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, the various embodiments can be combined with each other but will not be repeated one by one, and in the absence of contrary instructions, the directional words used, such as "upper" and "lower", usually refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device; the terms "first", "second", "third", etc. are used only as markings, and no numerical requirements are imposed or order is established.

[0038] The present application provides a display module and a method for manufacturing the same, which are described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0039] The present invention provides a method for preparing a display module, which comprises the following steps:

[0040] A display panel is provided, the display panel comprising a driving substrate, a first binding area and a second binding area are arranged on the driving substrate, the first binding area is arranged on the front side of the driving substrate, the second binding area is arranged on the back side of the driving substrate, and in the thickness direction of the driving substrate, the first binding area and the second binding area at least partially overlap;

[0041] The driving chip and the flexible circuit board are bound to the first binding area and the second binding area at the same time, the driving chip is bound to the first binding area, and one side of the flexible circuit board is bound to the second binding area.

[0042] The preparation method of the display module of the embodiment of the present application adopts a double-sided binding method on the front and back sides of the driving substrate to bind the driving chip and the flexible circuit board to the driving substrate, which not only saves binding time but also can achieve a narrow frame.

[0043] In addition, compared with binding the driver chip and the flexible circuit board in steps, binding the driver chip and the flexible circuit board at the same time can avoid the high temperature in the later binding step affecting the binding effect in the previous binding step, causing the driver chip or flexible circuit board bound in the previous step to peel off.

[0044] Please refer to Figure 1 The method for preparing a display module provided in an embodiment of the present application comprises the following steps:

[0045] Step B01: Provide a display panel 10. The display panel 10 includes a driving substrate 11, on which a first binding area c1 and a second binding area c2 are provided. The first binding area c1 is provided on the front side of the driving substrate 11, and the second binding area c2 is provided on the back side of the driving substrate 11. In the thickness direction of the driving substrate 11, the first binding area c1 and the second binding area c2 at least partially overlap.

[0046] Step B04: The driving chip 20 and the flexible circuit board 30 are simultaneously bound to the first binding area c1 and the second binding area c2. The driving chip 20 is bound to the first binding area c1, and one side of the flexible circuit board 30 is bound to the second binding area c2.

[0047] The preparation method of the display module of the embodiment of the present application adopts a double-sided binding method on the front and back sides of the driving substrate 11 to bind the driving chip 20 and the flexible circuit board 30 to the driving substrate 11, which not only saves binding time but also can achieve a narrow frame.

[0048] It should be noted that the display panel 10 may be a liquid crystal display panel, but is not limited thereto. For example, it may be an electroluminescent panel or an electrophoretic panel. The embodiment of the present application takes the display panel 10 as a liquid crystal display panel as an example and is described below.

[0049] Please refer to Figure 2 In step B01, a display panel 10 is provided.

[0050] The display panel 10 includes a driving substrate 11, on which a first binding area c1 and a second binding area c2 are provided, wherein the first binding area c1 is provided on the front side of the driving substrate 11, and the second binding area c2 is provided on the back side of the driving substrate 11. In the thickness direction of the driving substrate 11, the first binding area c1 and the second binding area c2 at least partially overlap.

[0051] The display panel 10 further includes an opposing substrate 12 disposed on the driving substrate 11 and a polarizer 13 disposed on the opposing substrate 12. The portion of the driving substrate 11 having the first binding area c1 and the second binding area c2 exceeds the opposing substrate 12 and the polarizer 13.

[0052] Optionally, the driving substrate 11 further includes a first pad 101 disposed on the first binding area c1 and a second pad 102 disposed on the second binding area c2. The first pad 101 is configured to be bound and connected to the driving chip 20, and the second pad 102 is configured to be bound and connected to the flexible circuit board 30. A trace 103 is disposed on the side of the driving substrate 11. One end of the trace 103 is connected to the driving circuit on the driving substrate 11, and the other end of the trace 103 is connected to the second pad 102.

[0053] Optionally, the traces 103 may be formed on the side and back sides of the driving substrate 11 by silk-screen printing.

[0054] Then go to step B02.

[0055] Please refer to Figure 3 , Step B02: pre-binding the driving chip 20 to the first binding area c1, and pre-binding the flexible circuit board 30 to the second binding area c2.

[0056] It is understandable that the driver chip 20 and the flexible circuit board 30 are pre-bound to facilitate better positioning and adjustment of the positions of the driver chip 20 and the flexible circuit board 30 and to fix the driver chip 20 and the flexible circuit board 30. In addition, compared with the step-by-step binding of the driver chip and the flexible circuit board, the simultaneous binding of the driver chip 20 and the flexible circuit board 30 can avoid the high temperature in the later binding step affecting the binding effect in the previous binding step, so that the driver chip or the flexible circuit board bound in the previous step is peeled off.

[0057] Optionally, step B02 further includes the following steps:

[0058] Step B021 : placing the display panel 10 on the carrier 40 , and the portion of the driving substrate 11 having the first binding area c1 and the second binding area c2 exceeds the carrier 40 and is suspended.

[0059] It is understandable that the binding part of the driving substrate 11 is suspended to facilitate the subsequent binding of the driving chip 20 and the flexible circuit board 30. The display panel 10 is arranged on the carrier 40, which can fix the display panel 10 and reduce the risk of the display panel 10 moving.

[0060] Optionally, the display panel 10 may be fixed on the carrier 40 by vacuum adsorption or other physical fixing methods. Then, the process proceeds to step B022.

[0061] Optionally, the pre-bound driver chip 20 and the flexible circuit board 30 may be aligned by using an upper light source reflected image alignment method.

[0062] Step B022: a first conductive adhesive 21 is disposed in the first binding region c1 , and the driving chip 20 is pre-bound to the first binding region c1 by the first conductive adhesive 21 , wherein the first conductive adhesive 21 is in a pre-cured state.

[0063] Step B023: a second conductive adhesive 31 is disposed in the second binding region c2 , and the flexible circuit board 30 is pre-bound to the second binding region c2 by the second conductive adhesive 31 , and the second conductive adhesive 31 is in a pre-cured state.

[0064] It should be understood that the first conductive adhesive 21 pre-binds the driver chip 20 and the second conductive adhesive 31 pre-binds the flexible circuit board 30, which has the effect of pre-positioning and pre-fixing the driver chip 20 and the flexible circuit board 30, facilitating the subsequent pressing step.

[0065] Optionally, step B022 and step B023 may be performed simultaneously or in steps.

[0066] Optionally, in some embodiments of the present application, a set time interval is set between the step of pre-binding the driver chip 20 and the step of pre-binding the flexible circuit board 30. That is, step B022 and step B023 are performed in steps, and one of step B022 and step B023 is pre-binded first, and the other is pre-binded later.

[0067] It should be understood that, since the binding part of the display panel 10 is suspended and the pressure required for pre-binding is relatively small, a pressure head can be used for single-sided pre-pressing without damaging the driving substrate 11. That is, in the pre-binding step, the pressure of the pressure head on the driving chip 20 and the flexible circuit board 30 is smaller than the adsorption force of the carrier 40 on the display panel 10.

[0068] Secondly, by setting the time interval, after the first conductive adhesive 21 is pre-fixed and cooled to room temperature, the temperature of pre-curing the second conductive adhesive 31 is relatively low and the false pressing time is relatively short. Therefore, when the second conductive adhesive 31 is pre-cured, the second conductive adhesive 31 has little effect on the first conductive adhesive 21, thereby reducing the risk of the two pre-curing steps affecting each other.

[0069] Optionally, the duration of pre-pressing the second conductive adhesive 31 is between 1 second and 3 seconds, such as 1 second, 2 seconds or 3 seconds; the set temperature of the second pressing head 62 for pre-pressing the second conductive adhesive 31 is between 80 degrees Celsius and 120 degrees Celsius, such as 80 degrees Celsius, 90 degrees Celsius, 100 degrees Celsius, 110 degrees Celsius or 120 degrees Celsius. Figure 5 .

[0070] In addition, in some embodiments, based on the duration and temperature of the pre-pressing of the second conductive adhesive 31, and the large area of ​​the second pressing head 62 and the second conductive adhesive 31, when pre-pressing the flexible circuit board 30, the second pressing head 62 transfers more heat to the driving substrate 11, and more heat is transferred to the first conductive adhesive 21 through the driving substrate 11, prompting the first conductive adhesive 21 to further pre-cure, so the duration and temperature of the pre-pressing of the second conductive adhesive 31 can be adjusted to supplement and improve the pre-cure degree of the first conductive adhesive 21 close to the driving substrate 11, thereby improving the stability of the pre-binding of the driving chip 20. That is, the pre-cure degree of the first conductive adhesive 21 is higher than the pre-cure degree of the second conductive adhesive 31, without affecting the main pressing effect of step B04.

[0071] Optionally, the set time length can be set according to actual conditions, and the present application does not impose any limitation thereto, as long as the first conductive adhesive 21 or the second conductive adhesive 31 can be cooled to room temperature.

[0072] Then go to step B03.

[0073] Please refer to Figure 4 Step B03: a first buffer layer 51 is disposed on a side of the driver chip 20 away from the driver substrate 11, and a second buffer layer 52 is disposed on a side of the flexible circuit board 30 away from the driver substrate 11. In a top view, the plane area of ​​the driver chip 20 is smaller than the plane area of ​​the flexible circuit board 30 in the second binding area c2.

[0074] It is understandable that the first buffer layer 51 and the second buffer layer 52 are correspondingly provided on the driving chip 20 and the flexible circuit board 30 , which can not only buffer the pressure of the pressure head, but also protect the driving chip 20 and the flexible circuit board 30 .

[0075] Secondly, the planar area of ​​the driving chip 20 is smaller than the planar area of ​​the portion of the flexible circuit board 30 located in the second binding area c2 , so the planar area of ​​the first buffer layer 51 is also required to be smaller than the planar area of ​​the second buffer layer 52 .

[0076] In some embodiments of the present application, the elastic modulus of the second buffer layer 52 is smaller than that of the first buffer layer 51 .

[0077] It should be noted that, since the flexible circuit board 30 has good flexibility, when it is subjected to a large pressure, the flexible circuit board 30 will be squeezed and deformed, which will affect the stability of the circuit. Therefore, the pressure required by the flexible circuit board 30 is relatively small.

[0078] In the subsequent step of pressing the driving chip 20 and the flexible circuit board 30, the driving chip 20 and the flexible circuit board 30 require different pressures. The driving chip 20 requires a larger pressure, so the elastic modulus of the second buffer layer 52 can be set to be smaller to relieve more pressure, thereby reducing the pressure on the flexible circuit board 30.

[0079] In some embodiments of the present application, the first buffer layer 51 can also be set on the pressing surface of the first pressing head 61 used to press the driving chip 20, and the second buffer layer 52 can be set on the pressing surface of the second pressing head 62 used to press the flexible circuit board 30.

[0080] Then proceed to step B04.

[0081] Please refer to Figure 5 In step B04, the driving chip 20 and the flexible circuit board 30 are simultaneously bound to the first binding area c1 and the second binding area c2. The driving chip 20 is bound to the first binding area c1, and one side of the flexible circuit board 30 is bound to the second binding area c2.

[0082] Optionally, the binding driving chip 20 and the flexible circuit board 30 may be aligned by using an upper light source reflected image alignment method.

[0083] Optionally, the first pressing head 61 is used to heat press the driving chip 20 and the second pressing head 62 is used to heat press the flexible circuit board 30 at the same time, so that the first conductive adhesive 21 and the second conductive adhesive 31 are both in a fully fixed state. At this time, the set pressure of the first pressing head 61 is equal to the set pressure of the second pressing head 62.

[0084] During the double-sided hot pressing process, the set pressures of the first pressing head 61 and the second pressing head 62 are set to be the same, so that the external combined force on the driving substrate 11 is 0, so that the driving substrate 11 is in a static state, thereby preventing the driving substrate 11 from being damaged due to excessive pressure on one side and being pressed toward the side with smaller pressure.

[0085] Optional, see Figure 6 In some embodiments of the present application, the flexible circuit board 30 includes a binding portion 3a and a redundant portion 3b located on the opposite side of the binding portion 3a, the binding portion 3a is configured to be bound and connected to the first binding area c1, and the redundant portion 3b is configured to relieve the pressure of the second pressure head 62. The second buffer layer 52 continuously covers the binding portion 3a and the redundant portion 3b.

[0086] The first pressing head 61 heat-presses the driving chip 20 through the first buffer layer 51 , and the second pressing head 62 heat-presses the flexible circuit board 30 through the second buffer layer 52 , so that the pressure on the driving chip 20 is greater than the pressure on the flexible circuit board 30 .

[0087] It is understandable that the redundant portion 3 b of the flexible circuit board 30 increases the pressing area between the flexible circuit board 30 and the second pressing head 62 , that is, increases the force-bearing area of ​​the second pressing head 62 , so as to share the pressure of the second pressing head 62 , thereby reducing the pressure on the flexible circuit board 30 .

[0088] Optionally, in the length direction of the second binding region c2, the length of the redundant portion 3b is between 1 / 4 and 2 / 1 of the length of the binding portion 3a, and may be 1 / 4, 1 / 3 or 1 / 2.

[0089] Optionally, in some embodiments of the present application, the actual pressure exerted on the driver chip 20 by the first pressure head 61 is between 60 MPa and 80 MPa, for example, 60 MPa, 65 MPa, 70 MPa, 75 MPa or 80 MPa.

[0090] The actual pressure exerted on the flexible circuit board 30 by the second pressure head 62 is between 3 MPa and 6 MPa, for example, 3 MPa, 4 MPa, 5 MPa or 6 MPa.

[0091] It is understandable that the force applied to the flexible circuit board 30 is less than 6 MPa, which can further reduce the risk of the binding disk in the flexible circuit board 30 being warped due to excessive pressure.

[0092] Optionally, in some embodiments, in a top view of the display panel 10 , the first binding area c1 is entirely disposed within the second binding area c2 , so that pressure areas of the first binding area c1 and the second binding area c2 overlap, thereby improving binding efficiency and binding yield.

[0093] Secondly, based on the simultaneous double-sided pressure, the second buffer layer 52 can also buffer and absorb the pressure transmitted by the first pressure head 61, and the first buffer layer 51 can buffer and absorb the pressure transmitted by the second pressure head 62, thereby reducing the risk of warping of the drive substrate 11 when the double-sided pressure is simultaneously applied.

[0094] Optionally, a supporting layer may be attached between the redundant part 3b and the driving substrate 11 to reduce the risk of cracking due to stress concentration at the boundary between the redundant part 3b and the binding part 3a when the redundant part 3b is suspended.

[0095] Optionally, before step B04, there is an empty space between the support layer and the second conductive adhesive 31. In step B04, the second conductive adhesive 31 overflows due to the pressure, and the overflowed conductive adhesive enters the empty space to fix the redundant part 3b and the driving substrate 11, thereby improving the stability of the connection between the flexible circuit board 30 and the driving substrate 11, and the support layer plays an effect of blocking the overflow of the second conductive adhesive 31.

[0096] Optionally, in some embodiments of the present application, the first pressing head 61 and the second pressing head 62 have the same set temperature, and the first pressing head 61 and the second pressing head 62 have the same hot pressing time. Such a setting is convenient for protecting the drive substrate 11 and preventing the drive substrate 11 from being damaged due to different temperatures on both sides and different pressing times.

[0097] Optionally, the set temperature for the double-sided binding of the driver chip 20 and the flexible circuit board 30 is between 160 degrees Celsius and 200 degrees Celsius, for example, 160 degrees Celsius, 170 degrees Celsius, 180 degrees Celsius, 190 degrees Celsius or 200 degrees Celsius.

[0098] Then go to step B05.

[0099] Please refer to Figure 7 In step B05 , the printed circuit board 70 and the flexible circuit board 30 are bound.

[0100] This completes the preparation process of the display module of the embodiment of the present application.

[0101] Please refer to Figure 8 The embodiment of the present application further provides a display module 100 , which includes a display panel 10 , a driving chip 20 and a flexible circuit board 30 .

[0102] The display panel 10 includes a driving substrate 11, and the driving substrate 11 is provided with a first binding area c1 and a second binding area c2, wherein the first binding area c1 is provided on the front surface of the driving substrate 11, and the second binding area c2 is provided on the back surface of the driving substrate 11. In the thickness direction of the driving substrate 11, the first binding area c1 and the second binding area c2 at least partially overlap.

[0103] The driving chip 20 is bound to the first binding area c1 , and the flexible circuit board 30 is bound to the second binding area c2 .

[0104] The driving chip 20 and the flexible circuit board 30 are configured to be simultaneously pressure-bonded to the display panel 10 .

[0105] It should be noted that the display module 100 of the embodiment of the present application is prepared by the display panel preparation method of the above embodiment. The driver chip 20 and the flexible circuit board 30 are bound to the driver substrate 11 by double-sided simultaneous pressing and binding on the front and back sides of the driver substrate 11, which not only saves the binding time but also can achieve a narrow frame.

[0106] Optionally, in some embodiments of the present application, the flexible circuit board 30 includes a binding portion 3a and a redundant portion 3b located on the opposite side of the binding portion 3a, the binding portion 3a is bound to the first binding area c1, and the redundant portion 3b is located outside the first binding area c1.

[0107] It is understandable that the redundant portion 3 b of the flexible circuit board 30 increases the pressing area between the flexible circuit board 30 and the second pressing head 62 , that is, increases the force-bearing area of ​​the second pressing head 62 , so as to share the pressure of the second pressing head 62 , thereby reducing the pressure on the flexible circuit board 30 .

[0108] Optionally, in the length direction of the second binding region c2, the length of the redundant portion 3b is between 1 / 4 and 2 / 1 of the length of the binding portion 3a, and may be 1 / 4, 1 / 3 or 1 / 2.

[0109] Optionally, in some embodiments, a supporting layer may be attached between the redundant part 3b and the driving substrate 11 to reduce the risk of cracking due to stress concentration at the boundary between the redundant part 3b and the binding part 3a when the redundant part 3b is suspended.

[0110] Optionally, there is a set distance between the support layer and the binding part 3a. When the second conductive glue 31 overflows due to the local pressure, the overflowing conductive glue enters the empty space of the set distance to fix the redundant part 3b and the driving substrate 11, thereby improving the stability of the connection between the flexible circuit board 30 and the driving substrate 11, and the support layer plays a role in blocking the overflow of the second conductive glue 31.

[0111] Optionally, the display module 100 further includes a printed circuit board 70 , and the printed circuit board 70 and the flexible circuit board 30 are bound and connected.

[0112] The above is a detailed introduction to a display module and a preparation method thereof provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing a display module, characterized in that: The following steps are involved: A display panel is provided, the display panel comprising a driving substrate, a first binding area and a second binding area are arranged on the driving substrate, the first binding area is arranged on the front side of the driving substrate, the second binding area is arranged on the back side of the driving substrate, and in the thickness direction of the driving substrate, the first binding area and the second binding area at least partially overlap; The driving chip and the flexible circuit board are bound to the first binding area and the second binding area at the same time, the driving chip is bound to the first binding area, and one side of the flexible circuit board is bound to the second binding area.

2. The method for preparing a display module according to claim 1, characterized in that: Before the step of binding the driving chip and the flexible circuit board in the first binding area and the second binding area, the method further includes: The display panel is placed on a stage, and the portion of the drive substrate having the first binding area and the second binding area exceeds the stage and is suspended; Disposing a first conductive adhesive in the first binding area, and pre-binding the driving chip to the first binding area through the first conductive adhesive, wherein the first conductive adhesive is in a pre-cured state; A second conductive adhesive is disposed in the second binding area, and the flexible circuit board is pre-bound to the second binding area through the second conductive adhesive, and the second conductive adhesive is in a pre-cured state.

3. The method for preparing a display module according to claim 2, characterized in that: A set time interval is set between the step of pre-binding the driver chip and the step of pre-binding the flexible circuit board.

4. The method for preparing a display module according to claim 3, characterized in that: The step of simultaneously binding the driving chip and the flexible circuit board in the first binding area and the second binding area comprises the following steps: The first pressing head is used to heat press the driving chip and the second pressing head is used to heat press the flexible circuit board at the same time, so that the first conductive adhesive and the second conductive adhesive are both in a fully fixed state, and the set pressure of the first pressing head is equal to the set pressure of the second pressing head.

5. The method for preparing a display module according to claim 4, characterized in that: Before the step of simultaneously using the first pressing head to heat press the driver chip and the second pressing head to heat press the flexible circuit board, the following steps are also included: Disposing a first buffer layer on a side of the driver chip away from the driver substrate; A second buffer layer is disposed on a side of the flexible circuit board away from the driving substrate, and in a top view, a plane area of ​​the driving chip is smaller than a plane area of ​​the flexible circuit board in the second binding area.

6. The method for preparing a display module according to claim 5, characterized in that: The flexible circuit board includes a binding portion and a redundant portion located at an opposite side of the binding portion, the binding portion is configured to be bound and connected to the first binding area, the redundant portion is configured to relieve the pressure of the second pressure head, and the second buffer layer continuously covers the binding portion and the redundant portion; In the step of simultaneously using the first press head to heat press the driver chip and the second press head to heat press the flexible circuit board, the first press head heat presses the driver chip through the first buffer layer, and the second press head heat presses the flexible circuit board through the second buffer layer, so that the pressure applied to the driver chip is greater than the pressure applied to the flexible circuit board.

7. The method for preparing a display module according to claim 6, characterized in that: The elastic modulus of the second buffer layer is smaller than the elastic modulus of the first buffer layer.

8. The method for preparing a display module according to any one of claims 5 to 7, characterized in that: The actual pressure exerted on the driver chip by the first pressure head is between 60 MPa and 80 MPa, and the actual pressure exerted on the flexible circuit board by the second pressure head is between 3 MPa and 6 MPa.

9. The method for preparing a display module according to any one of claims 4 to 7, characterized in that: The set temperatures of the first pressing head and the second pressing head are the same, and the hot pressing time of the first pressing head and the second pressing head is the same.

10. A display module, characterized in that: include: The display panel comprises a driving substrate, wherein the driving substrate is provided with a first binding area and a second binding area, wherein the first binding area is provided on a front surface of the driving substrate, and the second binding area is provided on a back surface of the driving substrate, and in a thickness direction of the driving substrate, the first binding area and the second binding area at least partially overlap; A driving chip, bound to the first binding area; as well as The flexible circuit board is bound to the second binding area.

11. The display module according to claim 10, characterized in that: The flexible circuit board includes a binding portion and a redundant portion located at an opposite side of the binding portion, the binding portion is bound to the first binding area, and the redundant portion is located outside the first binding area.

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