Rectifying device, substrate transmission unit and gluing and developing equipment

Abstract

The invention discloses a rectifying device, a substrate transmission unit and gluing and developing equipment. The rectifying device comprises a gas conveying pipe, a first gas flow channel and a second gas flow channel, a plurality of second airflow channels are constructed in the flow equalizing plate assembly, and a plurality of first air outlet holes are formed in the second airflow channels; the flow guide part is constructed to gradually reduce the flow area of the first airflow channel in the extending direction of the first airflow channel, so that the air pressure of the first airflow channel in the extending direction of the first airflow channel is kept consistent. The invention provides a rectifying device, a substrate transmission unit and a gluing and developing device, airflow is rectified through the rectifying device, so that uniform airflow is generated in the substrate transmission unit, and particle impurities are discharged out of the substrate transmission unit along with the airflow.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing equipment, and further to a rectifying device, a substrate transmission unit and a glue coating and developing device. Background Art

[0002] The photolithography process mainly includes a coating process, an exposure process, a development process, and a baking process between the above processes.

[0003] exist Figure 1 The illustrated coating and developing device 10 includes a device front-end module 11, a process station 12, and an interface station 13 connected in sequence. The process station 12 includes a thermal treatment unit 100, a coating unit 200, a developing unit 300, and a substrate transfer unit 400. The coating unit 200 is used to coat the substrate; the developing unit 300 is used to develop the substrate; and a manipulator 410 is configured in the substrate transfer unit 400, which moves and picks up the substrate, and is used to transfer the substrate between the thermal treatment unit 100 and the coating unit 200, and between the thermal treatment unit 100 and the developing unit 300.

[0004] However, during the transportation of the substrate in the substrate transfer unit 400 , mechanical movement of components such as the robot 410 may generate particulate impurities, which may contaminate the substrate and reduce the substrate yield. Summary of the invention

[0005] In view of the above technical problems, the present invention provides a rectifying device, a substrate transfer unit and a coating and developing device, wherein the rectifying device rectifies the airflow to generate a uniform airflow in the substrate transfer unit, so that particulate impurities are discharged from the substrate transfer unit along with the airflow.

[0006] In some embodiments, a rectifying device is provided, which is connected to an air source and is used to provide an air flow into a cavity and discharge particulate impurities in the cavity through the air flow, including: an air supply pipe, a first air flow channel is constructed inside the air supply pipe, the first air flow channel includes an inlet end, a sealing end and a strip interface located on the side wall of the first air flow channel, the length direction of the strip interface is consistent with the extension direction of the first air flow channel, and the inlet end, the first air flow channel and the strip interface are conductively connected; a flow equalizing plate assembly, which is internally constructed with a plurality of second air flow channels, the plurality of second air flow channels are conductively connected to the first air flow channel via the strip interface, and are arranged in sequence along the length direction of the strip interface, each of the second air flow channels is sequentially opened with a plurality of first air outlets along its extension direction for providing air flow into the cavity; a flow guide, which is located inside the first air flow channel, and the flow guide is constructed to gradually reduce the flow area of ​​the first air flow channel along the extension direction of the first air flow channel so that the air pressure of the first air flow channel along its extension direction remains consistent.

[0007] In some embodiments, a substrate transfer unit is provided, comprising: a cavity, wherein the side wall of the cavity is configured with a plurality of substrate transfer ports and air outlets; a robot arm, located in the cavity, configured to transfer the substrate through the substrate transfer ports; a rectifying device, wherein the rectifying device is configured at the top of the cavity; and an air source, connected to the rectifying device, configured to provide airflow to the rectifying device.

[0008] In some embodiments, a coating and developing device is provided, comprising a device front-end module, a process station and an interface station connected in sequence, wherein the process station comprises: a coating unit for coating a substrate; a developing unit for developing the substrate; a heat treatment unit for heat treating the substrate; and the above-mentioned substrate transfer unit for transferring the substrate between the coating unit and the heat treatment unit and between the developing unit and the heat treatment unit.

[0009] Compared with the prior art, the present invention has the following beneficial effects: by installing a guide member in the first air flow channel in the air supply pipe of the rectifier, the volume of the first air flow channel along its extension direction is gradually reduced, so that the air pressure of the first air flow channel along its extension direction is kept consistent, thereby avoiding the situation where the air pressure is high at a position close to the inlet end inside the first air flow channel and low at a position far from the inlet end, and thus making the flow velocity of the air flow transported by the first air flow channel consistent when entering each second air flow channel, so that each first air outlet can provide a uniform airflow into the cavity of the substrate transfer unit, so that particulate impurities are discharged from the substrate transfer unit along with the airflow, avoiding local vortexes caused by uneven airflow inside the cavity causing particulate impurities to remain inside the cavity, thereby reducing the risk of substrate contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0011] Figure 1 It is a schematic plan view of a glue coating and developing device according to an embodiment of the present application;

[0012] Figure 2 is a schematic diagram of a rectifier device according to an embodiment of the present application;

[0013] Figure 3 yes Figure 2 The main view of

[0014] Figure 4 yes Figure 2 Exploded diagram of

[0015] Figure 5 yes Figure 3 A cross-sectional view along section S1;

[0016] Figure 6 yes Figure 5 A partial enlarged view of area a;

[0017] Figure 7 yes Figure 2 A cross-sectional view along section S2;

[0018] Figure 8 is a schematic diagram of a substrate transfer unit according to an embodiment of the present application;

[0019] Fig. 9 yes Figure 8 Exploded diagram of

[0020] Fig.10 yes Figure 1 A cross-sectional view of one implementation of the illustrated embodiment is taken along section CC. DETAILED DESCRIPTION

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0022] In order to simplify the drawings, only the parts related to the invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0023] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0025] like Figure 2 As shown, a rectifying device 500 according to an embodiment of the present invention is disclosed. Figure 2 and Figure 8 As shown, the rectifying device 500 can be connected to the gas source 430 to provide airflow into the cavity 420 and discharge particulate impurities in the cavity 420 through the airflow.

[0026] Specifically, Figure 3 , Figure 4 and Figure 5As shown, the rectifying device 500 includes: a gas delivery pipe 510, a flow equalizing plate assembly 520 and a flow guide 530. Among them, a first airflow channel 511 is constructed inside the gas delivery pipe 510, and the first airflow channel 511 includes an inlet end 5111, a sealing end 5112 and a strip interface 5113 located on the side wall of the first airflow channel 511. The length direction of the strip interface 5113 is consistent with the extension direction of the first airflow channel 511, and the inlet end 5111, the first airflow channel 511 and the strip interface 5113 are connected. A plurality of second airflow channels 521 are constructed inside the flow equalizing plate assembly 520, and the second airflow channels 521 are connected to the first gas flow channel 511 through the strip interface 5113, and are arranged in sequence along the length direction of the strip interface 5113. The second airflow channel 521 is sequentially provided with a plurality of first air outlet holes 5221 along its extension direction, which are used to provide airflow into the cavity 420. In this example, the extension direction of the first gas channel 511 is perpendicular to the extension direction of the second gas channel 521. In the present application, the extension direction of the first gas channel 511 refers to the direction from the inlet end 5111 to the sealing end 5112, and the extension direction of the second gas channel 521 refers to the flow direction of the internal gas flow, that is, the direction in which the second gas channel 521 is away from the first gas channel 511.

[0027] In addition, if Figure 7 As shown, the guide member 530 is located inside the air delivery pipe 510, and the guide member 530 is constructed to gradually reduce the flow area of ​​the first air flow channel 511 along the extension direction of the first air flow channel 511, so that the air pressure of the first air flow channel 511 remains consistent along its extension direction.

[0028] In actual application, the airflow enters the first airflow channel 511 through the inlet end 5111, and is sequentially transported from the first airflow channel 511 to each second airflow channel 521, and then transported to the cavity 420 by the first air outlet 5221 located in the second airflow channel 521. In the case where the guide member 530 is not provided, the airflow in the first airflow channel 511 is gradually diverted to each second airflow channel 521 during the process of flowing from the inlet end 5111 to the sealing end 5112, which will cause the air pressure of the first airflow channel 511 to gradually decrease along its extension direction, thereby causing the airflow velocity transported from the first airflow channel 511 to different second airflow channels 521 to be inconsistent, the airflow velocity of the second airflow channel 521 close to the inlet end 5111 is high, and the airflow velocity of the second airflow channel 521 far from the inlet end 5111 is low, thereby causing the airflow velocity of the gas entering the cavity 420 from each first air outlet 5221 to be uneven. In the present embodiment, a flow guide 530 is provided in the first air flow channel 511 to gradually reduce the flow area in the first air flow channel 511. As the flow area is reduced, the air pressure increases, thereby offsetting the reduction in the air pressure of the airflow provided by the first air flow channel 511 to each second air flow channel 521, so that the air pressure of the first air flow channel 511 is consistent along its extension direction, and further, the flow rate of the airflow transported from the first air flow channel 511 to different second air flow channels 521 is consistent, and the flow rate of each first air outlet 5221 entering the cavity 420 is uniform.

[0029] Specifically, the guide member 530 is a plate-like structure, which is constructed at the top of the first airflow channel 511 and is gradually inclined toward the bottom of the first airflow channel 511 along the extension direction of the first airflow channel 511, so that the flow area in the first airflow channel 511 gradually decreases.

[0030] Preferably, if Figure 5 and Figure 6 As shown, the second air flow channel 521 includes an extension section 5211 and a flow balancing section 5212 in sequence along its extension direction. The extension section 5211 extends into the first air flow channel 511 through the strip interface 5113, the flow balancing section 5212 is located outside the first air flow channel 511, and the length m of the extension section 5211 corresponding to each second air flow channel 521 gradually increases along the extension direction of the first air flow channel 511.

[0031] In the above embodiment, the position of the entrance 5213 of the second airflow channel 521 in the first airflow channel 511 is changed by adjusting the length m of the extension section 5211 corresponding to different second airflow channels 521. In addition, the length m of the extension section 5211 corresponding to each second airflow channel 521 is set to gradually increase along the extension direction of the first airflow channel 511, so that the entrance 5213 of each second airflow channel 521 gradually extends into the first airflow channel 511, which is conducive to more uniform airflow entering each second airflow channel 521.

[0032] Preferably, refer again to Figure 6 and Figure 7 The rectifying device 500 also includes a buffer member 540, which is located in the first air flow channel 511, and the buffer member 540 is arranged on a side of the extension section 5211 corresponding to the second air flow channel 5214 closest to the inlet end 5111, close to the inlet end 5111, for guiding the air flow into the second air flow channel 5214 close to the inlet end 5111.

[0033] In the above embodiment, a buffer 540 is provided in the first airflow channel 511 to guide the airflow into the second airflow channel 5214 near the inlet end 5111. In the case where the buffer 540 is not provided, during the airflow flowing along the first airflow channel 511, the airflow will generate vortices in the second airflow channel 5214 near the inlet end 5111, so that the airflow cannot enter the second airflow channel 5214 near the inlet end 5111. In this embodiment, the buffer 540 is provided on the side of the extension section 5211 near the inlet end 5111, and the extension section 5211 belongs to the second airflow channel 5214 closest to the inlet end 5111, so as to change the original flow trend of the airflow, so that the airflow can enter the second airflow channel 5214 near the inlet end 5111, thereby making the airflow transported by the first airflow channel 511 have the same flow rate when entering each second airflow channel 521. It should be noted that the second airflow channel 5214 near the inlet end 5111 includes but is not limited to a second airflow channel 5214 closest to the inlet end 5111.

[0034] Preferably, the aperture of each first air outlet hole 5221 gradually increases along the extension direction of the second air flow channel 521. The interval between adjacent first air outlet holes 5221 on the same second air flow channel 521 gradually decreases along the extension direction of the second air flow channel 521. In this embodiment, by adjusting the aperture of the first air outlet hole 5221 and the interval between adjacent first air outlet holes 5221 on the same second air flow channel 521, the air pressure difference of the airflow provided by the second air flow channel 521 to each first air outlet hole 5221 along its extension direction is balanced, so that the air pressure of the second air flow channel 521 along its extension direction is consistent, and then the airflow velocity of the second air flow channel 521 entering different first air outlet holes 5221 is consistent.

[0035] Preferably, refer again to Figure 5 , the equalizing plate assembly 520 includes a flow dividing area A1 and a mixing area A2 in sequence, the flow dividing area A1 is located on the side of the equalizing plate assembly 520 close to the gas pipe 510, and the mixing area A2 is located on the side of the flow dividing area A1 away from the gas pipe 510. Among them, the second air flow channel 521 is constructed in the flow dividing area A1, which is used to connect the first air flow channel 511 and the mixing area A2, and the mixing area A2 is provided with a plurality of second air outlets 5222, which are used to provide air flow into the cavity 420. In actual application, when the air flow flows along the first air flow channel 511, the air flow is first divided into each second air flow channel 521 in the flow dividing area A1, and then transported to the mixing area A2 by each second air flow channel 521 for mixing, and when the air flow flows in the flow dividing area A1, it is discharged into the cavity 420 from the first air outlet 5221, and when the air flow is mixed in the mixing area A2, it is discharged into the cavity 420 from the second air outlet 5222. This embodiment is conducive to the consistency of the flow rate of the airflow entering the first air outlet holes 5221 and the second air outlet holes 5222.

[0036] Preferably, combined Figure 4 and Figure 5 As shown, the flow equalizing plate assembly 520 includes a bottom plate 522, a cover 523 and a plurality of diverter plates 524. The bottom plate 522 is used to set a first air outlet 5221 and a second air outlet 5222. The cover 523 is fixed above the bottom plate 522 to form a cavity between the bottom plate 522 and the bottom plate 522, and the cavity includes a diverter area A1 and a mixing area A2 in sequence. A plurality of diverter plates 524 are fixed in parallel in the cavity in sequence, and the diverter plates 524 are located in the diverter area A1 to separate the diverter area A1 into a plurality of second air flow channels 521. Again referring to Figure 4, the cover body 523 can be formed by welding the cover plate 5231 and the frame 5232, and the buffer member 540 can be configured as a block structure fixed to the side of the splitter plate 524 closest to the inlet end 5111 along the length direction of the splitter plate 524. In addition, in other embodiments of the flow equalizing plate assembly 520, the flow equalizing plate assembly 520 can be composed of a plurality of pipes, each of which is arranged in parallel in sequence, and the interior of the pipe is configured as a second air flow channel, and a plurality of first air outlet holes communicating with the second air flow channel are opened at the bottom of the pipe.

[0037] like Figure 8 and Fig. 9 As shown, a substrate transfer unit 400 according to an embodiment of the present invention is disclosed. The substrate transfer unit 400 includes a chamber 420, a robot 410, a gas source 430, and a rectifying device 500 disclosed in any of the above embodiments.

[0038] Specifically, the side wall of the cavity 420 is configured with a plurality of substrate delivery ports 421 and air outlets 422. The robot 410 is located in the cavity 420 and is used to transfer the substrate through the substrate delivery ports 421. The rectifying device 500 is configured at the top of the cavity 420. The gas source 430 is connected to the rectifying device 500 and is used to provide airflow into the cavity 420 so that the particulate impurities are discharged from the cavity 420 through the air outlets 422 along with the airflow. Figure 1 In actual applications, a substrate conveying port 421 is respectively constructed on a side of the cavity 420 close to the coating unit 200 or the developing unit 300 , and a side of the cavity 420 close to the thermal treatment unit 100 , so that the robot 410 can transfer the substrate between the coating unit 200 and the thermal treatment unit 100 , or between the developing unit 300 and the thermal treatment unit 100 , through the substrate conveying port 421 .

[0039] Preferably, the substrate transfer unit 400 further includes a connecting pipe 440. The substrate transfer unit 400 is configured with a plurality of cavities 420, a plurality of rectifying devices 500, and a plurality of gas sources 430, wherein the plurality of cavities 420 correspond to the plurality of rectifying devices 500 one by one, the plurality of cavities 420 are stacked into at least two columns, each column of cavities 420 corresponds to a gas source 430, and the gas source 430 provides gas flow to each rectifying device 500 in the column through the connecting pipe 440.

[0040] The above-mentioned substrate transfer unit 400 connects the gas source 430 to the rectifying device 500 to provide an airflow with a uniform flow rate to the cavity 420, enabling the particulate impurities generated by the manipulator 410 in the cavity 420 to be discharged from the cavity 420 through the air outlet 422 along with the airflow, avoiding local eddy currents caused by uneven internal airflow in the cavity 420, resulting in residual particulate impurities inside the cavity 420 and posing a risk of substrate contamination. In addition, multiple cavities 420 are stacked, and a gas source 430 is correspondingly provided for each column of cavities 420. The gas source 430 is connected to each rectifying device 500 in this column through a connecting pipe 440, thereby reducing the number of gas sources 430 and the occupied space.

[0041] As Figure 1 and Fig.10 shown, a coating and developing apparatus 10 according to an embodiment of the present invention is disclosed. The coating and developing apparatus 10 includes a front-end module 11, a process station 12, and an interface station 13 that are connected in sequence.

[0042] Specifically, the process station 12 includes a coating unit 200, a developing unit 300, a heat treatment unit 100, and the substrate transfer unit 400 disclosed in any of the above embodiments. The coating unit 200 is used to perform a coating process on the substrate, the developing unit 300 is used to perform a developing process on the substrate, the heat treatment unit 100 is used to perform a heat treatment on the substrate, and the substrate transfer unit 400 is used to transfer the substrate between the coating unit 200 and the heat treatment unit 100, and between the developing unit 300 and the heat treatment unit 100.

[0043] The above-mentioned coating and developing apparatus 10 assembles the substrate transfer unit 400 to transfer the substrate between the coating unit 200 and the heat treatment unit 100, and between the developing unit 300 and the heat treatment unit 100. The substrate transfer unit 400 can provide an airflow with a uniform flow rate to each internal cavity 420, enabling the particulate impurities generated by the manipulator 410 in the cavity 420 to be discharged from the cavity 420 through the air outlet 422 along with the airflow, avoiding local eddy currents caused by uneven internal airflow in the cavity 420, resulting in residual particulate impurities inside the cavity 420 and posing a risk of substrate contamination, thereby improving the yield of the substrate in the coating and developing process.

[0044] It should be noted that the above embodiments can be freely combined as needed. The above are only the preferred embodiments of the present invention. For those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A rectifying device, connected to an air source, for providing an air flow into a cavity, and for discharging particulate impurities in the cavity through the air flow, It is characterized in that include: An air delivery pipe, wherein a first air flow channel is configured inside the air delivery pipe, wherein the first air flow channel comprises an inlet end, a sealing end, and a strip interface located on a side wall of the first air flow channel, wherein the length direction of the strip interface is consistent with the extension direction of the first air flow channel, and the inlet end, the first air flow channel, and the strip interface are in conduction; A flow equalizing plate assembly, wherein a plurality of second air flow channels are internally constructed, wherein the plurality of second air flow channels are conductively connected to the first air flow channel via the strip interface and are sequentially arranged along the length direction of the strip interface, and each of the second air flow channels is sequentially provided with a plurality of first air outlet holes along its extension direction for providing air flow into the cavity; The guide member is located inside the first airflow channel, and is configured to gradually reduce the flow area of ​​the first airflow channel along the extension direction of the first airflow channel, so that the air pressure of the first airflow channel remains consistent along the extension direction thereof.

2. The rectifying device according to claim 1, It is characterized in that The guide member is a plate-shaped structure, which is constructed at the top of the first airflow channel and is gradually inclined toward the bottom of the first airflow channel along the extension direction of the first airflow channel.

3. The rectifying device according to claim 1, It is characterized in that The second airflow channel includes an extension section and a flow balancing section in sequence along its extension direction, the extension section extends into the first airflow channel through the strip interface, the flow balancing section is located outside the first airflow channel, and the length of the extension section of each second airflow channel gradually increases along the extension direction of the first airflow channel.

4. The rectifying device according to claim 3, It is characterized in that include: The buffer is located in the first airflow channel and is arranged on a side of the extension section corresponding to the second airflow channel closest to the inlet end and close to the inlet end, and is used to guide the airflow into the second airflow channel close to the inlet end.

5. The rectifying device according to claim 1, It is characterized in that The aperture of each first air outlet hole gradually increases along the extension direction of the second air flow channel, and / or the interval between adjacent first air outlet holes located on the same second air flow channel gradually decreases along the extension direction of the second air flow channel.

6. The rectifying device according to claim 1, It is characterized in that The flow balancing plate assembly includes a flow dividing area and a mixing area in sequence, wherein the flow dividing area is located on a side of the flow balancing plate assembly close to the gas pipeline, and the mixing area is located on a side of the flow dividing area away from the gas pipeline; wherein, The second air flow channel is constructed in the diversion area and is used to connect the first air flow channel and the mixing area. The mixing area is provided with a plurality of second air outlet holes for providing air flow into the cavity.

7. The rectifying device according to claim 6, It is characterized in that The current balancing plate assembly comprises: A bottom plate, used for setting the first air outlet and the second air outlet; A cover body, fixed above the bottom plate, and used to form a cavity between the cover body and the bottom plate, wherein the cavity includes the diversion area and the mixing area in sequence; A plurality of flow dividers are fixed in the cavity in parallel in sequence, and the flow dividers are located in the flow divider area and are used to divide the flow divider area into a plurality of the second air flow channels.

8. A substrate transfer unit, It is characterized in that include: A cavity, wherein the side wall of the cavity is configured with a plurality of substrate conveying ports and air outlets; A robot arm, located in the chamber, and used for transferring the substrate through the substrate transfer port; The rectifying device according to any one of claims 1 to 7, wherein the rectifying device is constructed at the top of the cavity; An air source is connected to the rectifying device and is used to provide air flow to the rectifying device.

9. The substrate transfer unit according to claim 8, It is characterized in that include: A plurality of connecting pipes, the substrate transmission unit is configured with a plurality of the cavities, a plurality of the rectifying devices and a plurality of the gas sources, the plurality of the cavities correspond one to one with the plurality of the rectifying devices, the plurality of the cavities are stacked into at least two columns, each column of the cavities corresponds to one gas source, and the gas source provides airflow to each of the rectifying devices in the column through the connecting pipes.

10. A coating and developing device, comprising a device front-end module, a process station and an interface station connected in sequence, It is characterized in that The process station comprises: A coating unit, used for coating the substrate; A developing unit, used for developing the substrate; A heat treatment unit, used for heat treating the substrate; And the substrate transfer unit according to claim 8 or 9, used to transfer the substrate between the coating unit and the thermal treatment unit, and between the developing unit and the thermal treatment unit.

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