Data monitoring system and monitoring method for automatic firework and cracker production line
By designing a fireworks and firecrackers automated production line data monitoring system that includes electrostatic discharge, mechanical monitoring, temperature and humidity sensing and gateway modules, the problem of insufficient reliability and safety of the existing system is solved, and more efficient and safe data monitoring is achieved.
Patent Information
- Application Number
- CN202510176048.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-18
- Publication Date
- 2025-05-23
AI Technical Summary
The data monitoring system of the existing fireworks and firecrackers automated production lines has problems of low reliability and poor safety, especially the failure to effectively consider the impact of static electricity on data monitoring in personnel during the production process.
A data monitoring system including an intrinsically safe power module, an electrostatic release module, a mechanical monitoring module, a temperature and humidity sensor module, a gateway module and an isolation barrier module are designed. The system monitors and releases static electricity from staff through the electrostatic release module. The mechanical monitoring module and the temperature and humidity sensor module monitor the cable temperature and current data, as well as temperature and humidity data in the production line in real time, and performs data processing and output through the gateway module and the isolation barrier module.
The reliability and safety of the data monitoring system of the fireworks and firecrackers automated production line is improved, the accuracy and real-time nature of data monitoring is ensured, and the potential safety risks caused by static electricity are reduced.
Smart Images

Figure CN120029149A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of fireworks and firecrackers automated production line monitoring, and in particular relates to a data monitoring system and a monitoring method for fireworks and firecrackers automated production line. Background Art
[0002] With the development of economy and technology, people pay more and more attention to the safety of industrial production process. Therefore, ensuring the safety of industrial production process is of great significance to industrial production enterprises.
[0003] At present, the automated production line of fireworks and firecrackers has become more and more popular, which has greatly improved the production efficiency of fireworks and firecrackers. However, the data monitoring of the current automated production line of fireworks and firecrackers is still relatively backward. For example, the patent applications with application numbers 201711302291.X and 200710100213.1, although they disclose data monitoring solutions for the automated production line of fireworks and firecrackers, the solutions are relatively general; moreover, the two solutions do not take into account the impact of static electricity on personnel during the production process. This makes such solutions not very reliable and less safe in actual operation. Summary of the invention
[0004] One of the purposes of the present invention is to provide a data monitoring system for an automated fireworks and firecracker production line with high reliability and good safety.
[0005] A second object of the present invention is to provide a monitoring method based on the data monitoring system of the fireworks and firecrackers automated production line.
[0006] The data monitoring system of the fireworks and firecrackers automated production line provided by the present invention comprises an intrinsically safe power supply module, an electrostatic discharge module, a mechanical monitoring module, a temperature and humidity sensor module, a gateway module and an isolation fence module; the intrinsically safe power supply module is connected to an external power supply; the output ends of the electrostatic discharge module, the mechanical monitoring module and the temperature and humidity sensor module are all connected to the input end of the gateway module, and the output end of the gateway module is connected to the input end of the isolation fence module; the intrinsically safe power supply module is used to convert the external input power into a power supply signal, and to supply power to the electrostatic discharge module, the mechanical monitoring module, the temperature and humidity sensor module, the gateway module and the isolation fence module; the electrostatic discharge module is used for the electrostatic discharge of the staff, and monitors The number of electrostatic releases is collected and uploaded to the gateway module; the mechanical monitoring module is used to monitor the cable temperature and current data of the fireworks and firecrackers automated production line, and upload the monitoring data to the gateway module; the temperature and humidity sensor module is used to monitor the temperature and humidity data of the fireworks and firecrackers automated production line, and upload the monitoring data to the gateway module; the gateway module is used to receive the signals uploaded by the electrostatic release module, the mechanical monitoring module and the temperature and humidity sensor module, and after logical judgment, the prompt or warning sound is played through the audio output sub-module, and the received signal is forwarded to the isolation fence module; the isolation fence module is used to send the signal uploaded by the gateway module to the outside after isolation, so as to complete the data monitoring of the fireworks and firecrackers automated production line.
[0007] The intrinsically safe power supply module includes a 12V output submodule, an output voltage sampling submodule, an output current sampling submodule, an overvoltage and overcurrent protection submodule, and an output control submodule;
[0008] The 12V output submodule is used to convert external input electrical energy into a 12V power supply, and supply power to the outside through the output control submodule; the output voltage sampling submodule is used to sample the voltage of the output 12V power supply, and upload the sampling signal to the overvoltage and overcurrent protection submodule; the output current sampling submodule is used to sample the current of the output 12V power supply, and upload the sampling signal to the overvoltage and overcurrent protection submodule; the overvoltage and overcurrent protection submodule is used to perform overvoltage and overcurrent protection of the 12V power supply according to the received sampling signal, and upload the protection signal to the output control submodule; the output control submodule is used to control the output of the 12V power supply;
[0009] The 12V output submodule is a circuit composed of a power chip model VPC2187; the output voltage sampling submodule is a circuit composed of a resistor voltage divider circuit; the output current sampling submodule is a sampling circuit composed of an operational amplifier and a resistor; the overvoltage and overcurrent protection submodule is a circuit composed of a comparator chip model TLV3202 and a timer chip model CD4538; the output control submodule is a switching circuit composed of a transistor.
[0010] The electrostatic discharge module includes an electrostatic discharge power submodule, an electrostatic discharge control submodule, an electrostatic discharge communication submodule and an electrostatic discharge inductor submodule;
[0011] The electrostatic discharge power supply submodule is used to supply power to the electrostatic discharge module; the electrostatic discharge inductor submodule is used for the electrostatic discharge of the staff, and monitors the number of discharges and uploads the electrostatic discharge control submodule; the electrostatic release control submodule is used to receive the uploaded number of electrostatic discharges, and upload the data to the gateway module through the electrostatic release communication submodule; the electrostatic release communication submodule is used for the communication between the electrostatic release control submodule and the gateway module;
[0012] The electrostatic release power supply submodule is a circuit composed of a power supply chip of model FR9889; the electrostatic release control submodule is a circuit composed of a control chip of model STM32G030C8T6; the electrostatic release communication submodule is a communication circuit composed of a communication chip of model BL3085B; the electrostatic release inductor submodule is a circuit composed of a chip of model ICM7555MM / TR.
[0013] The mechanical monitoring module includes a mechanical monitoring power supply submodule, a mechanical monitoring current sampling submodule, a mechanical monitoring cable temperature sampling submodule, a mechanical monitoring control submodule and a mechanical monitoring communication submodule;
[0014] The mechanical monitoring power supply submodule is used to supply power to the mechanical monitoring module; the mechanical monitoring current sampling submodule is used to monitor the current signal of the fireworks and firecrackers automated production line, and upload the monitoring signal to the mechanical monitoring control submodule; the mechanical monitoring cable temperature sampling submodule is used to monitor the cable temperature signal of the fireworks and firecrackers automated production line, and upload the monitoring signal to the mechanical monitoring control submodule; the mechanical monitoring control submodule is used to receive the uploaded monitoring signal, and upload the signal to the gateway module through the mechanical monitoring communication submodule; the mechanical monitoring communication submodule is used for communication between the mechanical monitoring control submodule and the gateway module;
[0015] The mechanical monitoring power supply submodule is a circuit composed of a power supply chip of model FR9889; the mechanical monitoring current sampling submodule is a circuit composed of a metering chip of model RN8032; the mechanical monitoring cable temperature sampling submodule is a circuit composed of a temperature sensor of model DS18B20; the mechanical monitoring control submodule is a circuit composed of a control chip of model STM32G030C8T6; the mechanical monitoring communication submodule is a communication circuit composed of a communication chip of model BL3085B.
[0016] The temperature and humidity sensor module includes a temperature and humidity power supply submodule, a temperature and humidity sensing submodule, a temperature and humidity control submodule, a temperature and humidity display submodule and a temperature and humidity communication submodule;
[0017] The temperature and humidity power supply submodule is used to power the temperature and humidity sensor module; the temperature and humidity sensor submodule is used to monitor the temperature and humidity data of the fireworks and firecrackers automated production line, and upload the monitoring signal to the temperature and humidity control submodule; the temperature and humidity control submodule is used to receive the uploaded monitoring signal, and display the temperature and humidity data through the temperature and humidity display submodule, and upload the temperature and humidity data to the gateway module through the temperature and humidity communication submodule; the temperature and humidity display submodule is used to display the temperature and humidity data; the temperature and humidity communication submodule is used for communication between the temperature and humidity control submodule and the gateway module;
[0018] The temperature and humidity power supply submodule is a circuit composed of a power supply chip of model FR9889; the temperature and humidity sensing submodule is a circuit composed of a temperature and humidity sensor of model HDC1080; the temperature and humidity control submodule is a circuit composed of a control chip of model STM32G030C8T6; the temperature and humidity display submodule is a circuit composed of an LCD driver chip of model HT1621B and a display screen of model QYT12429; the temperature and humidity communication submodule is a communication circuit composed of a communication chip of model BL3085B.
[0019] The gateway module includes a gateway power submodule, a gateway overvoltage protection submodule, a gateway communication submodule, a gateway audio interface submodule, a gateway audio output submodule, a gateway infrared receiver submodule, a gateway display submodule, a gateway storage submodule, a gateway control submodule and a gateway network submodule;
[0020] The gateway power submodule is used to supply power to the gateway module; the gateway overvoltage protection submodule is used to perform overvoltage protection on the power signal output by the gateway power submodule; the gateway communication submodule is used to receive signals uploaded by the electrostatic discharge module, the mechanical monitoring module and the temperature and humidity sensor module, and forward the signals to the gateway control submodule and the gateway network submodule; the gateway audio interface submodule is used for data transmission between the gateway audio output submodule and the isolation fence module; the gateway audio output submodule is used to receive audio signals and upload the audio signals to the isolation fence module through the gateway audio interface submodule; the gateway infrared receiving head submodule is used to receive infrared signals sent from the outside and upload the signals to the gateway control submodule; the gateway display submodule is used to receive data sent by the gateway control submodule and display the data; the gateway storage submodule is used to store the data of the gateway module; the gateway control submodule is used to control the operation of the gateway module; the gateway network submodule is used to receive data sent by the gateway control submodule and receive signals uploaded by the electrostatic discharge module, the mechanical monitoring module and the temperature and humidity sensor module, and forward the data to the isolation fence module;
[0021] The gateway power submodule is a circuit composed of a power chip of model FR9609; the gateway overvoltage protection submodule is a circuit composed of a TVS tube; the gateway communication submodule is a communication circuit composed of a communication chip of model BL3085B; the gateway audio output submodule is a circuit composed of an audio decoder chip of model WM8978; the gateway infrared receiver submodule is a circuit composed of an infrared receiver of model IRM-H638T; the gateway display submodule is a circuit composed of a display screen of model ILI9488; the gateway storage submodule is a circuit composed of a storage chip of model FM25V02 and a storage chip of model W25Q128FVSIG; the gateway control submodule is a circuit composed of a control chip of model STM32F407ZGT6; the gateway network submodule is a circuit composed of an Ethernet chip of model W5500 and a network transformer chip of model HR601680.
[0022] The isolation fence module includes an isolation audio submodule and an isolation network submodule;
[0023] The isolated audio submodule is used to send the received audio data to the outside after isolation; the isolated network submodule is used to send the received network data to the outside after isolation;
[0024] The isolated audio submodule is a circuit composed of an audio transformer; the isolated network submodule is a circuit composed of a network transformer chip with model number HR601680.
[0025] The present invention also provides a monitoring method based on the data monitoring system of the fireworks and firecrackers automated production line, comprising the following steps:
[0026] S1. Release static electricity from the staff and monitor the static electricity release information;
[0027] S2. Monitor the cable temperature and current data of the fireworks and firecrackers automation production line;
[0028] S3. Monitor the temperature and humidity data of the fireworks and firecrackers automated production line;
[0029] S4. Collect and send the monitoring data information of steps S1 to S3 to complete the data monitoring of the fireworks and firecrackers automated production line.
[0030] The data monitoring system and method for the automated production line of fireworks and firecrackers provided by the present invention monitor the temperature, humidity and current data of the automated production line of fireworks and firecrackers, and simultaneously release and monitor the static electricity of the workers of the automated production line of fireworks and firecrackers, thereby not only realizing the data monitoring of the automated production line of fireworks and firecrackers, but also having higher reliability and better safety. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Figure 1 Schematic diagram of the functional modules of the system of the present invention.
[0032] Figure 2 The figure is a schematic diagram of the circuit principle of the 12V output submodule in the system of the present invention.
[0033] Figure 3 The figure is a schematic diagram of the circuit principle of one circuit in the output voltage sampling submodule in the system of the present invention.
[0034] Figure 4 The figure is a schematic diagram of the circuit principle of one circuit in the output current sampling submodule in the system of the present invention.
[0035] Figure 5 The figure is a schematic diagram of the circuit principle of one circuit in the overvoltage and overcurrent protection submodule in the system of the present invention.
[0036] Figure 6 The figure is a schematic diagram of the circuit principle of the output control submodule in the system of the present invention.
[0037] Figure 7 The figure is a schematic diagram of the circuit principle of the electrostatic discharge power submodule in the system of the present invention.
[0038] Figure 8 The figure is a schematic diagram of the circuit principle of the electrostatic release control submodule in the system of the present invention.
[0039] Fig. 9 The figure is a schematic diagram of the circuit principle of the electrostatic discharge communication submodule in the system of the present invention.
[0040] Fig.10 The figure is a schematic diagram of the circuit principle of the electrostatic release inductor module in the system of the present invention.
[0041] Fig.11 The figure is a schematic diagram of the circuit principle of the mechanical monitoring power supply submodule in the system of the present invention.
[0042] Fig.12 The schematic diagram of the circuit principle of the mechanical monitoring current sampling submodule in the system of the present invention.
[0043] Fig.13 The schematic diagram of the circuit principle of the mechanical monitoring cable temperature sampling submodule in the system of the present invention.
[0044] Fig.14 The figure is a schematic diagram of the circuit principle of the mechanical monitoring and control submodule in the system of the present invention.
[0045] Fig.15 The figure is a schematic diagram of the circuit principle of the mechanical monitoring communication submodule in the system of the present invention.
[0046] Fig.16It is a schematic diagram of the circuit principle of the temperature and humidity power supply submodule in the system of the present invention.
[0047] Fig.17 The figure is a schematic diagram of the circuit principle of the temperature and humidity sensor submodule in the system of the present invention.
[0048] Fig.18 The figure is a schematic diagram of the circuit principle of the temperature and humidity control submodule in the system of the present invention.
[0049] Fig.19 The figure is a schematic diagram of the circuit principle of the temperature and humidity display submodule in the system of the present invention.
[0050] Fig. 20 The figure is a schematic diagram of the circuit principle of the temperature and humidity communication submodule in the system of the present invention.
[0051] Fig.21 The schematic diagram of the circuit principle of the gateway power submodule in the system of the present invention.
[0052] Fig. 22 The schematic diagram of the circuit principle of the gateway overvoltage protection submodule in the system of the present invention.
[0053] Fig.23 The schematic diagram of the circuit principle of the gateway communication submodule in the system of the present invention.
[0054] Fig.24 The diagram is a schematic diagram of the circuit principle of the gateway audio interface submodule in the system of the present invention.
[0055] Fig.25 The diagram is a schematic diagram of the circuit principle of the gateway audio output submodule in the system of the present invention.
[0056] Fig.26 The schematic diagram of the circuit principle of the gateway infrared receiving head submodule in the system of the present invention.
[0057] Fig. 27 The schematic diagram of the circuit principle of the gateway display submodule in the system of the present invention.
[0058] Fig.28 The schematic diagram of the circuit principle of the gateway storage submodule in the system of the present invention is shown in FIG.
[0059] Fig.29 The schematic diagram of the circuit principle of the gateway control submodule in the system of the present invention.
[0060] Fig.30 The schematic diagram of the circuit principle of the gateway network submodule in the system of the present invention.
[0061] Fig.31 The figure is a schematic diagram of the circuit principle of the isolated audio submodule in the system of the present invention.
[0062] Fig.32 The figure is a schematic diagram of the circuit principle of the isolation network submodule in the system of the present invention.
[0063] Fig.33 The figure is a schematic diagram of the method flow of the present invention. DETAILED DESCRIPTION
[0064] like Figure 1 The figure shows a schematic diagram of the functional modules of the system of the present invention: the data monitoring system of the fireworks and firecrackers automated production line disclosed in the present invention comprises an intrinsically safe power supply module, an electrostatic discharge module, a mechanical monitoring module, a temperature and humidity sensor module, a gateway module and an isolation barrier module; the intrinsically safe power supply module is connected to an external power supply; the output ends of the electrostatic discharge module, the mechanical monitoring module and the temperature and humidity sensor module are all connected to the input end of the gateway module, and the output end of the gateway module is connected to the input end of the isolation barrier module; the intrinsically safe power supply module is used to convert the external input power into a power supply signal, and to supply power to the electrostatic discharge module, the mechanical monitoring module, the temperature and humidity sensor module, the gateway module and the isolation barrier module ; The electrostatic release module is used for the staff's electrostatic release, and monitors the number of electrostatic releases and uploads them to the gateway module; the mechanical monitoring module is used to monitor the cable temperature and current data of the fireworks and firecrackers automated production line, and upload the monitoring data to the gateway module; the temperature and humidity sensor module is used to monitor the temperature and humidity data of the fireworks and firecrackers automated production line, and upload the monitoring data to the gateway module; the gateway module is used to receive the signals uploaded by the electrostatic release module, the mechanical monitoring module and the temperature and humidity sensor module, and forward the received signals to the isolation fence module; the isolation fence module is used to send the signal uploaded by the gateway module to the outside after isolation, so as to complete the data monitoring of the fireworks and firecrackers automated production line.
[0065] In specific implementation, the intrinsically safe power supply module includes a 12V output submodule, an output voltage sampling submodule, an output current sampling submodule, an overvoltage and overcurrent protection submodule and an output control submodule; the 12V output submodule is used to convert external input electrical energy into a 12V power supply, and supply power to the outside through the output control submodule; the output voltage sampling submodule is used to sample the voltage of the output 12V power supply, and upload the sampling signal to the overvoltage and overcurrent protection submodule; the output current sampling submodule is used to sample the current of the output 12V power supply, and upload the sampling signal to the overvoltage and overcurrent protection submodule; the overvoltage and overcurrent protection submodule is used to perform overvoltage and overcurrent protection of the 12V power supply according to the received sampling signal, and upload the protection signal to the output control submodule; the output control submodule is used to control the output of the 12V power supply;
[0066] The electrostatic discharge module includes an electrostatic discharge power submodule, an electrostatic discharge control submodule, an electrostatic discharge communication submodule and an electrostatic discharge inductance submodule; the electrostatic discharge power submodule is used to supply power to the electrostatic discharge module; the electrostatic discharge inductance submodule is used for the electrostatic discharge of the staff, and monitors the number of discharges and uploads them to the electrostatic discharge control submodule; the electrostatic release control submodule is used to receive the uploaded number of electrostatic discharges, and upload the data to the gateway module through the electrostatic release communication submodule; the electrostatic release communication submodule is used for the communication between the electrostatic release control submodule and the gateway module;
[0067] The mechanical monitoring module includes a mechanical monitoring power supply submodule, a mechanical monitoring current sampling submodule, a mechanical monitoring cable temperature sampling submodule, a mechanical monitoring control submodule and a mechanical monitoring communication submodule; the mechanical monitoring power supply submodule is used to supply power to the mechanical monitoring module; the mechanical monitoring current sampling submodule is used to monitor the current signal of the fireworks and firecrackers automated production line, and upload the monitoring signal to the mechanical monitoring control submodule; the mechanical monitoring cable temperature sampling submodule is used to monitor the cable temperature signal of the fireworks and firecrackers automated production line, and upload the monitoring signal to the mechanical monitoring control submodule; the mechanical monitoring control submodule is used to receive the uploaded monitoring signal, and upload the signal to the gateway module through the mechanical monitoring communication submodule; the mechanical monitoring communication submodule is used for communication between the mechanical monitoring control submodule and the gateway module;
[0068] The temperature and humidity sensor module includes a temperature and humidity power supply submodule, a temperature and humidity sensing submodule, a temperature and humidity control submodule, a temperature and humidity display submodule and a temperature and humidity communication submodule; the temperature and humidity power supply submodule is used to power the temperature and humidity sensor module; the temperature and humidity sensing submodule is used to monitor the temperature and humidity data of the fireworks and firecrackers automated production line, and upload the monitoring signal to the temperature and humidity control submodule; the temperature and humidity control submodule is used to receive the uploaded monitoring signal, and display the temperature and humidity data through the temperature and humidity display submodule, and upload the temperature and humidity data to the gateway module through the temperature and humidity communication submodule; the temperature and humidity display submodule is used to display the temperature and humidity data; the temperature and humidity communication submodule is used for communication between the temperature and humidity control submodule and the gateway module;
[0069] The gateway module includes a gateway power submodule, a gateway overvoltage protection submodule, a gateway communication submodule, a gateway audio interface submodule, a gateway audio output submodule, a gateway infrared receiver submodule, a gateway display submodule, a gateway storage submodule, a gateway control submodule and a gateway network submodule; the gateway power submodule is used to power the gateway module; the gateway overvoltage protection submodule is used to perform overvoltage protection on the power signal output by the gateway power submodule; the gateway communication submodule is used to receive signals uploaded by the electrostatic discharge module, the mechanical monitoring module and the temperature and humidity sensor module, and forward the signals to the gateway control submodule and the gateway network submodule; the gateway audio interface submodule is used to connect the gateway audio output submodule and the isolation The gateway audio output submodule is used to receive audio signals and upload the audio signals to the isolation barrier module through the gateway audio interface submodule; the gateway infrared receiving head submodule is used to receive infrared signals sent from the outside and upload the signals to the gateway control submodule; the gateway display submodule is used to receive data sent by the gateway control submodule and display the data; the gateway storage submodule is used to store the data of the gateway module; the gateway control submodule is used to control the work of the gateway module; the gateway network submodule is used to receive data sent by the gateway control submodule and receive signals uploaded by the electrostatic discharge module, the mechanical monitoring module and the temperature and humidity sensor module, and forward the data to the isolation barrier module;
[0070] The isolation fence module includes an isolation audio submodule and an isolation network submodule; the isolation audio submodule is used to send the received audio data to the outside after isolation; the isolation network submodule is used to send the received network data to the outside after isolation.
[0071] like Figure 2 The figure shows a schematic diagram of the circuit principle of the 12V output submodule in the system of the present invention: the 12V output submodule is a circuit composed of a module (labeled U1 in the figure) composed of a power chip of model VPC2187; the external input power is indicated by a resistor R31 and an LED lamp D4, and then is protected against overcurrent by a fuse F1, and then protected against overvoltage by protection diodes D1, D7 and D8, and then filtered by capacitors C1~C3, and then input to the input terminals 1 and 2 of the chip U1; Pin 3 of the chip is the output positive electrode, directly outputting a stable 12V power signal, and Pin 5 of the chip is the negative electrode and is directly grounded; capacitors C4~C6 are connected between the 12V power signal and the ground, and filtered.
[0072] like Figure 3 The schematic diagram of the circuit principle of one circuit in the output voltage sampling submodule of the system of the present invention is shown as follows: the output voltage sampling submodule is a circuit composed of a resistor voltage divider circuit, including three parallel-connected voltage sampling circuits, the three voltage sampling circuits are the same, and are respectively A-phase voltage sampling circuits (such as Figure 3As shown), a B-phase voltage sampling circuit and a C-phase voltage sampling circuit; Figure 3 In the circuit, the 12V power supply signal is grounded through resistors R21 and R23, and the voltage across the resistor R23 is used as the output value PRT_VOLA of the A-phase voltage sampling and output to the outside; the capacitor C22 is connected in series between the voltage sampling signal and the ground for filtering;
[0073] Adopt and Figure 3 The same circuit can obtain the corresponding B-phase voltage sampling signal PRT_VOLB and C-phase voltage sampling signal PRT_VOLC.
[0074] like Figure 4 The figure shows a schematic diagram of the circuit principle of one circuit in the output current sampling submodule of the system of the present invention: the output current sampling submodule is a sampling circuit composed of an operational amplifier and a resistor; the output current sampling submodule includes three current sampling circuits connected in series in sequence, the three current sampling circuits are the same, and are connected in series between the output end and the output end of the intrinsically safe power supply module, for sampling the current three times; the three current sampling circuits are respectively an A-phase current sampling circuit, a B-phase current sampling circuit and a C-phase current sampling circuit (such as Figure 4 shown); Figure 4 In the figure, the AA end is the input end and is connected to the output end of the intrinsically safe power module, and the BB end is connected to the input end of the next current sampling circuit as a series connection end; the input voltage signal is divided by the voltage-dividing resistors R42 and R41, and then input to the positive input of the operational amplifier (model GS8091), and the negative input of the operational amplifier is connected to the BB end through the resistor R43; the output end of the operational amplifier outputs the sampling signal PRT_CURC to the overvoltage and overcurrent protection submodule, and at the same time, the output end of the operational amplifier is also connected to the negative input of the operational amplifier through the resistor R45; at the same time, the output end of the operational amplifier is also grounded and filtered through the capacitor C35;
[0075] Adopt and Figure 4 The same circuit can obtain the corresponding A-phase current sampling signal PRT_CURA and B-phase current sampling signal PRT_CURB.
[0076] like Figure 5 The figure shows a schematic diagram of the circuit principle of a circuit in the overvoltage and overcurrent protection submodule of the system of the present invention: the overvoltage and overcurrent protection submodule is a circuit composed of a comparator chip of model TLV3202 and a timer chip of model CD4538; the overvoltage and overcurrent protection submodule includes 3 parallel and identical circuits, which are respectively the A phase overvoltage and overcurrent protection circuit (such as Figure 5 As shown), B phase overvoltage and overcurrent protection circuit and C phase overvoltage and overcurrent protection circuit;
[0077] Figure 5In the figure, the 2.5V voltage signal output by the reference voltage source is compared with the sampling signal PRT_CURA output by the A-phase current sampling circuit through the comparator chip TLV3202 (labeled U2A in the figure), and the comparison signal AAINPUT-A is output, and the base of the seventh switch tube (the transistor Q7 in the figure, model SS8050Y1) is connected through the current limiting resistor R1, the emitter of Q7 is grounded, and the collector of Q7 directly outputs the A-phase control signal LOGICA; when PRT_CURA is greater than the set value, the output AAINPUT-A is high level, at this time the transistor Q7 is turned on, and at this time the A-phase control signal LOGICA is low level; when PRT_CURA is lower than the set value, the output AAINPUTA is low level, at this time the transistor Q7 is turned off, and at this time the A-phase control signal LOGICA is high level;
[0078] The 2.5V voltage signal output by the reference voltage source is compared with the sampling signal PRT_VOLA output by the A-phase voltage sampling circuit through the comparator chip TLV3202 (labeled U3A in the figure), and then the comparison signal BAINPUT-A is output, and the base of the eighth switch tube (the transistor Q8 in the figure, model SS8050Y1) is connected through the current limiting resistor R3, the emitter of Q8 is grounded, and the collector of Q8 directly outputs the A-phase control signal LOGICA; when PRT_VOLA is greater than the set value, the output BAINPUT-A is high level, at this time the transistor Q8 is turned on, and at this time the A-phase control signal LOGICA is low level; when PRT_VOLA is lower than the set value, the output BAINPUTA is low level, at this time the transistor Q8 is turned off, and at this time the A-phase control signal LOGICA is high level;
[0079] In addition, the signals AAINPUT-A and BAINPUT-A are also edge-triggered by the bistable trigger U5 (model CD4538), and the corresponding trigger signals QAOUT-A and QBOUT-A are obtained;
[0080] After the 2.5V voltage signal output by the reference voltage source is compared with QAOUT-A through the comparator chip TLV3202 (marked U2B in the figure), the comparison signal is output and connected to the base of the ninth switch tube (the transistor Q9 in the figure, model SS8050Y1) through the current limiting resistor R12, the emitter of Q9 is grounded, and the collector of Q9 directly outputs the A phase control signal LOGICA; when QAOUT-A is greater than the set value, the output of the comparator chip TLV3202 is high level, at this time the transistor Q9 is turned on, at this time the A phase control signal LOGICA is low level; when QAOUT-A is lower than the set value, the output of the comparator chip TLV3202 is low level, at this time the transistor Q9 is turned off, at this time the A phase control signal LOGICA is high level;
[0081] After the 2.5V voltage signal output by the reference voltage source is compared with QBOUT-A through the comparator chip TLV3202 (marked U3B in the figure), the comparison signal is output and connected to the base of the tenth switch tube (the transistor Q10 in the figure, model SS8050Y1) through the current limiting resistor R16, the emitter of Q10 is grounded, and the collector of Q10 directly outputs the A phase control signal LOGICA; when QBOUT-A is greater than the set value, the output of the comparator chip TLV3202 is high level, at this time the transistor Q10 is turned on, at this time the A phase control signal LOGICA is low level; when QBOUT-A is lower than the set value, the output of the comparator chip TLV3202 is low level, at this time the transistor Q10 is turned off, at this time the A phase control signal LOGICA is high level;
[0082] Adopt and Figure 5 The same circuit can obtain the corresponding B-phase control signal LOGICB and C-phase control signal LOGICC.
[0083] like Figure 6 The figure shows the circuit principle diagram of the output control submodule in the system of the present invention: the output control submodule is a switch circuit composed of triodes; the output control submodule includes three-way control subcircuits and an output indication circuit;
[0084] In the A-phase control subcircuit, the A-phase control signal LOGICA is connected to the base of the first transistor Q1 after current limiting through the resistor R5, and the emitter of the first transistor Q1 is directly connected to the 12V power supply signal; the base of the first transistor Q1 is also connected to the 12V power supply signal through the pull-up resistor R4; the collector of the first transistor Q1 is grounded through the pull-down resistor R8; at the same time, the collector of the first transistor Q1 is the output end, which is directly connected to the control end of the second switch tube Q2 through the driving diode D2, and one end of the active end of the second switch tube Q2 is used as The output terminal is connected to the B-phase control subcircuit, and the other end of the active end of the second switch tube Q2 is directly connected to the 12V power supply signal; the capacitor C10 is used for filtering; when the A-phase control signal LOGICA is at a high level, Q1 is turned off and Q2 is turned on, and the 12V power supply signal is directly input to the B-phase control subcircuit; when the A-phase control signal LOGICA is at a low level, Q1 is turned on and Q2 is turned off, and the 12V power supply signal is disconnected from the B-phase control subcircuit, so the 12V power line signal PWROUTC has no output;
[0085] In the B-phase control subcircuit, the B-phase control signal LOGICB is connected to the base of the third transistor Q3 after current limiting by the resistor R10, and the emitter of the third transistor Q3 is directly connected to the 12V power supply signal; the base of the third transistor Q3 is also connected to the 12V power supply signal through the pull-up resistor R9; the collector of the third transistor Q3 is grounded through the pull-down resistor R15; at the same time, the collector of the third transistor Q3 is the output end, which is directly connected to the control end of the fourth switch tube Q4 through the driving diode D3, and one end of the active end of the fourth switch tube Q4 is connected to the control end of the fourth switch tube Q4. As the output end and connected to the C-phase control subcircuit, the other end of the active end of the fourth switch tube Q4 is directly connected to the 12V power supply signal; the capacitor C11 is used for filtering; when the B-phase control signal LOGICB is at a high level, Q3 is turned off and Q4 is turned on, and the 12V power supply signal is directly input to the C-phase control subcircuit; when the B-phase control signal LOGICB is at a low level, Q3 is turned on and Q4 is turned off, and the 12V power supply signal is disconnected from the C-phase control subcircuit, so the 12V power line signal PWROUTC has no output;
[0086] In the C-phase control subcircuit, the C-phase control signal LOGICC is connected to the base of the fifth transistor Q5 after current limiting by the resistor R34, and the emitter of the fifth transistor Q5 is directly connected to the 12V power supply signal; the base of the fifth transistor Q5 is also connected to the 12V power supply signal through the pull-up resistor R33; the collector of the fifth transistor Q5 is grounded through the pull-down resistor R37; at the same time, the collector of the fifth transistor Q5 is the output end, which is directly connected to the control end of the sixth switch tube Q6 through the driving diode D6, and the active end of the sixth switch tube Q6 One end is used as the output end and connected to the output indication circuit, and the other end of the active end of the sixth switch tube Q6 is directly connected to the 12V power supply signal; the capacitor C31 is used for filtering; when the C phase control signal LOGICC is at a high level, Q5 is turned off and Q6 is turned on, and the 12V power supply signal is directly input to the output indication circuit; when the C phase control signal LOGICC is at a low level, Q5 is turned on and Q6 is turned off, and the 12V power supply signal is disconnected from the output indication circuit, so the 12V power line signal PWROUTC has no output;
[0087] The output indication circuit includes a resistor R32 and an indicator light D5; the output 12V power line signal PWROUTC is grounded through the resistor R32 and the indicator light D5, and the output 12V power line signal is indicated; at the same time, the output 12V power line signal PWROUTC supplies power to the outside through the interface P2; finally, the negative pole of the indicator light D5 is connected to the output end of the output indication circuit, the output end of the output indication circuit is the output end of the intrinsically safe power supply module, and is connected to the output current sampling submodule.
[0088] like Figure 7The schematic diagram of the circuit principle of the electrostatic discharge power submodule in the system of the present invention is shown as follows: the electrostatic discharge power submodule is a circuit composed of a power chip of model FR9889; the external input power signal is input through the interface P4, and after being protected by the resistor R16 and the TVS tube D17 for overvoltage protection, it is then protected by the fuse F1 for overcurrent protection; then, the input power is reversely protected by the series-connected diodes D9~D11, and then grounded by the TVS tubes D12~D14 connected in parallel for overvoltage protection, and finally the input protection power signal is obtained;
[0089] After the protection power signal is grounded and divided by resistors R11 and R12, the terminal voltage of resistor R12 is input into the control terminal of the first switch tube Q1 after current limiting by resistor R13; the protection power signal is simultaneously connected to one end of the active end of the first switch tube Q1, and the other end of the active end of the first switch tube Q1 directly outputs the power signal VIN; at the same time, the power signal VIN is grounded and filtered through grounding capacitors C11 and C12; when the device is powered on, due to the effect of C1, the control pin of Q1 is at a high level, Q1 is turned off, and VIN has no power output; as time goes by, C1 is discharged through R12, and the voltage of the control pin of Q1 slowly decreases, at which time Q1 is gradually turned on, and the power signal can output the power signal VIN normally;
[0090] The power signal VIN is connected to the 2nd pin of the power chip U5 (model FR9889), and the 1st pin of the chip is connected to the output pin 3 of the chip through the capacitor C10; the output pin 3 of the chip outputs a 3.3V voltage signal, and after filtering through the inductor L2 and the capacitor C13, it outputs a 3.3V power signal and supplies power to the outside; at the same time, the 3.3V power signal output to the outside is grounded and sampled through the resistors R8 and R9, and the sampled signal is fed back to the 5th pin of the chip, so that the chip U5 can output a stable power supply; the 7th pin of the chip is connected to the power signal VIN through the pull-up resistor R3; the 8th pin of the chip is grounded through the capacitor C9; the 9th pin of the chip is the ground pin ice and is directly grounded;
[0091] In addition, the 3.3V power supply signal is output to the outside and grounded through three TVS tubes D6 to D8 connected in parallel, and overvoltage protection is performed.
[0092] like Figure 8The figure shows a schematic diagram of the circuit principle of the electrostatic release control submodule in the system of the present invention: the electrostatic release control submodule is a circuit composed of a control chip (labeled U3 in the figure) with a model of STM32G030C8T6; pin 3 of chip U3 is a power pin, and is directly connected to the power signal 3.3V; pin 7 of chip U3 is a ground pin, and is directly grounded; pin 10 of chip U3 is a reset pin, which is grounded through capacitor C6, and is also connected to the power signal 3.3V through a pull-up resistor R1 to ensure that the pin is in a high-level state; pins 29, 32 and 34 of chip U3 are communication pins, which are directly connected to the electrostatic release communication submodule and perform data exchange; pin 39 of chip U3 is an input pin, which is connected to the electrostatic release induction submodule and obtains the uploaded electrostatic induction monitoring signal.
[0093] like Fig. 9 The figure shows a schematic diagram of the circuit principle of the electrostatic release communication submodule in the system of the present invention: the electrostatic release communication submodule is a communication circuit composed of a communication module (labeled U1 in the figure) composed of a chip of model BL3085B; pins 1, 2 and 3 of module U1 are communication pins, which are directly connected to pins 21, 29 and 34 of the control chip in the electrostatic release control submodule for data exchange; pin 4 of module U1 is a power pin, which is directly connected to the power signal 3.3V and takes power; pin 5 of module U1 is a ground pin and is directly grounded; pins 8 and 9 of module U1 are second communication pins, and the output signal is protected by overvoltage through D2, D15 and D18, and then connected to port P3 through overcurrent protection resistors R14 and R15. Port P3 is used to connect to the gateway module and exchange data.
[0094] like Fig.10 The schematic diagram of the circuit principle of the electrostatic discharge induction submodule in the system of the present invention is shown as follows: the electrostatic discharge induction submodule is a circuit composed of a chip of model ICM7555MM / TR; pin 1 of the chip is directly grounded; pins 2 and 6 of the chip are directly short-circuited and connected to the electrostatic discharge induction point T2; the electrostatic discharge point T2 is used for the staff to touch to realize electrostatic discharge induction; at the same time, pins 2 and 6 of the chip are low potential and high potential detection pins, respectively, to detect the voltage in the T2 induction capacitor, and release the charge in the T2 induction capacitor through pin 7, so as to realize the detection of the electrostatic discharge line according to the detected change of the induction capacitor; pin 3 of the chip is an output pin, which directly outputs the electrostatic induction monitoring signal KEY1 and uploads it to pin 39 of the control chip in the electrostatic release control submodule; pin 4 of the chip is a reset signal pin, which is directly connected to the power supply signal 3.3V to ensure the stability of the pin level; pin 8 of the chip is a power supply pin, which is directly connected to the power supply signal 3.3V and takes a point; pin 7 of the chip is a discharge pin, which is connected to the electrostatic induction point T2 through a resistor R5, and is used for electrostatic discharge induction of the staff.
[0095] like Fig.11 The schematic diagram of the circuit principle of the mechanical monitoring power submodule in the system of the present invention is shown as follows: the mechanical monitoring power submodule is a circuit composed of a power chip of model FR9889; the external input power signal is filtered by inductors L2 and L3; after inductor filtering, one pole of the input power is protected from overcurrent by F1, and then reverse protection is performed by series-connected diodes D9 to D11; the other pole of the input power is protected from soft start by a switch tube Q1 and resistors R28, R29, R30, and C35; after soft start protection, the input power signal is protected from overvoltage by TVS diodes D12 to D14, and then a protection power signal VIN is output; the protection power signal VIN is also grounded and filtered by capacitors C31 and C32;
[0096] The protection power signal VIN is input to pin 2 of the power chip U5 (model FR9889); pin 1 of chip U5 is connected to pin 3 of chip U5 through capacitor C28; pin 4 of chip U5 is a ground pin and is directly grounded; pin 3 of chip U5 is an output pin, which directly outputs the power signal, and obtains a stable 3.3V power signal after filtering through inductor L1; at the same time, the stable 3.3V power signal is also grounded and filtered through capacitor C29, and at the same time, the stable 3.3V power signal is also grounded through resistors R25 and R26 and voltage sampling is performed, and the voltage sampling data is uploaded to pin 5 of chip U5 as feedback, so that chip U5 can output a stable power signal; pin 7 of chip U5 is directly connected to the protection power signal VIN through a pull-up resistor R24; pin 8 of chip U5 is grounded through capacitor C17; pin 9 of chip U5 is a ground pin and is directly grounded; finally, the stable 3.3V power signal is also grounded through diodes D6~D8 and overvoltage protection is performed.
[0097] like Fig.12The schematic diagram of the circuit principle of the mechanical monitoring current sampling submodule in the system of the present invention is shown as follows: the mechanical monitoring current sampling submodule is a circuit composed of a metering chip of model RN8032 (labeled U2 in the figure); P2 in the figure is an interface for connecting 4 external current sensors, wherein pins 1 and 2 are connected to the first current sensor, pins 3 and 4 are connected to the second current sensor, pins 5 and 6 are connected to the third current sensor, and pins 7 and 8 are connected to the fourth current sensor; the signal of the first current sensor is connected to the first current sensor through resistors R10, R15, R19 After the signal is filtered by the RC filter circuit composed of resistors R13, R14, R16, R17 and capacitors C13 and C14, it is uploaded to pins 10 and 11 of the metering chip; the signal of the third current sensor is filtered by the RC filter circuit composed of resistors R8, R9, R11, R12 and capacitors C11 and C12, and then uploaded to the metering chip. The signal of the fourth current sensor is filtered by the RC filter circuit composed of resistors R3, R4, R6, R7 and capacitors C9 and C10, and then uploaded to the 4th and 5th pins of the metering chip; the 3rd pin of the metering chip is connected to the reference power supply Vref; the 20th and 21st pins of the metering chip are directly grounded; the 28th pin of the metering chip is the power supply pin, which is directly connected to the power supply signal 3.3V and takes power; the 29th pin of the metering chip is the ground pin, and is directly grounded; the 36th and 37th pins of the metering chip are the crystal oscillator signal input pins, which are directly connected to the power supply signal 3.3V and take power; Connect the crystal oscillator circuit composed of crystal oscillator Y1, resistor R2 and capacitors C18 and C19 to obtain the crystal oscillator signal; pins 40 to 42 of the metering chip are directly connected to the 3.3V power supply signal; pins 43 and 44 of the metering chip are directly grounded; pins 31 to 35 of the metering chip are communication pins, of which pin 31 is an interrupt pin, pins 32 and 35 are communication signal pins, pin 33 is a clock signal pin, and pin 34 is a control signal pin; pins 31 to 35 of the metering chip are connected to the communication pins of the mechanical monitoring and control submodule, and data exchange is performed.
[0098] like Fig.13 The figure shows a schematic diagram of the circuit principle of the mechanical monitoring cable temperature sampling submodule in the system of the present invention: the mechanical monitoring cable temperature sampling submodule is a circuit composed of a temperature sensor of model DS18B20; the detection signal output by the temperature sensor is represented by DS18B20 and uploaded to the mechanical monitoring control submodule; at the same time, the pin of the detection signal is connected to the 3.3V power supply signal through the pull-up resistor R27 to ensure the level stability of the detection signal pin.
[0099] like Fig.14The schematic diagram of the circuit principle of the mechanical monitoring control submodule in the system of the present invention is shown as follows: the mechanical monitoring control submodule is a circuit composed of a control chip (labeled U3 in the figure) with a model of STM32G030C8T6; pins 2 and 3 of the control chip U3 are crystal oscillator signal pins, which are connected to the crystal oscillator circuit composed of crystal oscillator Y2, capacitors C33 and C34, and obtain crystal oscillator signals; pins 4, 5 and 6 of the control chip U3 are power supply pins, which directly connect to 3.3V power supply signals and take power; pin 7 of the control chip U3 is directly grounded; pin 10 of the control chip U3 is a reset signal pin, which is directly connected to the reset signal pin through a pull-up resistor R 23 is connected to the power supply signal 3.3V to ensure the stability of the pin level; pins 15 to 19 of the control chip U3 are communication pins, which are directly connected to pins 34, 33, 32, 35 and 31 of the metering chip RN8032 in the mechanical monitoring current sampling submodule, and perform data exchange; pins 29, 32 and 34 of the control chip U3 are the second communication pins, which are directly connected to the mechanical monitoring communication submodule and perform data exchange; pin 40 of the control chip U3 is the input signal pin, which is directly connected to the cable temperature monitoring signal DS18B20 uploaded by the mechanical monitoring cable temperature sampling submodule.
[0100] like Fig.15 The schematic diagram of the circuit principle of the mechanical monitoring communication submodule in the system of the present invention is shown as follows: the mechanical monitoring communication submodule is a communication circuit composed of a communication module U1 composed of a chip of model BL3085B; chip U4 is a power chip, model B0305S; pin 1 of chip U4 is directly grounded, and pin 2 of chip U4 is an input power signal pin, which is directly connected to the power signal 3.3V and takes power; pin 3 of chip U4 is a ground pin for RS485 communication, and is connected to the communication ground of RS485; pin 4 of chip U4 is a power output pin, which directly outputs the communication power signal VCC-485 of RS485 and supplies power to the communication chip U1; the communication chip Pins 1, 2, and 3 of chip U1 are communication pins, which are directly connected to pins 32, 29, and 34 of the control chip of the mechanical monitoring and control submodule, and perform data exchange; Pin 4 of the communication chip U1 is the communication power signal, which is directly connected to the 3.3V power signal and takes power; Pin 5 of the communication chip U1 is the ground pin and is directly grounded; Pin 6 of the communication chip U1 is the ground pin for RS485 communication and is connected to the communication ground of RS485; Pin 7 of the communication chip U1 is the communication power pin for RS485 and is connected to pin 4 of the power chip U4 and takes power; Pins 8 and 9 of the communication chip U1 are communication pins, which are directly connected to the gateway module and perform data exchange.
[0101] like Fig.16The schematic diagram of the circuit principle of the temperature and humidity power supply submodule in the system of the present invention is shown as follows: the temperature and humidity power supply submodule is a circuit composed of a power supply chip of model FR9889; the external input power supply signal is filtered by inductors L2 and L3; after inductor filtering, one pole of the input power supply is over-current protected by F1, and then reverse protection is performed by series-connected diodes D8~D10; the other pole of the input power supply is soft-start protected by switch tube Q1, capacitor C11, resistors R11, R12, and R13; after soft-start protection, the input power supply signal is over-voltage protected by TVS diodes D11~D13, and then a protection power supply signal VIN is output; the protection power supply signal VIN is also grounded and filtered by capacitors C9 and C10;
[0102] The protection power signal VIN is input to pin 2 of the power chip U5 (model FR9889); pin 1 of chip U5 is connected to pin 3 of chip U5 through capacitor C6; pin 4 of chip U5 is a ground pin and is directly grounded; pin 3 of chip U5 is an output pin, which directly outputs the power signal, and obtains a stable 3.3V power signal after filtering through inductor L1; at the same time, the stable 3.3V power signal is also grounded and filtered through capacitor C7, and at the same time, the stable 3.3V power signal is also grounded through resistors R6 and R8 and voltage sampling is performed, and the voltage sampling data is uploaded to pin 5 of chip U5 as feedback, so that chip U5 can output a stable power signal; pin 7 of chip U5 is directly connected to the protection power signal VIN through a pull-up resistor R5; pin 8 of chip U5 is grounded through capacitor C5; pin 9 of chip U5 is a ground pin and is directly grounded; finally, the stable 3.3V power signal is also grounded through diodes D5~D7 and overvoltage protection is performed.
[0103] like Fig.17 The figure shows a schematic diagram of the circuit principle of the temperature and humidity sensing submodule in the system of the present invention: the temperature and humidity sensing submodule is a circuit composed of a temperature and humidity sensor of model HDC1080; the detection signals output by the temperature and humidity sensor HDC1080 are bus signals SDA and SCL; the bus signals SDA and SCL are connected to the power supply signal 3.3V through pull-up resistors R3 and R2 respectively to ensure the stability of the pin level; at the same time, the bus signals SDA and SCL are also directly connected to the communication pins of the temperature and humidity control submodule to exchange data.
[0104] like Fig.18The schematic diagram of the circuit principle of the temperature and humidity control submodule in the system of the present invention is shown as follows: the temperature and humidity control submodule is a circuit composed of a control chip (labeled U2 in the figure) with a model of STM32G030C8T6; pins 4 to 6 of the control chip U2 are power signal pins, and are directly connected to the power signal 3.3V and powered; pin 7 of the control chip U2 is directly grounded; pin 10 of the control chip U2 is a reset signal pin, which is connected to the power signal 3.3V through a pull-up resistor R1 to ensure the stability of the pin level; at the same time, pin 1 of the control chip U2 Pin 0 is also grounded and filtered through filter capacitor C1; pins 15, 16 and 18 of the control chip U2 are communication pins, which are connected to the temperature and humidity display submodule and perform data exchange to make the temperature and humidity display submodule work; pins 29, 32 and 34 of the control chip U2 are the second communication pins, which are directly connected to the temperature and humidity communication submodule and perform data exchange; pins 45 and 46 of the control chip U2 are the third communication pins, which are directly connected to the bus signals (detection signals) SCL and SDA uploaded by the temperature and humidity sensor submodule, and perform data exchange.
[0105] like Fig.19 The schematic diagram of the circuit principle of the temperature and humidity display submodule in the system of the present invention is shown as follows: the temperature and humidity display submodule is a circuit composed of an LCD driver chip of model HT1621B (labeled U4 in the figure) and a display screen of model QYT12429 (labeled D4 in the figure); Pins 9, 11 and 12 of the LCD driver chip U4 are communication pins, which are directly connected to pins 15, 16 and 18 of the control chip in the temperature and humidity control submodule, and perform data exchange; Pin 13 of the LCD driver chip U4 is a ground pin, and is directly grounded; Pin 17 of the LCD driver chip U4 is a power pin, which is directly connected to a 3.3V power signal and takes power; Pins 21 to 24 of the LCD driver chip U4 are common pins, which are directly connected to common pins 1 to 4 of the display screen; Pins 8 to 1 and 48 to 41 of the LCD driver chip U4 are drive pins, which are directly connected to pins 5 to 20 of the display screen in sequence, and output data.
[0106] like Fig. 20The figure shows a schematic diagram of the circuit principle of the temperature and humidity communication submodule in the system of the present invention: the temperature and humidity communication submodule is a communication circuit composed of a communication module (labeled U1 in the figure) composed of a chip of model BL3085B; chip U3 is a power chip, model B0305S; pin 1 of chip U3 is directly grounded, and pin 2 of chip U3 is an input power signal pin, which is directly connected to the power signal 3.3V and takes power; pin 3 of chip U3 is a ground pin for RS485 communication, and is connected to the communication ground of RS485; pin 4 of chip U3 is a power output pin, which directly outputs the communication power signal VCC-485 of RS485 and supplies power to the communication chip U1; Pins 1, 2, and 3 of the communication chip U1 are communication pins, which are directly connected to pins 32, 29, and 34 of the control chip of the temperature and humidity control submodule, and perform data exchange; pin 4 of the communication chip U1 is the communication power signal, which is directly connected to the 3.3V power signal and takes power; pin 5 of the communication chip U1 is the ground pin and is directly grounded; pin 6 of the communication chip U1 is the ground pin for RS485 communication and is connected to the communication ground of RS485; pin 7 of the communication chip U1 is the communication power pin for RS485 and is connected to pin 4 of the power chip U4 and takes power; pins 8 and 9 of the communication chip U1 are communication pins, which are directly connected to the gateway module and perform data exchange.
[0107] like Fig.21 The schematic diagram of the circuit principle of the gateway power submodule in the system of the present invention is shown as follows: the gateway power submodule is a circuit composed of a power chip of model FR9609 (labeled U1 in the figure); the external input power signal is protected from overcurrent by self-recovery fuses R19 and R20, and then protected from overvoltage by TVS tubes D22, D29 and D4, and then filtered by common-mode inductors, and then protected from overcurrent by fuse F1, reverse protection by diodes D1~D3, and overvoltage protection by diodes D5~D7 in sequence, and then soft-start protection is performed by capacitor C12, resistors R3, R18, R4 and switch tube Q1, and finally the protection power signal VDD is output;
[0108] The protection power signal VDD is directly input to pin 2 of the power chip U1; pin 1 of the power chip U1 is directly connected to pin 3 of the power chip U1 through capacitor C2; pin 3 of the power chip U1 is the power output pin, and the output power signal is filtered by inductor L2 to output a stable power signal 3.3V; pin 4 of the power chip U1 is a ground pin and is directly grounded; the stable 3.3V power signal output by the power chip U1 is grounded and filtered through capacitor C7, and the stable 3.3V power signal is also sampled by voltage divider resistors R7 and R8 for output voltage, and the sampled signal is fed back to the feedback pin 5 of the power chip U1, so that the power chip U1 can output a stable power signal; pin 7 of the power chip U1 is connected to the power signal through a pull-up resistor R5; pin 8 of the power chip U1 is directly grounded through capacitor C1; pin 9 of the power chip U1 is a ground pin and is directly grounded.
[0109] like Fig. 22 The schematic diagram of the circuit principle of the gateway overvoltage protection submodule in the system of the present invention is shown: the gateway overvoltage protection submodule is a circuit composed of TVS tubes; the 3.3V power supply signal is grounded through three parallel connected, identical protection circuits; the first protection circuit in the figure includes TVS tube D16, resistors R12 and R15, capacitor C11 and bidirectional switch tube Q2; the second protection circuit includes TVS tube D15, resistors R11 and R14, capacitor C10 and bidirectional switch tube Q4; the third protection circuit includes TVS tube D14, resistors R10 and R13, capacitor C9 and bidirectional switch tube Q3;
[0110] In the first protection circuit, the 3.3V power supply signal is grounded through the TVS tube D16 and the resistor R15; the cathode of the TVS tube D16 is connected to the control end of the bidirectional switch tube Q2 through the resistor R12; the control end of the bidirectional switch tube Q2 is also grounded and filtered through the capacitor C11; when the power supply signal fails and is too high, the TVS tube D16 is broken down, and the cathode voltage of the TVS tube D16 is directly clamped to 2.7V; therefore, the bidirectional switch tube Q2 is turned on, and the power supply signal is forced to be pulled down to the ground signal to achieve forced protection when the power supply signal is too high.
[0111] In the second protection circuit, the 3.3V power signal is grounded through the TVS tube D15 and the resistor R14; the cathode of the TVS tube D15 is connected to the control end of the bidirectional switch tube Q4 through the resistor R11; the control end of the bidirectional switch tube Q4 is also grounded and filtered through the capacitor C10; when the power signal fails and is too high, the TVS tube D15 is broken down, and the cathode voltage of the TVS tube D15 is directly clamped to 2.7V; therefore, the bidirectional switch tube Q4 is turned on, and the power signal is forced to be pulled down to the ground signal to achieve forced protection when the power signal is too high.
[0112] In the third protection circuit, the 3.3V power supply signal is grounded through the TVS tube D14 and the resistor R13; the cathode of the TVS tube D14 is connected to the control end of the bidirectional switch tube Q3 through the resistor R10; the control end of the bidirectional switch tube Q3 is also grounded and filtered through the capacitor C9; when the power supply signal fails and is too high, the TVS tube D14 is broken down, and the cathode voltage of the TVS tube D14 is directly clamped to 2.7V; therefore, the bidirectional switch tube Q4 is turned on, and the power supply signal is forced to be pulled down to the ground signal to achieve forced protection when the power supply signal is too high.
[0113] like Fig.23 The schematic diagram of the circuit principle of the gateway communication submodule in the system of the present invention is shown as follows: the gateway communication submodule is a communication circuit composed of a communication module U1 composed of a chip with model BL3085B; chip U3 is a power chip with model B0305S; pin 1 of chip U3 is directly grounded, and pin 2 of chip U3 is an input power signal pin, which is directly connected to the power signal 3.3V and takes power; pin 3 of chip U3 is a ground pin for RS485 communication, and is connected to the communication ground of RS485; pin 4 of chip U3 is a power output pin, which directly outputs the communication power signal VCC-485 of RS485 and supplies power to the communication chip U2; pins 1, 2 and 3 of the communication chip U2 are communication pins, which are directly connected to the gateway control submodule and perform data interaction; communication Pin 4 of chip U2 is the communication power signal, which is directly connected to the 3.3V power signal and draws power; Pin 5 of communication chip U2 is the ground pin and is directly grounded; Pin 6 of communication chip U2 is the ground pin for RS485 communication and is connected to the communication ground of RS485; Pin 7 of communication chip U2 is the communication power pin of RS485 and is connected to Pin 4 of power chip U4 and draws power; Pins 8 and 9 of communication chip U2 are communication pins, which are protected by diodes D11~D13, and then grounded by diodes D26 and D27, and finally over-current protected by resistors R9 and R6 and connected to the isolated network sub-module for data interaction; in addition, the RS485 communication power signal VCC-485 is grounded and filtered through diodes D17~D19.
[0114] like Fig.24 The diagram shows the circuit principle of the gateway audio interface submodule in the system of the present invention: the audio signal AUDIOOUT output by the gateway audio output submodule is protected against overcurrent by resistors R1 and R2, then protected against overvoltage by TVS tube D20, then protected against overcurrent by resistors R16 and R17, and protected against ground overvoltage by diodes D21 and D23, and finally uploaded to the isolated audio submodule through interface Header4.
[0115] like Fig.25The schematic diagram of the circuit principle of the gateway audio output submodule in the system of the present invention is shown as follows: the gateway audio output submodule is a circuit composed of an audio decoder chip of model WM8978 (labeled U4 in the figure); the 26th pin of the audio decoder chip U4 is connected to the power signal 3.3V through a pull-up resistor R1, and is also grounded and filtered through capacitors C1 and C2; the 31st pin of the audio decoder chip U4 is a power pin, which is directly connected to the power signal 3.3V and takes power, and is also grounded and filtered through capacitors C4 and C5; the 13th and 14th pins of the audio decoder chip U4 are digital power pins, which are connected to the power signal through a resistor R4 3.3V and power is taken, and it is also grounded and filtered through capacitors C9 and C10; pins 12, 24, 33 and 28 of the audio decoder chip U4 are all ground pins and are directly grounded; pins 7, 8, 9, 10 and 11 of the audio decoder chip U4 are communication pins, which are directly connected to the gateway control submodule and perform data exchange; pins 16 and 17 of the audio decoder chip U4 are second communication pins, which are directly connected to the gateway submodule and perform data exchange; at the same time, pins 16 and 17 of the audio decoder chip U4 are also connected to the power signal through pull-up resistors R65 and R66 to ensure the stability of the pin level. Pin 27 of the audio decoder chip U4 is grounded through capacitors C23 and C24, and is also grounded through resistors R8, R10 and C22; Pins 1, 2, 4 and 5 of the audio decoder chip U4 are audio input interfaces, which are connected to interface MK1 and receive audio input; Pins 23 and 25 of the audio decoder chip U4 are audio output pins, and the audio signal directly output is filtered by capacitors C3 and C6 to obtain the audio signal AUDIOOUT; at the same time, the audio signal AUDIOOUT is also connected to the analog ground signal AGND through TVS tubes D20~D22 for overvoltage protection.
[0116] like Fig.26 The figure shows a schematic diagram of the circuit principle of the gateway infrared receiving head submodule in the system of the present invention: the gateway infrared receiving head submodule is a circuit composed of an infrared receiving head of model IRM-H638T; pins 1 and 2 of the infrared receiving head IRM-H638T are ground pins and are directly grounded; pin 4 of the infrared receiving head IRM-H638T is a power signal, and is directly connected to the power signal 3.3V and powered; pin 3 of the infrared receiving head IRM-H638T is an output signal pin, and the infrared signal output by it is impedance matched by resistors Rir1 and Rir-1 to obtain an infrared signal IR_REMOTE and upload it to the gateway control submodule.
[0117] like Fig. 27The schematic diagram of the circuit principle of the gateway display submodule in the system of the present invention is shown as follows: the gateway display submodule is a circuit composed of a display screen of model ILI9488; pin 5 of the display screen ILI9488 is a ground pin and is directly grounded; pins 6 and 7 of the display screen ILI9488 are power pins and are directly connected to the power signal 3.3V and powered; pins 9, 10, 11, 12 and 15 of the display screen ILI9488 are display control pins, which are directly connected to the gateway control submodule And obtain the display control signal; Pins 17 to 24 of the display screen ILI9488 are display data pins, which are directly connected to the grid control submodule and obtain the display data signal; Pin 33 of the display screen ILI9488 is the indicator light pin, which is directly connected to the power supply signal 3.3V through the current limiting resistor R42, the switch tube Q1 and the resistor R14; Pins 38 and 39 of the display screen ILI9488 are directly grounded; Pins 34 to 37 and Pins 40 to 42 of the display screen ILI9488 are directly grounded.
[0118] like Fig.28 The schematic diagram of the circuit principle of the gateway storage submodule in the system of the present invention is shown as follows: the gateway storage submodule is a circuit composed of a storage chip of model FM25V02 (labeled U2 in the figure) and a storage chip of model W25Q128FVSIG (labeled U5 in the figure);
[0119] Pin 1 of the memory chip U2 is an enable signal pin, which is connected to the gateway control submodule and obtains the enable signal SPI3_NSS2; Pins 2 and 5 of the memory chip U2 are communication data pins (the communication data signals are SPI3_MISO and SPI3_MOSI), which are directly connected to the gateway control submodule and perform data interaction; Pin 6 of the memory chip U2 is a clock signal pin, which is directly connected to the gateway control submodule and obtains the clock signal SPI3_SCK; Pins 3 and 4 of the memory chip U2 are directly grounded; Pin 7 of the memory chip U2 is a reset signal pin, which is directly connected to the power signal 3.3V and ensures the stability of the pin level; Pin 8 of the memory chip U2 is a power pin, which is directly connected to the power signal 3.3V and takes power; At the same time, Pin 8 of the memory chip U2 is also grounded and filtered through the grounding capacitor C12;
[0120] Similarly, pin 1 of the memory chip U5 is an enable signal pin, which is connected to the gateway control submodule and obtains the enable signal SPI3_NSS; pins 2 and 5 of the memory chip U5 are communication data pins (the communication data signals are SPI3_MISO and SPI3_MOSI), which are directly connected to the gateway control submodule and perform data exchange; pin 6 of the memory chip U5 is a clock signal pin, which is directly connected to the gateway control submodule and obtains the clock signal SPI3_SCK; pins 3 and 4 of the memory chip U5 are directly grounded; pin 7 of the memory chip U5 is a reset signal pin, which is connected to the power signal 3.3V through a pull-up resistor R15 to ensure the stability of the pin level; pin 8 of the memory chip U5 is a power pin, which is directly connected to the power signal 3.3V and takes power.
[0121] like Fig.29 The schematic diagram of the circuit principle of the gateway control submodule in the system of the present invention is shown as follows: the gateway control submodule is a circuit composed of a control chip (labeled U1 in the figure) of model STM32F407ZGT6; pins 41, 42, 43, 44, 49 and 50 of the control chip U1 are first-way communication pins, which are connected to the gateway network submodule and perform data exchange; pins 110, 133, 134, 135 and 132 of the control chip U1 are second-way communication pins, wherein pin 110 outputs an enable signal SPI3_NSS and controls Fig.28 The memory chip U5 works, and the 132-pin outputs the enable signal SPI3_NSS2 and controls Fig.28 The work of the storage chip U2; the 133rd pin of the control chip U1 is the clock signal pin, and the 134th and 135th pins of the control chip U1 are data pins, and are connected Fig.28 The communication pins of the storage chips U2 and U5 are used for data exchange; the 69th and 70th pins of the control chip U1 are the communication data pins, which are directly connected to Fig.23 Pins 2 and 1 of the communication chip U2; Pins 139 and 140 of the control chip U1 are communication pins, which are directly connected to the gateway audio output submodule ( Fig.25 ) pins 16 and 17 of chip U4; pins 73, 74, 28, 29 and 96 of control chip U1 are communication pins, which are directly connected to the gateway audio output submodule ( Fig.25 ) pins 7 to 11 of chip U4; pins 117, 118, 119, 123 and 80 of control chip U1 are display control pins, which are connected to the gateway display submodule ( Fig. 27 ) U9's 15th, 12th, 11th, 9th and 10th pins output control signals; the control chip U1's 85th, 86th, 114th, 115th, 58th, 59th, 60th and 63rd pins are data pins, which are connected to the gateway display submodule ( Fig. 27) U9's 17 to 24 pins, and output display data signals; the 16th, 38th, 51st, 61st, 83rd, 94th, 107th, 120th and 130th pins of the control chip U1 are all ground pins, and are directly grounded; the 71st pin of the control chip U1 is grounded through capacitor C37; the 143rd pin of the control chip U1 is directly connected to the power signal 3.3V; the 17th, 52nd, 39th, 62nd, 72nd, 84th, 95th, 108th, 121st, 131st and 144th pins of the control chip U1 are all power pins, and are directly connected to the power signal 3.3V and take power; the 31st pin of the control chip U1 is directly grounded; the 30th, 33rd and 32nd pins of the control chip U1 are power pins The control chip U1 is connected to the power supply pin and connected to the 3.3V power supply signal and takes power; the 25th pin of the control chip U1 is the reset signal pin, which is connected to the power supply signal through the pull-up resistor R12 to ensure the stability of the pin level; the 23rd and 24th pins of the control chip U1 are the crystal oscillator pins, which are connected to the crystal oscillator circuit composed of the crystal oscillator Y2, capacitors C16 and C21, and obtain the crystal oscillator signal; the 90th pin of the control chip U1 is the indication signal pin, which is connected to the power supply signal 3.3V through the resistor R20 and the LED lamp D4; the working indication of the control chip U1 is performed through the display status of the indicator light D4; the 11th pin of the control chip U1 is the remote control signal pin, which is connected to the gateway infrared receiving head module and receives the infrared signal IR_REMOTE.
[0122] like Fig.30 The schematic diagram of the circuit principle of the gateway network submodule in the system of the present invention is shown as follows: the gateway network submodule is a circuit composed of an Ethernet chip of model W5500 (labeled U3A and U3B in the figure) and a network transformer chip of model HR601680 (labeled L1 in the figure);
[0123] The 32nd, 33rd, 34th and 35th pins of the Ethernet chip U3A are communication pins, which are connected to the 44th, 41st, 42nd and 43rd pins of the control chip in the gateway control submodule and perform data exchange; the 36th pin of the Ethernet chip U3A is an interrupt signal pin, which is connected to the 49th pin of the control chip in the gateway control submodule and obtains the interrupt signal; the 37th pin of the Ethernet chip U3A is a reset signal pin, which is connected to the 50th pin of the control chip in the gateway control submodule and obtains the reset signal; at the same time, the 32nd, 36th and 37th pins of the Ethernet chip U3A are connected to the power signal 3.3V through their respective pull-up resistors to ensure that the lead The stability of the pin level; Pins 30 and 31 of the Ethernet chip U3A are crystal oscillator signal pins, which are connected to the crystal oscillator circuit composed of crystal oscillator Y3, resistor R58, capacitors C29 and C30, and obtain crystal oscillator signals; Pins 23, 38, 39, 40, 41 and 42 of the Ethernet chip U3A are grounded through their respective pull-down resistors (R32, R35, R39, R40, R41 and R57); Pins 1, 2, 5 and 6 of the Ethernet chip U3A are communication pins, which are connected to the network transformer chip L1 through their respective matching resistors (R21, R22, R25 and R28) and perform data exchange;
[0124] Pins 3, 9, 14, 16, 19 and 48 of Ethernet chip U3B are directly grounded; Pin 29 of Ethernet chip U3A is directly grounded; Pin 28 of Ethernet chip U3A is a power pin, which is directly connected to the 3.3V power signal and draws power; Pins 4, 8, 11, 15, 17 and 21 of Ethernet chip U3A are power pins, which are directly connected to the power signal VCC3.3E and draw power;
[0125] Pins 1, 3, 6 and 7 of the network transformer chip L1 are filtered by their respective filter capacitors (C55, C56, C57 and C58) and then connected to pins 1, 2, 5 and 6 of the Ethernet chip U3A; pin 2 of the network transformer chip L1 is connected to the 3.3V power signal through a pull-up resistor R61; pin 7 of the network transformer chip L1 is grounded through a capacitor; pins 6 and 8 of the network transformer chip L1 are grounded through TVS tubes D7 and D8 and are protected from overvoltage; the power supply requirement of the network transformer chip L1 is an independent power supply, so the power supply of the network transformer chip L1 is VCC3.3E, and the power supply signal VCC3.3E is connected and isolated from the normal power supply signal 3.3V through an inductor L5; pins 9, 11, 14 and 16 of the network transformer chip L1 are communication pins, which are connected to the isolated network sub-module through interface J2, and data is exchanged with the outside through the isolated network sub-module.
[0126] like Fig.31The figure shows a schematic diagram of the circuit principle of the isolated audio submodule in the system of the present invention: the isolated audio submodule is a circuit composed of an audio transformer; the dotted line part in the figure is a dividing line, which divides the circuit into several parts; from left to right in the figure, the divided parts are the output port, the bridge stack and the voltage regulator diode part, the metal film resistor matching part, the TVS tube protection part, the disposable fuse protection part, the isolation transformer part, the gas discharge tube part and the input port part;
[0127] The input port part is connected to the gateway audio output submodule and obtains the audio output signal; the obtained audio signal is successively protected by the gas discharge tube EPCOS1, the isolation transformer T1 for isolation protection, the disposable fuses F1 and F2 for overcurrent protection, the TVS tube D7~D9 for overvoltage protection, the resistors R1 and R2 for impedance matching, the bridge stack and the voltage regulator diodes D1~D3 for voltage regulation protection, and finally outputs a safe audio signal to the outside through the connector P1.
[0128] like Fig.32 The figure shows a schematic diagram of the circuit principle of the isolation network submodule in the system of the present invention: the isolation network submodule is a circuit composed of a network transformer chip of model HR601680; the dotted lines in the figure divide the circuit into several parts; in the figure, from left to right are the input port part, the gas discharge tube part, the network transformer part, the self-recovery insurance part, the TVS overvoltage protection part, the metal film resistor matching part, the bridge stack and the voltage regulator diode protection part and the output port part;
[0129] The input port P1 is connected to the gateway network submodule and obtains the corresponding communication signal; after the communication signal enters the isolation network submodule, it is protected by the gas discharge tube, the network transformers L1 and L2 for isolation protection, the self-recovery fuses F1~F4 for overcurrent protection, the TVS tubes D1~D3 for overvoltage protection, the resistors R1, R3, R5 and R8 for current limiting protection, and finally the bridge stack and the voltage stabilizing diodes D4~D6, D10~D12 for voltage stabilization protection, and finally connected to the external device through the connector PRJ1 for secure communication and data exchange.
[0130] like Fig.33 The method flow diagram of the method of the present invention is shown as follows: the monitoring method of the data monitoring system based on the fireworks and firecrackers automated production line disclosed in the present invention comprises the following steps:
[0131] S1. Release static electricity from the staff and monitor the static electricity release information;
[0132] S2. Monitor the cable temperature and current data of the fireworks and firecrackers automation production line;
[0133] S3. Monitor the temperature and humidity data of the fireworks and firecrackers automated production line;
[0134] S4. Collect and send the monitoring data information of steps S1 to S3 to complete the data monitoring of the fireworks and firecrackers automated production line.
Claims
1. A data monitoring system for an automated fireworks production line, characterized in that It includes an intrinsically safe power supply module, an electrostatic discharge module, a mechanical monitoring module, a temperature and humidity sensor module, a gateway module and an isolation fence module; the intrinsically safe power supply module is connected to an external power supply; the output ends of the electrostatic discharge module, the mechanical monitoring module and the temperature and humidity sensor module are all connected to the input end of the gateway module, and the output end of the gateway module is connected to the input end of the isolation fence module; the intrinsically safe power supply module is used to convert the external input power into a power supply signal, and to supply power to the electrostatic discharge module, the mechanical monitoring module, the temperature and humidity sensor module, the gateway module and the isolation fence module; the electrostatic discharge module is used for the electrostatic discharge of the staff, and monitors the number of electrostatic discharges and uploads them to the gateway module; the mechanical monitoring module is used to monitor the cable temperature and current data of the fireworks and firecrackers automation production line, and upload the monitoring data to the gateway module; The temperature and humidity sensor module is used to monitor the temperature and humidity data of the fireworks and firecrackers automated production line, and upload the monitoring data to the gateway module; The gateway module is used to receive signals uploaded by the electrostatic release module, mechanical monitoring module and temperature and humidity sensor module, play prompts or warning sounds through the audio output sub-module after logical judgment, and forward the received signals to the isolation fence module; the isolation fence module is used to isolate the signals uploaded by the gateway module and send them to the outside to complete the data monitoring of the fireworks and firecrackers automated production line.
2. The data monitoring system for the fireworks and firecrackers automated production line according to claim 1 is characterized in that The intrinsically safe power supply module includes a 12V output submodule, an output voltage sampling submodule, an output current sampling submodule, an overvoltage and overcurrent protection submodule, and an output control submodule; The 12V output submodule is used to convert external input electrical energy into a 12V power supply, and supply power to the outside through the output control submodule; the output voltage sampling submodule is used to sample the voltage of the output 12V power supply, and upload the sampling signal to the overvoltage and overcurrent protection submodule; the output current sampling submodule is used to sample the current of the output 12V power supply, and upload the sampling signal to the overvoltage and overcurrent protection submodule; the overvoltage and overcurrent protection submodule is used to perform overvoltage and overcurrent protection of the 12V power supply according to the received sampling signal, and upload the protection signal to the output control submodule; The output control submodule is used to control the output of 12V power supply; The 12V output submodule is a circuit composed of a power chip model VPC2187; the output voltage sampling submodule is a circuit composed of a resistor voltage divider circuit; the output current sampling submodule is a sampling circuit composed of an operational amplifier and a resistor; the overvoltage and overcurrent protection submodule is a circuit composed of a comparator chip model TLV3202 and a timer chip model CD4538; the output control submodule is a switching circuit composed of a transistor.
3. The data monitoring system for the fireworks and firecrackers automated production line according to claim 2 is characterized in that The electrostatic discharge module includes an electrostatic discharge power submodule, an electrostatic discharge control submodule, an electrostatic discharge communication submodule and an electrostatic discharge inductor submodule; The electrostatic discharge power supply submodule is used to supply power to the electrostatic discharge module; The electrostatic discharge inductor submodule is used for the electrostatic discharge of the staff, and monitors the discharge times and uploads them to the electrostatic discharge control submodule; The electrostatic discharge control submodule is used to receive the uploaded electrostatic discharge times and upload the data to the gateway module through the electrostatic discharge communication submodule; The electrostatic discharge communication submodule is used for communication between the electrostatic discharge control submodule and the gateway module; The electrostatic discharge power submodule is a circuit composed of a power chip of model FR9889; The electrostatic release control submodule is a circuit composed of a control chip of model STM32G030C8T6; the electrostatic release communication submodule is a communication circuit composed of a communication chip of model BL3085B; and the electrostatic release inductance submodule is a circuit composed of a chip of model ICM7555MM / TR.
4. The data monitoring system for the fireworks and firecrackers automated production line according to claim 3 is characterized in that The mechanical monitoring module includes a mechanical monitoring power supply submodule, a mechanical monitoring current sampling submodule, a mechanical monitoring cable temperature sampling submodule, a mechanical monitoring control submodule and a mechanical monitoring communication submodule; The mechanical monitoring power supply submodule is used to supply power to the mechanical monitoring module; the mechanical monitoring current sampling submodule is used to monitor the current signal of the fireworks and firecrackers automated production line, and upload the monitoring signal to the mechanical monitoring control submodule; The mechanical monitoring cable temperature sampling submodule is used to monitor the cable temperature signal of the fireworks and firecrackers automation production line, and upload the monitoring signal to the mechanical monitoring control submodule; The mechanical monitoring and control submodule is used to receive the uploaded monitoring signal and upload the signal to the gateway module through the mechanical monitoring communication submodule; the mechanical monitoring communication submodule is used for communication between the mechanical monitoring and control submodule and the gateway module; The mechanical monitoring power submodule is a circuit composed of a power chip model FR9889; The mechanical monitoring current sampling submodule is a circuit composed of a metering chip of model RN8032; the mechanical monitoring cable temperature sampling submodule is a circuit composed of a temperature sensor of model DS18B20; the mechanical monitoring control submodule is a circuit composed of a control chip of model STM32G030C8T6; the mechanical monitoring communication submodule is a communication circuit composed of a communication chip of model BL3085B.
5. The data monitoring system for the fireworks and firecrackers automated production line according to claim 4 is characterized in that The temperature and humidity sensor module includes a temperature and humidity power supply submodule, a temperature and humidity sensing submodule, a temperature and humidity control submodule, a temperature and humidity display submodule and a temperature and humidity communication submodule; The temperature and humidity power supply submodule is used to supply power to the temperature and humidity sensor module; the temperature and humidity sensor submodule is used to monitor the temperature and humidity data of the fireworks and firecrackers automated production line, and upload the monitoring signal to the temperature and humidity control submodule; The temperature and humidity control submodule is used to receive the uploaded monitoring signal, and display the temperature and humidity data through the temperature and humidity display submodule, and upload the temperature and humidity data to the gateway module through the temperature and humidity communication submodule; The temperature and humidity display submodule is used to display temperature and humidity data; the temperature and humidity communication submodule is used for communication between the temperature and humidity control submodule and the gateway module; The temperature and humidity power supply submodule is a circuit composed of a power supply chip of model FR9889; the temperature and humidity sensing submodule is a circuit composed of a temperature and humidity sensor of model HDC1080; the temperature and humidity control submodule is a circuit composed of a control chip of model STM32G030C8T6; the temperature and humidity display submodule is a circuit composed of an LCD driver chip of model HT1621B and a display screen of model QYT12429; the temperature and humidity communication submodule is a communication circuit composed of a communication chip of model BL3085B.
6. The data monitoring system for the fireworks and firecrackers automated production line according to claim 5 is characterized in that The gateway module includes a gateway power submodule, a gateway overvoltage protection submodule, a gateway communication submodule, a gateway audio interface submodule, a gateway audio output submodule, a gateway infrared receiver submodule, a gateway display submodule, a gateway storage submodule, a gateway control submodule and a gateway network submodule; The gateway power submodule is used to supply power to the gateway module; the gateway overvoltage protection submodule is used to protect the power signal output by the gateway power submodule from overvoltage; the gateway communication submodule is used to receive signals uploaded by the electrostatic discharge module, the mechanical monitoring module and the temperature and humidity sensor module, and forward the signals to the gateway control submodule and the gateway network submodule; the gateway audio interface submodule is used for data transmission between the gateway audio output submodule and the isolation barrier module; the gateway audio output submodule is used to receive audio signals, and upload the audio signals to the isolation barrier module through the gateway audio interface submodule; The gateway infrared receiving head submodule is used to receive infrared signals sent from the outside and upload the signals to the gateway control submodule; The gateway display submodule is used to receive the data sent by the gateway control submodule and display the data; the gateway storage submodule is used to store the data of the gateway module; The gateway control submodule is used to control the operation of the gateway module; the gateway network submodule is used to receive data sent by the gateway control submodule and receive signals uploaded by the electrostatic discharge module, the mechanical monitoring module and the temperature and humidity sensor module, and forward the data to the isolation barrier module; The gateway power submodule is a circuit composed of a power chip of model FR9609; the gateway overvoltage protection submodule is a circuit composed of a TVS tube; the gateway communication submodule is a communication circuit composed of a communication chip of model BL3085B; The gateway audio output submodule is a circuit composed of an audio decoder chip of model WM8978; the gateway infrared receiver submodule is a circuit composed of an infrared receiver of model IRM-H638T; The gateway display submodule is a circuit composed of a display screen with model number ILI9488; the gateway storage submodule is a circuit composed of a storage chip with model number FM25V02 and a storage chip with model number W25Q128FVSIG; the gateway control submodule is a circuit composed of a control chip with model number STM32F407ZGT6; the gateway network submodule is a circuit composed of an Ethernet chip with model number W5500 and a network transformer chip with model number HR601680.
7. The data monitoring system for the fireworks and firecrackers automated production line according to claim 6 is characterized in that The isolation fence module includes an isolation audio submodule and an isolation network submodule; The isolated audio submodule is used to send the received audio data to the outside after isolation; The isolated network submodule is used to send the received network data to the outside after isolation; The isolated audio submodule is a circuit composed of an audio transformer; the isolated network submodule is a circuit composed of a network transformer chip with model number HR601680.
8. A monitoring method based on the data monitoring system of the fireworks and firecrackers automated production line, characterized in that The steps include: S1. Release static electricity from the staff and monitor the static electricity release information; S2. Monitor the cable temperature and current data of the fireworks and firecrackers automation production line; S3. Monitor the temperature and humidity data of the fireworks and firecrackers automated production line; S4. Collect and send the monitoring data information of steps S1 to S3 to complete the data monitoring of the fireworks and firecrackers automated production line.
Citation Information
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