Heat dissipation module, radiator and server
By designing a heat dissipation module including a condenser and a heat dissipation component, and using the circulating flow of the phase-change working fluid for heat exchange, the problems of limited heat dissipation capacity and poor uniformity in traditional heat dissipation technology are solved, and efficient and uniform heat dissipation for high-heat flow density chips are achieved.
Patent Information
- Application Number
- CN202510213845.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2025-05-23
AI Technical Summary
The heat dissipation ability of traditional one-way cold plate liquid cooling is limited, which is difficult to meet the heat dissipation needs of high-heat flow density chips, and the heat dissipation uniformity is poor, resulting in large temperature differences between different chips.
A heat dissipation module is designed, including a condenser and at least two heat dissipation components. The heat dissipation component includes a heat dissipation plate, an air outlet pipe and a liquid return pipe. The heat exchange is performed between the condenser and the heat dissipation component through the circulating flow of the phase change working fluid to achieve continuous cooling of the heating device.
This solution effectively enhances the heat dissipation ability, ensures the uniformity of heat dissipation, avoids the temperature difference between heating devices, and meets the heat dissipation needs of high-heat flow density chips.
Smart Images
Figure CN120029424A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of server heat dissipation, and in particular to a heat dissipation module, a radiator and a server. Background Art
[0002] With the rapid development of information technology, the demand for AI computing power has gradually increased, and therefore the market demand for edge AI servers has also been increasing. Correspondingly, the power density of chips used for AI computing has been increasing. The increase in power will also be accompanied by an increase in heat generation. If electronic components work in a high-temperature environment for a long time, their working performance and stability will be greatly reduced.
[0003] In traditional technology, a one-way cold plate liquid cooling solution is usually used to provide heat dissipation services for chips with high heat flux density. However, the heat dissipation capacity of the one-way cold plate liquid cooling is extremely limited, and it is difficult to meet the heat dissipation needs of chips with gradually increasing heat generation. In addition, the heat dissipation uniformity is poor, resulting in large temperature differences between different chips. Summary of the invention
[0004] Based on this, it is necessary to provide a heat dissipation module, a radiator and a server to address the problems of limited heat dissipation capacity and poor heat dissipation uniformity.
[0005] In a first aspect of the present application, a heat dissipation module is provided, comprising:
[0006] A condenser, wherein the condenser is provided with an air inlet and a liquid outlet, wherein the air inlet and the liquid outlet are respectively arranged at two opposite ends of the condenser along the length direction of the heat dissipation module in a one-to-one correspondence, and the flow direction of the phase-change working medium in the condenser is consistent with the length direction and flows from the air inlet toward the liquid outlet; and
[0007] At least two heat dissipation components, at least two of the heat dissipation components are arranged side by side on one side of the condenser along the width direction of the heat dissipation module, the heat dissipation components include a heat dissipation plate, an air outlet pipe and a liquid return pipe, one end of the air outlet pipe is connected to the exhaust port of the heat dissipation plate, the other end of the air outlet pipe is connected to the air inlet, one end of the liquid return pipe is connected to the liquid outlet, and the other end of the liquid return pipe is connected to the liquid return port of the heat dissipation plate, and the heat dissipation component is used for heat transfer connection with the heating device.
[0008] In the heat dissipation module of the present solution, the heat dissipation components are respectively connected to the corresponding heating devices for heat transfer, and then at least two heat dissipation components are installed side by side and at intervals on one side of the condenser, the outlet pipe of each heat dissipation component connects the corresponding heat dissipation plate with the air inlet, and the return pipe connects the corresponding heat dissipation plate with the liquid outlet. When the heating device generates high-temperature heat during operation, the heat is transferred to the heat dissipation plate, so that the liquid phase change working medium in the heat dissipation plate absorbs the heat and heats up and vaporizes into high-temperature gas, and the high-temperature gas flows into the condenser through the outlet pipe; as the high-temperature gas flows in the condenser, the condenser exchanges heat with the high-temperature gas and the heat can be dissipated to the external environment, and the gas is cooled down and cooled And re-condensed into liquid phase change working fluid, the liquid phase change working fluid flows into the return pipe through the liquid outlet, and finally flows back to the heat sink; the above working process is repeated, which can achieve continuous cooling of the heating device, enhance the heat dissipation effect of the heating device, and meet the heat dissipation needs; in addition, since the phase change working fluid flows into one end of the condenser and flows out from the other end, the length direction of the condenser is fully utilized, the flow path of the phase change working fluid is extended, and a more sufficient heat exchange between the phase change working fluid and the condenser is achieved. Each heat dissipation component has the same heat dissipation performance, so the heat dissipation effect on each heating device is basically the same, ensuring the uniformity of heat dissipation and avoiding temperature differences between the heating devices.
[0009] The technical solution of this application is further described below:
[0010] In one of the embodiments, the heat dissipation module further includes an air separator, which is installed at the air inlet, and one end of all the air outlet pipes away from the heat dissipation plate is connected to the air separator.
[0011] In one embodiment, the gas distributor is provided with a gas homogenizing groove, the notch of the gas homogenizing groove is adapted to the size and shape of the gas inlet, and the mouth wall of the notch of the gas homogenizing groove is sealedly connected to the mouth wall of the gas inlet.
[0012] In one of the embodiments, the heat dissipation module further includes a water separator, which is installed at the liquid outlet, and one end of all the liquid return pipes away from the heat dissipation plate is connected to the water separator.
[0013] In one embodiment, the water distributor is provided with a water dividing groove, the notch of the water dividing groove is adapted to the size and shape of the liquid outlet, and the mouth wall of the notch of the water dividing groove is sealedly connected to the mouth wall of the liquid outlet.
[0014] In one embodiment, the condenser comprises a condensation shell and a plurality of condensation plates, wherein the plurality of condensation plates are arranged inside the condensation shell in parallel and spaced apart along the width direction, and a condensation flow channel is formed between two adjacent condensation plates;
[0015] Alternatively, the condenser includes a condensation shell and a plurality of condensation plates, wherein the plurality of condensation plates are arranged inside the condensation shell in a side-by-side manner along the width direction, a condensation flow channel is formed between two adjacent condensation plates, and a accommodating cavity is formed inside all of the condensation plates, wherein a flowable cooling medium is arranged in the accommodating cavity.
[0016] In one of the embodiments, the heat sink includes a heat sink shell and at least two heat sink fins. The heat sink shell forms an installation cavity inside. At least two heat sink fins are installed in the installation cavity and are arranged side by side along the width direction. A liquid flow channel is formed between two adjacent heat sink fins.
[0017] In one embodiment, the heat sink further includes a mounting assembly, which includes a mounting piece and an elastic piece. The heat sink shell is provided with a mounting through hole, and the mounting piece can be movably inserted into the mounting through hole. The elastic piece abuts between the heat sink shell and the mounting piece.
[0018] In a second aspect of the present application, a heat sink is provided, which includes at least two heat dissipation modules as described above, and at least two of the heat dissipation modules are arranged side by side along a preset direction.
[0019] In a third aspect of the present application, a server is further provided, comprising:
[0020] A device module, wherein the device module includes a heating device; and
[0021] The heat sink as described above cooperates with the heat-generating device in heat transfer. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application.
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0024] Figure 1 Schematic diagram of the structure of the heat dissipation module described in one embodiment of the present application.
[0025] Figure 2 for Figure 1 Schematic diagram of the structure from another perspective.
[0026] Figure 3This is a schematic diagram of a partial explosion structure of a heat dissipation module.
[0027] Figure 4 for Figure 3 Schematic diagram of the structure from another perspective.
[0028] Figure 5 This is another schematic diagram of a partial explosion structure of a heat dissipation module.
[0029] Description of reference numerals:
[0030] 100. Heat dissipation module. 10. Condenser; 11. Air inlet; 12. Liquid outlet; 13. Condenser housing; 14. Condenser plate; 15. Condenser flow channel; 20. Heat dissipation assembly; 21. Heat dissipation plate; 211. Heat dissipation housing; 211a. Mounting through hole; 212. Heat dissipation fin; 213. Mounting member; 214. Elastic member; 22. Air outlet pipe; 23. Liquid return pipe; 30. Air distributor; 31. Air uniformity tank; 40. Water distributor; 41. Water distribution tank. DETAILED DESCRIPTION
[0031] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0032] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0033] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0034] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0035] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0036] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.
[0037] See also Figure 1 and Figure 2 , a heat dissipation module 100 is shown in an embodiment of the present application, including a condenser 10 and at least two heat dissipation components 20.
[0038] Please continue reading Figure 3 and Figure 4The condenser 10 is provided with an air inlet 11 and a liquid outlet 12, which are respectively arranged at the opposite ends of the condenser 10 along the length direction of the heat dissipation module 100 in a one-to-one correspondence. The flow direction of the phase-change working medium in the condenser 10 is consistent with the length direction, and is from the air inlet 11 to the liquid outlet 12; at least two heat dissipation components 20 are arranged side by side on one side of the condenser 10 along the width direction of the heat dissipation module 100, and the heat dissipation component 20 includes a heat dissipation plate 21, an air outlet pipe 22 and a liquid return pipe 23, one end of the air outlet pipe 22 is connected to the exhaust port of the heat dissipation plate 21, the other end of the air outlet pipe 22 is connected to the air inlet 11, one end of the liquid return pipe 23 is connected to the liquid outlet 12, and the other end of the liquid return pipe 23 is connected to the liquid return port of the heat dissipation plate 21, and the heat dissipation component 20 is used for heat transfer connection with the heating device.
[0039] It should be noted that the phase change working fluid in this application is specifically water. When water absorbs heat and heats up, it vaporizes into gas, and the gas enters the condenser 10 to perform heat exchange with the condenser 10. The temperature carried by the gas is absorbed and dissipated, so that the gas temperature drops and condenses into water again.
[0040] That is to say, water continuously switches between gas and liquid forms in the circulation loop formed by the condenser 10 and the heat dissipation component 20, which can continuously and uninterruptedly absorb heat and cool the heating device, ensuring excellent heat dissipation and cooling of the heating device.
[0041] Optionally, the heat generating device in the present application may be, but is not limited to, a chip.
[0042] In summary, the implementation of the technical solution of this embodiment will achieve the following beneficial effects: in the heat dissipation module 100 of this solution, the heat dissipation components 20 are respectively connected to the corresponding heating devices for heat transfer, and then at least two heat dissipation components 20 are installed side by side and spaced apart on one side of the condenser 10, and the air outlet pipe 22 of each heat dissipation component 20 connects the corresponding heat dissipation plate 21 with the air inlet 11, and the liquid return pipe 23 connects the corresponding heat dissipation plate 21 with the liquid outlet 12. When the heating device generates high-temperature heat during operation, the heat is transferred to the heat dissipation plate 21, so that the liquid phase change medium in the heat dissipation plate 21 After absorbing heat, it heats up and vaporizes into high-temperature gas, which flows into the condenser 10 through the outlet pipe 22; as the high-temperature gas flows in the condenser 10, the condenser 10 exchanges heat with the high-temperature gas and dissipates the heat to the external environment, and the gas is cooled and re-condensed into a liquid phase-change working fluid, which flows into the return pipe 23 through the liquid outlet 12 and finally flows back to the heat sink 21; the above working process is repeated in a cycle, which can achieve continuous cooling of the heating device, enhance the heat dissipation effect of the heating device, and meet the heat dissipation needs.
[0043] In addition, since the phase change medium flows into one end of the condenser 10 and flows out of the other end, the length direction of the condenser 10 is fully utilized, the flow path of the phase change medium is extended, and a more complete heat exchange between the phase change medium and the condenser 10 is achieved. Each heat dissipation component 20 has the same heat dissipation performance, so the heat dissipation effect on each heating device is basically the same, ensuring the uniformity of heat dissipation and avoiding temperature differences between the heating devices.
[0044] In the present application, the condenser 10 is a rectangular parallelepiped structure, and at least two heat dissipation components 20 are arranged together on one side of one of the sides with the largest surface area of the condenser 10. The air inlet 11 and the liquid outlet 12 are respectively opened at opposite ends of the length direction of the side with the largest surface area, and the air inlet 11 and the liquid outlet 12 are both connected to the condensation chamber.
[0045] Moreover, the lengths of the air inlet 11 and the liquid outlet 12 are both equal to the width of the condenser 10. With this arrangement, on the one hand, it can be ensured that the gas can effectively fill the entire cross-section of the condenser 10 as soon as it flows into the condenser 10 from the air inlet 11, thereby ensuring the gas condensation efficiency. On the other hand, the water formed by condensation can also flow out quickly and completely from the liquid outlet 12, thereby avoiding water residue and reducing the water flow involved in the cooling operation, thereby affecting the overall heat dissipation efficiency of the heat dissipation module 100.
[0046] Please continue reading Figure 1 , Figure 3 and Figure 4 On the basis of the above embodiment, the heat dissipation module 100 further includes an air distributor 30, which is installed at the air inlet 11, and one end of all the air outlet pipes 22 away from the heat dissipation plate 21 is connected to the air distributor 30. The high-temperature gas transmitted from each air outlet pipe 22 is gathered in the air distributor 30, and the air distributor 30 divides and diffuses the high-temperature gas, so that the high-temperature gas can flow into the condenser 10 through the entire air inlet 11, thereby expanding the heat exchange area to ensure the condensation efficiency.
[0047] Specifically, the gas distributor 30 is provided with a uniform gas groove 31, the notch of the uniform gas groove 31 is adapted to the size and shape of the air inlet 11, and the mouth wall of the notch of the uniform gas groove 31 is sealed and connected to the mouth wall of the air inlet 11. Therefore, the high-temperature gas sent into the gas distributor 30 by the outlet pipe 22 quickly fills the uniform gas groove 31, and then flows from the uniform gas groove 31 to the air inlet 11, so that the high-temperature gas can be effectively distributed over the entire cross section of the condenser 10.
[0048] In addition, in another embodiment, the heat dissipation module 100 further includes a water divider 40, which is installed at the liquid outlet 12, and one end of all liquid return pipes 23 away from the heat dissipation plate 21 is connected to the water divider 40. The water after the gas condenses and liquefies flows into the water divider 40, and the water divider 40 has a diversion effect on the water, so that the amount of water flowing into each liquid return pipe 23 is equal, thereby ensuring that each heat dissipation plate 21 has a consistent heat dissipation effect on the heat generating device connected to it, and avoiding temperature differences between the heat generating devices.
[0049] Specifically, the water distributor 40 is provided with a water distribution groove 41, the notch of the water distribution groove 41 is adapted to the size and shape of the liquid outlet 12, and the mouth wall of the notch of the water distribution groove 41 is sealed and connected to the mouth wall of the liquid outlet 12. In this way, there are no corners or other structures around the liquid outlet 12 that will form a water accumulation effect, so that all the water produced by condensation can flow into the water distribution groove 41, and then evenly divided and flow into each return liquid pipe 23, ensuring that the amount of liquid participating in the heat absorption and cooling of the heating device in each heat sink 21 is consistent, so that the cooling effect of each heating device is consistent, and temperature difference is avoided.
[0050] Please continue reading Figure 1 and Figure 2 In addition, based on any of the above embodiments, in an optional embodiment, the condenser 10 includes a condensation shell 13 and a plurality of condensation plates 14, wherein the plurality of condensation plates 14 are arranged side by side and spaced apart along the width direction inside the condensation shell 13, and a condensation flow channel 15 is formed between two adjacent condensation plates 14. The high-temperature gas flows into the condensation shell 13 and exchanges heat with the condensation plates 14. The condensation plates 14 absorb heat and dissipate the heat to the external environment through the condensation shell 13, and the gas is cooled and condensed into water.
[0051] Alternatively, as an alternative to the above embodiment, the condenser 10 includes a condensation shell 13 and a plurality of condensation plates 14, wherein the plurality of condensation plates 14 are arranged side by side and spaced apart along the width direction inside the condensation shell 13, a condensation flow channel 15 is formed between two adjacent condensation plates 14, and a receiving cavity is formed inside all the condensation plates 14, wherein a flowable cooling medium is arranged in the receiving cavity. The difference from the above embodiment is that the cooling medium contained in the condensation plates 14 performs heat exchange with the gas, thereby absorbing heat and cooling the gas, and condensing the gas into water.
[0052] Please continue reading Figure 5 In one embodiment, the heat sink 21 includes a heat sink shell 211 and at least two heat sink fins 212. The heat sink shell 211 forms an installation cavity inside. At least two heat sink fins 212 are installed in the installation cavity and arranged side by side along the width direction. A liquid flow channel is formed between two adjacent heat sink fins 212.
[0053] When in use, the heat dissipation shell 211 is directly attached to the chip to be dissipated or indirectly contacted through a heat transfer medium (such as thermal conductive glue), so that the high-temperature heat generated by the chip can be conducted to the heat dissipation shell 211, and the heat is further conducted to the heat dissipation fins 212 to exchange heat with the coolant in the installation cavity. The coolant absorbs heat and heats up and vaporizes into gas, thereby cooling the chip; the produced high-temperature gas flows into the condenser 10 and is re-condensed into coolant, and then flows back to the heat dissipation shell 211, thereby realizing recycling and continuous heat dissipation of the chip.
[0054] Furthermore, the heat sink 21 also includes a mounting assembly, which includes a mounting member 213 and an elastic member 214 . The heat sink shell 211 is provided with a mounting through hole 211a , and the mounting member 213 can be movably inserted into the mounting through hole 211a . The elastic member 214 abuts between the heat sink shell 211 and the mounting member 213 .
[0055] Therefore, the heat sink 21 can be installed on the mainboard through the mounting assembly, so that the heat dissipation housing 211 and the chip can cooperate in heat transfer.
[0056] Specifically, the mounting member 213 is inserted into the mounting through hole 211a and fixedly connected to the mainboard, at which time the elastic member 214 is compressed to store energy; when the heat sink 21 is removed, the mounting member 213 is loosened from the mainboard, and the elastic member 214 releases the elastic force to automatically move away from the mainboard.
[0057] For example, the mounting member 213 is a threaded component such as a screw or a bolt to reduce the difficulty of installation and disassembly while ensuring the connection strength.
[0058] Preferably, there are multiple mounting components, for example, four mounting components; the four mounting components are arranged in a rectangular shape around the outer circumference of the heat dissipation housing 211, thereby further improving the connection reliability by increasing the number of connection points with the mainboard.
[0059] In addition to the above, the present application also provides a server, including a device module, the device module including a heating device; and a heat sink, the heat sink and the heating device cooperate in heat transfer. The heat sink includes at least two heat dissipation modules 100 as above, and at least two heat dissipation modules 100 are arranged side by side along a preset direction.
[0060] The functional device module specifically includes a mainboard and a chip. The chip refers to the heat generating device, and the chip is installed on the mainboard.
[0061] There may be multiple chips on the mainboard arranged in an array, so a heat sink formed by at least two heat dissipation modules 100 can simultaneously meet the heat dissipation and cooling needs of multiple chips.
[0062] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0063] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A heat dissipation module, characterized in that: include: A condenser, wherein the condenser is provided with an air inlet and a liquid outlet, wherein the air inlet and the liquid outlet are respectively arranged at opposite ends of the condenser along the length direction of the heat dissipation module in a one-to-one correspondence, and the flow direction of the phase-change working medium in the condenser is consistent with the length direction and flows from the air inlet toward the liquid outlet; as well as At least two heat dissipation components, at least two of the heat dissipation components are arranged side by side on one side of the condenser along the width direction of the heat dissipation module, the heat dissipation components include a heat dissipation plate, an air outlet pipe and a liquid return pipe, one end of the air outlet pipe is connected to the exhaust port of the heat dissipation plate, the other end of the air outlet pipe is connected to the air inlet, one end of the liquid return pipe is connected to the liquid outlet, and the other end of the liquid return pipe is connected to the liquid return port of the heat dissipation plate, and the heat dissipation component is used for heat transfer connection with the heating device.
2. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module also includes an air distributor, which is installed at the air inlet, and one end of all the air outlet pipes away from the heat dissipation plate is connected to the air distributor.
3. The heat dissipation module according to claim 2, characterized in that: The gas distributor is provided with a gas-uniform groove, the notch of the gas-uniform groove is adapted to the size and shape of the gas inlet, and the mouth wall of the notch of the gas-uniform groove is sealedly connected to the mouth wall of the gas inlet.
4. The heat dissipation module according to claim 1, characterized in that: The heat dissipation module also includes a water distributor, which is installed at the liquid outlet, and one end of all the liquid return pipes away from the heat dissipation plate is connected to the water distributor.
5. The heat dissipation module according to claim 4, characterized in that: The water distributor is provided with a water distribution groove, the notch of the water distribution groove is adapted to the size and shape of the liquid outlet, and the mouth wall of the notch of the water distribution groove is sealedly connected to the mouth wall of the liquid outlet.
6. The heat dissipation module according to claim 1, characterized in that: The condenser comprises a condensation shell and a plurality of condensation plates, wherein the plurality of condensation plates are arranged side by side and spaced apart along the width direction inside the condensation shell, and a condensation flow channel is formed between two adjacent condensation plates; Alternatively, the condenser includes a condensation shell and a plurality of condensation plates, wherein the plurality of condensation plates are arranged inside the condensation shell in a side-by-side manner along the width direction, a condensation flow channel is formed between two adjacent condensation plates, and a accommodating cavity is formed inside all of the condensation plates, wherein a flowable cooling medium is arranged in the accommodating cavity.
7. The heat dissipation module according to claim 1, characterized in that: The heat sink comprises a heat sink shell and at least two heat sink fins. The heat sink shell forms an installation cavity inside. At least two heat sink fins are installed in the installation cavity and arranged side by side along the width direction. A liquid flow channel is formed between two adjacent heat sink fins.
8. The heat dissipation module according to claim 7, characterized in that: The heat sink also includes a mounting assembly, which includes a mounting piece and an elastic piece. The heat sink housing is provided with a mounting through hole, the mounting piece can be movably inserted into the mounting through hole, and the elastic piece abuts between the heat sink housing and the mounting piece.
9. A radiator, characterized in that: It comprises at least two heat dissipation modules according to any one of claims 1 to 8, and at least two of the heat dissipation modules are arranged side by side along a preset direction.
10. A server, characterized in that: include: A device module, wherein the device module includes a heating device; as well as The heat sink as claimed in claim 9, wherein the heat sink cooperates with the heat generating device in heat transfer.