Heat dissipation method and system, electronic equipment and medium

Abstract

The invention provides a heat dissipation method which can be applied to the technical field of heat dissipation and servers. The heat dissipation method comprises the steps of generating a control signal for adjusting the heat dissipation intensity of a target heat dissipation device under the condition of determining that target equipment is in an overclocking mode, and sending the control signal to the target heat dissipation device, so that the target heat dissipation device executes heat dissipation operation according to the control signal; in response to a received current equipment state value representing the current state of the target equipment from the universal controller, identifying the heat dissipation demand of the target equipment by using a historical equipment state value and the current equipment state value received at a historical moment to obtain an identification result; and under the condition that the identification result represents that the current heat dissipation requirement of the target equipment meets the preset heat dissipation condition, updating the control signal, generating an updated control signal, and sending the updated control signal to the target heat dissipation device. The invention further provides a heat dissipation system, electronic equipment and a storage medium.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation and server technology, and in particular to a heat dissipation method, a heat dissipation system, an electronic device and a storage medium. Background Art

[0002] With the continuous development of computer technology, more and more devices support overclocking mode. When the device is in overclocking mode, the processing power of the device can be improved, which can improve the user's work and entertainment experience.

[0003] However, when the device is in overclocking mode, it is easy to cause the device temperature to rise suddenly, causing overheating, which in turn causes device loss or triggers an over-temperature alarm. Summary of the invention

[0004] In view of the above problems, the present application provides a heat dissipation method, system, device, medium, overclocking controller and program product that improve the heat dissipation capability of a target device in overclocking mode while reducing the power consumption of a heat dissipation device.

[0005] According to a first aspect of the present application, a heat dissipation method is provided, comprising:

[0006] When it is determined that the target device is in the overclocking mode, a control signal for adjusting the heat dissipation intensity of the target heat dissipation device is generated and sent to the target heat dissipation device so that the target heat dissipation device performs a heat dissipation operation according to the control signal;

[0007] In response to receiving a current device state value representing a current state of the target device from the universal controller, identifying a heat dissipation requirement of the target device using a historical device state value received at a historical moment and the current device state value to obtain an identification result; and

[0008] When the identification result indicates that the current heat dissipation demand of the target device meets the preset heat dissipation condition, the control signal is updated to generate an updated control signal, and the updated control signal is sent to the target heat dissipation device.

[0009] According to an embodiment of the present application, the historical device status value received at the historical moment and the current device status value are used to identify the heat dissipation requirement of the target device, and the identification result is obtained, including:

[0010] Using the historical device status value received at the historical moment and the above current device status value, a status difference is obtained; and

[0011] Based on the state difference, the recognition result is determined.

[0012] According to an embodiment of the present application, the device state value includes a device temperature value, and the state difference value includes a device temperature difference value;

[0013] The above-mentioned identification result is determined based on the above-mentioned state difference, including:

[0014] In the case where the temperature difference of the device is less than a predetermined temperature threshold, it is determined that the identification result indicates that the current heat dissipation demand of the target device meets the preset heat dissipation condition.

[0015] According to an embodiment of the present application, the above-mentioned generating a control signal for adjusting the heat dissipation intensity of the target heat dissipation device includes:

[0016] Determining a heat dissipation intensity value that matches the device type of the target device according to a predetermined mapping relationship; and

[0017] Based on the heat dissipation intensity value, a control signal for adjusting the heat dissipation intensity of the target heat dissipation device is generated.

[0018] According to an embodiment of the present application, the above-mentioned control signal is updated to generate an updated control signal, including:

[0019] Based on the device type of the target device, the historical device status value and the current device status value, updating the heat dissipation intensity value corresponding to the control signal to obtain an updated heat dissipation intensity value; and

[0020] Based on the updated heat dissipation intensity value, the updated control signal is generated.

[0021] According to an embodiment of the present application, the above method further includes:

[0022] determining the target device in the overclocking mode from among the plurality of devices;

[0023] Determining the device location of the target device based on the device identification of the target device; and

[0024] The target heat dissipation device is determined from a plurality of heat dissipation devices according to the device position of the target device.

[0025] According to an embodiment of the present application, the above method further includes:

[0026] Acquire, from the target device, a signal indicating that the target device is in an overclocking mode; or

[0027] Obtain the above signal from the register of the above target device;

[0028] The above signal is determined by using the above target device in the following manner:

[0029] Determine the operating frequency of the above target device; and

[0030] When it is determined that the operating frequency of the above target device is greater than the rated frequency of the above target device, generate the above signal for characterizing that the above target device is in the overclocking mode.

[0031] The second aspect of the present application provides a heat dissipation system, including:

[0032] At least one heat dissipation device for heat dissipation;

[0033] A general controller for monitoring the states of the above target device at different times when the above target device is in the overclocking mode to obtain a plurality of device state values; and

[0034] An overclocking controller for generating a control signal for adjusting the heat dissipation intensity of the above target heat dissipation device and sending it to the target heat dissipation device in at least one of the above heat dissipation devices when it is determined that the target device is in the overclocking mode, so that the target heat dissipation device performs a heat dissipation operation according to the above control signal; in response to receiving the current device state value characterizing the current state of the above target device from the above general controller; using the historical device state value received at the historical moment and the above current device state value to identify the heat dissipation requirement of the above target device to obtain an identification result; and when the above identification result characterizes that the current heat dissipation requirement of the above target device meets the preset heat dissipation condition, updating the above control signal to generate an updated control signal and sending the updated control signal to the above target heat dissipation device.

[0035] The third aspect of the present application provides an electronic device, including: one or more processors; a memory for storing one or more computer programs, wherein the above one or more processors execute the above one or more computer programs to implement the steps of the above method.

[0036] The fourth aspect of the present application further provides a computer-readable storage medium, on which a computer program or instruction is stored, and when the above computer program or instruction is executed by a processor, the steps of the above method are implemented.

[0037] The fifth aspect of the present application further provides an overclocking controller, including:

[0038] An overclocking heat dissipation module for generating a control signal for adjusting the heat dissipation intensity of a target heat dissipation device and sending it to the above target heat dissipation device when it is determined that the target device is in the overclocking mode, so that the target heat dissipation device performs a heat dissipation operation according to the above control signal;

[0039] an identification module, configured to, in response to receiving a current device state value representing a current state of the target device from the universal controller, identify the heat dissipation requirement of the target device using the historical device state value received at a historical moment and the current device state value, and obtain an identification result; and

[0040] The fine-tuning module is used to update the control signal, generate an updated control signal, and send the updated control signal to the target cooling device when the recognition result indicates that the current cooling demand of the target device meets the preset cooling condition.

[0041] The sixth aspect of the present application also provides a computer program product, including a computer program or instructions, which implement the steps of the above method when the above computer program or instructions are executed by a processor. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The above contents and other purposes, features and advantages of the present application will become more apparent through the following description of the embodiments of the present application with reference to the accompanying drawings, in which:

[0043] Figure 1 A schematic diagram showing an application scenario of a heat dissipation method and a heat dissipation system according to an embodiment of the present application is shown;

[0044] Figure 2 A flow chart of a heat dissipation method according to an embodiment of the present application is schematically shown;

[0045] Figure 3 A flow chart of a heat dissipation method according to another embodiment of the present application is schematically shown;

[0046] Figure 4 A schematic diagram of a communication method between an overclocking controller and a target device according to an embodiment of the present application is schematically shown;

[0047] Figure 5 A schematic diagram schematically shows the architecture of a device and a heat dissipation device according to an embodiment of the present application; and

[0048] Figure 6 A block diagram of an electronic device suitable for implementing a heat dissipation method according to an embodiment of the present application is schematically shown. DETAILED DESCRIPTION

[0049] Below, embodiments of the present application will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present application. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present application. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present application.

[0050] The terms used herein are only for describing specific embodiments and are not intended to limit the present application. The terms "include", "comprising", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0051] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0052] When using expressions such as "at least one of A, B, and C, etc.", they should generally be interpreted according to the meaning of the expression commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0053] With the advent of the era of big data, cloud computing, and artificial intelligence, the volume of Internet business and data has increased dramatically, and the amount of computing has also increased. In the server system, as the amount of data increases, the number of servers deployed is also increasing, the density is getting higher and higher, and the carrying pressure is also increasing. The business load also changes at any time, and the change range is large, and an overclocking mode will appear. When the target device in the server is in overclocking mode, the heat generation rises suddenly, and the internal temperature of the target device rises. However, the temperature that the target device can withstand is limited. If it runs in a high temperature environment for a long time, an over-temperature shutdown will occur. The consequences caused by this may include business interruption and data loss, which will cause greater losses.

[0054] An embodiment of the present application provides a heat dissipation method, comprising: when it is determined that a target device is in an overclocking mode, generating a control signal for adjusting the heat dissipation intensity of a target heat dissipation device, and sending the control signal to the target heat dissipation device so that the target heat dissipation device performs a heat dissipation operation according to the control signal; in response to receiving a current device status value representing the current state of the target device from a universal controller, using historical device status values ​​received at historical moments and current device status values ​​to identify the heat dissipation requirements of the target device and obtain an identification result; and when the identification result represents that the current heat dissipation requirement of the target device meets a preset heat dissipation condition, updating the control signal, generating an updated control signal, and sending the updated control signal to the target heat dissipation device.

[0055] An embodiment of the present application also provides a heat dissipation system, comprising: at least one heat dissipation device for dissipating heat; a universal controller for monitoring the state of the target device at different times when the target device is in an overclocking mode to obtain multiple device state values; and an overclocking controller for generating a control signal for adjusting the heat dissipation intensity of the target heat dissipation device when it is determined that the target device is in the overclocking mode, and sending the control signal to the target heat dissipation device in at least one heat dissipation device so that the target heat dissipation device performs a heat dissipation operation according to the control signal; in response to receiving a current device state value representing the current state of the target device from the universal controller; using the historical device state values ​​and the current device state values ​​received at historical times, the heat dissipation demand of the target device is identified to obtain an identification result; and when the identification result represents that the current heat dissipation demand of the target device meets the preset heat dissipation condition, the control signal is updated to generate an updated control signal, and the updated control signal is sent to the target heat dissipation device.

[0056] By using the heat dissipation method or heat dissipation system provided in the embodiment of the present application, when the target device is in the overclocking mode, a control signal can be generated to control the target heat dissipation device to perform heat dissipation in the overclocking heat dissipation operation mode on the target device, so that the target heat dissipation device can be used to perform heat dissipation in the overclocking heat dissipation operation mode on the target device. In addition, the device status value collected by the universal controller is used to identify the heat dissipation requirements of the target device, so that the control signal can be fine-tuned according to the identification result, while ensuring the heat dissipation stability of the target device in the overclocking mode, while reducing the energy consumption of the target heat dissipation device. This improves the stability and reliability of the product composed of the target device and the heat dissipation system, and improves the energy-saving and emission reduction performance of the product.

[0057] Figure 1 The application scenario diagram of the heat dissipation method and the heat dissipation system according to the embodiments of the present application is schematically shown.

[0058] like Figure 1As shown, the application scenario 100 according to this embodiment may include a target device 110 and a heat dissipation system 120 .

[0059] The target device 110 may include a heating element. For example, in a server scenario, the target device 110 may include a processor, a controller, or other heating elements, such as a central processing unit (CPU), a memory, a hard disk, a graphics card, a graphics processing unit (GPU), etc.

[0060] The heat dissipation system 120 may be used to dissipate heat for the target device. Exemplarily, the heat dissipation system may include at least one heat dissipation device 121 , a general controller 122 , and an overclocking controller 123 .

[0061] At least one heat sink 121 is used to dissipate heat for the target device 110. Optionally, the heat sink 121 may include a fan, but is not limited thereto, and may also include a heat pipe, as long as it is an element that plays a heat dissipation role. In the case where the heat sink 121 includes multiple heat sinks, the layout of the heat sink is not limited. For example, it may be array-type, randomly arranged, or arranged around the target device. As long as it can dissipate heat for the target device.

[0062] The general controller 122 is used to monitor the state of the target device 110 at different times when the target device 110 is in the overclocking mode, and obtain a plurality of device state values.

[0063] The overclocking controller 123 is used to generate a control signal for adjusting the heat dissipation intensity of the heat dissipation device 121 when it is determined that the target device 110 is in the overclocking mode, and send it to the target heat dissipation device in at least one heat dissipation device 121, so that the target heat dissipation device performs a heat dissipation operation according to the control signal; in response to receiving a current device status value representing the current status of the target device 110 from the general controller 122; using the historical device status value and the current device status value received at the historical moment, the heat dissipation demand of the target device 110 is identified to obtain an identification result; and when the identification result represents that the current heat dissipation demand of the target device 110 meets the preset heat dissipation condition, the control signal is updated to generate an updated control signal, and the updated control signal is sent to the target heat dissipation device.

[0064] The types of the general controller 122 and the overclocking controller 123 are not limited. For example, the general controller 122 and the overclocking controller 123 may respectively include at least one of the following: an integrated circuit chip (Microcontroller Unit, MCU), a baseboard management controller (Baseboard Management Controller, BMC), a computer chip (Power Line Communication, PLC) that transmits data and media signals through power lines, a complex programmable logic device (Complex Programmable Logic Device, CPLD) single-chip computer, etc.

[0065] Exemplarily, the general controller may include a BMC, and the overclocking controller may include a CPLD.

[0066] The universal controller can be combined with a universal server by configuring an overclocking controller on the universal server and establishing communication connections between the overclocking controller and the universal controller, the target device and the target cooling device. The additional devices are simple and easy to implement.

[0067] It should be noted that the heat dissipation method provided in the embodiment of the present application can generally be executed by an overclocking controller.

[0068] It should be understood that Figure 1 The number of target devices, target heat sinks, general controllers, and overclocking controllers in the embodiment is only illustrative. Any number of target devices, target heat sinks, general controllers, and overclocking controllers may be provided according to implementation requirements.

[0069] The following will be based on Figure 1 The scene described by Figure 2~Figure 5 The heat dissipation method of the disclosed embodiment is described in detail.

[0070] Figure 2 The flowchart of the heat dissipation method according to the embodiment of the present application is schematically shown.

[0071] like Figure 2 As shown, the heat dissipation method of this embodiment includes operations S210 to S230, and the heat dissipation method can be executed by an overclocking controller.

[0072] In operation S210, when it is determined that the target device is in the overclocking mode, a control signal for adjusting the heat dissipation intensity of the target heat dissipation device is generated and sent to the target heat dissipation device so that the target heat dissipation device performs a heat dissipation operation according to the control signal.

[0073] In operation S220, in response to receiving a current device state value representing a current state of the target device from the universal controller, the heat dissipation requirement of the target device is identified using the historical device state values ​​received at historical moments and the current device state value to obtain an identification result.

[0074] In operation S230, when the identification result indicates that the current heat dissipation demand of the target device meets the preset heat dissipation condition, the control signal is updated to generate an updated control signal, and the updated control signal is sent to the target heat dissipation device.

[0075] The target device may include electronic devices that generate heat, such as a central processing unit, a graphics processing unit, a network card, or other devices in a server.

[0076] The overclocking mode may include a working mode in which the operating frequency exceeds a predetermined frequency threshold, but is not limited thereto. It may also include a working mode in which the carrying pressure exceeds a predetermined pressure threshold or the data load exceeds a predetermined data volume threshold, as long as it is a working mode that can cause a sudden increase in heat.

[0077] When the target device is in the overclocking mode, the overclocking heat dissipation operation mode may be entered, for example, a control signal for adjusting the heat dissipation intensity of the target heat dissipation device to the overclocking heat dissipation intensity is generated, and the control signal is sent to the target heat dissipation device, so that the target heat dissipation device performs the heat dissipation operation according to the control signal.

[0078] When the target heat dissipation device is in the overclocking heat dissipation operation mode, the device status of the target device can be monitored by using the universal controller to obtain device status values ​​collected at different times.

[0079] The general controller sends the information to the overclocking controller, so that the overclocking controller can use multiple device status values ​​received at different times, such as historical device status values ​​received at historical times and current device status values, to identify the heat dissipation requirements of the target device and obtain an identification result. The identification result can indicate whether the current heat dissipation requirements of the target device meet the preset heat dissipation conditions.

[0080] When the identification result indicates that the current heat dissipation demand of the target device meets the preset heat dissipation condition, the control signal is updated to generate an updated control signal, and the updated control signal is sent to the target heat dissipation device, so that the target heat dissipation device performs the heat dissipation operation on the target device according to the updated control signal.

[0081] When the identification result indicates that the current heat dissipation demand of the target device does not meet the preset heat dissipation conditions, the control signal can be kept unchanged, and the target heat dissipation device can be continuously cooled by the heat dissipation intensity in the overclocking heat dissipation operation mode represented by the control signal.

[0082] By using the heat dissipation method provided in the embodiment of the present application, when the target device is in the overclocking mode, a control signal can be generated to control the target heat dissipation device to perform heat dissipation in the overclocking heat dissipation operation mode on the target device, so that the target heat dissipation device can be used to perform heat dissipation in the overclocking heat dissipation operation mode on the target device. In addition, the current device status value and the historical device status value collected by the universal controller are used to identify the current heat dissipation demand of the target device, so as to fine-tune the control signal according to the identification result, while ensuring the heat dissipation stability of the target device in the overclocking mode, and reducing the energy consumption of the target heat dissipation device. This improves the stability and reliability of the product composed of the target device and the heat dissipation system, and improves the energy-saving and emission reduction performance of the product.

[0083] According to the embodiments of the present application, Figure 2 The operation S210 of generating a control signal for adjusting the heat dissipation intensity of the target heat dissipation device may include: determining a heat dissipation intensity value matching the device type of the target device according to a predetermined mapping relationship, and generating a control signal for adjusting the heat dissipation intensity of the target heat dissipation device based on the heat dissipation emphasis value.

[0084] In a related embodiment, when it is determined that the target device is in overclocking mode, a control signal for adjusting the heat dissipation intensity of the target heat dissipation device can be generated according to a preset heat dissipation intensity value. However, it is not limited to this. A predetermined mapping relationship can also be constructed to determine the heat dissipation intensity value based on the device type and the predetermined mapping relationship.

[0085] For example, if the CPU or GPU is used as the target device, the heat dissipation intensity value can be set to the maximum rotation speed value of the target heat dissipation device. If the network card or graphics card is used as the target device, the heat dissipation intensity value can be set to 80% of the maximum rotation speed value of the target heat dissipation device.

[0086] Considering the different functions of the target devices, the types and quantities of the core components loaded are also different, which results in different heat generation, load pressure, and data volume load of the target devices in overclocking mode.

[0087] Based on the device type of the target device, the maximum variation range values ​​of the device heat, carrying pressure, data volume load, etc. of the target device in overclocking mode can be determined, and the heat dissipation intensity value can be determined based on multiple maximum variation range values.

[0088] By determining the heat dissipation intensity value based on multiple maximum variation amplitude values ​​and flexibly matching the heat dissipation intensity value suitable for the target device based on the device type, the effectiveness and pertinence of the generated control signal can be improved.

[0089] Compared with the method of directly determining the preset heat dissipation intensity value, different heat dissipation intensity values ​​are set for target devices of different device types, thereby improving the pertinence and effectiveness of the determined control signal, and avoiding the increase in energy consumption of the target heat dissipation device due to the heat dissipation intensity value being set too large, or the target heat dissipation device failing to achieve the expected heat dissipation effect due to the heat dissipation intensity value being set too small.

[0090] According to the embodiments of the present application, Figure 2 Operation S230 shown, using the current device state value and the historical device state value received at the historical moment to identify the heat dissipation demand of the target device and obtain the identification result, may include: using the historical device state value received at the historical moment and the current device state value to obtain the state difference value. Based on the state difference value, the identification result is determined.

[0091] Multiple device status values ​​received at different times can be arranged in time sequence to obtain a device status value sequence. Based on the device status value sequence, a state curve for characterizing the state trend of the target device in a predetermined historical period can be determined, and the recognition result can be determined based on the state curve. However, it is not limited to this. The state difference between the historical device status value received at the historical moment and the current device status value can also be obtained, and the recognition result can be determined based on the state difference.

[0092] For example, there is no limitation on the historical moment, for example, the 10th second from the current moment can be used as the historical moment, or the 5th second from the current moment can be used as the historical moment. Then, the current moment is 10 o'clock, and the historical moment is 9:59:50 or 9:59:55.

[0093] The state difference value may be obtained based on the current device state value corresponding to 10 o'clock and the historical device state value corresponding to 9:59:55. For example, the state difference value may be obtained by subtracting the historical device state value from the current device state value.

[0094] Based on the state difference, an identification result for characterizing whether the state of the device is getting better or worse is determined.

[0095] The state difference is used to determine the recognition result, and the quantifiable state difference is used to determine the recognition result used to characterize the change of the device state, thereby improving the accuracy and analyzability of the recognition result.

[0096] According to an embodiment of the present application, the device state value may include a device temperature value, and the state difference value may include a device temperature difference value.

[0097] According to an embodiment of the present application, determining the recognition result based on the state difference may include: when the device temperature difference is less than a predetermined temperature threshold, determining that the recognition result indicates that the current heat dissipation demand of the target device meets the preset heat dissipation condition. When the device temperature difference is greater than or equal to the predetermined temperature threshold, determining that the recognition result indicates that the current heat dissipation demand of the target device does not meet the preset heat dissipation condition.

[0098] For example, the predetermined temperature threshold may include 0. When the device temperature difference is less than 0, it is determined that the recognition result indicates that the target device is in a cooling state. When the device temperature difference is greater than 0, it is determined that the recognition result indicates that the target device is in a heating state. When the device temperature difference is equal to 0, it is determined that the recognition result indicates that the target device is in a stable state with a constant temperature. The target device being in a cooling state may be regarded as the current heat dissipation demand of the target device meeting the preset heat dissipation condition. The target device being in a heating state or a constant temperature state may be regarded as the current heat dissipation demand of the target device not meeting the preset heat dissipation condition.

[0099] According to the embodiments of the present application, by using the device temperature value as the device status value, the device temperature value can be easily detected, easily represented, and stable, thereby improving the effectiveness of the device status value as a quantitative indicator and thus improving the efficiency and accuracy of determining the recognition result. In addition, by setting a predetermined temperature threshold, the accuracy of the recognition result can be further improved.

[0100] Figure 3 The flowchart of a heat dissipation method according to another embodiment of the present application is schematically shown.

[0101] like Figure 3 As shown, the heat dissipation method includes operations S310 to S370.

[0102] In operation S310, when it is determined that the target device is in the overclocking mode, a control signal for adjusting the heat dissipation intensity of the target heat dissipation device is generated and sent to the target heat dissipation device so that the target heat dissipation device performs a heat dissipation operation according to the control signal.

[0103] In operation S320, the target device is monitored to determine whether the target device is in the overclocking mode at the current moment, so as to determine whether the target device is in the overclocking mode after a preset time period. If it is determined that the target device is in the overclocking mode, operation S330 is performed, otherwise, operation S370 is performed.

[0104] In operation S330, in response to receiving a current device state value representing a current state of the target device from the universal controller, the heat dissipation requirement of the target device is identified using the historical device state values ​​received at historical moments and the current device state value to obtain an identification result.

[0105] In operation S340, based on the recognition result, it is determined whether the current heat dissipation requirement of the target device meets the preset heat dissipation condition. If the recognition result indicates that the current heat dissipation requirement of the target device meets the preset heat dissipation condition, operation S350 is performed, otherwise, operation S360 is performed.

[0106] In operation S350, the control signal is updated to generate an updated control signal, and the updated control signal is sent to the target heat dissipation device.

[0107] In operation S360, the control signal is maintained unchanged.

[0108] In operation S370, a universal control instruction is sent to the universal controller, so that the universal controller generates a universal control signal for adjusting the heat dissipation intensity of the target heat dissipation device based on the universal heat dissipation strategy in response to the universal control instruction.

[0109] Taking the application of the heat dissipation method in the server as an example, the BMC (Baseboard Management Controller) can be used as a universal controller to monitor and manage the health status of the target device. Some parameters of the target device, such as voltage, temperature, and power consumption, can be monitored and recorded by the universal controller. When the target device is in normal mode, the universal controller can be used to generate a universal heat dissipation strategy, and a universal control signal can be generated according to the universal heat dissipation strategy, so that the target heat dissipation device can dissipate heat according to the heat dissipation intensity corresponding to the universal control signal. The heat dissipation intensity value of the corresponding target heat dissipation device, such as the rotation speed, can be matched and regulated according to the temperature state value monitored by the universal controller, thereby ensuring that the heat dissipation of the target device is in a good state, thereby achieving the temperature operation requirements of the target device at a lower rotation speed, and achieving the purpose of energy saving.

[0110] In operation S320, the effect of monitoring whether the target device is in the overclocking mode may be achieved by receiving a signal from the target device indicating whether the target device is in the normal mode or a signal indicating whether the target device is in the overclocking mode.

[0111] A communication connection may be established by setting a pin between the overclocking controller and the target device, but is not limited thereto. A communication connection may also be established between the overclocking controller and the register of the target device to obtain a signal for indicating whether the target device is in an overclocking mode or a signal in a normal mode.

[0112] Any signal that can be used to determine the operating mode of the target device can be obtained quickly and accurately.

[0113] By continuously monitoring the operating mode of the target device, it can be determined whether to use the overclocking controller to control the overclocking cooling mode of the target cooling device. In addition, by continuously monitoring the operating status of the target device, especially the temperature status, through the universal controller, it can be determined whether the cooling intensity of the target cooling device meets the cooling requirements of the target device, and whether the cooling intensity of the target cooling device can be fine-tuned to meet the cooling requirements while reducing the operating energy consumption of the target cooling device. This improves the comprehensive performance of cooling.

[0114] The following will take the signal including the signal used to indicate whether the target device is in the overclocking mode as an example to describe in detail the signal acquisition method and the signal generation method. It should be noted that the acquisition method and the generation method of the signal used to indicate whether the target device is in the normal mode are the same as those in the following embodiment, and will not be repeated here.

[0115] According to the embodiment of the present application, when executing Figure 2 Operation S210 shown or as Figure 3 Before S310 shown, the heat dissipation method may further include: obtaining a signal from the target device for indicating that the target device is in the overclocking mode. Or obtaining a signal from a register of the target device. However, it is not limited thereto. A first signal may also be obtained from the target device. A second signal may be obtained from the register. When the first signal and the second signal are obtained at the same time, it is determined that the target device is in the overclocking mode.

[0116] By collecting signals to determine whether the target device is in overclocking mode, the device's working mode can be determined quickly, timely and accurately, thereby improving the timeliness and accuracy of the target heat dissipation device's adjustment, ensuring the normal operation of the target electronic device and avoiding malfunctions.

[0117] In addition, when the first signal and the second signal are obtained at the same time, it is determined that the target device is in the overclocking mode, which can ensure processing efficiency while improving processing accuracy.

[0118] Figure 4 A schematic diagram of a communication method between an overclocking controller and a target device according to an embodiment of the present application is schematically shown.

[0119] like Figure 4 As shown, the overclocking controller 420 can establish communication between the overclocking controller 420 and the target device 410 by adding pins, see Figure 4 The solid line in the middle. However, it is not limited to this. It is also possible to establish communication between the overclocking controller 420 and the register 411 of the target device 410, see Figure 4 The dotted line in .

[0120] Thus, a signal is obtained from the target device or a register of the target device.

[0121] According to an embodiment of the present application, the signal may be determined by the target device in the following manner: determining the operating frequency of the target device and generating a signal for indicating that the target device is in overclocking mode when determining that the operating frequency of the target device is greater than the rated frequency of the target device.

[0122] The frequency search tool can be used to determine the current operating frequency of the target device from the frequency setting options of the processor of the target device, and a signal for indicating that the target device is in overclocking mode is generated based on the operating frequency and the rated frequency of the target device. However, this is not limited to this. The status monitoring tool can also be used to monitor the working status of the target device in real time, such as the frequency. By comparing the actual operating frequency with the rated frequency, it is determined whether the target device is in overclocking mode.

[0123] The use of signal monitoring can improve the timeliness and effectiveness of monitoring, and avoid the problem of untimely heat dissipation caused by the inability to adjust the operation strategy of the heat dissipation device in time when the frequency changes suddenly.

[0124] According to another embodiment, a universal controller may be used to detect a device status value of a target device, and based on a plurality of device status values ​​at different times, it is determined whether the target device is in an overclocking mode.

[0125] Compared with the method of using a general controller to determine the working mode of the target device, determining the working mode of the target device through a signal can accurately and quickly identify the working mode of the target device according to the signal when the frequency of the target device changes suddenly, and match the corresponding heat dissipation device to adjust the speed scheme, thereby avoiding the problem of triggering an over-temperature alarm due to a sudden change in the frequency and power consumption of the target device.

[0126] According to the embodiments of the present application, Figure 2 Operation S230 shown or as Figure 3 The operation S360 shown, updating the control signal to generate an updated control signal, may include: updating the heat dissipation intensity value corresponding to the control signal based on the device type, historical device status value and current device status value of the target device to obtain an updated heat dissipation intensity value. Based on the updated heat dissipation intensity value, generating an updated control signal.

[0127] Optionally, the control signal may include a pulse width modulation (PWM) signal.

[0128] The operating state of the target device can be determined based on multiple device state values, such as an operating curve or a state difference within a predetermined time period. A heat dissipation intensity value mapping relationship is generated in advance, and the parameter value mapping relationship includes a corresponding relationship between the state difference, the device type, and the heat dissipation intensity difference. The heat dissipation intensity difference used for updating is determined based on the state difference, the device type, and the heat dissipation intensity value mapping relationship. The heat dissipation intensity value can be updated based on the heat dissipation intensity difference to obtain an updated heat dissipation intensity value. An updated control signal is generated based on the updated heat dissipation intensity value.

[0129] Taking the target device as a central processing unit as an example, when the device temperature difference decreases by 1°C every 10 seconds, the heat dissipation intensity difference that matches the device type and the device temperature difference is determined through the heat dissipation intensity value mapping relationship. For example, the heat dissipation intensity difference is adjusted to reduce the heat dissipation intensity value by 5% every 10 seconds, thereby obtaining an updated heat dissipation intensity value of 95% of the heat dissipation intensity value, and an updated control signal is generated based on the updated heat dissipation intensity value.

[0130] By utilizing the embodiments provided in the present application, the updated control signal can be used to fine-tune the operating state of the target heat dissipation device, thereby improving the heat dissipation intensity of the target heat dissipation device to match the actual operating state of the target device, thereby ensuring the normal operation of the target device in the overclocking mode while reducing the overall energy consumption.

[0131] According to the embodiment of the present application, when executing Figure 2 Operation S210 shown or as Figure 3 Before the operation S310 shown, the heat dissipation method may further include: determining a target device in overclocking mode from a plurality of devices, determining a device location of the target device based on a device identifier of the target device, and determining a target heat dissipation device from a plurality of heat dissipation devices according to the device location.

[0132] Figure 5 The schematic diagram shows the architecture of the device and the heat dissipation device according to the embodiment of the present application.

[0133] like Figure 5 As shown, multiple devices can be provided, such as device 1, device 2, ..., device n. Multiple heat sinks can be provided. A heat sink can be used to cool at least one device. When device 2 is in overclocking mode, a target heat sink responsible for the device position of the first device can be used, such as Figure 5 The heat dissipation device 2 shown is used to dissipate heat for the device 2 in an overclocking heat dissipation mode.

[0134] A corresponding relationship between the heat dissipation device and the device location can be established to generate a heat dissipation mapping relationship.

[0135] The overclocking controller 510 can simultaneously receive signals from multiple devices 520 indicating whether the devices are overclocked. Based on the signals, a target device in overclocking mode, such as device 2, is determined from the multiple devices 520.

[0136] Determine the device identifier of the target device or other identifier that uniquely identifies the target device, and determine the device location of the target device. Based on the device location and the heat dissipation mapping relationship, determine the target heat dissipation device corresponding to the device location from multiple heat dissipation devices 530, such as heat dissipation device 2. Heat dissipation device 2 is used to dissipate heat in the overclocking heat dissipation operation mode of device 2.

[0137] When there are multiple devices and heat dissipation devices, the target heat dissipation device corresponding to the target device can be used to dissipate heat for the target device, thereby improving the pertinence and effectiveness of heat dissipation while reducing heat dissipation power consumption.

[0138] Based on the above heat dissipation method, the present application also provides an overclocking controller, which will be described in detail below.

[0139] The overclocking controller of this embodiment includes an overclocking heat dissipation module, an identification module and a fine-tuning module.

[0140] The overclocking heat dissipation module is used to generate a control signal for adjusting the heat dissipation intensity of the target heat dissipation device when determining that the target device is in the overclocking mode, and send the control signal to the target heat dissipation device so that the target heat dissipation device performs a heat dissipation operation according to the control signal. In one embodiment, the overclocking heat dissipation module can be used to perform the operation S210 described above, which will not be repeated here.

[0141] The identification module is used to, in response to receiving a current device state value representing a current state of the target device from the universal controller, identify the heat dissipation demand of the target device using the historical device state value received at the historical moment and the current device state value to obtain an identification result. In one embodiment, the identification module can be used to perform the operation S220 described above, which will not be repeated here.

[0142] The fine-tuning module is used to update the control signal, generate an updated control signal, and send the updated control signal to the target heat dissipation device when the recognition result indicates that the current heat dissipation demand of the target device meets the preset heat dissipation condition. In one embodiment, the fine-tuning module can be used to perform the operation S230 described above, which will not be repeated here.

[0143] According to an embodiment of the present application, the identification module includes: a first identification submodule and a second identification submodule.

[0144] The first identification submodule is used to obtain a state difference value by using a historical device state value received at a historical moment and a current device state value.

[0145] The second recognition submodule is used to determine the recognition result based on the state difference.

[0146] According to an embodiment of the present application, the device state value includes a device temperature value, and the state difference value includes a device temperature difference value.

[0147] The second identification submodule includes: an identification unit.

[0148] The identification unit is used to determine that the identification result indicates that the current heat dissipation demand of the target device meets the preset heat dissipation condition when the device temperature difference is less than a predetermined temperature threshold.

[0149] According to an embodiment of the present application, the overclocking heat dissipation module includes: a first heat dissipation sub-module and a second heat dissipation sub-module.

[0150] The first heat dissipation submodule is used to determine a heat dissipation intensity value matching a device type of a target device according to a predetermined mapping relationship.

[0151] The second heat dissipation submodule is used to generate a control signal for adjusting the heat dissipation intensity of the target heat dissipation device based on the heat dissipation intensity value.

[0152] According to an embodiment of the present application, the fine-tuning module includes: a first updating submodule and a second updating submodule.

[0153] The first updating submodule is used to update the heat dissipation intensity value corresponding to the control signal based on the device type, historical device status value and current device status value of the target device to obtain an updated heat dissipation intensity value.

[0154] The second updating submodule is used to generate an updated control signal based on the updated heat dissipation intensity value.

[0155] According to an embodiment of the present application, the fine-tuning controller further includes: a first determination module, a second determination module and a third determination module.

[0156] The first determining module is used to determine a target device in an overclocking mode from a plurality of devices.

[0157] The second determining module is used to determine the device location of the target device based on the device identification of the target device.

[0158] The third determination module is used to determine a target heat dissipation device from a plurality of heat dissipation devices according to a device location of the target device.

[0159] According to an embodiment of the present application, the fine-tuning controller further includes: a first signal acquisition module or a second signal acquisition module.

[0160] The first signal acquisition module is used to acquire, from the target device, a signal used to indicate that the target device is in an overclocking mode.

[0161] A second signal acquisition module, used to acquire a signal from a register of a target device;

[0162] Among them, the signal is determined by the target device through the following modules:

[0163] The frequency determination module is used to determine the operating frequency of the target device.

[0164] The signal generating module is used to generate a signal for indicating that the target device is in an overclocking mode when it is determined that the operating frequency of the target device is greater than the rated frequency of the target device.

[0165] According to an embodiment of the present application, any multiple modules among the overclocking heat dissipation module, the identification module and the fine-tuning module can be combined into one module for implementation, or any one of the modules can be split into multiple modules. Alternatively, at least part of the functions of one or more of these modules can be combined with at least part of the functions of other modules and implemented in one module. According to an embodiment of the present application, at least one of the overclocking heat dissipation module, the identification module and the fine-tuning module can be at least partially implemented as a hardware circuit, such as a field programmable gate array (FPGA), a programmable logic array (PLA), a system on a chip, a system on a substrate, a system on a package, an application-specific integrated circuit (ASIC), or can be implemented by hardware or firmware such as any other reasonable way of integrating or packaging the circuit, or implemented in any one of the three implementation methods of software, hardware and firmware or in an appropriate combination of any of them. Alternatively, at least one of the overclocking heat dissipation module, the identification module and the fine-tuning module can be at least partially implemented as a computer program module, and when the computer program module is run, the corresponding function can be executed.

[0166] Figure 6 A block diagram of an electronic device suitable for implementing a heat dissipation method according to an embodiment of the present application is schematically shown.

[0167] like Figure 6As shown, the electronic device 600 according to an embodiment of the present application includes a processor 601, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 602 or a program loaded from a storage part 608 to a random access memory (RAM) 603. The processor 601 may include, for example, a general-purpose microprocessor (such as a CPU), an instruction set processor and / or a related chipset and / or a dedicated microprocessor (for example, an application-specific integrated circuit (ASIC)), etc. The processor 601 may also include an onboard memory for caching purposes. The processor 601 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present application.

[0168] In RAM 603, various programs and data required for the operation of electronic device 600 are stored. Processor 601, ROM 602 and RAM 603 are connected to each other via bus 604. Processor 601 performs various operations of the method flow according to the embodiment of the present application by executing the program in ROM 602 and / or RAM 603. It should be noted that the program can also be stored in one or more memories other than ROM 602 and RAM 603. Processor 601 can also perform various operations of the method flow according to the embodiment of the present application by executing the program stored in the one or more memories.

[0169] According to an embodiment of the present application, the electronic device 600 may further include an input / output (I / O) interface 605, which is also connected to the bus 604. The electronic device 600 may further include one or more of the following components connected to the input / output (I / O) interface 605: an input portion 606 including a keyboard, a mouse, etc.; an output portion 607 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage portion 608 including a hard disk, etc.; and a communication portion 609 including a network interface card such as a LAN card, a modem, etc. The communication portion 609 performs communication processing via a network such as the Internet. A drive 610 is also connected to the input / output (I / O) interface 605 as needed. A removable medium 611, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 610 as needed, so that a computer program read therefrom is installed into the storage portion 608 as needed.

[0170] The present application also provides a computer-readable storage medium, which may be included in the device / apparatus / system described in the above embodiments; or may exist independently without being assembled into the device / apparatus / system. The above computer-readable storage medium carries one or more programs, and when the above one or more programs are executed, the method according to the embodiment of the present application is implemented.

[0171] According to an embodiment of the present application, the computer-readable storage medium may be a non-volatile computer-readable storage medium, for example, it may include but is not limited to: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program, which may be used by or in combination with an instruction execution system, an apparatus or a device. For example, according to an embodiment of the present application, the computer-readable storage medium may include the ROM 602 and / or RAM 603 described above and / or one or more memories other than ROM 602 and RAM 603.

[0172] The embodiment of the present application also includes a computer program product, which includes a computer program, and the computer program contains program code for executing the method shown in the flowchart. When the computer program product is run in a computer system, the program code is used to enable the computer system to implement the heat dissipation method provided in the embodiment of the present application.

[0173] The above functions defined in the system / device of the embodiment of the present application are performed when the computer program is executed by the processor 601. According to the embodiment of the present application, the system, device, module, unit, etc. described above can be implemented by a computer program module.

[0174] In one embodiment, the computer program may rely on tangible storage media such as optical storage devices, magnetic storage devices, etc. In another embodiment, the computer program may also be transmitted and distributed in the form of signals on a network medium, and downloaded and installed through the communication part 609, and / or installed from a removable medium 611. The program code contained in the computer program may be transmitted using any appropriate network medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0175] In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 609, and / or installed from the removable medium 611. When the computer program is executed by the processor 601, the above functions defined in the system of the embodiment of the present application are performed. According to the embodiment of the present application, the system, device, apparatus, module, unit, etc. described above can be implemented by a computer program module.

[0176] According to an embodiment of the present application, the program code for executing the computer program provided by the embodiment of the present application can be written in any combination of one or more programming languages, and specifically, these computing programs can be implemented using high-level process and / or object-oriented programming languages, and / or assembly / machine languages. Programming languages ​​include, but are not limited to, such as Java, C++, python, "C" language or similar programming languages. The program code can be executed entirely on the user computing device, partially on the user device, partially on the remote computing device, or completely on the remote computing device or server. In the case of a remote computing device, the remote computing device can be connected to the user computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device (e.g., using an Internet service provider to connect through the Internet).

[0177] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the above-mentioned module, program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flow chart, and the combination of the boxes in the block diagram or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0178] It will be appreciated by those skilled in the art that the features described in the various embodiments of the present application may be combined and / or combined in a variety of ways, even if such combinations or combinations are not explicitly described in the present application. In particular, without departing from the spirit and teachings of the present application, the features described in the various embodiments of the present application may be combined and / or combined in a variety of ways. All of these combinations and / or combinations fall within the scope of the present application.

[0179] The embodiments of the present application are described above. However, these embodiments are only for the purpose of illustration, and are not intended to limit the scope of the present application. Although each embodiment is described above, this does not mean that the measures in each embodiment cannot be used in combination advantageously. Without departing from the scope of the present application, those skilled in the art may make a variety of substitutions and modifications, which should all fall within the scope of the present application.

Claims

1. A heat dissipation method, characterized in that: The method comprises: In the case of determining that the target device is in the overclocking mode, generating a control signal for adjusting the heat dissipation intensity of the target heat dissipation device and sending the control signal to the target heat dissipation device so that the target heat dissipation device performs a heat dissipation operation according to the control signal; In response to receiving a current device state value representing a current state of the target device from a universal controller, identifying a heat dissipation requirement of the target device using historical device state values ​​received at historical moments and the current device state value to obtain an identification result; and When the identification result indicates that the current heat dissipation demand of the target device meets the preset heat dissipation condition, the control signal is updated to generate an updated control signal, and the updated control signal is sent to the target heat dissipation device.

2. The method according to claim 1, characterized in that: The step of identifying the heat dissipation requirement of the target device by using the historical device status value received at the historical moment and the current device status value to obtain the identification result includes: Using the historical device status value received at the historical moment and the current device status value, a status difference is obtained; and Based on the state difference, the recognition result is determined.

3. The method according to claim 2, characterized in that The device state value includes a device temperature value, and the state difference value includes a device temperature difference value; The determining the recognition result based on the state difference includes: In a case where the device temperature difference is less than a predetermined temperature threshold, determining that the identification result indicates that a current heat dissipation demand of the target device meets the preset heat dissipation condition.

4. The method according to claim 1, characterized in that: The generating of a control signal for adjusting the heat dissipation intensity of the target heat dissipation device comprises: Determining a heat dissipation intensity value that matches a device type of the target device according to a predetermined mapping relationship; and Based on the heat dissipation intensity value, a control signal for adjusting the heat dissipation intensity of the target heat dissipation device is generated.

5. The method according to claim 1 or 4, characterized in that: The updating of the control signal to generate an updated control signal includes: Based on the device type of the target device, the historical device status value, and the current device status value, updating the heat dissipation intensity value corresponding to the control signal to obtain an updated heat dissipation intensity value; and The updated control signal is generated based on the updated heat dissipation intensity value.

6. The method according to claim 1, characterized in that The method further comprises: determining the target device in overclocking mode from a plurality of devices; Determining a device location of the target device based on the device identification of the target device; and The target heat dissipation device is determined from a plurality of heat dissipation devices according to a device position of the target device.

7. The method according to claim 1, characterized in that The method further comprises: Acquire, from the target device, a signal indicating that the target device is in an overclocking mode; or Obtaining the signal from a register of the target device; The signal is determined by using the target device in the following manner: determining an operating frequency of the target device; and In the case where it is determined that the operating frequency of the target device is greater than the rated frequency of the target device, the signal for indicating that the target device is in an overclocking mode is generated.

8. A heat dissipation system, characterized in that: The system comprises: at least one heat sink for dissipating heat; a universal controller, configured to monitor the state of the target device at different times to obtain a plurality of device state values ​​when the target device is in an overclocking mode; and An overclocking controller is used to generate a control signal for adjusting the heat dissipation intensity of the target heat dissipation device when it is determined that the target device is in an overclocking mode, and send the control signal to a target heat dissipation device among at least one of the heat dissipation devices so that the target heat dissipation device performs a heat dissipation operation according to the control signal; in response to receiving a current device status value representing the current status of the target device from the universal controller; using the historical device status value received at a historical moment and the current device status value, the heat dissipation demand of the target device is identified to obtain an identification result; and when the identification result represents that the current heat dissipation demand of the target device meets a preset heat dissipation condition, the control signal is updated to generate an updated control signal, and the updated control signal is sent to the target heat dissipation device.

9. An electronic device, comprising: one or more processors; a memory for storing one or more computer programs, It is characterized in that the one or more processors execute the one or more computer programs to implement the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program or instruction stored thereon, characterized in that: When the computer program or instruction is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

Images