Power supply device, board card, electronic equipment and server

Abstract

The invention provides a power supply device, a board card, electronic equipment and a server. An intermediate circuit board and a substrate circuit board are stacked, and an integrated module is arranged between the intermediate circuit board and the substrate circuit board; the first pin surface of the integrated module is jointed with the substrate circuit board, and the second pin surface of the integrated module is jointed with the intermediate circuit board; the integrated module comprises an inductor assembly and a power transmission line. An output pin of the inductor assembly is arranged on the first pin surface, and an input pin is arranged on the second pin surface; an input pin of the power transmission line is arranged on the first pin surface, and an output pin is arranged on the second pin surface; an inductance coil and a power transmission line of the inductance assembly are perpendicular to the first pin face, and the power transmission line and the inductance assembly are arranged in parallel. Compared with the prior art, the power transmission path can be shortened, the transmission loss can be reduced, the conversion efficiency can be improved, the effect is remarkable in a low-voltage large-current scene, the energy waste can be reduced, and the equipment heating can be reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to a power supply device and board, electronic equipment, and a server. Background Art

[0002] As the performance of processors such as the Central Processing Unit (CPU) and Graphics Processing Unit (GPU) continues to improve, their power and required current have increased significantly, which has brought many challenges to power supply design. Traditional electromagnetic component layouts are mostly horizontal, and this layout method has obvious limitations. In the case of limited internal space in the server, the horizontal layout leads to low space utilization and it is difficult to integrate more power components in a limited space. With the increase in CPU and GPU power, when the power supply current is transmitted on the printed circuit board (PCB), a large amount of heat will be generated due to the existence of PCB impedance, and high loss and heat dissipation problems are becoming increasingly prominent. The existing electromagnetic component design and power supply solutions can no longer meet the needs of the continuous development of electronic equipment. A new design is urgently needed to solve these problems and improve the performance and reliability of electromagnetic components. Summary of the invention

[0003] The present invention provides a power supply device and board, electronic equipment, and server, which are mainly intended to solve the problem that a large amount of heat and loss will be generated by the circuit board as the power of the electrical device increases.

[0004] According to a first aspect of the present disclosure, there is provided a power supply device, comprising: an integrated module, an intermediate circuit board, and a substrate circuit board; The intermediate circuit board and the base circuit board are stacked, and an integrated module is arranged between the two; the first pin surface of the integrated module is engaged with the base circuit board, and the second pin surface of the integrated module is engaged with the intermediate circuit board; The integrated module includes: an inductor component and a power transmission line; the output pin of the inductor component is arranged on a first pin surface, and the input pin is arranged on a second pin surface; the input pin of the power transmission line is arranged on the first pin surface, and the output pin is arranged on the second pin surface; the inductor coil and the power transmission line of the inductor component are perpendicular to the first pin surface, and the power transmission line is arranged in parallel with the inductor component.

[0005] Optionally, the integrated module further includes: a signal transmission line; The first pin of the signal transmission line is arranged on the first pin surface, and the second pin is arranged on the second pin surface.

[0006] Optionally, in the device cavity, the signal transmission line is perpendicular to the first pin surface, and the signal transmission line is arranged in parallel with the power transmission line and the inductor component.

[0007] Optionally, the signal transmission line is between the power transmission line and the inductor component.

[0008] Optionally, the integrated module further comprises: an isolation insulating layer; The third pin of the isolation insulating layer is arranged on the first pin surface, and the fourth pin is arranged on the second pin surface.

[0009] Optionally, in the device cavity, an isolation insulating layer is perpendicular to the first pin surface, and the isolation insulating layer divides the device cavity into a first cavity and a second cavity; the inductor component is located in the first cavity, and the signal transmission line and the power transmission line are located in the second cavity; The isolation insulating layer is respectively arranged in parallel with the inductor component, the signal transmission line and the power transmission line.

[0010] Optionally, the first connection surface of the substrate circuit board is connected to the first pin surface, and the second connection surface is connected to a target circuit board where the target electrical device is located.

[0011] Optionally, the inductor component is a trans-inductor regulator; The output pins of the trans-inductor voltage regulator include a main coil pin and a secondary coil pin; the main coil pin and the secondary coil pin are arranged on the first pin surface.

[0012] Optionally, an input pin of the power transmission line is electrically connected to a power line of the substrate circuit board; and an output pin of the power transmission line is electrically connected to the intermediate circuit board.

[0013] Optionally, an input pin of the inductor component is electrically connected to the intermediate circuit board, and an output pin of the inductor component is electrically connected to the substrate circuit board.

[0014] Optionally, a first pin of the signal transmission circuit is communicatively connected to the substrate circuit board, and a second pin of the signal transmission circuit is communicatively connected to the intermediate circuit board.

[0015] Optionally, the third pin of the isolation insulating layer is electrically connected to the ground line of the substrate circuit board, and the fourth pin of the isolation insulating layer is electrically connected to the ground line of the intermediate circuit board.

[0016] According to a second aspect of the present disclosure, a board is provided, comprising: a power supply device as described in the first aspect and a target circuit board where a target electrical device is located; the target circuit board is connected to a substrate circuit board of the power supply device.

[0017] According to a third aspect of the present disclosure, an electronic device is provided, comprising: the board card as described in the second aspect above.

[0018] According to a fourth aspect of the present disclosure, a server is provided, comprising: the board as described in the second aspect above.

[0019] The present disclosure provides a power supply device and a board, an electronic device, and a server, and relates to the technical field of electronic devices. The embodiment of the present disclosure can improve the power supply quality and ensure the stable operation of the electrical device by using an inductor component to balance and optimize the current input to the target electrical device. The power transmission line is perpendicular to the pin surface and arranged in parallel with the inductor component, which can shorten the power transmission path, reduce transmission loss, and improve the power conversion efficiency. It has a significant effect in the application scenario of low voltage and high current, and can reduce energy waste and reduce equipment heating. The inductor component and the power transmission line are perpendicular to the first pin surface and arranged in parallel. This layout method makes full use of the vertical space and saves the horizontal space of the circuit board compared to the traditional horizontal layout. In the case of limited internal space of the server, more power components can be integrated in the limited horizontal space to make room for other components, which is conducive to the miniaturization and integrated design of the equipment. The vertical power supply method makes the connection between the power supply device and the target circuit board more stable, reduces the risk of power supply failure caused by unstable connection, and is suitable for use in complex environments such as vibration. The power supply device adopts a modular packaging design, and the inductor component and the power transmission line are integrated in a package body, which is convenient for production and installation. The assembly process can be reduced during the production process, thereby improving production efficiency and product yield; during installation, it is only necessary to solder the pins on the first pin surface to the target circuit board, which is simple to operate and can reduce installation difficulty and cost.

[0020] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure. Figure 1 A schematic diagram of the structure of a power supply device provided in an embodiment of the present disclosure; Figure 2 A schematic diagram of the structure of an integrated module provided in an embodiment of the present disclosure; Figure 3 A schematic diagram of the structure of an integrated module provided in an embodiment of the present disclosure; Figure 4 A schematic diagram of a first pin surface and a second pin surface is provided for an embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0023] The power supply device and board, electronic device, and server according to the embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0024] Figure 1 This is a schematic diagram of the structure of a power supply device provided by an embodiment of the present disclosure. Figure 1 As shown, the power supply device includes: an integrated module 11, an intermediate circuit board 12, and a base circuit board 13.

[0025] The intermediate circuit board 12 and the base circuit board 13 are stacked, with the integrated module 11 disposed therebetween; the first pin surface 113 of the integrated module 11 is bonded to the base circuit board 13 , and the second pin surface 114 of the integrated module 11 is bonded to the intermediate circuit board 12 .

[0026] In the disclosed embodiment, the integrated module 11 has a first pin face 113 and a second pin face 114, and these two pin faces play a connecting role in the power supply process. The pins of the first pin face 113 can establish a stable electrical connection with the substrate circuit board 13 by, but not limited to, welding. The pins of the second pin face 114 are welded to the intermediate circuit board 12, thereby realizing the electrical connection between the integrated module 11 and the intermediate circuit board 12. This connection method enables the integrated module 11 to receive the current modulated by the power supply control circuit on the intermediate circuit board 12. After receiving the current modulated by the power supply control circuit, the integrated module 11 will perform a balanced optimization process on it. The core components such as the inductor component inside the integrated module 11 play a role, and further adjust the current according to the principle of electromagnetic induction. The inductor component 111 can suppress the fluctuation of the current, make the current more stable, and reduce the impact of the current change on the target electrical device. At the same time, by adjusting parameters such as the current phase, the balanced distribution of the current is achieved, and the reliability and stability of the power supply are improved. The current after balanced optimization processing by the integrated module 11 is finally vertically powered to the target electrical device in the substrate circuit board 13 through the pins of the first pin surface 113. The vertical power supply method is of great significance in modern electronic devices. It can make full use of the vertical space of the circuit board, reduce the horizontal wiring occupation, and improve the space utilization rate of the circuit board. In addition, vertical power supply can shorten the current transmission path, reduce the energy loss during the transmission process, improve the power supply efficiency, meet the strict requirements of the target electrical device for power supply quality, and ensure that the target electrical device can operate stably and efficiently.

[0027] The integrated module 11 includes: an inductor component 111 and a power transmission line 112; the output pin of the inductor component 111 is arranged on a first pin surface 113, and the input pin is arranged on a second pin surface 114; the input pin of the power transmission line 112 is arranged on the first pin surface 113, and the output pin is arranged on the second pin surface 114; the inductor coil and the power transmission line of the inductor component 111 are perpendicular to the first pin surface 113, and the power transmission line 112 is arranged in parallel with the inductor component 111.

[0028] In the embodiments of the present disclosure, Figure 2 The schematic diagram of the structure of an integrated module provided by an embodiment of the present disclosure is shown in FIG. 11. The integrated module 11 mainly includes an inductor component 111 and a power transmission line 112. The output pin of the inductor component 111 is arranged on a first pin surface 113, and the input pin is arranged on a second pin surface 114; the input pin of the power transmission line 112 is also arranged on the first pin surface 113, and the output pin is arranged on the second pin surface 114.

[0029] The specific process of power transmission of the power transmission line 112 is as follows: in an actual working scenario, when the integrated module 11 is connected to the circuit system, the power provided by the external power source is transmitted to the input pin of the power transmission line 112 through the line connected to the first pin surface 113. The power transmission line 112 can be made of, but not limited to, low-impedance, easy-to-weld materials to make the wire. This feature can greatly reduce the energy loss caused by the wire resistance during the transmission of power, effectively ensuring the efficiency of power transmission.

[0030] From the perspective of the transmission path, the power transmission line 112 is arranged in the vertical direction and is arranged in parallel with the inductor component 111. This layout design not only meets the design requirements of vertical power supply, but also enables the electric energy to be more efficiently transmitted from the first pin surface 113 to the second pin surface 114 during the transmission process. At the second pin surface 114, the electric energy is transmitted to the inductor component 111 through the output pin and the line connected to the second pin surface 114; after being balanced and optimized by the inductor component 111, it is transmitted from the output pin of the inductor component 111 to the target circuit board where the target electrical device is located, thereby providing the target electrical device with the electric energy required for operation.

[0031] In addition, the inductor component 111 is closely matched with the power transmission line 112. When the inductor component 111 performs balanced optimization processing on the current input to the target electrical device, its working process will affect the characteristics of the current, and the power transmission line 112 needs to stably transmit electric energy under such a current environment. Since the two are arranged in parallel, a close coupling relationship is formed in space, so that the power transmission line 112 can better adapt to the adjustment of the current by the inductor component 111, ensuring that under various working conditions, electric energy can be continuously and stably transmitted to the target electrical device, ensuring the normal operation of the target electrical device.

[0032] The inductor component 111 and the power transmission line 112 are packaged in a device cavity formed by the first pin surface 113, the second pin surface 114 and the side packaging surface. This packaging structure provides a physical protection and electrically isolated space environment for the inductor component 111 and the power transmission line 112. From the perspective of physical protection, the side packaging surface and the first and second pin surfaces form a closed space, which can effectively prevent the entry of external impurities such as dust and moisture, and avoid corrosion or short circuit problems to the inductor component 111 and the power transmission line 112; from the perspective of electrical isolation, the packaging structure can reduce the impact of external electromagnetic interference on internal components, and ensure the stable operation of the integrated module 11. It should be noted that the shape of the power supply device disclosed in the present invention can be square or cylindrical, and the embodiments of the present disclosure are not limited to this.

[0033] Inside the device cavity, the inductor coil and the power transmission line 112 of the inductor component 111 are both perpendicular to the first pin surface 113. For the inductor coil, its setting perpendicular to the first pin surface 113 is based on electromagnetic principles and vertical power supply design requirements. In electromagnetism, the performance of the inductor is closely related to factors such as the winding direction and spatial position of the coil. When the inductor coil is perpendicular to the first pin surface 113, the direction of the magnetic field it generates will also be perpendicular to the first pin surface 113 accordingly. This magnetic field distribution characteristic is conducive to the inductor component 111 to perform efficient balanced optimization processing of the current. For example, when processing large currents, the vertical magnetic field can more effectively suppress current fluctuations, reduce ripple current, and provide a stable current source for subsequent power transmission.

[0034] The power transmission line 112 is perpendicular to the first pin surface 113 and is arranged in parallel with the inductor component 111. The layout perpendicular to the first pin surface 113 is to achieve high efficiency of vertical power supply. In a vertical power supply system, electric energy needs to be transmitted in a vertical direction. This layout of the power transmission line 112 can minimize the bending of the transmission path, reduce the transmission resistance and inductance, and thus reduce the loss of electric energy during the transmission process. At the same time, it is arranged in parallel with the inductor component 111, and the two are tightly coupled in space and can work better together. On the one hand, when the power transmission line 112 is transmitting electric energy, the optimized processing of the current by the inductor component 111 can directly act on the current in the power transmission line 112 to ensure stable current transmission; on the other hand, the parallel setting also reduces the electromagnetic interference between the two and improves the overall performance of the power supply system.

[0035] The pins in the first pin face 113 are welded to the substrate circuit board 13 where the target electrical device is located. This welding connection method establishes an electrical connection between the integrated module 11 and the target electrical device. During the welding process, through a suitable welding process, such as reflow soldering or wave soldering, the pins are connected to the pads on the substrate circuit board 13 to form a reliable metal connection, ensuring that the electric energy can be stably transmitted from the power transmission line 112 to the substrate circuit board 13 through the pins of the first pin face 113, and finally power the target electrical device. This vertical power supply method has many advantages over the traditional horizontal power supply method. It can make full use of the vertical space of the circuit board, reduce the occupied area in the horizontal direction, and improve the space utilization rate of the circuit board. It is particularly suitable for electronic devices with high requirements for space layout, such as servers, high-performance computing equipment, etc. At the same time, vertical power supply can also shorten the power transmission path, reduce energy loss during transmission, improve power supply efficiency, and provide strong guarantee for the stable operation of the target electrical device.

[0036] The present disclosure provides an integrated module 11. The embodiment of the present disclosure can improve the power supply quality and ensure the stable operation of the electrical devices by using the inductor component 111 to balance and optimize the current input to the target electrical device. The power transmission line 112 is perpendicular to the pin surface and arranged in parallel with the inductor component 111, which can shorten the power transmission path, reduce transmission loss, and improve the power conversion efficiency. It has a significant effect in the application scenario of low voltage and high current, and can reduce energy waste and reduce equipment heating. The inductor component 111 and the power transmission line 112 are perpendicular to the first pin surface 113 and arranged in parallel. This layout method makes full use of the vertical space and saves the horizontal space of the circuit board compared to the traditional horizontal layout. In the case of limited internal space of the server, more power components can be integrated in the limited horizontal space to make room for other components, which is conducive to the miniaturization and integrated design of the equipment. The vertical power supply method makes the connection between the integrated module 11 and the substrate circuit board 13 more stable, reduces the risk of power supply failure caused by unstable connection, and is suitable for use in complex environments such as vibration. The integrated module 11 adopts a modular packaging design, integrating the inductor component 111 and the power transmission line 112 in one package, which is convenient for manufacturing and installation. The assembly process can be reduced during the production process, and the production efficiency and product yield can be improved; during installation, only the pins of the first pin surface 113 need to be soldered on the substrate circuit board 13, which is simple to operate and can reduce the difficulty and cost of installation.

[0037] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 2 As shown, the integrated module 11 further includes: a signal transmission circuit 115 ; a first pin of the signal transmission circuit 115 is arranged on the first pin surface 113 , and a second pin is arranged on the second pin surface 114 .

[0038] Specifically, the integrated module 11 includes not only the inductor component 111 and the power transmission line 112 , but also an additional signal transmission line 115 . Figure 3 A schematic diagram of the structure of an integrated module provided in an embodiment of the present disclosure. From the perspective of pin arrangement, the first pin of the signal transmission circuit 115 is arranged on the first pin surface 113, and the second pin is arranged on the second pin surface 114. This pin arrangement mode builds a bridge for the transmission of signals between different circuit modules. The main function of the signal transmission circuit 115 is to realize signal transmission. In the actual operation of electronic equipment, a large amount of data interaction and communication is required between various components.

[0039] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 2 As shown, in the device cavity, the signal transmission line 115 is perpendicular to the first pin surface 113 , and the signal transmission line 115 is arranged in parallel with the power transmission line 112 and the inductor component 111 .

[0040] Specifically, in terms of the layout of the device cavity, the signal transmission line 115 is perpendicular to the first pin surface 113, and is arranged in parallel with the power transmission line 112 and the inductor component 111. The layout perpendicular to the first pin surface 113 is consistent with the vertical layout of the power transmission line 112 and the inductor component 111. From the perspective of electromagnetic principles, the parallel arrangement can reduce the electromagnetic coupling interference between the signal transmission line 115 and the power transmission line 112 and the inductor component 111. Because when arranged in parallel, the direction of the magnetic field generated by each line is relatively fixed, and the interference between them is relatively weak, thereby ensuring the stability and accuracy of the signal during transmission.

[0041] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 2 As shown, the signal transmission line 115 is between the power transmission line 112 and the inductor component 111 .

[0042] Specifically, the signal transmission line 115 is between the power transmission line 112 and the inductor component 111. On the one hand, the power transmission line 112 will generate certain electromagnetic interference during the transmission of electric energy, and the inductor component 111 will also generate a magnetic field when working. By arranging the signal transmission line 115 between the two, the shielding effect of the power transmission line 112 and the inductor component 111 can be utilized to provide certain protection for the signal transmission line 115. For example, the metal wire of the power transmission line 112 and the magnetic material of the inductor component 111 can both block the influence of external electromagnetic interference on the signal transmission line 115 to a certain extent; on the other hand, the signal transmission line 115 is closely adjacent to the power transmission line 112 and the inductor component 111, which is conducive to the miniaturization of the integrated module 11, thereby reducing the transmission line of the current in the circuit and achieving the purpose of reducing the heating of the circuit board. Through such a design, the signal transmission line 115 fully exerts its signal transmission function in the integrated module 11, cooperates with the inductor component 111 and the power transmission line 112, improves the overall performance of the integrated module 11, and meets the needs of modern electronic equipment for integrated and efficient power supply and signal transmission.

[0043] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 2 As shown, the integrated module 11 further includes: an isolation insulating layer 116 ; a third pin of the isolation insulating layer 116 is disposed on the first pin surface 113 , and a fourth pin is disposed on the second pin surface 114 .

[0044] Specifically, the integrated module 11 is provided with an isolation insulating layer 116. From the perspective of pin setting, the third pin of the isolation insulating layer 116 is set on the first pin surface 113, and the fourth pin is set on the second pin surface 114. This pin setting method enables the isolation insulating layer 116 to establish an electrical connection with other parts of the integrated module 11, ensuring that its function can be effectively realized. The core function of the isolation insulating layer 116 is to suppress the electromagnetic interference of the signal transmission line 115. In the actual operation of the electronic device, the inductor component 111 will generate a strong magnetic field when working, and the power transmission line 112 will also generate a certain degree of electromagnetic interference when transmitting electric energy. If these interferences are not suppressed, they will seriously affect the transmission quality of the signal in the signal transmission line 115, resulting in signal distortion, bit errors and other problems, thereby affecting the normal operation of the entire electronic device. The isolation insulating layer 116 can effectively block and shield these electromagnetic interferences through its own material properties and structural design, and ensure the accuracy and stability of the signal in the signal transmission line 115.

[0045] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 2 As shown, in the device cavity, the isolation insulating layer 116 is perpendicular to the first pin surface 113, and the isolation insulating layer 116 divides the device cavity into a first cavity and a second cavity; the inductor component 111 is located in the first cavity, and the signal transmission line 115 and the power transmission line 112 are located in the second cavity; the isolation insulating layer 116 is arranged parallel to the inductor component 111, the signal transmission line 115, and the power transmission line 112, respectively.

[0046] Specifically, in terms of the layout of the device cavity, the isolation insulating layer 116 is perpendicular to the first pin surface 113. This layout is coordinated with the vertical layout of the inductor component 111, the signal transmission line 115, and the power transmission line 112, and fully utilizes the space of the device cavity. At the same time, the isolation insulating layer 116 divides the device cavity into a first cavity and a second cavity. This division method further optimizes the structural layout inside the integrated module 11, so that different components can work in relatively independent spaces and reduce mutual interference. The inductor component 111 is located in the first cavity, and the signal transmission line 115 and the power transmission line 112 are located in the second cavity. This layout arrangement fully considers the characteristics and functional requirements of each component. The magnetic field generated by the inductor component 111 during operation is relatively strong. Placing it alone in the first cavity can prevent its magnetic field from causing excessive interference to the signal transmission line 115 and the power transmission line 112. The signal transmission line 115 and the power transmission line 112 are located in the second cavity. Although there is some mutual influence between them, the shielding effect of the isolation insulating layer 116 and the reasonable parallel layout design can effectively control this influence within an acceptable range. At the same time, this layout method also facilitates the connection and wiring between the components, improving the overall integration and reliability of the integrated module 11.

[0047] The isolation insulating layer 116 is respectively arranged in parallel with the inductor component 111, the signal transmission line 115, and the power transmission line 112. The advantage of the parallel arrangement is that the shielding effect of the isolation insulating layer 116 can be maximized without affecting the normal operation of each component. Because when arranged in parallel, the distance between the isolation insulating layer 116 and each component is relatively uniform, it can more effectively block the propagation path of electromagnetic interference. For example, when the magnetic field generated by the inductor component 111 spreads outward, the vertical and parallel isolation insulating layer 116 can shield the magnetic field over a larger area, reducing the influence of the magnetic field on the signal transmission line 115 and the power transmission line 112.

[0048] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 2 As shown, the inductor component 111 is a trans-inductor regulator; the output pins of the trans-inductor regulator include a main coil pin and a secondary coil pin; the main coil pin and the secondary coil pin are arranged on the first pin surface 113 .

[0049] Specifically, the inductor component 111 is specifically a trans-inductor voltage regulator. The trans-inductor voltage regulator is an advanced inductor design. Compared with traditional inductors, it has unique advantages in voltage regulation and current processing, and is particularly suitable for scenarios with high requirements for power supply stability, such as powering high-performance chips such as CPUs and GPUs. The output pins of the trans-inductor voltage regulator include a main coil pin and a secondary coil pin, and these two pins have different functions in circuit operation. The main coil pin is the key connection point for the trans-inductor voltage regulator to realize the basic inductor function. During the power conversion and current processing process, the main coil pin is responsible for outputting the current processed by the inductor component and providing a stable current supply for the subsequent circuit. The main coil pin and the secondary coil pin are both set on the first pin face 113. This pin setting method has many technical significances. From the perspective of circuit connection, all output pins are concentrated on the first pin face 113, which facilitates the connection and wiring with the external circuit. In the actual production and assembly process, this centralized pin layout can simplify the design and manufacturing process of the circuit board, reduce the complexity of wiring, and reduce production costs. At the same time, the centralized setting of pins can also reduce the length and impedance of the signal transmission path, and improve the efficiency and stability of signal transmission. For example, in the scenario of high-speed signal transmission, a shorter transmission path can effectively reduce signal attenuation and interference, ensuring that the current signal output by the trans-inductor regulator can be accurately and quickly transmitted to the target circuit. In order to have a clearer understanding of the first pin face 113 and the second pin face 114, the embodiment of the present disclosure provides a schematic diagram of the first pin face and the second pin face, Figure 4 (a) represents the second pin surface 114, Figure 4 (b) shows the first pin surface 113 .

[0050] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 2 As shown, the first connection surface of the substrate circuit board 13 is connected to the first pin surface 113, and the second connection surface is connected to the target circuit board where the target electrical device is located.

[0051] Specifically, the substrate circuit board 13 has a first connection surface and a second connection surface, wherein the first connection surface is connected to the first pin surface 113 of the power supply device. This connection is an important link in realizing the transmission of electric energy and signals, and is usually electrically connected by welding, plugging, etc. Taking welding as an example, through processes such as reflow soldering or wave soldering, the pads on the first connection surface are reliably connected to the pins on the first pin surface 113 to form a stable electrical path. Such a connection method can ensure that the electrical connection between the power transmission line, signal transmission line, etc. of the power supply device and the substrate circuit board 13 is firm, reduce contact resistance, and ensure the efficiency and stability of power and signal transmission.

[0052] From the perspective of power transmission, the inductor component 111 in the integrated module 11 transmits power to the first pin surface 113, and then transmits it to the power line on the substrate circuit board 13 through the first connection surface. The power will be distributed and transmitted in the internal circuit of the substrate circuit board 13 to prepare for the subsequent power supply link. In terms of signal transmission, the signal transmission line 115 establishes a connection between the first pin surface 113 and the first connection surface of the substrate circuit board 13, so that the power supply device and the substrate circuit board 13 can interact with each other, such as the transmission of control signals, data signals, etc., to achieve precise control of the power supply process and monitoring of the operating status of the equipment.

[0053] The second connection surface of the substrate circuit board 13 is connected to the target circuit board where the target electrical device is located. This connection is also very important. It is the key path for the power supply device to finally transmit the power and signal processed by the power supply device to the target electrical device. There are also various ways to connect the second connection surface to the target circuit board, which is not limited by the present disclosure.

[0054] In terms of power transmission, the second connection surface of the substrate circuit board 13 transmits the processed and distributed power to the target circuit board, providing a stable power supply for the target electrical device. For target electrical devices such as the CPU and GPU in the server, a stable power supply is the basis for their normal operation. The second connection surface of the substrate circuit board 13 ensures that the power can be accurately and efficiently transmitted to the power pins of the target electrical device. In terms of signal transmission, the second connection surface connects the signal line on the substrate circuit board 13 with the corresponding signal line on the target circuit board, realizing a complete signal transmission path between the power supply device and the target electrical device, ensuring that the target electrical device can receive accurate control signals and data signals, so as to perform various tasks normally.

[0055] By connecting the first connection surface of the substrate circuit board 13 to the first pin surface 113 and the second connection surface to the target circuit board where the target electrical device is located, a complete power supply and signal transmission link is constructed, so that the power supply device can effectively provide power and signal support to the target electrical device, ensuring the stable operation of the entire system.

[0056] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 4 As shown, the input pin of the power transmission circuit 112 is electrically connected to the power line (pin) of the substrate circuit board 13 ; and the output pin of the power transmission circuit 112 is electrically connected to the intermediate circuit board 12 .

[0057] Specifically, the input pin of the power transmission line 112 in the integrated module 11 is electrically connected to the power pin of the substrate circuit board 13. This electrical connection is the starting point of the entire power supply link. The power pin of the substrate circuit board 13 serves as an interface for power input and provides a source of power for the integrated module 11. The input pin of the power transmission line 112 is connected to the power pin of the substrate circuit board 13 through a specific electrical connection method, such as welding or connecting with a special connector to ensure the reliability and stability of the electrical connection, so as to ensure that the power can be smoothly transmitted from the substrate circuit board 13 to the power transmission line 112. The output pin of the power transmission line 112 is electrically connected to the power control circuit on the intermediate circuit board 12. The power transmission line 112 transmits the power obtained from the substrate circuit board 13 to the power control circuit to provide the power control circuit with the energy required for work. After receiving the power, the power control circuit will perform a series of modulation processing on it, such as adjusting the size and waveform of the voltage and current to meet the working requirements of the subsequent circuit. This connection method enables the power transmission line 112 and the power control circuit to form a closely coordinated power supply link to ensure that the output power quality meets the requirements.

[0058] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 4 As shown, the input pin of the inductor component 111 is electrically connected to the intermediate circuit board 12 , and the output pin of the inductor component 111 is electrically connected to the base circuit board 13 .

[0059] Specifically, the input pin of the inductor component 111 in the integrated module 11 is electrically connected to the power control circuit. The current modulated by the power control circuit is transmitted to the inductor component 111 through this connection. The inductor component 111 processes the input current based on the principle of electromagnetic induction. The connection between the input pin of the inductor component 111 and the power control circuit enables the inductor component 111 to obtain the current signal after preliminary modulation, providing a basis for subsequent current optimization processing. The output pin of the inductor component 111 is electrically connected to the substrate circuit board 13. After the inductor component 111 performs balanced optimization processing on the input current, the optimized current is transmitted to the target electrical device through its output pin and the substrate circuit board 13. This connection directly provides a stable and reliable current supply for the target electrical device, ensuring the normal operation of the target electrical device. For example, for high-performance target electrical devices such as CPUs and GPUs, a stable current supply is crucial to their computing performance and working stability, and the connection between the output pin of the inductor component 111 and the target electrical device plays a key role in power supply guarantee.

[0060] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 4As shown, the first pin of the signal transmission circuit 115 is communicatively connected to the base circuit board 13 , and the second pin of the signal transmission circuit 115 is communicatively connected to the intermediate circuit board 12 .

[0061] Specifically, the first pin of the signal transmission circuit 115 in the integrated module 11 is communicatively connected to the substrate circuit board 13, and the second pin of the signal transmission circuit 115 is communicatively connected to the intermediate circuit board 12. This connection mode of the signal transmission circuit 115 realizes the signal transmission function between the substrate circuit board 13 and the intermediate circuit board 12. During the operation of the electronic device, data interaction and control signal transmission are required between the components on the substrate circuit board 13 and the intermediate circuit board 12. The signal transmission circuit 115 receives the signal from the substrate circuit board 13 through its first pin, and then transmits the signal to the intermediate circuit board 12 through the second pin through line transmission. The signal transmission circuit 115 can adopt different modes such as differential signal transmission and single-ended signal transmission to adapt to the transmission requirements of different types of signals and ensure the accuracy and stability of the signal during the transmission process.

[0062] Furthermore, in a possible implementation of the embodiment of the present disclosure, as Figure 4 As shown, the third pin of the isolation insulating layer 116 in the integrated module 11 is electrically connected to the ground line (pin) of the substrate circuit board 13 , and the fourth pin of the isolation insulating layer 116 is electrically connected to the ground line (pin) of the intermediate circuit board 12 .

[0063] Specifically, the third pin of the isolation insulating layer 116 in the integrated module 11 is electrically connected to the ground pin of the substrate circuit board 13, and the fourth pin of the isolation insulating layer 116 is electrically connected to the ground pin of the intermediate circuit board 12. This connection method constructs a ground loop, and the isolation insulating layer 116 is connected to the grounding system by connecting to the ground pins of the substrate circuit board 13 and the intermediate circuit board 12. Its main function is to suppress the electromagnetic interference on the signal transmission line 115. In electronic equipment, components such as the inductor component 111 and the power transmission line 112 will generate electromagnetic interference during operation, and these interferences may affect the signal transmission quality of the signal transmission line 115. The isolation insulating layer 116 is connected to the ground, which can guide the induced electromagnetic interference to the ground, thereby effectively reducing the impact of electromagnetic interference on the signal transmission line 115 and ensuring the accuracy and reliability of signal transmission.

[0064] Figure 4 A schematic diagram of a board structure provided in an embodiment of the present disclosure is shown in FIG. Figure 4 As shown, the board includes: a base circuit board 13, an intermediate circuit board 12, and an integrated module 11; The intermediate circuit board 12 includes a power control circuit, which is electrically connected to the integrated module 11 . The power control circuit is used to modulate the current transmitted by the integrated module 11 and transmit the modulated current to the integrated module 11 .

[0065] In the embodiment of the present disclosure, the intermediate circuit board 12 and the integrated module 11 cooperate with each other to jointly realize the stable power supply to the target electrical device. A power supply control circuit is provided on the intermediate circuit board 12, and the circuit is electrically connected to the integrated module 11. The power supply control circuit undertakes the key current modulation task in the entire power supply system. When the integrated module 11 transmits the current to the intermediate circuit board 12, the power supply control circuit performs a series of modulation operations on the current. The current may be affected by various factors during the transmission process, such as voltage fluctuations, line impedance changes, etc., resulting in a decrease in the stability and quality of the current. The power supply control circuit adjusts and optimizes the input current by using technical means such as filtering, voltage stabilization, and current conversion. For example, a filter circuit composed of components such as capacitors and inductors can effectively remove clutter and ripples in the current and make the current smoother; by adjusting parameters such as resistance and inductance in the circuit, accurate control of the current size and voltage is achieved to ensure that the output current meets specific requirements. After modulation processing, the power supply control circuit will transmit the optimized current back to the integrated module 11 again.

[0066] The integrated module 11 includes a first pin surface 113 and a second pin surface 114; the pins of the first pin surface 113 are welded to the substrate circuit board 13, and the pins of the second pin surface 114 are welded to the intermediate circuit board 12; the integrated module 11 is used to balance and optimize the current transmitted by the power control circuit, and to vertically supply power to the target electrical devices in the substrate circuit board 13.

[0067] In the embodiment of the present disclosure, the integrated module 11 has a first pin face 113 and a second pin face 114, and these two pin faces play a key connection role in the power supply process. The pins of the first pin face 113 establish a stable electrical connection with the substrate circuit board 13 by welding. Welding, as a reliable connection method, can ensure good electrical conductivity between the pins and the substrate circuit board 13, reduce contact resistance, and thus reduce the loss of electric energy at the connection point. The pins of the second pin face 114 are welded to the intermediate circuit board 12, thereby realizing the electrical connection between the integrated module 11 and the intermediate circuit board 12. This connection method enables the integrated module 11 to receive the current modulated by the power supply control circuit on the intermediate circuit board 12. After receiving the current modulated by the power supply control circuit, the integrated module 11 will perform a balanced optimization process on it. The core components such as the inductor component inside the integrated module 11 play a role, and further adjust the current according to the principle of electromagnetic induction. The inductor component can suppress the fluctuation of the current, make the current more stable, and reduce the impact of the current change on the target electrical device. At the same time, by adjusting parameters such as the current phase, the current is evenly distributed, and the reliability and stability of the power supply are improved. The current after balanced optimization processing by the integrated module 11 is finally vertically powered to the target electrical device in the substrate circuit board 13 through the pins of the first pin surface 113. The vertical power supply method is of great significance in modern electronic devices. It can make full use of the vertical space of the circuit board, reduce the horizontal wiring occupation, and improve the space utilization rate of the circuit board. In addition, vertical power supply can shorten the current transmission path, reduce the energy loss during the transmission process, improve the power supply efficiency, meet the strict requirements of the target electrical device for power supply quality, and ensure that the target electrical device can operate stably and efficiently.

[0068] According to an embodiment of the present disclosure, the present disclosure also provides a board, an electronic device and a server.

[0069] It should be noted that the above explanation of the power supply device embodiment is also applicable to the board, electronic equipment, and server of this embodiment. The principles are the same and are no longer limited in this embodiment.

[0070] At least one in the present disclosure may also be described as one or more, and a plurality may be two, three, four or more, which is not limited in the present disclosure. In the embodiments of the present disclosure, for a technical feature, the technical features in the technical feature are distinguished by "first", "second", "third", "A", "B", "C" and "D", etc., and there is no order of precedence or size between the technical features described by the "first", "second", "third", "A", "B", "C" and "D".

[0071] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired results of the technical solution disclosed in this disclosure can be achieved, and no limitations are imposed herein.

[0072] The above specific embodiments do not constitute a limitation on the protection scope of this disclosure. Those skilled in the art should understand that various modifications, combinations, sub - combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure shall be included within the protection scope of this disclosure.

Claims

1. A power supply device, characterized in that: include: Integrated modules, intermediate circuit boards, substrate circuit boards; The intermediate circuit board and the base circuit board are stacked, and the integrated module is arranged between the two; The first pin surface of the integrated module is engaged with the substrate circuit board, and the second pin surface of the integrated module is engaged with the intermediate circuit board; The integrated module includes: an inductor component and a power transmission line; The output pin of the inductor component is arranged on the first pin surface, and the input pin is arranged on the second pin surface; the input pin of the power transmission line is arranged on the first pin surface, and the output pin is arranged on the second pin surface; the inductor coil of the inductor component and the power transmission line are perpendicular to the first pin surface, and the power transmission line is arranged in parallel with the inductor component.

2. The power supply device according to claim 1, characterized in that: The integrated module further comprises: a signal transmission circuit; The first pin of the signal transmission line is arranged on the first pin surface, and the second pin is arranged on the second pin surface.

3. The power supply device according to claim 2, characterized in that: In the device cavity, the signal transmission line is perpendicular to the first pin surface, and the signal transmission line is arranged in parallel with the power transmission line and the inductor component.

4. The power supply device according to claim 3, characterized in that: The signal transmission line is between the power transmission line and the inductor component.

5. The power supply device according to claim 2, characterized in that: The integrated module further comprises: an isolation insulating layer; The third pin of the isolation insulating layer is arranged on the first pin surface, and the fourth pin is arranged on the second pin surface.

6. The power supply device according to claim 5, characterized in that: In the device cavity, the isolation insulating layer is perpendicular to the first pin surface, and the isolation insulating layer divides the device cavity into a first cavity and a second cavity; the inductor component is located in the first cavity, and the signal transmission line and the power transmission line are located in the second cavity; The isolation insulating layer is respectively arranged in parallel with the inductor component, the signal transmission line, and the power transmission line.

7. The power supply device according to claim 1, characterized in that: The first connection surface of the substrate circuit board is connected to the first pin surface, and the second connection surface is connected to a target circuit board where a target electrical device is located.

8. The power supply device according to claim 1, characterized in that: The inductor component is a trans-inductor regulator; The output pins of the trans-inductor voltage regulator include a main coil pin and a secondary coil pin; the main coil pin and the secondary coil pin are arranged on the first pin surface.

9. The power supply device according to claim 1, characterized in that: The input pin of the power transmission circuit is electrically connected to the power line of the substrate circuit board; the output pin of the power transmission circuit is electrically connected to the intermediate circuit board.

10. The power supply device according to claim 1, characterized in that: The input pin of the inductor component is electrically connected to the intermediate circuit board, and the output pin of the inductor component is electrically connected to the substrate circuit board.

11. The power supply device according to claim 2, characterized in that: The first pin of the signal transmission circuit is communicatively connected to the substrate circuit board, and the second pin of the signal transmission circuit is communicatively connected to the intermediate circuit board.

12. The power supply device according to claim 5, characterized in that: The third pin of the isolation insulating layer is electrically connected to the ground line of the substrate circuit board, and the fourth pin of the isolation insulating layer is electrically connected to the ground line of the intermediate circuit board.

13. A board, characterized in that: The board includes: a power supply device as described in any one of claims 1 to 12 and a target circuit board where a target electrical device is located; The target circuit board is connected to a substrate circuit board of the power supply device.

14. An electronic device, characterized in that: The electronic device comprises: the board card as claimed in claim 13.

15. A server, characterized in that: The server comprises: the board card as claimed in claim 13.

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