Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a display panel, a printed circuit board, a flexible circuit board, a driving chip and a shielding film. The display panel comprises a display part, a bending part and a binding part connected in sequence. The display part is arranged opposite to the binding part. The printed circuit board comprises a first area and a second area connected in sequence in a first direction from the bending part to the display part. The binding part and the first area at least partially overlap in a projection of the display part. The second area and the binding part do not overlap in the projection of the display part. The flexible circuit board is electrically connected to the printed circuit board and the display panel. The driving chip partially overlaps the first area in the projection of the display part. The shielding film is arranged on a side of the driving chip away from the binding part. The shielding film partially overlaps the printed circuit board in the projection of the display part.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] OLED (Organic Light Emitting Diode) displays are self-emissive displays. Based on the driving method, they can be divided into PMOLED (Passive Matrix Driving OLED) displays and AMOLED (Active Matrix Driving OLED) displays. As a next-generation display technology, especially AMOLED technology, it has received increasing attention from the industry. Its high transmittance, ultra-thin design, high definition, long battery life, and low power consumption make OLED products a mainstream high-end product sought after by customers.

[0003] In some medium to large-sized display modules, IC (Integrated Circuit) cover tape is typically used to prevent EMI (Electromagnetic Interference) and EMC (Electromagnetic Compatibility). However, related technologies suffer from issues such as the large size and high cost of the IC cover tape. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a display module and a display device.

[0005] For the purposes described above, this application provides a display module, including:

[0006] The display panel includes a display section, a bending section, and a binding section connected in sequence; wherein the display section and the binding section are disposed opposite to each other.

[0007] A printed circuit board is disposed on the side of the bonding portion near the display portion; along a first direction from the bending portion to the display portion, the printed circuit board includes a first region and a second region connected together; the size of the first region in a second direction is smaller than the size of the second region in the second direction, and the second direction is a direction perpendicular to the display panel; the orthographic projection of the bonding portion on the display portion at least partially overlaps with the orthographic projection of the first region on the display portion, and the orthographic projection of the second region on the display portion does not overlap with the orthographic projection of the bonding portion on the display portion;

[0008] A flexible circuit board is disposed on the side of the bonding portion away from the display portion; both ends of the flexible circuit board are electrically connected to the printed circuit board and the display panel, respectively.

[0009] A driver chip is disposed on the side of the bonding portion away from the display portion; the orthographic projection of the driver chip onto the display portion overlaps with the orthographic projection of the first region onto the display portion.

[0010] A shielding film is disposed on the side of the driver chip away from the bonding portion; the orthographic projection of the shielding film on the display portion overlaps with the orthographic projection portion of the printed circuit board on the display portion.

[0011] In some embodiments, the end of the flexible circuit board away from the bend is bonded to the end of the second region away from the bend; the end of the flexible circuit board near the bend is bonded to the end of the bonding portion away from the bend.

[0012] In some embodiments, the first region has an exposed copper area whose orthographic projection on the display at least partially overlaps with the orthographic projection of the driver chip on the display.

[0013] In some embodiments, the first region has a first side close to the bonding portion and a second side away from the bonding portion; the exposed copper area is disposed on at least one of the first side and the second side.

[0014] In some embodiments, components are disposed on the printed circuit board; the components are disposed on the side of the second region away from the display; the orthographic projection of the components on the display is located within the orthographic projection of the flexible circuit board on the display.

[0015] In some embodiments, the display module further includes an adhesive layer; the adhesive layer is disposed on the side of the first region near the bonding portion.

[0016] In some embodiments, the first and second regions of the printed circuit board form a stepped structure.

[0017] In some embodiments, the shielding film includes a first insulating adhesive layer, a conductive layer, a wave-absorbing layer, and a second insulating adhesive layer stacked together.

[0018] In some embodiments, the display module further includes a heat dissipation film, a polarizer, an adhesive film layer, and a cover plate layer, wherein the heat dissipation film is disposed on the side of the printed circuit board near the display segment;

[0019] The polarizer is disposed on the side of the display panel away from the printed circuit board, and the polarizer at least covers the display segment;

[0020] The adhesive film layer is disposed on the side of the polarizing layer away from the display panel;

[0021] The cover plate layer is disposed on the side of the adhesive film layer opposite to the polarizing layer.

[0022] This application also provides a display device, including a display module as described in any of the preceding claims.

[0023] As can be seen from the above description, the display module and display device provided in this application, by setting a display panel, includes a display part, a bending part, and a bonding part connected in sequence; wherein, the display part and the bonding part are arranged opposite to each other; a printed circuit board is disposed on the side of the bonding part near the display part; along a first direction from the bending part to the display part, the printed circuit board includes a first region and a second region connected together; the size of the first region in a second direction is smaller than the size of the second region in the second direction, and the second direction is a direction perpendicular to the display panel; the orthographic projection of the bonding part on the display part at least partially overlaps with the orthographic projection of the first region on the display part, and the orthographic projection of the second region on the display part does not overlap with the orthographic projection of the bonding part on the display part; a flexible circuit board is disposed on the side of the bonding part away from the display part; the flexible circuit board... The two ends of the circuit board are electrically connected to the printed circuit board and the display panel, respectively. A driver chip is disposed on the side of the bonding portion away from the display portion; the orthographic projection of the driver chip on the display portion overlaps with the orthographic projection of the first region on the display portion. A shielding film is disposed on the side of the driver chip away from the bonding portion; the orthographic projection of the shielding film on the display portion overlaps with the orthographic projection of the printed circuit board on the display portion. This design fully utilizes the space between the printed circuit board and the bonding portion in the second direction. In the first direction, it reduces the distance between the bent portion of the printed circuit board and the display panel, and reduces the distance between the far end of the printed circuit board (i.e., the end away from the bent portion) and the far end of the flexible circuit board (i.e., the end away from the bent portion) in the first direction. This allows for a reduction in the size and area of ​​the shielding film in the first direction, thus lowering costs. Simultaneously, it increases the distance between the far end of the printed circuit board and the far end of the display segment of the display panel (i.e., the end away from the bent portion), providing more design space for the entire device. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a cross-sectional view of an exemplary display module;

[0026] Figure 2 This is a partial top view of an exemplary display module;

[0027] Figure 3 This is a cross-sectional structural diagram of the display module according to an embodiment of this application;

[0028] Figure 4a This is a schematic diagram of the PCB structure according to an embodiment of this application;

[0029] Figure 4b This is a side view of the PCB according to an embodiment of this application;

[0030] Figure 4c This is another side view of the PCB according to an embodiment of this application;

[0031] Figure 5 This is a partial top view of the display module according to an embodiment of this application;

[0032] Figure 6 This is a schematic diagram of the shielding membrane in an embodiment of this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1-Display panel; 11-Display section; 12-Bending section; 13-Bonding section; 2-Printed circuit board; 21-Gold finger structure; 22-Exposed copper area; 23-Components; 231-Flash; 232-Tcon; 233-PMIC; 234-TIC; 24-Connector; 25-First area; 26-Second area; 27-Back film layer; 3-Flexible circuit board; 31-Bonding structure; 4-Driver chip; 5-Shielding film; 51-First insulating adhesive layer; 52-Conductive layer; 53-Wave absorption layer; 54-Second insulating adhesive layer; 6-Heat dissipation film; 7-Polarizer; 8-Adhesive film layer; 9-Cover plate layer; 10-Adhesive layer; 14-Support pad; X-First direction; Y-Second direction. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0036] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0037] With the international environment becoming increasingly complex and the economy slowing down, cost reduction and efficiency improvement have become a major theme and business strategy for enterprises. Therefore, it is of great significance to adopt solutions with less material and lower cost while ensuring product performance, such as further enhancing the competitiveness of products.

[0038] In related technologies, to ensure a product's EMI and EMC capabilities, an IC cover tape, consisting of absorbing material and copper foil, is typically attached to the PCB (Printed Circuit Board). Generally, the larger the area covered, the higher the cost. Tests have shown that to pass EMI tests, as much PCB coverage as possible is required. Figure 1 and Figure 2 A structural diagram of a display module in the related technology is shown. A bending spacer 14 is provided between the bonding portion and the display portion of the display panel. The PCB is positioned away from the bonding portion, and the PCB and the bonding portion are electrically connected via an FPC. This design presents several problems: the PCB is bonded to the far end of the FPC from its near end, resulting in a relatively large distance d1 between the PCB and the bending section of the display panel. If the IC cover tape covers as much of the PCB as possible, the area used for the IC cover tape will be very large, leading to higher costs.

[0039] Based on this, this application provides a display module that, by designing the PCB as a stepped shape and using far-end bonding, can reduce the distance between the PCB and the panel, effectively reducing the area of ​​the IC Cover Tape and saving an estimated 50%, thereby solving to some extent the problem of the large area and high cost of the IC Cover Tape.

[0040] like Figure 3As shown, the display module provided in this application embodiment may include:

[0041] The display panel 1 includes a display part 11, a bending part 12, and a binding part 13 connected in sequence; wherein the display part 11 and the binding part 13 are disposed opposite to each other; by bending the bending part 12, the binding part 13 can be disposed opposite to the display part 11.

[0042] A printed circuit board 2 is disposed on the side of the bonding portion 13 near the display portion 11; along a first direction X from the bending portion 12 to the display portion 11, the printed circuit board 2 includes a first region 25 and a second region 26 connected together; the size of the first region 25 in a second direction Y is smaller than the size of the second region 26 in the second direction Y, where the second direction Y is perpendicular to the display panel 1; the orthographic projection of the bonding portion 13 on the display portion 11 at least partially overlaps with the orthographic projection of the first region 25 on the display portion 11, and the orthographic projection of the second region 26 on the display portion 11 does not overlap with the orthographic projection of the bonding portion 13 on the display portion 11;

[0043] A flexible circuit board 3 is disposed on the side of the bonding portion 13 away from the display portion 11; both ends of the flexible circuit board 3 are electrically connected to the printed circuit board 2 and the display panel 1, respectively.

[0044] The driving chip 4 is disposed on the side of the bonding portion 13 away from the display portion 11; the orthographic projection of the driving chip 4 onto the display portion 11 overlaps with the orthographic projection of the first region 25 onto the substrate display panel 1.

[0045] A shielding film 5 is disposed on the side of the driving chip 4 away from the bonding portion 13; the orthographic projection of the shielding film 5 on the display portion 11 overlaps with the orthographic projection portion of the printed circuit board 2 on the display portion 11.

[0046] The display module provided in this application embodiment includes a display panel 1 comprising a display portion 11, a bending portion 12, and a bonding portion 13 connected in sequence. The display portion 11 and the bonding portion 13 are positioned opposite each other. The bending of the bending portion 12 allows the bonding portion 13 to be positioned opposite the display portion 11. A printed circuit board 2 is disposed on the side of the bonding portion 13 near the display portion 11. Along a first direction X from the bending portion 12 to the display portion 11, the printed circuit board 2 includes a first region 25 and a second region 26 connected in a second direction Y. The size of the first region 25 in a second direction Y is smaller than the size of the second region 26 in the second direction Y, where the second direction Y is perpendicular to the display panel 1. The orthographic projection of the bonding portion 13 onto the display portion 11 at least partially overlaps with the orthographic projection of the first region 25 onto the display portion 11, while the orthographic projection of the second region 26 onto the display portion 11 does not overlap with the orthographic projection of the bonding portion 13 onto the display portion 11. A flexible circuit board 3 is disposed away from the bonding portion 13. The display unit 11 is located on one side; the flexible circuit board 3 is electrically connected to the printed circuit board 2 and the display panel 1 at both ends, respectively; a driving chip 4 is disposed on the side of the bonding portion 13 away from the display unit 11; the orthographic projection of the driving chip 4 on the display unit 11 overlaps with the orthographic projection of the first region 25 on the substrate display panel 1; a shielding film 5 is disposed on the side of the driving chip 4 away from the bonding portion 13; the orthographic projection of the shielding film 5 on the display unit 11 overlaps with the orthographic projection of the printed circuit board 2 on the display unit 11, which can make full use of the space between the printed circuit board 2 and the bonding portion 13 in the second direction Y, and reduce the distance between the printed circuit board 2 and the bending portion 12 of the display panel 1 in the first direction X, and reduce the distance between the far end of the printed circuit board 2 (i.e., the end away from the bending portion 12) and the far end of the flexible circuit board 3 (i.e., the end away from the bending portion 12) in the first direction X, thereby reducing the size of the shielding film 5 in the first direction X to a certain extent, reducing the area of ​​the shielding film 5, and reducing the cost. It can also increase the distance between the far end of the printed circuit board 2 and the far end of the display segment of the display panel 1 (that is, the end away from the bend 12), thereby reserving more design space for the whole machine.

[0047] In some embodiments, the display panel 1 can be an active-matrix display panel 1, such as an organic light-emitting diode (OLED) display panel 1, an active-matrix organic light-emitting diode (AMOLED) display panel 1, a passive-matrix organic light-emitting diode (AMOLED) display panel 1, a quantum dot organic light-emitting diode (QLED) display panel 1, etc.

[0048] In some embodiments, the display panel 1 can be a liquid crystal display panel 1. The embodiments of this application do not limit the type of the display panel 1. It can be a vertical electric field type liquid crystal display panel 1, such as a twisted nematic (TN) type liquid crystal display panel 1, a multi-domain vertical alignment (MVA) type liquid crystal display panel 1, or a horizontal electric field type liquid crystal display panel 1, such as a fringe field switching (FFS) type liquid crystal display panel 1 or an in-plane switching (IPS) type liquid crystal display panel 1, etc.

[0049] In some embodiments, the display panel 1 may include a substrate and a plurality of film layers disposed on one side of the substrate. These film layers may include stacked driving circuit layers, light-emitting layers, touch layers, and encapsulation layers, etc. These film layers enable the display panel 1 to emit light, thereby displaying image content.

[0050] In some embodiments, reference Figure 3 A heat dissipation film 6 can be provided on the side of the display section 11 near the bonding section 13. Typically, a certain distance can exist between the heat dissipation film 6 and the bending section 12. The heat dissipation film 6 allows for better heat dissipation. The heat dissipation film 6 can be a super clean foam (SCF) protective film.

[0051] In some of these embodiments, reference continues. Figure 3A printed circuit board 2 can be provided on the side of the heat dissipation film 6 near the bonding portion 13. That is, the printed circuit board 2 can be provided on the side of the bonding portion 13 near the display portion 11. In the printed circuit board 2, the size of the first region 25 in the first direction X can be slightly larger than the bonding portion 13. That is, the orthographic projection of the bonding portion 13 onto the display portion 11 can be located within the orthographic projection of the first region 25 onto the display portion 11. This is to better support the bonding portion 13 and better ensure that the bonding portion 13 is in a horizontal state.

[0052] In some of these embodiments, such as Figure 4b As shown, an adhesive layer 10 can also be provided on the side of the first region 25 near the bonding portion 13. The adhesive layer 10 bonds the first region 25 and the bonding portion 13, and keeps the bent section in a bent state. That is, the adhesive layer 10 is used to raise and fix the bonding portion 13, so that the bonding portion 13 can be in a horizontal state. The adhesive layer 10 can usually be an adhesive. This structural design, compared with the structure of setting a support pad (bending spacer) between the heat dissipation film 6 and the bonding portion 13, can eliminate the support pad (bending spacer), thereby saving costs to a certain extent. For example, for the shielding film 5 (IC Cover Tape) with the original size of 291mm (length) * 39.82mm (width), it can save about 14 yuan in cost. In addition, it can also increase the distance from the end of the printed circuit board 2 away from the bending portion 12 to the end of the display portion 11 away from the bending portion 12, leaving more design space for the whole machine and facilitating the routing of other areas.

[0053] In some embodiments, a driver chip 4 (source IC) may be disposed on the side of the bonding portion 13 away from the adhesive layer. The orthographic projection of the driver chip 4 onto the display portion 11 may be located within the orthographic projection of the first region 25 onto the display portion 11.

[0054] In some embodiments, reference Figure 4a As shown, the first region 25 has an exposed copper area 22. The orthographic projection of the exposed copper area 22 onto the display unit 11 at least partially overlaps with the orthographic projection of the driver chip 4 onto the display unit 11. For example, the orthographic projection of the exposed copper area 22 onto the display unit 11 may exactly overlap with the orthographic projection of the driver chip 4 onto the display unit 11, and the orthographic projection of the driver chip 4 onto the display unit 11 may also be located within the orthographic projection of the exposed copper area 22 onto the display unit 11. Typically, the exposed copper area 22 can be formed by creating a window on the printed circuit board 2. By providing the exposed copper area 22, the heat generated by the driver chip 4 can be dissipated more effectively.

[0055] In some embodiments, reference Figure 3and Figure 4a The exposed copper area 22 can be located on at least one side of the first region 25, near the bonding portion 13, and on the side of the first region 25 away from the bonding portion 13. Typically, the exposed copper area 22 can be located only on the side of the first region 25 near the bonding portion 13.

[0056] In some of these embodiments, return Figure 3 The flexible circuit board 3 is disposed on the side of the printed circuit board 2 away from the display section 11. The proximal end of the flexible circuit board 3 (i.e., the end near the bend 12) is bonded to the distal end of the bonding section 13 (i.e., the end away from the bend 12), achieving an electrical connection. The distal end of the flexible circuit board 3 (i.e., the end away from the bend 12) is also bonded to the distal end of the second region 26 (i.e., the end away from the bend 12), achieving an electrical connection. In other words, the end of the flexible circuit board 3 away from the bend 12 is bonded to the end of the printed circuit board 2 away from the bend 12; the end of the flexible circuit board 3 near the bend 12 is bonded to the end of the bonding section 13 away from the bend 12. Thus, the flexible circuit board 3 achieves an electrical connection between the printed circuit board 2 and the display panel 1. In this way, by bonding the far end of the printed circuit board 2 (i.e., the end furthest from the bend 12) to the far end of the flexible circuit board 3 (i.e., the end furthest from the bend 12), compared to bonding the near end of the printed circuit board 2 (i.e., the end closest to the bend 12) to the far end of the flexible circuit board 3 (i.e., the end furthest from the bend 12), the distance between the far end of the printed circuit board 2 (i.e., the end furthest from the bend 12) and the bend segment can be minimized, thereby reducing the area of ​​the shielding film 5. For example, for the shielding film 5 (IC Cover Tape) with original dimensions of 291mm (length) * 39.82mm (width), approximately 50% of the cost can be saved.

[0057] In some embodiments, the flexible circuit board 3 may include a copper-clad layer and a trace layer stacked together. Typically, the copper-clad layer can be a single layer of copper or a grid of copper layers. The copper-clad layer effectively shields against external electromagnetic interference, particularly electromagnetic interference originating from the touch layer. This application does not specify the exact location of the copper-clad layer and the trace layer. Either the copper-clad layer or the trace layer can be positioned close to the printed circuit board 2. For example, the copper-clad layer is positioned close to the printed circuit board 2, and the trace layer is positioned on the side of the copper-clad layer furthest from the printed circuit board 2.

[0058] In some embodiments, reference Figure 3 and Figure 4aAs shown, on the side of the printed circuit board 2 away from the display unit 11, a gold finger structure 21 can be provided at the end of the second region 26 away from the bending portion 12. The end of the flexible circuit board 3 away from the bending portion 12 is electrically connected to the end of the printed circuit board 2 away from the bending portion 12 via the gold finger structure 21. On the side of the flexible circuit board 3 away from the display unit 11, a corresponding bonding structure 31 can be provided at the end near the bending portion 12, through which a bonding electrical connection with the bonding portion 13 is achieved.

[0059] In some embodiments, reference Figure 4b and Figure 4c As shown, the display module may further include components 23 (e.g., PCB components 23); the components 23 are disposed on the side of the printed circuit board 2 away from the display section 11, for example, on the side of the second region 26 away from the display section 11. Figure 5 As shown, the projection of component 23 onto display unit 11 is located within the projection of the second region 26 onto display unit 11, and the orthographic projection of component 23 onto display unit 11 is located within the orthographic projection of flexible circuit board 3 onto display unit 11. In this way, component 23 can be located in the space below flexible circuit board 3, that is, in the space between flexible circuit board 3 and printed circuit board 2. This better avoids the influence of external electromagnetic interference, such as touch interference, on sensitive component 23.

[0060] In some embodiments, reference Figure 4b As shown, the first region 25 and the second region 26 of the printed circuit board 2 can form a stepped structure. The connection between the first region 25 and the second region 26 can have an included angle, which can be a right angle. In some possible embodiments, refer to... Figure 4c As shown, the included angle can be an obtuse angle, and the cross-section at the connection can be a slope.

[0061] In some embodiments, reference Figure 4a As shown, the component 23 may include Flash231 (memory chip) and Tcon232 (Timing Controller), as well as power chips such as PMIC233 (Power Management Integrated Circuit) and TIC234 (Touch Integrated Circuit). The power chips can be used as power supply chips for PNL (Panel).

[0062] In some embodiments, reference Figure 5As shown, multiple flexible circuit boards 3 can be configured. In a third direction parallel to the surface of the display panel 1 and perpendicular to the first direction X, multiple flexible circuit boards 3 can be configured, with each flexible circuit board 3 having its two ends electrically connected to the printed circuit board 2 and the bonding portion 13, respectively.

[0063] In some embodiments, reference Figure 5 As shown, the printed circuit board 2 may also be provided with a connector 24 for connection to the outside. It should be understood that the orthographic projection of the shielding film 5 on the display part 11 overlaps with the orthographic projection of the area of ​​the printed circuit board 2 where the connector 24 is not provided on the display part 11, and the orthographic projection of the shielding film 5 on the display part 11 does not intersect with the orthographic projection of the area of ​​the printed circuit board 2 where the connector 24 is provided on the display part 11.

[0064] In some embodiments, reference Figure 6 As shown, the shielding film 5 may include a first insulating adhesive layer 51, a conductive layer 52, a wave-absorbing layer 53, and a second insulating adhesive layer 54 stacked together. This embodiment does not specify the exact placement of the conductive layer 52 and the wave-absorbing layer 53 in the shielding film 5. The conductive layer 52 may be positioned close to the flexible circuit board 3, or the wave-absorbing layer 53 may be positioned close to the flexible circuit board 3. The shielding film 5 can be bonded using either the first insulating adhesive layer 51 or the second insulating adhesive layer 54, for example, to the bonding part 13, the driving chip 4, the flexible circuit board 3, the printed circuit board 2, and the display part 11. The first insulating adhesive layer 51 may be made of insulating Mylar adhesive, and the second insulating adhesive layer 54 may also be made of insulating Mylar adhesive. The conductive layer 52 may be made of conductive copper foil. The wave-absorbing layer 53 may be made of at least one of polyethylene terephthalate (PET), polyimide (PI), graphite, and copper.

[0065] In some embodiments, the absorbing layer 53 can be a single-layer structure, and the material can be one of polyethylene terephthalate (PET), polyimide (PI), graphite, and copper. The absorbing layer 53 can also be a multi-layer structure, and the materials of the absorbing layers can be a combination of these materials. For example, when the absorbing layer 53 comprises a two-layer structure, one absorbing layer 53 can be made of PET, and the other absorbing layer 53 can be made of copper.

[0066] The display module provided in this application embodiment, by designing the PCB in a stepped shape, can replace the bending spacer while achieving its own functions, and simultaneously greatly reduces the area of ​​the IC cover tape, thereby lowering the cost of the display module. The method of bonding the far end of the PCB to the FPC in this application embodiment has been tested and shows good bonding performance.

[0067] Based on the same inventive concept, embodiments of this application disclose a display device, including any of the display modules described above in the embodiments of this application.

[0068] The aforementioned display device may be a touch-enabled display device, or a foldable or rollable display device, or a display device that simultaneously has touch and foldable functions; no limitation is made here. The display device may be a flexible display device (also known as a flexible screen) or a rigid display device (i.e., a display screen that cannot be bent); no limitation is made here.

[0069] Specifically, the display device may include computer monitors, televisions, billboards, laser printers with display functions, telephones, mobile phones, personal digital assistants (PDAs), laptops, digital cameras, portable camcorders, viewfinders, vehicles, large walls, theater screens, or stadium signs, etc.

[0070] It should be understood that the display device includes a display module as described in any of the preceding embodiments, and therefore has the effects corresponding to the display module embodiments.

[0071] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0072] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0073] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0074] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized in that, include: The display panel includes a display section, a bent section, and a binding section connected in sequence; wherein the display section and the binding section are disposed opposite to each other. A printed circuit board is disposed on the side of the bonding portion near the display portion; along a first direction from the bending portion to the display portion, the printed circuit board includes a first region and a second region connected together; the size of the first region in a second direction is smaller than the size of the second region in the second direction, and the second direction is a direction perpendicular to the display panel; the orthographic projection of the bonding portion on the display portion at least partially overlaps with the orthographic projection of the first region on the display portion, and the orthographic projection of the second region on the display portion does not overlap with the orthographic projection of the bonding portion on the display portion; A flexible circuit board is disposed on the side of the bonding portion away from the display portion; both ends of the flexible circuit board are electrically connected to the printed circuit board and the display panel, respectively. A driver chip is disposed on the side of the bonding portion away from the display portion; the orthographic projection of the driver chip onto the display portion overlaps with the orthographic projection of the first region onto the display portion. A shielding film is disposed on the side of the driver chip away from the bonding portion; the orthographic projection of the shielding film on the display portion overlaps with the orthographic projection portion of the printed circuit board on the display portion.

2. The display module according to claim 1, characterized in that, The end of the flexible circuit board away from the bend is bonded to the end of the second region away from the bend; the end of the flexible circuit board near the bend is bonded to the end of the bonding portion away from the bend.

3. The display module according to claim 1, characterized in that, The first region has an exposed copper area, and the orthographic projection of the exposed copper area onto the display panel at least partially overlaps with the orthographic projection of the driver chip onto the display panel.

4. The display module according to claim 3, characterized in that, The first region has a first side close to the bonding portion and a second side away from the bonding portion; the exposed copper area is disposed on at least one of the first side and the second side.

5. The display module according to claim 1, characterized in that, The printed circuit board is provided with components; the components are located on the side of the second region away from the display part; the orthographic projection of the components on the display part is located within the orthographic projection of the flexible circuit board on the display part.

6. The display module according to claim 1, characterized in that, The display module further includes an adhesive layer; the adhesive layer is disposed on the side of the first region near the bonding portion.

7. The display module according to claim 1, characterized in that, The first and second regions of the printed circuit board form a stepped structure; a back film layer is provided on the side of the printed circuit board near the display section.

8. The display module according to claim 1, characterized in that, The shielding film comprises a first insulating adhesive layer, a conductive layer, a wave-absorbing layer, and a second insulating adhesive layer, which are stacked together.

9. The display module according to claim 1, characterized in that, The display module also includes a heat dissipation film, a polarizer, an adhesive film layer, and a cover plate layer. The heat dissipation film is disposed on the side of the printed circuit board near the display section. The polarizer is disposed on the side of the display panel away from the printed circuit board, and the polarizer at least covers the display segment; The adhesive film layer is disposed on the side of the polarizer away from the display panel; The cover plate layer is disposed on the side of the adhesive film layer opposite to the polarizer.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-9.

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