Multi-pad chip magnetic part and vertical integrated power supply module

Abstract

The invention discloses a multi-pad chip magnetic element and vertical integrated power supply module, which comprises a first magnetic element inductance part, a first electrical connection pad, a second electrical connection pad and a heat conduction pad, the first electrical connection bonding pad, the second electrical connection bonding pad and the heat conduction bonding pad are all directly pressed on the first magnetic piece inductor part through the pressing technology. The chip magnetic detection module has the advantages of being high in expansibility, excellent in heat dissipation performance and high in power density.

Description

Technical Field

[0001] The invention belongs to the technical field of packaging, and relates to a multi-pad chip magnetic component and a vertically integrated power module. Background Art

[0002] With the continuous development of modern information technology, high-computing applications such as artificial intelligence, data centers and unmanned driving have exploded, bringing about the demand for extremely high power density. At the same time, there is a trend of miniaturization of power supply load terminals, which will lead to high-performance microprocessors consuming hundreds or even thousands of amperes of current within a few square centimeters of chip area, and the power density reaches hundreds of watts per square centimeter. In these systems, advanced power modules are urgently needed to meet the power density requirements.

[0003] Today, most off-the-shelf power modules use discrete magnetic components, which take up a lot of space and limit the further improvement of power density. As power requirements become more complex and stringent, discrete magnetic component design has difficulty keeping up with the pace of development. At present, some magnetic integrated power applications have also emerged, which vertically integrate discrete magnetic components into the power module, thereby reducing the package plane size and improving power density and space utilization. However, these magnetic integrated power applications have the defects of poor solderability, poor scalability and poor heat dissipation performance. In order to pursue the ultimate performance of power supply and reduce the loss and volume of the power module, a new type of vertically integrated magnetic component is needed, which has high integration scalability and high heat dissipation performance, and can make full use of the internal space of the power module to maximize power density.

[0004] Defects and shortcomings of the existing technology:

[0005] The existing vertical integration technology of magnetic components uses the copper sheets of the internal windings as electrical connection terminals. The electrical connection terminals are fixed in position and need to be soldered to the pads of the PCB or substrate before they can be interconnected with the main circuit. The scalability of vertical integration of magnetic components is poor.

[0006] The existing vertical integration technology of magnetic components is restricted by limited electrical connection terminals, and its overall effective heat dissipation path is relatively small, resulting in poor heat dissipation performance of vertically integrated magnetic components.

[0007] In the existing vertical integration technology of magnetic components, the chip or bare die cannot be directly welded and connected to the magnetic component, so the chip and passive devices cannot be embedded in the magnetic component, and the space between the magnetic component and the chip and passive devices cannot be effectively utilized, which limits the further improvement of power density. Summary of the invention

[0008] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a multi-pad chip-based magnetic component and a vertically integrated power module. The chip-based magnetic detection and module have the characteristics of strong scalability, excellent heat dissipation performance and high power density.

[0009] To achieve the above-mentioned purpose, the present invention discloses a non-slotted multi-pad chip magnetic component, including a first magnetic component inductor part, a first electrical connection pad, a second electrical connection pad and a thermal conductive pad, wherein the first electrical connection pad, the second electrical connection pad and the thermal conductive pad are all directly pressed onto the first magnetic component inductor part through a pressing process.

[0010] The further improvement of the non-slotted multi-pad chip-based magnetic component of the present invention is:

[0011] Furthermore, the positions and quantities of the first electrical connection pad, the second electrical connection pad and the thermal conductive pad are determined according to the application scenario.

[0012] The present invention discloses a non-slotted magnetic component vertical integrated power module, comprising a first passive component, a thermal conductive solder bump, a first electrical connection solder bump, a second electrical connection bump, a first chip, a first substrate and a non-slotted multi-pad chip magnetic component;

[0013] The first electrical connection pad is welded to the first chip via a first electrical connection solder bump; the second electrical connection pad is welded to the first substrate via a second electrical connection bump; the thermal conductive pad is welded to the first substrate via a thermal conductive solder bump; the first magnetic component inductor part, the first passive component and the first chip are interconnected by direct welding or by wiring of the first substrate.

[0014] The present invention discloses a slotted multi-pad chip magnetic component, comprising a second magnetic component inductor part, an active device groove, a passive device groove, a first pad, a second pad and a third pad; the first pad, the second pad and the third pad are directly pressed on the bottom of the second magnetic component inductor part through a pressing process.

[0015] The further improvement of the non-slotted multi-pad chip-based magnetic component of the present invention is:

[0016] Furthermore, the positions and quantities of the first pad, the second pad and the third pad are determined according to the application scenario.

[0017] Furthermore, the second pad is a Z-shaped pad.

[0018] Furthermore, the second pad flows through the bottom, sidewalls and top of the active device groove.

[0019] Furthermore, the active device groove and the passive device groove are both opened at the bottom of the inductor portion of the second magnetic component through a slotting process.

[0020] The invention discloses a slotted magnetic component vertically integrated power supply module, comprising a second chip, a second passive device, a second substrate and a slotted multi-pad chip-based magnetic component; the second chip is placed in the active device groove and is welded and connected to the first pad via a first solder bump; the second passive device is placed in the passive device groove; the second pad is welded and connected to the second substrate via a second solder bump; the third pad is welded and connected to the second substrate via a third solder bump; the inductance part of the second magnetic component, the second chip and the second passive device are interconnected by direct welding or by wiring on the second substrate.

[0021] The further improvement of the slotted magnetic component vertical integrated power module of the present invention is:

[0022] Furthermore, the second chip includes but is not limited to: a bare chip and a packaged single chip.

[0023] The present invention has the following beneficial effects:

[0024] During the specific operation of the multi-pad chip-based magnetic component and vertically integrated power supply module described in the present invention, pads are directly pressed out on the outer surface or inner surface of the magnetic component through a pressing process during the manufacturing process of the magnetic component. The pads can be flexibly distributed on the outer surface of the magnetic component or even on the inner groove of the magnetic component according to the design, and have excellent solderability to form a chip-based magnetic component, which solves the current problem of poor scalability of vertical integration of magnetic components. In addition, the present invention sets a thermal conductive pad while setting an electrical connection pad, which greatly enriches the effective heat dissipation path of the magnetic component and improves the current problem of poor heat dissipation performance of the magnetic component. Finally, the chip and passive components are embedded in the magnetic component and directly connected to form a part of the main circuit, which can effectively utilize the space between the magnetic component and the chip and passive components, and greatly improve the power density of the power supply module. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0026] Figure 1 It is a structural diagram of embodiment 1;

[0027] Figure 2a is a structural diagram of Embodiment 2;

[0028] Figure 2b It is a side view of the second embodiment;

[0029] Figure 3 It is a structural diagram of embodiment 3;

[0030] Figure 4 is a structural diagram of Embodiment 4;

[0031] Figure 5 This is the distribution diagram in Example 4;

[0032] Figure 6 This is a structural diagram of embodiment 5.

[0033] Among them, 100 is the inductor part of the first magnetic component, 101 is the first electrical connection pad, 102 is the second electrical connection pad, 103 is the thermal conductive pad, 201 is the first passive component, 202 is the thermal conductive solder bump, 203 is the first electrical connection solder bump, 204 is the second electrical connection bump, 205 is the first chip, 206 is the first substrate, 300 is the active component groove, 301 is the passive component groove, 302 is the first pad, 303 is the second pad, 304 is the third pad, 400 is the first solder bump, 401 is the second solder bump, 402 is the third solder bump, 500 is the inductor part of the second magnetic component, 501 is the second chip, 502 is the second passive component, 503 is the second substrate, 600 is the magnetic core, 601 is the trapezoidal copper sheet winding, 602 is the winding placement position inside the magnetic core, and 603 is the bottom square groove. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In the description of the present invention, it should be understood that the terms “include” and “comprises” indicate the presence of described features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or collections thereof.

[0036] It should also be understood that the terms used in the present specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the present specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0037] It should be further understood that the term "and / or" used in the present specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes these combinations. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present invention generally indicates that the associated objects are in an "or" relationship.

[0038] It should be understood that, although the terms first, second, third, etc. may be used to describe preset ranges, etc. in the embodiments of the present invention, these preset ranges should not be limited to these terms. These terms are only used to distinguish preset ranges from each other. For example, without departing from the scope of the embodiments of the present invention, the first preset range may also be referred to as the second preset range, and similarly, the second preset range may also be referred to as the first preset range.

[0039] The word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0040] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings here can usually be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0041] Various structural schematic diagrams of the embodiments disclosed in the present invention are shown in the accompanying drawings. These figures are not drawn to scale, and some details are magnified and some details may be omitted for the purpose of clear expression. The shapes of various regions and layers shown in the figures and the relative sizes and positional relationships therebetween are only exemplary, and may deviate in practice due to manufacturing tolerances or technical limitations, and those skilled in the art may additionally design regions / layers with different shapes, sizes, and relative positions according to actual needs.

[0042] As is known, pads are a key component in the field of electronic manufacturing. The following is a detailed introduction to pads: pads, also known as Land or Pad in English, are the basic building blocks of surface mount assembly. On a circuit board, a pad is a metal area that connects electronic components to circuits, usually made of copper, and formed by chemical or mechanical processing. Its main function is to provide proper electrical contact to ensure that electronic components can be firmly fixed on the circuit board during welding and electrical connection, and transmit signals and power normally. Pads come in a variety of types and shapes to meet different types of electronic components and circuit board design requirements. Common pad shapes include: Square pads: mostly used on printed boards with large and few components and simple printed conductors. Round pads: widely used in single-sided and double-sided printed boards with regular arrangement of components. Teardrop pads: often used when the traces connected to the pads are thin to prevent the pads from peeling and the traces from being disconnected from the pads. This type of pad is often used in high-frequency circuits. Polygonal pads: used to distinguish pads with similar outer diameters but different apertures, which is convenient for processing and assembly. Oval pad: It has enough area to enhance the anti-peeling ability and is often used in dual in-line devices. In addition, there are special shapes such as open pads to meet specific welding and assembly requirements.

[0043] Embodiment 1

[0044] refer to Figure 1 The present embodiment discloses a non-slotted multi-pad chip-based magnetic component, comprising a first magnetic component inductor portion 100, a first electrical connection pad 101, a second electrical connection pad 102 and a thermally conductive pad 103, wherein the first electrical connection pad 101, the second electrical connection pad 102 and the thermally conductive pad 103 are directly pressed onto the first magnetic component inductor portion 100 through a pressing process, and the positions and quantities of the first electrical connection pad 101, the second electrical connection pad 102 and the thermally conductive pad 103 can be flexibly set, the first electrical connection pad 101 is directly welded to the chip or bare die for electrical connection and thermal conduction; the second electrical connection pad 102 is directly welded to the substrate or PCB for electrical connection and thermal conduction; the thermally conductive pad 103 is directly welded to the substrate or PCB for thermal conduction.

[0045] Embodiment 2

[0046] refer to Figure 2a and Figure 2bThe present embodiment discloses a non-slotted magnetic component vertically integrated power module, comprising a first passive component 201, a thermally conductive solder bump 202, a first electrical connection solder bump 203, a second electrical connection bump 204, a first chip 205, a first substrate 206 and the non-slotted multi-pad chip-based magnetic component described in Example 1; the non-slotted multi-pad chip-based magnetic component comprises a first magnetic component inductor part 100, a first electrical connection pad 101, a second electrical connection pad 102 and a thermally conductive pad 103, wherein the first electrical connection pad 101, the second electrical connection pad 102 and the thermally conductive pad 103 are directly pressed onto the first magnetic component inductor part 100 through a pressing process.

[0047] The first electrical connection pad 101 is welded to the first chip 205 via the first electrical connection solder bump 203; the second electrical connection pad 102 is welded to the first substrate 206 via the second electrical connection bump 204; the thermal conductive pad 103 is welded to the first substrate 206 via the thermal conductive solder bump 202; the first magnetic component inductor part 100, the first passive component 201 and the first chip 205 are interconnected by direct welding or by wiring of the first substrate 206 to form a circuit of the power module.

[0048] Embodiment 3

[0049] refer to Figure 3 This embodiment discloses a slotted multi-pad chip-type magnetic component, comprising a second magnetic component inductor part 500, an active device groove 300, a passive device groove 301, a first pad 302, a second pad 303 and a third pad 304; the first pad 302, the second pad 303 and the third pad 304 are directly pressed on the bottom of the second magnetic component inductor part 500 by a pressing process, and the position and quantity can be flexibly set, and can be used for electrical connection and heat conduction;

[0050] The second pad 303 is a Z-shaped pad. The active device groove 300 and the passive device groove 301 are both opened at the bottom of the second magnetic component inductor part 500 through a slotting process. The second pad 303 flows through the bottom, sidewall and top of the active device groove 300.

[0051] Embodiment 4

[0052] refer to Figure 5 and Figure 4The present embodiment discloses a slotted magnetic component vertically integrated power module including a second chip 501, a second passive device 502, a second substrate 503 and the slotted multi-pad chip-based magnetic component described in Example 3; the slotted multi-pad chip-based magnetic component includes a second magnetic component inductor part 500, an active device groove 300, a passive device groove 301, a first pad 302, a second pad 303 and a third pad 304; the first pad 302, the second pad 303 and the third pad 304 are directly pressed on the bottom of the second magnetic component inductor part 500 through a pressing process.

[0053] The second chip 501 is placed in the active device groove 300 and is welded to the first pad 302 through the first solder bump 400; the second passive device 502 is placed in the passive device groove 301; the second pad 303 is welded to the second substrate 503 through the second solder bump 401; the third pad 304 is welded to the second substrate 503 through the third solder bump 402; the second magnetic inductor part 500, the second chip 501 and the second passive device 502 are interconnected by direct welding or by wiring on the second substrate 503 to form a circuit of the power module.

[0054] Embodiment 5

[0055] refer to Figure 6 In this embodiment, a magnetic component inductor part includes a magnetic core 600, a trapezoidal copper sheet winding 601, a winding placement position 602 inside the magnetic core, and a bottom square groove 603; the trapezoidal copper sheet winding 601 is placed at the winding placement position 602 inside the magnetic core, and the magnetic core 600 and the trapezoidal copper sheet winding 601 are directly formed and integrated together through a pressing process, and the lead-out pad of the trapezoidal copper sheet winding 601 can be used for both electrical connection and heat dissipation; the bottom square groove 603 is a groove form, and chips and passive devices can be placed inside it at the same time.

[0056] In this embodiment, the material of the magnetic core 600 includes but is not limited to magnetic powder core and ferrite.

[0057] In this embodiment, the number, shape, thickness and distribution of the second pads 303 can be flexibly set and are not limited to the plane. A vertical Z-shaped pad can be set. For example, the second pad 303 is a Z-shaped pad, and the Z-shaped pad can also be set on the outer wall of the magnetic component.

[0058] In this embodiment, the material of the solder bump includes but is not limited to tin-based materials.

[0059] In this embodiment, the position and depth of the groove are not limited to this example and can be freely set.

[0060] In this embodiment, the chip includes but is not limited to a bare chip, a packaged single chip, etc. Both the bare chip and the packaged single chip may be provided with pads on the surface and directly connected to the magnetic component by welding.

[0061] It should be noted that the present invention directly presses out pads on the outer surface or the inner surface through a pressing process. The pads can be flexibly distributed on the outer surface of the magnetic part or even the inner groove of the magnetic part according to the design, and have excellent solderability. The pads can be used as electrical connection pads or as thermal conductive pads 103, which greatly enriches the effective heat dissipation path of the magnetic part. In addition, the multi-pad chip magnetic part can choose two packaging integration methods: slotted type or non-slotted type, and can be directly welded to the chip or bare die, greatly improving the power density of the power module.

[0062] The vertically integrated multi-pad chip-based magnetic component disclosed in the present invention can choose two packaging integration methods: slotted type or non-slotted type. It can be directly welded and connected to the chip or bare die, greatly improving the power density of the power module. It is suitable for high power density applications and greatly improves the power supply capacity in a limited space.

[0063] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and disclosure of the invention. This application is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed by the present invention. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0064] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

[0065] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any way. Any simple modification, change and equivalent structural change made to the above embodiment based on the technical essence of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A non-slotted multi-pad chip magnetic component, characterized in that: The invention comprises a first magnetic component inductor part (100), a first electrical connection pad (101), a second electrical connection pad (102) and a thermal conductive pad (103), wherein the first electrical connection pad (101), the second electrical connection pad (102) and the thermal conductive pad (103) are directly pressed onto the first magnetic component inductor part (100) by a pressing process.

2. The non-slotted multi-pad chip-based magnetic component according to claim 1, characterized in that: The positions and quantities of the first electrical connection pad (101), the second electrical connection pad (102) and the thermal conductive pad (103) are determined according to the application scenario.

3. A non-slotted magnetic vertical integrated power module, characterized in that: It comprises a first passive component (201), a thermally conductive solder bump (202), a first electrical connection solder bump (203), a second electrical connection bump (204), a first chip (205), a first substrate (206), and the non-slotted multi-pad chip-based magnetic component according to claim 1; The first electrical connection pad (101) is connected to the first chip (205) by welding via a first electrical connection solder bump (203); the second electrical connection pad (102) is connected to the first substrate (206) by welding via a second electrical connection bump (204); the thermal conductive pad (103) is connected to the first substrate (206) by welding via a thermal conductive solder bump (202); and the first magnetic component inductor portion (100), the first passive component (201) and the first chip (205) are interconnected by direct welding or by wiring of the first substrate (206).

4. A slotted multi-pad chip-based magnetic component, characterized in that: The invention comprises a second magnetic component inductor part (500), an active component groove (300), a passive component groove (301), a first solder pad (302), a second solder pad (303) and a third solder pad (304); the first solder pad (302), the second solder pad (303) and the third solder pad (304) are directly pressed on the bottom of the second magnetic component inductor part (500) through a pressing process.

5. The slotted multi-pad chip-based magnetic component according to claim 4, characterized in that: The positions and quantities of the first solder pad (302), the second solder pad (303) and the third solder pad (304) are determined according to the application scenario.

6. The slotted multi-pad chip-based magnetic component according to claim 4, characterized in that: The second pad (303) is a Z-shaped pad.

7. The slotted multi-pad chip-based magnetic component according to claim 6, characterized in that: The second pad (303) flows through the bottom, sidewalls and top of the active device groove (300).

8. The slotted multi-pad chip-based magnetic component according to claim 4, characterized in that: The active device groove (300) and the passive device groove (301) are both opened at the bottom of the second magnetic component inductor part (500) through a slotting process.

9. A slotted magnetic vertically integrated power module, characterized in that: The invention comprises a second chip (501), a second passive device (502), a second substrate (503) and the slotted multi-pad chip-type magnetic component according to claim 4; the second chip (501) is placed in the active device groove (300) and is connected to the first pad (302) by welding through a first solder bump (400); the second passive device (502) is placed in the passive device groove (301); the second pad (303) is connected to the second substrate (503) by welding through a second solder bump (401); the third pad (304) is connected to the second substrate (503) by welding through a third solder bump (402); the inductor part (500) of the second magnetic component, the second chip (501) and the second passive device (502) are interconnected by direct welding or by wiring on the second substrate (503).

10. The slotted magnetic component vertically integrated power module according to claim 9, characterized in that: The second chip (501) includes but is not limited to: a bare chip and a packaged single chip.

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