Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a body including a dielectric layer and first, second, third, and fourth internal electrode layers, the first inner electrode layer, the second inner electrode layer, the third inner electrode layer and the fourth inner electrode layer are alternately arranged in a first direction, and the dielectric layer is arranged among the first inner electrode layer, the second inner electrode layer, the third inner electrode layer and the fourth inner electrode layer; and first and second external electrodes disposed on the third and fourth surfaces, respectively, in which the internal electrode layer includes an internal electrode and a dummy electrode spaced apart from each other with a spacer portion between the internal electrode and the dummy electrode, and at least two of the spacers may include regions overlapping each other in the first direction and other regions not overlapping each other.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0162334 filed on November 21, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC), a multilayer electronic component, may be a chip capacitor mounted on a printed circuit board of various electronic products (e.g., computers, smart phones, mobile phones, etc.) including image display devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs)) for charging or discharging the same.

[0004] Such a multilayer ceramic capacitor can be used as a component of various electronic devices because the multilayer ceramic capacitor can have a small size and high capacitance and can be easily mounted. As various electronic devices such as computers and mobile devices have been designed to have smaller sizes and higher outputs, the demand for miniaturization and increased capacitance of multilayer ceramic capacitors has increased.

[0005] The body as a component of the multilayer ceramic capacitor may mainly include a ceramic material, which is a brittle material, and may be susceptible to tensile stress. Therefore, depending on the manufacturing process or the use environment, the body may not withstand the stress applied from the outside, and cracks may be generated in the body, which may shorten the life of the multilayer ceramic capacitor. Summary of the invention

[0006] Embodiments of the present disclosure are directed to providing a multilayer electronic component having improved warpage strength.

[0007] According to an embodiment of the present disclosure, a multilayer electronic component includes: a main body, including a dielectric layer and a first internal electrode layer, a second internal electrode layer, a third internal electrode layer and a fourth internal electrode layer, wherein the first internal electrode layer, the second internal electrode layer, the third internal electrode layer and the fourth internal electrode layer are alternately arranged in a first direction and the dielectric layer is interposed between the first internal electrode layer, the second internal electrode layer, the third internal electrode layer and the fourth internal electrode layer, the main body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and a first external electrode and a second external electrode, respectively arranged on the third surface and the fourth surface, wherein the first internal electrode layer includes a first internal electrode and a first dummy electrode, the first dummy electrode is spaced apart from the first internal electrode and a first spacing portion is located between the first internal electrode and the first dummy electrode, and the second internal electrode layer includes a second internal electrode and a second a dummy electrode, the second dummy electrode is spaced apart from the second inner electrode and the second spacing portion is located between the second inner electrode and the second dummy electrode, the third inner electrode layer includes a third inner electrode and a third dummy electrode, the third dummy electrode is spaced apart from the third inner electrode and the third spacing portion is located between the third inner electrode and the third dummy electrode, the fourth inner electrode layer includes a fourth inner electrode and a fourth dummy electrode, the fourth dummy electrode is spaced apart from the fourth inner electrode and the fourth spacing portion is located between the fourth inner electrode and the fourth dummy electrode, wherein the first external electrode is connected to the first inner electrode, the third inner electrode, the second dummy electrode and the fourth dummy electrode, and the second external electrode is connected to the second inner electrode, the fourth inner electrode, the first dummy electrode and the third dummy electrode, and wherein the first spacing portion includes an area overlapping with the third spacing portion in the first direction and an area not overlapping with the third spacing portion, and the second spacing portion includes an area overlapping with the fourth spacing portion in the first direction and an area not overlapping with the fourth spacing portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present disclosure; FIG. 2A to FIG. 2D is a cross-sectional view showing an inner electrode layer according to an embodiment of the present disclosure; FIG. 3A to FIG. 3Dis a cross-sectional view showing an inner electrode layer according to another embodiment of the present disclosure; Figure 4 is a cross-sectional view showing an inner electrode layer according to another embodiment of the present disclosure; Figure 5 is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 6 is along Figure 1 A cross-sectional view taken along line II-II' in FIG. Figure 7 is along Figure 1 A cross-sectional view taken along line III-III'. DETAILED DESCRIPTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0010] These embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure. It should be understood that the various embodiments of the present disclosure, although different, are not necessarily mutually exclusive. For example, without departing from the spirit and scope of the present disclosure, the structure, shape and size described as an example in the embodiments of the present disclosure may be implemented in another embodiment. In addition, without departing from the spirit and scope of the present disclosure, the position or arrangement of the elements in the embodiments may be modified. Therefore, the following detailed description should not be regarded as having a limiting meaning, and the scope of the present disclosure is limited only by the full scope of the attached claims appropriately interpreted and the equivalent schemes given by the claims.

[0011] In the accompanying drawings, the same elements will be represented by the same reference numerals. In addition, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the main idea of ​​the present disclosure will be omitted. In the accompanying drawings, some elements may be exaggerated, omitted or briefly shown, and the size of the elements does not necessarily reflect the actual size of these elements. The terms "comprise", "comprising", "configured to", etc. in the description are used to indicate the presence of features, quantities, steps, operations, elements, parts or combinations thereof, and do not exclude the possibility of combining or adding one or more features, quantities, steps, operations, elements, parts or combinations thereof.

[0012] As used herein, as will be understood by those skilled in the art, the expression "substantially the same" may refer to a parameter having the same numerical value as another parameter to which it is compared, and allows for approximations, inaccuracies, and limitations of measurement in relevant circumstances. Unless otherwise indicated, the term "substantially" may provide an industry-accepted tolerance for relativity between corresponding terms and / or items, such as ±1%, ±5%, or ±10% of the actual value stated, as well as other suitable tolerances.

[0013] In the drawings, a first direction may be defined as a stacking direction or a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0014] Multilayer electronic components Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment.

[0015] FIG. 2A to FIG. 2D is a cross-sectional view showing an inner electrode layer according to an embodiment.

[0016] FIG. 3A to FIG. 3D is a cross-sectional view showing an inner electrode layer according to another embodiment.

[0017] Figure 4 is a cross-sectional view showing an inner electrode layer according to another embodiment.

[0018] Figure 5 is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0019] Figure 6 is along Figure 1 A cross-sectional view taken along line II-II'.

[0020] Figure 7 is along Figure 1 A cross-sectional view taken along line III-III'.

[0021] In the following, reference will be made to Figures 1 to 7 The multilayer electronic component according to the embodiment is described in more detail. As an example of the multilayer electronic component, a multilayer ceramic capacitor will be described, but the embodiment is not limited thereto, and the description of the multilayer ceramic capacitor can be applied to various multilayer electronic components such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0022] The multilayer electronic component 100 according to the embodiment may include: a body including a dielectric layer 111 and first, second, third, and fourth internal electrode layers 121, 122, 123, and 124, the first, second, third, and fourth internal electrode layers 121, 122, 123, and 124 being alternately arranged in a first direction with the dielectric layer 111 interposed therebetween, and the body including a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a dielectric layer 111 connected to the first surface 1 and the third surface 4 connected to the first surface 1 and the fourth surface 4. The first inner electrode layer 121 may include a first inner electrode 121a and a first dummy electrode 121b, the first dummy electrode 121b is spaced apart from the first inner electrode 121a, and the first spacing portion 141 is located between the first inner electrode 121a and the first dummy electrode 121b, the second inner electrode layer 122 may include a second inner electrode 122a and a second dummy electrode 122b, the second dummy electrode 122b is spaced apart from the second inner electrode 121a, and the first spacing portion 141 is located between the first inner electrode 121a and the first dummy electrode 121b, and the second inner electrode layer 122 may include a second inner electrode 122a and a second dummy electrode 122b, and the second dummy electrode 122b is spaced apart from the second inner electrode 121a. 122a is spaced apart, and the second spacer 142 is located between the second inner electrode 122a and the second dummy electrode 122b, the third inner electrode layer 123 may include a third inner electrode 123a and a third dummy electrode 123b, the third dummy electrode 123b is spaced apart from the third inner electrode 123a, and the third spacer 143 is located between the third inner electrode 123a and the third dummy electrode 123b, and the fourth inner electrode layer 124 may include a fourth inner electrode 124a and a fourth dummy electrode 124b, the fourth dummy electrode 124b is spaced apart from the fourth inner electrode 124a, and the fourth spacer 144 is located between the fourth inner electrode 124a and the fourth dummy electrode The first outer electrode 131 is connected to the first inner electrode 121a, the third inner electrode 123a, the second dummy electrode 122b and the fourth dummy electrode 124b, and the second outer electrode 132 is connected to the second inner electrode 122a, the fourth inner electrode 124a, the first dummy electrode 121b and the third dummy electrode 123b, and the first spacer 141 may include an area overlapping with the third spacer 143 in the first direction and an area not overlapping with the third spacer 143, and the second spacer 142 may include an area overlapping with the fourth spacer 144 in the first direction and an area not overlapping with the fourth spacer 144.

[0023] The body 110 may have dielectric layers 111 and internal electrode layers 121 , 122 , 123 , and 124 that are alternately stacked.

[0024] More specifically, the body 110 may include a first inner electrode layer 121, a second inner electrode layer 122, a third inner electrode layer 123, and a fourth inner electrode layer 124. The first inner electrode layer 121, the second inner electrode layer 122, the third inner electrode layer 123, and the fourth inner electrode layer 124 are disposed in the body 110 and are alternately arranged. A dielectric layer 111 is located between the first inner electrode layer 121, the second inner electrode layer 122, the third inner electrode layer 123, and the fourth inner electrode layer 124.

[0025] The shape of the body 110 is not limited to any specific shape. However, as shown in the figure, the body 110 may have a hexahedron shape or a shape similar to a hexahedron shape. Since the ceramic powder included in the body 110 shrinks during the firing process, the body 110 may not have an exact hexahedron shape formed by straight lines, but may have a substantially hexahedron shape.

[0026] The body 110 may have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in a third direction.

[0027] The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that the boundary between them cannot be distinguished without using a scanning electron microscope (SEM).

[0028] The raw material for forming the dielectric layer 111 is not restricted as long as sufficient capacitance can be obtained therefrom. Generally, perovskite (ABO 3 ) materials can be used. For example, barium titanate materials, lead composite perovskite materials, or strontium titanate materials can be used. The barium titanate material may include BaTiO 3 ceramic particles, and examples of the BaTiO 3 ceramic particles may include (Ba 3 in which Ca (calcium) and / or Zr (zirconium) are partially solid-solved 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1- y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-yZr y ) 3 (0 <y<1)。

[0029] In addition, as a raw material for forming the dielectric layer 111, various ceramic additives, organic solvents, binders, and dispersants may be added to a dielectric material such as barium titanate (BaTiO 3 ) particles.

[0030] The thickness td of the dielectric layer 111 may not be limited to any specific example.

[0031] However, in order to ensure the reliability of the multilayer electronic component 100 in a high voltage environment, the thickness of the dielectric layer 111 may be 10.0 μm or less. In addition, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the dielectric layer 111 may be 3.0 μm or less. In order to easily achieve ultra-miniaturization and high capacitance, the thickness of the dielectric layer 111 may be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0032] Here, the thickness td of the dielectric layer 111 may indicate a thickness td of at least one of the plurality of dielectric layers 111 .

[0033] The thickness td of the dielectric layer 111 may refer to a size of the dielectric layer 111 in the first direction. In addition, the thickness td of the dielectric layer 111 may refer to an average thickness td of the dielectric layer 111 and may refer to an average size of the dielectric layer 111 in the first direction.

[0034] The average size of the dielectric layer 111 in the first direction may be measured by scanning a cross section of the body 110 in the first direction and the second direction using a scanning electron microscope (SEM) with a magnification of 10000. More specifically, the average size of the dielectric layer 111 in the first direction may indicate an average value calculated by measuring the size of the dielectric layer 111 in the first direction at 10 points spaced at equal distances in the second direction in the scanned image. The 10 points spaced at equal distances may be specified in the capacitance forming portion Ac. In addition, by extending the measurement of the average value to 10 dielectric layers 111, the average size of the dielectric layer 111 in the first direction may be further generalized.

[0035] The internal electrode layers 121 , 122 , 123 , and 124 may be alternately stacked with the dielectric layers 111 .

[0036] The internal electrode layers 121, 122, 123 and 124 may include internal electrodes 121a, 122a, 123a and 124a and dummy electrodes 121b, 122b, 123b and 124b, the dummy electrodes 121b, 122b, 123b and 124b are separated from the internal electrodes 121a, 122a, 123a and 124a and do not form a capacitor, and the spacers 141, 142, 143 and 144 are located between the dummy electrodes 121b, 122b, 123b and 124b and the internal electrodes 121a, 122a, 123a and 124a.

[0037] In an embodiment, unless otherwise stated, the description of the internal electrode layers 121 , 122 , 123 , and 124 may include the description of the internal electrodes 121 a , 122 a , 123 a , and 124 a and the description of the dummy electrodes 121 b , 122 b , 123 b , and 124 b .

[0038] More specifically, the first internal electrode layer 121 may include a first internal electrode 121a and a first dummy electrode 121b separated from the first internal electrode 121a by a first spacer 141, the second internal electrode layer 122 may include a second internal electrode 122a and a second dummy electrode 122b separated from the second internal electrode 122a by a second spacer 142, the third internal electrode layer 123 may include a third internal electrode 123a and a third dummy electrode 123b separated from the third internal electrode 123a by a third spacer 143, and the fourth internal electrode layer 124 may include a fourth internal electrode 124a and a fourth dummy electrode 124b separated from the fourth internal electrode 124a by a fourth spacer 144.

[0039] In other words, the inner electrodes 121a, 122a, 123a, and 124a may be electrically insulated from the dummy electrodes 121b, 122b, 123b, and 124b. More specifically, the first inner electrode 121a may be electrically insulated from the first dummy electrode 121b, the second inner electrode 122a may be electrically insulated from the second dummy electrode 122b, the third inner electrode 123a may be electrically insulated from the third dummy electrode 123b, and the fourth inner electrode 124a may be electrically insulated from the fourth dummy electrode 124b.

[0040] More specifically, the first inner electrode 121a may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, the second inner electrode 122a may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4, the third inner electrode 123a may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, and the fourth inner electrode 124a may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4.

[0041] In addition, the first dummy electrode 121b may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4, the second dummy electrode 122b may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, the third dummy electrode 123b may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4, and the fourth dummy electrode 124b may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3.

[0042] The first spacer 141 may refer to a region between the first inner electrode 121a and the first dummy electrode 121b which are spaced apart from each other in the second direction and are spaced apart from the third surface 3 and the fourth surface 4, the second spacer 142 may refer to a region between the second inner electrode 122a and the second dummy electrode 122b which are spaced apart from each other in the second direction and are spaced apart from the third surface 3 and the fourth surface 4, the third spacer 143 may refer to a region between the third inner electrode 123a and the third dummy electrode 123b which are spaced apart from each other in the second direction and are spaced apart from the third surface 3 and the fourth surface 4, and the fourth spacer 144 may refer to a region between the fourth inner electrode 124a and the fourth dummy electrode 124b which are spaced apart from each other in the second direction and are spaced apart from the third surface 3 and the fourth surface 4.

[0043] In this case, the first spacer 141 may include an area overlapping with the third spacer 143 in the first direction and an area not overlapping with the third spacer 143, and the second spacer 142 may include an area overlapping with the fourth spacer 144 in the first direction and an area not overlapping with the fourth spacer 144.

[0044] The first spacer 141 and the third spacer 143 may be alternately disposed to include a region where the first spacer 141 and the third spacer 143 overlap each other and a region where the first spacer 141 and the third spacer 143 do not overlap each other, and the second spacer 142 and the fourth spacer 144 may be alternately disposed to include a region where the second spacer 142 and the fourth spacer 144 overlap each other and a region where the second spacer 142 and the fourth spacer 144 do not overlap each other, so that even when warping stress is applied to the body 110, the formation of cracks can be effectively prevented.

[0045] In other words, when the first spacers 141 and the third spacers 143 are alternately arranged in the first direction to include a region where the first spacers 141 and the third spacers 143 overlap with each other and a region where the first spacers 141 and the third spacers 143 do not overlap with each other, and the second spacers 142 and the fourth spacers 144 are alternately arranged in the first direction to include a region where the second spacers 142 and the fourth spacers 144 overlap with each other and a region where the second spacers 142 and the fourth spacers 144 do not overlap with each other, the region where the spacers 141, 142, 143 and 144 where the internal electrodes 121a, 122a, 123a and 124a and the dummy electrodes 121b, 122b, 123b and 124b are not arranged overlap with each other relative to the first direction can be reduced, so when warping stress is applied to the multilayer electronic component 100 including the main body 110 along the first direction, cracks can be prevented and the mechanical properties of the multilayer electronic component 100 can be improved.

[0046] For example, each of the first spacer 141, the second spacer 142, the third spacer 143 and the fourth spacer 144 may have a substantially parallelogram shape, and the first spacer 141 and the third spacer 143 having the parallelogram shape may be arranged to cross each other in the first direction, and the second spacer 142 and the fourth spacer 144 having the parallelogram shape may be arranged to cross each other in the first direction.

[0047] In addition, the spacers in the inner electrode layers adjacent to each other in the first direction do not overlap with each other in the first direction, for example, the first spacer 141 and the second spacer 142 do not overlap with each other in the first direction, the second spacer 142 and the third spacer 143 do not overlap with each other in the first direction, the third spacer 143 and the fourth spacer 144 do not overlap with each other in the first direction, and the fourth spacer 144 and the first spacer 141 do not overlap with each other in the first direction.

[0048] As used herein, the term "substantially parallelogram shape" refers to a quadrilateral shape in which opposite sides are parallel or substantially parallel to each other. As used herein, the term "substantially parallel" describes opposite sides that intersect each other at an angle of 1° or less.

[0049] In some embodiments, each of the first to fourth spacers may be inclined relative to the fifth surface. For example, the first and second spacers may be inclined relative to the fifth surface at substantially the same angle, the third and fourth spacers may be inclined relative to the fifth surface at substantially the same angle, and the first and third spacers may be inclined relative to the fifth surface at different angles.

[0050] The first inner electrode 121a, the second inner electrode 122a, the third inner electrode 123a and the fourth inner electrode 124a may include a first side and a second side opposite to each other in a third direction, and the lengths of the first side and the second side of the first inner electrode 121a, the second inner electrode 122a, the third inner electrode 123a and the fourth inner electrode 124a may be different.

[0051] In other words, when the lengths of one side and the other side of the inner electrode opposite to each other in the third direction are defined as L1 and L2, respectively, L1 and L2 may be different.

[0052] More specifically, the first inner electrode 121a may include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the first side of the first inner electrode 121a in the second direction may be greater than the size of the second side of the first inner electrode 121a in the second direction. The second inner electrode 122a may include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the second side of the second inner electrode 122a in the second direction may be greater than the size of the first side of the second inner electrode 122a in the second direction. The third inner electrode 123a may include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the second side of the third inner electrode 123a in the second direction may be greater than the size of the first side of the third inner electrode 123a in the second direction. The fourth inner electrode 124a may include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the first side of the fourth inner electrode 124a in the second direction may be greater than the size of the second side of the fourth inner electrode 124a in the second direction.

[0053] In addition, the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b and the fourth dummy electrode 124b may include a first side and a second side opposite to each other in a third direction, and the lengths of the first side and the second side of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b and the fourth dummy electrode 124b may be different.

[0054] In other words, when the lengths of one side and the other side of the dummy electrode opposite to each other in the third direction are defined as L3 and L5, respectively, L3 and L5 may be different.

[0055] More specifically, the first dummy electrode 121b may include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the second side of the first dummy electrode 121b in the second direction may be larger than the size of the first side of the first dummy electrode 121b in the second direction. The second dummy electrode 122b may include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the first side of the second dummy electrode 122b in the second direction may be larger than the size of the second side of the second dummy electrode 122b in the second direction. The third dummy electrode 123b may include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the first side of the third dummy electrode 123b in the second direction may be larger than the size of the second side of the third dummy electrode 123b in the second direction. The fourth dummy electrode 124d may include a first side adjacent to the fifth surface 5 and a second side adjacent to the sixth surface 6, and the size of the second side of the fourth dummy electrode 124b in the second direction may be larger than the size of the first side of the fourth dummy electrode 124b in the second direction.

[0056] Since the lengths of the first and second sides of the first, second, third, and fourth internal electrodes 121a, 122a, 123a, and 124a are different, and the lengths of the first and second sides of the first, second, third, and fourth dummy electrodes 121b, 122b, 123b, and 124b are different, the warping strength of the multilayer electronic component can be further improved.

[0057] In addition, the average size of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a and the fourth internal electrode 124a in the second direction may be larger than the average size of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b and the fourth dummy electrode 124b in the second direction, respectively.

[0058] Since the average size of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a and the fourth internal electrode 124a in the second direction is larger than the average size of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b and the fourth dummy electrode 124b in the second direction, sufficient capacitance of the multilayer electronic component can be formed and sufficient warping strength of the multilayer electronic component can be ensured.

[0059] The average size of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a in the second direction may be measured using a scanning electron microscope (SEM) in the following manner: respectively measuring the size of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a in the second direction at the center of the third direction, measuring the size in the second direction at points at the same distance from the center in the third direction in the direction from the center in the third direction toward both sides in the third direction, and calculating the average of the above-measured sizes in the second direction. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used.

[0060] Similarly, the average size of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b in the second direction can be measured using a scanning electron microscope (SEM) in the following manner: respectively measuring the size of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b in the second direction at the center of the third direction, measuring the size in the second direction at points at the same distance from the center in the third direction in the direction from the center in the third direction toward both sides in the third direction, and calculating the average of the above-measured sizes in the second direction. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may also be used.

[0061] The size of each of the first spacer 141, the second spacer 142, the third spacer 143, and the fourth spacer 144 in the second direction may be substantially constant. For example, the difference between the maximum value and the minimum value of the size of each of the first spacer 141, the second spacer 142, the third spacer 143, and the fourth spacer 144 in the second direction at different positions in the third direction may be less than 5% of the average value of the size of each of the first spacer 141, the second spacer 142, the third spacer 143, and the fourth spacer 144 in the second direction at different positions in the third direction.

[0062] Since each of the first spacer 141 , the second spacer 142 , the third spacer 143 , and the fourth spacer 144 has a substantially constant size in the second direction, the warping stress applied in the first direction may be properly absorbed, thereby improving the warping strength of the multilayer electronic component.

[0063] The size and average size of each of the first spacer 141, the second spacer 142, the third spacer 143, and the fourth spacer 144 in the second direction may be measured using a scanning electron microscope (SEM). The average size may be obtained by measuring the size of the first spacer 141, the second spacer 142, the third spacer 143, and the fourth spacer 144 in the second direction at the center of the third direction, respectively, measuring the size in the second direction at points at the same distance from the center in the third direction in the direction from the center in the third direction toward both sides in the third direction, and calculating the average of the above-measured sizes in the second direction. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used.

[0064] For reference as an example Figure 5 and Figure 6 Describing in more detail, in a cross-sectional view taken along line II' corresponding to a cross-sectional view in the first direction and the second direction at the center in the third direction of the multilayer electronic component 100, the first spacer 141 and the third spacer 143 may overlap each other in the first direction, and the second spacer 142 and the fourth spacer 144 may overlap each other in the first direction. In addition, in a cross-sectional view taken along line II-II' corresponding to a cross-sectional view in the first direction and the second direction spaced apart from the center in the third direction of the multilayer electronic component 100, the first spacer 141 and the third spacer 143 may not overlap each other in the first direction, and the second spacer 142 and the fourth spacer 144 may not overlap each other in the first direction.

[0065] Therefore, even when the multilayer electronic component 100 is mounted on a substrate and warping stress is applied in a first direction, adjacent areas of the spacers 141, 142, 143 and 144 in the first direction where the internal electrode layers 121, 122, 123 and 124 are not provided are areas where other internal electrode layers 121, 122, 123 and 124 are provided, thereby improving the warping strength of the multilayer electronic component 100.

[0066] In addition, the first to fourth internal electrodes 121 a , 122 a , 123 a , and 124 a may be spaced apart from the fifth and sixth surfaces 5 and 6 .

[0067] More specifically, the first inner electrode 121a, the second inner electrode 122a, the third inner electrode 123a and the fourth inner electrode 124a may be spaced apart from the fifth surface 5 by W3 in the third direction, and the first inner electrode 121a, the second inner electrode 122a, the third inner electrode 123a and the fourth inner electrode 124a may be spaced apart from the sixth surface 6 by W4 in the third direction.

[0068] Here, the area spaced apart by W3 may be referred to as a first side edge region, and the area spaced apart by W4 may be referred to as a second side edge region. W3 and W4 will be described later.

[0069] In addition, the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b may be spaced apart from the fifth surface 5 and the sixth surface 6. However, the embodiment is not limited thereto, and the first dummy electrode 221b, the second dummy electrode 222b, the third dummy electrode 223b, and the fourth dummy electrode 224b may be disposed to contact a portion of the fifth surface 5 or the sixth surface 6, and thus, the first to fourth dummy electrodes may be spaced apart from at least one of the fifth surface 5 and the sixth surface 6.

[0070] More specifically, the first dummy electrode 221b may be in contact with a portion of the fifth surface 5 and may be spaced apart from the sixth surface 6, the second dummy electrode 222b may be spaced apart from the fifth surface 5 and may be in contact with a portion of the sixth surface 6, the third dummy electrode 223b may be spaced apart from the fifth surface 5 and may be in contact with a portion of the sixth surface 6, and the fourth dummy electrode 224b may be in contact with a portion of the fifth surface 5 and may be spaced apart from the sixth surface 6.

[0071] The first external electrode 131 may be disposed on the third surface 3 of the body 110 and may be connected to the first internal electrode 121a, the third internal electrode 123a, the second dummy electrode 122b and the fourth dummy electrode 124b, and the second external electrode 132 may be disposed on the fourth surface 4 of the body 110 and may be connected to the second internal electrode 122a, the fourth internal electrode 124a, the first dummy electrode 121b and the third dummy electrode 123b.

[0072] That is, the first internal electrode 121a, the third internal electrode 123a, the second dummy electrode 122b, and the fourth dummy electrode 124b may not be connected to the second external electrode 132 and may be connected to the first external electrode 131, and the second internal electrode 122a, the fourth internal electrode 124a, the first dummy electrode 121b, and the third dummy electrode 123b may not be connected to the first external electrode 131 but may be connected to the second external electrode 132. In this case, each of the first internal electrode 121a, the second internal electrode 122a, the third internal electrode 123a, and the fourth internal electrode 124a and each of the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b, and the fourth dummy electrode 124b may be electrically separated from each other by the dielectric layer 111 disposed therebetween in the first direction.

[0073] The main body 110 can be formed by stacking a first ceramic green sheet on which a conductive paste for a first internal electrode layer 121 is printed, a second ceramic green sheet on which a conductive paste for a second internal electrode layer 122 is printed, a third ceramic green sheet on which a conductive paste for a third internal electrode layer 123 is printed, and a fourth ceramic green sheet on which a conductive paste for a fourth internal electrode layer 124 is printed, and firing these ceramic green sheets.

[0074] Refer to the example Figure 4 (being a cross section in the second direction and the third direction) describes in more detail the shapes of the dielectric layer, the fourth inner electrode 224a and the fourth dummy electrode 224b, but its embodiments are not limited thereto, and the description of the fourth inner electrode 224a can be applied to the first inner electrode 121a, the second inner electrode 122a, the third inner electrode 123a and the fourth inner electrode 124a as well as the first inner electrode 221a, the second inner electrode 222a and the third inner electrode 223a, and the description of the fourth dummy electrode 224b can be applied to the first dummy electrode 121b, the second dummy electrode 122b, the third dummy electrode 123b and the fourth dummy electrode 124b as well as the first dummy electrode 221b, the second dummy electrode 222b and the third dummy electrode 223b.

[0075] A dimension of the dielectric layer 111 in the second direction may be defined as L, and a dimension of the dielectric layer 111 in the third direction may be defined as W.

[0076] The fourth inner electrode 224a may include first to fourth sides and may be exposed through the fourth surface 4. A size of a first side of the fourth inner electrode 224a adjacent to the fifth surface 5 in the second direction may be defined as L1, a size of a second side of the fourth inner electrode 224a adjacent to the sixth surface 6 in the second direction may be defined as L2, a size of a third side of the fourth inner electrode 224a contacting the fourth surface 4 in the third direction may be defined as W1, and a length of the fourth side of the fourth inner electrode 224a may be determined by the first to third sides of the fourth inner electrode 224a.

[0077] Here, L1 and L2 may satisfy 0.35×L≤L1≤0.98×L and 0.14×L1≤L2≤0.94×L1 to form sufficient capacitance, and W1 may satisfy 0.42×W≤W1≤0.94×W to form an electrical connection with the second external electrode and sufficient capacitance of the multilayer electronic component.

[0078] In addition, a first side of the fourth internal electrode 224 a may be spaced apart W3 from the fifth surface 5 in the third direction, and a second side of the fourth internal electrode 224 a may be spaced apart W4 from the sixth surface 6 in the third direction.

[0079] Here, W3 and W4 may satisfy 0.03×W≤W3≤0.29×W and 0.03×W≤W4≤0.29×W, and W3 may have the same size as W4, but may not be limited thereto.

[0080] The fourth dummy electrode 224b may include first to fourth sides and may be exposed through the third surface 3. A size of a first side of the fourth dummy electrode 224b contacting or adjacent to the fifth surface 5 in the second direction may be defined as L3, a size of a second side of the fourth dummy electrode 224b adjacent to the sixth surface 6 in the second direction may be defined as L5, a size of a third side of the fourth dummy electrode 224b contacting the third surface 3 in the third direction may be defined as W2, and a length of a fourth side of the fourth dummy electrode 224b may be determined by the first to third sides of the fourth dummy electrode 224b.

[0081] Here, L3 and L5 may satisfy 0≤L3≤0.22×L and L5=L−L4−L2 to ensure sufficient warpage strength of the multilayer electronic component, and W2 may satisfy W1≤W2≤0.97×W to ensure sufficient warpage strength of the multilayer electronic component.

[0082] A size of the fourth spacers 144 and 244 in the second direction may be defined as L4 and may satisfy 15 μm≤L4≤200 μm, and the size of the fourth spacers 144 and 244 in the second direction may be substantially constant.

[0083] Since a dimension L4 of each of the first spacers 141 and 241 , the second spacers 142 and 242 , the third spacers 143 and 243 , and the fourth spacers 144 and 244 in the second direction satisfies 15 μm≤L4≤200 μm, the warpage strength of the multilayer electronic component may be improved.

[0084] When the dimension L4 of each of the first spacers 141 and 241, the second spacers 142 and 242, the third spacers 143 and 243, and the fourth spacers 144 and 244 in the second direction is less than 15 μm, the internal electrodes and the dummy electrodes may not be electrically insulated from each other, which may cause a short circuit, and when the dimension L4 of each of the first spacers 141 and 241, the second spacers 142 and 242, the third spacers 143 and 243, and the fourth spacers 144 and 244 in the second direction exceeds 200 μm, the warping strength of the multilayer electronic component may not be improved, which may cause cracks.

[0085] When the angle of the inner angle formed by the first side and the fourth side of the fourth inner electrode 224 a is defined as θ1, 30°≤θ1≤80° may be satisfied to ensure sufficient warpage strength of the multilayer electronic component.

[0086] Furthermore, when the angle of the inner angle formed by the second side and the fourth side of the fourth dummy electrode 224 b is defined as θ2, 30°≤θ2≤80° may be satisfied to ensure sufficient warpage strength of the multilayer electronic component.

[0087] In some embodiments, θ1 and θ2 may be substantially the same.

[0088] The material for forming the internal electrode layers 121, 122, 123, and 124 is not limited to any specific example, and a material having excellent conductivity may be used. For example, the internal electrode layers 121, 122, 123, and 124 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0089] In addition, the internal electrode layers 121, 122, 123, and 124 may be formed by printing a conductive paste for forming the internal electrodes on the ceramic green sheet, the conductive paste including one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. As a method of printing the conductive paste for the internal electrodes, a screen printing method or a gravure printing method may be used, but the embodiment is not limited thereto.

[0090] The thickness te of the internal electrode layers 121 , 122 , 123 , and 124 may not be limited to any specific example.

[0091] In order to ensure the reliability of the multilayer electronic component 100 in a high voltage environment, the thickness te of each of the internal electrode layers 121, 122, 123, and 124 may be 3.0 μm or less. In addition, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of each of the internal electrode layers 121, 122, 123, and 124 may be 1.0 μm or less, and in order to easily achieve ultra-miniaturization and high capacitance of the multilayer electronic component 100, the thickness of each of the internal electrode layers 121, 122, 123, and 124 may be 0.6 μm or less, and more preferably 0.4 μm or less.

[0092] Here, the thicknesses of the internal electrode layers 121, 122, 123, and 124 may respectively represent the sizes of the internal electrodes 121, 122, 123, and 124 in the first direction. In addition, the thicknesses te of the internal electrode layers 121, 122, 123, and 124 may respectively represent the average thicknesses te of the internal electrode layers 121, 122, 123, and 124, and may respectively represent the average sizes of the internal electrode layers 121, 122, 123, and 124 in the first direction.

[0093] The average size of each of the internal electrode layers 121, 122, 123, and 124 in the first direction may be measured by scanning a cross section of the body 110 using a scanning electron microscope (SEM) at a magnification of 10000. More specifically, the average value may be measured based on the size of the internal electrode in the first direction at five points spaced at equal distances in the second direction in the scanned image, and the average size of the dummy electrode in the first direction may be obtained by measuring the size of the dummy electrode in the first direction at five points spaced at equal distances in the second direction. Then, the average size of the internal electrode layer in the first direction may be obtained by averaging the average size of the internal electrode in the first direction and the average size of the dummy electrode in the first direction. In addition, by extending the measurement of the average value to 10 internal electrodes, the average size of the internal electrode layers 121, 122, 123, and 124 may be further generalized.

[0094] Here, the average size of the inner electrode in the first direction and the average size of the dummy electrode in the first direction may be substantially the same, but the embodiment is not limited thereto. Here, the configuration that the average size of the inner electrode in the first direction and the average size of the dummy electrode in the first direction are substantially the same may indicate that the difference between the large value and the small value of the size of the inner electrode in the first direction and the size of the dummy electrode in the first direction is less than 5% of the average size of the inner electrode layer in the first direction.

[0095] In an embodiment, an average thickness td of at least one of the plurality of dielectric layers 111 and an average thickness te of at least one of the plurality of internal electrode layers 121, 122, 123, and 124 may satisfy 2×te <td。

[0096] In other words, the average thickness td of the dielectric layer 111 may be greater than twice the average thickness te of one of the internal electrode layers 121, 122, 123, and 124. Preferably, the average thickness td of the plurality of dielectric layers 111 may be greater than twice the average thickness te of the plurality of internal electrode layers 121, 122, 123, and 124.

[0097] Each of the dimensions (e.g., length, width) and angles disclosed herein can be measured by a scanning electron microscope (SEM). The average dimension of each of the spacers in the second direction can be obtained by taking the average of the dimensions measured at different points in the third direction. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may also be used.

[0098] Generally, high voltage electronic components may have problems in reliability due to a decrease in breakdown voltage (BDV) in a high voltage environment.

[0099] Therefore, in order to prevent the breakdown voltage from decreasing under a high voltage environment, by configuring the average thickness td of the dielectric layer 111 to be greater than twice the average thickness te of the internal electrode layers 121, 122, 123 and 124, the thickness of the dielectric layer (the distance between the internal electrodes) can be increased, and the breakdown voltage characteristics can be improved.

[0100] When the average thickness td of the dielectric layer 111 is less than twice the average thickness te of the internal electrode layers 121, 122, 123 and 124, the average thickness of the dielectric layer (the distance between the internal electrodes) may decrease, so that the breakdown voltage may be reduced and a short circuit may occur between the internal electrodes.

[0101] The body 110 may include a capacitance forming portion Ac and cover portions 112 and 113 disposed on both end surfaces of the capacitance forming portion Ac in the first direction.

[0102] More specifically, the body 110 may include an upper cover portion 112 disposed on one surface of the capacitance forming portion Ac in the first direction and a lower cover portion 113 disposed on the other surface of the capacitance forming portion Ac in the first direction. More specifically, the body 110 may include an upper cover portion 112 disposed on an upper portion of the capacitance forming portion Ac in the first direction and a lower cover portion 113 disposed on a lower portion of the capacitance forming portion Ac in the first direction.

[0103] The upper covering portion 112 and the lower covering portion 113 may be formed by stacking a single dielectric layer 111 or two or more dielectric layers 111 on the upper and lower surfaces of the capacitor forming portion Ac in the first direction, and may prevent damage to the internal electrode layers 121, 122, 123, and 124 due to physical stress or chemical stress.

[0104] The upper cover 112 and the lower cover 113 do not include the internal electrode layers 121, 122, 123, and 124, and may include the same material as that of the dielectric layer 111. That is, the upper cover 112 and the lower cover 113 may include a ceramic material, for example, barium titanate (BaTiO 3 ) Ceramic materials.

[0105] The thickness tc of the covering parts 112 and 113 may not be limited to any specific example.

[0106] However, in order to easily realize miniaturization and high capacitance of multilayer electronic components, the thickness tc of the covers 112 and 113 may be 100 μm or less, preferably 30 μm or less. More preferably, the thickness tc of the covers 112 and 113 may be 20 μm or less in ultra-small products.

[0107] Here, the thickness tc of the cover 112 or 113 may refer to the size of the cover 112 or 113 in the first direction. In addition, the thickness tc of the cover 112 and 113 may refer to the average thickness of the cover 112 and 113 and may refer to the average size of the cover 112 and 113 in the first direction.

[0108] The average size of the covering portions 112 and 113 may be measured by scanning a cross section in the first direction and the second direction of the body 110 using a scanning electron microscope (SEM) at a magnification of 10000. More specifically, the average size may represent an average value calculated by measuring the size of the covering portion in the first direction at 10 points spaced at equal distances in the second direction in the scanned image.

[0109] In addition, the average size of the covering portion in the first direction measured by the above method may be substantially the same as the average size of the covering portion in the first direction in cross sections of the body 110 in the first and third directions.

[0110] The body 110 may include side margin parts 114 and 115 disposed between a surface of the body 110 in the third direction and both sides of the internal electrode layers 121 , 122 , 123 , and 124 in the third direction.

[0111] More specifically, the side edge portions 114 and 115 may include a first side edge portion 114 and a second side edge portion 115, the first side edge portion 114 being disposed between the fifth surface 5 of the main body 110 and one side of the internal electrode layers 121, 122, 123 and 124 in the third direction, and the second side edge portion 115 being disposed between the sixth surface 6 of the main body 110 and the other side of the internal electrode layers 121, 122, 123 and 124 in the third direction.

[0112] However, embodiments thereof are not limited thereto, and when the dummy electrodes 221b, 222b, 223b and 224b contact a portion of one of the fifth surface 5 and the sixth surface 6 of the body 110, an area between portions of the fifth surface 5 and the sixth surface 6 of the body 110 that are not in contact with the dummy electrodes 221b, 222b, 223b and 224b and both sides of the inner electrode layers 221, 222, 223 and 224 in the third direction may be referred to as a side edge portion.

[0113] exist FIG. 2A to FIG. 2D In the case of the example of , the side edge portions 114 and 115 may refer to side edge regions between the fifth and sixth surfaces 5 and 6 of the body and both sides of the internal electrodes 121 a , 122 a , 123 a , and 124 a .

[0114] More specifically, the area between the first inner electrode 121a and the fifth surface 5 may be referred to as the first side edge region of the first inner electrode, the area between the first inner electrode 121a and the sixth surface 6 may be referred to as the second side edge region of the first inner electrode, the area between the second inner electrode 122a and the fifth surface 5 may be referred to as the first side edge region of the second inner electrode, the area between the second inner electrode 122a and the sixth surface 6 may be referred to as the second side edge region of the second inner electrode, the area between the third inner electrode 123a and the fifth surface 5 may be referred to as the first side edge region of the third inner electrode, the area between the third inner electrode 123a and the sixth surface 6 may be referred to as the second side edge region of the third inner electrode, the area between the fourth inner electrode 124a and the fifth surface 5 may be referred to as the first side edge region of the fourth inner electrode, and the area between the fourth inner electrode 124a and the sixth surface 6 may be referred to as the second side edge region of the fourth inner electrode.

[0115] The side margin parts 114 and 115 may prevent damage to the internal electrode layers 121 , 122 , 123 , and 124 due to physical stress or chemical stress.

[0116] In embodiments, the multilayer electronic component 100 may have two external electrodes 131 and 132 , but the number of the external electrodes 131 and 132 or shapes thereof may vary depending on the form of the internal electrode layers 121 , 122 , 123 , and 124 or other purposes.

[0117] The external electrodes 131 and 132 may be disposed on the body 110 , and may be connected to the internal electrode layers 121 , 122 , 123 , and 124 .

[0118] More specifically, the first external electrode 131 may be disposed on the third surface 3 of the body 110 and may be connected to the first internal electrode 121a, the third internal electrode 123a, the second dummy electrode 122b and the fourth dummy electrode 124b, and the second external electrode 132 may be disposed on the fourth surface 4 of the body 110 and may be connected to the second internal electrode 122a, the fourth internal electrode 124a, the first dummy electrode 121b and the third dummy electrode 123b.

[0119] In addition, the external electrodes 131 and 132 may extend to a portion of the first surface 1 and the second surface 2 of the body 110 and be disposed on a portion of the first surface 1 and the second surface 2 of the body 110, or may extend to a portion of the fifth surface 5 and the sixth surface 6 of the body 110 and be disposed on a portion of the fifth surface 5 and the sixth surface 6 of the body 110. That is, the first external electrode 131 may be disposed on a portion of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the body 110 and the third surface 3 of the body 110, and the second external electrode 132 may be disposed on a portion of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 of the body 110 and the fourth surface 4 of the body 110.

[0120] When the dummy electrodes 221b, 222b, 223b, and 224b are disposed to contact a portion of one of the fifth and sixth surfaces 5 and 6 of the body, the external electrodes 131 and 132 may be disposed to cover the dummy electrodes 221b, 222b, 223b, and 224b.

[0121] For example, when the first dummy electrode 221b contacts a portion of the fifth surface 5, the size of the portion of the second external electrode 132 contacting a portion of the fifth surface 5 in the second direction may be larger than the size of the portion of the first dummy electrode 221b contacting a portion of the fifth surface 5 in the second direction. When the second dummy electrode 222b contacts a portion of the sixth surface 6, the size of the portion of the first external electrode 131 contacting a portion of the sixth surface 6 in the second direction may be larger than the size of the portion of the second dummy electrode 222b contacting a portion of the sixth surface 6 in the second direction. When the third dummy electrode 223b contacts a portion of the sixth surface 6, the size of the portion of the second external electrode 132 contacting a portion of the sixth surface 6 in the second direction may be larger than the size of the portion of the third dummy electrode 223b contacting a portion of the sixth surface 6 in the second direction. When the fourth dummy electrode 224b contacts a portion of the fifth surface 5, the size of the portion of the first external electrode 131 contacting a portion of the fifth surface 5 in the second direction may be larger than the size of the portion of the fourth dummy electrode 224b contacting a portion of the fifth surface 5 in the second direction.

[0122] Even when the first dummy electrode 221b, the second dummy electrode 222b, the third dummy electrode 223b and the fourth dummy electrode 224b are arranged to contact a portion of one of the fifth surface and the sixth surface and be exposed to one of the fifth surface and the sixth surface, the first external electrode 131 and the second external electrode 132 can also cover the dummy electrodes, thereby preventing external moisture from penetrating and improving moisture-proof reliability.

[0123] The external electrodes 131 and 132 may be formed using any material having conductivity, such as metal, and a specific material may be determined in consideration of electrical characteristics and structural stability, and may have a multi-layered structure.

[0124] For example, the external electrodes 131 and 132 may include an electrode layer disposed on the body 110 and a plating layer disposed on the electrode layer.

[0125] As a more specific example of the electrode layer, the electrode layer may include first electrode layers 131 a and 132 a (which may be fired electrodes including a first conductive metal and glass) or second electrode layers 131 b and 132 b (which may be resin-based electrodes including a second conductive metal and resin).

[0126] Here, the conductive metal included in the first electrode layers 131a and 132a may be referred to as a first conductive metal, and the conductive metal included in the second electrode layers 131b and 132b may be referred to as a second conductive metal. In this case, the first conductive metal and the second conductive metal may be the same as or different from each other, and when a plurality of conductive metals are included, only a portion of the first electrode layers 131a and 132a and the second electrode layers 131b and 132b may include the same conductive metal, but the embodiment is not limited thereto.

[0127] In addition, the electrode layer may be formed by sequentially forming a fired electrode and a resin-based electrode on the body 110 .

[0128] In addition, the electrode layer may be formed by transferring a sheet including a conductive metal onto the body, or may be formed by transferring a sheet including a conductive metal onto a fired electrode.

[0129] A material having excellent electrical conductivity may be used as the conductive metal included in the electrode layers 131a, 132a, 131b, and 132b. For example, the conductive metal may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but the embodiment is not limited thereto.

[0130] In an embodiment, the electrode layers 131a, 132a, 131b and 132b may have a double-layer structure including first electrode layers 131a and 132a and second electrode layers 131b and 132b, and thus, the external electrodes 131 and 132 may include first electrode layers 131a and 132a and second electrode layers 131b and 132b, the first electrode layers 131a and 132a including a first conductive metal and glass, and the second electrode layers 131b and 132b are disposed on the first electrode layers 131a and 132a and including a second conductive metal and resin.

[0131] The first electrode layers 131 a and 132 a may improve bonding with the body 110 by including glass, and the second electrode layers 131 b and 132 b may improve warping strength by including resin.

[0132] The first conductive metal included in the first electrode layers 131a and 132a is not limited to any specific example as long as the material can be electrically connected to the internal electrode layers 121, 122, 123 and 124 to form a capacitor. For example, the first conductive metal may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti) and alloys thereof.

[0133] The first electrode layers 131 a and 132 a may be formed by applying a conductive paste prepared by adding glass frit to first conductive metal particles and firing the conductive paste.

[0134] The second conductive metal included in the second electrode layers 131 b and 132 b may electrically connect the second electrode layers 131 b and 132 b to the first electrode layers 131 a and 132 a .

[0135] The conductive metal included in the second electrode layers 131 b and 132 b is not limited to any specific example as long as the material can be electrically connected to the electrode layers 131 a and 132 a, and may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0136] The second conductive metal included in the second electrode layers 131b and 132b may include one or more of spherical particles and flake-type particles. In other words, the conductive metal may include only flake-type particles, only spherical particles, or may be a mixture of flake-type particles and spherical particles. Here, the spherical particles may include an incomplete spherical shape, for example, a shape in which the length ratio between the major axis and the minor axis (major axis length / minor axis length) is 1.45 or more. Flake-type particles may refer to particles having a flat and elongated shape, and are not limited to any specific example, for example, the length ratio between the major axis and the minor axis (major axis length / minor axis length) may be 1.95 or more. The lengths of the major axis and the minor axis of the spherical particles and the flake-type particles may be measured from an image obtained by scanning a cross section in the first direction and the second direction of a central portion of a multilayer electronic component in the third direction using a scanning electron microscope (SEM).

[0137] The resin included in the second electrode layers 131b and 132b can ensure bonding and can absorb impact. The resin included in the second electrode layers 131b and 132b is not limited to any specific example as long as the resin has bonding and impact absorption characteristics and can be mixed with the second conductive metal particles to form a paste, and may include, for example, epoxy resin.

[0138] In addition, the second electrode layers 131b and 132b may include a plurality of metal particles, an intermetallic compound, and a resin. By including the intermetallic compound, electrical connectivity with the first electrode layers 131a and 132a may be improved. The intermetallic compound may improve electrical connectivity by connecting a plurality of metal particles to each other, may surround a plurality of metal particles, and may connect the metal particles to each other.

[0139] In this case, the intermetallic compound may include a metal having a melting point lower than the solidification temperature of the resin. That is, since the intermetallic compound may include a metal having a melting point lower than the solidification temperature of the resin, the metal having a melting point lower than the solidification temperature of the resin may melt during the drying and solidification process, may form the intermetallic compound with a portion of the metal particles, and may surround the metal particles. In this case, the intermetallic compound may include a low melting point (preferably lower than 300° C.) metal.

[0140] For example, Sn having a melting point of 213° C. to 220° C. may be included. During the drying and hardening process, Sn may melt, and the molten Sn may wet metal particles having a high melting point (such as Ag, Ni, or Cu) by capillary action, may react with a portion of Ag metal particles, Ni metal particles, or Cu metal particles, and may form an intermetallic compound (such as Ag). 3 Sn、Ni 3 Sn 4 , Cu 6 Sn 5 Cu 3 Sn). Ag, Ni or Cu that does not participate in the reaction may remain in the form of metal particles.

[0141] Therefore, the plurality of metal particles may include one or more of Ag, Ni, and Cu, and the intermetallic compound may include Ag. 3 Sn、Ni 3 Sn 4 , Cu 6 Sn 5 and Cu 3 One or more of Sn.

[0142] The plating layers 131c and 132c can improve mounting characteristics.

[0143] The types of the coatings 131c and 132c are not limited to any specific examples, and the coatings 131c and 132c can be single-layer coatings including one of nickel (Ni), tin (Sn), palladium (Pd), and their alloys, and can also be formed as multi-layer coatings including at least two of nickel (Ni), tin (Sn), palladium (Pd), and their alloys.

[0144] As more specific examples of the coatings 131c and 132c, the coatings 131c and 132c can be Ni coatings or Sn coatings. A Ni coating and an Sn coating can be sequentially formed on the electrode layer, and an Sn coating, a Ni coating, and an Sn coating can be sequentially formed. In addition, the coatings 131c and 132c can include multiple Ni coatings and / or multiple Sn coatings.

[0145] The size of the multi-layer electronic component 100 is not limited to any specific example.

[0146] However, in order to achieve both miniaturization and high capacitance of the multi-layer electronic component 100, it may be necessary to increase the number of stacked layers by reducing the thickness of the dielectric layer and the internal electrodes, such that the effects described in the embodiments are significant in the multi-layer electronic component 100 having a size of 3216 (length × width: 3.2 mm × 1.6 mm) or smaller.

[0147] According to the foregoing embodiments, the warpage strength of the multi-layer electronic component can be improved.

[0148] The scope of the present disclosure is not necessarily limited to a specific form of embodiment. Instead, modifications, equivalents, and alternatives included within the scope of the disclosure concept and technology of this specification can be adopted. Throughout the specification, similar reference numerals are used for similar elements.

[0149] In the embodiments, the term "embodiment" does not necessarily refer to the same embodiment, and can be provided to describe and emphasize the different unique features of each embodiment. The proposed embodiments can be implemented without excluding the possibility of combining the features of other embodiments. For example, even if the features described in one embodiment are not described in another embodiment, unless otherwise stated, this description can be understood as being related to another embodiment.

[0150] The terms used in this specification are for explaining the embodiments rather than limiting the embodiments. Unless explicitly described to the contrary, expressions in the singular form in this specification can include expressions in the plural form.

[0151] Although the embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer electronic component comprising: A body, comprising a dielectric layer and first, second, third and fourth internal electrode layers, wherein the first, second, third and fourth internal electrode layers are alternately arranged in a first direction and the dielectric layer is interposed between the first, second, third and fourth internal electrode layers, the body comprising a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposite to each other in a third direction; as well as The first external electrode and the second external electrode are respectively arranged on the third surface and the fourth surface, wherein the first inner electrode layer comprises a first inner electrode and a first dummy electrode, the first dummy electrode is spaced apart from the first inner electrode and a first spacing portion is located between the first inner electrode and the first dummy electrode, the second inner electrode layer comprises a second inner electrode and a second dummy electrode, the second dummy electrode is spaced apart from the second inner electrode and a second spacing portion is located between the second inner electrode and the second dummy electrode, the third inner electrode layer comprises a third inner electrode and a third dummy electrode, the third dummy electrode is spaced apart from the third inner electrode and a third spacing portion is located between the third inner electrode and the third dummy electrode, the fourth inner electrode layer comprises a fourth inner electrode and a fourth dummy electrode, the fourth dummy electrode is spaced apart from the fourth inner electrode and a fourth spacing portion is located between the fourth inner electrode and the fourth dummy electrode, wherein the first outer electrode is connected to the first inner electrode, the third inner electrode, the second dummy electrode and the fourth dummy electrode, and the second outer electrode is connected to the second inner electrode, the fourth inner electrode, the first dummy electrode and the third dummy electrode, and The first spacer includes a region overlapping with the third spacer and a region not overlapping with the third spacer in the first direction, and the second spacer includes a region overlapping with the fourth spacer and a region not overlapping with the fourth spacer in the first direction.

2. The multilayer electronic component according to claim 1, in, Each of the first to fourth internal electrodes includes a first side and a second side opposite to each other in the third direction, and Among them, the length of the first side of the first inner electrode is different from the length of the second side of the first inner electrode, the length of the first side of the second inner electrode is different from the length of the second side of the second inner electrode, the length of the first side of the third inner electrode is different from the length of the second side of the third inner electrode, and the length of the first side of the fourth inner electrode is different from the length of the second side of the fourth inner electrode.

3. The multilayer electronic component according to claim 1, in, Each of the first to fourth dummy electrodes includes a first side and a second side opposite to each other in the third direction, and Among them, the length of the first side of the first dummy electrode is different from the length of the second side of the first dummy electrode, the length of the first side of the second dummy electrode is different from the length of the second side of the second dummy electrode, the length of the first side of the third dummy electrode is different from the length of the second side of the third dummy electrode, and the length of the first side of the fourth dummy electrode is different from the length of the second side of the fourth dummy electrode.

4. The multilayer electronic component according to claim 1, wherein: Each of the first to fourth spacers has a substantially parallelogram shape.

5. The multilayer electronic component according to claim 1, wherein A dimension of each of the first to fourth spacers in the second direction at different positions in the third direction is substantially constant.

6. The multilayer electronic component according to claim 1, wherein: An average size of each of the first to fourth spacers in the second direction is greater than or equal to 15 μm and less than or equal to 200 μm.

7. The multilayer electronic component according to claim 1, wherein: The first to fourth internal electrodes are spaced apart from the fifth and sixth surfaces.

8. The multilayer electronic component according to claim 1, wherein The first to fourth dummy electrodes are spaced apart from at least one of the fifth surface and the sixth surface.

9. The multilayer electronic component according to claim 1, wherein: The first to fourth dummy electrodes are in contact with a portion of one of the fifth surface and the sixth surface.

10. The multilayer electronic component according to claim 9, wherein The first dummy electrode and the fourth dummy electrode are disposed in contact with a portion of the fifth surface, and the second dummy electrode and the third dummy electrode are disposed in contact with a portion of the sixth surface.

11. The multilayer electronic component according to claim 10, in, The first external electrode and the second external electrode are respectively arranged to contact a portion of the fifth surface and a portion of the sixth surface, wherein a size of a portion of the first external electrode in contact with a portion of the fifth surface in the second direction is greater than a size of a portion of the fourth dummy electrode in contact with a portion of the fifth surface in the second direction, wherein a size of a portion of the first external electrode in contact with a portion of the sixth surface in the second direction is greater than a size of a portion of the second dummy electrode in contact with a portion of the sixth surface in the second direction, wherein a size of a portion of the second external electrode in contact with a portion of the fifth surface in the second direction is greater than a size of a portion of the first dummy electrode in contact with a portion of the fifth surface in the second direction, and The size of a portion of the second external electrode in contact with a portion of the sixth surface in the second direction is greater than the size of a portion of the third dummy electrode in contact with a portion of the sixth surface in the second direction.

12. The multilayer electronic component according to claim 1, wherein Each of the first to fourth internal electrodes includes an inner angle of angle θ1, each of the first to fourth dummy electrodes includes an inner angle of angle θ2, and both θ1 and θ2 are greater than or equal to 30° and less than or equal to 80°.

13. The multilayer electronic component according to claim 1, wherein An average size of each of the first to fourth internal electrodes in the second direction is respectively greater than an average size of each of the first to fourth dummy electrodes in the second direction.

14. The multilayer electronic component according to claim 1, wherein Each of the first to fourth spacers is inclined with respect to the fifth surface.

15. The multilayer electronic component according to claim 12, wherein: θ1 and θ2 are substantially the same.

16. The multilayer electronic component according to claim 1, wherein The spacing parts in the internal electrode layers adjacent to each other in the first direction do not overlap each other in the first direction.

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