Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes a body including dielectric layers and a plurality of internal electrodes alternately disposed in a first direction. The body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction. External electrodes are disposed on the third surface and the fourth surface, respectively. At least one of the plurality of internal electrodes includes: a main portion; a lead-out portion extending from the main portion in the second direction, the lead-out portion having a first end portion contacting the external electrode; and an extending portion extending from the main portion so as to face the lead-out portion, and having a second end portion facing the first end portion. When the widths of the main part, the first end part and the second end part in the third direction are respectively W1, W2 and W3, W2gt is satisfied; w3gt; w1.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0163768 filed in the Korean Intellectual Property Office on November 22, 2023, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various electronic products, including image display devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, mobile phones, etc., and used to charge or discharge therefrom. Since multilayer ceramic capacitors can have a small size and high capacitance and can be easily mounted, such multilayer ceramic capacitors can be used as components of various electronic devices.

[0004] In addition, bending cracks may occur in the multilayer ceramic capacitor due to deformation or vibration of a printed circuit board on which the multilayer ceramic capacitor is mounted. Cracks in the multilayer ceramic capacitor may cause external moisture to easily penetrate, thereby causing a decrease in insulation resistance or a short circuit in the internal electrode due to external moisture, which may reduce the electrical characteristics or reliability of the multilayer ceramic capacitor. Therefore, it may be necessary to develop a multilayer ceramic capacitor with improved bending strength characteristics. Summary of the invention

[0005] Embodiments of the present disclosure are directed to providing a multilayer electronic component having improved bending strength.

[0006] Embodiments of the present disclosure are directed to providing a multilayer electronic component having improved electrical characteristics.

[0007] According to an embodiment of the present disclosure, a multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately arranged with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction; and external electrodes respectively arranged on the third surface and the fourth surface, wherein at least one of the plurality of internal electrodes includes: a main portion, arranged in the central part of the main body in the second direction; a lead-out portion extending from the main portion along the second direction, having a first end portion in contact with the external electrode and spaced apart from the fifth surface and the sixth surface; and an extension portion extending from the main portion in a direction opposite to the lead-out portion, spaced apart from the external electrode, and having a second end portion opposite to the first end portion, and wherein, when the width of the main portion in the third direction is defined as W1, the width of the first end portion in the third direction is defined as W2, and the width of the second end portion in the third direction is defined as W3, W2>W3>W1 is satisfied.

[0008] According to an embodiment of the present disclosure, a multilayer electronic component includes: a body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction, the body including a dielectric layer, an inner electrode pair spaced apart from each other in the second direction, and a floating electrode, wherein the inner electrode pair and the floating electrode are alternately arranged in the first direction and the dielectric layer is interposed between the inner electrode pair and the floating electrode; and a first outer electrode and a second outer electrode, respectively arranged on the third surface and the fourth surface, wherein the inner electrode pair includes: a first inner electrode including a first main portion and a first lead portion, the first lead portion extending from the first main portion and having a first end portion in contact with the first outer electrode; and a second inner electrode including a second main portion and a second lead portion. a lead-out portion extending from the second main portion and having a second end portion contacting the second external electrode, wherein the floating electrode comprises: a third main portion; a first extension portion extending from the third main portion toward the first external electrode, having a third end portion and being spaced apart from the first external electrode; and a second extension portion extending from the third main portion toward the second external electrode, having a fourth end portion and being spaced apart from the second external electrode, wherein the first main portion, the second main portion and the third main portion are arranged in a central portion of the body in the second direction, and wherein when the widths of the first main portion and the second main portion in the third direction are defined as W11', the width of the third main portion in the third direction is defined as W12', the widths of the first end portion and the second end portion in the third direction are defined as W2', and the widths of the third end portion and the fourth end portion in the third direction are defined as W3', W2'>W11' and W3'>W12' are satisfied. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present disclosure; Figure 2 is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 3 is along Figure 1 A cross-sectional view taken along line II-II'; Figure 4 is along Figure 2 A cross-sectional view taken along line III-III'; Figure 5 is along Figure 2 A cross-sectional view taken along line IV-IV'; Figure 6 is a plan view showing a state in which first and second internal electrodes of a multilayer electronic component according to an embodiment of the present disclosure are overlapped with each other; Figure 7 FIG. 1 is a diagram showing a multilayer electronic component according to another embodiment of the present disclosure. Figure 2 The corresponding cross-sectional view; Figure 8 is along Figure 7 A cross-sectional view taken along line V-V'; Fig. 9 is along Figure 7 A cross-sectional view taken along line VI-VI' in FIG. Fig.10 is a diagram showing a state in which first and second internal electrodes of a multilayer electronic component according to another embodiment of the present disclosure are overlapped with each other. Figure 6 The corresponding floor plan. DETAILED DESCRIPTION

[0010] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0011] These embodiments are described in sufficient detail to enable those skilled in the art to practice the present disclosure. It should be understood that the various embodiments of the present disclosure, although different, are not necessarily mutually exclusive. For example, without departing from the spirit and scope of the present disclosure, the structure, shape and size described as an example in the embodiments of the present disclosure may be implemented in another embodiment. In addition, without departing from the spirit and scope of the present disclosure, the position or arrangement of the elements in the embodiments may be modified. Therefore, the following detailed description should not be regarded as having a limiting meaning, and the scope of the present disclosure is limited only by the full scope of the attached claims and the equivalent schemes given by the claims, which are properly interpreted.

[0012] In the accompanying drawings, the same elements will be represented by the same reference numerals. In addition, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the subject matter of the present disclosure will be omitted. In the accompanying drawings, some elements may be exaggerated, omitted or briefly shown, and the size of the elements does not necessarily reflect the actual size of these elements. The terms "comprise", "comprising", "configured to", etc. of the specification are used to indicate the presence of features, quantities, steps, operations, elements, parts, or combinations thereof, and do not exclude the possibility of combining or adding one or more features, quantities, steps, operations, elements, parts, or combinations thereof.

[0013] In the drawings, a first direction may be defined as a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0014] Multilayer electronic components Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment.

[0015] Figure 2 is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0016] Figure 3 is along Figure 1 A cross-sectional view taken along line II-II'.

[0017] Figure 4 is along Figure 2 A cross-sectional view taken along line III-III'.

[0018] Figure 5 is along Figure 2 A cross-sectional view taken along line IV-IV'.

[0019] Figure 6 is a plan view illustrating a state in which first and second internal electrodes of a multilayer electronic component according to an embodiment are overlapped with each other.

[0020] In the following, reference will be made to Figures 1 to 6 The multilayer electronic component according to the embodiment is described in more detail. A multilayer ceramic capacitor will be described as an example of the multilayer electronic component, but the embodiment is not limited thereto, and the multilayer electronic component of the present disclosure can be applied to various electronic products using the dielectric composition, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0021] The size of the multilayer electronic component 100 may not be limited to any specific example. The maximum length of the multilayer electronic component 100 in the second direction may be, for example, 0.6 mm to 3.2 mm. The maximum width of the multilayer electronic component 100 in the third direction may be, for example, 0.3 mm to 1.6 mm.

[0022] Reference Figures 1 to 3 , the multilayer electronic component 100 according to the embodiment may include: a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 ; and external electrodes 131 and 132 .

[0023] The shape of the body 110 may not be limited to any particular shape, but Figures 1 to 6As shown, the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic powder included in the main body 110 during the sintering process or the polishing of the corners, the main body 110 may not have an exact hexahedral shape formed by straight lines, but may generally have a hexahedral shape.

[0024] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction.

[0025] The main body 110 may include a dielectric layer 111 and a first inner electrode 121 and a second inner electrode 122 that are alternately arranged in a first direction and the dielectric layer 111 is interposed therebetween. The plurality of dielectric layers 111 forming the main body 110 may be in a fired state, and adjacent dielectric layers 111 may be integrated with each other such that their boundaries may not be easily distinguishable without using a scanning electron microscope (SEM).

[0026] The average thickness td of the dielectric layer 111 may not be limited to any specific example. The average thickness td of the dielectric layer 111 may be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0027] The dielectric layer 111 may be formed by the following method: preparing a ceramic slurry including a ceramic powder, an organic solvent, an additive, and a binder, preparing a ceramic green sheet by coating the slurry on a carrier film and drying the slurry, and sintering the ceramic green sheet. The ceramic powder is not limited to any specific example as long as a sufficient electrostatic capacitance can be obtained using it. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material may be used. Examples of the barium titanate-based ceramic powder may include BaTiO 3 , in which Ca (calcium) and / or Zr (zirconium) is partially solid-solved in BaTiO 3 of (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zry )O 3 (0 < y < 1). The organic solvent can be ethanol or the like, the binder can be polyvinyl butyral or the like, and the organic solvent or the binder can be a commonly used material used in the corresponding field.

[0028] The plurality of internal electrodes 121 and 122 can include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged with a dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122 (a pair of electrodes with different polarities) can be arranged opposite to each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other through the dielectric layer 111 interposed therebetween.

[0029] The first internal electrode 121 can be spaced apart from the fourth surface 4 and can be connected to the first external electrode 131 on the third surface 3. The second internal electrode 122 can be spaced apart from the third surface 3 and can be connected to the second external electrode 132 on the fourth surface 4.

[0030] The conductive metal included in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and more preferably Ni can be included, but the embodiments are not limited thereto.

[0031] The average thickness te of the internal electrodes 121 and 122 is not limited to any specific example. The average thickness te of the internal electrodes 121 and 122 can be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0032] The internal electrodes 121 and 122 can be formed by coating a conductive paste including a conductive metal for the internal electrodes on the green ceramic sheet with a predetermined thickness and sintering. As a method of printing the conductive paste for the internal electrodes, a screen printing method or a gravure printing method can be used, but the embodiments are not limited thereto.

[0033] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may indicate the average thickness of the dielectric layer 111 in the first direction and the average thickness of the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may be measured by scanning a cross section of the body 110 in the first direction and the second direction through the center in the third direction at a magnification of 10000 using a scanning electron microscope (SEM). More specifically, the average thickness td of the dielectric layer 111 may be obtained by measuring the thickness of the dielectric layer 111 at a plurality of points (e.g., 30 points at equal distances) in the second direction and calculating their average values. In addition, the average thickness te of the internal electrodes 121 and 122 may be obtained by measuring the thickness of the internal electrodes 121 and 122 at a plurality of points (e.g., 30 points at equal distances) in the second direction and calculating the average value. 30 points at equal distances may be specified in the capacitance forming portion Ac. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may be more generalized by obtaining average values ​​after respectively calculating average values ​​of 10 dielectric layers 111 and 10 internal electrodes 121 and 122 .

[0034] The body 110 may include: a capacitance forming part Ac, which is disposed in the body 110 and includes first and second internal electrodes 121 and 122 alternately disposed with a dielectric layer 111 located therebetween; and a first cover 112 and a second cover 113, which are respectively disposed on two surfaces of the capacitance forming part Ac that are opposite to each other in a first direction. The cover 112 and 113 may prevent the internal electrodes 121 and 122 from being damaged due to physical stress or chemical stress. The cover 112 and 113 may have a material similar to that of the dielectric layer 111, except that the cover 112 and 113 do not include the internal electrodes.

[0035] The average thickness tc of the covering portions 112 and 113 may not be limited to any specific example. The average thickness tc of the covering portions 112 and 113 may be, for example, 120 μm or less, 100 μm or less, 50 μm or less, or 20 μm or less. Here, the average thickness tc of the covering portions 112 and 113 may indicate the average thickness of the first covering portion 112 and the average thickness of the second covering portion 113, respectively.

[0036] The average thickness tc of the covering portions 112 and 113 may refer to the average thickness of the covering portions 112 and 113 in the first direction, and may be the average value of the thickness of the covering portions 112 and 113 in the first direction measured at five points at equal distances in the second direction in a cross-section of the main body 110 in the first direction and the second direction passing through the center in the third direction.

[0037] The cover portions 112 and 113 may be formed by laminating a predetermined number of ceramic green sheets on which the conductive paste for internal electrodes is not applied on two opposing surfaces of the capacitance forming portion Ac in the first direction and sintering the ceramic green sheets.

[0038] The body 110 may include a first edge portion 114 and a second edge portion 115 respectively disposed on two surfaces of the capacitance forming portion Ac opposite to each other in the third direction. In other words, the edge portions 114 and 115 may indicate a region between both ends of the internal electrodes 121 and 122 in the third direction and an outer surface of the body 110 in the third direction in a cross section of the body 110 in the first direction and the third direction.

[0039] The edge portions 114 and 115 may have a material similar to that of the dielectric layer 111, except that the edge portions 114 and 115 do not include the internal electrodes 121 and 122. The edge portions 114 and 115 may prevent the internal electrodes 121 and 122 from being damaged due to physical stress or chemical stress.

[0040] The average thickness of the edge portions 114 and 115 may not be particularly limited. The average thickness of the edge portions 114 and 115 may be 120 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less, but the embodiment is not limited thereto. Here, the average thickness of the edge portions 114 and 115 may refer to the average thickness of the first edge portion 114 and the average thickness of the second edge portion 115, respectively.

[0041] The average thickness of the edge portions 114 and 115 may refer to the average width of the edge portions 114 and 115 in the third direction, and may be the average value of the width of the edge portions 114 and 115 in the third direction measured at five points at equal distances in the first direction in a cross-section of the main body 110 in the first and third directions passing through the center in the second direction.

[0042] The edge portions 114 and 115 may be formed by applying a conductive paste for an internal electrode to a portion of the ceramic green sheet excluding an area where the edge portions are to be formed and sintering the same. Alternatively, in order to suppress a step difference caused by the internal electrodes 121 and 122, after lamination, the laminate may be cut to expose the internal electrodes 121 and 122 to two surfaces of the capacitor forming portion Ac that are opposite to each other in the third direction, and a single dielectric layer or two or more dielectric layers may be laminated on two surfaces of the capacitor forming portion Ac that are opposite to each other in the third direction, thereby forming the edge portions 114 and 115.

[0043] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and may extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. In addition, the external electrodes 131 and 132 may include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122. In the drawings, the multilayer electronic component 100 may have two external electrodes 131 and 132, but embodiments thereof are not limited thereto, and the number of the external electrodes 131 and 132 and their shapes may vary according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0044] The external electrodes 131 and 132 may include substrate electrode layers 131a and 132a in contact with the internal electrodes 121 and 122 and plating layers 131b and 132b disposed on the substrate electrode layers 131a and 132a. That is, the first external electrode 131 may include a first substrate electrode layer 131a in contact with the first internal electrode 121 and a first plating layer 131b disposed on the first substrate electrode layer 131a, and the second external electrode 132 may include a second substrate electrode layer 132a in contact with the second internal electrode 122 and a second plating layer 132b disposed on the second substrate electrode layer 132a.

[0045] The substrate electrode layers 131a and 132a may include metal and glass. The substrate electrode layers 131a and 132a may be formed by dipping the third surface 3 and the fourth surface 4 of the body 110 into a conductive paste including metal powder and glass frit and sintering. The conductive metal included in the substrate electrode layers 131a and 132a may include Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys thereof, but embodiments thereof are not limited thereto.

[0046] The substrate electrode layers 131a and 132a may include only one layer including metal and glass, but the embodiment is not limited thereto, and the substrate electrode layers 131a and 132a may have a multi-layer structure. For example, the substrate electrode layers 131a and 132a may include: a first layer including metal and glass; and a second layer disposed on the first layer and including metal and resin.

[0047] The metal included in the second layer is not limited to any specific example, and may include one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof. The resin included in the second layer may include, for example, one or more materials selected from epoxy resins, acrylic resins, and ethyl cellulose. The second layer may be formed by applying a conductive resin composition including metal powder and resin on the first layer, drying the composition, and performing curing and heat treatment.

[0048] The plating layers 131b and 132b can improve mounting performance. The types of the plating layers 131b and 132b are not limited to any specific example, and the plating layers 131b and 132b may be plating layers including Ni, Sn, Pd, and / or alloys thereof, and / or may be formed as a plurality of layers. The plating layers 131b and 132b may be, for example, Ni plating layers or Sn plating layers, or may be formed by sequentially forming Ni plating layers and Sn plating layers. In addition, the plating layers 131b and 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0049] In the following, reference will be made to Figures 4 to 6 The internal electrodes 121 and 122 of the multilayer electronic component 100 according to the embodiment are described in more detail.

[0050] According to an embodiment, at least one of the plurality of internal electrodes 121 and 122 may include main portions 121a and 122a, lead portions 121b and 122b, and extension portions 121c and 122c. At least one of the plurality of first internal electrodes 121 may include a first main portion 121a, a first lead portion 121b, and a first extension portion 121c, and at least one of the plurality of second internal electrodes 122 may include a second main portion 122a, a second lead portion 122b, and a second extension portion 122c.

[0051] The main parts 121a and 122a may overlap with the main part of another adjacent inner electrode of the plurality of inner electrodes 121 and 122 in the first direction. That is, the first main part 121a may overlap with the second main part 122a of the adjacent second inner electrode 122 in the first direction. The main parts 121a and 122a may form a capacitor of the multilayer electronic component 100. The main parts 121a and 122a may have a rectangular shape perpendicular to the first direction. The main parts 121a and 122a may be spaced apart from the outer surface of the body 110, and the main parts 121a and 122a may be connected to the outer electrodes 131 and 132 through the lead-out parts 121b and 122b. The main parts 121a and 122a may be disposed in the central portion of the body 110 in the second direction.

[0052] The lead portions 121b and 122b may extend from the main portions 121a and 122a in the second direction and may have first end portions 21a and 22a in contact with the external electrodes 131 and 132. That is, the first lead portion 121b may extend from the first main portion 121a in the second direction and may have a first end portion in contact with the first external electrode 131, i.e., a 1-1 end portion 21a. The second lead portion 122b may extend from the second main portion 122a in the second direction and may have a first end portion in contact with the second external electrode 132, i.e., a 1-2 end portion 22a. The surfaces of the internal electrodes 121 and 122 in contact with the external electrodes 131 and 132 are limited to the third surface 3 and the fourth surface 4 among the first surface 1, the second surface 2, the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 of the body 110 to improve the moisture-proof reliability of the multilayer electronic component 100, and the lead-out portions 121b and 122b may be spaced apart from the fifth surface 5 and the sixth surface 6.

[0053] The extension portions 121c and 122c may extend from the main portions 121a and 122a in a direction opposite to the lead portions 121b and 122b, may be spaced apart from the external electrodes 132 and 131, and may have second ends 21b and 22b opposite to the first ends 21a and 22a. That is, the first extension portion 121c may extend from the first main portion 121a in a direction opposite to the first lead portion 121b and may be spaced apart from the second external electrode 132, and the second extension portion 122c may extend from the second main portion 122a in a direction opposite to the second lead portion 122b and may be spaced apart from the first external electrode 131. The first extension portion 121c may have a second end opposite to the 1-1 end 21a, that is, the 2-1 end 21b, and the second extension portion 122c may have a second end opposite to the 1-2 end 22a, that is, the 2-2 end 22b.

[0054] According to an embodiment, when the width of the main portions 121a and 122a in the third direction is defined as W1, the width of the first end portions 21a and 22a in the third direction is defined as W2, and the width of the second end portions 21b and 22b in the third direction is defined as W3, W2>W3>W1 may be satisfied. By satisfying W2>W3>W1, the lead portions 121b and 122b and the extension portions 121c and 122c may effectively disperse the bending stress applied to the body 110. In addition, the width W2 of the first end portions 21a and 22a in the third direction may be greater than the width W1 of the main portions 121a and 122a in the third direction, so that residual organic substances in the dielectric layer 111 may be smoothly discharged during the sintering process, and by expanding the contact area between the internal electrodes 121 and 122 and the external electrodes 131 and 132, the equivalent series resistance (ESR) of the multilayer electronic component 100 may be reduced. In addition, the region having the minimum width in the third direction of the edge portions 114 and 115 can be limited to the first end portions 21a and 22a sides, and the internal electrodes 121 and 122 can be prevented from being exposed to the fifth surface 5 and the sixth surface 6 sides due to errors in the process. Therefore, the moisture-proof reliability of the multilayer electronic component 100 can be prevented from being deteriorated.

[0055] W1 may indicate, for example, an average width of the main portions 121a and 122a in the third direction. For example, W1 may indicate an average value of the widths of the main portions 121a and 122a in the third direction measured at five points at equal distances in the second direction in a cross section of the body 110 in the second and third directions.

[0056] W1 may not be limited to any specific example. For example, when the width of the body 110 in the third direction is defined as Wo, the ratio of W1 to Wo (W1 / Wo) may be 0.4 to 0.8. When W1 / Wo is less than 0.4, the capacitance of the multilayer electronic component 100 may be excessively degraded, and when W1 / Wo is greater than 0.8, the main portions 121a and 122a may be exposed to the fifth surface 5 side and the sixth surface 6 side due to errors in the process, so that the reliability of the multilayer electronic component 100 may be degraded due to moisture penetration.

[0057] W2 may not be limited to any specific example. For example, the ratio of W2 to Wo (W2 / Wo) may be 0.85 to 0.99. When W2 / Wo is less than 0.85, the effect of improving bending strength and reducing ESR in the embodiment may be small. When W2 / Wo exceeds 0.99, the first end portions 21a and 22a may be exposed to the fifth surface 5 and the sixth surface 6 side due to errors in the process, and the reliability of the multilayer electronic component 100 may be deteriorated due to moisture penetration.

[0058] The body 110 may have a first corner portion C1 connecting the third surface 3 to the fifth surface 5, a second corner portion C2 connecting the third surface 3 to the sixth surface 6, a third corner portion C3 connecting the fourth surface 4 to the fifth surface 5, and a fourth corner portion C4 connecting the fourth surface 4 to the sixth surface 6. In addition, in order to prevent the corner portions C1, C2, C3, and C4 of the body 110 from being broken (chipping defects), the body 110 may be polished after sintering. Therefore, each of the corner portions C1, C2, C3, and C4 may have a rounded shape.

[0059] Corner portions C1, C2, C3, and C4 may be portions of the body 110 susceptible to external moisture penetration. Therefore, when the first end portions 21a and 22a contact the corner portions C1, C2, C3, and C4, the moisture-proof reliability of the multilayer electronic component 100 may be deteriorated. Therefore, the first end portions 21a and 22a may be spaced apart from the corner portions C1, C2, C3, and C4. That is, the 1-1 end portion 21a may be spaced apart from the first corner portion C1 and the second corner portion C2, and the 1-2 end portion 22a may be spaced apart from the third corner portion C3 and the fourth corner portion C4.

[0060] In an embodiment, the extension portions 121c and 122c may overlap with the lead-out portion of another adjacent inner electrode of the plurality of inner electrodes 121 and 122 in the first direction. That is, the first extension portion 121c may overlap with the second lead-out portion 122b adjacent in the first direction in the first direction, and the second extension portion 122c may overlap with the first lead-out portion 121b adjacent in the first direction in the first direction. That is, the main portions 121a and 122a, the lead-out portions 121b and 122b, and the extension portions 121c and 122c may form a capacitance forming portion Ac, thereby improving the capacitance of the multilayer electronic component 100.

[0061] In an embodiment, the width of the lead-out portions 121b and 122b in the third direction may gradually increase from the main portions 121a and 122a to the first ends 21a and 22a, and the width of the extension portions 121c and 122c in the third direction may gradually increase from the main portions 121a and 122a to the second ends 21b and 22b. That is, the width of the first lead-out portion 121b in the third direction may gradually increase from the first main portion 121a to the 1-1 end 21a, and the width of the second lead-out portion 122b in the third direction may gradually increase from the second main portion 122a to the 1-2 end 22a. The width of the first extension portion 121c in the third direction may gradually increase from the first main portion 121a to the 2-1 end 21b, and the width of the second extension portion 122c in the third direction may gradually increase from the second main portion 122a to the 2-2 end 22b.

[0062] That is, since the widths of the lead portions 121b and 122b and the extension portions 121c and 122c in the third direction may gradually increase toward the outer side of the body 110 in the second direction, the internal electrodes 121 and 122 may have a relatively large area, and thus the bending stress applied to the body 110 may be effectively dispersed. Figure 6 As shown in the figure, the area of ​​the capacitor forming portion Ac in which the lead portions 121b and 122b and the extension portions 122c and 121c overlap each other in the first direction may also have a width in the third direction that gradually increases toward the outside of the main body 110 in the second direction, thereby effectively improving the capacitance of the multilayer electronic component 100.

[0063] In order to improve the bending strength of the multilayer electronic component 100, the first internal electrode 121 and the second internal electrode 122 may be point-symmetrical to each other. Therefore, in an embodiment, the main portions 121a and 122a may not overlap with the lead-out portion of another adjacent internal electrode of the plurality of internal electrodes 121 and 122 in the first direction. That is, the first main portion 121a may not overlap with the second lead-out portion 122b of the second internal electrode 122 adjacent thereto in the first direction in the first direction. In addition, in an embodiment, the main portions 121a and 122a may not overlap with the extension portion of another adjacent internal electrode of the plurality of internal electrodes 121 and 122 in the first direction. That is, the first main portion 121a may not overlap with the second extension portion 122c of the second internal electrode 122 adjacent thereto in the first direction in the first direction.

[0064] In an embodiment, the ends of the external electrodes 131 and 132 may overlap with the lead portions 121b and 122b in the third direction. For example, the end of the first external electrode 131 may overlap with the first lead portion 121b in the third direction, and the end of the second external electrode 132 may overlap with the second lead portion 122b in the third direction. For example, the maximum length L2 of the lead portions 121b and 122b in the second direction may be longer than the distance from the third surface 3 or the fourth surface 4 to the end of the external electrode 131 or 132 in the second direction. Cracks formed in the body 110 may generally propagate from the ends of the external electrodes 131 and 132. Since the ends of the external electrodes 131 and 132 overlap with the lead portions 121 b and 122 b in the third direction, the lead portions 121 b and 122 b having a width in the third direction greater than the width of the main portions 121 a and 122 a in the third direction can effectively reduce the bending stress propagating from the ends of the external electrodes 131 and 132 to the dielectric layer 111.

[0065] The lengths of the main portions 121a and 122a, the lead portions 121b and 122b, and the extension portions 121c and 122c in the second direction are not limited to any specific example. For example, when the length of the main portions 121a and 122a in the second direction is defined as L1, the maximum length of the lead portions 121b and 122b in the second direction is defined as L2, and the maximum length of the extension portions 121c and 122c in the second direction is defined as L3, L1>L2>L3 may be satisfied. When L1 is less than L2 and / or L3, the capacitance of the multilayer electronic component 100 may be excessively reduced.

[0066] L2 is not limited to any specific example, and when the length of the body 110 in the second direction is defined as Lo, the ratio of L2 to Lo (L2 / Lo) may be 0.05 to 0.30. When L2 / Lo is less than 0.05, the effect of improving the bending strength in the embodiment may be minimal. In addition, when L2 / Lo exceeds 0.30, the capacitance of the multilayer electronic component 100 may be reduced.

[0067] L3 is not limited to any specific example, and the ratio of L3 to L2 (L3 / L2) may be 0.01 to 0.90. When L3 / L2 is less than 0.01, the effect of improving bending strength and capacitance may be minimal in the embodiment. When L3 / L2 exceeds 0.90, the inner electrodes 121 and 122 may contact the outer electrodes 132 and 131 having different polarities due to cutting errors.

[0068] L1 is not limited to any specific example, and the ratio of L1 to Lo (L1 / Lo) may be 0.43 to 0.94.

[0069] Figure 7 FIG. 2 is a diagram showing a multilayer electronic component according to another embodiment. Figure 2 The corresponding cross-sectional view. Figure 8 is along Figure 7 A cross-sectional view taken along line V-V'. Fig. 9 is along Figure 7 A cross-sectional view taken along line VI-VI'. Fig.10 is a diagram showing a state in which first and second internal electrodes of a multilayer electronic component are overlapped with each other according to another embodiment. Figure 6 The corresponding floor plan.

[0070] In the following, reference will be made to Figures 7 to 10 A multilayer electronic assembly 200 according to another embodiment is described. The same / similar reference numerals may be used for Figures 1 to 6 The components of the multilayer electronic component 100 described in and will not be provided with repeated description.

[0071] The multilayer electronic component 200 according to the embodiment may include: a body 210 including a dielectric layer 211 , an inner electrode pair 221 and 222 , and a floating electrode 223 ; and outer electrodes 231 and 232 .

[0072] The body 210 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0073] In the body 210, the inner electrode pairs 221 and 222 and the floating electrode 223 spaced apart from each other in the second direction may be alternately arranged in the first direction with the dielectric layer 211 therebetween. For example, the inner electrode pairs 221 and 222 may include a first inner electrode 221 and a second inner electrode 222 spaced apart from each other in the second direction. The first inner electrode 221 may be connected to the first outer electrode 231 on the third surface 3, and the second inner electrode 222 may be connected to the second outer electrode 232 on the fourth surface 4.

[0074] The body 210 may include covering portions 212 and 213 disposed on the inner electrodes 221 and 222 or the floating electrode 223 disposed at the outermost portion in the first direction. That is, the body 210 may include covering portions 212 and 213 disposed on the first surface 1 and the second surface 2 sides, respectively, and not including the inner electrodes. The body 210 may include edge portions 214 and 215 disposed on the fifth surface 5 and the sixth surface 6 sides, respectively. The edge portions 214 and 215 do not include the inner electrodes.

[0075] The external electrodes 231 and 232 may include a first external electrode 231 and a second external electrode 232 disposed on the third surface 3 and the fourth surface 4, respectively. The first external electrode 231 may be connected to the first internal electrode 221, and the second external electrode 232 may be connected to the second internal electrode 222. The external electrodes 231 and 232 may include substrate electrode layers 231a and 232a contacting the internal electrodes 221 and 222, and plating layers 231b and 232b disposed on the substrate electrode layers 231a and 232a.

[0076] The first inner electrode 221 may include a first main portion 221a and a first lead portion 221b extending from the first main portion 221a and having a first end portion 21a' in contact with the first outer electrode 231. The second inner electrode 222 may include a second main portion 222a and a second lead portion 222b extending from the second main portion 222a and having a second end portion 22a' in contact with the second outer electrode 232.

[0077] The floating electrode 223 may include a third main portion 223a, a first extension portion 223b extending from the third main portion 223a toward the first external electrode 231 and spaced apart from the first external electrode 231, and a second extension portion 223c extending from the third main portion 223a toward the second external electrode 232 and spaced apart from the second external electrode 232.

[0078] The first main part 221a and the second main part 222a may overlap with the third main part 223a in the first direction. That is, the first main part 221a, the second main part 222a, and the third main part 223a may form a capacitor of the multilayer electronic component 200, and may divide a voltage applied to the multilayer electronic component 200, and the divided voltage may be applied to a region where the first main part 221a and the third main part 223a overlap each other and a region where the second main part 222a and the third main part 223a overlap each other, respectively, thereby improving the reliability of the multilayer electronic component 200.

[0079] The first main portion 221a, the second main portion 222a, and the third main portion 223a may be disposed in a central portion of the body 210 in the second direction. The first main portion 221a and the second main portion 222a may be spaced apart from each other in the second direction in the central portion of the body 210, and may be opposite to each other in the second direction. In addition, the center of the first main portion 221a and the center of the second main portion 222a may be offset from the center of the third main portion 223a.

[0080] According to an embodiment, when the widths of the first main portion 221a and the second main portion 222a in the third direction are defined as W11', the width of the third main portion 223a in the third direction is defined as W12', the widths of the first end portion 21a' and the second end portion 22a' in the third direction are defined as W2', and the widths of both end portions 23a and 23b (third end portion and fourth end portion) of the floating electrode 223 in the second direction in the third direction are defined as W3', W2'>W11' and W3'>W12' may be satisfied.

[0081] By satisfying W2'>W11' and W3'>W12', the lead-out portions 221b and 222b and the extension portions 223b and 223c can effectively disperse the bending stress applied to the body 210. In addition, since W2' is greater than W11', the residual organic matter in the dielectric layer 211 can be smoothly discharged during the sintering process, and the contact area between the internal electrodes 221 and 222 and the external electrodes 231 and 232 can be expanded, so that the equivalent series resistance (ESR) of the multilayer electronic component 200 can be reduced. In addition, the area having the minimum width in the third direction of the edge portions 214 and 215 can be limited to the first end portion 21a' and the second end portion 22a' side, so that the internal electrodes 221 and 222 can be prevented from being exposed to the fifth surface 5 and the sixth surface 6 side due to errors in the process. Therefore, the moisture-proof reliability of the multilayer electronic component 200 can be prevented from being deteriorated. In an embodiment, W2'>W3' can be satisfied.

[0082] W11' and W12' may not be limited to any specific example. For example, when the width of the body 210 in the third direction is defined as Wo', the ratio of W11' to Wo' W11' / Wo' may be 0.4 to 0.8, and the ratio of W12' to Wo' W12' / Wo' may be 0.4 to 0.8. The ratio of W2' to Wo' W2' / Wo' may be, for example, 0.85 to 0.99.

[0083] In an embodiment, the first extension portion 223b may overlap the first lead-out portion 221b in the first direction, and the second extension portion 223c may overlap the second lead-out portion 222b in the first direction. Therefore, the capacitance of the multilayer electronic component 200 may be improved.

[0084] In an embodiment, the width of the first lead portion 221b in the third direction may gradually increase from the first main portion 221a to the first end portion 21a', the width of the second lead portion 222b in the third direction may gradually increase from the second main portion 222a to the second end portion 22a', and the width of the first extension portion 223b and the second extension portion 223c in the third direction may gradually increase from the third main portion 223a to the two ends 23a and 23b of the floating electrode 223 in the second direction. That is, the width of the lead portions 221b and 222b and the extension portions 223b and 223c in the third direction may gradually increase toward the outer side of the body 210 in the second direction, so that the internal electrodes 221 and 222 and the floating electrode 223 may have a relatively large area. Therefore, the bending stress applied to the body 210 can be effectively dispersed. In addition, as Fig.10As shown in FIG, the width of the region where the lead portions 221 b and 222 b overlap the extension portions 223 b and 223 c in the first direction may gradually increase toward the outer side of the body 210 in the second direction, thereby effectively improving the capacitance of the multilayer electronic component 200.

[0085] In an embodiment, when the length of the third main portion 223a in the second direction is defined as L1', the maximum length of the lead portions 221b and 222b in the second direction is defined as L2', and the maximum length of the extension portions 223b and 223c in the second direction is defined as L3', L1'>L2'>L3' may be satisfied. For example, when the length of the body 210 in the second direction is defined as Lo', the ratio of L2' to Lo' L2' / Lo' may be 0.05 to 0.30, and the ratio of L3' to L2' L3' / L2' may be 0.01 to 0.90. L1' is not limited to any specific example, and the ratio of L1' to Lo' L1' / Lo' may be 0.43 to 0.94.

[0086] The length and width disclosed herein may be measured using a scanning electron microscope (SEM). Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may be used.

[0087] According to the aforementioned embodiments, a multilayer electronic component having improved bending strength can be provided.

[0088] Furthermore, a multilayer electronic component having improved electrical characteristics can be provided.

[0089] The embodiments do not necessarily limit the scope of the embodiments to specific embodiment forms. On the contrary, modifications, equivalents and replacements included in the disclosed concepts and technical scope of this specification may be adopted. Throughout the specification, similar reference numerals are used for similar elements.

[0090] In the embodiments, the term "embodiment" may not refer to one and the same embodiment, and may be provided to describe and emphasize the different unique features of each embodiment. The proposed embodiment may be implemented without excluding the possibility of combining with the features of other embodiments. For example, unless otherwise specified, even if a feature described in one embodiment is not described in another embodiment, the description may be understood to be related to another embodiment.

[0091] The terms "first", "second", etc. may be used to distinguish one element from another element, and may not limit the order and / or importance or other related to the elements. In some cases, without departing from the scope of the example embodiments, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element.

[0092] While embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and a plurality of inner electrodes alternately arranged with the dielectric layer in a first direction, the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction; as well as external electrodes, respectively disposed on the third surface and the fourth surface, Wherein, at least one of the plurality of inner electrodes comprises: a main portion disposed in a central portion of the main body in the second direction; a lead portion extending from the main portion in the second direction, having a first end portion in contact with the external electrode and spaced apart from the fifth surface and the sixth surface; and an extension portion extending from the main portion in a direction opposite to the lead-out portion, spaced apart from the external electrode, and having a second end portion opposite to the first end portion, and When the width of the main portion in the third direction is defined as W1, the width of the first end portion in the third direction is defined as W2, and the width of the second end portion in the third direction is defined as W3, W2>W3>W1 is satisfied.

2. The multilayer electronic component according to claim 1, wherein The extending portion of one of the at least one internal electrode overlaps the lead-out portion of another of the at least one internal electrode adjacent to the one internal electrode in the first direction.

3. The multilayer electronic component according to claim 1, in, The width of the lead-out portion in the third direction gradually increases from the main portion toward the first end portion, and Wherein, the width of the extension portion in the third direction gradually increases from the main portion to the second end portion.

4. The multilayer electronic component according to claim 1, wherein: When a width of the body in the third direction is defined as Wo, a ratio W1 to Wo, ie, W1 / Wo, is 0.4 to 0.

8.

5. The multilayer electronic component according to claim 1, wherein When a width of the body in the third direction is defined as Wo, a ratio of W2 to Wo, W2 / Wo, is 0.85 to 0.

99.

6. The multilayer electronic component according to claim 1, in, The body includes a corner portion connecting the third surface to the fifth surface, connecting the third surface to the sixth surface, connecting the fourth surface to the fifth surface, and / or connecting the fourth surface to the sixth surface, the corner portion having a rounded shape, and Wherein, the first end portion is spaced apart from the corner portion.

7. The multilayer electronic component according to claim 1, wherein: When the length of the main portion in the second direction is defined as L1, the maximum length of the lead portion in the second direction is defined as L2, and the maximum length of the extension portion in the second direction is defined as L3, L1>L2>L3 is satisfied.

8. The multilayer electronic component according to claim 7, wherein: When the length of the body in the second direction is defined as Lo, a ratio of L2 to Lo, L2 / Lo, is 0.05 to 0.

30.

9. The multilayer electronic component according to claim 7, wherein: The ratio of L3 to L2, L3 / L2, is 0.01 to 0.

90.

10. The multilayer electronic component according to claim 7, wherein When the length of the body in the second direction is defined as Lo, a ratio of L1 to Lo, L1 / Lo, is 0.43 to 0.

94.

11. The multilayer electronic component according to claim 1, wherein An end portion of the external electrode overlaps the lead portion in the third direction.

12. The multilayer electronic component according to claim 1, wherein The main portion of one of the at least one internal electrode overlaps the main portion of another of the at least one internal electrode adjacent to the one internal electrode in the first direction and does not overlap the lead portion of the other internal electrode in the first direction.

13. The multilayer electronic component according to claim 1, wherein The main portion of one of the at least one internal electrode overlaps the main portion of another of the at least one internal electrode adjacent to the one internal electrode in the first direction and does not overlap the extending portion of the other internal electrode in the first direction.

14. A multilayer electronic component comprising: a body comprising a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction, the body comprising a dielectric layer, an inner electrode pair spaced apart from each other in the second direction, and a floating electrode, wherein the inner electrode pair and the floating electrode are alternately arranged in the first direction with the dielectric layer interposed between the inner electrode pair and the floating electrode; and The first external electrode and the second external electrode are respectively arranged on the third surface and the fourth surface, Wherein, the inner electrode pair comprises: a first internal electrode including a first main portion and a first lead portion, the first lead portion extending from the first main portion and having a first end portion contacting the first external electrode; and a second inner electrode including a second main portion and a second lead portion, the second lead portion extending from the second main portion and having a second end portion in contact with the second outer electrode, Wherein, the floating electrode comprises: The third main part; a first extending portion extending from the third main portion toward the first external electrode, having a third end portion, and spaced apart from the first external electrode; and a second extension portion extending from the third main portion toward the second external electrode, having a fourth end portion and spaced apart from the second external electrode, wherein the first main portion, the second main portion and the third main portion are arranged in a central portion of the main body in the second direction, and Among them, when the width of the first main part and the second main part in the third direction is defined as W11', the width of the third main part in the third direction is defined as W12', the width of the first end part and the second end part in the third direction is defined as W2', and the width of the third end part and the fourth end part in the third direction is defined as W3', W2'>W11' and W3'>W12' are satisfied.

15. The multilayer electronic component according to claim 14, in, The first extension portion overlaps the first lead-out portion in the first direction, and The second extending portion overlaps the second leading portion in the first direction.

16. The multilayer electronic component according to claim 14, in, The width of the first lead portion in the third direction gradually increases from the first main portion toward the first end portion, wherein the width of the second lead portion in the third direction gradually increases from the second main portion toward the second end portion, and The widths of the first extension portion and the second extension portion in the third direction gradually increase from the third main portion along the second direction toward the third end portion and the fourth end portion respectively.

17. The multilayer electronic component according to claim 14, wherein: The first main portion and the second main portion face each other in the second direction.

18. The multilayer electronic component according to claim 14, wherein: The first main portion and the second main portion are spaced apart in the second direction.

19. The multilayer electronic component according to claim 14, wherein: A center of the first main portion and a center of the second main portion are offset from a center of the third main portion.

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