Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the first surface and the second surface are opposite to each other in the first direction, the third surface and the fourth surface are opposite to each other in the second direction, and the fifth surface and the sixth surface are opposite to each other in the third direction; and external electrodes including connection portions disposed on the third surface and the fourth surface, respectively, and tape portions extending from the respective connection portions onto a portion of at least one of the first surface and the second surface. The external electrodes each include an electrode layer connected to one of the internal electrodes and a first plating layer disposed on the electrode layer, and a metal layer including a conductive metal and glass is interposed between the electrode layer and the main body in the tape portion.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0163747 filed on November 22, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCC, a type of multilayer electronic component) may be chip capacitors that are mounted on printed circuit boards of various types of electronic products (such as image display devices including liquid crystal displays (LCDs), plasma display panels (PDPs), etc., computers, smart phones, mobile phones, infotainment systems, etc.) and used for charging or discharging.

[0004] In order to prevent moisture from penetrating into the external electrode, attempts have been made to form a separate plating layer on the base electrode layer so as to be in contact with the main body. However, there is a risk that the end of the plating layer and the surface of the main body may be separated due to a difference in components, and therefore, damage to the base electrode layer and moisture penetration into the main body may not be prevented, and a problem of reducing the moisture resistance reliability of the multilayer electronic component may occur.

[0005] Therefore, there is a need for structural improvements that can simultaneously prevent moisture from penetrating into the external electrodes and prevent moisture from penetrating into the body. Summary of the invention

[0006] An aspect of the present disclosure is to prevent a phenomenon in which an end portion of a plating layer and a surface of a body are separated from each other to deteriorate moisture resistance reliability of a multilayer electronic component.

[0007] The purpose of the present disclosure is not limited to the above contents and can be more easily understood in the process of explaining specific embodiments of the present disclosure.

[0008] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body, including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and an external electrode, including a connecting portion arranged on the third surface and the fourth surface and a band portion extending from the connecting portion to a portion of the first surface and a portion of the second surface, wherein the external electrode includes an electrode layer connected to the internal electrode and a first plating layer arranged on the electrode layer, and a metal layer including a conductive metal and glass is interposed between the electrode layer and the main body in the band portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present disclosure.

[0010] Figure 2 yes Figure 1 A cross-sectional view taken along line II'.

[0011] Figure 3 is a multilayer electronic component according to an embodiment of the present invention Figure 2 The corresponding cross-sectional view.

[0012] Figure 4 yes Figure 2 Magnified view of part A.

[0013] Figure 5 yes Figure 1 A cross-sectional view taken along line II-II'.

[0014] Figure 6 and Figure 7 yes Figure 1 sectional views of the first modification example and the second modification example taken along line III-III'.

[0015] Figure 8 is an exploded perspective view of a main body according to an embodiment. DETAILED DESCRIPTION

[0016] Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, embodiments of the present disclosure may be modified into various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, embodiments of the present disclosure may be provided to more completely describe the present disclosure to those of ordinary skill. Therefore, for the sake of clarity of description, the shapes, sizes, etc. of the elements in the accompanying drawings may be exaggerated, and the elements represented by the same reference numerals in the accompanying drawings may be the same elements.

[0017] In addition, in order to clearly explain the present disclosure in the accompanying drawings, parts that are not related to the description will be omitted, and the thickness can be enlarged to clearly show the layers and regions. The same reference numerals will be used to represent the same components. In addition, throughout the specification, unless otherwise specifically stated, when an element is referred to as "comprising" or "including" an element, this means that the element may also include other elements without excluding other elements.

[0018] Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present disclosure.

[0019] Figure 2 yes Figure 1 A cross-sectional view taken along line II'.

[0020] Figure 3 is a multilayer electronic component according to an embodiment of the present invention Figure 2 The corresponding cross-sectional view.

[0021] Figure 4 yes Figure 2 Magnified view of part A.

[0022] Figure 5 yes Figure 1 A cross-sectional view taken along line II-II'.

[0023] Figure 6 and Figure 7 yes Figure 1 sectional views of the first modification example and the second modification example taken along line III-III'.

[0024] Figure 8 is an exploded perspective view of a main body according to an embodiment.

[0025] In the drawings, the first direction may be defined as a direction or a thickness direction in which the first internal electrode and the second internal electrode are alternately arranged and the dielectric layer is interposed between the first internal electrode and the second internal electrode, and in a second direction and a third direction perpendicular to the first direction, the second direction may be defined as a length direction, and the third direction may be defined as a width direction.

[0026] In the following, reference will be made to Figures 1 to 8A multilayer electronic component and various examples thereof according to an embodiment of the present disclosure are described in detail.

[0027] A multilayer electronic component according to an embodiment of the present disclosure may include a body 110 and external electrodes 130 and 140, the body 110 includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer in a first direction, and the body 110 includes a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface to the fourth surface and opposite to each other in the third direction, and the external electrodes 130 and 140 include a connection portion provided on the third surface and the fourth surface and a band portion extending from the connection portion to a portion of the first surface and a portion of the second surface. However, the present disclosure is not limited thereto. The band portion may extend from the corresponding connection portion to a portion of at least one of the first surface and the second surface. Each of the external electrodes may include an electrode layer 131 and 141 connected to the internal electrode and a first plating layer 132 and 142 provided on the electrode layer, and metal layers 151 and 152 including conductive metal and glass are interposed between the electrode layers 131 and 141 and the body 110 in the band portion.

[0028] Reference Figure 2 , the body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 alternately disposed with the dielectric layer 111 in a first direction.

[0029] Although the specific shape of the body 110 is not particularly limited, Figure 1 As shown, the body 110 may have a hexahedral shape, etc. Due to shrinkage of ceramic powder particles included in the body 110 during a sintering process, the body 110 may not have a completely right hexahedral shape but may have a substantially hexahedral shape.

[0030] The body 110 may include a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0031] The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated to such an extent that it may be difficult to identify boundaries between adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0032] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained therefrom. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. may be used. The barium titanate-based material may include BaTiO 3 -based ceramic powder, and examples of the BaTiO 3 -based ceramic powder may include BaTiO 3 or (Ba 3 Ca 1-x )TiO x in which calcium (Ca), zirconium (Zr), etc. are partially solid-solved in BaTiO 3 etc. (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1- y Zr y )O 3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc.

[0033] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. may be added to barium titanate (BaTiO 3 ) powder, etc. as the raw material for forming the dielectric layer 111.

[0034] The average thickness td of the dielectric layer 111 is not particularly limited.

[0035] For the purpose of miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be less than or equal to 0.35 μm, and for improving the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 may be greater than or equal to 3 μm.

[0036] The average thickness td of the dielectric layer 111 can be measured by scanning images of the cross-sections in the second direction and the first direction of the main body 110 using a scanning electron microscope (SEM).

[0037] For example, the average thickness td of the dielectric layer 111 may be determined in the following manner: among the dielectric layers extracted from an image obtained by scanning a cross section in the length direction and the thickness direction taken from the central portion in the width direction of the body 110 using a scanning electron microscope (SEM), based on one dielectric layer disposed at a point where the length direction center line of the body 110 and the thickness direction center line of the body 110 intersect, for a total of five dielectric layers (including one dielectric layer, two dielectric layers thereon, and two dielectric layers thereunder), five points (one reference point, two points on the left side thereof, and two points on the right side thereof) equally spaced around one reference point are defined based on the point where the length direction center line of the dielectric layer and the thickness direction center line of the dielectric layer intersect, the thickness of the dielectric layer at these points is measured, and the average value of the thickness is calculated. Even if not described in the present disclosure, other measurement methods and / or tools understood by those of ordinary skill in the art may be used.

[0038] The internal electrodes 121 and 122 may be alternately disposed (with the dielectric layer 111 interposed therebetween) to form a capacitor together with the dielectric layer 111 .

[0039] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 may be alternately disposed opposite to each other with the dielectric layer 111 constituting the body 110 interposed therebetween, and may be exposed from the third surface 3 and the fourth surface 4 of the body 110, respectively. Specifically, one end of the first internal electrode 121 may be exposed to the third surface 3, and one end of the second internal electrode 122 may be exposed to the fourth surface 4.

[0040] like Figure 2 As shown in , the first internal electrode 121 may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4. The first external electrode 130 may be disposed on the third surface 3 of the body 110 and connected to the first internal electrode 121, and the second external electrode 140 may be disposed on the fourth surface 4 of the body 110 and connected to the second internal electrode 122.

[0041] For example, the first internal electrode 121 may not be connected to the second external electrode 140 but may be connected to the first external electrode 130, and the second internal electrode 122 may not be connected to the first external electrode 130 but may be connected to the second external electrode 140. Therefore, the first internal electrode 121 may be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 may be formed at a certain distance from the third surface 3. In this case, the first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 interposed between the first internal electrode 121 and the second internal electrode 122.

[0042] The material for forming the internal electrodes 121 and 122 is not particularly limited, and a material having excellent conductivity may be used. For example, the internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0043] In addition, the internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As a printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, etc. may be used, but the present disclosure is not limited thereto.

[0044] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and may vary according to the purpose. In order to miniaturize the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 may be less than or equal to 0.35 μm, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrodes 121 and 122 may be greater than or equal to 3 μm.

[0045] The average thickness te of the internal electrodes 121 and 122 may be determined in the following manner: among the internal electrode layers extracted from an image obtained by scanning a cross section in the length and thickness directions cut from a central portion in the width direction of the body 110 using a scanning electron microscope (SEM), based on one internal electrode layer disposed at a point where a center line in the length direction of the body and a center line in the thickness direction of the body intersect, for a total of five internal electrode layers (including one internal electrode layer, two internal electrode layers thereon, and two internal electrode layers thereunder), based on a point where a center line in the length direction of the internal electrode layer and a center line in the thickness direction of the internal electrode layer intersect, five points (a reference point, two points on the left side thereof, and two points on the right side thereof) equally spaced around one reference point are defined, the thickness of the internal electrode layer at these points is measured, and the average value of the thickness is calculated. Even if not described in the present disclosure, other measurement methods and / or tools understood by a person of ordinary skill in the art may be used.

[0046] Reference Figure 2 and Figure 5 , the body 110 may include a capacitance forming part Ac disposed in the body 110 , and the capacitance forming part Ac may be a region where the first internal electrode 121 and the second internal electrode 122 overlap in the first direction.

[0047] The capacitance forming portion Ac may be a portion that contributes to forming the capacitance of the capacitor, and as Figure 8As shown, the capacitance forming part Ac may be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 with the dielectric layer 111 interposed between the first internal electrodes 121 and the second internal electrodes 122 .

[0048] An upper cover portion 112 may be disposed on one surface of the capacitance forming portion Ac in the first direction, and a lower cover portion 113 may be disposed on the other surface of the capacitance forming portion Ac in the first direction.

[0049] The upper cover portion 112 and the lower cover portion 113 may be formed by stacking a single dielectric layer 111 or two or more dielectric layers 111 on the upper and lower surfaces of the capacitor forming portion Ac in the first direction, respectively, and may mainly play a role in preventing damage to the internal electrode due to physical stress or chemical stress.

[0050] The upper cover portion 112 and the lower cover portion 113 may not include an internal electrode, and may include the same material as the dielectric layer 111 .

[0051] For example, the upper cover portion 112 and the lower cover portion 113 may include a ceramic material, and may include, for example, barium titanate (BaTiO 3 ) based ceramic materials.

[0052] The thickness tc of each of the cover parts 112 and 113 is not limited. In order to more easily achieve miniaturization and high capacitance of multilayer electronic components, the thickness tc of each of the cover parts 112 and 113 may be less than or equal to 15 μm. In this case, the average thickness of the cover parts 112 and 113 may refer to the average thickness of each of the cover parts 112 and 113.

[0053] The average thickness tc of cover portions 112 and 113 may refer to an average size of cover portions 112 and 113 in the first direction, and may be an average value of the sizes of cover portions 112 and 113 measured at five points equally spaced above or below capacitance forming portion Ac in the first direction.

[0054] Reference Figure 5 , the edge portions 114 and 115 may be provided on one surface and the other surface of the capacitance forming portion Ac in the third direction.

[0055] The edge portions 114 and 115 may include an edge portion 114 disposed on the fifth surface 5 of the body 110 and an edge portion 115 disposed on the sixth surface 6. For example, the edge portions 114 and 115 may be disposed on both side surfaces of the body 110 in the width direction.

[0056] like Figure 5As shown in , the edge portions 114 and 115 may refer to regions between both ends of the first and second internal electrodes 121 and 122 and the outer surface of the body 110 , respectively, in a cross section in a width-thickness direction of the body 110 .

[0057] The edge portions 114 and 115 may mainly serve to prevent the inner electrodes from being damaged due to physical stress or chemical stress.

[0058] The edge parts 114 and 115 may be prepared by not coating the conductive paste on the ceramic green sheet except for the region where the internal electrodes are formed.

[0059] In addition, in order to suppress the occurrence of step differences caused by the internal electrodes 121 and 122, after stacking, the internal electrodes can be cut to expose the two side surfaces of the capacitor forming portion in the width direction, and then a single dielectric layer 111 or two or more dielectric layers 111 can be stacked on the two side surfaces of the capacitor forming portion Ac in the width direction to form edge portions 114 and 115.

[0060] In addition, the width of the edge portions 114 and 115 is not limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the edge portions 114 and 115 may be less than or equal to 15 μm.

[0061] The average width of the edge portions 114 and 115 may mean an average size of the edge portions 114 and 115 in the third direction, and may be an average value of the sizes of the edge portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0062] The external electrodes 130 and 140 may be disposed on the body 110 .

[0063] The external electrodes 130 and 140 may be disposed on the third surface 3 and the fourth surface 4 to be connected to the internal electrodes 121 and 122, and the third surface 3 and the fourth surface 4 may be surfaces opposite in a second direction perpendicular to the first direction of the body 110. Specifically, the first external electrode 130 may be disposed on the third surface 3 to be connected to the first internal electrode 121, and the third surface 3 may be one surface perpendicular to the second direction perpendicular to the first direction of the body 110, and the second external electrode 140 may be disposed on the fourth surface 4 to be connected to the second internal electrode 122, and the fourth surface 4 may be another surface perpendicular to the second direction perpendicular to the first direction of the body 110.

[0064] In this embodiment, it is described that the multilayer electronic component 100 may have a structure with two external electrodes 130 and 140 , but the number, shape, etc. of the external electrodes 130 and 140 may be changed according to the shape of the internal electrodes 121 and 122 or other purposes.

[0065] The external electrodes 130 and 140 may include a connection portion provided on the third surface 3 and the fourth surface 4 , and a band portion extending from the connection portion to a portion of the first surface 1 and a portion of the second surface 2 .

[0066] Reference Figure 2 and Figure 3 , showing that the belt portion extends from the connecting portion to a portion of the first surface 1 and a portion of the second surface 2, but the present disclosure is not limited thereto. In an embodiment, the belt portion may have a structure extending from the connecting portion to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6.

[0067] The external electrodes 130 and 140 may include electrode layers 131 and 141 connected to the internal electrodes. The electrode layers 131 and 141 may be disposed on the third surface 3 and the fourth surface 4 of the body 110 and may contact one end of the internal electrodes 121 and 122 in the second direction.

[0068] The electrode layers 131 and 141 may include a first electrode layer 131 connected to the first internal electrode 121 and a second electrode layer 141 connected to the second internal electrode 122 .

[0069] like Figures 2 to 4 As shown, the electrode layers 131 and 141 may be disposed in the connection portion and the band portion of the external electrodes 130 and 140 .

[0070] The electrode layers 131 and 141 may include conductive metal and glass. As the conductive metal, a material having excellent conductivity may be used, but the present disclosure is not particularly limited thereto. For example, the conductive metal may be one or more of Cu, Ni, Sn, Pd, Au, and alloys thereof.

[0071] The method of forming the electrode layers 131 and 141 is not particularly limited. For example, a method of dipping the third surface 3 and the fourth surface 4 of the body 110 into a conductive paste including a conductive metal and glass may be used. When the dipping method is used, the conductive paste may be formed not only on the third surface 3 and the fourth surface 4 of the body 110, but also on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6.

[0072] The external electrodes 130 and 140 may include first plating layers 132 and 142 disposed on the electrode layers 131 and 141. The first plating layers 132 and 142 may serve to improve sealing or mechanical strength by protecting the electrode layers 131 and 141 from external environmental factors such as heat or moisture.

[0073] In an embodiment, the first plating layers 132 and 142 may be provided to cover the electrode layers 131 and 141 , and thus the effect of improving sealing or mechanical strength may become more significant.

[0074] The composition of the first plating layers 132 and 142 is not particularly limited. The first plating layers 132 and 142 may include a metal that can smoothly form a plating layer. For example, the first plating layers 132 and 142 may include one or more of Cu, Ni, Sn, Pd, Au, and alloys thereof.

[0075] More specifically, the first plating layers 132 and 142 may be Cu plating layers including Cu. Therefore, a plating crack phenomenon of a Ni plating layer to be described later may be suppressed.

[0076] In an embodiment, the first plating layers 132 and 142 may include the same metal as the conductive metal included in the electrode layers 131 and 141. Therefore, electrical connectivity and bonding strength of the first plating layers 132 and 142 and the electrode layers 131 and 141 may be further improved.

[0077] Unlike the surface of the body 110, since the first plating layers 132 and 142 may have a small amount of ceramic components and a large amount of metal components, the first plating layers 132 and 142 may have a weak bonding force with the surface of the body 110. Therefore, the first plating layers 132 and 142 and the surface of the body 110 may be separated from each other, and the interface between the first plating layers 132 and 142 and the surface of the body 110 may be a penetration path of external moisture, which may cause damage to the electrode layers 131 and 141. In particular, the end portions of the electrode layers 131 and 141 in the band portion may be formed to be thinner than other regions, and thus may be more susceptible to penetration of external moisture.

[0078] Therefore, in the embodiment of the present disclosure, the moisture-resistant reliability of the multilayer electronic component 100 against external moisture penetration can be improved by providing the metal layers 151 and 152 including conductive metal and glass between the electrode layers 131 and 141 and the body. Specifically, the metal layers 151 and 152 may include conductive metal and glass, and thus may have excellent bonding strength with the electrode layers 131 and 141 and the body 110. In addition, the metal layers 151 and 152 may be interposed between the electrode layers 131 and 141 and the body in the band portion of the external electrodes 130 and 140, and thus may be used to smoothly form the first plating layers 132 and 142 until the end of the band portion.

[0079] Reference Figure 2 , Figure 3 and Figure 4, the metal layers 151 and 152 according to the embodiment may be interposed between the ends of the electrode layers 131 and 141 and the surface of the body 110 in the band portion. Specifically, one end of the metal layers 151 and 152 in the second direction may be disposed beyond one end of the electrode layers 131 and 141 in the second direction, and the other end of the metal layers 151 and 152 in the second direction may be disposed in a portion between the electrode layers 131 and 141 and the surface of the body 110.

[0080] The conductive metal included in the metal layers 151 and 152 may be one or more of Sn, Pd, Au, Ni, Cu, and alloys thereof, and is not particularly limited as long as it may be a material having excellent conductivity.

[0081] In an embodiment, Figure 6 As shown, the metal layers 151 and 152 may be continuously disposed on the first surface 1 and the second surface 2 from one end to the other end of the body 110 in the third direction. Therefore, the penetration of external moisture can be effectively prevented in the entire band portion formed on the first surface 1 and the second surface 2 of the body, and thus the moisture resistance reliability of the multilayer electronic component 100 can be further improved.

[0082] In an embodiment, the metal layers 151 and 152 may be disposed on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. When the band portions of the external electrodes 130 and 140 are also formed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6, the metal layers 151 and 152 may also be disposed on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6 to prevent external moisture from penetrating throughout the band portions. In this case, as Figure 7 As shown, in order to further improve the moisture resistance reliability of the multilayer electronic component 100, the metal layers 151 and 152 can be arranged around the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6, and the metal layers 151 and 152 arranged around the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 can have a continuous shape along the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6.

[0083] In an embodiment, the metal layers 151 and 152 may be disposed only on the first surface 1 and the second surface 2. When the band portions of the external electrodes 130 and 140 are formed on a portion of the first surface 1 and a portion of the second surface 2, or the band portions of the external electrodes 130 and 140 are formed on a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6, the metal layers 151 and 152 may be disposed only on one of the first surface 1 and the second surface 2. In this case, it may be more difficult to improve moisture resistance reliability than when the metal layers 151 and 152 are disposed on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, but it may not be necessary to perform an additional process of separately forming the metal layers 151 and 152 on the fifth surface 5 and the sixth surface 6, and the size of the external electrodes 130 and 140 in the third direction may be reduced. Therefore, it may be advantageous to thin the external electrodes 130 and 140.

[0084] Reference Figure 2 , the metal layers 151 and 152 may be provided on only one of the first surface 1 and the second surface 2. When the first surface 1 is a mounting surface, the multilayer electronic component 100 may be more susceptible to external moisture penetration as external moisture moves toward the second surface 2 which is a surface opposite to the first surface 1. Therefore, in an embodiment, the external electrodes 130 and 140 may be thinned while ensuring moisture resistance reliability by providing the metal layers 151 and 152 on only one of the first surface 1 and the second surface 2.

[0085] In an embodiment, a portion of the metal layers 151 and 152 may be disposed in the band portion beyond one end of the electrode layers 131 and 141 in the second direction. In this case, since a portion of the metal layers 151 and 152 including the conductive metal and the glass exists at a portion of the interface between the first plating layers 132 and 142 and the body 110, the bonding strength of the first plating layers 132 and 142 and the surface of the body 110 may be improved.

[0086] In this case, the first plating layers 132 and 142 may cover portions of the metal layers 151 and 152 disposed beyond one end of the electrode layers 131 and 141 in the second direction. Therefore, the bonding strength between the electrode layers 131 and 141 and the body 110 may be further improved, and the bonding strength between the first plating layers 132 and 142 and the body 110 may also be improved. As a result, a phenomenon in which a gap is generated between the first plating layers 132 and 142 and the body 110 may be suppressed, and penetration of external moisture may be suppressed, so as to further improve the moisture resistance reliability of the multilayer electronic component 100.

[0087] A portion of the metal layers 151 and 152 may be provided in the band portion so as not to exceed the end portions of the first plating layers 132 and 142 in the second direction. In this case, one end of the metal layers 151 and 152 in the second direction may be interposed between one end of the electrode layers 131 and 141 in the band portion in the second direction and one end of the first plating layers 132 and 142 in the second direction.

[0088] In this case, if the total length of metal layers 151 and 152 is a, and the length of the portion of metal layers 151 and 152 disposed beyond one end of electrode layers 131 and 141 in the second direction is b, b / a is greater than or equal to 0.5 and less than or equal to 1.0.

[0089] When b / a is less than 0.5, it may be difficult to form sufficient bonding strength with the first plating layers 132 and 142 , and the effect of improving moisture resistance reliability may be small.

[0090] The upper limit of b / a is not particularly limited, but may not exceed 1.0.

[0091] Therefore, in the embodiment, by ensuring that b / a satisfies 0.5 or more and 1.0 or less, the moisture resistance reliability of the multilayer electronic component can be improved and an excessive increase in the volume of the external electrode can be suppressed.

[0092] The method of forming the metal layers 151 and 152 is not particularly limited. For example, before forming the external electrodes, the metal layers 151 and 152 may be formed on the first surface 1 and the second surface 2 by printing a conductive paste including a conductive metal and glass on the surfaces of the cover parts 112 and 113. Before forming the external electrodes, the metal layers 151 and 152 may be formed on the fifth surface 5 and the sixth surface 6 of the body 110 by attaching a sheet including a conductive metal and glass on the fifth surface 5 and the sixth surface 6.

[0093] The method of distinguishing the metal layers 151 and 152 in the multilayer electronic component 100 is not particularly limited. When the metal layers 151 and 152 include the same metal as the metal component of the electrode layers 131 and 141 or the metal component of the first plating layers 132 and 142, it may be difficult to distinguish the metal layers 151 and 152 even when the cross section in the first direction and the second direction is observed with a scanning electron microscope (SEM). In this case, the band portion of the external electrode can be distinguished by a high-resolution observation method using a field emission scanning electron microscope (FE-SEM), a transmission electron microscope (TEM), or the like. Specifically, the metal layers 151 and 152 can be distinguished as regions including a material other than the metal component.

[0094] When the metal layers 151 and 152 include a different metal from the electrode layers 131 and 141 or the first plating layers 132 and 142 , the metal layers 151 and 152 may be distinguished by a method such as using a scanning electron microscope-energy dispersive spectrometer (SEM-EDS), a transmission electron microscope-energy dispersive spectrometer (TEM-EDS), etc. For example, the metal layers 151 and 152 may be distinguished by observing the ends of the external electrodes in a cross section of the multilayer electronic component 100 in the first direction and the second direction, and according to the presence or absence of other metal elements.

[0095] The Ni plating layers 133 and 143 may be disposed on the first plating layers 132 and 142 , and the Sn plating layers 134 and 144 may be disposed on the Ni plating layers 133 and 143 .

[0096] The present disclosure is not limited to the Ni plating layers 133 and 143 and the Sn plating layers 134 and 144 , and a single plating layer or a plurality of plating layers including one or more of Cu, Ni, Sn, Pd, Au, and alloys thereof may be provided on the first plating layers 132 and 142 .

[0097] The size of the multilayer electronic component 100 is not limited.

[0098] To achieve both miniaturization and high capacitance, the thickness of the dielectric layer and the internal electrode should be thinned to increase the number of stacked layers. In a multilayer electronic component 100 having a size of 0201 (length×width: 0.2 mm×0.1 mm) or less, it may be difficult to ensure moisture resistance reliability.

[0099] Therefore, considering manufacturing errors, external electrode sizes, etc., when the length of the multilayer electronic component 100 is less than or equal to 0.22 mm and the width thereof is less than or equal to 0.11 mm, the effect of improving reliability according to the present disclosure may be more significant. In this case, the length of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the third direction.

[0100] In addition, the expression "embodiment" used in this specification does not mean the same embodiment, and may be provided to emphasize and describe different unique features. However, the embodiment presented above may not exclude the combination of features with another embodiment. For example, unless otherwise described or contradictory to another embodiment, although the description in a specific embodiment is not described in another embodiment, it can be understood as an explanation related to another embodiment.

[0101] The terms used in the present disclosure are only used to illustrate various examples and are not intended to limit the inventive concept. Unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0102] One of the many effects of the present disclosure is to improve the moisture resistance reliability of a multilayer electronic component by preventing the end of a plating layer and a surface of a body from being separated from each other by providing a metal layer including a conductive metal and glass between an electrode layer and a body.

[0103] However, various advantages and effects of the present disclosure are not limited to the above contents and can be more easily understood in the process of explaining specific embodiments of the present disclosure.

[0104] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; as well as an outer electrode including connection portions provided on the third surface and the fourth surface and a band portion extending from the corresponding connection portions to a portion of at least one of the first surface and the second surface, wherein each of the external electrodes comprises an electrode layer connected to one of the internal electrodes and a first plating layer disposed on the electrode layer, and A metal layer including a conductive metal and glass is interposed between the electrode layer and the body in the band portion.

2. The multilayer electronic component according to claim 1, wherein The belt portion is arranged to extend from the connecting portion onto a portion of the first surface, a portion of the second surface, a portion of the fifth surface, and a portion of the sixth surface.

3. The multilayer electronic component according to claim 2, wherein: The metal layer is disposed only on the first surface and the second surface.

4. The multilayer electronic component according to claim 1, wherein: The metal layer is disposed on only one of the first surface and the second surface.

5. The multilayer electronic component according to claim 2, wherein: The metal layer is disposed on the first surface, the second surface, the fifth surface, and the sixth surface.

6. The multilayer electronic component according to claim 5, wherein: The metal layer is continuously provided on the first surface, the second surface, the fifth surface, and the sixth surface.

7. The multilayer electronic component according to claim 1, wherein: The metal layer is disposed on at least one of the first surface and the second surface continuously from one end to the other end of the body in the third direction.

8. The multilayer electronic component according to claim 1, wherein A portion of the metal layer is disposed in the strip portion beyond one end of the electrode layer in the second direction.

9. The multilayer electronic component according to claim 8, wherein: The first plating layer covers a portion of the metal layer that is disposed beyond the one end of the electrode layer in the second direction.

10. The multilayer electronic component according to claim 8, wherein If the total length of the metal layer is a, and the length of a portion of the metal layer disposed beyond the one end of the electrode layer in the second direction is b, b / a is greater than or equal to 0.5 and less than or equal to 1.

0.

11. The multilayer electronic component according to claim 1, wherein The metal layer is provided in the strip portion so as not to exceed one end of the first plating layer in the second direction.

12. The multilayer electronic component according to claim 1, wherein The first plating layer includes Cu.

13. The multilayer electronic component according to claim 1, wherein The electrode layer comprises conductive metal and glass, wherein the first plating layer comprises the same metal as the conductive metal included in the electrode layer, and The external electrode further includes a Ni plating layer disposed on the first plating layer and a Sn plating layer disposed on the Ni plating layer.

14. The multilayer electronic component according to claim 1, wherein The conductive metal included in the metal layer includes one or more of Sn, Pd, Au, Ni, Cu and alloys thereof.

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