Large depth-to-width ratio glass through hole filling and sealing method and device based on liquid metal

Abstract

The invention discloses a filling and sealing method and device for a large depth-to-width ratio glass through hole based on liquid metal, belongs to the field of electronic packaging, and mainly comprises the steps of filling the large depth-to-width ratio glass through hole (TGV) with the liquid metal based on ink jet 3D printing, curing and sealing nano-silver ink and designing the filling and sealing device. The photocured nano-silver ink is used for sealing the TGV with the large depth-to-width ratio filled with the liquid metal, the liquid metal can be effectively prevented from overflowing, and meanwhile the device can achieve accurate filling and reliable sealing of the TGV array with the large depth-to-width ratio. By utilizing high conductivity, low resistivity, high heat conductivity coefficient and excellent fluidity of liquid metal, the TGV interconnection structure has excellent filling quality, high-frequency electrical property and heat dissipation performance, and the defects that cavities, recesses and the like are easy to generate in the traditional filling process, the adhesion between a glass hole wall and metal copper is poor, and the service life of the TGV interconnection structure is prolonged are effectively solved. And the copper material is difficult to meet the high-frequency and high-speed transmission requirement of a future radio frequency system.

Description

Technical Field

[0001] The present application belongs to the field of electronic packaging and is suitable for high-frequency, high-speed radio frequency component multi-layer circuit interconnection. Specifically, it relates to a method and device for filling and sealing a large aspect ratio glass through hole based on liquid metal. Background Art

[0002] With the rapid development of aerospace, automotive electronics and other fields, RF systems will be deployed in higher frequency bands in the future to meet their development needs such as high performance, miniaturization and diversification. Glass is gradually being used in RF system packaging and RF components due to its excellent high-frequency electrical properties. Through-glass via (TGV) technology can achieve multi-layer electrical interconnection and is the core technology for achieving high-density packaging of RF systems. Filling is a key link in TGV technology. By filling the conductive material to conduct the current from one end of the through-hole to the other, it can ensure the electrical performance of the RF system and enhance the mechanical stability. Chemical / electroplating copper is currently the most commonly used TGV filling method. However, these methods still face huge challenges in filling TGVs with a large aspect ratio, mainly in the following aspects: (1) During the filling process of TGVs with a large aspect ratio, defects such as voids and depressions are easily generated, which affect the electrical and mechanical properties of the interconnect structure; (2) The adhesion between the glass hole wall and the metal material is poor, and delamination is easily present at the filling interface, which leads to curling or even shedding of the filling layer; (3) Due to the significant skin effect, unsatisfactory dielectric constant and dielectric loss factor, copper materials are difficult to meet the high-frequency and high-speed requirements of RF systems. Therefore, the development of new TGV filling methods and devices with a large aspect ratio is of great significance for promoting the miniaturization and diversification of high-performance RF systems.

[0003] Liquid metals, such as gallium-based alloys, have high conductivity and low resistivity, can achieve more efficient current transmission, reduce signal transmission loss, improve the signal transmission quality and efficiency of RF components, reduce signal distortion and attenuation, and better meet the needs of high-frequency and high-speed signal transmission. At the same time, liquid metal has good fluidity, which can realize adaptive filling of small, complex shapes, and large aspect ratio TGV structures, and ensure uniform filling and close interface contact, reduce contact resistance and signal reflection, and ensure electrical connection reliability. By selecting different liquid metal components or alloy formulas, its physical properties (such as thermal expansion coefficient, etc.) can be adjusted to a certain extent, which can better match the glass substrate and other packaging materials, thereby improving the stability and reliability of the entire packaging structure and reducing the risk of failure caused by factors such as thermal mismatch. In addition, liquid metal has a high thermal conductivity, which can effectively conduct the heat generated by the chip, improve the heat dissipation performance of the RF component, reduce the operating temperature of the chip, and thus improve the chip reliability and service life.

[0004] Through the above analysis, liquid metal, with its advantages of good fluidity, good electrical and thermal conductivity, provides a new idea and solution for high-quality, high-performance, high-aspect-ratio TGV filling. However, it is worth noting that liquid metal itself has fluidity, and the liquid metal filled in the TGV needs to be effectively sealed to prevent the liquid metal from overflowing from the TGV. Summary of the invention

[0005] The purpose of this application is to provide a method and device for filling and sealing a large aspect ratio glass through hole based on liquid metal, in view of the fact that defects such as voids and depressions are easily generated in the current traditional chemical copper plating and electroplating copper filling processes of large aspect ratio TGVs, the poor adhesion between the glass hole wall and the metal copper, and the difficulty of copper materials to meet the high-frequency and high-speed transmission requirements of future radio frequency systems.

[0006] The method of the present application mainly includes the design of a filling and sealing integrated device for liquid metal filling of glass through holes with large aspect ratios, nanosilver ink curing and sealing based on inkjet 3D printing. Compared with the traditional TGV filling method, which requires complex processes such as depositing a seed layer first and then electroplating, inkjet 3D printing can use the tip of the nozzle to directly print the filling material into the TGV accurately according to a set path, which not only simplifies the process flow, but also can achieve the precision filling of small-sized TGVs. At the same time, inkjet 3D printing allows the advantage of composite printing of multiple different materials, and nanosilver ink printing and photocuring methods are used to achieve the sealing of liquid metal in TGV. In order to further ensure that the liquid metal adheres to and spreads on the inner wall of the TGV and improve the wettability of the hole wall, plasma is used to bombard the inner wall of the TGV or laser is used to process micro-nano structures on the inner wall of the TGV. In addition, the device of the present application can simultaneously achieve precise filling and reliable sealing of TGV arrays with large aspect ratios.

[0007] The purpose of this application is achieved through the following technical solutions:

[0008] A method for filling and sealing a through-glass hole with a large aspect ratio based on liquid metal comprises the following steps:

[0009] Step 1: prepare a PDMS substrate and a glass substrate with a through-glass hole, tightly attach a heat release tape between the glass substrate and the PDMS substrate, and then put them into a heat sealer, where the heat release tape melts to form a heat release tape sealing layer to bond the glass substrate and the PDMS substrate together;

[0010] Step 2: Fill the nanosilver ink into the bottom of the through-glass hole, and then turn on the near-infrared light source to light-cure the nanosilver ink to form a nanosilver sealing layer at the bottom of the through-glass hole;

[0011] Step 3, filling the liquid metal into the hole of the glass through hole;

[0012] Step 4, filling the nanosilver ink into the opening of the glass through hole and filling it up, and then turning on the near-infrared light source to light-cure the nanosilver ink to form a nanosilver sealing layer at the opening of the glass through hole;

[0013] Step five, heating and separating the glass substrate and the PDMS substrate.

[0014] Furthermore, the nanosilver ink multi-nozzle module is controlled to move to the top of the glass through-hole for filling or away from the glass through-hole by means of the X-axis coarse adjustment motion displacement stage, the Y-axis coarse adjustment motion displacement stage and the Z-axis coarse adjustment motion displacement stage; the liquid metal multi-nozzle module is controlled to move to the top of the glass through-hole for filling or away from the glass through-hole by means of the X-axis coarse adjustment motion displacement stage, the Y-axis coarse adjustment motion displacement stage and the Z-axis coarse adjustment motion displacement stage; the near-infrared light source is controlled to move to the glass through-hole for light curing or away from the glass through-hole by means of the X-axis coarse adjustment motion displacement stage and the pneumatic device; the glass through-hole and the multi-nozzle module are precisely aligned by means of the XYZ fine adjustment motion displacement stage.

[0015] Furthermore, the glass through holes are large aspect ratio arrays, prepared by femtosecond laser induced wet etching, and micro-nano structures are prepared on the inner wall of TGV by femtosecond laser, or plasma is used to bombard the inner wall of TGV; liquid metal multi-nozzle modules and nano-silver ink multi-nozzle modules are based on inkjet 3D printing technology.

[0016] Furthermore, the liquid metal is a gallium-based liquid metal alloy, which contains indium and tin metal elements in addition to gallium.

[0017] Furthermore, the temperature setting range in step 1 is 100-150° C., and the pressure holding time range is set to 10-20 s.

[0018] Furthermore, in step 2, step 3 and step 4, the distance between the print head and the glass substrate is 1 to 5 mm, the jet speed setting range is 1 to 10 m / s when filling with nanosilver ink, the jet frequency setting range is 1 to 10 kHz, the jet speed and jet frequency when filling with liquid metal are lower than the jet speed and jet frequency when filling with nanosilver ink, and the ambient temperature is 100 to 150°C.

[0019] Furthermore, in step 2, the near-infrared light source is located 5 to 20 cm above the glass substrate, the light source power is set in the range of 10 to 100 W, and the illumination time is set in the range of 1 to 10 min.

[0020] Furthermore, the heating temperature and heating time in step five are set to 150-200° C. and 5-10 min, respectively.

[0021] A liquid metal-based glass through-hole filling and sealing device with a large aspect ratio comprises a machine body, a liquid metal multi-nozzle module and a nano silver ink multi-nozzle module with XYZ coarse adjustment are provided on the machine body, a near-infrared light source with X coarse adjustment and Y-direction telescopic adjustment is provided on the machine body, and a stage with XYZ fine adjustment is provided on the machine body.

[0022] Furthermore, an XYZ fine-tuning motion displacement stage is provided in the machine body, a loading platform with a heating function is provided on the XYZ fine-tuning motion displacement stage, an X-axis coarse-tuning motion displacement stage is provided on the machine body, a Y-axis coarse-tuning motion displacement stage and a telescopic pneumatic device are provided on the X-axis coarse-tuning motion displacement stage, a Z-axis coarse-tuning motion displacement stage is provided on the Y-axis coarse-tuning motion displacement stage, a liquid metal multi-nozzle module and a nano-silver ink multi-nozzle module are provided on the Z-axis coarse-tuning motion displacement stage, and a near-infrared light source is provided on the pneumatic device.

[0023] Furthermore, a liquid metal storage chamber and a nano-silver ink storage device are provided on the Y-axis coarse adjustment displacement table. The liquid metal storage chamber is connected to the liquid metal multi-nozzle module through a liquid metal conduit. The nano-silver ink storage device is connected to the nano-silver ink multi-nozzle module through a nano-silver ink conduit. Both the liquid metal multi-nozzle module and the nano-silver ink multi-nozzle module are provided with a CCD camera and a print nozzle.

[0024] Beneficial effects of this application:

[0025] (1) Excellent filling quality. Liquid metal is used as the filling material for TGVs with a large aspect ratio. It has good fluidity and can be precisely positioned using 3D printing methods to ensure that the liquid metal flows smoothly into and fills the TGVs with a large aspect ratio. The surface tension of liquid metal is low. At the same time, using plasma to bombard the inner wall of the TGV or laser processing of micro-nano structures on the inner wall of the TGV can improve the wettability of the glass hole wall. Even for TGVs with complex shapes, the filled liquid metal is still evenly distributed, which can avoid the generation of defects such as voids, thereby ensuring the uniformity and integrity of the filling.

[0026] (2) The interconnect structure has excellent high-frequency and high-frequency electrical properties. Compared with traditional metal copper materials, liquid metal has more excellent electrical conductivity, which can ensure that the filled TGV can meet the needs of high-frequency and high-speed signal transmission. At the same time, it can form a close electrical contact with the sealing layer material, which can reduce the risk of electrical signal fluctuations or interruptions caused by poor contact, and improve the electrical stability and reliability of the interconnect structure.

[0027] (3) Excellent heat dissipation properties. Liquid metal has a high thermal conductivity, which can quickly transfer heat from the chip to the heat dissipation components and the surrounding environment, reducing the chip operating temperature and thereby improving the chip's service reliability and lifespan.

[0028] (4) Effective sealing structure and sealing process. Liquid metal has good fluidity. Before and after the liquid metal is filled, the nanosilver ink is filled in the TGV with a large aspect ratio using the 3D printing method. Combined with the photocuring method, a sealing layer is formed at both ends of the TGV, which can effectively prevent the liquid metal from overflowing, thereby ensuring that the interconnection structure has stable electrical properties.

[0029] (5) Reliable integrated liquid metal filling and sealing device. An integrated device that can simultaneously realize liquid metal filling and nanosilver ink curing and sealing is designed. By coordinating the control of the X / Y / Z coarse and fine adjustment motion stage, the nanosilver ink multi-nozzle module, the liquid metal multi-nozzle module and the near-infrared light source, high-quality and high-efficiency filling and sealing of the large aspect ratio TGV array structure can be achieved.

[0030] The aforementioned main scheme of the present application and its further options can be freely combined to form multiple schemes, all of which are schemes that can be adopted and claimed for protection in the present application; and in the present application, (non-conflicting options) can also be freely combined with each other and with other options. After understanding the scheme of the present application, those skilled in the art can understand that there are multiple combinations based on the prior art and common knowledge, all of which are technical schemes to be protected by the present application, and they are not exhaustively listed here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a flow chart of the present application method.

[0032] Figure 2 It is a schematic diagram of the structure of sealing a glass substrate using a heat release tape in the present application.

[0033] Figure 3 It is a schematic diagram of the structure of sealing the bottom of a glass through hole by using nano silver ink in the present application.

[0034] Figure 4 It is a schematic diagram of the structure of sealing a through-glass hole using liquid metal and nano-silver ink in the present application.

[0035] Figure 5 It is a schematic diagram of the structure of the device of the present application.

[0036] In the figure: 1-glass substrate, 2-glass through hole (TGV for short), 3-thermal release tape sealing layer, 4-PDMS substrate, 5-nanosilver sealing layer, 6-liquid metal, 7-X-axis coarse adjustment motion displacement stage, 8-Y-axis coarse adjustment motion displacement stage, 9-Z-axis coarse adjustment motion displacement stage, 10-XYZ fine adjustment motion displacement stage, 11-liquid metal storage chamber, 12-liquid metal conduit, 13-nanosilver ink storage device, 14-nanosilver ink conduit, 15-CCD camera, 16-liquid metal multi-nozzle module, 17-printing nozzle, 18-stage, 19-substrate and substrate combination, 20-pneumatic device, 21-near infrared light source, 22-nanosilver ink multi-nozzle module. DETAILED DESCRIPTION

[0037] The following non-limiting examples are provided to illustrate the present application.

[0038] Example 1

[0039] refer to Figure 1 to Figure 4 As shown, a method for filling and sealing a through-glass via with a large aspect ratio based on liquid metal mainly includes filling a through-glass via with a large aspect ratio (TGV) with liquid metal based on inkjet 3D printing and curing and sealing with nanosilver ink. The use of photocured nanosilver ink to seal the TGV with a large aspect ratio filled with liquid metal can effectively prevent the liquid metal from overflowing, thereby ensuring that the interconnect structure has stable electrical properties.

[0040] The specific steps of filling and sealing a large aspect ratio glass through hole based on liquid metal are as follows: Step 1, prepare a clean PDMS substrate 4 and a glass substrate 1 with a glass through hole 2, tightly fit the heat release tape between the glass substrate 1 and the PDMS substrate 4, and then put them into a heat sealer. Under the action of the pressure and temperature of the heat sealer, the heat release tape is completely melted to form a heat release tape sealing layer 3, so as to completely bond the glass substrate 1 and the PDMS substrate 4 together to form a substrate-substrate combination 19.

[0041] Step 2: Control the nanosilver ink multi-nozzle module 22 to move to the top of the glass through hole 2 for filling through the X-axis coarse adjustment motion displacement stage 7, the Y-axis coarse adjustment motion displacement stage 8 and the Z-axis coarse adjustment motion displacement stage 9; control the glass through hole 2 to be precisely aligned with the multi-nozzle module through the XYZ fine adjustment motion displacement stage 10, fill the nanosilver ink into the bottom of the glass through hole 2, and control the nanosilver ink multi-nozzle module 22 to stay away from the glass through hole 2 after filling.

[0042] The near-infrared light source 21 is controlled to move to the top of the glass through hole 2 for light curing through the X-axis coarse motion displacement stage 7 and the pneumatic device 20, and then the near-infrared light source 21 is turned on to light-cure the nanosilver ink to form a nanosilver sealing layer at the bottom of the glass through hole 2. After curing, the near-infrared light source 21 is controlled to stay away from the glass through hole 2.

[0043] Step 3: Similarly, the liquid metal multi-nozzle module 16 is controlled to move to the top of the through-glass hole 2 for filling or away from the through-glass hole 2 through the X-axis coarse adjustment motion stage 7, the Y-axis coarse adjustment motion stage 8 and the Z-axis coarse adjustment motion stage 9, and the through-glass hole 2 is controlled to be precisely aligned with the multi-nozzle module through the XYZ fine adjustment motion stage 10. The liquid metal 6 is filled into the through-glass hole 2 until the liquid metal 6 is filled to a position close to the top of the glass substrate 1.

[0044] Step 4: Similarly, the nanosilver ink multi-nozzle module 22 is controlled to move to the top of the through-glass hole 2 for filling or away from the through-glass hole 2 through the X-axis coarse adjustment motion stage 7, the Y-axis coarse adjustment motion stage 8 and the Z-axis coarse adjustment motion stage 9, and the through-glass hole 2 is controlled to be precisely aligned with the multi-nozzle module through the XYZ fine adjustment motion stage 10. The nanosilver ink is filled into the opening of the through-glass hole 2 and filled.

[0045] Then, the near-infrared light source 21 is turned on to perform light curing on the nanosilver ink to form a nanosilver sealing layer 5 at the opening of the through-glass hole 2. Similarly, the near-infrared light source 21 is controlled by the X-axis coarse motion stage 7 and the pneumatic device 20 to move to the through-glass hole 2 for light curing or away from the through-glass hole 2.

[0046] Step 5: Heat and separate the glass substrate 1 and the PDMS substrate 4. Take out the glass substrate and the PDMS substrate filled with liquid metal from the device and place them on a heating table. Use tweezers or other tools to separate the glass substrate and the PDMS substrate.

[0047] The through glass via 2 is a large aspect ratio array, which is prepared by a femtosecond laser induced wet etching method, and a femtosecond laser is used to prepare a micro-nano structure on the inner wall of the TGV, or a plasma is used to bombard the inner wall of the TGV to improve the wettability of the hole wall.

[0048] The liquid metal multi-nozzle module 16 and the nano-silver ink multi-nozzle module 22 perform filling operations based on inkjet 3D printing technology. The distance between the printing nozzle 17 arrays of the liquid metal multi-nozzle module 16 and the nano-silver ink multi-nozzle module 22 can be dynamically adjusted to adapt to TGV arrays with different spacings. The inner diameter size range of the nozzle is 5-80μm.

[0049] The liquid metal is a gallium-based liquid metal alloy, which contains indium and tin metal elements in addition to gallium. The types and proportions of elements can be adjusted according to different needs.

[0050] The temperature setting range in step 1 is 100-150°C, and the pressure holding time range is set to 10-20s.

[0051] In step 2, step 3 and step 4, the distance between the print head 17 and the glass substrate 1 is 1 to 5 mm, the jet speed setting range is 1 to 10 m / s when filling with nanosilver ink, and the jet frequency setting range is 1 to 10 kHz. The jet speed and jet frequency when filling with liquid metal are lower than the jet speed and jet frequency when filling with nanosilver ink, and the ambient temperature is 100 to 150°C.

[0052] In step 2, the near-infrared light source 21 is located 5 to 20 cm above the glass substrate 1 , the light source power is set in the range of 10 to 100 W, and the illumination time is set in the range of 1 to 10 min.

[0053] The heating temperature and heating time in step five are set to 150-200° C. and 5-10 min, respectively.

[0054] Example 2

[0055] refer to Figure 5 As shown, a liquid metal-based large aspect ratio glass through hole filling and sealing device includes a body, on which are provided a liquid metal multi-nozzle module 16 and a nano silver ink multi-nozzle module 22 with XYZ coarse adjustment, a near-infrared light source 21 with X coarse adjustment and Y-direction telescopic adjustment, and a stage 18 with XYZ fine adjustment.

[0056] An XYZ fine-tuning motion displacement stage 10 is provided in the machine body, and a stage 18 with a heating function is provided on the XYZ fine-tuning motion displacement stage 10. The stage 18 is precisely adjusted and displaced by controlling the XYZ fine-tuning motion displacement stage 10, and the stage 18 drives the substrate and the base plate combination 19 to move synchronously, thereby realizing precise alignment of the hole position and the nozzle and providing a heated working environment for it.

[0057] An X-axis coarse adjustment motion displacement stage 7 is provided on the machine body, a Y-axis coarse adjustment motion displacement stage 8 and a telescopic pneumatic device 20 are provided on the X-axis coarse adjustment motion displacement stage 7, a Z-axis coarse adjustment motion displacement stage 9 is provided on the Y-axis coarse adjustment motion displacement stage 8, a liquid metal multi-nozzle module 16 and a nano-silver ink multi-nozzle module 22 are respectively provided on the Z-axis coarse adjustment motion displacement stage 9, and a near-infrared light source 21 is provided on the pneumatic device 20. The coarse adjustment motion displacement stage is used to achieve rough adjustment and displacement of the liquid metal multi-nozzle module 16 and the nano-silver ink multi-nozzle module 22, and the coarse adjustment motion displacement stage and the pneumatic device 20 are used to achieve rough displacement adjustment of the near-infrared light source 21.

[0058] A liquid metal storage chamber 11 and a nano-silver ink storage device 13 are provided on the Y-axis coarse adjustment displacement stage 8. The liquid metal storage chamber 11 is connected to the liquid metal multi-nozzle module 16 through a liquid metal conduit 12, and the nano-silver ink storage device 13 is connected to the nano-silver ink multi-nozzle module 22 through a nano-silver ink conduit 14.

[0059] The liquid metal multi-nozzle module 16 and the nano silver ink multi-nozzle module 22 are both provided with a CCD camera 15 and a print nozzle 17. The CCD camera 15 performs visual comparison to assist the motion adjustment of the position motion displacement stage, and the print nozzle 17 performs specific filling.

[0060] Implementation Cases

[0061] refer to Figure 1 to Figure 5 As shown, first prepare a clean, flat glass substrate 1 and a PDMS substrate 4 with a large aspect ratio TGV array, and cut a heat release tape with a width / length suitable for the glass substrate and the PDMS substrate. The cut heat release tape is tightly attached to the surface of the glass substrate 1 and the PDMS substrate 4, respectively, and try to ensure that no bubbles and wrinkles are generated at the bonding interface. Then align the glass substrate 1 and the PDMS substrate 4 with the heat sealing tape and put them into a heat sealer, set the temperature at 100-150°C, apply appropriate pressure between the two and maintain for 10-20s, until the heat release tape is completely melted and completely bonded to the two to form a heat release tape sealing layer 3.

[0062] The substrate and substrate combination 19 (bottom-sealed glass substrate) is placed on a stage 18 with a heating function in the device, and the nanosilver ink multi-nozzle module 22 with a CCD camera 15 and a print head 17 array is moved to just above the glass substrate 1 by controlling the X-axis coarse adjustment motion displacement stage 7, the Y-axis coarse adjustment motion displacement stage 8, and the Z-axis coarse adjustment motion displacement stage 9, so that the distance between the print head 17 array and the glass substrate is 1 to 5 mm, and the tip of the nozzle is aligned with the TGV through hole on the glass substrate by controlling the XYZ fine adjustment motion displacement stage 10.

[0063] The nanosilver ink is injected into the ink storage device and is transferred to the tip of the print head 17 array through the conduit. By setting the jet speed to 1-10 m / s, the jet frequency to 1-10 kHz and the stage temperature to 100-150° C., the nanosilver ink is filled into the TGV through hole with a large aspect ratio, and the filling thickness is about 5-10 μm.

[0064] By controlling the X-axis coarse adjustment motion stage 7, the Y-axis coarse adjustment motion stage 8, and the Z-axis coarse adjustment motion stage 9, the nanosilver ink multi-nozzle module 22 is moved away from the top of the glass substrate. Then, the X-axis coarse adjustment motion stage 7 and the pneumatic device 20 are controlled to move the near-infrared light source 21 to 5 to 20 cm above the glass substrate 1, and the light source power is set to 10 to 100 W and the light exposure time is set to 1 to 10 minutes for light curing. After curing is completed, the near-infrared light source is moved away from the top of the glass substrate.

[0065] Then, by controlling the three coarse adjustment stages, the liquid metal multi-nozzle module 16 is moved to a position 1 to 5 mm above the glass substrate 1, and the liquid metal is injected into the liquid storage chamber, and the liquid metal is transmitted to the tip of the print head array through the conduit. By setting a reasonable injection speed and injection frequency, the liquid metal is injected into the high aspect ratio TGV, so that the liquid metal is filled to 5 to 10 μm at the top of the TGV. The liquid metal multi-nozzle module 16 is moved away from the top of the glass substrate 1.

[0066] The nano silver ink is filled again in the same way, and the near infrared light source 21 is controlled to move to a position 5 to 20 cm above the glass substrate, and the light source power is set to 10 to 100 W and the illumination time is set to 1 to 10 minutes for light curing. After the curing is completed, the filled liquid metal can be sealed.

[0067] Move the glass substrate and PDMS substrate filled with liquid metal out of the device and place them on a heating table. Set the heating temperature and heating time to 150-200°C and 5-10 minutes respectively. The sealing layer formed by the thermal release tape will gradually soften, and the glass substrate and PDMS substrate can be separated using tools such as tweezers.

[0068] The aforementioned basic examples and their further selected examples can be freely combined to form multiple embodiments, all of which are embodiments that can be adopted and claimed for protection in this application. In the scheme of this application, each selected example can be arbitrarily combined with any other basic examples and selected examples.

[0069] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for filling and sealing a through-glass hole with a large aspect ratio based on liquid metal, characterized in that: The steps include: Step 1: prepare a PDMS substrate (4) and a glass substrate (1) having a through-glass hole (2), and tightly attach a heat release tape between the glass substrate (1) and the PDMS substrate (4), and then put them into a heat sealer, so that the heat release tape melts to form a heat release tape sealing layer (3), so as to bond the glass substrate (1) and the PDMS substrate (4) together; Step 2: Fill the bottom of the glass through hole (2) with nanosilver ink, then turn on the near-infrared light source (21) to light-cure the nanosilver ink, so as to form a nanosilver sealing layer (5) at the bottom of the glass through hole (2); Step 3, filling the liquid metal (6) into the hole of the glass through hole (2); Step 4: Fill the nanosilver ink into the opening of the glass through hole (2) and fill it completely, then turn on the near-infrared light source (21) to light-cure the nanosilver ink, so as to form a nanosilver sealing layer (5) at the opening of the glass through hole (2); Step five: heating and separating the glass substrate (1) and the PDMS substrate (4).

2. The method for filling and sealing a through-glass via with a large aspect ratio based on liquid metal according to claim 1, characterized in that: The nanosilver ink multi-nozzle module (22) is controlled to move to the top of the glass through hole (2) for filling or away from the glass through hole (2) by means of an X-axis coarse adjustment motion displacement stage (7), a Y-axis coarse adjustment motion displacement stage (8) and a Z-axis coarse adjustment motion displacement stage (9); the liquid metal multi-nozzle module (16) is controlled to move to the top of the glass through hole (2) for filling or away from the glass through hole (2) by means of an X-axis coarse adjustment motion displacement stage (7), a Y-axis coarse adjustment motion displacement stage (8) and a Z-axis coarse adjustment motion displacement stage (9); the near-infrared light source (21) is controlled to move to the glass through hole (2) for light curing or away from the glass through hole (2) by means of an X-axis coarse adjustment motion displacement stage (7) and a pneumatic device (20); and the glass through hole (2) is controlled to be precisely aligned with the multi-nozzle module by means of an XYZ fine adjustment motion displacement stage (10).

3. The method for filling and sealing a through-glass via with a large aspect ratio based on liquid metal according to claim 1, characterized in that: The glass through hole (2) is a large aspect ratio array, which is prepared by a femtosecond laser induced wet etching method, and a micro-nano structure is prepared on the inner wall of the TGV by using a femtosecond laser, or the inner wall of the TGV is bombarded by plasma; the liquid metal multi-nozzle module (16) and the nano silver ink multi-nozzle module (22) are based on inkjet 3D printing technology.

4. The method for filling and sealing a through-glass via with a large aspect ratio based on liquid metal according to claim 1, characterized in that: The liquid metal is a gallium-based liquid metal alloy, which contains indium and tin metal elements in addition to gallium.

5. The method for filling and sealing a through-glass via with a large aspect ratio based on liquid metal according to claim 1, characterized in that: The temperature setting range in step 1 is 100-150°C, and the pressure holding time range is set to 10-20s.

6. The method for filling and sealing a through-glass via with a large aspect ratio based on liquid metal according to claim 1, characterized in that: In step 2, step 3 and step 4, the distance between the printing nozzle (17) and the glass substrate (1) is 1 to 5 mm, the jet speed setting range is 1 to 10 m / s when filling with nanosilver ink, the jet frequency setting range is 1 to 10 kHz, the jet speed and jet frequency when filling with liquid metal are lower than the jet speed and jet frequency when filling with nanosilver ink, and the ambient temperature is 100 to 150° C.; in step 2, the near-infrared light source (21) is located 5 to 20 cm above the glass substrate (1), the light source power setting range is 10 to 100 W, and the illumination time setting range is 1 to 10 min.

7. The method for filling and sealing a through-glass via with a large aspect ratio based on liquid metal according to claim 1, characterized in that: The heating temperature and heating time in step five are set to 150-200° C. and 5-10 min, respectively.

8. A liquid metal-based high aspect ratio glass through hole filling and sealing device, comprising a body, characterized in that: The machine body is provided with a liquid metal multi-nozzle module (16) and a nano silver ink multi-nozzle module (22) for rough adjustment in the X, Y and Z directions, a near-infrared light source (21) for rough adjustment in the X, Y and Z directions, and a stage (18) for fine adjustment in the X, Y and Z directions.

9. The liquid metal-based high aspect ratio through-glass via filling and sealing device according to claim 8, characterized in that: An XYZ fine-adjustment motion displacement stage (10) is arranged in the machine body, a loading platform (18) with a heating function is arranged on the XYZ fine-adjustment motion displacement stage (10), an X-axis coarse-adjustment motion displacement stage (7) is arranged on the machine body, a Y-axis coarse-adjustment motion displacement stage (8) and a telescopic pneumatic device (20) are arranged on the X-axis coarse-adjustment motion displacement stage (7), a Z-axis coarse-adjustment motion displacement stage (9) is arranged on the Y-axis coarse-adjustment motion displacement stage (8), a liquid metal multi-nozzle module (16) and a nano silver ink multi-nozzle module (22) are arranged on the Z-axis coarse-adjustment motion displacement stage (9), and a near-infrared light source (21) is arranged on the pneumatic device (20).

10. The liquid metal-based high aspect ratio through-glass via filling and sealing device according to claim 8, characterized in that: A liquid metal storage chamber (11) and a nano-silver ink storage device (13) are provided on the Y-axis coarse adjustment motion displacement stage (8); the liquid metal storage chamber (11) is connected to a liquid metal multi-nozzle module (16) via a liquid metal conduit (12); the nano-silver ink storage device (13) is connected to a nano-silver ink multi-nozzle module (22) via a nano-silver ink conduit (14); and a CCD camera (15) and a print nozzle (17) are provided on both the liquid metal multi-nozzle module (16) and the nano-silver ink multi-nozzle module (22).

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