Diode packaging equipment and process

Abstract

The invention relates to the technical field of diode packaging, and discloses a diode packaging device and process, which comprises a mounting table, a supporting column is arranged at the top of the mounting table, a console sleeves the supporting column, a processing table further sleeves the supporting column, a conveying part is arranged on one side of the top of the mounting table, and a plurality of groups of processing heads are arranged at the bottom of the processing table. A mounting plate is arranged at the top of the mounting table, a guide plate is arranged on the mounting plate, and a positioning assembly used in cooperation with the machining head is arranged on the guide plate; an adjusting assembly is arranged on one side of the positioning assembly; the positioning assembly is used for accurately positioning diode raw materials during packaging; the adjusting assembly can automatically adjust the corresponding pressure during packaging according to the size of the diode. Compared with the prior art, the pressure applied during packaging can be automatically adjusted according to the size of the diode, dynamic supplementary adjustment of the pressure is achieved, and therefore stability and accuracy in the packaging process are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of diode packaging, and in particular to a diode packaging device and process. Background Art

[0002] With the continuous progress and development of modern electronic technology, various electronic components are increasingly widely used, especially diodes as basic electronic components, which have been widely used in communications, computers, consumer electronics, automotive electronics, optoelectronic displays and other fields. The packaging process of diodes has an important impact on their performance, reliability and service life. Therefore, improving the accuracy and efficiency of diode packaging technology has become one of the key technical issues in the electronics manufacturing industry.

[0003] In the prior art, a Chinese patent document with publication number CN221783162U proposes a diode packaging device and a packaging method thereof; the device comprises: a bottom plate, the upper surface of which is fixedly connected to a storage table; the diode packaging device and the packaging method provided by the present invention, when in use, start the driving motor, the first crawler conveyor belt and the second crawler conveyor belt rotate synchronously, the square light-emitting diode is placed in the storage groove, when the ball contacts the trapezoidal block, the ball moves upward, so that the piston moves upward, the raw material in the rubber cartridge is injected into the square light-emitting diode through the rubber outlet head, when the ball separates from the trapezoidal block, the piston returns to its original position through the second spring, so that the raw material in the rubber box enters the rubber cartridge, and the raw material is evenly dispersed through the vibration motor, so that the two During the use of diode packaging equipment, there is no need to stop when packaging diodes, and packaging can be performed during the transportation process, which shortens the packaging time of the diodes and improves the diode packaging efficiency. However, in actual use, with the diversification of diode types and the continuous miniaturization of sizes, the adaptability and flexibility of traditional packaging equipment has become a bottleneck restricting the improvement of production efficiency and the stability of product quality. Traditional packaging equipment is generally unable to perform precise adjustment for diodes of different sizes, resulting in the inability to ensure uniform pressure and accurate packaging position during the packaging process, thereby affecting the packaging quality and production efficiency. Therefore, the present application discloses a diode packaging device and process to meet the needs of achieving precise positioning and automatic adjustment of diodes of different sizes. Summary of the invention

[0004] 1. Technical issues to be resolved In view of the deficiencies in the prior art, the present invention provides a diode packaging device and process, which has the advantages of precise positioning and automatic adjustment of diodes of different sizes, and solves a series of problems such as the inability of traditional packaging equipment to accurately adjust diodes of different sizes.

[0005] (II) Technical solution To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a diode packaging device and process, including a mounting table, a support column is arranged on the top of the mounting table, a control console is mounted on the support column, a processing table is also mounted on the support column, a conveying part is arranged on one side of the top of the mounting table, the conveying part is used to convey diode raw materials, a plurality of groups of processing heads are arranged on the bottom of the processing table, the processing heads are used to package the diode raw materials, a mounting plate is arranged on the top of the mounting table, a guide plate is arranged on the mounting plate, a positioning assembly used in conjunction with the processing head is arranged on the guide plate; an adjustment assembly is arranged on one side of the positioning assembly; the positioning assembly is used to accurately position the diode raw materials when packaging; the adjustment assembly can automatically adjust the corresponding pressure during packaging according to the size of the diode.

[0006] Preferably, a guide plate is provided on the top of the mounting plate, the guide plate has a slope inclined to one side, and guide grooves are provided between the guide plates.

[0007] Preferably, a support frame is provided on the top of the guide plate, a support plate is provided on the top of the support frame, a connecting platform is provided on the top of the support plate, a first guide rod is provided on one side of the inner wall of the connecting platform, the first guide rod is a telescopic structure, a pushing block is provided at one end of the first guide rod, the pushing block is trapezoidal, a contact side plate is provided on one side of the pushing block, a first return spring is sleeved on the first guide rod, one end of the first return spring is provided on one side of the inner wall of the connecting platform, and the other end of the first return spring is provided on one side of the pushing block.

[0008] Preferably, the positioning assembly includes a mounting base arranged on the support plate, a plurality of support platforms are arranged on the top of the mounting base, a rotating rod is rotatably arranged on the support platform, a deflection arm is arranged on the rotating rod, a synchronization plate is arranged on one side of the bottom of the deflection arm, a lifting plate is rotatably arranged on the bottom of the synchronization plate, a lifting rod is arranged at the bottom of the lifting plate, the bottom of the lifting plate is passed through the support plate and the mounting base, a support spring is sleeved on the lifting rod, one end of the support spring is arranged at the bottom of the lifting plate, and the other end of the support spring is arranged on the mounting base.

[0009] Preferably, the positioning assembly also includes a first contact plate arranged on one end of the deflection arm, a sliding groove is provided on the first contact plate, a second guide rod is provided on one side of the deflection arm, a second contact plate is provided at one end of the second guide rod, a second return spring is sleeved on the second guide rod, one end of the second return spring is provided on one side of the deflection arm, and the other end of the second return spring is provided on one side of the second contact plate.

[0010] Preferably, the adjusting assembly includes a group of mounting frames symmetrically arranged in the supporting plate, a mounting panel is provided at one end of the mounting frame, a central gear is rotatably provided on the mounting panel, a first sliding rod and a second sliding rod pass through the mounting panel, a first sliding block is provided at one end of the first sliding rod, the first sliding block is meshed with the central gear, a driving plate is provided at one end of the first sliding rod, the driving plate is an arc structure bent to one side, a second sliding block is provided at one end of the second sliding rod, the second sliding block is meshed with the central gear, a group of pressure plates is provided at one end of the second sliding rod, a third return spring is sleeved on the second sliding rod, one end of the third return spring is provided on one side of the lifting plate, and the other end of the second sliding rod is provided on one side of the pressure plate.

[0011] Preferably, a guide block is provided at the bottom of the second contact plate, and the guide block is slidably disposed in the sliding groove.

[0012] Preferably, surfaces of the first contact plate and the second contact plate are both made of rubber.

[0013] Preferably, the pressure plates are relatively slidable, and springs are arranged between the pressure plates.

[0014] A diode packaging process, applied to the above-mentioned diode packaging device, comprises the following steps: S1. Raw material preparation and transportation: The diode raw materials are sent to the processing area through the conveyor and stay at the appropriate position for subsequent processing: S2. Pressure regulation and packaging: The packaging pressure applied to the diode is automatically adjusted by adjusting the components according to the size and packaging requirements of the diode. S3, packaging processing: After positioning and pressure adjustment, the processing head starts the packaging processing operation. The processing head welds, bonds or injects packaging glue to the diode to complete the protection and packaging of the diode according to specific requirements: S4. Inspection and testing after packaging: After packaging is completed, the diode enters the inspection area. The equipment ensures the packaging quality through electrical testing and appearance inspection, and checks whether the packaged diode meets the performance standards. After passing the inspection, the diode will be sent to the downstream link through the conveying department for final packaging and shipment.

[0015] (III) Beneficial effects Compared with the prior art, the present invention provides a diode packaging device and process, which has the following beneficial effects: 1. The diode packaging equipment and process supports the entire packaging process through a mounting table. A control panel and a processing table are installed above the support column to facilitate the control and adjustment of the packaging process. The conveying unit is responsible for conveying the diode raw materials to the processing table to ensure smooth supply of materials. Multiple groups of processing heads arranged under the processing table are used for precise packaging and processing of the diode raw materials. The mounting plate is equipped with a guide plate. The positioning component on the guide plate works in conjunction with the processing head to ensure precise positioning of the diode raw materials. The positioning component is used in conjunction with the adjustment component. The adjustment component automatically adjusts the pressure applied during packaging according to the size of the diode to achieve dynamic supplementary adjustment of the pressure, thereby ensuring stability and accuracy during the packaging process. It can flexibly adapt to the packaging needs of diodes of different specifications, thereby enhancing the adaptability of the equipment and the production capacity of the production line.

[0016] 2. The diode packaging equipment and process, when packaging the diode, the diode raw material is injected with packaging glue through the processing head, and the diode is slowly dropped onto the surface of the first contact plate by the clamping of the processing head, so that the first contact plate can be driven to drive the deflection arm to deflect on the axis of the rotating rod, so that the deflection arm can drive the synchronous plate to deflect at the same time, and the lifting plate can be lifted and lowered synchronously in this process. In the process of lifting the lifting plate, the accuracy of the simultaneous deflection of multiple groups of deflection arms can be guaranteed. At the same time, the simultaneous deflection of the deflection arm can make the second contact plate move along the sliding groove, so that the second contact plate contacts the surface of the diode, thereby ensuring the stability of the diode packaging process. The first contact plate and the second contact plate made of rubber can effectively prevent damage to the diode surface, and provide sufficient friction to ensure precise positioning, thereby realizing the step of completing the mold pressurization of the diode. The elastic force of the supporting spring can drive the lifting plate to rise when the diode is separated from the first contact plate under the guidance of the lifting rod, thereby ensuring the continuity of the diode packaging process, improving the convenience of equipment operation and the automation level of the production line.

[0017] 3. The diode packaging equipment and process, when packaging the diode, the bottom of the diode is preferentially contacted with the driving plate, when diodes of different sizes are in contact with the driving plate, they can all push the first sliding rod to move, during the movement of the first sliding rod, the first sliding block can drive the meshing central gear to rotate, when the central gear rotates, the second sliding block and the first sliding block can be made to move in opposite directions, and at the same time, the pressure plates can be driven to approach each other, and the pressure required for diode packaging is applied through the pressure plates, springs are arranged between the pressure plates to ensure the flexibility and stability of pressure regulation, the pressure plates have relative sliding property and the elastic effect of the third reset spring, which can ensure that under different working conditions, the pressure regulation process is smoother and less likely to generate excessive impact force, thereby avoiding damage to the diode, not only improving the pressure control accuracy during the packaging process, but also enhancing the adaptability of the equipment, and being able to automatically adjust to adapt to diodes of different sizes and specifications, thereby improving production efficiency and packaging quality.

[0018] 4. The diode packaging equipment and process, when the diode enters the guide plate under the drive of the processing head, the diode can contact the contact side plate to push the push block to move along the axis of the first guide rod, and at the same time the first reset spring is compressed. When the diode is packaged, it moves out of the support plate under the drive of the processing head. The elastic force of the first reset spring drives the contact side plate to contact the diode under the guidance of the first guide rod, so that the diode is separated from the processing head and enters the guide plate. Through the slope of the guide plate, the diode can fall into the mounting table along the guide groove, and then the diode is collected after packaging. It can be adjusted according to diodes of different specifications, which improves the versatility and packaging efficiency of the equipment.

[0019] 5. The diode packaging equipment and process, this packaging process can flexibly adapt to the packaging needs of diodes of different sizes and specifications, and is widely used in the production of electronic components, effectively improving the packaging quality and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention from a first viewing angle; Figure 2 It is a schematic diagram of the three-dimensional structure of the present invention from a second viewing angle; Figure 3 This is a schematic diagram of the three-dimensional structure of the top of the mounting platform of the present invention; Figure 4 This is a schematic diagram of the three-dimensional structure of the guide plate of the present invention; Figure 5 For the present invention Figure 4 A in the middle is an enlarged schematic diagram of the three-dimensional structure; Figure 6 It is a schematic diagram of the three-dimensional structure of the positioning component of the present invention; Figure 7It is a schematic diagram of the three-dimensional structure of the adjustment component of the present invention.

[0021] In the figure: 1, mounting table; 2, support column; 3, control table; 4, processing table; 5, conveying part; 6, processing head; 7, guide plate; 8, mounting plate; 9, guide groove; 10, support frame; 11, support plate; 12, connecting table; 13, first guide rod; 14, push block; 15, contact side plate; 16, first return spring; 17, mounting base; 18, support table; 19, rotating rod; 20, deflection arm; 21, lifting rod; 22, support Support spring; 23, lifting plate; 24, synchronization plate; 25, first contact plate; 26, sliding groove; 27, second guide rod; 28, second return spring; 29, second contact plate; 30, guide block; 31, mounting frame; 32, mounting panel; 33, central gear; 34, first sliding block; 35, first sliding rod; 36, driving plate; 37, second sliding block; 38, second sliding rod; 39, third return spring; 40, pressure plate. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] As introduced in the background technology, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes a diode packaging device and process.

[0024] In a typical implementation of the present application, Figure 1-Figure 7 As shown, a diode packaging equipment and process, including a mounting platform 1, a support column 2 is arranged on the top of the mounting platform 1, a control console 3 is sleeved on the support column 2, a processing platform 4 is also sleeved on the support column 2, a conveying part 5 is arranged on one side of the top of the mounting platform 1, the conveying part 5 is used to convey diode raw materials, a plurality of groups of processing heads 6 are arranged on the bottom of the processing platform 4, the processing heads 6 are used to package the diode raw materials, a mounting plate 8 is arranged on the top of the mounting platform 1, a guide plate 7 is arranged on the mounting plate 8, and a positioning component used in conjunction with the processing head 6 is arranged on the guide plate 7; an adjustment component is arranged on one side of the positioning component; the positioning component is used to accurately position the diode raw materials when packaging; the adjustment component can automatically adjust the corresponding pressure during packaging according to the size of the diode; The entire packaging process is supported by the mounting table 1. A control table 3 and a processing table 4 are installed above the support column 2 to facilitate the control and adjustment of the packaging process. The conveying unit 5 is responsible for conveying the diode raw material to the processing table 4 to ensure smooth supply of materials. Multiple groups of processing heads 6 are arranged under the processing table 4 for precise packaging and processing of the diode raw material. The mounting plate 8 is provided with a guide plate 7. The positioning component on the guide plate 7 cooperates with the processing head 6 to ensure precise positioning of the diode raw material. The positioning component is used in conjunction with the adjustment component. The adjustment component automatically adjusts the pressure applied during packaging according to the size of the diode to achieve dynamic supplementary adjustment of the pressure, thereby ensuring stability and accuracy during the packaging process. It can flexibly adapt to the packaging requirements of diodes of different specifications, thereby enhancing the adaptability of the equipment and the production capacity of the production line.

[0025] As a preferred implementation in this embodiment, refer to the attached Figure 1-Figure 6 The positioning assembly includes a mounting base 17 arranged on the support plate 11, a plurality of support platforms 18 are arranged on the top of the mounting base 17, a rotating rod 19 is rotatably arranged on the support platform 18, a deflection arm 20 is arranged on the rotating rod 19, a synchronization plate 24 is arranged on one side of the bottom of the deflection arm 20, a lifting plate 23 is rotatably arranged on the bottom of the synchronization plate 24, a lifting rod 21 is arranged at the bottom of the lifting plate 23, the bottom of the lifting rod 21 passes through the support plate 11 and the mounting base 17, a support spring 22 is sleeved on the lifting rod 21, one end of the support spring 22 is arranged at the bottom of the lifting plate 23, and the other end of the support spring 22 is arranged on the mounting base 17; The positioning assembly further includes a first contact plate 25 disposed on one end of the deflection arm 20, a sliding groove 26 is provided on the first contact plate 25, a second guide rod 27 is provided on one side of the deflection arm 20, a second contact plate 29 is provided on one end of the second guide rod 27, a second return spring 28 is sleeved on the second guide rod 27, one end of the second return spring 28 is provided on one side of the deflection arm 20, and the other end of the second return spring 28 is provided on one side of the second contact plate 29; a guide block 30 is provided at the bottom of the second contact plate 29, and the guide block 30 is slidably provided in the sliding groove 26; the surfaces of the first contact plate 25 and the second contact plate 29 are both made of rubber; When the diode is packaged, the diode raw material is injected with packaging glue through the processing head 6. At the same time, the diode is slowly clamped by the processing head 6 to fall onto the surface of the first contact plate 25, thereby driving the first contact plate 25 to drive the deflection arm 20 to deflect on the axis of the rotating rod 19, thereby enabling the deflection arm 20 to drive the synchronous plate 24 to deflect simultaneously. In this process, the lifting plate 23 can be lifted and lowered synchronously. In the process of lifting and lowering the lifting plate 23, the accuracy of simultaneous deflection of multiple groups of deflection arms 20 can be guaranteed. At the same time, the simultaneous deflection of the deflection arm 20 can enable the second contact plate 29 to move along the sliding groove 26. Then, the second contact plate 29 is in contact with the surface of the diode, thereby ensuring the stability of the diode packaging process. The first contact plate 25 and the second contact plate 29 made of rubber material can effectively prevent damage to the diode surface, and at the same time provide sufficient friction to ensure precise positioning, thereby completing the step of pressurizing the mold for the diode. Through the elastic force of the supporting spring 22, under the guidance of the lifting rod 21, the diode can be separated from the first contact plate 25, which can drive the lifting plate 23 to rise, thereby ensuring the continuity of the diode packaging process, improving the operating convenience of the equipment and the automation level of the production line.

[0026] As a preferred implementation in this embodiment, refer to the attached Figure 1-Figure 5 , Figure 7 The adjusting component includes a group of mounting frames 31 symmetrically arranged in the support plate 11, a mounting panel 32 is arranged at one end of the mounting frame 31, a central gear 33 is rotatably arranged on the mounting panel 32, a first sliding rod 35 and a second sliding rod 38 pass through the mounting panel 32, a first sliding block 34 is arranged at one end of the first sliding rod 35, the first sliding block 34 is meshed with the central gear 33, a driving plate 36 is arranged at one end of the first sliding rod 35, and the driving plate 36 is an arc-shaped structure bent to one side, a second sliding block 37 is arranged at one end of the second sliding rod 38, the second sliding block 37 is meshed with the central gear 33, a group of pressure plates 40 are arranged at one end of the second sliding rod 38, a third return spring 39 is sleeved on the second sliding rod 38, one end of the third return spring 39 is arranged on one side of the lifting plate 23, and the other end of the second sliding rod 38 is arranged on one side of the pressure plate 40; the pressure plates 40 can slide relative to each other, and a spring is arranged between the pressure plates 40; When the diode is packaged, the bottom of the diode is preferentially in contact with the driving plate 36. When diodes of different sizes are in contact with the driving plate 36, they can all push the first sliding rod 35 to move. During the movement of the first sliding rod 35, the first sliding block 34 can drive the meshing central gear 33 to rotate. When the central gear 33 rotates, the second sliding block 37 and the first sliding block 34 can be driven to move in opposite directions. At the same time, the pressure plates 40 can be driven to approach each other. The pressure required for diode packaging is applied through the pressure plates 40. Springs are arranged between the pressure plates 40 to ensure the flexibility and stability of pressure regulation. The pressure plates 40 have relative sliding properties and the elastic effect of the third reset spring 39, which can ensure that under different working conditions, the pressure regulation process is smoother and less likely to generate excessive impact force, thereby avoiding damage to the diode. This not only improves the pressure control accuracy during the packaging process, but also enhances the adaptability of the equipment, and can automatically adjust to adapt to diodes of different sizes and specifications, thereby improving production efficiency and packaging quality.

[0027] As a preferred implementation in this embodiment, refer to the attached Figure 3-Figure 5 A guide plate 7 is provided on the top of the mounting plate 8, and the guide plate 7 is a slope inclined to one side, and a guide groove 9 is provided between the guide plates 7; a support frame 10 is provided on the top of the guide plate 7, and a support plate 11 is provided on the top of the support frame 10, and a connecting platform 12 is provided on the top of the support plate 11, and a first guide rod 13 is provided on one side of the inner wall of the connecting platform 12, and the first guide rod 13 is a telescopic structure, and a push block 14 is provided at one end of the first guide rod 13, and the push block 14 is trapezoidal, and a contact side plate 15 is provided on one side of the push block 14, and a first return spring 16 is sleeved on the first guide rod 13, and one end of the first return spring 16 is arranged on one side of the inner wall of the connecting platform 12, and the other end of the first return spring 16 is arranged on one side of the push block 14; When the diode enters the guide plate 7 driven by the processing head 6, the diode can contact the contact side plate 15 to push the push block 14 to move along the axis of the first guide rod 13, and at the same time, the first return spring 16 is compressed. When the diode is packaged, it moves out of the support plate 11 under the drive of the processing head 6. The elastic force of the first return spring 16 drives the contact side plate 15 to contact the diode under the guidance of the first guide rod 13, so that the diode is separated from the processing head 6 and enters the guide plate 7. Through the slope of the guide plate 7, the diode can fall into the mounting table 1 along the guide groove 9, and then the collection of the diode after packaging is completed. It can be adjusted according to diodes of different specifications, thereby improving the versatility and packaging efficiency of the equipment.

[0028] A diode packaging process, applied to the above-mentioned diode packaging device, comprises the following steps: S1. Raw material preparation and transportation: The diode raw materials are transported to the processing area through the transport unit 5 (such as an automatic conveyor belt). The transport unit ensures the smooth transportation of the diode raw materials and stops them at a suitable position for subsequent processing: S2. Pressure adjustment and packaging: The packaging pressure applied to the diode is automatically adjusted according to the size of the diode and the packaging requirements through the adjustment component (including the first sliding rod 35, the second sliding rod 38, etc.). The adjustment component accurately controls the position and pressure of the pressure plate 40 through the cooperation of the central gear 33 and the sliding block. The pressure plate 40 can be adjusted according to the actual size of the diode to ensure that the diode is subjected to appropriate pressure during the packaging process to avoid poor packaging. Springs are arranged between the pressure plates 40 to adapt to diodes of different sizes and ensure that the applied pressure is uniform and stable: S3, packaging processing: After positioning and pressure adjustment, the processing head 6 starts the packaging processing operation. The processing head 6 performs operations such as welding, bonding or injecting packaging glue on the diode to complete the protection and packaging of the diode according to specific requirements: S4. Inspection and testing after packaging: After packaging, the diode enters the inspection area. The equipment ensures the packaging quality through electrical testing and appearance inspection, and checks whether the packaged diode meets the performance standards (such as forward voltage, reverse current, etc.). After passing the inspection, the diode will be sent to the downstream link through the conveying department for final packaging and shipment.

[0029] This packaging process can flexibly adapt to the packaging needs of diodes of different sizes and specifications, and is widely used in the production of electronic components, effectively improving packaging quality and production efficiency.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A diode packaging device, comprising a mounting platform (1), characterized in that: The mounting platform (1) is provided with a support column (2) at the top, a control panel (3) is sleeved on the support column (2), a processing platform (4) is sleeved on the support column (2), a conveying portion (5) is provided on one side of the top of the mounting platform (1), the conveying portion (5) is used to convey diode raw materials, a plurality of groups of processing heads (6) are provided at the bottom of the processing platform (4), the processing heads (6) are used to package the diode raw materials, a mounting plate (8) is provided on the top of the mounting platform (1), a guide plate (7) is provided on the mounting plate (8), a positioning component used in conjunction with the processing head (6) is provided on the guide plate (7); an adjustment component is provided on one side of the positioning component; The positioning component is used for accurate positioning of diode raw materials during packaging; The regulating component can automatically adjust the corresponding pressure during packaging according to the size of the diode.

2. The diode packaging device according to claim 1, characterized in that: A guide plate (7) is provided on the top of the mounting plate (8), the guide plate (7) has a slope inclined to one side, and guide grooves (9) are provided between the guide plates (7).

3. The diode packaging device according to claim 2, characterized in that: A support frame (10) is arranged on the top of the guide plate (7), a support plate (11) is arranged on the top of the support frame (10), a connecting platform (12) is arranged on the top of the supporting plate (11), a first guide rod (13) is arranged on one side of the inner wall of the connecting platform (12), the first guide rod (13) is a telescopic structure, a push block (14) is arranged on one end of the first guide rod (13), the push block (14) is trapezoidal, a contact side plate (15) is arranged on one side of the push block (14), a first return spring (16) is sleeved on the first guide rod (13), one end of the first return spring (16) is arranged on one side of the inner wall of the connecting platform (12), and the other end of the first return spring (16) is arranged on one side of the push block (14).

4. The diode packaging device according to claim 3, characterized in that: The positioning assembly comprises a mounting base (17) arranged on the support plate (11); a plurality of support platforms (18) are arranged on the top of the mounting base (17); a rotating rod (19) is rotatably arranged on the support platform (18); a deflection arm (20) is arranged on the rotating rod (19); a synchronization plate (24) is arranged on one side of the bottom of the deflection arm (20); a lifting plate (23) is rotatably arranged on the bottom of the synchronization plate (24); a lifting rod (21) is arranged at the bottom of the lifting plate (23); the bottom of the lifting rod (21) passes through the support plate (11) and the mounting base (17); a support spring (22) is sleeved on the lifting rod (21); one end of the support spring (22) is arranged at the bottom of the lifting plate (23); and the other end of the support spring (22) is arranged on the mounting base (17).

5. The diode packaging device according to claim 4, characterized in that: The positioning assembly further comprises a first contact plate (25) arranged on one end of the deflection arm (20), a sliding groove (26) being provided on the first contact plate (25), a second guide rod (27) being provided on one side of the deflection arm (20), a second contact plate (29) being provided on one end of the second guide rod (27), a second return spring (28) being sleeved on the second guide rod (27), one end of the second return spring (28) being provided on one side of the deflection arm (20), and the other end of the second return spring (28) being provided on one side of the second contact plate (29).

6. The diode packaging device according to claim 5, characterized in that: The adjustment assembly comprises a group of mounting frames (31) symmetrically arranged in the support plate (11); a mounting panel (32) is arranged at one end of the mounting frame (31); a central gear (33) is rotatably arranged on the mounting panel (32); a first sliding rod (35) and a second sliding rod (38) pass through the mounting panel (32); a first sliding block (34) is arranged at one end of the first sliding rod (35); the first sliding block (34) is meshed with the central gear (33); a driving gear (33) is arranged at one end of the first sliding rod (35); The driving plate (36) is an arc-shaped structure bent toward one side, a second sliding block (37) is provided at one end of the second sliding rod (38), the second sliding block (37) is meshed with the central gear (33), a group of pressure plates (40) are provided at one end of the second sliding rod (38), a third return spring (39) is sleeved on the second sliding rod (38), one end of the third return spring (39) is provided on one side of the lifting plate (23), and the other end of the second sliding rod (38) is provided on one side of the pressure plate (40).

7. The diode packaging device according to claim 5, characterized in that: A guide block (30) is provided at the bottom of the second contact plate (29), and the guide block (30) is slidably disposed in the sliding groove (26).

8. The diode packaging device according to claim 7, characterized in that: The surfaces of the first contact plate (25) and the second contact plate (29) are both made of rubber.

9. The diode packaging device according to claim 6, characterized in that: The pressure plates (40) are relatively slidable, and springs are arranged between the pressure plates (40).

10. A diode packaging process, applied to a diode packaging device as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Raw material preparation and transportation: The diode raw material is transported to the processing area through the conveying part (5) and stays at an appropriate position for subsequent processing: S2. Pressure regulation and packaging: The packaging pressure applied to the diode is automatically adjusted by adjusting the components according to the size and packaging requirements of the diode. S3, packaging processing: After positioning and pressure adjustment, the processing head (6) starts the packaging processing operation. The processing head (6) performs welding, bonding or injection of packaging glue on the diode to complete the protection and packaging of the diode according to specific requirements: S4. Inspection and testing after packaging: After packaging is completed, the diode enters the inspection area. The equipment ensures the packaging quality through electrical testing and appearance inspection, and checks whether the packaged diode meets the performance standards. After passing the inspection, the diode will be sent to the downstream link through the conveying department for final packaging and shipment.

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