Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method, which can automatically crush waste such as unnecessary parts, other materials, defective products and the like generated in a semiconductor production process into small sizes and automatically discharge the waste to the outside, and comprises: a waste crushing device for crushing the waste into small sizes; the waste crushing device is used for crushing wastes generated in the semiconductor production process and discharged from the discharge port into small sizes; and a filter device that separates the crushed material, which has been crushed into a small size, from the working fluid, thereby filtering the crushed material and discharging only the working fluid.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0164765 filed in the Korean Intellectual Property Office on November 23, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to a substrate processing device and a substrate processing method, and more specifically, to a substrate processing device and a substrate processing method that can automatically crush waste such as unnecessary parts, other materials or defective products generated in a semiconductor production process into smaller sizes and automatically discharge them to the outside. Background Art

[0004] Generally, a semiconductor device can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor device formed as described above can be made into a semiconductor strip composed of a plurality of semiconductor packages through a dicing process, a die bonding process, and a molding process.

[0005] The semiconductor strip manufactured as described above can be separated into a plurality of independent semiconductor packages by a sawing and sorting process, and then classified according to good or defective determination. For example, the device for performing the sawing and sorting process can load the semiconductor strip onto a vacuum plate, and then separate it into a plurality of independent semiconductor packages using a sawing blade, and after the independent semiconductor packages are cleaned and dried, they can be inspected using a vision module.

[0006] In addition, in the process of cutting substrate strips, etc. using a cutting blade, the unnecessary parts generated at the edges of the semiconductor strips, etc., will be piled up and accumulated at the bottom of the device. The operator must constantly check the accumulation of these wastes. Once the saturation state is reached, the equipment needs to be stopped, and then the accumulated wastes need to be manually collected and discarded for cleaning.

[0007] Furthermore, conventional semiconductor package cutting and sorting devices sort and accommodate the semiconductor packages in trays for good products according to the inspection results, or temporarily collect a large number of defective products into a separate collection container such as a bulk box, which then needs to be manually discarded. Summary of the invention

[0008] Technical issues to be solved

[0009] However, this traditional semiconductor packaging cutting and sorting device has the following problems: unnecessary parts generated by the cutting process or defective materials or defective products that cannot pass inspection are temporarily left inside the device for a period of time, which may have an adverse effect on the products produced; there are inconveniences such as the operator needing to manually clean or manage the inside of the device frequently, and the cleaning process requires a lot of time and manpower, which greatly reduces production efficiency.

[0010] In order to solve various problems including the above problems, the object of the present invention is to provide a substrate processing device and a substrate processing method, which can automatically crush waste such as unnecessary parts, other materials or defective products generated in the semiconductor production process into smaller sizes and automatically discharge them to the outside. However, these issues are exemplary and do not limit the scope of the present invention.

[0011] Solutions to technical problems

[0012] To solve the above problems, a substrate processing device according to the present invention includes: a waste crushing device, which crushes waste generated in the semiconductor production process and discharged from the discharge port into small sizes; and a filtering device, which separates the crushed materials into small sizes from the working fluid, thereby filtering the crushed materials and only discharging the working fluid.

[0013] Furthermore, according to the present invention, the waste is an unnecessary portion remaining after cutting in the semiconductor package cutting and sorting apparatus.

[0014] Furthermore, according to the present invention, the substrate processing apparatus further includes a waste conveying device that conveys the waste to the discharge port using the working fluid.

[0015] Furthermore, according to the present invention, the waste conveying device includes a nozzle device which is disposed in the process chamber and has a plurality of injection ports formed in the direction of the discharge port for injecting the working fluid in a straight line or in a vortex form.

[0016] Furthermore, according to the present invention, the working fluid is high-pressure air or water to transmit a delivery pressure to the waste.

[0017] Furthermore, according to the present invention, the waste conveying device further comprises a nozzle moving device, and the nozzle moving device moves the nozzle device along a guide member toward the discharge port.

[0018] Furthermore, according to the present invention, the waste conveying device further comprises a water outlet device, and the water outlet device supplies water to the bottom surface of the process chamber so as to form a water film between the bottom surface of the process chamber and the waste.

[0019] Furthermore, according to the present invention, the process chamber is a process chamber for a cutting process for cutting a substrate strip using a blade rotated by a motor.

[0020] Furthermore, according to the present invention, at least a portion of the bottom surface of the process chamber is formed with a guide slope for guiding the waste.

[0021] Furthermore, according to the present invention, the waste crushing device is a grinding pump, a suction port for sucking the waste and water is formed on one side of the grinding pump, and a discharge pipe for discharging the crushed material and water is formed on the other side of the grinding pump.

[0022] In addition, according to the present invention, the grinding pump includes: a pump body, which is formed with the suction port and the discharge pipe; a cutter, which crushes the waste sucked through the suction port; an impeller, which forms a transmission pressure to the crushed material and water crushed by the cutter; and a pump motor, which is formed in the pump body and rotates the cutter and the impeller.

[0023] In addition, according to the present invention, the cutter includes: a cutter body portion, a rotating shaft hole portion connected to the rotating shaft of the pump motor is formed at the center of the cutter body portion, and a through window portion is formed at the outer edge portion of the cutter body portion; and a cutter blade portion, the cutter blade portion is formed in the through window portion of the cutter body portion, and the cutter blade portion forms a sharp front end so that the waste can be crushed.

[0024] Furthermore, according to the present invention, a rotating shaft hole portion connected to the rotating shaft of the pump motor is formed at the center of the impeller, an input portion is formed at the upper or lower portion of the impeller, and a discharge portion is formed at the side of the impeller so as to form a pressure difference by centrifugal force.

[0025] Furthermore, according to the present invention, the filtering device includes: a collecting body having a housing space formed therein; and a filter element accommodated in the collecting body and having fine pores or a filter screen formed therein so that the crushed matter remains and only the working fluid is discharged.

[0026] Furthermore, according to the present invention, the waste is materials or defective products that cannot pass the inspection process in the semiconductor package cutting and sorting device.

[0027] Furthermore, according to the present invention, the substrate processing apparatus further includes a guiding element, which is in a funnel shape as a whole and guides the waste dropped from the pickup head to the direction of the discharge port.

[0028] On the other hand, in order to solve the above-mentioned problems, the substrate processing method conceived according to the present invention includes: (a) a step of using a working fluid to transport waste generated in the semiconductor production process to an exhaust port; (b) a step of crushing the waste discharged from the exhaust port into smaller sizes; and (c) a step of separating the crushed materials into smaller sizes from the working fluid, thereby filtering the crushed materials and only discharging the working fluid.

[0029] Furthermore, according to the present invention, the step (b) includes: (b-1) a step of crushing the waste using a cutter of a grinding pump; and (b-2) a step of conveying the crushed material using an impeller of the grinding pump.

[0030] Furthermore, according to the present invention, in the step (c), a filter member is used, which is contained in the collection body and has fine pores or a filter screen formed therein, so that the pulverized material remains and only the working fluid is discharged.

[0031] On the other hand, in order to solve the above-mentioned problems, a substrate processing device according to the present invention includes: a waste crushing device, which crushes waste generated in a semiconductor production process and discharged from a discharge port into small sizes; and a filtering device, which separates the crushed material crushed into small sizes from a working fluid, thereby filtering the crushed material and discharging only the working fluid. The waste is an unnecessary part remaining after cutting in a semiconductor package cutting and sorting device. The substrate processing device also includes a waste conveying device, which conveys the waste to the discharge port using the working fluid. The waste conveying device includes a nozzle device, which is arranged in a process chamber and has a plurality of injection ports for spraying the working fluid in the direction of the discharge port. The working fluid is high-pressure air or water to transmit the conveying pressure to the waste. The waste conveying device also includes a nozzle moving device, which moves the nozzle device along a guide member in the direction of the discharge port. The waste conveying device also includes a water discharge device, which supplies water to the bottom surface of the process chamber so as to form a water film between the bottom surface of the process chamber and the waste. The process chamber is a process chamber for a cutting process that uses blades rotated by a motor to cut substrate strips. The waste crushing device is a grinding pump, and a suction port for sucking in the waste and water is formed on one side of the grinding pump, and a discharge pipe for discharging the crushed material and water is formed on the other side of the grinding pump. The grinding pump includes: a pump body, the pump body is formed with the suction port and the discharge pipe; a cutter, the cutter crushes the waste sucked through the suction port; an impeller, the impeller forms a transmission pressure to the crushed material and water crushed by the cutter; and a pump motor, the pump motor is formed in the pump body and rotates the cutter and the impeller. The filtering device includes: a capture group, the interior of the capture group is formed with a storage space; and a filter element, the filter element is accommodated in the capture group and is formed with fine pores or a filter screen so that the crushed material remains and only the working fluid is discharged.

[0032] Effects of the Invention

[0033] According to the various embodiments of the present invention implemented as described above, unnecessary parts, other materials, or defective products generated in the semiconductor production process can be automatically crushed into smaller sizes and automatically discharged to the outside. Without relying on manual operation by operators, the inside of the device can always be cleanly managed, so that high-quality products can be produced, and working time and manpower can be greatly saved, so that the effect of maximizing production efficiency can be achieved. Of course, these effects do not limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1is a plan layout diagram conceptually showing a semiconductor package cutting and sorting apparatus according to some embodiments of the present invention.

[0035] Figure 2 2 is a cross-sectional view showing a substrate processing apparatus according to some embodiments of the present invention.

[0036] Figure 3 It is shown Figure 2 A cross-sectional view of a substrate processing device showing a state in which a substrate strip is cut.

[0037] Figure 4 It is shown Figure 3 A plan view of a substrate strip of a substrate processing device.

[0038] Figure 5 It is shown Figure 2 A side view of a waste conveying device for a substrate processing device.

[0039] Figure 6 It is shown Figure 2 A cross-sectional view of a waste crushing device of a substrate processing device.

[0040] Figure 7 It is shown Figure 6 A plan view of the cutter of the grinding pump.

[0041] Figure 8 It is shown Figure 6 Plan view of the impeller of the grinder pump.

[0042] Fig. 9 It is shown Figure 2 A side view of a filtering device of a substrate processing device.

[0043] Fig.10 2 is a cross-sectional view showing a substrate processing apparatus according to some other embodiments of the present invention.

[0044] Fig.11 is a cross-sectional view showing a substrate processing device according to another embodiment of the present invention.

[0045] Fig.12 is a flow chart showing a substrate processing method according to some embodiments of the present invention. DETAILED DESCRIPTION

[0046] Hereinafter, with reference to the accompanying drawings, several preferred embodiments of the present invention are described in detail.

[0047] The embodiments of the present invention are provided to more completely explain the present invention to those with conventional knowledge in the technical field. The following embodiments may be transformed into a variety of different forms, and the scope of the present invention is not limited to the following embodiments. On the contrary, these embodiments are provided to make the present disclosure more substantial and complete, and to fully convey the technical concept of the present invention to those skilled in the art. In addition, for ease of description and clarity, the thickness or size of each layer in the drawings is exaggerated.

[0048] The terms used in this specification are intended to be used to describe specific embodiments and are not intended to limit the present invention. As used in this specification, unless the context clearly indicates otherwise, the singular form may include the plural form. In addition, when used in this specification, "comprise" and / or "comprising" refer to the existence of the shapes, numbers, steps, operations, parts, elements and / or these groups, and do not exclude the existence or addition of one or more other shapes, numbers, operations, parts, elements and / or these groups.

[0049] Embodiments of the present invention will be described below with reference to the accompanying drawings which briefly illustrate ideal embodiments of the present invention. In the accompanying drawings, variations in the shapes shown may be expected, for example, depending on manufacturing techniques and / or tolerances. Therefore, embodiments of the present inventive concept should not be construed as limited to the specific shapes of the regions shown in this specification, but should include variations in shapes caused by, for example, manufacturing.

[0050] Figure 1 FIG. 1 is a plan layout diagram conceptually illustrating a semiconductor package cutting and sorting apparatus 1000 according to some embodiments of the present invention.

[0051] First, if Figure 1 As shown, the semiconductor package cutting and sorting device 1000 according to some embodiments of the present invention can be used to perform a cutting and sorting process for manufacturing semiconductor devices. Specifically, the semiconductor package cutting and sorting device 1000 can be used to cut a semiconductor strip G and divide it into a plurality of independent semiconductor packages P, and inspect and sort the semiconductor packages P.

[0052] The semiconductor package cutting and sorting device 1000 includes: a cutting module 2000 for cutting a semiconductor strip G and dividing it into a plurality of independent semiconductor packages P; an inspection module 3000 for inspecting the semiconductor packages P; and a semiconductor package conveying module 4000 for classifying and conveying the semiconductor packages P based on the inspection results of the inspection module 3000.

[0053] For example, a magazine 5000 containing a plurality of semiconductor strips G may be configured on one side of the cutting module 2000. In addition, a gripper (not shown) for extracting the semiconductor strips G from the magazine 5000 may be provided, and the semiconductor strips G extracted from the magazine 5000 may be guided by the guide rail 320.

[0054] The cutting module 2000 may include: a strip picker 2100 for picking up and transferring the semiconductor strip G; a strip picker driving unit 2120 for moving the strip picker 2100 in the vertical direction and the horizontal direction; and a vacuum plate 2200 for placing the semiconductor strip G. The strip picker 2100 may be configured to rotate by the strip picker driving unit 2120 to adjust the placement direction of the semiconductor strip G.

[0055] For example, the strip picker 2100 may pick up the semiconductor strip G extracted from the magazine 5000 , and then rotate the semiconductor strip G, and then transfer the rotated semiconductor strip G onto the vacuum plate 2200 .

[0056] The vacuum plate 2200 may be supported by a carrier plate 2220, which may move the semiconductor strip G to the cutting unit 2300. The cutting unit 2300 may include a blade for cutting the semiconductor strip G, and the carrier plate 2220 may be moved by a separate driving portion so that the semiconductor strip G is located below the cutting unit 2300.

[0057] The independent semiconductor packages P divided by the cutting unit 2300 can be picked up and transferred by the package picker 2400. The cutting module 2000 may include a cleaning unit 2500 for cleaning the independent semiconductor packages P. The package picker 2400 is configured to be movable in the vertical direction and the horizontal direction by the package picker driving unit 2420. For example, the package picker driving unit 2420 can move the package picker 2400 to the top of the cleaning unit 2500 after the semiconductor package P is picked up by the package picker 2400, and the cleaning unit 2500 can remove foreign matter from the semiconductor package P using a cleaning brush and a cleaning liquid. In addition, the cleaning unit 2500 can dry the semiconductor package P by spraying air to the semiconductor package P.

[0058] After cleaning and drying the semiconductor package P, the package picker 2400 may transfer the semiconductor package P to the semiconductor package transfer module 4000. For example, the semiconductor package transfer module 4000 may include a tray stage 4100 for supporting the semiconductor package P, and the package picker 2400 may transfer the semiconductor package P to the tray stage 4100.

[0059] The semiconductor package transfer module 4000 may include a stage transfer unit 4120 for moving the tray stage 4100 along a first horizontal direction, for example, along the Y-axis direction. The inspection module 3000 is disposed above a moving path of the tray stage 4100 and may include a first vision unit 3100 for inspecting the semiconductor package P on the tray stage 4100.

[0060] The semiconductor package transfer module 4000 may include a first tray 4200 and a second tray 4220 for accommodating semiconductor packages P. For example, the semiconductor package transfer module 4000 may include a plurality of pickers 4300 for picking up semiconductor packages P from the tray stage 4100 and transferring to the first tray 4200 or the second tray 4220. At this time, the inspection module 3000 may include a second vision unit 3200 for inspecting the semiconductor package P picked up by the picker 4300. As an example, as shown in the figure, the inspection module 3000 may include a second vision unit 3200 configured below the moving route of the picker 4300 and for inspecting the semiconductor package P picked up by the picker 4300. The first tray 4200 and the second tray 4220 may be equipped with pockets for accommodating semiconductor packages P, respectively.

[0061] The first tray 4200 and the second tray 4220 may be disposed below the moving path of the picker 4300, and the picker 4300 may be configured to move along a second horizontal direction, such as the X-axis direction, through the picker driving unit 4320. In addition, the semiconductor package conveying module 4000 may include a tray conveying unit 4240 for moving the first tray 4200 and the second tray 4220 along the first horizontal direction.

[0062] The stage transfer part 4120 and the tray transfer part 4240 may move the tray stage 4100 and the first tray 4200 and the second tray 4220 to the classification area, for example, to below the moving path of the picker 4300. In addition, the semiconductor package transfer module 4000 may include a tray supply part 4400 for supplying the first tray 4200 and the second tray 4220, and a container 4420 for recovering defective semiconductor packages P.

[0063] for Figure 2 The substrate processing apparatus 100 according to some embodiments of the present invention, which will be described below, can be applied to various unnecessary parts cut in the cutting module 2000 or separated and dropped from the cleaning unit 2500 and Figure 1 In addition to the container 4420, it can also be applied to various wastes.

[0064] Figure 2is a cross-sectional view showing a substrate processing apparatus 100 according to some embodiments of the present invention, Figure 3 It is shown Figure 2 A cross-sectional view of a substrate strip S in a cutting state of a substrate processing apparatus 100. Figure 4 It is shown Figure 3 A plan view of a substrate strip S of a substrate processing apparatus 100.

[0065] like Figures 2 to 4 As shown, a substrate processing apparatus 100 according to some embodiments of the present invention may include a waste conveying apparatus 10 , a waste crushing apparatus 20 , and a filtering apparatus 30 .

[0066] For example, Figure 2 As shown, the waste conveying device 10 may be a device for conveying the waste 1 to the exhaust port Cb formed at one side of the process chamber C using the working fluid F.

[0067] For example, Figures 2 to 4 As shown, the process chamber C may be a process chamber for a cutting process, wherein a blade B rotated by a motor M forms a cut K on a substrate strip S, thereby cutting the substrate strip S into a plurality of individual substrates U.

[0068] In addition, for example, at least a portion of the bottom surface of the process chamber C may be formed with a guide slope Ca for guiding the waste 1 .

[0069] However, these process chambers C are not necessarily limited to the drawings, and may be applicable to various situations according to the form or type of equipment that generates various forms of waste.

[0070] The working fluid F may be high pressure air or water to transmit the conveying pressure to the waste 1. However, the working fluid F is not necessarily limited thereto, and a mixed liquid of water and alcohol, an inert gas such as nitrogen or helium, various cleaning agents or working media may be used.

[0071] In addition, for example, Figure 4 As shown, the waste 1 may be an unnecessary portion remaining at an edge portion of the substrate strip S or the like after the substrate strip S is cut to form individual substrates U in the semiconductor package cutting and sorting apparatus 1000 .

[0072] In addition, for example, a gate valve 14 may be provided at the discharge port Cb to achieve selective discharge of the waste 1 and prevent the influence caused by the discharged waste 1 in advance.

[0073] For example, Figure 2As shown, the waste crushing device 20 can be a device that can crush the waste 1 generated in the semiconductor production process and discharged from the discharge port Cb into smaller-sized crushed products 2 of several centimeters or millimeters in size for easy processing, management or transportation.

[0074] The size of the crushed material 2 can be determined according to factors such as the size of the conveying pipe, so the crushed material 2 crushed into such a small size is not only easy to handle and manage, but also can prevent the pipe from being blocked during conveyance, thus facilitating conveyance.

[0075] More specifically, the waste pulverizing device 20 may be, for example, a grinder pump 21 having a pulverizing function and a conveying function so as to be able to pulverize and convey the waste 1 .

[0076] However, the waste pulverizing device 20 is not necessarily limited to the drawings, and various types of pulverizers and agitators may be applied.

[0077] The filtering device 30 may be a device that filters the pulverized matter 2 and discharges only the working fluid F by separating the pulverized matter 2 pulverized into a smaller size of several centimeters or millimeters from the working fluid F for easy handling, management, or transportation.

[0078] More specifically, the filter device 30 includes a collection body 31 and a filter 32. The collection body 31 has a receiving space formed therein; the filter 32 is received in the collection body 31 and has fine pores or a filter screen formed therein so that the crushed material 2 remains and only the working fluid F is discharged.

[0079] By using such a filtering device 30 , the pulverized material 2 and the working fluid F can be separated, and the pulverized material 2 can be filtered to discharge only the working fluid F. The filtered pulverized material 2 can be dried, incinerated, or discarded for separate management.

[0080] Therefore, according to the present invention, the waste conveying device 10 can use the working fluid F to convey the waste 1 generated in the semiconductor production process to the discharge port Cb, the waste crushing device 20 can crush the waste 1 discharged from the discharge port Cb into smaller sizes, and the filtering device 30 separates the crushed material 2 crushed into a smaller size from the working fluid F, thereby filtering the crushed material 2 and discharging only the working fluid F to the outside.

[0081] Therefore, waste 1 such as unnecessary parts, other materials or defective products generated in the semiconductor production process can be automatically crushed into smaller-sized crushed materials 2 and automatically discharged to the outside. Without relying on manual operation by operators, the inside of the equipment can always be managed cleanly, thereby producing high-quality products, greatly saving working time and manpower, and maximizing production efficiency.

[0082] Figure 5 It is shown Figure 2 1 is a side view of the waste conveying device 10 of the substrate processing device 100.

[0083] like Figure 5 As shown, the waste conveying device 10 of the substrate processing device 100 according to some embodiments of the present invention includes a nozzle device 11, a nozzle moving device 12 and a water outlet device 13. The nozzle device 11 is arranged in the process chamber C and has a plurality of injection ports 11a formed in the direction of the discharge port Cb for injecting the working fluid F in a straight line or in a vortex form. The nozzle moving device 12 moves the nozzle device 11 in the direction of the discharge port Cb along a guide member (e.g., a track) R. The water outlet device 13 can supply water to the bottom surface of the process chamber C so as to form a water film between the bottom surface of the process chamber C and the waste 1.

[0084] Therefore, when the waste conveying device 10 is used, a separate camera or sensor is used to confirm the stacking state of the waste 1, or the working fluid F is supplied to the nozzle device 11 at a predetermined time so as to spray the working fluid F in a straight line or vortex form toward the discharge port Cb. At the same time, a water film is formed between the bottom surface of the process chamber C and the waste 1 by the water discharge device 13, and then the nozzle device 11 is moved toward the discharge port Cb along the track R by the nozzle moving device 12, and the waste 1 falling on the ground can be moved toward the discharge port Cb under the pressure of the working fluid F and discharged.

[0085] Figure 6 It is shown Figure 2 A cross-sectional view of a waste crushing device 20 of a substrate processing device 100, Figure 7 It is shown Figure 6 A plan view of the cutter 212 of the grinding pump 21, Figure 8 It is shown Figure 6 A plan view of the impeller 213 of the grinding pump 21.

[0086] like Figures 6 to 8 As shown, the waste crushing device 20 can be a grinding pump 21, and a suction port 21a for sucking waste 1 and water is formed on one side of the grinding pump 21, and a discharge pipe 21b for discharging crushed material 2 and water is formed on the other side of the grinding pump 21.

[0087] For example, Figure 6 As shown, the grinding pump 21 may include a pump body 211, a cutter 212, an impeller 213, and a pump motor 214. The pump body 211 is formed with a suction port 21a and a discharge pipe 21b; the cutter 212 crushes the waste 1 sucked through the suction port 21a; the impeller 213 generates a transmission pressure to the crushed material 2 crushed by the cutter 212 and water; and the pump motor 214 is formed in the pump body 211 and rotates the cutter 212 and the impeller 213.

[0088] Therefore, when the pump motor 214 rotates the cutter 212 and the impeller 213, the cutter 212 can crush the waste 1 sucked through the suction port 21a into crushed material 2, and the impeller 213 generates a transmission pressure for the crushed material 2 and water crushed by the cutter 212 and discharges them to the discharge pipe 21b.

[0089] For example, Figure 7 As shown, the cutter 212 includes a cutter body 212a and a cutter blade 212b. A rotating shaft hole H1 connected to the rotating shaft 214a of the pump motor 214 is formed at the center of the cutter body 212a, and a through window W is formed at the outer edge of the cutter body 212a; the cutter blade 212b is formed in the through window W of the cutter body 212a, and the front end of the cutter blade 212b is formed to be sharp so that the waste 1 can be crushed.

[0090] Therefore, when the cutter 212 is used, when the pump motor 214 rotates the cutter 212 , the waste 1 flowing into the through window W can be crushed into smaller sized crushed objects 2 by the cutter blade 212 b , and the crushed objects 2 can be moved to the impeller 213 .

[0091] For example, Figure 8 As shown, a rotating shaft hole portion H2 connected to the rotating shaft 214a of the pump motor 214 may be formed at the center of the impeller 213, an input portion 213a may be formed at the upper or lower portion of the impeller 213, and a discharge portion 213b may be formed at the side of the impeller 213 so as to form a pressure difference through centrifugal force.

[0092] Therefore, when the impeller 213 is used, when the impeller 213 is rotated by the pump motor 214, the crushed material 2 and the working fluid F flowing into the input part 213a can be discharged to the discharge part 213b by centrifugal force, so that a transmission pressure can be formed, and under this transmission pressure, the crushed material 2 and the working fluid F can be transmitted to the discharge pipe 21b.

[0093] Fig. 9 It is shown Figure 2 FIG. 1 is a side view of the filter device 30 of the substrate processing apparatus 100 .

[0094] like Figure 2 and Fig. 9 As shown, the filter device 30 of the substrate processing device 100 according to some embodiments of the present invention includes a capture group 31 and a filter 32. The capture group 31 has a receiving space formed therein; the filter 32 is received in the capture group 31 and has fine pores or a filter screen formed therein so that the crushed material 2 remains and only the working fluid F is discharged.

[0095] Such a filter 32 may utilize fine pores at least smaller than the size of the pulverized material 2 or a filter formed at a pitch smaller than the size of the pulverized material 2 .

[0096] Therefore, when using such a filter 32, the pulverized material 2 and the working fluid F can be separated, and the pulverized material 2 can be filtered and only the working fluid F can be discharged. The filtered pulverized material 2 can be dried, incinerated, or discarded for separate management.

[0097] However, the filter 32 is not necessarily limited to the drawings, and filters in various forms such as sponge, fabric, non-woven fabric, etc. may also be applied.

[0098] Fig.10 2 is a cross-sectional view showing a substrate processing apparatus 200 according to some other embodiments of the present invention.

[0099] like Fig.10 As shown, a substrate processing device 200 according to some other embodiments of the present invention may include a guide member 40 , a waste crushing device 20 , and a filtering device 30 .

[0100] According to some other embodiments of the present invention, the substrate processing device 200 can crush and process the waste 1, which may be materials or defective products that cannot pass the inspection process in the semiconductor package cutting and sorting device 1000.

[0101] For example, the guide member 40 may be a hopper or a conveying pipe having a funnel shape as a whole, and guides the waste 1 dropped from the pickup head PH to the discharge port Cb.

[0102] For example, the waste pulverizing device 20 may be a device that pulverizes waste 1 generated during semiconductor production and discharged from the discharge port Cb into smaller sized pulverized products 2 of several centimeters or millimeters in size for easy handling, management or transportation.

[0103] The filter device 30 is a device that separates the pulverized material 2 pulverized into a smaller size, such as several centimeters or several millimeters, from the working fluid F such as ordinary air for easy handling, management or transportation, thereby filtering the pulverized material 2 and discharging only the working fluid F.

[0104] The working fluid F may be normal ambient air without additional supply, or may be water or working medium supplied by a separate supply device.

[0105] Therefore, according to the present invention, when the guide 40 guides the waste 1 dropped from the pickup head PH to the direction of the discharge port Cb, for example, the waste crushing device 20 can crush the waste 1 discharged from the discharge port Cb into smaller sizes, and the filtering device 30 separates the crushed material 2 crushed into smaller sizes from the working fluid F such as air, thereby filtering the crushed material 2 and discharging only the working fluid F to the outside.

[0106] Therefore, waste 1 such as materials or defective products that cannot pass the inspection process in the semiconductor packaging cutting and sorting device 1000 can be automatically crushed into smaller-sized crushed materials 2 and automatically discharged to the outside. Without relying on manual operation by an operator, the inside of the equipment can always be managed cleanly, thereby producing high-quality products, greatly saving working time and manpower, and maximizing production efficiency.

[0107] Fig.11 2 is a cross-sectional view showing a substrate processing apparatus 300 according to some other embodiments of the present invention.

[0108] like Figures 1 to 11 As shown, according to another embodiment of the present invention, the substrate processing device 300 described above Figure 2 The substrate processing device 100 and Fig.10 The exhaust pipes of the substrate processing apparatus 200 may be connected to each other to exhaust the working fluid into a separate tank T, or circulate it through a separate circulation line for reuse.

[0109] However, the substrate processing apparatus 300 according to another part of other embodiments of the present invention is not necessarily limited to the drawings and may be applied to various forms and kinds of apparatuses other than the semiconductor package cutting and sorting apparatus 1000 .

[0110] Therefore, it can not only handle Figure 1 The unnecessary parts remaining after cutting in the cutting module 2000 of the semiconductor package cutting and sorting device 1000 can also be processed in a unified manner as waste 1 such as materials or defective products that cannot pass the inspection in the semiconductor package conveying module 4000.

[0111] Fig.12 is a flow chart showing a substrate processing method according to some embodiments of the present invention.

[0112] like Figures 1 to 12 As shown, the substrate processing method according to some embodiments of the present invention includes: (a) a step of using a working fluid F to transport waste 1 generated in a semiconductor production process to an outlet Cb; (b) a step of crushing the waste 1 discharged from the outlet Cb into smaller sizes; and (c) a step of separating the crushed material 2 crushed into a smaller size from the working fluid F, thereby filtering the crushed material 2 and only discharging the working fluid F.

[0113] The step (b) may include: (b-1) crushing the waste 1 using the cutter 212 of the grinding pump 21; and (b-2) conveying the crushed material using the impeller 213 of the grinding pump 21.

[0114] In the step (c), a filter 32 may be used. The filter 32 is contained in the collection body 31 and has fine pores or a filter screen formed therein so that the pulverized material 2 remains and only the working fluid F is discharged.

[0115] Although the present invention has been described with reference to the embodiments shown in the accompanying drawings, this is merely exemplary, and those skilled in the art will appreciate that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention must be determined by the technical concept of the attached patent claims.

[0116] Reference numerals

[0117] 1: Waste F: Working fluid

[0118] C: Process chamber Ca: Guide slope

[0119] Cb: discharge port M: motor

[0120] B: Blade S: Base strip

[0121] P: Semiconductor package G: Semiconductor strip

[0122] U: Single substrate 2: Crushed material

[0123] 10: Waste conveying device 11: Nozzle device

[0124] 11a: Injection port 12: Nozzle moving device

[0125] R: guide member 13: water outlet device

[0126] 14: Gate valve 20: Waste crushing device

[0127] 21: Grinding pump 21a: Suction port

[0128] 21b: discharge pipe 211: pump body

[0129] 212: Cutter 212a: Cutter body

[0130] H1: Rotating shaft hole W: Through window

[0131] 212b: cutting blade 213: impeller

[0132] H2: Rotation shaft hole 213a: Input part

[0133] 213b: discharge part 214: pump motor

[0134] 214a: Rotating shaft 30: Filtering device

[0135] 31: Capture group 32: Filter element

[0136] 40: Guide PH: Pickup head

[0137] T: Box 100, 200, 300: Substrate processing device

[0138] 1000: Semiconductor packaging cutting and sorting equipment

[0139] 5000: Material box

Claims

1. A substrate processing device, comprising: A waste crushing device, which crushes waste generated in the semiconductor production process and discharged from the discharge port into small sizes; as well as A filtering device separates the pulverized matter pulverized into a small size from the working fluid, thereby filtering the pulverized matter and discharging only the working fluid.

2. The substrate processing device according to claim 1, wherein: The waste is unnecessary parts remaining after cutting in a semiconductor package cutting and sorting device.

3. The substrate processing device according to claim 1, wherein: The substrate processing device further includes a waste conveying device configured to convey the waste to the discharge port using the working fluid.

4. The substrate processing device according to claim 3, wherein: The waste conveying device includes a nozzle device, which is disposed in the process chamber and has a plurality of injection ports formed in the direction of the discharge port for injecting the working fluid in a straight line or in a vortex form.

5. The substrate processing device according to claim 4, wherein: The working fluid is high pressure air or water to transmit the delivery pressure to the waste.

6. The substrate processing device according to claim 4, wherein: The waste conveying device further includes a nozzle moving device, which moves the nozzle device along the guide member toward the discharge port.

7. The substrate processing device according to claim 4, wherein: The waste conveying device further comprises a water outlet device, which supplies water to the bottom surface of the process chamber so as to form a water film between the bottom surface of the process chamber and the waste.

8. The substrate processing device according to claim 4, wherein: The process chamber is a process chamber for a cutting process that cuts a substrate strip using a blade rotated by a motor.

9. The substrate processing device according to claim 4, wherein: A guide slope for guiding the waste is formed on at least a portion of the bottom surface of the process chamber.

10. The substrate processing device according to claim 1, wherein: The waste crushing device is a grinding pump, a suction port for sucking the waste and water is formed on one side of the grinding pump, and a discharge pipe for discharging the crushed material and water is formed on the other side of the grinding pump.

11. The substrate processing device according to claim 10, wherein: The grinding pump comprises: a pump body, the pump body being formed with the suction port and the discharge pipe; a cutter for crushing the waste sucked in through the suction port; an impeller that generates a transmission pressure to the pulverized material and water pulverized by the cutter; and A pump motor is formed in the pump body and rotates the cutter and the impeller.

12. The substrate processing device according to claim 11, wherein: The cutter comprises: a cutter body, wherein a rotating shaft hole portion connected to the rotating shaft of the pump motor is formed at the center of the cutter body, and a through window portion is formed at the outer edge of the cutter body; and A cutter blade is formed in the through window of the cutter body, and has a sharp front end so as to crush the waste.

13. The substrate processing device according to claim 11, wherein: A rotating shaft hole portion connected to the rotating shaft of the pump motor is formed at the center of the impeller, an input portion is formed at the upper or lower portion of the impeller, and a discharge portion is formed at the side of the impeller so as to form a pressure difference by centrifugal force.

14. The substrate processing device according to claim 1, wherein: The filtering device comprises: a capture body, wherein a receiving space is formed inside the capture body; and A filter is contained in the collecting body and is formed with fine pores or a filter screen so as to allow the crushed matter to remain and discharge only the working fluid.

15. The substrate processing device according to claim 1, wherein: The waste is materials or defective products that cannot pass the inspection process in the semiconductor package cutting and sorting equipment.

16. The substrate processing device according to claim 15, wherein: The substrate processing device further includes a guide member, which is in a funnel shape as a whole and guides the waste dropped from the pickup head to the direction of the discharge port.

17. A substrate processing method, the substrate processing method comprising: (a) a step of transferring waste generated in a semiconductor production process to an outlet using a working fluid; (b) a step of crushing the waste discharged from the discharge port into smaller sizes; as well as (c) A step of separating the pulverized material pulverized into a smaller size from the working fluid, thereby filtering the pulverized material and discharging only the working fluid.

18. The substrate processing method according to claim 17, wherein: The step (b) comprises: (b-1) a step of crushing the waste using a cutter of a grinding pump; and (b-2) A step of conveying the pulverized material by using an impeller of the grinding pump.

19. The substrate processing method according to claim 17, wherein: In the step (c), a filter member is used. The filter member is contained in the collection body and has fine pores or a filter screen formed therein so that the pulverized material remains and only the working fluid is discharged.

20. A substrate processing device, comprising: A waste crushing device, which crushes waste generated in the semiconductor production process and discharged from the discharge port into small sizes; and a filtering device that separates the pulverized matter pulverized into a small size from the working fluid, thereby filtering the pulverized matter and discharging only the working fluid, The waste is the unnecessary parts remaining after cutting in the semiconductor package cutting and sorting device, The substrate processing device further includes a waste conveying device, wherein the waste conveying device uses the working fluid to convey the waste to the discharge port. The waste conveying device includes a nozzle device, which is arranged in the process chamber and has a plurality of injection ports for injecting the working fluid in the direction of the discharge port. The working fluid is high pressure air or water to transmit the transmission pressure to the waste. The waste conveying device further comprises a nozzle moving device, wherein the nozzle moving device moves the nozzle device along the guide member toward the discharge port. The waste conveying device further comprises a water outlet device, which supplies water to the bottom surface of the process chamber so as to form a water film between the bottom surface of the process chamber and the waste; The process chamber is a process chamber for a cutting process that uses blades rotated by a motor to cut substrate strips. The waste crushing device is a grinding pump, a suction port for sucking the waste and water is formed on one side of the grinding pump, and a discharge pipe for discharging the crushed material and water is formed on the other side of the grinding pump. The grinding pump includes: a pump body, the pump body is formed with the suction port and the discharge pipe; a cutter, the cutter crushes the waste sucked through the suction port; an impeller, the impeller generates a transmission pressure to the crushed material and water crushed by the cutter; and a pump motor, the pump motor is formed in the pump body and rotates the cutter and the impeller, The filtering device includes: a collecting body having a containing space formed therein; and a filter element contained in the collecting body and having fine pores or a filter screen formed therein so as to allow the crushed matter to remain and discharge only the working fluid.

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