Wafer positioning device of dry etching machine

Abstract

The invention relates to the technical field of wafer processing, in particular to a wafer positioning device of a dry etching machine table, which comprises a dry etching machine main body, a portal frame is arranged at the top end of the outer wall of a working table of the dry etching machine main body, and a positioning seat is arranged on the working table of the dry etching machine main body and positioned below the portal frame. According to the invention, through the arrangement of the wafer placing cylinder and the wafer placing groove, a worker can place the wafer at the center of the top end of the positioning placing cylinder to the maximum extent; then, a first electric control telescopic rod simultaneously controls three side clamping plates to move towards the direction of the positioning placement cylinder, so that three arc-shaped clamping blocks can simultaneously clamp the side end of the wafer, the wafer can be fixedly placed in the center of the positioning placement cylinder, it is guaranteed that a vacuum chuck can accurately adsorb the wafer, and the wafer clamping efficiency is improved. And the wafer placement accuracy is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to a wafer positioning device for a dry etching machine. Background Art

[0002] A dry etcher is a device used in the microelectronics and semiconductor industries to form fine patterns on wafers or other substrates. The dry etching process relies mainly on gas reactions and physical effects to remove materials through ion bombardment and chemical reactions in order to achieve high-precision pattern transfer.

[0003] Before the existing dry etching machine is processed, a person is required to place the wafer to be processed on the processing table. However, during the placement process, the wafer is often sucked by a transport fixture and transported to the placement seat of the etching table for the etching machine to facilitate etching processing. However, the transport fixture often causes the wafer to be placed offset because the position of the wafer is not fixed during suction, which makes it easy for the pattern to be misaligned during the subsequent etching process of the wafer, resulting in the wafer being unable to undergo subsequent processing and production normally. Therefore, there are still certain shortcomings.

[0004] Therefore, it is necessary to invent a wafer positioning device for a dry etching machine. Summary of the invention

[0005] To this end, the present invention provides a wafer positioning device for a dry etching machine to solve the problem that the wafer is often placed offset during placement, which leads to pattern misalignment during the subsequent etching process of the wafer, resulting in the wafer being unable to undergo subsequent processing and production normally.

[0006] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer positioning device for a dry etching machine, comprising a dry etching machine main body, a gantry is placed on the top of the outer wall of the workbench of the dry etching machine main body, a moving component for moving the wafer is installed on the top of the inner wall of the gantry, and a positioning seat is provided on the workbench of the dry etching machine main body below the gantry, and a positioning component for positioning the wafer is provided in the positioning seat.

[0007] Preferably, the positioning component includes a horizontal plate, which is slidably connected to the upper end of the inner wall of the positioning seat, and a hydraulic telescopic rod is fixed to the bottom end of the inner wall of the positioning seat and below the horizontal plate, and the top output end of the hydraulic telescopic rod is connected to the bottom end of the outer wall of the horizontal plate.

[0008] Preferably, a positioning and placement tube is fixed at the center of the top end of the outer wall of the horizontal plate, and side clamps are provided on the side ends of the outer wall of the positioning and placement tube. The three side clamps are evenly arranged in a strip array, and arc-shaped clamping blocks are fixed on the outer wall of the side clamp and on one side close to the positioning and placement tube, and the bottom end of the outer wall of the arc-shaped clamping block is arranged above the top end of the outer wall of the positioning and placement tube.

[0009] Preferably, a storage tank is opened inside the positioning and placing cylinder and at a position corresponding to the bottom end of the side clamp, a fixing seat is fixed at the bottom end of the inner wall of the storage tank, and a first electrically-controlled telescopic rod is fixed at the side end of the outer wall of the fixing seat and at a position corresponding to the side clamp, and the output end of the first electrically-controlled telescopic rod is fixedly connected to the bottom end of the side clamp.

[0010] Preferably, a first vacuum pump is fixed to the top of the outer wall of the horizontal plate and located on one side of the positioning and placement tube, a vacuum seat for placing the wafer is provided at the center of the top of the inner wall of the positioning and placement tube, and the top suction end of the first vacuum pump is connected to the inner wall of the vacuum seat through a suction pipe.

[0011] Preferably, the positioning component also includes a wafer placing cylinder, which is arranged above the top of the outer wall of the positioning seat, and the inner wall of the wafer placing cylinder is provided with a wafer placing groove for the wafer to fall, and a fixing cylinder is fixed on the top of the outer wall of the dry etching machine body and on one side of the positioning seat.

[0012] Preferably, the inner wall of the fixed cylinder is rotatably connected to a curved clamp rod, and the end of the curved clamp rod away from the fixed cylinder is fixedly connected to the side end of the outer wall of the wafer placement cylinder, and positioning sliders are fixed to the side walls of the curved clamp rod and the upper and lower sides inside the fixed cylinder.

[0013] Preferably, a positioning slot is provided on the inner wall of the fixing cylinder at a position corresponding to the positioning slide block, the outer wall of the positioning slide block is slidably connected to the inner wall of the positioning slot, and the positioning slot is provided at an angle of 90 degrees or 180 degrees.

[0014] Preferably, the moving component includes an air-controlled slide, which is fixed to the top of the inner wall of the gantry, and a second electrically-controlled telescopic rod is installed at the bottom end of the outer wall of the air-controlled slide, and a fixing plate is fixed to the bottom output end of the second electrically-controlled telescopic rod.

[0015] Preferably, a vacuum suction cup is fixedly installed at the bottom end of the outer wall of the fixed plate and at a position corresponding to the positioning and placement tube, and a second vacuum pump is fixed to one side of the top end of the outer wall of the fixed plate, and the suction end of the second vacuum pump is connected to the vacuum suction cup through a suction pipe.

[0016] The beneficial effects of the present invention are:

[0017] In the present invention, the wafer placement cylinder and wafer placement groove are set up so that personnel can place the wafer at the top center of the positioning placement cylinder to the greatest extent, and then the first electrically-controlled telescopic rod simultaneously controls the three side clamps to move toward the direction of the positioning placement cylinder, so that the three arc-shaped clamping blocks can clamp the side ends of the wafer at the same time, so that the wafer can be fixedly placed in the center of the positioning placement cylinder, ensuring that the vacuum suction cup can accurately adsorb the wafer, improving the accuracy of wafer placement, and avoiding the situation where the dry etcher etches the pattern of the wafer offset. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention in a side view;

[0019] Figure 2 It is a partial structural schematic diagram of the positioning component in the present invention in the front view direction;

[0020] Figure 3 It is a schematic diagram of the cross-sectional structure of the positioning seat in the front view direction of the present invention;

[0021] Figure 4 It is a schematic cross-sectional structure diagram of the positioning and placing tube in the present invention in the front view direction;

[0022] Figure 5 It is a schematic diagram of the cross-sectional structure of the wafer placing cylinder and the fixing cylinder in the front view direction of the present invention;

[0023] Figure 6 For the present invention Figure 1 The enlarged structural diagram at A in the middle;

[0024] Figure 7 It is a schematic diagram of a partial three-dimensional structure of the fixing cylinder in the present invention in the front view direction;

[0025] Figure 8 It is a schematic diagram of the three-dimensional structure of the side splint in the present invention.

[0026] In the figure: 100, dry etching machine body; 200, positioning seat; 210, hydraulic telescopic rod; 211, horizontal plate; 220, first vacuum pump; 230, positioning placement cylinder; 231, side clamping plate; 232, arc clamping block; 233, first electric-controlled telescopic rod; 234, vacuum seat; 300, wafer placement cylinder; 310, wafer placement groove; 400, fixed cylinder; 410, curved clamping rod; 411, positioning slider; 420, positioning slide groove; 500, gantry; 510, air-controlled slide; 520, second electric-controlled telescopic rod; 521, fixed plate; 522, vacuum suction cup; 523, second vacuum pump. DETAILED DESCRIPTION

[0027] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0028] Refer to the attached Figure 1-Figure 8 The present invention provides a wafer positioning device for a dry etching machine, comprising a dry etching machine body 100, a gantry 500 is placed on the top of the outer wall of the workbench of the dry etching machine body 100, the gantry 500 can move the wafer to the bottom of the etching tool of the dry etching machine body 100 through a moving component, so that the dry etching machine body 100 can etch the wafer, the top of the inner wall of the gantry 500 is equipped with a moving component for moving the wafer, the moving component comprises an air-controlled slide 510, the air-controlled slide 510 is fixed to the top of the inner wall of the gantry 500, and the air-controlled slide 510 comprises a moving guide rail and an air-controlled guide rail slide, and the air-controlled guide rail slide can drive a second electric-controlled telescopic rod 520 to move, and the bottom of the outer wall of the air-controlled slide 510 is equipped with a moving component for moving the wafer. There is a second electrically-controlled telescopic rod 520, a fixing plate 521 is fixed to the bottom output end of the second electrically-controlled telescopic rod 520, a vacuum suction cup 522 is fixedly installed at the bottom end of the outer wall of the fixing plate 521 and at a position corresponding to the positioning and placing tube 230, a second air pump 523 is fixed to one side of the top end of the outer wall of the fixing plate 521, the suction end of the second air pump 523 is connected with the vacuum suction cup 522 through an air suction pipe, the second electrically-controlled telescopic rod 520 can drive the fixing plate 521 to move up and down through the output end, and when the fixing plate 521 moves downward, the vacuum suction cup 522 can be brought into contact with the top end of the wafer, and then the second air pump 523 is powered on to evacuate the vacuum suction cup 522 so that the vacuum suction cup 522 adsorbs and fixes the wafer, thereby enabling the wafer to be transported;

[0029] The workbench of the dry etching machine body 100 is located below the gantry 500 and is provided with a positioning seat 200. The positioning seat 200 is provided with a positioning component for positioning the wafer. The positioning component includes a horizontal plate 211, which is slidably connected to the upper end of the inner wall of the positioning seat 200. A slider is fixed to the outer side of the horizontal plate 211. The horizontal plate 211 can ensure the stability of its sliding on the inner wall of the positioning seat 200 through the slider. A hydraulic telescopic rod 210 is fixed to the bottom end of the inner wall of the positioning seat 200 and located below the horizontal plate 211. The top output end of the hydraulic telescopic rod 210 is connected to the bottom end of the outer wall of the horizontal plate 211. The hydraulic telescopic rod 210 can push the horizontal plate 211 to move between the positioning seat 2 00 The inner wall can move up and down, so that the position of the positioning and placing cylinder 230 can be adjusted. The positioning and placing cylinder 230 is fixed at the center of the top end of the outer wall of the horizontal plate 211. The side ends of the outer wall of the positioning and placing cylinder 230 are provided with side clamps 231. The three side clamps 231 are evenly arranged in a strip array. The outer wall of the side clamps 231 and one side close to the positioning and placing cylinder 230 are fixed with arc clamps 232. The bottom end of the outer wall of the arc clamp 232 is set above the top end of the outer wall of the positioning and placing cylinder 230. The distances between the three side clamps 231 and the positioning and placing cylinder 230 are the same. When the three side clamps 231 move toward the direction of the positioning and placing cylinder 230 at the same time, When the wafer is placed in the center of the top of the inner wall of the positioning and placing cylinder 230, the arc-shaped clamping block 232 can clamp the side wall of the wafer at the same time, so that the wafer can be located at the top center of the inner wall of the positioning and placing cylinder 230, thereby playing a role in positioning the wafer. A storage tank is provided inside the positioning and placing cylinder 230 and at a position corresponding to the bottom end of the side clamping plate 231. A fixing seat is fixed to the bottom end of the inner wall of the storage tank. A first electrically-controlled telescopic rod 233 is fixed to the side end of the outer wall of the fixing seat and at a position corresponding to the side clamping plate 231. The output ends of the first electrically-controlled telescopic rods 233 are fixedly connected to the bottom end of the side clamping plate 231. The multiple first electrically-controlled telescopic rods 233 are controlled by a switch, and the first electrically-controlled telescopic rods 233 can drive the side clamps 230 to move. The plate 231 moves forward and backward, so as to fix or loosen the wafer. A first vacuum pump 220 is fixed to the top of the outer wall of the horizontal plate 211 and on one side of the positioning and placing tube 230. A vacuum seat 234 for placing the wafer is arranged at the center of the top of the inner wall of the positioning and placing tube 230. The top suction end of the first vacuum pump 220 is connected with the inner wall of the vacuum seat 234 through a suction pipe. The vacuum seat 234 comprises a hollow box installed at the top of the inner part of the positioning and placing tube 230 and a suction cup arranged at the center of the top of the outer wall of the positioning and placing tube 230. The first vacuum pump 220 can use the suction pipe to extract the air in the vacuum box, so that the suction cup can adsorb and fix the wafer.

[0030] The positioning component also includes a wafer placement cylinder 300, which is arranged above the top of the outer wall of the positioning seat 200. The inner wall of the wafer placement cylinder 300 is provided with a wafer placement groove 310 for the wafer to fall. The opened wafer placement groove 310 is arranged in a manner of being wide at the top and narrow at the bottom, so that the wafer placement groove 310 can make the wafer fall into the center of the top of the outer wall of the positioning placement cylinder 230 to the greatest extent. A fixed cylinder 400 is fixed to the top of the outer wall of the dry etching machine body 100 and is located on one side of the positioning seat 200. The inner wall of the fixed cylinder 400 is rotatably connected with a curved clamping rod 410, and the end of the curved clamping rod 410 away from the fixed cylinder 400 is connected to the wafer placement cylinder 3 00 is fixedly connected to the side end of the outer wall, and a positioning slider 411 is fixed to the side wall of the curved clamp rod 410 and the upper and lower sides of the interior of the fixed cylinder 400. A positioning groove 420 is provided on the inner wall of the fixed cylinder 400 and at a position corresponding to the positioning slider 411. The outer wall of the positioning slider 411 is slidably connected to the inner wall of the positioning groove 420. The angle of the positioning groove 420 is 90 degrees or 180 degrees. When the curved clamp rod 410 is rotated, the rotation position of the wafer placement cylinder 300 can be limited by the setting of the positioning slider 411 and the positioning groove 420, so that the wafer placement cylinder 300 can be just above the positioning placement cylinder 230.

[0031] The use process of the present invention is as follows: first, the personnel can rotate the wafer placement barrel 300 so that the wafer placement barrel 300 rotates to the top of the positioning placement barrel 230, and then the hydraulic telescopic rod 210 pushes the cross plate 211 to move upward, so that the positioning placement barrel 230 can move to the bottom of the wafer placement barrel 300, and then the personnel can put the wafer down from the top of the wafer placement slot 310, so that the wafer can pass through the wafer placement slot 310 and fall into the top center of the positioning placement barrel 230, and then the first electrically controlled telescopic rod 233 is controlled by the switch to shrink at the same time, so that the side clamping plate 231 slides toward the direction of the positioning placement barrel 230, and the arc clamping block 232 can clamp the side wall of the wafer and fix the wafer at the top center of the positioning placement barrel 230, and then the first vacuum pump 220 can evacuate the vacuum seat 234 after being powered on and make the vacuum seat 234 suck the wafer, and then the side clamping plate 231 moves outward to separate from the wafer;

[0032] Then the personnel can rotate the wafer placement cylinder 300 to one side, and then move the second electrically-controlled telescopic rod 520 to above the top of the positioning placement cylinder 230 through the air-controlled slide 510, and then the second electrically-controlled telescopic rod 520 moves downward to make the vacuum suction cup 522 move downward to abut against the wafer, and then the second vacuum pump 523 evacuates the vacuum suction cup 522 to adsorb the wafer, and at the same time the first vacuum pump 220 is turned off to ensure that the vacuum suction cup 522 sucks air into the wafer, and then the air-controlled slide 510 moves the wafer to the wafer processing placement seat of the dry etching machine main body 100, and then the dry etching machine main body 100 etches the wafer.

[0033] The above is only a preferred embodiment of the present invention. Any person skilled in the art may modify the present invention by using the above technical solution or modify it into an equivalent technical solution. Therefore, any simple modification or equivalent replacement made according to the technical solution of the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A wafer positioning device for a dry etching machine, comprising a dry etching machine body (100), a gantry (500) is placed on the top of the outer wall of the workbench of the dry etching machine body (100), and a moving component for moving the wafer is installed on the top of the inner wall of the gantry (500), characterized in that: The workbench of the dry etching machine body (100) is located below the gantry (500) and is provided with a positioning seat (200), wherein a positioning component for positioning a wafer is arranged in the positioning seat (200).

2. The wafer positioning device for a dry etching machine according to claim 1, characterized in that: The positioning component comprises a transverse plate (211), wherein the transverse plate (211) is slidably connected to the upper end of the inner wall of the positioning seat (200), and a hydraulic telescopic rod (210) is fixed to the lower end of the inner wall of the positioning seat (200) and below the transverse plate (211), and the top output end of the hydraulic telescopic rod (210) is connected to the lower end of the outer wall of the transverse plate (211).

3. The wafer positioning device for a dry etching machine according to claim 2, characterized in that: A positioning and placing cylinder (230) is fixed at the center of the top end of the outer wall of the horizontal plate (211), and side clamps (231) are arranged at the side ends of the outer wall of the positioning and placing cylinder (230). The three side clamps (231) are evenly arranged in a strip array. An arc-shaped clamping block (232) is fixed to the outer wall of the side clamping plate (231) and on one side close to the positioning and placing cylinder (230), and the bottom end of the outer wall of the arc-shaped clamping block (232) is arranged above the top end of the outer wall of the positioning and placing cylinder (230).

4. The wafer positioning device for a dry etching machine according to claim 3, characterized in that: A storage tank is provided inside the positioning and placing cylinder (230) and at a position corresponding to the bottom end of the side clamping plate (231); a fixing seat is fixed to the bottom end of the inner wall of the storage tank; a first electrically controlled telescopic rod (233) is fixed to the side end of the outer wall of the fixing seat and at a position corresponding to the side clamping plate (231); and an output end of the first electrically controlled telescopic rod (233) is fixedly connected to the bottom end of the side clamping plate (231).

5. The wafer positioning device for a dry etching machine according to claim 3, characterized in that: A first vacuum pump (220) is fixed at the top of the outer wall of the horizontal plate (211) and located on one side of the positioning and placement tube (230); a vacuum seat (234) for placing wafers is provided at the center of the top of the inner wall of the positioning and placement tube (230); the top suction end of the first vacuum pump (220) is connected to the inner wall of the vacuum seat (234) through a suction pipe.

6. The wafer positioning device for a dry etching machine according to claim 2, characterized in that: The positioning component also includes a wafer placement barrel (300), which is arranged above the top of the outer wall of the positioning seat (200), and the inner wall of the wafer placement barrel (300) is provided with a wafer placement groove (310) for the wafer to fall, and a fixing barrel (400) is fixed at the top of the outer wall of the dry etching machine body (100) and located on one side of the positioning seat (200).

7. The wafer positioning device for a dry etching machine according to claim 6, characterized in that: The inner wall of the fixed cylinder (400) is rotatably connected to a curved clamping rod (410), and one end of the curved clamping rod (410) away from the fixed cylinder (400) is fixedly connected to the side end of the outer wall of the wafer placement cylinder (300), and positioning sliders (411) are fixed to the side walls of the curved clamping rod (410) and located on the upper and lower sides of the interior of the fixed cylinder (400).

8. The wafer positioning device for a dry etching machine according to claim 7, characterized in that: The inner wall of the fixed cylinder (400) and the corresponding position of the positioning slide block (411) are provided with a positioning slide groove (420), the outer wall of the positioning slide block (411) is slidably connected to the inner wall of the positioning slide groove (420), and the angle of the positioning slide groove (420) is 90 degrees or 180 degrees.

9. The wafer positioning device for a dry etching machine according to claim 3, characterized in that: The moving component comprises an air-controlled slide (510), wherein the air-controlled slide (510) is fixed to the top end of the inner wall of the gantry (500), a second electrically-controlled telescopic rod (520) is installed at the bottom end of the outer wall of the air-controlled slide (510), and a fixing plate (521) is fixed to the bottom output end of the second electrically-controlled telescopic rod (520).

10. The wafer positioning device for a dry etching machine according to claim 9, characterized in that: A vacuum suction cup (522) is fixedly installed at the bottom end of the outer wall of the fixing plate (521) and at a position corresponding to the positioning and placing tube (230), and a second vacuum pump (523) is fixed to one side of the top end of the outer wall of the fixing plate (521), and the suction end of the second vacuum pump (523) is connected to the vacuum suction cup (522) through a suction pipe.

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