Wafer alignment device

Abstract

The invention discloses a wafer alignment device which comprises the components of a bearing member which comprises a sucking disc part and a bearing main body, the bearing main body is provided with a central air channel and an air guide shunting groove which are communicated with each other, the air guide shunting groove is positioned at one end, deviating from the sucking disc part, of the bearing main body, and the sucking disc part is provided with a vacuum adsorption area which is used for adsorbing a wafer; the driving alignment assembly is used for driving the suction cup part to be aligned with the circle center of the wafer; the rotating shaft is rotationally connected into the mounting hole, the rotating shaft is fixedly connected with the bottom of the suction cup part, a plurality of branch air channels are formed in the rotating shaft in the height direction, the branch air channels are evenly distributed in the rotating shaft in the circumferential direction, and an annular air channel is formed in the rotating shaft in the circumferential direction; the movable sealing piece is arranged on the outer surface of the rotating shaft in a relatively rotating and sleeving mode and forms a first movable sealing ring face and a second movable sealing ring face. By adopting the scheme, the phenomenon of chip falling caused by unstable negative pressure due to air pressure leakage is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer conveying equipment, and in particular to a wafer alignment device. Background Art

[0002] In the field of semiconductor wafer manufacturing, precise positioning of wafers is the core prerequisite for ensuring the yield of key processes such as lithography and etching. The outer edge of the wafer is usually designed with a V-shaped notch or a flat edge as a positioning mark to identify the direction of the wafer and the reference position of the chip array. When the robotic arm transfers the wafer from the wafer boat box to the processing stage, it is necessary to rotate the wafer to coincide with the center of the stage, and correct its azimuth angle to meet the micron-level positioning requirements of subsequent processes. This process places strict requirements on the motion accuracy, stability and reliability of the equipment. Any slight position deviation or unexpected displacement may cause chain process defects.

[0003] The current mainstream wafer centering device uses a rotating adsorption stage structure, which fixes the wafer through vacuum adsorption and drives it to rotate to achieve alignment. However, the gas supply system of this structure has inherent defects: when the stage rotates at high speed, the dynamic uniformity of the adsorption force is easily affected by its internal gas supply or negative pressure airflow path design defects, resulting in fluctuations in the adsorption force of local areas of the wafer, which in turn causes micron-level deviations. In addition, the existing wafer centering device is the part that supplies air to the rotating adsorption stage, and its sealing is poor, which leads to air leakage and also affects the adsorption force on the wafer.

[0004] Therefore, it is necessary to provide a wafer alignment device to solve the above problems existing in the prior art. Summary of the invention

[0005] The object of the present invention is to provide a wafer alignment device, which is used to improve the adsorption stability of the wafer during the centering process and avoid wafer falling and wafer deviation.

[0006] To achieve the above object, the technical solution of the present invention is as follows: A wafer alignment device, comprising: The supporting member comprises a suction cup part and a supporting body, wherein the supporting body is provided with a central air passage and an air guide diversion groove which are connected to each other, wherein the air guide diversion groove is located at one end of the supporting body away from the suction cup part, and the suction cup part has a vacuum adsorption area for adsorbing the wafer; A driving alignment component, used for driving the suction cup portion to align with the center of the wafer, comprises a lifting plate, wherein a mounting hole is provided in the lifting plate; A rotating shaft, rotatably connected in the mounting hole, the rotating shaft is fixedly connected to the bottom of the suction cup portion, the rotating shaft is provided with a plurality of branch air passages along the height direction, the branch air passages are uniformly distributed inside the rotating shaft along the circumferential direction, and the rotating shaft is provided with an annular air passage along the circumferential direction; A dynamic seal is relatively rotatably sleeved on the outer surface of the rotating shaft and forms a first dynamic seal ring surface and a second dynamic seal ring surface; Among them, one end of the multiple branch airways is connected to the air guide diversion groove, and the other end is connected to the annular airway. The annular airway is used to communicate with the outside. The first dynamic sealing ring surface and the second dynamic sealing ring surface are respectively arranged on the axial upper and lower sides of the annular airway to form a sealed isolation for the annular airway.

[0007] The beneficial effects of a wafer alignment device provided by the present invention are: utilizing the design of a central airway, multi-branch airways and annular airways to solve the problems of uneven gas distribution and response hysteresis in the traditional single airway system through diversion and pressure equalization, structural reinforcement and dynamic response optimization, and can significantly improve the process stability of precision manufacturing equipment; and the first dynamic sealing ring surface and the second dynamic sealing ring surface formed by the dynamic seal and the outer surface of the rotating shaft further seal and protect the annular airway to avoid air pressure leakage that causes negative pressure instability and wafer falling.

[0008] Furthermore, the supporting body is provided with a groove, one end of the rotating shaft is provided with a boss, the boss is inserted into the groove, and a sealing ring is provided on the outer sleeve of the boss.

[0009] Furthermore, the air guiding diversion groove includes a plurality of guiding areas radially distributed at equal angles along the circumferential direction, and the plurality of guiding areas respectively correspond to and connect with the plurality of branch airways.

[0010] Further, the lifting plate is provided with a first annular groove and a second annular groove along the axial direction of the mounting hole, and the dynamic seal includes a first ring and a second ring, the first ring and the second ring are respectively arranged in the first annular groove and the second annular groove, the first ring and the second ring each include an integrally formed inner ring sealing portion and an outer ring retaining portion, the outer ring retaining portion is arranged in the first annular groove and the second annular groove, and the inner ring sealing portion covers the outer wall of the rotating shaft and forms a first dynamic sealing ring surface and a second dynamic sealing ring surface.

[0011] Furthermore, the lifting plate has an airway wall, which is located between the first annular groove and the second annular groove and is used to block the annular airway. An air hole is opened on the airway wall and passes through the outer wall of the lifting plate. An air pipe joint is installed on the air hole.

[0012] Furthermore, a vertical projection of the branch airway along the height direction at least partially overlaps with the annular airway, and a terminal tube wall of the branch airway is an exposed portion, and the exposed portion is concave toward and exposed to the annular airway.

[0013] Further, including: The housing comprises a top plate, a strip window is provided in the middle of the top plate, and the supporting member is arranged in the strip window; An optical detection module, used for detecting the position of the wafer on the suction cup portion; A rotating member, fixedly connected to the bottom of the rotating shaft, and used to drive the rotating shaft to rotate around its own axis; An X-axis translation member connected to the rotation support member and used to drive the rotation support member to move along the length direction of the strip-shaped window; The Z-axis lifting component is connected to the rotating supporting component and is used to drive the supporting component to rise and fall along the Z-axis.

[0014] Further, the optical detection module includes a through-beam sensor arranged vertically along the Z axis, and the through-beam sensor emits a laser beam along the Z axis direction and forms a vertical detection plane; When the wafer is placed on the suction cup part, the edge of the wafer blocks part of the laser beam. At this time, the through-beam sensor can detect the coordinate point of the wafer edge on the suction cup part in a non-contact manner.

[0015] Furthermore, the X-axis translation member comprises: A translation block is located in the housing and connected to the lifting plate, wherein a first screw nut is provided in the translation block; A translation screw rod, threadably matched with the first screw rod nut along the X-axis direction; The first guide rod is arranged inside the translation block and is fixedly connected to the inner wall of the shell along the X-axis direction.

[0016] Furthermore, the rotating member includes: a first motor having an output shaft, and the output shaft is coaxially arranged and fixedly connected to the rotating shaft.

[0017] Furthermore, the Z-axis lifting member comprises: a second motor, mounted in the housing; A second guide rod, one end of which is fixedly connected to the bottom of the lifting plate, and the other end of which is slidably arranged through the translation block; A lifting screw is fixedly connected to the output shaft of the second motor, a second screw nut is arranged in the lifting plate, and the lifting screw is threadably matched with the second screw nut; The translation block is provided with a sinking groove, and a sinking platform is provided at the bottom of the lifting plate, and the sinking platform is plugged and matched with the sinking groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of a wafer alignment device according to an embodiment of the present invention; Figure 2 This is a diagram of the internal structure of a wafer alignment device according to an embodiment of the present invention; Figure 3 An exploded view of a supporting member according to an embodiment of the present invention; Figure 4 It is a structural schematic diagram of a rotating shaft according to an embodiment of the present invention; Figure 5 is a cross-sectional view of a rotating shaft and a lifting plate according to an embodiment of the present invention; Figure 6 This is a schematic structural diagram of a dynamic seal according to an embodiment of the present invention; Figure 7 is a cross-sectional view of a dynamic seal according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of the lifting plate according to an embodiment of the present invention; Fig. 9 This is a schematic diagram of the structure of a lifting member according to an embodiment of the present invention; Fig.10 This is a schematic diagram of the structure of an X-axis translation member according to an embodiment of the present invention; Fig.11 Schematic diagram of the structure of the translation block according to an embodiment of the present invention.

[0019] Reference numerals: 100, supporting member; 101, suction cup portion; 102, supporting body; 103, central airway; 104, air guide diversion groove; 200, rotating shaft; 201, branch airway; 202, annular airway; 203, boss; 204, exposed portion; 205, sealing ring; 300, dynamic sealing member; 301, first ring; 302, second ring; 303, inner ring sealing portion; 304, outer ring retaining portion; 400, lifting plate; 401, airway wall; 4 02, air pipe joint; 403, air hole; 500, shell; 510, strip window; 520, through-beam sensor; 530, X-axis translation member; 531, translation block; 532, translation screw; 533, first guide rod; 534, third motor; 535, X-axis guide mounting plate; 540, Z-axis lifting member; 541, second motor; 542, second guide rod; 543, lifting screw; 544, sinking groove; 550, rotating member; 551, first motor. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0021] The following is combined with Figure 1 - Attachment Fig.11 , the specific implementation modes of the present invention are further described in detail.

[0022] Reference Figure 1-Figure 5 A wafer alignment device includes a supporting member 100, a driving alignment assembly, a rotating shaft 200 and a dynamic seal 300.

[0023] Reference Figure 3-Figure 5 The supporting member 100 includes a coaxially arranged suction cup portion 101 and a supporting body 102. The supporting body 102 is provided with a central air channel 103 and a gas diversion groove 104 which are interconnected. The gas diversion groove 104 is located at the end of the supporting body 102 away from the suction cup portion 101. The upper surface of the suction cup portion 101 has a vacuum adsorption area for adsorbing wafers, and the central air channel 103 is interconnected with the vacuum adsorption area. In some specific embodiments of the present invention, the suction cup portion 101 is columnar, and a vacuum adsorption array which is concentric with the suction cup portion 101 and evenly distributed circumferentially is provided on the vacuum adsorption area of ​​the upper table.

[0024] The driving alignment assembly is used to drive the suction cup part 101 to align with the center of the wafer and includes a lifting plate 400, and a mounting hole is opened in the lifting plate 400. In some specific embodiments of the present invention, the rotating shaft 200 is rotatably connected in the mounting hole, the rotating shaft 200 is fixedly connected to the bottom of the suction cup part 101, and the rotating shaft 200 is provided with a plurality of branch air passages 201 along the height direction, and the branch air passages 201 are uniformly distributed inside the rotating shaft 200 along the circumferential direction, and the rotating shaft 200 is provided with an annular air passage 202 along the circumferential direction.

[0025] Reference Figure 3 and Figure 4In some specific embodiments, the central airway 103 and the branch airway 201 are in the shape of holes, and the aperture of the central airway 103 is larger than the aperture of the branch airway 201. One end of the multiple branch airways 201 is connected to the gas guide diversion groove 104, and the other end is connected to the annular airway 202, and the annular airway 202 is used to communicate with the outside. The design of the central airway 103, the multiple branch airways 201 and the annular airway 202 solves the problems of uneven gas distribution and delayed response of the traditional single airway system through diversion and pressure equalization, structural reinforcement, and dynamic response optimization, which can significantly improve the process stability of precision manufacturing equipment; Reference Figure 5-Figure 7 The dynamic seal 300 is relatively rotatably sleeved on the outer surface of the rotating shaft 200 and forms a first dynamic seal ring surface and a second dynamic seal ring surface. The first dynamic seal ring surface and the second dynamic seal ring surface are respectively arranged on the upper and lower sides of the annular airway 202 in the axial direction to form a seal isolation for the annular airway 202. The first dynamic seal ring surface and the second dynamic seal ring surface formed by the dynamic seal 300 and the outer surface of the rotating shaft 200 further seal and protect the annular airway 202 to avoid the phenomenon of air pressure leakage causing negative pressure instability and chip falling.

[0026] Reference Figure 8 In some specific embodiments of the present invention, the lifting plate 400 is provided with a first annular groove and a second annular groove along the axial direction of the mounting hole of the rotating shaft 200, and the dynamic seal 300 includes a first ring 301 and a second ring 302, which are respectively arranged in the first annular groove and the second annular groove, and the first ring 301 and the second ring 302 include an integrally formed inner ring sealing portion 303 and an outer ring retaining portion 304, and the outer ring retaining portion 304 is fixedly arranged in the first annular groove and the second annular groove, and the inner ring sealing portion 303 is covered on the outer wall of the rotating shaft 200 and forms a first dynamic sealing ring surface and a second dynamic sealing ring surface.

[0027] Reference Figure 6 and Figure 7 Specifically, the outer ring retaining portion 304 adopts a spherical cross-section annular structure, which is elastic and has a curved surface profile fixedly connected to the contact surface of the first annular groove and the second annular groove. A clearance margin is formed between the outer ring retaining portion 304 and the inner ring sealing portion 303. The outer ring retaining portion 304 and the inner ring sealing portion 303 are integrally injection molded with a flexible sealing material, and their inner diameters form an interference fit with the outer wall of the rotating shaft 200, and the rotating shaft 200 is tightly covered by radial elastic deformation to form a double dynamic sealing interface. With the above technical solution, the first sealing ring and the second sealing ring are integrated into the first annular groove and the second annular groove, which further improves the sealing effect while saving installation space.

[0028] Reference Figure 3In some embodiments of the present invention, the supporting body 102 is provided with a groove, one end of the rotating shaft 200 is provided with a boss 203, the boss 203 is inserted into the groove, and a sealing ring 205 is provided on the outer cover of the boss 203. By connecting the rotating shaft 200 and the supporting body 102, plugging in the boss 203 and sealing with the sealing ring 205, the sealing effect is better than the traditional connection method. Specifically, the end face of the boss 203 fits tightly with the bottom surface of the groove, and the elastic deformation of the sealing ring 205 fills the microscopic gap. Compared with the traditional plane flange connection that only relies on axial compression and is prone to sealing failure due to vibration, the sealing effect of this embodiment is better.

[0029] Reference Figure 3 In some embodiments of the present invention, the air guide diversion groove 104 includes a plurality of guide areas radially distributed at equal angles along the circumference, and the plurality of guide areas correspond to and connect a plurality of branch airways 201. The air guide diversion groove 104 is designed as a plurality of radially distributed guide areas, and each guide area directly corresponds to a branch airway 201. This structure allows the airflow to be more evenly distributed to each branch airway 201, avoiding the problem of pressure imbalance caused by the different lengths of the airflow paths in the traditional design.

[0030] Reference Figure 3 In some embodiments of the present invention, the air guide diversion groove 104 has three guide areas, and the branch air channel 201 has three, and the air guide diversion areas are strip-shaped and interconnected. Specifically, the air guide diversion groove 104 adopts a three-leaf flow channel design, including three radial guide areas equally distributed at 120° circumferentially. Each guide area is a tapered streamlined channel, and its extension direction forms a continuous airflow guide angle with the axis of the corresponding branch air channel 201. At the same time, the radial layout shortens the airflow transmission distance, making the reaction faster during vacuuming or gas supply, and the wafer adsorption more stable. The precise correspondence between the guide area and the branch air channel 201 also reduces the chaotic airflow, making the wafer adsorption more uniform and reliable, which is especially suitable for semiconductor manufacturing scenarios that require fast and precise alignment.

[0031] Reference Figure 7In some embodiments of the present invention, the lifting plate 400 has an airway wall 401, and the airway wall 401 is located between the first annular groove and the second annular groove. The airway wall 401 is provided with an air hole 403 that penetrates to the outer wall of the lifting plate 400, and an air pipe joint 402 is installed on the air hole 403. The airway wall 401 adopts a stepped sealing structure, which is axially arranged between the first annular groove and the second annular groove to form a closed side wall of the annular airway 202. The airway wall 401 is radially penetrated by a stepped air hole 403 channel, the inner end of which is connected to the annular airway 202, and the outer end extends to the outer peripheral surface of the lifting plate 400 and integrates a quick-connect air pipe interface. This structure realizes the shortest path connection of the air path while ensuring the independent operation of the dynamic seal through the orthogonal layout of the axial sealing surface and the radial air path.

[0032] Reference Figure 3 In some embodiments of the present invention, the vertical projection of the branch airway 201 along the height direction at least partially overlaps with the annular airway 202, and the terminal tube wall of the branch airway 201 is an exposed portion 204, and the exposed portion 204 is concave and exposed to the annular airway 202. Specifically, by adopting the above technical solution, the vertical projection of the branch airway at least partially overlaps with the annular airway 202, thereby expanding the volume of the annular gas buffer chamber and increasing the negative pressure buffer time at the sealing point.

[0033] Reference Figure 2 In some embodiments of the present invention, the wafer alignment device further includes a housing 500, an optical detection module, a rotating member 550, an X-axis translation member 530, and a Z-axis lifting member 540. The housing 500 includes a top plate, a side cover, and a base. A strip window 510 is provided in the middle of the top plate, and the supporting member 100 is disposed in the strip window 510. The optical detection module is used to detect the position of the wafer located on the suction cup portion 101. In some specific embodiments, the optical detection module includes a through-beam sensor 520 arranged vertically along the Z axis, and the through-beam sensor 520 is mounted on the top plate through a bracket. The through-beam sensor 520 emits a laser beam along the Z axis direction and forms a vertical detection plane; the through-beam sensor 520 includes a transmitting sensor and a receiving sensor, which are respectively mounted at the upper and lower ends of the bracket, and a sensor cover is provided on the outer periphery of the through-beam sensor 520 located at the upper end. When the wafer is placed on the suction cup part 101, the edge of the wafer blocks part of the laser beam, and at this time, the through-beam sensor 520 can detect the coordinate point of the wafer edge on the suction cup part 101 in a non-contact manner. By adopting the above technical solution, the vertical detection plane formed by the optical detection module is used to perform non-contact position detection on the wafer, making the detection more accurate and without causing interference to the wafer.

[0034] Reference Fig. 9In some embodiments of the present invention, the rotating member 550 is fixedly connected to the bottom of the rotating shaft 200, and is used to drive the rotating shaft 200 to rotate around its own axis. In some embodiments, the rotating member 550 includes a first motor 551, and the first motor 551 has an output shaft. The bottom of the rotating shaft 200 is provided with a shaft hole, and the shaft hole is fixedly connected to the output shaft of the first motor 551. The specific connection method can be a key connection, etc., which is not limited here.

[0035] Reference Fig.10 In some embodiments of the present invention, the X-axis translation member 530 is connected to the rotating support member 100 to drive the rotating support member 100 to move along the length direction of the strip window 510. The Z-axis lifting member 540 is connected to the rotating support member 100 to drive the bearing member to rise and fall along the Z axis. By using the rotating member 550 and the strip window 510, the degree of freedom required for the alignment device is reduced, and only the X-axis translation and the Z-axis translation are required to achieve the alignment of the wafer. The X-axis translation member 530 includes an X-axis guide mounting plate 535. Among them, the first screw is driven by the third motor 534.

[0036] Reference Fig.10 and Fig.11 In some embodiments of the present invention, the X-axis translation member 530 has a translation block 531, which is rigidly connected to the lifting plate 400 by bolts, and a first screw nut is integrated inside the translation block 531; the translation screw 532 extends horizontally along the X-axis, and forms a high-precision ball thread match with the first screw nut; the first guide rod 533 passes through the translation block 531 along the X-axis direction, and both ends are fixedly connected to the inner wall of the housing 500 through the X-axis guide mounting plate 535 to form a double-track guide system. A guide sleeve is arranged outside the first guide rod 533. The above structure realizes the linear motion of the translation block 531 along the length direction of the strip window 510 through the synergistic effect of the screw transmission and the guide rod constraint.

[0037] In some embodiments of the present invention, the Z-axis lifting adopts a modular drive design, the second motor 541 is fixed to the bottom of the housing 500 through a mounting frame, and its output shaft is coaxially connected to the lifting screw 543 through a coupling; the second guide rod 542 vertically penetrates the translation block 531, and the upper end is fixed to the bottom of the lifting plate 400 through a locking nut; the second screw nut embedded in the lifting plate 400 and the lifting screw 543 form a two-way threaded transmission pair. In particular, a rectangular sinking groove 544 is machined on the top surface of the translation block 531, and a stepped sinking platform is correspondingly provided at the bottom of the lifting plate 400. The two are axially positioned through a precisely machined plug-in surface, forming a radial anti-deflection constraint during the Z-axis lifting process. This plug-in structure effectively disperses the lateral load during the lifting process while ensuring the motion accuracy.

[0038] The beneficial effect of a wafer alignment device provided by the present invention is that: the design of the central airway 103, the multi-branch airway 201 and the annular airway 202 solves the problems of uneven gas distribution and response hysteresis in the traditional single airway system through diversion and pressure equalization, structural reinforcement, and dynamic response optimization, and can significantly improve the process stability of precision manufacturing equipment; and the first dynamic sealing ring surface and the second dynamic sealing ring surface formed by the dynamic seal 300 and the outer surface of the rotating shaft 200 further seal and protect the annular airway 202 to avoid air pressure leakage that causes negative pressure instability and wafer falling.

[0039] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A wafer alignment device, characterized in that: include: A supporting member (100) comprises a suction cup portion (101) and a supporting body (102), wherein the supporting body (102) is provided with a central air channel (103) and an air guide flow diversion groove (104) which are connected to each other, wherein the air guide flow diversion groove (104) is located at an end of the supporting body (102) away from the suction cup portion (101), and the suction cup portion (101) has a vacuum adsorption area for adsorbing wafers; A driving alignment component, used for driving the suction cup portion (101) to align with the center of a wafer, comprising a lifting plate (400), wherein a mounting hole is provided in the lifting plate (400); A rotating shaft (200) is rotatably connected in the mounting hole, the rotating shaft (200) is fixedly connected to the bottom of the suction cup portion (101), the rotating shaft (200) is provided with a plurality of branch air passages (201) along a height direction, the branch air passages (201) are evenly distributed inside the rotating shaft (200) along a circumferential direction, and the rotating shaft (200) is provided with an annular air passage (202) along a circumferential direction; A dynamic seal (300) is relatively rotatably sleeved on the outer surface of the rotating shaft (200) and forms a first dynamic seal ring surface and a second dynamic seal ring surface; One end of each of the plurality of branch airways (201) is connected to the air guide diversion groove (104), and the other end is connected to the annular airway (202); the annular airway (202) is used to communicate with the outside; the first dynamic sealing ring surface and the second dynamic sealing ring surface are respectively arranged on the upper and lower sides of the annular airway (202) in the axial direction to form a sealed isolation for the annular airway (202).

2. A wafer alignment device according to claim 1, characterized in that: The supporting body (102) is provided with a groove, one end of the rotating shaft (200) is provided with a boss (203), the boss (203) is inserted into the groove, and a sealing ring (205) is provided on the outer cover of the boss (203).

3. The wafer alignment device according to claim 1, characterized in that: The air guiding flow dividing groove (104) comprises a plurality of guiding areas radially distributed at equal angles along the circumference, and the plurality of guiding areas respectively correspond to and are connected to a plurality of branch airways (201).

4. The wafer alignment device according to claim 1, characterized in that: The lifting plate (400) is provided with a first annular groove and a second annular groove along the axial direction of the mounting hole. The dynamic seal (300) comprises a first ring (301) and a second ring (302). The first ring (301) and the second ring (302) are respectively arranged in the first annular groove and the second annular groove. The first ring (301) and the second ring (302) both comprise an inner ring sealing portion (303) and an outer ring retaining portion (304) formed integrally. The outer ring retaining portion (304) is arranged in the first annular groove and the second annular groove. The inner ring sealing portion (303) covers the outer wall of the rotating shaft (200) and forms a first dynamic sealing annular surface and a second dynamic sealing annular surface.

5. The wafer alignment device according to claim 4, characterized in that: The lifting plate (400) has an airway wall (401), the airway wall (401) being located between the first annular groove and the second annular groove and used for sealing the annular airway (202), the airway wall (401) being provided with an air hole (403) penetrating to the outer wall of the lifting plate (400), and an air pipe joint (402) being installed on the air hole (403).

6. The wafer alignment device according to claim 1, characterized in that: The vertical projection of the branch airway (201) along the height direction at least partially overlaps with the annular airway (202); the terminal tube wall of the branch airway (201) is an exposed portion (204); and the exposed portion (204) is concave toward and exposed to the annular airway (202).

7. The wafer alignment device according to claim 1, characterized in that: include: The housing (500) comprises a top plate, a strip-shaped window (510) is provided in the middle of the top plate, and the supporting member (100) is arranged in the strip-shaped window (510); An optical detection module, used for detecting the position of a wafer located on the suction cup portion (101); A rotating member (550) is fixedly connected to the bottom of the rotating shaft (200) and is used to drive the rotating shaft (200) to rotate around its own axis; An X-axis translation member (530) connected to the rotation support member (100) and used for driving the rotation support member (100) to move along the length direction of the strip-shaped window (510); A Z-axis lifting component (540) is connected to the rotating support component (100) and is used to drive the support component to rise and fall along the Z-axis.

8. The wafer alignment device according to claim 7, characterized in that: The optical detection module comprises a beam sensor (520) arranged vertically along the Z axis, wherein the beam sensor (520) emits a laser beam along the Z axis direction and forms a vertical detection plane; When a wafer is placed on the suction cup portion (101), the edge of the wafer blocks part of the laser beam, and at this time the incident sensor (520) can detect the coordinate point of the wafer edge on the suction cup portion (101) in a non-contact manner.

9. The wafer alignment device according to claim 7, characterized in that: The X-axis translation member (530) comprises: A translation block (531) is located in the housing (500) and connected to the lifting plate (400), wherein a first screw nut is provided in the translation block (531); A translation screw (532) threadably engaged with the first screw nut along the X-axis direction; The first guide rod (533) is inserted into the interior of the translation block (531) and is fixedly connected to the inner wall of the housing (500) along the X-axis direction.

10. The wafer alignment device according to claim 9, characterized in that: The rotating member (550) comprises: a first motor (551) having an output shaft, the output shaft being coaxially arranged and fixedly connected to the rotating shaft (200).

11. The wafer alignment device according to claim 9, characterized in that: The Z-axis lifting member (540) comprises: A second motor (541) is installed in the housing (500); A second guide rod (542), one end of which is fixedly connected to the bottom of the lifting plate (400), and the other end of which is slidably inserted through the translation block (531); A lifting screw (543) is fixedly connected to the output shaft of the second motor (541); a second screw nut is provided in the lifting plate (400); and the lifting screw (543) is threadably matched with the second screw nut; The translation block (531) is provided with a sinking groove (544), and the bottom of the lifting plate (400) is provided with a sinking platform, and the sinking platform is plugged into and matched with the sinking groove (544).

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