Large-warpage wafer adsorption device

Abstract

The invention discloses a large warpage wafer adsorption device which comprises a base, a fixed seat and an adsorption platform, the fixed seat is connected with the base and the adsorption platform, the large warpage wafer adsorption device further comprises a self-adaptive sealing pipe, a lifting assembly and a wafer traction mechanism, the self-adaptive sealing pipe is arranged on the adsorption platform, the lifting assembly is arranged on the base, and the wafer traction mechanism is arranged on the lifting assembly. The wafer traction mechanism is connected with the lifting assembly through the traction mechanism installation frame, the wafer traction mechanism can be controlled to ascend and descend under the action of the lifting assembly, the descended wafer is attached to the self-adaptive sealing pipe, and the self-adaptive sealing pipe automatically adapts to warping of the surface of the wafer. The device has the advantages that the wafer traction mechanism is driven by the lifting assembly which is simple in structure and small in size to move up and down, the wafer traction mechanism pulls the wafer to move up and down, when the wafer moves downwards, the self-adaptive sealing pipe automatically adapts to warping of the wafer, and the self-adaptive sealing pipe and the vacuum adsorption cavity in the adsorption platform form a negative pressure cavity with good sealing performance; the position of the wafer is fixed through negative pressure, and the device is simple in overall structure, low in use cost and suitable for fixing the large-warping wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a large-warp wafer adsorption device. Background Art

[0002] In semiconductor processing equipment, a device for supporting and adsorbing wafers is a key device. In the existing technology, general adsorption devices can only adsorb flat wafers without warping.

[0003] With the upgrading of technology, the wafer processing technology becomes more and more complicated, and the wafer is subjected to more and more processes, which will cause the wafer to warp or deform to a certain extent. This phenomenon is becoming more and more common in semiconductor processing, and the demand for devices that can absorb warped wafers is becoming more and more urgent.

[0004] The existing adsorption device can generally handle wafers with a warpage of several hundred microns. When the warpage is close to 1 mm, the existing adsorption device is difficult to adsorb wafers with a warpage of about 1 mm, and its applicability is poor.

[0005] Some existing companies have made some efforts to absorb warped wafers, but the wafer absorption devices they have prepared are large in size, not simple enough, and have a complex structure and high cost of use.

[0006] Therefore, there is a need for a wafer adsorption device that can solve the problem of adsorption of warped wafers with a warpage of less than 3 mm, and also has a simple structure, is easy to implement and assemble, has a small space and low cost.

[0007] The publication number is CN116313980A, and the name is: Wafer adsorption device. It is a Chinese patent application. The application records a wafer suction cup for adsorbing wafers. More than two adsorption areas are arranged on the adsorption surface of the wafer suction cup, and the adsorption areas are separated by sealing rings; the adsorption areas can generate negative pressure to achieve zoned adsorption of the wafer.

[0008] The application of the wafer adsorption device is mainly to process the adsorption surface of the wafer suction cup into a form with multiple independent adsorption areas, and to control the wafer adsorption process by controlling different adsorption areas, thereby realizing the adsorption of the warped wafer. The application can structurally realize the adsorption of the warped wafer, but the overall structure of the technical solution of the application is relatively complex, the assembly difficulty is high, the volume is large, and the use cost is high. Summary of the invention

[0009] The technical problem to be solved by the present invention is that the existing wafer adsorption device mentioned in the background technology is difficult to apply to wafers with large warping, and the existing wafer adsorption device has a complex structure, is difficult to implement and assemble, has a large space volume and high cost.

[0010] In view of the above technical problems, a large warp wafer adsorption device is proposed; it is achieved by the following technical scheme: a large warp wafer adsorption device, including a base, a fixed seat and an adsorption platform, the fixed seat is arranged between the base and the adsorption platform, connecting the base and the adsorption platform, and is characterized in that it also includes an adaptive sealing tube, a lifting assembly and a wafer traction mechanism, the adaptive sealing tube is arranged on the adsorption platform, the lifting assembly is arranged on the base, and the wafer traction mechanism for pulling the wafer to move is connected to the lifting assembly through a traction mechanism mounting frame, and the wafer traction mechanism can be controllably lifted and lowered under the action of the lifting assembly, and the surface of the wafer after descending is in contact with the adaptive sealing tube, and forms a cavity for adsorbing the wafer with the adsorption platform, and the adaptive sealing tube automatically adapts to the warped wafer and adsorbs it flat.

[0011] Preferably, the adsorption platform comprises a vacuum adsorption chamber and a sealing tube placement groove. The vacuum adsorption chamber is concavely opened on the surface of the adsorption platform. The sealing tube placement groove for adaptively installing the sealing tube is concavely arranged on the surface of the adsorption platform. There is a gap between the sealing tube placement groove and the vacuum adsorption chamber. The arrangement of the vacuum adsorption chamber facilitates the formation of a pressure chamber for negative pressure adsorption of the wafer under negative pressure, thereby facilitating the fixation of the wafer.

[0012] Preferably, a microporous ceramic plate is provided in the vacuum adsorption chamber. The microporous ceramic plate is placed in the vacuum adsorption chamber. The surface of the microporous ceramic plate is flush with the surface of the adsorption platform. The setting of the microporous ceramic plate facilitates bonding with the surface of the wafer to prevent damage to the wafer due to negative pressure attraction and warping problems.

[0013] Preferably, the adaptive sealing tube comprises a tube body and a fixed end of the tube body, the fixed end of the tube body is connected to the tube body, and the tube body is connected to the adsorption platform through the fixed end of the tube body. The setting of the adaptive sealing tube enables the adaptive sealing tube itself to automatically adapt to the warping shape of the wafer, thereby ensuring the sealing performance during negative pressure suction, facilitating the adsorption and fixation of the wafer, having a simple structure and high practicality.

[0014] Preferably, the tube body is made of flexible rubber and the interior of the tube body is hollow. Such a setting facilitates the adaptive sealing tube to automatically adapt to the warping of the wafer, ensures the sealing of the vacuum adsorption chamber during negative pressure suction, facilitates the adsorption and fixation of the wafer, has a simple structure and high practicality.

[0015] Preferably, the lifting assembly includes a telescopic cylinder and a lifting push rod, one end of the lifting push rod is connected to the traction mechanism mounting frame, the telescopic cylinder is arranged on the base, a wedge-shaped guide block is arranged on the telescopic cylinder, the wedge-shaped guide block is slidably matched with the other end of the lifting push rod, and the lifting push rod is lifted and lowered under the action of the wedge-shaped guide block. The arrangement of the lifting assembly is convenient for driving the wafer traction mechanism to move, convenient for pulling the wafer to fit onto the adsorption platform, and convenient for fixing the wafer. The structure is simple, the operation is convenient, and the use cost is low.

[0016] Preferably, the traction mechanism mounting frame includes a fixed frame and a movable frame, the fixed frame is arranged on the adsorption platform, and the movable frame is placed in the fixed frame, the movable frame is connected to the lifting push rod in the lifting assembly, and the movable frame can be controlled to rise and fall in the fixed frame under the action of the lifting push rod. The setting of the traction mechanism mounting frame is convenient for fixing the wafer traction mechanism, convenient for controlling the lifting and lowering of the wafer, and easy to use.

[0017] Preferably, a sealing ring is provided at the connection between the mobile frame and the adsorption platform, and a plurality of guide shafts for guiding the lifting of the mobile frame are provided between the fixed frame and the mobile frame. The setting of the guide shafts facilitates the stable movement of the mobile frame up and down.

[0018] Preferably, a reset spring is provided between the fixed frame and the movable frame, and the movable frame is reset under the action of the reset spring. Such a setting facilitates the reset of the movable frame by the reset spring, and has a simple structure and is easy to use.

[0019] Preferably, the wafer traction mechanism includes a traction rod, one end of which is connected to a movable frame in a traction mechanism mounting frame, and the other end of the traction rod is fixed with a suction cup, through which the traction rod contacts the wafer. This arrangement facilitates movement of the position of the wafer, and also facilitates pulling the wafer to adhere to the adsorption platform, thereby facilitating fixation of the wafer. The structure is simple, the operation is convenient, and the use cost is low.

[0020] Compared with the prior art, the present invention has the following beneficial effects: The technical solution of the present invention utilizes a lifting component with a simple structure and small size to drive the wafer traction mechanism to move up and down, and the wafer is pulled up and down by the wafer traction mechanism. When the wafer moves down, the adaptive sealing tube arranged on the adsorption platform automatically adapts to the warping of the wafer, and a chamber with good sealing performance is formed by the adaptive sealing tube and the vacuum adsorption cavity on the adsorption platform, and then the position of the wafer is fixed by negative pressure suction. The overall structure of the device is simple and the use cost is low, while achieving the adsorption and fixation of wafers with large warping. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional schematic diagram of the present invention Figure 1(Wafer descending adsorption state); Figure 2 A three-dimensional schematic diagram of the present invention Figure 2 (Wafer rises and returns to the state); Figure 3 It is a three-dimensional schematic diagram of the adsorption platform; Figure 4 It is a three-dimensional schematic diagram of the lifting assembly; Figure 5 It is a three-dimensional schematic diagram of the traction mechanism mounting frame; Figure 6 This is the exploded view of the traction mechanism mounting frame; Figure 7 It is a three-dimensional schematic diagram of the wafer pulling mechanism; Figure 8 It is a partial cross-sectional view of the present invention; Fig. 9 for Figure 8 Enlarged view of point A in the middle; Fig.10 for Figure 8 Enlarged view of point B in the middle; Fig.11 It is an exploded view of the present invention; Explanation of the accompanying drawings: 1-base, 2-fixed seat, 3-adsorption platform, 31-vacuum adsorption chamber, 32-sealing tube placement groove, 33-sealing tube fixing groove, 4-adaptive sealing tube, 41-tube body, 42-tube body fixed end, 5-microporous ceramic plate, 6-lifting assembly, 61-telescopic cylinder, 62-lifting push rod, 63-guide wheel, 64-wedge guide block, 7-traction mechanism mounting frame, 71-fixed frame, 72-movable frame, 73-guide shaft mounting hole, 74-traction rod mounting groove, 75-guide shaft, 76-guide shaft sleeve, 77-reset spring, 8-wafer traction mechanism, 81-traction rod, 82-suction cup, 9-negative pressure suction head. DETAILED DESCRIPTION

[0022] The following will be combined with the attached embodiment of the present invention Figure 1-11 , the technical solutions in the embodiments of the present invention are described in detail.

[0023] Example

[0024] like Figure 1 , 2As shown in Figure 11, a large warpage wafer adsorption device includes a base 1, a fixed base 2, an adsorption platform 3, an adaptive sealing tube 4, a lifting assembly 6, a traction mechanism mounting frame 7 and a wafer traction mechanism 8, wherein the adsorption platform 3 is connected to the base 1 through the fixed base 2, the adaptive sealing tube 4 is installed on the adsorption platform 3, the adaptive sealing tube 4 and the vacuum adsorption chamber 31 on the adsorption platform 3 together constitute a chamber for adsorbing the wafer, the wafer traction mechanism 8 is installed on the adsorption platform 3 through the traction mechanism mounting frame 7, the lifting assembly 6 is connected to the wafer traction mechanism 8, the wafer can be adsorbed through the wafer traction mechanism 8, and then the wafer is pulled up and down, so that the wafer can be stably adsorbed on the adsorption platform 3 through negative pressure.

[0025] The main function of the base 1 is to serve as a carrier for installing the entire wafer adsorption device. The entire device is installed on the working position through the base 1.

[0026] The main function of the fixing base 2 is to connect the adsorption platform 3 and the base 1 . Meanwhile, the fixing base 2 also separates a space for installing the lifting component 6 between the adsorption platform 3 and the base 1 .

[0027] The main function of the adsorption platform 3 is to support the wafer. At the same time, a vacuum adsorption chamber 31 is opened on the adsorption platform 3. The vacuum adsorption chamber 31 generates negative pressure on the adsorption platform 3 by using negative pressure to stably adsorb the wafer on the adsorption platform 3.

[0028] The main function of the adaptive sealing tube 4 is to automatically adapt to the deformed shape of the wafer, ensure the tightness of the fit between the wafer surface and the adsorption platform 3, improve the adsorption effect of the negative pressure on the wafer, so that the wafer can be stably adsorbed on the adsorption platform 3, and improve the stability of the wafer fixed on the adsorption platform 3.

[0029] The main function of the wafer pulling mechanism 8 is to contact the wafer, pull the wafer up or down, and then stably place the wafer on the adsorption platform 3, or lift the wafer to contact the front-end module of the external equipment for subsequent processes.

[0030] The main function of the traction mechanism mounting frame 7 is to install and fix the wafer traction mechanism 8 , so as to facilitate the installation of the wafer traction mechanism 8 on the back side of the adsorption platform 3 .

[0031] The main function of the lifting assembly 6 is to provide power for the wafer pulling mechanism 8 to rise. The lifting assembly 6 can drive the wafer pulling mechanism 8 to move upward.

[0032] like Figure 1 , 3 As shown in FIGS. 8 and 11 , the base 1 is a circular metal plate made of metal, and the lifting assembly 6 is fixed to the middle of the base 1 by screws.

[0033] The fixing seat 2 is a metal seat made of metal with a rectangular cross-section. The fixing seat 2 is fixed to the surface of the base 1 by screws, and in order to improve stability, multiple fixing seats 2 are fixed on the base 1. In this embodiment, three fixing seats 2 are preferably fixed on the base 1, and the three fixing seats 2 are evenly distributed on the base 1.

[0034] The adsorption platform 3 is a circular plate with a certain thickness. In this embodiment, the adsorption platform 3 is preferably made of ceramics. The adsorption platform 3 is connected to the fixing seat 2 by screws.

[0035] Definition: In this embodiment, the base 1 is taken as the basis, and the direction from the base 1 to the adsorption platform 3 is upward, and the opposite direction is downward.

[0036] like Figure 3 , 8 As shown in 9, in order to facilitate the formation of the adsorption cavity and facilitate the adsorption of the wafer by negative pressure, a circular groove is provided on the upper surface of the adsorption platform 3, perpendicular to the surface of the adsorption platform 3, and this groove is named the vacuum adsorption chamber 31. At the same time, a circular through hole connected to the outside is provided in the vacuum adsorption chamber 31, and this through hole is named the negative pressure connection port. The negative pressure suction head 9 is screwed and fixed in the negative pressure connection port, and the negative pressure suction head 9 is located on the lower surface of the adsorption platform 3.

[0037] In order to facilitate the installation of the adaptive sealing tube 4, a circular groove is opened on the surface of the adsorption platform 3, and this groove is named as the sealing tube placement groove 32. The diameter of the sealing tube placement groove 32 is larger than the diameter of the vacuum adsorption chamber 31. At the same time, in order to facilitate the fixation of the adaptive sealing tube 4, a circular groove is also concave on the bottom surface of the sealing tube placement groove 32 and perpendicular to the sealing tube placement groove 32. This groove is named as the sealing tube fixing groove 33. The fixed end on the adaptive sealing tube 4 is fixed in the sealing tube fixing groove 33, and the tube body 41 of the adaptive sealing tube 4 is placed in the sealing tube placement groove 32.

[0038] The adaptive sealing tube 4 is a round tube made of flexible rubber. The adaptive sealing tube 4 includes a tube body 41 and a tube body fixed end 42. The tube body 41 is a hollow tube with a circular cross-section. This arrangement enables the soft and hollow tube body 41 to automatically adapt to the warped shape of the wafer when the warped wafer surface contacts the adaptive sealing tube 4, thereby facilitating the formation of a closed cavity between the wafer, the adaptive sealing tube 4 and the vacuum adsorption chamber 31, and then adsorbing the wafer.

[0039] In order to accommodate wafers with different warping degrees, in this embodiment, the diameter of the tube 41 is preferably 10 mm.

[0040] In order to facilitate the fixation of the adaptive sealing tube 4, a circular tube body fixing end 42 is also fixed on the tube body 41 in the adaptive sealing tube 4. The tube body fixing end 42 is a circular ring as a whole. The cross-sectional size of the tube body fixing end 42 is the same as the cross-sectional size of the sealing tube fixing groove 33. The tube body fixing end 42 can be inserted into the sealing tube fixing groove 33 and fixed by glue.

[0041] The tube body fixed end 42 in the adaptive sealing tube 4 is fixed in the sealing tube fixing groove 33, about one-third of the tube body 41 is located in the sealing tube placement groove 32, and two-thirds of the tube body 41 protrudes from the upper surface of the adsorption platform 3. When the wafer is placed on the adsorption platform 3, it contacts the tube body 41 first.

[0042] When the wafer is adsorbed on the adsorption platform 3 and is adsorbed flat under the action of negative pressure, in order to prevent the wafer from being broken by the action of negative pressure, a circular microporous ceramic plate 5 is also placed in the vacuum adsorption chamber 31. The microporous ceramic plate 5 is a circular plate made of ceramic, and a plurality of micropores are evenly opened on the surface of the microporous ceramic plate 5. The microporous ceramic plate 5 is placed in the vacuum adsorption chamber 31, and the upper surface of the microporous ceramic plate 5 is flush with the upper surface of the adsorption platform 3. In this way, when the negative pressure suction head 9 is used for negative pressure suction, the micropores on the microporous ceramic plate 5 can circulate air, which facilitates the air in the vacuum adsorption chamber 31 to be sucked out to form a negative pressure space.

[0043] Regarding the adsorption process of the wafer: when the wafer is placed on the adsorption platform 3, because the upper end of the tube body 41 of the adaptive sealing tube 4 is higher than the upper surface of the adsorption platform 3, the upper end of the tube body 41 first contacts the wafer surface. When the negative pressure attracts the wafer, the wafer surface squeezes the tube body 41, and the tube body 41 deforms to adapt to the shape of the wafer, and then cooperates with the vacuum adsorption chamber 31 to form a sealed cavity. At this time, the negative pressure is continued to attract, and the surface of the wafer contacts the surface of the microporous ceramic plate 5, which ensures the adsorption effect while preventing the negative pressure from causing deformation and damage to the wafer.

[0044] like Figure 1 , 4 As shown in FIGS. 8 and 11 , the main function of the lifting assembly 6 is to drive the wafer pulling mechanism 8 to move up and down, contact with the wafer, and pull the wafer onto the adsorption platform 3 to facilitate the fixation of the wafer.

[0045] The lifting assembly 6 includes a telescopic cylinder 61 and a lifting push rod 62. In order to reduce the installation space occupied by the telescopic cylinder 61 and promote the miniaturization of the device, the telescopic cylinder 61 is placed flat on the upper surface of the base 1 and fixed with screws. One end of the lifting push rod 62 is connected to the telescopic cylinder 61, and the other end is connected to the wafer traction mechanism 8. The telescopic cylinder 61 can drive the lifting push rod 62 to move up and down, thereby realizing the up and down movement of the wafer traction mechanism 8.

[0046] In order to enable the telescopic cylinder 61 to drive the lifting push rod 62 to move up and down, a connecting mechanism is arranged between the telescopic cylinder 61 and the lifting push rod 62, and the connecting mechanism can be a crank-connecting rod mechanism. In this embodiment, a wedge block with a triangular cross-section is preferably arranged, and this wedge block is named as a wedge guide block 64. The wedge guide block 64 is connected to the telescopic cylinder 61 by screws. When the telescopic cylinder 61 is extended, the wedge guide block 64 moves, driving the lifting push rod 62 matched therewith to move upward.

[0047] The lifting push rod 62 is a circular guide rod. In order to facilitate the lifting of the lifting push rod 62 through the wedge-shaped guide block 64, a circular guide wheel 63 is fixed at the end of the lifting push rod 62 by a pin. The guide wheel 63 can rotate freely along the pin joint, and the guide wheel 63 is in contact with the inclined surface of the wedge-shaped guide block 64. When the wedge-shaped guide block 64 moves, the inclined surface of the wedge-shaped guide block 64 applies pressure to the guide wheel 63, thereby driving the lifting push rod 62 to move upward.

[0048] like Figure 5 , 6 As shown in FIGS. 8 and 11 , in order to facilitate the fixation of the wafer pulling mechanism 8 , a pulling mechanism mounting frame 7 is fixed on the lower surface of the adsorption platform 3 , and the wafer pulling mechanism 8 is connected to the adsorption platform 3 via the pulling mechanism mounting frame 7 .

[0049] The traction mechanism mounting frame 7 includes a fixed frame 71 and a movable frame 72 . The movable frame 72 is placed inside the fixed frame 71 . The fixed frame 71 is fixed on the back side of the adsorption platform 3 .

[0050] The fixing frame 71 is a circular plastic plate, and three rectangular brackets are fixed integrally with the circular plastic plate on the arc-shaped side surface of the circular plastic plate, and the three rectangular brackets are evenly spaced and distributed on the plastic plate.

[0051] A circular mounting hole is provided at the end of the rectangular bracket, and the fixing frame 71 is fixed to the back of the adsorption platform 3 by screws. In order to improve the sealing performance of the contact between the fixing frame 71 and the surface of the adsorption platform 3, a sealing gasket is placed on the end face of the fixing frame 71, and the sealing gasket can improve the sealing performance of the connection.

[0052] In order to facilitate the placement of the movable rack 72 in the fixed rack 71 , a movable rack placement groove is recessed in the upper surface of the fixed rack 71 , and the movable rack 72 is movably placed in the movable rack placement groove.

[0053] The movable frame 72 is made of plastic. The shape of the movable frame 72 is the same as that of the fixed frame 71 , both of which are discs with three brackets fixed on the side. The size of the movable frame 72 is smaller than that of the fixed frame 71 , and the movable frame 72 can be stored in the fixed frame 71 .

[0054] A circular through hole is opened in the middle of the fixed frame 71, and the other end of the lifting push rod 62 away from the guide wheel 63 passes through the circular through hole and is fixedly connected to the moving frame 72. When the lifting push rod 62 is raised or lowered, it can drive the moving frame 72 to rise or fall.

[0055] In order to increase the movement stroke of the mobile frame 72, a groove for the mobile frame 72 to move is also opened at the corresponding position on the back of the adsorption platform 3. This groove is named as a stroke groove. When the mobile frame 72 rises, the upper end of the mobile frame 72 exceeds the upper end of the fixed frame 71 and enters the stroke groove.

[0056] In order to improve the stability of the mobile frame 72 when rising or falling in the fixed frame 71, three circular guide shafts 75 are screwed on the fixed frame 71, and the three guide shafts 75 are evenly distributed in the fixed frame 71. Three circular through holes are opened at corresponding positions on the mobile frame 72, and these through holes are named guide shaft mounting holes 73. A guide shaft sleeve 76 is fixed in each guide shaft mounting hole 73. The guide shaft 75, one end of which is fixed on the fixed frame 71, is inserted into the guide shaft sleeve 76. When the mobile frame 72 moves up and down, it slides along the matching guide shaft 75 and guide shaft sleeve 76, thereby ensuring the stability of the movement.

[0057] In order to facilitate the installation of the traction rod 81 in the wafer traction mechanism 8, three circular grooves are provided on the upper surface of the movable frame 72 perpendicular to the movable frame 72. These grooves are called traction rod installation grooves 74. One end of the traction rod 81 is screwed into the traction rod installation groove 74.

[0058] In order to facilitate the control of the mobile frame 72 to be reset after being lowered from the frame, a reset spring 77 is placed in each traction rod mounting groove 74. The reset spring 77 is sleeved on the outside of the traction rod 81. One end of the reset spring 77 is against the bottom surface of the traction rod mounting groove 74, and the other end is against the back of the adsorption platform 3. When the mobile frame 72 moves upward, the reset spring 77 is compressed.

[0059] like Figure 1 , 7 As shown in Figures 8, 10 and 11, the wafer traction mechanism 8 includes a traction rod 81. The traction rod 81 is a rod with a circular cross-section. A thread is provided at one end of the traction rod 81. The traction rod 81 is screwed into the traction rod mounting groove 74 through the thread.

[0060] In order to facilitate the traction rod 81 to pull the wafer up and down, a circular suction cup 82 is fixed to the other end of the traction rod 81. When the traction rod 81 contacts the wafer, the suction cup 82 contacts the wafer first to adsorb the wafer.

[0061] In order to facilitate the upward movement of the traction rod 81, corresponding clearance holes are opened on the adsorption platform 3 and the microporous ceramic plate 5, and one end of the traction rod 81 with the suction cup 82 passes through the clearance hole and is exposed to the outside.

[0062] The usage process of this embodiment: The falling process, i.e. the wafer adsorption process: After the wafer is positioned and calibrated in the front-end module of the equipment, it enters the process chamber (or detection chamber) from the front-end module of the equipment, and before it falls on the adsorption device, the traction rod 81 and the moving frame 72 are in a raised state, and the return spring 77 is in a compressed state. Then the fingers on the front-end module of the equipment put the wafer on the suction cup 82 on the traction rod 81, and then the fingers of the front-end module of the equipment are separated from the wafer and return to the inside of the front-end module of the equipment. At this time, the suction cup 82 on the traction rod 81 is adsorbed with the wafer, and then the telescopic cylinder 61 is retracted, and the wedge-shaped guide block 64 is released from the lifting push rod 6 2 contact, at this time, the moving frame 72 descends under the action of the reset spring 77, and the traction rod 81 descends with the wafer, and the wafer will first contact the adaptive sealing tube 4, and the traction rod 81 continues to descend. Due to the characteristics of the adaptive sealing tube 4, it will conform to the warping of the wafer and fit with the wafer, automatically adapt to the warping of the wafer, and form a vacuum boundary. At this time, the vacuum is started at the negative pressure suction head 9, and a vacuum area is formed on the lower side of the wafer. Under the action of the atmosphere, the wafer moves downward until it contacts the surface of the adsorption platform 3, and then is firmly adsorbed by the vacuum for the next step of process detection.

[0063] Wafer rising, that is, the wafer returning process: Disconnect the negative pressure suction at the negative pressure suction head 9, and restore the atmospheric pressure in the vacuum adsorption chamber 31 in the adsorption platform 3 below the wafer (the recovery process is the existing technology, and can be completed by injecting air into the vacuum adsorption chamber 31 through the negative pressure suction head 9). At this time, the wafer is no longer adsorbed, and the movement of the telescopic cylinder 61 drives the wedge-shaped guide block 64 to move, and then drives the lifting push rod 62 to move upward. At this time, the traction rod 81 rises and contacts the wafer, and then lifts the wafer to the highest point (this height can be designed as needed, generally about 10mm). At this time, the fingers of the front-end module of the equipment extend under the wafer, and then the fingers move upward, generally move upward about 6mm, to lift the wafer, and then the fingers return to the front-end module of the equipment with the wafer, completing a cycle of the wafer in the inspection chamber.

[0064] Advantages of the present invention: The structure is simple. The technical solution of the present invention utilizes an adaptive sealing tube 4 that can automatically adapt to the warping of the wafer and a vacuum adsorption cavity 31 on the adsorption platform 3 to form an adsorption cavity to complete the adsorption of the warped wafer. The structure is simple and the operability is strong. At the same time, a lifting component 6 that occupies little space is used to control the wafer traction mechanism 8 to drive the wafer to rise and fall. The overall structure is simple, the use cost is low, the space occupied is small, and the assembly is easy.

[0065] The above embodiments are only for illustrating the technical idea of ​​the present invention, and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the present invention.

Claims

1. A large warp wafer adsorption device, comprising a base (1), a fixing base (2) and an adsorption platform (3), wherein the fixing base (2) is arranged between the base (1) and the adsorption platform (3), and connects the base (1) and the adsorption platform (3), characterized in that: It also comprises an adaptive sealing tube (4), a lifting assembly (6) and a wafer pulling mechanism (8), wherein the adaptive sealing tube (4) is arranged on the adsorption platform (3), the lifting assembly (6) is arranged on the base (1), and the wafer pulling mechanism (8) for pulling the wafer to move is connected to the lifting assembly (6) via a pulling mechanism mounting frame (7), and the wafer pulling mechanism (8) can be controlled to rise and fall under the action of the lifting assembly (6), and the surface of the wafer after descending is in contact with the adaptive sealing tube (4), and forms a cavity for adsorbing the wafer with the adsorption platform (3), and the adaptive sealing tube (4) automatically adapts to and fits the warped wafer, and adsorbs and flattens it.

2. The large warpage wafer adsorption device according to claim 1, characterized in that: The adsorption platform (3) comprises a vacuum adsorption chamber (31) and a sealing tube placement groove (32); the vacuum adsorption chamber (31) is concavely provided on the surface of the adsorption platform (3); the sealing tube placement groove (32) for installing the adaptive sealing tube (4) is concavely provided on the surface of the adsorption platform (3); and a gap is provided between the sealing tube placement groove (32) and the vacuum adsorption chamber (31).

3. The large warpage wafer adsorption device according to claim 2, characterized in that: A microporous ceramic plate (5) is arranged in the vacuum adsorption chamber (31); the microporous ceramic plate (5) is placed in the vacuum adsorption chamber (31); and the surface of the microporous ceramic plate (5) is flush with the surface of the adsorption platform (3).

4. The large warpage wafer adsorption device according to claim 1, characterized in that: The adaptive sealing tube (4) comprises a tube body (41) and a tube body fixed end (42); the tube body fixed end (42) is connected to the tube body (41); and the tube body (41) is connected to the adsorption platform (3) via the tube body fixed end (42).

5. The large warpage wafer adsorption device according to claim 4, characterized in that: The tube body (41) is made of flexible rubber, and the interior of the tube body (41) is hollow.

6. The large warpage wafer adsorption device according to claim 1, characterized in that: The lifting assembly (6) comprises a telescopic cylinder (61) and a lifting push rod (62). One end of the lifting push rod (62) is connected to the traction mechanism mounting frame (7). The telescopic cylinder (61) is arranged on the base (1). A wedge-shaped guide block (64) is arranged on the telescopic cylinder (61). The wedge-shaped guide block (64) is slidably matched with the other end of the lifting push rod (62). The lifting push rod (62) is lifted and lowered under the action of the wedge-shaped guide block (64).

7. The large warpage wafer adsorption device according to claim 1, characterized in that: The traction mechanism mounting frame (7) comprises a fixed frame (71) and a movable frame (72); the fixed frame (71) is arranged on the adsorption platform (3); the movable frame (72) is placed in the fixed frame (71); the movable frame (72) is connected to a lifting push rod (62) in the lifting assembly (6); and the movable frame (72) can be controlled to rise and fall in the fixed frame (71) under the action of the lifting push rod (62).

8. The large warpage wafer adsorption device according to claim 7, characterized in that: A sealing ring is provided at the connection between the movable frame (72) and the adsorption platform (3), and a plurality of guide shafts (75) for guiding the movable frame (72) to rise and fall are provided between the fixed frame (71) and the movable frame (72).

9. The large warpage wafer adsorption device according to claim 7, characterized in that: A return spring (77) is provided between the fixed frame (71) and the movable frame (72), and the movable frame (72) is returned to its original position under the action of the return spring (77).

10. The large warpage wafer adsorption device according to claim 1, characterized in that: The wafer traction mechanism (8) comprises a traction rod (81), one end of the traction rod (81) is connected to a moving frame (72) in a traction mechanism mounting frame (7), and a suction cup (82) is fixed to the other end of the traction rod (81), and the traction rod (81) contacts the wafer via the suction cup (82).

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