Packaging structure and manufacturing method thereof

Abstract

The invention discloses a packaging structure and a manufacturing method, and the packaging structure comprises a packaging substrate which comprises a plurality of sub-boards arranged in an array; the packaging edge plate is arranged on the outer edge of the packaging substrate in a surrounding manner; the ink layer is arranged on the packaging edge and the packaging substrate; the face, coated with the ink layer, of the packaging edge plate is provided with a patterned flow guide structure so as to conduct flow guide on ink when the ink is brushed. Through the mode, the uniformity and the flatness of the ink layer can be ensured, so that the packaging structure has the uniformity and the flatness, and the production and processing requirements are met.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit manufacturing, and in particular to a packaging structure and a manufacturing method thereof. Background Art

[0002] During the production process of the packaging structure, a printing ink layer is required to protect the metal layer from oxidation and corrosion, and to avoid short circuits between wires when subsequent welding components are packaged.

[0003] The printing ink layer is usually printed by screen printing, and a squeegee is used to apply directional pressure to the ink portion on the screen printing plate, so that the ink is squeezed from the mesh of the screen printing plate to the packaging structure by the moving squeegee. The ink printing process is prone to uneven ink or inconsistent thickness, which affects the uniformity and flatness of the packaging structure, and further affects the electrical performance and mechanical strength of the packaging structure, affecting its durability.

[0004] Therefore, ensuring the quality of the ink layer of the packaging structure is crucial to the final quality of the packaging structure and affects subsequent production and processing. Summary of the invention

[0005] The present application provides a packaging structure and a manufacturing method thereof, which can ensure the uniformity and flatness of the ink layer, so that the packaging structure has uniformity and flatness to meet production and processing requirements.

[0006] In order to solve the above technical problems, the technical solution adopted in the present application provides a packaging structure, wherein the packaging structure includes:

[0007] The packaging substrate comprises a plurality of sub-boards arranged in an array; a packaging edge board arranged around the outer edge of the packaging substrate; and an ink layer arranged on the packaging edge and the packaging substrate; wherein a patterned guide structure is provided on one side of the packaging edge board coated with the ink layer to guide the ink when the ink is applied.

[0008] The guide structure is a plurality of guide grooves, and the intervals between the guide grooves are 10 to 20 microns.

[0009] Among them, a plurality of guide grooves are in a comb-teeth shape.

[0010] Among them, the flow-guiding structure is a porous structure.

[0011] Among them, the porous structure is in a grid shape.

[0012] The distance between the pores of the porous structure is 10 to 200 microns.

[0013] Wherein, the width of the guide groove is 2 mm to 10 mm.

[0014] The surface of the packaging edge plate and the surface of the packaging substrate are in the same plane.

[0015] In order to solve the above-mentioned technical problems, the second aspect of the present application provides a method for manufacturing a packaging structure, and the method for manufacturing a packaging structure is used to prepare any of the above-mentioned packaging structures, and the manufacturing method includes: obtaining the packaging structure to be processed; etching the packaging edge plate of the packaging structure to be processed to form a guide structure; applying ink on at least one side of the packaging structure to be processed, and the guide structure guides the ink when the ink is applied to form an ink layer.

[0016] Among them, the packaging substrate to be processed includes a dielectric layer, and the packaging edge plate of the packaging structure to be processed is etched to form a guide structure. The steps include: electroplating the packaging structure to be processed to form a metal layer; etching the packaging edge plate to expose the dielectric layer and form multiple guide grooves.

[0017] Different from the prior art, the present application provides a packaging structure and a manufacturing method, in which a guide structure is provided on one side of the packaging edge plate coated with the ink layer to drain the ink when the ink is applied, thereby ensuring the uniformity and flatness of the ink layer, so that the packaging structure has uniformity and flatness, improves the durability of the packaging structure, meets the production and processing requirements, and improves the production quality and production efficiency of the packaging substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a top view of the structure of an implementation method of the packaging structure of the present application;

[0019] Figure 2 is a top view of a local structure A of another embodiment of the packaging structure of the present application;

[0020] Figure 3 It is a cross-sectional view of a local structure A of an implementation method of a packaging structure of the present application;

[0021] Figure 4 is a top view of a local structure A of another embodiment of the packaging structure of the present application;

[0022] Figure 5 is a partial A structural cross-sectional view of another embodiment of the packaging structure of the present application;

[0023] Figure 6 It is a top view of a local structure A of another embodiment of the packaging structure of the present application;

[0024] Figure 7 is a contour map of the thickness of the ink layer 103 of the packaging structure of the prior art;

[0025] Figure 8 is a contour diagram of the thickness of the ink layer 103 of another embodiment of the packaging structure of the present application;

[0026] Fig. 9 It is a flow chart of an implementation method of a method for manufacturing a packaging structure of the present application;

[0027] Fig.10 It is a flow chart of another implementation method of a method for manufacturing a packaging structure of the present application. DETAILED DESCRIPTION

[0028] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0029] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0030] The term "and / or" in this article is only a description of the association relationship of the associated objects. There can be three kinds of relationships. For example, A and / or B can be: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally means that the associated objects before and after are in an "or" relationship. In addition, "more" in this article means two or more than two.

[0031] Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0032] This application first provides a packaging structure, see Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a top view of the structure of an implementation method of the packaging structure of the present application; Figure 2 It is a top view of a local structure A of an implementation method of a packaging structure of the present application; Figure 3 It is a cross-sectional view of a local structure A of an implementation method of the packaging structure of the present application.

[0033] like Figure 1 As shown, in order to solve the above technical problems, the technical solution adopted by the present application provides a packaging structure 100, wherein the packaging substrate 101 is a carrier that provides electrical connection, protection, support, heat dissipation, assembly and other functions for the chip, wherein the packaging structure 100 includes:

[0034] The packaging substrate 101 includes a plurality of sub-boards (not shown) arranged in an array; a packaging edge plate 102, which is arranged around the outer edge of the packaging substrate 101; an ink layer 103, wherein the ink layer 103 is arranged between the packaging edge and the packaging substrate 101; wherein a patterned guide structure 1021 is provided on one side of the packaging edge plate 102 coated with the ink layer 103 to guide the ink when the ink is applied.

[0035] Specifically, the package substrate 101 is a carrier that provides electrical connection, protection, support, heat dissipation, assembly and other functions for the chip. During the processing, the package substrate 101 with multiple sub-boards will be assembled on a package structure 100 for production, and then the sub-boards will be separated to complete the delivery of the finished product. The design of the package substrate 101 has been fixed to avoid the height difference between the package substrate 101 and the package edge board 102, or the surface tension of the ink, which affects the flow of the ink, so the applied ink needs to be guided.

[0036] In a specific embodiment, there is a spacing groove (not shown) between the packaging edge plate 102 and the packaging substrate 101, the spacing groove surrounds the packaging substrate 101, and distinguishes the packaging edge plate 102 from the packaging substrate 101. The spacing groove can also play a certain role in guiding the ink accumulated during the processing, which helps to form a uniform and flat ink layer 103.

[0037] The guide structure 1021 can be a guide groove, a guide hole or a guide slope. The setting of the guide groove of the packaging structure 100 is determined according to the design of the packaging substrate 101. When the packaging substrate 101 has a large area where ink dots are easily accumulated, multiple guide structures 1021 can be set on the packaging edge plate 102 to enhance the ink diversion effect.

[0038] like Figure 2 As shown, in an optional embodiment, the guide structure 1021 is a plurality of guide grooves, and the intervals between the guide grooves are 10 to 20 microns.

[0039] In order to ensure the toughness and strength of the package structure 100 during processing and to reserve the clamping space of the package structure 100 during processing, a certain spacing needs to be ensured between the plurality of guide grooves. 10 microns, 11.5 microns, 12 microns, 15 microns, 15.5 microns, 16 microns, 18 microns, 20 microns.

[0040] In an optional implementation, the plurality of guide grooves are in a comb-teeth shape.

[0041] like Figure 3 As shown, the cross section of a guide groove is comb-tooth-shaped, so that the ink accumulated during the printing process can flow from a high place to the bottom of the groove and fill into the gaps between the comb teeth, ensuring that the formed ink layer 103 can be even and flat.

[0042] The depth of the guide groove can be one-third or one-fifth of the thickness of the packaging structure 100, so that the bottom of the guide groove can contact the dielectric layer (not shown) in the center of the packaging structure 100. The dielectric layer can be a dielectric layer or a combination of multiple metal layers and insulating layers. In an optional embodiment, the guide groove is only provided on both sides of the packaging substrate 101 to prevent the guide grooves on both sides from penetrating the packaging structure 100 or affecting the strength of the packaging structure 100. In other embodiments, the depth of the guide groove can be increased to guide more accumulated ink.

[0043] In an optional embodiment, the width of the guide groove is 2 mm to 10 mm.

[0044] The width of the guide groove can be 2 mm, 2.5 mm, 3 mm, 5 mm, 6 mm, 6.5 mm, 7 mm, 8 mm, 9 mm, or 10 mm. The width of the guide groove can be determined based on the area of ​​the packaging substrate 101 that needs to be coated with ink. In a specific embodiment, the width of the guide groove can be the same as the width of the packaging edge plate 102 so that the packaging edge plate 102 can be fully utilized, so that the guide groove can fully guide the accumulated ink.

[0045] In an optional embodiment, the surface of the package edge plate 102 and the surface of the package substrate 101 are in the same plane.

[0046] When the surfaces of the package edge plate 102 and the package substrate 101 are in the same plane, the ink can be pushed more smoothly by the printing scraper during screen printing, thereby ensuring the flatness and uniformity of the ink layer 103 formed on the surface of the package structure 100 .

[0047] In other embodiments, the surface height of the portion provided with the guide structure 1021 can be lower than the surface of the packaging substrate 101, so that during screen printing, the ink near the packaging edge plate 102 and the packaging substrate 101 can flow into the guide structure 1021 more quickly and play a full guide role.

[0048] See also Figure 4 and Figure 5 , Figure 4 is a top view of a local structure A of another embodiment of the packaging structure of the present application; Figure 5 It is a partial A structure cross-sectional view of another embodiment of the packaging structure of the present application.

[0049] like Figure 4 As shown, in order to solve the above technical problems, the technical solution adopted by the present application provides a packaging structure 100, wherein the packaging substrate 101 is a carrier that provides electrical connection, protection, support, heat dissipation, assembly and other functions for the chip, wherein the packaging structure 100 includes:

[0050] The packaging substrate 101 includes a plurality of sub-boards (not shown) arranged in an array; a packaging edge plate 102, which is arranged around the outer edge of the packaging substrate 101; an ink layer 103, wherein the ink layer 103 is arranged between the packaging edge and the packaging substrate 101; wherein a patterned guide structure 1021 is provided on one side of the packaging edge plate 102 coated with the ink layer 103 to guide the ink when the ink is applied.

[0051] Specifically, the package substrate 101 is a carrier that provides electrical connection, protection, support, heat dissipation, assembly and other functions for the chip. During the processing, the package substrate 101 with multiple sub-boards will be assembled on a package structure 100 for production, and then the sub-boards will be separated to complete the delivery of the finished product. The design of the package substrate 101 has been fixed to avoid the height difference between the package substrate 101 and the package edge board 102, or the surface tension of the ink, which affects the flow of the ink, so the applied ink needs to be guided.

[0052] The guide structure 1021 can be a guide groove, a guide hole or a guide slope. The setting of the guide groove of the packaging structure 100 is determined according to the design of the packaging substrate 101. When the packaging substrate 101 has a large area where ink dots are easily accumulated, multiple guide structures 1021 can be set on the packaging edge plate 102 to enhance the ink diversion effect.

[0053] In an optional embodiment, the guide structure 1021 is a plurality of guide grooves, and the intervals between the guide grooves are 10 to 20 microns.

[0054] In order to ensure the toughness and strength of the package structure 100 during processing and to reserve the clamping space of the package structure 100 during processing, a certain spacing needs to be ensured between the plurality of guide grooves. 10 microns, 11.5 microns, 12 microns, 15 microns, 15.5 microns, 16 microns, 18 microns, 20 microns.

[0055] In an optional implementation, the plurality of guide grooves are in a comb-teeth shape.

[0056] like Figure 5 As shown, the cross section of a guide groove is comb-tooth-shaped, so that the ink accumulated during the printing process can flow from a high place to the bottom of the groove and fill into the gaps between the comb teeth, ensuring that the formed ink layer 103 can be even and flat.

[0057] The depth of the guide groove can be one-third or one-fifth of the thickness of the packaging structure 100, so that the bottom of the guide groove can contact the dielectric layer (not shown) in the center of the packaging structure 100. The dielectric layer can be a dielectric layer or a combination of multiple metal layers and insulating layers. In an optional embodiment, the guide groove is only provided on both sides of the packaging substrate 101 to prevent the guide grooves on both sides from penetrating the packaging structure 100 or affecting the strength of the packaging structure 100. In other embodiments, the depth of the guide groove can be increased to guide more accumulated ink.

[0058] In an optional implementation, the flow guiding structure 1021 is a porous structure.

[0059] Holes are punched on the packaging edge plate 102 to form a porous hole array, which can accommodate the accumulated ink and have a certain diversion effect while ensuring the structure of the packaging edge plate 102, and ensure the flatness of the surface of the packaging substrate 101, so that the scraper can pass smoothly on the diversion structure 1021.

[0060] In an optional embodiment, the distance between pores of the porous structure is 10 to 200 microns.

[0061] The distance between holes can be set according to the area of ​​the package substrate 101 that needs to be coated with ink. Under the same pore size, the larger the distance between holes, the fewer the number of holes. The distance between holes can be 10 microns, 15 microns, 20 microns, 40 microns, 50 microns, 60 microns, 80 microns, 100 microns, 130 microns, 150 microns, 200 microns.

[0062] In an optional embodiment, the width of the guide groove is 2 mm to 10 mm.

[0063] The width of the guide groove can be 2 mm, 2.5 mm, 3 mm, 5 mm, 6 mm, 6.5 mm, 7 mm, 8 mm, 9 mm, or 10 mm. The width of the guide groove can be determined based on the area of ​​the packaging substrate 101 that needs to be coated with ink. In a specific embodiment, the width of the guide groove can be the same as the width of the packaging edge plate 102 so that the packaging edge plate 102 can be fully utilized, so that the guide groove can fully guide the accumulated ink.

[0064] In an optional embodiment, the surface of the package edge plate 102 and the surface of the package substrate 101 are in the same plane.

[0065] When the surfaces of the package edge plate 102 and the package substrate 101 are in the same plane, the ink can be pushed more smoothly by the printing scraper during screen printing, thereby ensuring the flatness and uniformity of the ink layer 103 formed on the surface of the package structure 100 .

[0066] In other embodiments, the surface height of the portion provided with the guide structure 1021 can be lower than the surface of the packaging substrate 101, so that during screen printing, the ink near the packaging edge plate 102 and the packaging substrate 101 can flow into the guide structure 1021 more quickly and play a full guide role.

[0067] Please refer to Figure 6 , Figure 7 and Figure 8 , Figure 6 It is a top view of a local structure A of another embodiment of the packaging structure of the present application; Figure 7 is a contour map of the thickness of the ink layer 103 of the packaging structure of the prior art; Figure 8 is a contour diagram of the thickness of the ink layer 103 of another embodiment of the packaging structure of the present application;

[0068] In order to solve the above technical problems, the technical solution adopted in the present application provides a packaging structure 100, wherein the packaging structure 100 includes:

[0069] In order to solve the above technical problems, the technical solution adopted in the present application provides a packaging structure 100, wherein the packaging substrate 101 is a carrier that provides electrical connection, protection, support, heat dissipation, assembly and other functions for the chip, wherein the packaging structure 100 includes:

[0070] The packaging substrate 101 includes a plurality of sub-boards (not shown) arranged in an array; a packaging edge plate 102, which is arranged around the outer edge of the packaging substrate 101; an ink layer 103, wherein the ink layer 103 is arranged between the packaging edge and the packaging substrate 101; wherein a patterned guide structure 1021 is provided on one side of the packaging edge plate 102 coated with the ink layer 103 to guide the ink when the ink is applied.

[0071] In an optional embodiment, the flow guiding structure 1021 is a porous structure.

[0072] Regarding the shape and size of the packaging structure 100 in another embodiment of the packaging structure 100 of the present application, reference may be made to the description of another embodiment of the packaging structure 100 of the present application, etc., which will not be repeated here.

[0073] like Figure 6 As shown, in an optional embodiment, the porous structure is in a grid shape.

[0074] Specifically, the grid-like holes of the porous structure are rectangular in shape when viewed from above.

[0075] In an optional embodiment, the distance between pores of the porous structure is 10 to 200 micrometers.

[0076] Specifically, relative to the edge angle of the packaging structure 100, multiple parallel line segments with an angle of 45 degrees and multiple parallel line segments with an angle of 135 degrees form a grid-like porous structure with a diamond cross-section, and the distance between the parallel lines is 10 to 200 microns, so a grid-like porous structure with a pore spacing of 10 to 200 microns is formed, and the pore spacing can be 10 microns, 15 microns, 20 microns, 40 microns, 50 microns, 60 microns, 80 microns, 100 microns, 130 microns, 150 microns, and 200 microns.

[0077] In other embodiments, the angles of the plurality of parallel lines forming the grid-like porous structure relative to the edge of the packaging structure 100 may be 30 degrees and 150 degrees, or 60 degrees and 120 degrees, etc.

[0078] like Figure 7 and Figure 8 As shown, 30 points are evenly taken on a sub-plate of the packaging structure of the prior art and the packaging structure 100 of the present application to obtain the thickness data of the ink layer 103, and the thickness data are obtained respectively. Figure 7 and Figure 8 The right edge and the lower edge of the obtained sub-board are adjacent to the package edge board 102, and it can be seen that Figure 7 The ink thickness difference at the lower right corner is large, and Figure 8 The difference ratio of ink thickness in the contour map Figure 7 The difference in ink thickness in the contour map is small, which can prove that the coated ink layer 103 of another embodiment of the packaging structure 100 of the present application can meet good production requirements and ensure the uniformity and flatness of the ink layer 103.

[0079] In the packaging structure 100 provided in the above embodiment, a patterned guide structure 1021 is provided on one side of the packaging edge plate 102 coated with the ink layer 103, which is used to guide the ink when the ink is applied, thereby ensuring the uniformity and flatness of the ink layer 103, so that the packaging structure 100 has uniformity and flatness, thereby improving the durability of the packaging structure 100, meeting production and processing requirements, and improving the production quality and production efficiency of the packaging substrate 101.

[0080] Fig. 9 is a schematic diagram of a process for manufacturing a packaging structure of the present application; the method for manufacturing a packaging structure of the embodiment is used to prepare the above-mentioned Figure 1 to Figure 6 The packaging structure of any one of the items.

[0081] The specific production steps are as follows:

[0082] S11: Obtain the packaging structure to be processed.

[0083] The packaging structure to be processed includes: a packaging substrate with multiple sub-boards arranged in an array and a packaging edge plate arranged around the outer edge of the packaging substrate. The packaging structure to be processed can be a packaging structure to be processed that has undergone processing steps such as chip installation, internal circuit etching or insulation packaging.

[0084] S12: etching the package edge plate of the package structure to be processed to form a guide structure.

[0085] On one or both sides of the packaging structure that need to be coated with ink, a guide structure is formed by developing etching or laser etching. The guide structure can be a guide groove, a guide hole or a guide slope. The setting of the guide groove of the packaging structure is determined according to the design of the packaging substrate. When the packaging substrate has a large area and ink dots are easily accumulated, multiple guide structures can be set on the packaging edge plate to enhance the ink guide effect.

[0086] S13: applying ink on at least one side of the packaging structure to be processed, and the guide structure guides the ink when applying the ink to form an ink layer 103 .

[0087] When screen printing is performed, a directional pressure is applied to the ink portion on the screen printing plate with a scraper so that the ink is moved. A guide structure is provided on the packaging structure of the scraper in motion so that during screen printing, the ink near the packaging edge plate and the packaging substrate can flow into the guide structure more quickly, thereby fully exerting the guide effect.

[0088] Fig.10 FIG. 1 is a flow chart of another embodiment of a method for manufacturing a packaging structure of the present application. The method for manufacturing a packaging structure of the present embodiment is used to prepare the above-mentioned Figure 1 to Figure 6 The packaging structure of any one of the items.

[0089] The specific production steps are as follows:

[0090] S21: Obtain the packaging structure to be processed.

[0091] The packaging structure to be processed includes: a packaging substrate with multiple sub-boards arranged in an array and a packaging edge plate arranged around the outer edge of the packaging substrate. The packaging structure to be processed can be a packaging structure to be processed that has undergone processing steps such as chip installation, internal circuit etching or insulation packaging.

[0092] The package structure to be processed includes a dielectric layer, and the step of etching the package edge plate of the package structure to be processed to form a guide structure includes:

[0093] S22: electroplating the package structure to be processed to form a metal layer; etching the package edge plate to expose the dielectric layer and form a plurality of guide grooves.

[0094] On one or both sides of the packaging structure that need to be coated with ink, a flow guide structure is formed by developing etching or laser etching. In a specific embodiment, when the outermost metal layer of the packaging structure is produced, the etching of the circuit or process edge of the metal layer of the packaging substrate and the flow guide structure of the packaging edge plate can be etched simultaneously to save production steps. In other embodiments, the production of the flow guide structure can also be carried out separately from the production steps of the packaging substrate.

[0095] In an optional embodiment, in order to distinguish the packaging substrate from the packaging edge plate in the packaging structure and to assist in splitting the packaging substrate when the finished product is delivered, a spacing groove is etched between the outer edge of the packaging substrate and the packaging edge plate, and the spacing groove can also provide a certain guide effect.

[0096] The guide structure can be a guide groove, a guide hole or a guide slope. The setting of the guide groove of the packaging structure is determined according to the design of the packaging substrate. When the packaging substrate has a large area where ink dots are easily accumulated, multiple guide structures can be set on the packaging edge plate to enhance the ink guide effect.

[0097] In one embodiment, the guide structure can be a guide groove, and the depth of the guide groove can be one-third or one-fifth of the thickness of the packaging structure, so that the bottom of the guide groove can contact the dielectric layer in the center of the packaging structure. The dielectric layer can be a dielectric layer or a collection of multiple metal layers and insulating layers.

[0098] S23: applying ink on at least one side of the packaging structure to be processed, and the guide structure guides the ink when applying the ink to form an ink layer 103 .

[0099] When screen printing is performed, a directional pressure is applied to the ink portion on the screen printing plate with a scraper so that the ink is moved. A guide structure is provided on the packaging structure of the scraper in motion so that during screen printing, the ink near the packaging edge plate and the packaging substrate can flow into the guide structure more quickly, thereby fully exerting the guide effect.

[0100] Through the above-mentioned method, a packaging structure is provided. Different from the prior art, the present application provides a packaging structure and a manufacturing method. A patterned guide structure is provided on one side of the packaging edge plate coated with the ink layer 103. During the manufacturing process, the ink is drained when the ink is applied, so that the uniformity and flatness of the ink layer 103 can be ensured, so that the packaging structure has uniform flatness, the durability of the packaging structure is improved, the production and processing requirements are met, and the production quality and efficiency of the packaging substrate are improved.

[0101] In the several embodiments provided in the present application, it should be understood that the disclosed systems and devices can be implemented in other ways. For the technical solutions in the embodiments of the present application, it is obvious that the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. For example, the device implementation described above is only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0102] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0103] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "coupled", "connected", "connected", "set", and "installed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0104] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0105] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0106] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A packaging structure, characterized in that: The packaging structure comprises: A packaging substrate, comprising a plurality of sub-boards arranged in an array; A packaging edge plate, arranged around the outer edge of the packaging substrate; An ink layer, the ink layer being arranged on the packaging edge and the packaging substrate; Wherein, a patterned guide structure is provided on one side of the packaging edge plate coated with the ink layer to guide the ink when the ink is applied.

2. The packaging structure according to claim 1, characterized in that: The guide structure is a plurality of guide grooves, and the intervals between the guide grooves are 10 to 20 microns.

3. The packaging structure according to claim 2, characterized in that: The plurality of guide grooves are in a comb-teeth shape.

4. The packaging structure according to claim 1, characterized in that: The flow-guiding structure is a porous structure.

5. The packaging structure according to claim 4, characterized in that: The porous structure is in a grid shape.

6. The packaging structure according to claim 4, characterized in that: The distance between holes in the porous structure is 10 to 200 microns.

7. The packaging structure according to claim 2, characterized in that: The width of the guide groove is 2 mm to 10 mm.

8. The packaging structure according to claim 1, characterized in that: The surface of the packaging edge plate and the surface of the packaging substrate are in the same plane.

9. A method for manufacturing a packaging structure, characterized in that: The method for manufacturing the packaging structure is used to prepare the packaging structure according to any one of claims 1 to 5, and the method comprises: Obtaining a packaging structure to be processed; Etching the package edge plate of the package structure to be processed to form a guide structure; Ink is applied to at least one side of the packaging structure to be processed, and the guide structure guides the ink when the ink is applied to form an ink layer.

10. The manufacturing method according to claim 9, characterized in that: The package structure to be processed includes a dielectric layer, and the step of etching the package edge plate of the package structure to be processed to form a guide structure includes: Electroplating the package structure to be processed to form a metal layer; The package edge plate is etched to expose the dielectric layer and form a plurality of guide grooves.

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