Modularized packaging device of MicroLED

Abstract

The invention relates to the technical field of Mi croLEDs, and discloses a modular packaging device for Mi croLEDs, which comprises a first substrate, a second substrate and a miniature LED, the first substrate and the second substrate are stacked and fixedly connected, the first substrate is positioned above the second substrate, two sides of the second substrate are respectively provided with a connecting piece a and a connecting piece b, and the connecting piece a and the connecting piece b are connected with the miniature LED. Conductive coatings are arranged on the upper surface and the two side faces of the first substrate and extend into the connecting piece a and the connecting piece b, the connecting piece a is a first connecting groove, the connecting piece b is a second connecting groove, an epoxy resin layer and a miniature LED are further arranged on the first substrate, the epoxy resin layer is located above the miniature LED, and the miniature LED is located above the conductive coatings; the conductive plate is clamped with the second substrate through the connecting piece a and the connecting piece b and located below the second substrate, and a plurality of first substrates and second substrates are arranged on the conductive plate. The device has the advantages of certain heat dissipation function, modular design, cost saving, convenience in replacement and the like.

Description

Technical Field

[0001] The present invention relates to the field of MicroLED technology, and in particular to a modular packaging device for MicroLED. Background Art

[0002] Modular packaging technology has become a research hotspot. Its core idea is to decompose the display panel into standardized module units that can be independently manufactured, tested and replaced. Each module contains a certain number of MicroLED chips, drive circuits and optical components, and the electrical and mechanical connections between modules are achieved through high-precision interfaces. This design can significantly simplify the mass transfer process (reducing the chip transfer range from the entire substrate to a single module) and reduce the difficulty of the process; at the same time, it supports modular production, testing and maintenance, greatly improving the yield and reducing costs. In addition, the modular structure facilitates the optimization of heat dissipation design (such as integrated metal heat dissipation layer) and optical effects (such as independent light control), enhancing product reliability and display performance. At present, modular packaging technology is developing towards smaller size (such as millimeter-level modules), higher integration (chip and driver integration) and intelligence (self-diagnosis and adaptive functions), providing technical support for the popularization of MicroLED in TVs, car displays, wearable devices and other fields. Summary of the invention

[0003] 1. Technical issues to be resolved

[0004] In view of the deficiencies in the prior art, the present invention provides a modular packaging device for MicroLED, which has certain advantages such as heat dissipation function, modular design, cost saving, and convenient replacement, thereby solving the modular packaging problem of MicroLED.

[0005] (II) Technical solution

[0006] To achieve the above modular packaging purpose, the present invention provides the following technical solutions: A modular packaging device for MicroLED, comprising a first substrate, a second substrate, a conductive plate and a microLED, wherein the first substrate and the second substrate are stacked and fixedly connected, the first substrate is located above the second substrate, a connector a and a connector b are respectively provided on both sides of the second substrate, a conductive coating is provided on the upper surface and both side surfaces of the first substrate and extends into the connector a and the connector b, an epoxy resin layer and a microLED are also provided on the first substrate, the epoxy resin layer is located above the microLED, and the microLED is located above the conductive coating;

[0007] The conductive plate is clamped to the second substrate via the connector a and the connector b and is located below the second substrate. A plurality of first substrates and second substrates are arranged on the conductive plate.

[0008] Preferably, a plurality of warping grooves are provided at intervals on both side surfaces of the first substrate, a plurality of groups of the first substrates are provided at intervals, and each group of the first substrates is provided with a plurality of warping grooves, which are arranged adjacent to each other, and a plurality of the first substrates are provided adjacent to each other.

[0009] Preferably, the connecting member a is a first connecting groove, and the connecting member b is a second connecting groove.

[0010] Preferably, a plurality of equally spaced slots are provided in the conductive plate, a plurality of equally spaced connecting blocks are provided on both sides of the slots, and a plurality of equally spaced heat dissipation holes are provided on the bottom surface of the slots.

[0011] Preferably, the first connection groove and the second connection groove are respectively clamped on the connection blocks, and both side surfaces of each connection block are provided with conductive metal material.

[0012] Preferably, a plurality of spaced micro LEDs are fixedly mounted on the conductive coating.

[0013] Preferably, a rectangular groove extending downward is formed on the upper surface of the package body, and the conductive plate, the second substrate and the first substrate are placed in the rectangular groove in sequence.

[0014] Preferably, the packaging plate is connected to the top of the packaging body by screws and is located above the first substrate.

[0015] Preferably, the bottom surface of the rectangular groove is provided with a plurality of heat sinks with equal spacing, and the heat sinks extend to the outside of the packaging body.

[0016] (III) Beneficial effects

[0017] Compared with the prior art, the present invention provides a modular packaging device for MicroLED, which has the following beneficial effects:

[0018] 1. The invention realizes modular design by setting a plurality of first substrates and second substrates, thereby avoiding the situation where one of them needs to be replaced due to damage. Each module is independently conductive, so if one of them is damaged, only one needs to be replaced, thereby saving costs.

[0019] 2. The invention can facilitate the removal of the first substrate and the second substrate by setting the warping groove.

[0020] 3. The invention can clamp the second substrate onto the conductive plate and maintain a certain stability through the provision of the first connecting groove, the second connecting groove and the connecting block.

[0021] 4. The invention can prevent the micro LED surface from being dirty and dusty by encapsulating the micro LED therein through the encapsulation body and the encapsulation plate.

[0022] 5. The invention can dissipate heat from the heating element by providing heat sinks and heat dissipation holes.

[0023] 6. This invention protects the surface of micro LEDs through an epoxy resin layer and realizes modular packaging of micro LEDs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the assembly structure of the first and second glass substrates and the conductive plate of the present invention;

[0025] Figure 2 is a schematic diagram of the assembly structure of the first glass substrate and the second glass substrate of the present invention;

[0026] Figure 3 is a schematic structural diagram of a second glass substrate of the present invention;

[0027] Figure 4 It is a structural schematic diagram of the conductive plate of the present invention;

[0028] Figure 5 It is a schematic diagram of the structure of indium tin oxide, epoxy resin layer and micro LED of the present invention;

[0029] Figure 6 It is a structural schematic diagram of the packaging body and the packaging board of the present invention;

[0030] Figure 7 It is a schematic diagram of the structure of the packaging body and the heat sink of the present invention.

[0031] In the figure: 1. first substrate; 10. lift groove; 2. second substrate; 20. first connection groove; 21. second connection groove; 3. conductive plate; 30. card slot; 31. connection block; 32. heat dissipation hole; 4. conductive coating; 5. epoxy resin layer; 6. micro LED; 7. packaging body; 70. rectangular groove; 8. packaging plate; 9. heat sink. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-7, a modular packaging device of MicroLED, comprising a first substrate 1, a second substrate 2, a conductive plate 3 and a micro LED 6, wherein the first substrate 1 and the second substrate 2 are stacked and fixedly connected, the first substrate 1 is located above the second substrate 2, and a connector a and a connector b are respectively provided on both sides of the second substrate 2, and a conductive coating is provided on the upper surface and both side surfaces of the first substrate 1, and extends into the connector a and the connector b, and an epoxy resin layer 5 and a micro LED 6 are also provided on the first substrate 1, the epoxy resin layer 5 is located above the micro LED 6, and the micro LED 6 is located above the conductive coating 4;

[0034] The conductive plate 3 is clamped to the second substrate 2 through the connector a and the connector b and is located below the second substrate 2 . A plurality of first substrates 1 and second substrates 2 are arranged on the conductive plate 3 .

[0035] The first substrate 1 is the main plate material for connecting the micro LED 6. The first substrate 1 and the second substrate 2 can be made of glass, silicon, plastic and other materials. The first substrate 1 provides an installation platform for the micro LED 6 and also participates in the electrical connection. When many first substrates 1 and second substrates 2 are placed together, it will make it difficult to take them out of the conductive plate 3. At this time, a number of spaced warping grooves 10 are processed on both sides of the first substrate 1, and tools are used to insert into the warping grooves 10 to remove the first substrate 1 and the second substrate 2 from the conductive plate 3.

[0036] The diameters of the first substrate 1 and the second substrate 2 are between 1cm and 10cm. The second substrate 2 is smaller than the first substrate 1. When the micro LED 6 on the first substrate 1 is damaged, one of the first substrate 1 and the second substrate 2 can be taken out and replaced separately. The first substrate 1 and the second substrate 2 can be a whole or two separate individuals. If they are two separate individuals, the first substrate 1 and the second substrate 2 need to be fixed and installed, and the first substrate 1 is located on the second substrate 2. Several groups of first substrates 1 are arranged at intervals, and each group of first substrates 1 has several first substrates 1, which are arranged adjacent to each other. Several first substrates 1 are arranged adjacent to each other. When each first substrate 1 is arranged adjacent to each other, the micro LED 6 will be gathered into one piece. The epoxy resin layer 5 covers the micro LED 6 and provides packaging protection to prevent environmental factors from damaging the micro LED 6 and also prevent the intact micro LED 6 from being damaged during the replacement process.

[0037] The connector a is the first connecting groove 20, and the connector b is the second connecting groove 21. The first connecting groove 20 and the second connecting groove 21 are also provided with a conductive coating 4, which is snapped to the bottom of the second substrate 1 through the first connecting groove 20 and the second connecting groove 21. It is mainly responsible for providing additional electrical paths and support in the structure. Several groups of first substrates 1 and second substrates 2 are arranged at equal intervals on the conductive plate 3, which means that this is a modular design that can be expanded or reduced to meet different application requirements.

[0038] The conductive plate 3 is provided with a number of equally spaced slots 30, and a number of equally spaced connecting blocks 31 are provided on both sides of the slots 30. The connecting blocks 31 are respectively snapped into the first connecting slot 20 and the second connecting slot 21, and the first substrate 1 and the second substrate 2 are snapped and mounted on the conductive plate 3, and the first substrate 1 and the second substrate 2 can be prevented from falling off due to bumps during transportation. Conductive metal materials are provided on both sides of each connecting block 31, so that the metal materials are connected in series and fixedly mounted on the conductive plate 3. The bottom surface of the slots 30 is provided with a number of equally spaced heat dissipation holes 32, which help heat dissipate from the micro LED 6 and other heating components to the heat sink 9, thereby improving the overall heat dissipation efficiency.

[0039] A number of spaced micro LEDs 6 are fixedly mounted on the conductive coating 4. The conductive coating 4 is also arranged in the first connection groove 20 and the second connection groove 21. When the first connection groove 20 and the second connection groove 21 are clamped on the connection block 31, the conductive coating 4 is connected to the conductive metal material and the micro LED 6 is energized. A rectangular groove 70 extending downward is processed on the upper surface of the package body 7 to accommodate the conductive plate 3, the second substrate 2 and the first substrate 1, and are placed in the rectangular groove 70 in sequence. This design provides an integrated framework so that all components can be closely arranged together to form a compact and efficient module. A power plug is provided on the package body 7, and the power plug is connected to the conductive plate 3 through a cable signal.

[0040] The packaging plate 8 is made of a transparent material. The packaging plate 8 is connected to the top of the packaging body 7 by screws and is located above the first substrate 1. The packaging plate 8 can resist the first substrate 1 and the second substrate 2 in the conductive plate 3 and maintain the stability of the connection between the first substrate 1 and the second substrate 2. The bottom surface of the rectangular groove 70 is provided with a plurality of heat sinks 9 with equal spacing, and the heat sinks 9 extend to the outside of the packaging body 7. When the micro LED 6 and other heating elements conduct heat to the conductive plate 3, the conductive plate 3 dissipates the heat to the rectangular groove 70 through the heat dissipation holes 32. Due to the setting of the heat sink 9 on the bottom surface of the conductive plate 3, there is a certain distance between the conductive plate 3 and the rectangular groove 70, so the heat will be absorbed by the heat sink 9 and dissipated to the outside of the packaging body 7. The heat sink 9 is a metal material with good thermal conductivity.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A modular packaging device for MicroLED, comprising a first substrate (1), a second substrate (2), a conductive plate (3) and a MicroLED (6), characterized in that: The first substrate (1) and the second substrate (2) are stacked and fixedly connected, the first substrate (1) is located above the second substrate (2), a connector a and a connector b are provided on both sides of the second substrate (2), the upper surface and both side surfaces of the first substrate (1) are provided with a conductive coating, which extends into the connector a and the connector b, the first substrate (1) is also provided with an epoxy resin layer (5) and a micro LED (6), the epoxy resin layer (5) is located above the micro LED (6), and the micro LED (6) is located above the conductive coating (4); The conductive plate (3) is clamped to the second substrate (2) via a connector a and a connector b and is located below the second substrate (2). A plurality of first substrates (1) and second substrates (2) are provided on the conductive plate (3).

2. The modular packaging device of MicroLED according to claim 1, characterized in that: Both side surfaces of the first substrate (1) are provided with a plurality of warping grooves (10) at intervals, the first substrate (1) is provided with a plurality of groups at intervals, and each group of first substrates (1) is provided with a plurality of warping grooves (10) which are arranged adjacent to each other, and the first substrates (1) are provided with a plurality of warping grooves adjacent to each other.

3. The modular packaging device of MicroLED according to claim 1, characterized in that: The connecting member a is a first connecting groove (20), and the connecting member b is a second connecting groove (21).

4. The modular packaging device of MicroLED according to claim 1, characterized in that: The conductive plate (3) is provided with a plurality of equally spaced slots (30), and both sides of the slots (30) are provided with a plurality of equally spaced connecting blocks (31), and the bottom surface of the slots (30) is provided with a plurality of equally spaced heat dissipation holes (32).

5. A modular packaging device for MicroLED according to claims 3 and 4, characterized in that: The first connection groove (20) and the second connection groove (21) are respectively clamped on the connection block (31), and both side surfaces of each connection block (31) are provided with conductive metal material.

6. The modular packaging device of MicroLED according to claim 1, characterized in that: A plurality of spaced micro LEDs (6) are fixedly mounted on the conductive coating (4).

7. The modular packaging device of MicroLED according to claim 1, characterized in that: The upper surface of the packaging body (7) is provided with a rectangular groove (70) extending downward, and the conductive plate (3), the second substrate (2) and the first substrate (1) are placed in the rectangular groove (70) in sequence.

8. A modular packaging device for MicroLED according to claims 1 and 7, characterized in that: The packaging plate (8) is connected to the top of the packaging body (7) by means of screws and is located above the first substrate (1).

9. A modular packaging device for MicroLED according to claims 1 and 7, characterized in that: The bottom surface of the rectangular groove (70) is provided with a plurality of heat sinks (9) at equal intervals, and the heat sinks (9) extend to the outside of the packaging body (7).

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