Optical signal receiving sensor with internal shielding electromagnetic interference and processing method

Abstract

The invention provides an optical signal receiving sensor with internal shielding electromagnetic interference and a processing method. The optical signal receiving sensor comprises a PD photoelectric receiving diode; an IC chip; wherein the number of the PD photoelectric receiving diodes is two, the two PD photoelectric receiving diodes are connected in series and in parallel to be connected with the IC chip, and the two PD photoelectric receiving diodes can output analog signals and convert pulse information of optical signals into codes of electronic analog signals; a traditional receiving head structure is optimized, a receiving tube of a PD signal output port for receiving an optical signal is converted into a level signal capable of simulating the signal, and a better remote control system is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of optical signal receiving sensors, and in particular to an optical signal receiving sensor with internal shielding of electromagnetic interference and a processing method thereof. Background Art

[0002] Optical signal receiving sensor, also known as fiber optic sensor, is a sensor that converts the state of the measured object into a measurable optical signal. The working principle of the fiber optic sensor is to send the incident light beam from the light source into the modulator through the optical fiber, and the interaction with the external measured parameter in the modulator changes the optical properties of the light, such as the intensity, wavelength, frequency, phase, polarization state, etc., to become a modulated optical signal, which is then sent to the optoelectronic device through the optical fiber and the measured parameter is obtained after the demodulator.

[0003] However, the existing optical signal receiving sensors are often subject to external electromagnetic interference when in use, which affects the acquisition accuracy. The existing optical signal receiving sensors generally add a metal iron box (with the photosensitive area left empty) to the outside after the device is formed to achieve the same shielding of electromagnetic interference; its disadvantages are that the cost of assembling the iron box later is high, the structure size is large, and the application end may be limited. Therefore, an optical signal receiving sensor with internal electromagnetic interference shielding and a processing method are proposed. Summary of the invention

[0004] In view of this, the embodiments of the present invention hope to provide an optical signal receiving sensor with internal shielding of electromagnetic interference and a processing method to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial choice.

[0005] The technical solution of the embodiment of the present invention is implemented as follows: an optical signal receiving sensor with internal shielding of electromagnetic interference, comprising:

[0006] PD photo receiving diode;

[0007] IC chips;

[0008] Wherein, the PD photoelectric receiving diode is provided with two in total, and the two PD photoelectric receiving diodes are connected in series and in parallel to the IC chip, and can output analog signals, and convert the pulse information of the optical signal into the code of the electronic analog signal;

[0009] The outer side of the IC chip is covered with a metal shielding shell, and the outer side of the metal shielding shell is provided with a cycloaliphatic resin colloid layer.

[0010] Further preferably, the analog signal is any one of continuous code, NEC, and RC5.

[0011] A method for processing an optical signal receiving sensor with internal shielding of electromagnetic interference, used for processing the optical signal receiving sensor as described above, comprises the following steps:

[0012] S1. Use silver glue to fix the IC signal processing chip and PD photoelectric receiving diode;

[0013] S2, using alloy wire to electrically connect the electrode of the IC chip and the PD photoelectric receiving diode;

[0014] S3. Use a punching and folding die to bend the V-shaped punching wire groove reserved on the bracket, so that the metal bracket turns upward to cover the IC chip and shield electromagnetic interference;

[0015] S4, injecting the cycloaliphatic resin into the mold cavity to encapsulate the semi-finished device;

[0016] S5. Use water jet to remove colloid residue and electroplated tin;

[0017] S6. Use cutting and bending dies to separate the semi-finished products into individual pieces, and conduct a simulation test of the photoelectric signal.

[0018] Further preferably, in S4, the cycloaliphatic resin colloid is black, so as to enhance the protection against visible light interference.

[0019] Further preferably: in S5, the thickness of the tin layer is 2-10 um.

[0020] Further preferably, in S3, the bracket is made of iron or copper, and before processing, the bracket is pre-punched, specific functional areas are set, and V-shaped wire grooves are punched.

[0021] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution:

[0022] 1. The present invention optimizes the traditional receiving head structure, and converts the optical signal into a level signal that can be simulated through the receiving tube of the PD signal output port, thereby achieving a better remote control system.

[0023] 2. The present invention adopts black cycloaliphatic resin colloid and injects it into the specified mold cavity, which can enhance the protection against visible light interference. At the same time, it cooperates with the metal shielding shell to achieve the effect of internal shielding of electromagnetic interference. It can be manufactured in large quantities, has a simple processing technology, and is easy to promote.

[0024] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a structural diagram of the present invention;

[0027] Figure 2 This is a disassembled structural diagram of the optical signal receiving sensor during processing in an embodiment of the present invention;

[0028] Figure 3 A structural diagram of a bracket from one perspective in an embodiment of the present invention;

[0029] Figure 4 A structural diagram of a bracket from another perspective in an embodiment of the present invention;

[0030] Figure 5 It is a structural diagram of the colloid residue and electroplated tin on the PIN pin bracket of the optical signal receiving sensor in an embodiment of the present invention;

[0031] Figure 6 is a test circuit diagram in an embodiment of the present invention;

[0032] Figure 7 Schematic diagram of output signals of a test circuit in an embodiment of the present invention;

[0033] Figure 8 It is a schematic diagram of frequency division decoding information applied to different specific occasions and in an embodiment of the present invention.

[0034] Figure numerals: 1, optical signal receiving sensor; 11, focusing sphere; 21, metal shielding shell; 22, alloy wire; 23, PD photoelectric receiving diode; 24, cycloaliphatic resin colloid layer; 25, IC chip; 3, bracket; 31, V-shaped stamping wire groove; 32, mold cavity. DETAILED DESCRIPTION

[0035] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0036] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0037] like Figure 1-5As shown, an embodiment of the present invention provides an optical signal receiving sensor with internal shielding of electromagnetic interference, comprising:

[0038] PD photo receiving diode;

[0039] IC chips;

[0040] There are two PD photoelectric receiving diodes 23, which are connected in series and in parallel to the IC chip 25, and can output analog signals to convert the pulse information of the optical signal into the code of the electronic analog signal.

[0041] The IC chip 25 is covered with a metal shielding shell 21 on its outer side. A cycloaliphatic resin colloid layer 24 is provided on its outer side. After the cycloaliphatic resin colloid layer 24 is cooled and formed, a focusing hemisphere 11 is formed.

[0042] Specifically, the analog signal is any one of continuous code, NEC, and RC5;

[0043] By using two PD photoelectric receiving diodes 23 connected in series and in parallel to the built-in analog signal IC chip 25, the signal can output a continuous code or an analog signal of NEC or RC5, thereby converting the pulse information of the optical signal into the code of the electronic analog signal;

[0044] By adopting the above technical means, the traditional plug-in receiving head structure can be optimized, and the signal can be strengthened to become a double-head PD and an application mode that combines SMT and plug-in.

[0045] At the same time, the present invention also provides a method for processing an optical signal receiving sensor with internal shielding of electromagnetic interference, which is used to process the optical signal receiving sensor as described above, comprising the following steps:

[0046] Before use, prepare the bracket for processing. The appearance of bracket 3 is as follows Figure 3 and Figure 4 As shown, the bracket 3 is made of iron or copper, pre-punched and set with specific functional areas, and a V-shaped punching groove 31 is made at the bending position of the later packaging link to reduce the bending stress;

[0047] During processing, such as Figure 2 As shown, according to the use requirements, the product uses silver glue to fix the IC signal processing chip 25 and the PD photoelectric receiving diode 23, uses alloy wire 22 to electrically connect the electrode of the IC chip 25 with the PD photoelectric receiving diode 23, and then uses a specific punching die to bend the V-shaped punching wire groove 31 reserved in the bracket 3, the purpose is to use the metal bracket to flip up and cover the IC chip 25, so as to achieve the effect of shielding electromagnetic interference;

[0048] Then, a black cycloaliphatic resin colloid that is enhanced to prevent visible light interference is injected into the designated mold cavity 32 to generate an optical signal receiving sensor 1 with a focusing ball head 11, and the semi-finished device is packaged;

[0049] Then, the electric water jet is used to remove the colloid residue and the electroplated tin 12 on the PIN pin bracket of the optical signal receiving sensor 1, and the thickness of the tin layer is kept at 2-10um, so as to protect the PIN pin from oxidation and increase the solderability of SMT soldering;

[0050] Then the product is divided into individual pieces by cutting and bending dies. Figure 1 As shown in the finished product optical signal receiving sensor 1, a simulation test of the photoelectric signal is carried out.

[0051] In this embodiment, in the finished product processed by the above processing method, the dimensions of the optical signal receiving sensor 1 are 5.0-10.0 mm in length, 3.0-4.0 mm in width, 1.5-3.5 mm in thickness, and the radius of the focusing ball head 11 is 1.5 mm-2.0 mm.

[0052] Embodiment 2

[0053] The present invention also provides a test circuit for the optical signal receiving sensor of the present invention, such as Figure 6-7 As shown, where:

[0054] The PD receiving diode converts the optical signal irradiated by the transmitter into an electrical signal (current). The IC chip converts the current generated by the PhotoDiode into a voltage level value that is convenient for signal processing. The automatic level change control system (AGC) automatically adjusts the amplification rate according to the input size of the signal or circuit noise wave. The Burke packet filter (BPF) selectively passes only the required frequency bandpass filter. The waveform detector detects and reproduces the components of the carrier signal by the ATC selection system and integrator. The ATC circuit maintains a certain pulse width according to the arrival distance (signal strength). The waveform generation and shaping processor shapes the waveform through the Schmitt trigger circuit. The signal output adopts a low-activity output structure with an internal pull-up resistor, and is convenient for connecting with the circuit signal at the application end through an external pull-up / pull-down resistor.

[0055] like Figure 8 As shown, the Waveform Rectifier of the present invention can also be applied to different specific occasions and frequency division decoding information.

[0056] The present invention optimizes the traditional receiving head structure, and converts the optical signal into a level signal that can be used as an analog signal through a receiving tube at a PD signal output port, thereby achieving a better remote control system.

[0057] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of various changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An optical signal receiving sensor with internal shielding of electromagnetic interference, characterized in that: include: PD photo receiving diode; IC chips; Wherein, the PD photoelectric receiving diode is provided with two in total, and the two PD photoelectric receiving diodes are connected in series and in parallel to the IC chip, and can output analog signals, and convert the pulse information of the optical signal into the code of the electronic analog signal; The outer side of the IC chip is covered with a metal shielding shell, and the outer side of the metal shielding shell is provided with a cycloaliphatic resin colloid layer.

2. The optical signal receiving sensor with internal shielding of electromagnetic interference according to claim 1, characterized in that: The analog signal is any one of continuous code, NEC, and RC5.

3. A method for processing an optical signal receiving sensor with internal shielding of electromagnetic interference, used for processing the optical signal receiving sensor as claimed in any one of claims 1 to 2, characterized in that: The following steps are involved: S1. Use silver glue to fix the IC signal processing chip and PD photoelectric receiving diode; S2, using alloy wire to electrically connect the electrode of the IC chip and the PD photoelectric receiving diode; S3. Use a punching and folding die to bend the V-shaped punching wire groove reserved on the bracket, so that the metal bracket turns upward to cover the IC chip and shield electromagnetic interference; S4, injecting the cycloaliphatic resin into the mold cavity to encapsulate the semi-finished device; S5. Use water jet to remove colloid residue and electroplated tin; S6. Use cutting and bending dies to separate the semi-finished products into individual pieces, and conduct a simulation test of the photoelectric signal.

4. The method for processing an optical signal receiving sensor with internal shielding of electromagnetic interference according to claim 3, characterized in that: In the above S4, the cycloaliphatic resin colloid is black, which is used to enhance the protection against visible light interference.

5. The method for processing an optical signal receiving sensor with internal shielding of electromagnetic interference according to claim 3, characterized in that: In the S5, the thickness of the tin layer is 2-10 um.

6. The method for processing an optical signal receiving sensor with internal shielding of electromagnetic interference according to claim 3, characterized in that: In S3, the bracket is made of iron or copper. Before processing, the bracket is pre-punched, specific functional areas are set, and V-shaped wire grooves are punched.

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