Structure and circuit of intelligent novel ultrathin punctuality clock module

Abstract

The invention provides an intelligent novel ultrathin punctuality clock module structure and circuit, and relates to the technical field of communication equipment, the intelligent novel ultrathin punctuality clock module structure comprises a mounting base and a metal shell, the top of the mounting base is provided with a concave PCB, the top surface of the concave PCB is provided with a constant temperature groove body, the constant temperature groove body is internally provided with a PCB mainboard, the bottom of the PCB mainboard is provided with a temperature compensation active crystal oscillator, and the temperature compensation active crystal oscillator is connected with the metal shell. A connecting groove is formed in the top face of the concave PCB, a semicircular tin climbing groove is formed in the edge of the bottom face of the concave PCB, isolation layers are arranged on the two sides of the top face of the concave PCB, the PCB mainboard and the concave PCB are matched with the three-dimensional combination mode of the metal shell to connect the temperature compensation active crystal oscillator, the concave PCB is of a metal plug-in type structure, the size is optimized by more than 10 times, and the temperature compensation active crystal oscillator is connected with the PCB mainboard. The temperature compensation active crystal oscillator replaces a traditional constant-temperature crystal oscillator, the whole taming time is improved from 24-hour taming of the traditional constant-temperature crystal oscillator to 3-minute taming of the temperature compensation active crystal oscillator, a taming algorithm model is built, the structure is simple, the size is small, and the rapid taming structure is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of communication equipment, and in particular to a structure and circuit of a novel intelligent ultra-thin timekeeping clock module. Background Art

[0002] According to a super-thin clock patch digital tube disclosed by Chinese patent number CN206021821 U, it includes a PCB circuit board and a reflective cover installed on the PCB circuit board, connecting electrodes are installed on both sides of the PCB circuit board, and the connecting electrodes are connected to the light-emitting chip installed on the PCB circuit board through the circuit on the PCB circuit board, and the four corners of the PCB circuit board are also installed with fixed pads; a reflective cavity is opened on the reflective cover above the light-emitting chip, and a light-emitting channel is opened on the reflective cover above the side of the light-emitting chip, and the light-emitting channel is connected to the reflective cavity; support columns of the same length are installed at intervals on the back of the reflective cover, and the reflective cavity and the light-emitting channel are filled with epoxy resin diffusion adhesive layers, and the reflective cover and the PCB circuit board are also bonded and connected by the epoxy resin diffusion adhesive layer. The super-thin clock patch digital tube of the present invention has a thin thickness, a stable structure, uniform light emission, and is convenient for automated patch production.

[0003] The existing technology generally adopts DIP direct plug-in type, which can only be wave soldered. In the field of high-frequency applications, the pins penetrate the PCB, which is not conducive to RF signal shielding. It is large in size and takes a long time to tame, which is not conducive to the secondary packaging of the metal cavity. Summary of the invention

[0004] Technical issues solved

[0005] In view of the deficiencies of the prior art, the purpose of the present invention is to solve the shortcomings of the prior art, such as large size and long taming time, and to propose a structure and circuit of a new type of intelligent ultra-thin timekeeping clock module.

[0006] Technical Solution

[0007] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a structure and circuit of a smart new ultra-thin timekeeping clock module, including a mounting base and a metal shell, a concave PCB board is provided on the top of the mounting base, a constant temperature tank body is clamped on the top surface of the concave PCB board, a PCB mainboard is provided near the top surface inside the constant temperature tank body, a temperature-compensated active crystal oscillator is provided at the bottom of the PCB mainboard, a connecting groove is provided on the top surface of the concave PCB board, a semicircular tin climbing groove is provided at the edge of the bottom surface of the concave PCB board, an isolation layer is provided on both sides of the top surface of the concave PCB board, solder pads are provided at the edges of the top surface of the concave PCB board perpendicular to the isolation layer, and a fixing frame is provided on the top surface of the concave PCB board.

[0008] Preferably, a thermostatic bath cover is slidably engaged with the top surface of the thermostatic bath body, and the bottom edge of the thermostatic bath cover is engaged with the top surface of the isolation layer.

[0009] Preferably, the front cross-section of the thermostatic bath cover is an inverted U-shape, and the bottom surface of the thermostatic bath cover is gap-matched with the top surface and side edges of the thermostatic bath body.

[0010] Preferably, connecting bolts are provided through the four corners of the surface of the mounting base, the top ends of the connecting bolts are connected to the four corners of the surface of the concave PCB board, and the bottom surface of the metal shell and the top surface of the mounting base are engaged with each other.

[0011] Preferably, the height of the semicircular tin climbing bath is 1 / 2 of the thickness of the isolation layer, and the edge of the fixing frame coincides with the edge of the top surface of the concave PCB board.

[0012] Preferably, the adjacent side edges of the mounting base and the adjacent side edges of the metal shell are both rounded.

[0013] Preferably, the PCB main board is electrically connected to the concave PCB board, and the temperature compensated active crystal oscillator is electrically connected to the PCB main board.

[0014] Preferably, the circuit structure includes the following parts:

[0015] Intelligent identification circuit: The intelligent identification circuit includes a load, a DC blocking capacitor, a detector and an operational amplifier circuit, and is used to identify circuit signals;

[0016] Control module: The control module includes a single chip microcomputer, a DAC, and an ADC, and is used for circuit control;

[0017] Signal switch: The signal switch is used for on-off control of the circuit.

[0018] Preferably, the circuit structure further includes an active temperature-compensated voltage-controlled crystal oscillator and a clock reference source.

[0019] Beneficial Effects

[0020] In the present invention, a temperature-compensated active crystal oscillator is connected by adopting a three-dimensional combination mode of a PCB main board and a concave PCB board in cooperation with a metal shell. The concave PCB board has a metal plug-in structure, and the volume is optimized by more than 10 times, so that small size, surface mount type and ultra-thin requirements are achieved. A temperature-compensated active crystal oscillator is adopted to replace a traditional constant temperature crystal oscillator, so that the entire taming time is improved from 24 hours for taming of a traditional constant temperature crystal oscillator and 72 hours for building a taming algorithm model to 3 minutes for taming of a temperature-compensated active crystal oscillator and building a taming algorithm model. The structure is simple, the volume is small, and a fast taming structure is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of the internal part of the present invention;

[0022] Figure 2 It is the exploded structure diagram of the present invention;

[0023] Figure 3 It is a three-dimensional structural diagram of the present invention;

[0024] Figure 4 It is a connection structure diagram of the present invention;

[0025] Figure 5 This is a structural diagram of a concave PCB board of the present invention;

[0026] Figure 6 This is a structural diagram of the bottom surface of the concave PCB board of the present invention;

[0027] Figure 7 It is the core circuit framework diagram of the present invention;

[0028] Figure 8 It is a circuit diagram of the present invention.

[0029] Among them: 1. Installation base; 2. Metal shell; 3. Temperature compensated active crystal oscillator; 4. Constant temperature tank body; 5. PCB main board; 6. Constant temperature tank cover; 7. Concave PCB board; 701. Semicircular tin climbing bath; 702. Isolation layer; 703. Solder pad; 704. Fixing frame; 705. Connection groove; 8. Connection bolts. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Specific embodiment one:

[0032] As shown in the figure, a structure and circuit of a smart new ultra-thin timekeeping clock module include a mounting base 1 and a metal shell 2. A concave PCB board 7 is provided on the top of the mounting base 1. A constant temperature tank body 4 is provided on the top surface of the concave PCB board 7. A PCB main board 5 is provided near the top surface of the constant temperature tank body 4. A temperature-compensated active crystal oscillator 3 is provided at the bottom of the PCB main board 5. The temperature-compensated active crystal oscillator 3 is used in the whole device to replace the traditional constant temperature crystal oscillator as the frequency reference source for taming the timekeeping clock module. Since the size of the temperature-compensated active crystal oscillator 3 is selected as 2.0*1.6*0.7mm, and the traditional constant temperature crystal oscillator is generally 17*17*7mm, the entire volume of the device structure finally formed is greatly reduced, more than 70% of the components can be saved, and 3 minutes of taming can be achieved. The general taming time is 24 hours, and the shortcomings of the traditional timekeeping clock module, such as large volume, high power consumption, slow startup, and long taming time, are effectively solved. The SMT structure is designed to replace the original DIP structure, which can form the advantages of ultra-thinness and shielding.

[0033] The structure of the concave PCB board 7 is specifically as follows: a connecting groove 705 is provided on the top surface of the concave PCB board 7, a semicircular tin climbing groove 701 is provided at the edge of the bottom surface of the concave PCB board 7, an isolation layer 702 is provided on both sides of the top surface of the concave PCB board 7, and solder pads 703 are provided at the edges of the top surface of the concave PCB board 7 perpendicular to the isolation layer 702. A fixing frame 704 is provided on the top surface of the concave PCB board 7. The isolation layer 702 is usually made of various general materials for making the PCB main board 5, and is used to realize the bottom pin definition and position defined by the product and the extension of the electrical connection port of the PCB interface placed inside the connecting groove 705. The height of the semicircular tin climbing groove 701 is usually designed to be half the thickness of the isolation layer 702 to avoid the electrical performance of the bottom part of the pins. In order to avoid the risk of short circuit with the metal shell 2 at the back, the inner surface of the connecting groove 705 is paved with a large area of ​​ground to shield radio frequency interference. The depth of the connecting groove 705 should be designed to be half of the thickness of the PCB main board 5, the height of the highest component placed on the top layer of the PCB main board 5 and the thickness of the SMT solder paste. The purpose is to facilitate electrical connection through the pads 703 on the fixed frame 704 around the concave PCB board 7, and have the function of fixing the PCB main board 5. The semicircular tin climbing holes are designed to meet the requirements of SMT and manual blow soldering processes. The design principle of the thickness around the fixed frame 704 is that the sum of the thickness of the metal shell 2 and the width of the pad 703 is slightly less than the thickness of the frame, usually retaining more than 0.2mm to avoid the frame breaking and affecting the appearance.

[0034] The circuit structure includes the following parts: intelligent identification circuit: the intelligent identification circuit includes a load, a DC blocking capacitor, a detector and an operational amplifier circuit, which are used to identify circuit signals; a control module: the control module includes a single-chip microcomputer, a DAC, and an ADC, which are used for circuit control; a signal switch: the signal switch is used for on-off control of the circuit, and the circuit structure also includes an active temperature-compensated voltage-controlled crystal oscillator and a clock reference source. The other limiting structures in the entire device are that the top surface of the constant temperature tank body 4 is slidably engaged with a constant temperature tank cover 6, and the bottom edge of the constant temperature tank cover 6 is engaged with the top surface of the isolation layer 702, the front cross-section of the constant temperature tank cover 6 is an inverted U-shaped, and the constant The bottom surface of the temperature tank cover 6 is matched with the top surface and side edge clearance of the constant temperature tank body 4 to maintain the sealed environment of the top surface of the constant temperature tank. Connecting bolts 8 are penetrated through the four corners of the surface of the mounting base 1. The top of the connecting bolts 8 is connected to the four corners of the surface of the concave PCB board 7. The bottom surface of the metal shell 2 and the top surface of the mounting base 1 are engaged with each other, which is convenient for the installation and combination of the entire device. The adjacent side edges of the mounting base 1 and the adjacent side edges of the metal shell 2 are both rounded. The PCB mainboard 5 and the concave PCB board 7 are electrically connected, and the temperature compensating active crystal oscillator 3 is electrically connected to the PCB mainboard 5, which is convenient for the connection and use of the temperature compensating active crystal oscillator 3. Specific embodiment 2:

[0036] Referring to the diagram, when the circuit structure of the entire device is used, the active temperature-compensated crystal oscillator is used to replace the traditional constant temperature crystal oscillator. The passive crystal start-up circuit, frequency selection circuit, B-mode and C-mode suppression circuit, and heating circuit are removed from the circuit, and the intelligent identification circuit is added to expand the synchronization of the indoor customer clock system. The intelligent identification circuit consists of matching loads, DC blocking capacitors, and operational amplifiers.

[0037] In summary:

[0038] The temperature-compensated active crystal oscillator 3 is connected by a three-dimensional combination of a PCB main board 5 and a concave PCB board 7 in cooperation with a metal shell 2. The concave PCB board 7 has a metal plug-in structure, and the volume is optimized by more than 10 times, achieving small size, surface mount and ultra-thin requirements. The temperature-compensated active crystal oscillator 3 is used to replace the traditional constant temperature crystal oscillator, so that the entire taming time is improved from the traditional constant temperature crystal oscillator 24 hours taming and 72 hours to build a taming algorithm model to the temperature-compensated active crystal oscillator 3 performing 3 minutes taming and building a taming algorithm model. The structure is simple, the volume is small, and a fast taming structure is achieved.

[0039] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprising a reference structure" do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0040] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A structure of a novel intelligent ultra-thin timekeeping clock module, comprising a mounting base (1) and a metal housing (2), Features: A concave PCB board (7) is provided on the top of the mounting base (1); a thermostatic tank body (4) is engaged with the top surface of the concave PCB board (7); a PCB mainboard (5) is provided inside the thermostatic tank body (4) near the top surface; a temperature-compensated active crystal oscillator (3) is provided at the bottom of the PCB mainboard (5); a connecting groove (705) is provided on the top surface of the concave PCB board (7); a semicircular tin trough (701) is provided at the edge of the bottom surface of the concave PCB board (7); isolation layers (702) are provided on both sides of the top surface of the concave PCB board (7); solder pads (703) are provided at both side edges of the top surface of the concave PCB board (7) that are perpendicular to the isolation layer (702); and a fixing frame (704) is provided on the top surface of the concave PCB board (7).

2. The structure of a smart new ultra-thin timekeeping clock module according to claim 1, Features: The top surface of the thermostatic tank body (4) is slidably engaged with a thermostatic tank cover (6), and the bottom edge of the thermostatic tank cover (6) is engaged with the top surface of the isolation layer (702).

3. The structure of a smart new ultra-thin timekeeping clock module according to claim 2, Features: The front cross-section of the thermostatic bath cover (6) is an inverted U-shape, and the bottom surface of the thermostatic bath cover (6) is gap-matched with the top surface and side edge of the thermostatic bath body (4).

4. The structure of a smart new ultra-thin timekeeping clock module according to claim 1, Features: Connecting bolts (8) are provided through the four corners of the surface of the mounting base (1), the top ends of the connecting bolts (8) are connected to the four corners of the surface of the concave PCB board (7), and the bottom surface of the metal shell (2) and the top surface of the mounting base (1) are mutually engaged.

5. The structure of a smart new ultra-thin timekeeping clock module according to claim 1, Features: The height of the semicircular tin climbing groove (701) is 1 / 2 of the thickness of the isolation layer (702), and the edge of the fixing frame (704) and the edge of the top surface of the concave PCB board (7) overlap with each other.

6. The structure of a smart new ultra-thin timekeeping clock module according to claim 1, Features: The adjacent side edges of the mounting base (1) and the adjacent side edges of the metal shell (2) are both rounded.

7. The structure of a smart new ultra-thin timekeeping clock module according to claim 1, Features: The PCB main board (5) and the concave PCB board (7) are electrically connected, and the temperature-compensated active crystal oscillator (3) is electrically connected to the PCB main board (5).

8. A circuit structure of a novel intelligent ultra-thin timekeeping clock module according to any one of claims 1 to 7, Features: The circuit structure includes the following parts: Intelligent identification circuit: The intelligent identification circuit includes a load, a DC blocking capacitor, a detector and an operational amplifier circuit, and is used to identify circuit signals; Control module: The control module includes a single chip microcomputer, a DAC, and an ADC, and is used for circuit control; Signal switch: The signal switch is used for on-off control of the circuit.

9. The circuit structure of a smart new ultra-thin timekeeping clock module according to claim 8, Features: The circuit structure also includes an active temperature-compensated voltage-controlled crystal oscillator and a clock reference source.

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