A gate line and a method of manufacturing the same

Abstract

The present application relates to the field of solar cell preparation, in particular to a grid line and a preparation method thereof. The preparation method of the grid line provided by the present application comprises the following steps: performing first spray printing on the surface of a metal seed layer to obtain a plurality of first spray printing strips; the region between adjacent first spray printing strips on the surface of the metal seed layer is an initial blanking area; performing second spray printing to obtain a plurality of second spray printing strips; the second spray printing strips cover part of the initial blanking area; the second spray printing strips cover part of the first spray printing strips; the first spray printing strips and the second spray printing strips covering the first spray printing strips form composite spray printing strips to obtain a blanking area; repeating the above steps N times to obtain a target blanking area; and depositing metal to form a metal plating layer to obtain the grid line. The method provided by the present application can have the following advantages: adjusting the size of the grid line, obtaining a grid line with a relatively narrow line width, having a relatively high material utilization rate in the preparation process, and having a relatively low production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of solar cell preparation, in particular to a grid line and a preparation method thereof. BACKGROUND

[0002] At present, grid lines are prepared by patterning process in the field of photovoltaics, and the patterning process mainly includes screen printing method and laser ablation method. However, the screen printing method is limited due to the following problems: (1) the material utilization rate is relatively low, and the cost is high. The material used for the grid line is mainly precious metal paste, which is of high value; (2) in the industrialization process, the high-precision screen printing screen is expensive, and the service life is short; (3) if different line width products are produced, different aperture screens are needed, which is of high cost. For the laser ablation method, the equipment is expensive, the material utilization rate is low, and the grid line precision is limited by the focusing size of the laser, so it is difficult to form a grid line with a line width less than 35 μm.

[0003] In the prior art, it is urgent to provide a method for preparing a grid line which can adjust the size of the grid line width, has a relatively narrow grid line width, has a high material utilization rate in the preparation process, and has a low production cost. SUMMARY

[0004] Therefore, the technical problem to be solved by the present application is to overcome the fact that there is no method for preparing a grid line which can adjust the size of the grid line width, has a relatively narrow grid line width, has a high material utilization rate in the preparation process, and has a low production cost in the prior art, so as to provide a grid line and a preparation method thereof.

[0005] The present application provides a preparation method of a grid line, comprising the following steps:

[0006] (1) forming a metal seed layer on the surface of a substrate layer; the surface of the metal seed layer has a first direction and a second direction perpendicular to each other;

[0007] (2) performing first printing on the surface of the metal seed layer along the second direction through a plurality of first nozzles with a center distance of T0 to obtain a plurality of first printing strips; the ink drop diameter of the first printing is wherein the plurality of first nozzles are arranged parallel to the first direction; the area between adjacent first printing strips on the surface of the metal seed layer is an initial blank area;

[0008] (3) performing second printing along the second direction through a plurality of second nozzles with a center distance of T0 to obtain a plurality of second printing strips; wherein the plurality of second nozzles are arranged parallel to the first direction and correspond to the plurality of first nozzles in step (2); the ink drop diameter of the second printing is The second jetting band covers part of the initial white space formed in step (2); the second jetting band covers part of the first jetting band; the first jetting band and the second jetting band covering it form a composite jetting band; in this step, the area between the composite jetting bands on the surface of the metal seed layer is a white space;

[0009] (4) Repeat step (3) N times, in each repetition, the jetting nozzle used is parallel to the first direction, the diameter of the ink droplet jetted is less than or equal to the diameter of the ink droplet jetted in the previous repetition; the jetting band formed in each repetition covers the composite jetting band obtained in the previous repetition, and covers the white space obtained in the previous repetition; after repeating step (3) N times, the area between the composite jetting bands on the surface of the metal seed layer is a target white space; N is an integer greater than or equal to zero;

[0010] (5) Deposit metal on the target white space to form a metal layer, thereby obtaining the gate line.

[0011] Preferably, the width of the initial white space in step (2) is

[0012] Preferably, in step (3), the second jetting band covers part of the initial white space, and the width of the initial white space covered is T1, and the second jetting band covers part of the first jetting band, and the width of the first jetting band covered is T2, the width of the white space obtained in step (3) is T3.

[0013] Preferably, in step (4), in the i-th repetition of repeating step (3) N times, the jetting band formed covers part of the white space obtained in the previous repetition, and the width of the white space obtained in the previous repetition covered is Ti, (i) i is an integer between 0 and N; and the width of the target white space obtained after repeating step (3) N times is T.

[0014] It can be understood that, in step (3), the distance between the second jetting nozzle and the corresponding first jetting nozzle in the first direction is Δx1, the second jetting band covers part of the initial white space, and the width of the initial white space covered is T1, the width of the white space obtained in step (3) is T3.

[0015] In step (4), in the i-th repetition of repeating step (3) N times, the diameter of the jetting nozzle used is and the distance between the corresponding jetting nozzle in the previous repetition and the jetting nozzle in the i-th repetition in the first direction is Δx (i) , the jetting band formed covers part of the white space obtained in the previous repetition, and the width of the white space obtained in the previous repetition covered is Ti. i is an integer between 0 and N; wherein, when i is 0, the repeating step (3) is not performed, Δx (0) = 0; the width of the blank area obtained in step (4) is

[0016] Preferably, the substrate layer is a silicon wafer.

[0017] Preferably, the silicon wafer is a bare silicon wafer for solar cells.

[0018] Preferably, in step (5), the method of depositing metal is selected from electroplating, electroless plating, physical vapor deposition or chemical vapor deposition.

[0019] Preferably, after forming the gate lines, the process further comprises sequentially removing the surface printing material of the metal seed layer and the metal seed layer not covered by the gate lines.

[0020] Preferably, the printing material used in the printing is selected from a hot melt material, wherein the hot melt material has fluidity at greater than or equal to 50°C, and the viscosity is 0.1 mPa·S to 20 mPa·S; and when the hot melt material is solid or fluid at less than or equal to 25°C, the hot melt material has a viscosity greater than 10,000 mPa·S when it is fluid.

[0021] Preferably, the printing material used in the printing is selected from one or more of acrylate, rosin ester resin, C11-C22 alkyl acid, polypropylene wax, microcrystalline wax, polyethylene wax, and ethylene-vinyl acetate copolymer wax.

[0022] Preferably, the ink droplet diameter in step (3) is the same as the ink droplet diameter in step (2); the second ejection orifice in step (3) is the ejection orifice after the first ejection orifice in step (2) is translated in the first direction; and / or,

[0023] the ink droplet diameter in step (4) is the same as the ink droplet diameter in step (2); and the ejection orifice in step (4) is the ejection orifice after the first ejection orifice in step (2) is translated in the first direction.

[0024] Preferably, the second ejection orifice in step (3) is an ejection orifice that is misaligned with the first ejection orifice in step (2); and / or,

[0025] the ejection orifice in step (4) is an ejection orifice that is misaligned with the first ejection orifice in step (2).

[0026] Preferably, in step (3), and / or,

[0027] In step (4), T (i) is less than or equal to 0.85 times the diameter of the ink droplet of this printing.

[0028] The application further provides a grid line prepared by the preparation method.

[0029] The application further provides a solar cell comprising the grid line prepared by the preparation method or the grid line.

[0030] The application has the following advantages:

[0031] The preparation method of the grid line comprises the following steps: (1) forming a metal seed layer on a surface of a substrate layer; the surface of the metal seed layer has a first direction and a second direction perpendicular to each other; (2) performing first printing on the surface of the metal seed layer along the second direction through a plurality of first nozzles with a center distance of T0 to obtain a plurality of first printing strips; the ink drop diameter of the first printing is wherein the plurality of first nozzles are arranged parallel to the first direction; the region between adjacent first printing strips on the surface of the metal seed layer is an initial white region; (3) performing second printing along the second direction through a plurality of second nozzles with a center distance of T0 to obtain a plurality of second printing strips; wherein the plurality of second nozzles are arranged parallel to the first direction and correspond to the plurality of first nozzles in step (2); the ink drop diameter of the second printing is The second printing strips cover part of the initial white region formed in step (2); the second printing strips cover part of the first printing strips; the first printing strips and the second printing strips covering the first printing strips form composite printing strips; in this step, the region between adjacent composite printing strips on the surface of the metal seed layer is a white region; (4) repeating step (3) N times; the nozzles used for each printing are arranged parallel to the first direction, and the ink drop diameter of each printing is less than or equal to the ink drop diameter of the previous printing; the printing strip formed by each printing covers part of the composite printing strip obtained by the previous printing and covers part of the white region obtained by the previous printing; after repeating step (3) N times, the region between adjacent composite printing strips on the surface of the metal seed layer is a target white region; N is an integer greater than or equal to zero; (5) depositing a metal on the target white region to form a metal layer, thereby obtaining the grid line.

[0032] In the present application, the initial white space is formed on the surface of the metal seed layer by the first spray printing; then part of the initial white space is gradually covered by the spray printing of steps (3) and (4), so that the width of the obtained white space gradually decreases, and then the metal is deposited to form the gate line; by using the technical scheme of the present application, the width of the white space between the adjacent composite spray printing bands on the surface of the metal seed layer can be adjusted by multiple spray printing; and by the above adjustment, the width of the white space can be gradually reduced, and the gate line with extremely narrow line width can be prepared according to the production requirements; and when facing the requirement of different width of the gate line, the equipment adjustment cost is low, thereby reducing the production cost; and since the width of the white space is adjusted only by spray printing, additional removal is not required for the spray printing band, thereby improving the material utilization rate; in summary, the method provided by the present application can take into account the adjustment of the gate line width, the gate line with narrow line width is prepared, the material utilization rate is high during the preparation process, and the production cost is low;

[0033] Further, in the technical scheme of the present application, the spray printing is performed by the spray hole with the determined center distance, and the initial white space is gradually covered by multiple spray printing, and the diameter of the ink droplet of the spray printing is less than or equal to the diameter of the ink droplet of the previous spray printing, compared with the way of increasing the diameter of the ink droplet of the spray printing to reduce the width of the white space, the edge jaggedness of the spray printing band can be reduced, the straightness of the edge of the white space can be improved, and finally the gate line with small line width change is obtained, the quality of the gate line is effectively improved, and the quality of the final product is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the specific embodiments of the present application or the technical schemes in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any inventive labor.

[0035] Figure 1 The preparation method of the gate line in an embodiment of the present application;

[0036] Figure 2 、 Figure 3 、 Figure 5 The schematic diagram of the gate line preparation process in an embodiment of the present application;

[0037] Figure 4 The schematic diagram of the spray hole position in an embodiment of the present application;

[0038] Explanation of reference signs:

[0039] 100-first spray printing band; 200-initial white space; 201-white space; 101-second spray printing band; 102-third spray printing band; 10-first spray hole; 20-second spray hole. DETAILED DESCRIPTION

[0040] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0041] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0042] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0043] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0044] Embodiment

[0045] The present embodiment provides a preparation method of a gate line, please refer to Figure 1 , comprising the following steps:

[0046] Step 1: forming a metal seed layer on the surface of the substrate layer; the surface of the metal seed layer has a first direction and a second direction perpendicular to each other;

[0047] Step 2: forming a plurality of first inkjet printing strips by first inkjet printing on the surface of the metal seed layer along the second direction through a plurality of first nozzles with a center distance of T0; the diameter of the ink droplets of the first inkjet printing is Wherein, the plurality of first nozzles are arranged parallel to the first direction; the area between adjacent first inkjet printing strips on the surface of the metal seed layer is an initial white space;

[0048] Step 3: a plurality of second nozzles with a center distance of T0 are used to perform second printing along the second direction to obtain a plurality of second printing strips; wherein the plurality of second nozzles are arranged parallel to the first direction and correspond to the plurality of first nozzles in Step 2; the diameter of the ink droplets in the second printing is The second printing strip covers part of the initial white space formed in step (2); the second printing strip covers part of the first printing strip; the first printing strip and the second printing strip covering it form a composite printing strip; in this step, the area between the adjacent composite printing strips on the surface of the metal seed layer is a white space;

[0049] Step 4: Step 3 is repeated N times; each time, the nozzles used for printing are arranged parallel to the first direction, and the diameter of the ink droplets in the printing is smaller than or equal to the diameter of the ink droplets in the previous printing; each time, the printing strip formed covers part of the composite printing strip obtained in the previous printing and covers part of the white space obtained in the previous printing; after repeating Step 3 N times, the area between the adjacent composite printing strips on the surface of the metal seed layer is a target white space; N is an integer greater than or equal to zero;

[0050] Step 5: a metal layer is deposited on the target white space to form a gate line.

[0051] In the previous research, the inventors increased the diameter of the ink droplets to reduce the width of the white space, thereby narrowing the line width of the gate line; as the diameter of the ink droplets increased, the edge sawtooth degree of the strip-shaped mask layer in the length direction was large, and the line width of the finally prepared gate line varied greatly; the inventors found that the gate line with varying line width had a direct impact on the quality of the final product; and the minimum line width that could be ultimately achieved by increasing the diameter of the ink droplets was large, and the cost was high; and the preparation process of the gate line by the above method had high requirements for the nozzle aperture.

[0052] In the present application, an initial white space is formed on the surface of a metal seed layer by first printing; then part of the initial white space is gradually covered by the printing in steps (3) and (4), so that the width of the obtained white space gradually decreases; and then a metal layer is deposited to form a gate line; by using the technical solution of the present application, the width of the white space between the adjacent composite printing strips on the surface of the metal seed layer can be adjusted by multiple printing; and by adjusting the width of the white space as described above, a very narrow line width of the gate line can be prepared according to the production requirements; when facing different width requirements of the gate line, the equipment adjustment cost is low, thereby reducing the production cost; and since the width of the white space is adjusted only by printing, no additional removal is required for the printing strip, thereby improving the material utilization rate; in summary, the method provided by the present application can adjust the line width of the gate line, the line width of the prepared gate line is narrow, the material utilization rate is high during the preparation process, and the production cost is low;

[0053] Further, in the technical scheme of the present application, by determining the center distance of the jetting hole for jetting, gradually covering the initial blank area by multiple jetting, and jetting the ink droplet diameter less than or equal to the ink droplet diameter of the previous jetting, compared with the method of increasing the jetting ink droplet diameter to reduce the width of the blank area, the edge jaggedness of the jetting ribbon can be reduced, the straightness of the edge of the blank area can be improved, and finally the grid line with smaller line width change can be obtained, the grid line quality can be effectively improved, and the final product quality can be improved.

[0054] In the present embodiment, the jetting material used in jetting is selected from a hot melt material, wherein the hot melt material has fluidity at greater than or equal to 50°C, and the viscosity is 0.1 mPa·S to 20 mPa·S; and when at less than or equal to 25°C, the hot melt material is solid or fluid, when it is fluid, the viscosity of the hot melt material is greater than 10,000 mPa·S.

[0055] In a specific embodiment of the present application, the jetting material used in jetting is selected from one or more of acrylate, rosin ester resin, C11-C22 alkyl acid, polypropylene wax, microcrystalline wax, polyethylene wax or ethylene-vinyl acetate copolymer wax.

[0056] In Step 4 of the present embodiment, Step 3 is repeated N times, N is an integer selected from 0-3, for example 0, 1, 2, 3; when N is 0, it means that Step 4 is not performed, and after Step 3 is completed, the step of forming a metal layer is performed.

[0057] In the present embodiment, a metal seed layer is formed on the surface of the substrate layer; the surface of the metal seed layer has a first direction and a second direction perpendicular to each other.

[0058] The following will be described in detail in conjunction with Figure 2 , Figure 3 , Figure 5

[0059] Reference Figure 2 , a plurality of first jetting holes with a center distance of T0 are used to perform first jetting on the surface of the metal seed layer along the second direction S2 to obtain a plurality of first jetting ribbons 100; the ink droplet diameter of the first jetting is wherein the plurality of first jetting holes are arranged parallel to the first direction S1; the area between adjacent first jetting ribbons 100 on the surface of the metal seed layer is an initial blank area 200; the width of the initial blank area 200 is

[0060] In one embodiment, the center distance T0 of the first jetting hole is 63.5 μm;

[0061] In one embodiment, the ink droplet diameter of the first jetting is 10 μm;​

[0062] Reference Figure 3 The second printing is performed along the second direction by a plurality of second nozzles with a center distance of T0 to obtain a plurality of second printing strips 101; wherein the plurality of second nozzles are arranged parallel to the first direction S1 and correspond to the plurality of first nozzles in Step 2; the diameter of the ink droplets of the second printing is The second printing strips cover part of the initial white area 200, and the width of the covered initial white area is T1, and The second printing strips 101 cover part of the first printing strips 100, and the width of the covered first printing strips is The first printing strips 100 and the second printing strips covering them form a composite printing strip, and the area between the adjacent composite printing strips on the surface of the metal seed layer is a newly obtained white area 201, and the width of the white area 201 is

[0063] In one specific embodiment, If T1 is greater than The composite printing strip formed by the second printing strips and the first printing strips covering them is prone to have an area not filled with the printing material, which will directly affect the quality of the final product.

[0064] In one specific embodiment, the second printing is performed after the first printing is completed and the first nozzles are translated along the first direction S1.

[0065] In actual production, when preparing a target width of the grid line, if the specific width of the white area is directly obtained by a single printing of ink droplets, the dependence on the nozzles of the printhead is high, and a printhead with a specific size nozzle needs to be customized, and a specific diameter of the ink droplets needs to be formed during printing. However, by using the above-mentioned embodiment, the width of the white area is gradually reduced by multiple printing to prepare a target width of the grid line. In the preparation process, the nozzles of a single printhead are the same, and only the sum of the distances moved during multiple printing needs to be adjusted to a specific width to achieve the preparation of the target width of the grid line. The dependence on the printhead is low during the entire preparation process, and the control accuracy requirement of the diameter of the ink droplets formed by the printing is low.

[0066] In another specific embodiment, the second printing is performed by the second nozzles 20 arranged in a staggered manner with the first nozzles 10 (the position of the printhead is shown in Figure 4

[0067] ​In the present application, the plurality of nozzles are arranged in a staggered manner, so that the staggered arrangement between corresponding nozzles is realized, and a narrower white space is obtained in the inkjet printing. In the preparation of the target width gate line, by adjusting the number of nozzles and / or adjusting the staggered distance between nozzles, the target width white space can be obtained, and finally the target width gate line is obtained. The preparation process has low dependence on the nozzle aperture, and the control accuracy of the ink droplet diameter is also low.

[0068] Reference Figure 5 , a third inkjet printing (repeating the second inkjet printing process) is performed, the nozzles used in the third inkjet printing are arranged in parallel to the first direction S1, and the ink droplet diameter used in the third inkjet printing is less than or equal to the ink droplet diameter used in the second inkjet printing; the third inkjet printing forms a third inkjet printing belt 102 covering part of the composite inkjet printing belt obtained by the second inkjet printing, and covering the white space 201 formed by the previous inkjet printing. The width of the white space 201 formed by the previous inkjet printing which is covered is T (1) After the third inkjet printing is completed, a new white space 201 is obtained on the surface of the metal seed layer, and the width of the white space 201 after the third inkjet printing is completed is

[0069] In one specific embodiment, the white space 201 obtained after the third inkjet printing is the target white space, and the metal is deposited on the white space 201 obtained after the third inkjet printing to form a metal layer, thereby obtaining the gate line to be prepared.

[0070] For a plurality of nozzles, the nozzles are arranged in a staggered manner between adjacent nozzles. The apertures of the nozzles can be the same or different. There is no special limitation on the specific aperture and the specific ink droplet diameter. Only the size relationship between the ink droplets ejected from the nozzles of adjacent nozzles needs to be adjusted. The sum of the staggered distances between the nozzles before inkjet printing can also achieve the preparation of the target width gate line, which has low dependence on the nozzles and low control accuracy of the ink droplet diameter.

[0071] In one specific embodiment, if T (1) is greater than When the third inkjet printing belt covers the composite inkjet printing belt obtained after the second inkjet printing, the area not covered by the inkjet printing material is easy to appear, that is, the third inkjet printing belt and the composite inkjet printing belt obtained after the second inkjet printing are easy to directly expose the metal seed layer, which will directly affect the quality of the final product.

[0072] In one specific embodiment, the third inkjet printing is not performed after the second inkjet printing is completed, that is, the initial white space 200 is the target white space, and the metal is deposited on the initial white space 200 formed after the second inkjet printing to form a metal layer, thereby obtaining the gate line to be prepared.

[0073] In another embodiment, the third printing is completed, and the white space 201 obtained after the third printing is the target white space. A metal layer is deposited on the white space 201 obtained after the third printing, and the gate line to be prepared is obtained.

[0074] In other embodiments, after the third printing is completed, the second printing process is continued multiple times to gradually narrow the width of the strip-shaped white space, and the target white space is obtained. Finally, a metal layer is deposited on the target white space to obtain the gate line to be prepared.

[0075] In one embodiment, the line width of the gate line is 5-20 μm, such as 5 μm, 10 μm, 15 μm, or 20 μm.

[0076] In other embodiments, the width of the white space to be prepared can be adjusted according to actual production needs, and the width can be less than 10 μm.

[0077] In one embodiment, the method of depositing the metal is electroplating, electroless plating, physical vapor deposition, or chemical vapor deposition.

[0078] In one embodiment, the process of the metal seed layer is chemical vapor deposition or physical vapor deposition. For example, a copper layer is deposited on the surface of the substrate by physical vapor deposition, and the thickness of the copper layer is 100-1000 nm, such as 100 nm, 200 nm, 300 nm, 500 nm, or 800 nm.

[0079] In one embodiment, the metal seed layer material is copper. In other embodiments, the metal seed layer can be other metal materials, such as aluminum or silver.

[0080] In one embodiment, after the gate line is formed, the process of sequentially removing the printing material on the surface of the metal seed layer and the metal seed layer not covered by the gate line is further included.

[0081] In one embodiment, the printing material on the surface of the metal seed layer can be removed by a corresponding existing solvent cleaning.

[0082] In one embodiment, the metal seed layer material is copper, and the metal seed layer not covered by the gate line is removed by an etching method of a CuCl2alkaline etching solution / sulfuric acid hydrogen peroxide in the prior art.

[0083] Obviously, the above embodiments are only examples for the sake of clarity, and are not intended to limit the embodiments. Based on the above description, other different forms of changes or variations can be made by those of ordinary skill in the art. Here, it is not necessary and impossible to exhaust all embodiments. The obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A method of producing a gate line, characterized by, The method comprises the following steps: (1) forming a metal seed layer on the surface of a substrate layer; the surface of the metal seed layer has a first direction and a second direction perpendicular to each other; (2) performing first printing on the surface of the metal seed layer along the second direction through a plurality of first nozzles with a center distance of T0 to obtain a plurality of first printing strips; the diameter of the ink droplets in the first printing is φ1, and T0> φ1; wherein the plurality of first nozzles are arranged parallel to the first direction; the area between adjacent first printing strips on the surface of the metal seed layer is an initial white area; (3) performing second printing along the second direction through a plurality of second nozzles with a center distance of T0 to obtain a plurality of second printing strips; wherein the plurality of second nozzles are arranged parallel to the first direction and correspond to the plurality of first nozzles in step (2); the diameter of the ink droplets in the second printing is φ2, and φ2≤ φ1; the second printing strip covers part of the initial white area formed in step (2); the second printing strip covers part of the first printing strip; the first printing strip and the second printing strip covering it form a composite printing strip; in this step, the area between adjacent composite printing strips on the surface of the metal seed layer is a white area; (4) repeating step (3) N times; the nozzles used in each printing are arranged parallel to the first direction, the diameter of the ink droplets in the printing is less than or equal to the diameter of the ink droplets in the previous printing; the printing strip formed in each printing covers part of the composite printing strip obtained in the previous printing, and covers part of the white area obtained in the previous printing; after repeating step (3) N times, the area between adjacent composite printing strips on the surface of the metal seed layer is a target white area; N is an integer greater than or equal to zero; (5) depositing a metal on the target white area to form a metal layer, thereby obtaining the gate line; The width of the initial white area in step (2) is T0-φ1; In step (3), the second printing strip covers part of the initial white area, and the width of the covered initial white area is T1, T1< T0-φ1 and T1< φ2; The second printing strip covers part of the first printing strip, and the width of the covered first printing strip is φ2-T1; the width of the white area obtained in step (3) is T0-φ1-T1; In step (4), the printing tape covering part of the blank area obtained by the previous printing is formed by printing in the i-th repetition of step (3) for N times （i） ; i is an integer between 0 and N; after repeating step (3) for N times, the width of the target blank area obtained is .

2. The production method according to claim 1, characterized by, The substrate layer is a silicon wafer.

3. The preparation method according to claim 1, characterized in that, In step (5), the method of depositing the metal is selected from electroplating, electroless plating, physical vapor deposition or chemical vapor deposition.

4. The preparation method according to claim 3, characterized in that, After the gate line is formed, the process of sequentially removing the printing material on the surface of the metal seed layer and the metal seed layer not covered by the gate line is further included.

5. The preparation method according to claim 1, characterized in that, The printing material used in the printing is selected from hot melt materials, wherein the hot melt material has fluidity at a temperature greater than or equal to 50°C, and the viscosity is 0.1 mPa·S~20 mPa·S; and when the temperature is less than or equal to 25°C, the hot melt material is a solid or a fluid, and when it is a fluid, the viscosity of the hot melt material is greater than 10,000 mPa·S.

6. The preparation method according to claim 1, characterized in that, The printing material used in the printing is selected from one or more of acrylate, rosin ester resin, C11-C22 alkyl acid, polypropylene wax, microcrystalline wax, polyethylene wax, and ethylene-vinyl acetate copolymer wax.

7. The preparation method according to claim 1, characterized in that, the ink droplet diameter in step (3) is the same as the ink droplet diameter in step (2); the second ejection orifice in step (3) is the ejection orifice after the first ejection orifice in step (2) is translated in the first direction; and / or, the ink droplet diameter in step (4) is the same as the ink droplet diameter in step (2); the ejection orifice in step (4) is the ejection orifice after the first ejection orifice in step (2) is translated in the first direction.

8. The preparation method according to claim 1, characterized in that, the second ejection orifice in step (3) is the ejection orifice that is misaligned with the first ejection orifice in step (2); and / or, the ejection orifice in step (4) is the ejection orifice that is misaligned with the first ejection orifice in step (2).

9. The method of claim 1, wherein, in step (3), T1≤0.85φ2; and / or, In step (4), T （i） less than or equal to 0.85 times the diameter of the ink droplet of the current jet.

10. A gate line, characterized by obtained by the preparation method of any one of claims 1-8.

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