MLED substrate and manufacturing method thereof

Abstract

The invention relates to the technical field of MLED display, and discloses an MLED substrate which comprises a substrate body, a metal wire layer is arranged on the substrate body, the surface of the side, away from the substrate body, of the metal wire layer is covered with a first protection layer, the thickness of the metal wire layer ranges from 4000 A to 6000 A, the thickness of the first protection layer ranges from 300 A to 1000 A, and the thickness of the second protection layer ranges from 300 A to 1000 A. And the metal wire layer and the first protection layer adopt the same coating process. According to the scheme, the first protection layer covers the metal wire layer, so that the anti-oxidation performance of the metal wire layer is improved, meanwhile, the metal conducting layer and the first protection layer adopt the same manufacturing process, the manufacturing process can be simplified, and the production cost is reduced. The invention further discloses a manufacturing method of the MLED substrate base plate.

Description

Technical Field

[0001] The invention relates to the technical field of MLED display, and in particular to an MLED substrate base plate and a manufacturing method thereof. Background Art

[0002] MLED includes Mini LED and Micro LED, which generally have more than 2 layers of metal conductive materials. When making circuit boards, Cu material is usually selected as the material for making metal circuits because of its excellent conductivity, ductility and thermal conductivity. In existing MLED products, the Cu metal surface is easily chemically reacted with oxygen, water vapor, CO2, etc. in the air, resulting in the change of conductivity of the Cu film layer and loss of function. Since MLED usually uses different substrates, the anti-oxidation process of metal circuits used on different substrates is also different. For example, in PCB boards, the process scheme of rolled copper foil and yellow light etching is usually used for circuit production. To prevent the oxidation of Cu circuits, electroplating or nickel-gold film layer is used to protect the Cu circuits; while the glass substrate is made by vacuum magnetron sputtering Cu thin film and then yellow light etching process scheme. To prevent the oxidation of Cu circuits, electroplating or nickel-gold film layer is used to protect the Cu circuits. However, the current electroplating or nickel-gold anti-oxidation scheme has a complex overall process and high cost, and also brings problems such as environmental pollution.

[0003] Therefore, how to improve the anti-oxidation effect of the Cu film while reducing costs, simplifying processes and avoiding environmental pollution has become an urgent problem to be solved in the industry. Summary of the invention

[0004] The present invention aims to solve at least one of the problems in the background technology. To this end, the present invention provides an MLED substrate and a manufacturing method thereof, wherein the MLED substrate is provided with a first protective layer on the metal wire layer, thereby improving the anti-oxidation performance of the metal wire layer, and the metal conductive layer and the first protective layer are manufactured using the same process, thereby simplifying the processing steps and reducing the production cost.

[0005] According to an embodiment of the first aspect of the present invention, an MLED substrate substrate comprises a substrate, on which a metal wire layer is arranged, and a surface of the metal wire layer on a side away from the substrate is covered with a first protective layer, the thickness of the metal conductive layer is 4000-6000A, the thickness of the first protective layer is 300-1000A, and the metal wire layer and the first protective layer are produced using the same coating process.

[0006] According to another embodiment of the present invention, the metal wire layer is a copper wire layer.

[0007] According to another embodiment of the present invention, a second protective layer is provided between the copper wire layer and the first protective layer.

[0008] According to another embodiment of the present invention, the second protective layer is a metal layer of copper, nickel, titanium, or an alloy layer containing at least two of copper, nickel, and titanium.

[0009] According to another embodiment of the present invention, the thickness of the second protective layer is 500-2000 Å.

[0010] According to another embodiment of the present invention, the substrate is at least one of a PCB board, a glass substrate, a PI substrate or a BT substrate.

[0011] A method for manufacturing an MLED substrate according to an embodiment of the second aspect of the present invention includes:

[0012] providing a substrate;

[0013] forming a metal conductor layer above the substrate;

[0014] forming a first protective layer on the metal wire layer;

[0015] Circuit patterning is performed based on the metal conductive layer and the first protective layer.

[0016] According to another embodiment of the present invention, the step of forming a metal wire layer above the substrate and the step of forming a first protective layer based on the metal wire layer further includes:

[0017] Based on the metal wire layer, a second protective layer is formed on the surface of the metal conductive layer.

[0018] According to another embodiment of the present invention, the metal wire layer and the first protective layer are formed by the same coating process.

[0019] According to another embodiment of the present invention, the metal wire layer is a copper wire layer, and the material of the first protective layer and / or the second protective layer includes one or more of gold, copper, nickel, chromium, titanium or molybdenum.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The invention discloses an MLED substrate, including a substrate, a metal wire layer is arranged on the substrate, a first protective layer is covered on a side of the metal wire layer away from the substrate, the thickness of the metal conductive layer is 4000-6000A, the thickness of the first protective layer is 300-1000A, and the metal wire layer and the first protective layer adopt the same coating process. By covering the metal wire layer with a first protective layer, the anti-oxidation performance of the metal wire layer is improved, and at the same time, the metal conductive layer and the first protective layer adopt the same process, which can simplify the processing procedures and reduce the production cost.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings:

[0024] Figure 1 A cross-sectional schematic diagram of an embodiment of an MLED substrate provided in the present application;

[0025] Figure 2 A cross-sectional schematic diagram of another embodiment of the MLED substrate provided in the present application;

[0026] Figure 3 A cross-sectional schematic diagram of another embodiment of the MLED substrate provided in the present application;

[0027] Figure 4 A schematic diagram of a process flow of an embodiment of a method for manufacturing an MLED substrate provided in the present application;

[0028] Figure 5 A schematic flow chart of another embodiment of a method for manufacturing an MLED substrate provided in the present application;

[0029] The meanings of the marks in the figure are:

[0030] 100. Substrate;

[0031] 200, metal conductor layer;

[0032] 300, first protective layer;

[0033] 400. Second protective layer. DETAILED DESCRIPTION

[0034] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] In the description of the present invention, it is to be understood that a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0036] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] To illustrate the MLED substrate and the manufacturing method thereof provided in the present application, the following is a detailed description in conjunction with the accompanying drawings and the textual description of the embodiments.

[0038] Reference below Figure 1-Figure 3 An MLED substrate according to an embodiment of the first aspect of the present invention is described. Figure 1 and Figure 2 As shown, the MLED substrate includes a substrate, specifically, a metal wire layer is arranged on the substrate, and a first protective layer is covered on a surface of the metal wire layer away from the substrate. Furthermore, the thickness of the metal conductive layer is 4000-6000A, and the thickness of the first protective layer is 300-1000A. It can be understood that the thickness of the first protective layer needs to be smaller than the thickness of the metal conductive layer to avoid the first protective layer affecting the conductive performance of the metal wire layer. Furthermore, the metal wire layer and the first protective layer adopt the same coating process. By adopting the same coating process for the metal wire layer and the first protective layer, the processing steps can be simplified and the production cost can be reduced.

[0039] It should be noted that the metal wire layer may be a copper wire layer, a silver wire layer or other conductive metal layers.

[0040] It should be noted that the metal wire layer and the first protective layer can be prepared by magnetron sputtering.

[0041] It should be noted that the material of the first protective layer may include one or more of gold (Au), copper (Cu), nickel (Ni), chromium (Cr), titanium (Ti) or molybdenum (Mo). For example, the first protective layer may be a gold-copper alloy layer, a nickel-chromium alloy layer or a copper-nickel-titanium alloy layer.

[0042] According to one embodiment of the present invention, Figure 1 and Figure 2 As shown, the metal wire layer is a copper wire layer. It can be understood that copper material can be selected as the material for making the metal circuit because copper material has excellent electrical conductivity, ductility and thermal conductivity.

[0043] According to one embodiment of the present invention, Figure 2 As shown, a second protective layer is provided between the copper conductor layer and the first protective layer. It can be understood that by providing the second protective layer, the protective effect can be further enhanced and the anti-oxidation ability of the surface of the copper conductor layer can be improved.

[0044] It should be noted that there is at least one difference between the first protective layer and the second protective layer in terms of material composition, thickness, etc.

[0045] According to one embodiment of the present invention, Figure 2 As shown, the second protective layer is a metal layer of Cu, Ni, Ti, or an alloy layer containing at least two of Cu, Ni, and Ti. For example, the second protective layer is a copper-nickel alloy layer.

[0046] It should be noted that, in other embodiments, the second protective layer may also be made of other materials. For example, the second protective layer may include gold (Au), chromium (Cr) or molybdenum (Mo).

[0047] According to one embodiment of the present invention, Figure 2 As shown, the thickness of the second protective layer is 500-2000A.

[0048] According to one embodiment of the present invention, Figure 1-Figure 3 As shown, the substrate may be at least one of a PCB (Printed Circuit Board) board, a glass substrate, a polyimide (PI) substrate or a BT (Bismaleimide Triazine) resin substrate.

[0049] Reference below Figure 4 and Figure 5 A method for manufacturing an MLED substrate according to an embodiment of the second aspect of the present invention is described as follows: Figure 4 As shown, the steps include:

[0050] Step S100: providing a substrate;

[0051] Specifically, the substrate may be one or more of a PCB (Printed Circuit Board) board, a glass substrate, a polyimide (PI) substrate or a BT (Bismaleimide Triazine) resin substrate.

[0052] Step S200: forming a metal wire layer above the substrate;

[0053] Step S300: forming a first protective layer on the metal wire layer;

[0054] Specifically, the metal wire layer and the first protective layer may be prepared by magnetron sputtering.

[0055] Step S400: patterning the circuit based on the metal conductive layer and the first protective layer.

[0056] Specifically, fine patterning can be performed through yellow light processing.

[0057] It should be noted that, after the step S400: patterning of the circuit based on the metal conductive layer and the first protective layer, Figure 3 As shown, the process may further include step S500: manufacturing circuits by chemical wet etching, laser dry etching and other processes, and removing the redundant metal conductor layer and the first protective layer outside the pattern.

[0058] It should be noted that the metal conductive layer may be a copper wire layer, a silver wire layer or other conductive metal layers.

[0059] It can be seen that by covering the metal wire layer with a first protective layer, the anti-oxidation performance of the metal wire layer is improved.

[0060] According to one embodiment of the present invention, Figure 5 As shown, between step S200: forming a metal wire layer on the substrate and step S300: forming a first protective layer on the metal wire layer, there are also steps:

[0061] S201: Based on the metal wire layer, a second protective layer is formed on the surface of the metal conductive layer.

[0062] By providing a second protective layer, the protective effect can be further enhanced and the anti-oxidation ability of the surface of the copper conductor layer can be improved.

[0063] According to an embodiment of the present invention, the metal wire layer and the first protective layer are formed using the same coating process.

[0064] By adopting the same manufacturing process for the metal conductive layer and the first protective layer, the manufacturing process can be simplified and the production cost can be reduced.

[0065] According to one embodiment of the present invention, Figure 1-Figure 3 As shown, the metal wire layer is a copper wire layer, and the material of the first protective layer and / or may include one or more of gold (Au), copper (Cu), nickel (Ni), chromium (Cr), titanium (Ti) or molybdenum (Mo).

[0066] The MLED substrate substrate and its manufacturing method provided above for this application are preferred embodiments and should not be understood as limiting the scope of protection of the present application. Those skilled in the art should know that various improvements or replacements can be made without departing from the concept of this application. All improvements or replacements should be within the scope of protection of the present application, that is, the scope of protection of the present application should be based on the claims.

[0067] In the absence of conflict, the above embodiments and features in the embodiments may be combined with each other.

Claims

1. An MLED substrate substrate, It is characterized in that It includes a substrate, on which a metal wire layer is arranged, and a surface of the metal wire layer away from the substrate is covered with a first protective layer, the thickness of the metal conductive layer is 4000-6000A, the thickness of the first protective layer is 300-1000A, and the metal wire layer and the first protective layer adopt the same coating process.

2. The MLED substrate according to claim 1, It is characterized in that The metal wire layer is a copper wire layer.

3. The MLED substrate according to claim 2, It is characterized in that A second protective layer is arranged between the copper wire layer and the first protective layer.

4. The MLED substrate substrate according to claim 3, It is characterized in that The second protective layer is a metal layer of copper, nickel, titanium, or an alloy layer containing at least two of copper, nickel, and titanium.

5. The MLED substrate according to claim 3, It is characterized in that The thickness of the second protective layer is 500-2000A.

6. The MLED substrate substrate according to claim 1, It is characterized in that The substrate is at least one of a PCB board, a glass substrate, a PI substrate or a BT substrate.

7. A method for manufacturing an MLED substrate. It is characterized in that include: providing a substrate; forming a metal conductor layer above the substrate; forming a first protective layer on the metal wire layer; Circuit patterning is performed based on the metal conductive layer and the first protective layer.

8. The method for manufacturing the MLED substrate according to claim 7, It is characterized in that The step of forming a metal wire layer above the substrate and forming a first protective layer based on the metal wire layer further includes: Based on the metal wire layer, a second protective layer is formed on the surface of the metal conductive layer.

9. The method for manufacturing the MLED substrate according to claim 7, It is characterized in that The metal wire layer and the first protective layer are produced using the same coating process.

10. The method for manufacturing the MLED substrate according to claim 7, It is characterized in that The metal wire layer is a copper wire layer, and the material of the first protective layer and / or the second protective layer includes one or more of gold, copper, nickel, chromium, titanium or molybdenum.

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