Display apparatus and apparatus for manufacturing same

Abstract

A display apparatus and an apparatus for manufacturing the same are provided. An apparatus for manufacturing a display apparatus includes: a chamber in which a display substrate and a mask assembly are disposed; a first support member supporting the display substrate; a second support supporting the mask assembly to face the display substrate; and a source facing the mask assembly and ejecting a deposition material to the display substrate, in which the mask assembly includes a mask sheet including an opening through which the deposition material passes, and the mask sheet further includes: a body portion including an opening; a rib extending to the body portion and dividing the opening into two regions; and a shielding portion extending to the rib, protruding from a surface of the rib toward the display substrate, and shielding the deposition material.

Description

[0001] This application is a divisional application of patent application 202011094878.8, filed on October 14, 2020, entitled “Display device and device for manufacturing display device”. Technical Field

[0002] One or more embodiments relate to apparatus related to manufacturing a display device. Background Art

[0003] The applications of display devices have recently been diversified. In addition, as display devices have become thinner and lighter, their scope of use has increased.

[0004] The display area of ​​the display device has increased, and various functions applicable to or linked to the display device have also been added. In order to increase the display area and also add various functions, a display device capable of having various components arranged in the display area has been studied.

[0005] It will be understood that this background in the technical section is intended, in part, to provide a useful background for understanding the technology. However, this background in the technical section may also include ideas, concepts or realizations that were not known or appreciated by a person skilled in the relevant art prior to the corresponding effective filing date of the subject matter disclosed herein. Summary of the invention

[0006] Embodiments may include an apparatus for manufacturing a display device, which may include a display panel having an area in which various kinds of components may be disposed in a display area. However, the embodiments are merely examples, and the scope of the disclosure is not limited thereto.

[0007] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented disclosed embodiments.

[0008] According to an embodiment, a display device may include: a substrate, including a first display area, an opening area located in the first display area, a peripheral area surrounding at least a portion of the opening area, and a second display area extending from the peripheral area to an edge of the first display area; a pixel defining layer, disposed on the substrate and including a first opening located in the first display area and a second opening located in the second display area; a first common layer, disposed in the first opening; and a second common layer, disposed in the second opening.

[0009] The first common layer and the second common layer may include at least one of: a counter electrode disposed throughout the first display area and the second display area; and at least one of intermediate layers disposed between the substrate and the counter electrode.

[0010] The edge of the first display area may be rectangular, and the second display area may be diagonally disposed to face a vertex of the first display area.

[0011] The thickness of the first common layer may be greater than the thickness of the second common layer.

[0012] The thickness of the first common layer may be substantially the same as the thickness of the second common layer.

[0013] The thickness of the second common layer may decrease in a direction from an edge of the second common layer to a center of the second common layer.

[0014] The through hole may be provided in the opening region.

[0015] According to an embodiment, an apparatus for manufacturing a display device may include: a chamber in which a display substrate and a mask assembly are disposed; a first support member supporting the display substrate; a second support member supporting the mask assembly to face the display substrate; and a source facing the mask assembly and spraying a deposition material to the display substrate. The mask assembly may include a mask sheet including an opening through which the deposition material passes. The mask sheet may also include: a main body portion including an opening; a rib extending to the main body portion and dividing the opening into two areas; and a shielding portion extending to the rib, protruding from a surface of the rib toward the display substrate, and shielding the deposition material.

[0016] The opening may be rectangular, and the ribs may be disposed in a diagonal direction to face a vertex of the opening.

[0017] A first distance from a surface of the shielding portion facing the display substrate to a surface of the rib facing the display substrate may be equal to or greater than 2.7×10 of a second distance from the source to a surface of the rib facing the source. -4 times.

[0018] At least one of the body portion, the ribs, and the shield portion may include carbon fiber.

[0019] The ribs and the shielding portion may include carbon fibers, and the ribs may be attached to the body portion by an adhesive material.

[0020] The body portion may include a seating groove into which the rib may be inserted and seated.

[0021] The deposited material can form at least one of: a counter electrode, arranged throughout the first display area and the second display area of ​​the display substrate; and at least one of the intermediate layers, which is arranged between the display substrate and the counter electrode, wherein the thickness of the deposited material in the first display area can be different from the thickness of the deposited material in the second display area.

[0022] The mask sheet may further include a magnet disposed in the body portion.

[0023] According to an embodiment, a method for manufacturing a display device may include: setting a display substrate and a mask assembly in a chamber; aligning the display substrate with the mask assembly; supplying a deposition material from a source to the display substrate through the mask assembly; and forming an opening area in the display substrate by selectively blocking the deposition material passing through an opening of the mask assembly, wherein the display substrate may further include a first display area and a second display area in addition to the opening area, and a thickness of the deposition material in the first display area may be different from a thickness of the deposition material in the second display area.

[0024] The thickness of the deposited material in the first display area may be greater than the thickness of the deposited material in the second display area.

[0025] The thickness of the deposited material in the second display region may vary in the width direction of the second display region.

[0026] The thickness of the deposition material in the second display area may decrease in a direction from an edge of the second display area to a center of the second display area.

[0027] The first display area may be rectangular, and the second display area may be diagonally disposed to face a vertex of the first display area.

[0028] The mask assembly may include a mask sheet, the mask sheet including an opening, and the mask sheet may also include: a main body portion including the opening; a rib extending to the main body portion and dividing the opening into two areas; and a shielding portion extending to the rib, protruding from a surface of the rib toward a display substrate, and shielding a deposited material.

[0029] These and / or other aspects will become apparent and more easily understood through the following description of embodiments in conjunction with the accompanying drawings.

[0030] These general and specific embodiments may be implemented by using a system, a method, a computer program, or a combination thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other aspects, features and advantages of certain disclosed embodiments will become more apparent through the following description in conjunction with the accompanying drawings, in which: Figure 1 is a schematic perspective view of a display device according to an embodiment; Figure 2 is a schematic cross-sectional view of a display device according to an embodiment; Figure 3 is a schematic cross-sectional view of a display device according to another embodiment; Figure 4 is a schematic plan view of a display panel according to an embodiment; Figure 5is a schematic circuit diagram of a pixel in a display panel according to an embodiment; Figure 6 is a schematic cross-sectional view of a display panel according to an embodiment; Figure 7 It is shown Figure 4 A schematic cross-sectional view of a first display area of ​​a display panel; Figure 8 It is shown Figure 4 A schematic cross-sectional view of a second display area of ​​a display panel; Fig. 9 is a schematic cross-sectional view of a display panel according to another embodiment; Fig.10 is a schematic cross-sectional view of a display panel according to another embodiment; Fig.11 is a schematic cross-sectional view of a display panel according to another embodiment; Fig.12 yes Fig.11 A schematic cross-sectional view of a display panel; Fig.13 is a schematic cross-sectional view of a display panel according to another embodiment; Fig.14 is a schematic cross-sectional view of a display panel according to another embodiment; Fig.15 is a schematic cross-sectional view of an apparatus for manufacturing a display device according to an embodiment; Fig.16 According to the embodiment Fig.15 A schematic perspective view of a mask assembly shown in FIG. Fig.17 According to the embodiment Fig.16 A schematic cross-sectional view of the mask sheet taken along line CC'; Fig.18 According to another embodiment Fig.15 A schematic cross-sectional view of a mask sheet; Fig.19 According to another embodiment Fig.15 A schematic cross-sectional view of a mask sheet; and Fig. 20 is a diagram showing a through Figures 17 to 19 Schematic cross-sectional view of deposition of rib deposition material on a display substrate is shown in FIG. DETAILED DESCRIPTION

[0032] Now will refer to the embodiment in detail, the example of embodiment is shown in the accompanying drawings, wherein the same reference numerals always refer to the same element. Redundant explanation can be omitted. The embodiment can have different forms and should not be interpreted as being limited to the description set forth herein. Therefore, the embodiment is described below only by reference to the accompanying drawings to explain the described aspects. As used herein, the term "and / or" includes any combination and all combinations of one or more related listed items. The terms "and" and "or" can be used in the sense of combination or separation, and can be understood to be equivalent to "and / or". Throughout the disclosure, the expression "at least one (kind / person) of a, b and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c or its variant.

[0033] It will be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another component.

[0034] As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0035] It will also be understood that the terms “comprises,” “comprising,” “including,” and variations thereof, used herein indicate the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0036] It will be understood that when a layer, region, or component is referred to as being "on," "formed on," etc., relative to another layer, region, or component, the layer, region, or component may be directly or indirectly formed on the other layer, region, or component. For example, there may be intervening layers, regions, or components.

[0037] For the convenience of explanation, the size of the elements in the drawings may be exaggerated. In other words, since the size and thickness of the components in the drawings may be arbitrarily shown for the convenience of explanation, the following embodiments are not limited thereto.

[0038] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0039] The term "overlying" may include layered, stacked, facing and variations thereof, extending across, covering or partially covering, or any other suitable term as would be appreciated and understood by one of ordinary skill in the art.

[0040] The phrase "non-overlapping" may include "spaced from" or "separated from" or "offset from" and any other suitable equivalents as would be appreciated and understood by one of ordinary skill in the art.

[0041] When specific embodiments can be implemented differently, the specific process order can be performed in a different order than described. For example, two consecutively described processes can be performed substantially simultaneously or in a reverse order to the described order.

[0042] Figure 1 is a schematic perspective view of a display device 1 according to the embodiment.

[0043] Reference Figure 1 , the display device 1 may include an opening area OP (e.g., a first area), a first display area DA1, and a second display area DA2 extending to the opening area OP. The first display area DA1 and the second display area DA2 may correspond to a second area surrounding at least a portion of the opening area OP. The display device 1 may be configured by using pixels P (see FIG. 1 ) disposed (e.g., arranged) in the first display area DA1 and the second display area DA2. Figure 4 ) to provide a specific image. Figure 1 FIG. 1 shows that an opening area OP can be set inside the first display area DA1, and the opening area OP can be completely surrounded by the first display area DA1. The opening area OP can be set to be referred to later. Figure 2 Describes the area of ​​the component.

[0044] The second non-display area NDA2 as the third area may be disposed between the opening area OP and the first display area DA1 as the second area. In at least some embodiments, the second non-display area NDA2 may be considered as a peripheral area. The first display area DA1 may be surrounded by the first non-display area NDA1 as the fourth area. The second display area DA2 may extend to the first non-display area NDA1. In other words, the second display area DA2 may extend from the edge of the second non-display area NDA2 to the edge of the first display area DA1. Figure 1 As shown in , the edge of the first display area DA1 is rectangular, and the second display area DA2 is diagonally disposed to face the vertex of the first display area DA1. The second non-display area NDA2 and the first non-display area NDA1 may be non-display areas where no pixels P may be disposed. The second non-display area NDA2 may be completely surrounded by the first display area DA1 and the second display area DA2, and the first display area DA1 may be completely surrounded by the first non-display area NDA1.

[0045] Although an organic light emitting display will now be shown and described as the display device 1, the display device 1 is not limited thereto. According to another embodiment, a different type of display device may be used, such as a quantum dot light emitting display.

[0046] Although a single opening area OP may be included in Figure 1 in and Figure 1 The opening area OP may be approximately circular, but the embodiment is not limited thereto. The number of the opening areas OP may be two or more, and the shape of each opening area OP may be any of various shapes such as a circular shape, an elliptical shape, a polygonal shape, a star shape, a diamond shape, etc.

[0047] Figure 2 is a schematic cross-sectional view of a display device 1 according to the embodiment. Figure 3 is a schematic cross-sectional view of a display device 1 according to another embodiment. Figure 2 and Figure 3 Shown along Figure 1 A cross-sectional view taken along line AA'.

[0048] Reference Figure 2 and Figure 3 , the display device 1 may include a display panel 10, and an input sensing layer 40 and an optical functional layer 50 disposed (e.g., sequentially disposed) on the display panel 10. These layers may be covered by a window 60. The display device 1 may be any of various electronic devices such as a mobile phone, a notebook computer, and a smart watch.

[0049] The display panel 10 may display an image. The display panel 10 may include pixels P disposed in a first display area DA1 and a second display area (not shown). Each pixel P may include a display element and a pixel circuit PC (see FIG. 1 ) connected to the display element. Figure 5 ). The display element may include an organic light emitting diode, a quantum dot organic light emitting diode, etc.

[0050] The input sensing layer 40 may obtain coordinate information corresponding to an external input (e.g., a touch event). The input sensing layer 40 may include a sensing electrode (or a touch electrode) and a trace connected to the sensing electrode. The input sensing layer 40 may be disposed on the display panel 10. The input sensing layer 40 may sense an external input according to a mutual capacitance method and / or a self-capacitance method.

[0051] The input sensing layer 40 may be formed (e.g., directly formed) on the display panel 10, or may be formed separately and bonded to the display panel 10 by using an adhesive layer such as an optically transparent adhesive. For example, the input sensing layer 40 may be continuously formed after a process of forming the display panel 10. The input sensing layer 40 may be understood as a part of the display panel 10, and in an embodiment, an adhesive layer may not be provided between the input sensing layer 40 and the display panel 10. Figure 2 It is shown that the input sensing layer 40 may be located between the display panel 10 and the optical functional layer 50. However, according to another embodiment, the input sensing layer 40 may be located on the optical functional layer 50.

[0052] The optical functional layer 50 may include an anti-reflection layer. The anti-reflection layer may reduce the reflectivity of light (external light) incident from an external source through the window 60 toward the display panel 10. The anti-reflection layer may include a phase retarder and a polarizer. The phase retarder may be a film type or a liquid coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid coating type. The film type may include a stretchable synthetic resin film, and the liquid coating type may include liquid crystals arranged in a certain arrangement. The phase retarder and the polarizer may also include protective films, respectively. The phase retarder and the polarizer or their protective films may be defined as the base layer of the anti-reflection layer.

[0053] According to another embodiment, the anti-reflection layer may include a black matrix and a color filter. The color filter may be set by considering the color of the light beam emitted by the pixel P of the display panel 10. According to another embodiment, the anti-reflection layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, may destructively interfere with each other, and thus the reflectivity of the external light may be reduced.

[0054] The optical function layer 50 may include a lens layer. The lens layer may improve the emission efficiency of light emitted from the display panel 10 or reduce the color deviation of light emitted from the display panel 10. The lens layer may include a layer having a concave lens or a convex lens shape, and / or may include layers that may have different refractive indices. The optical function layer 50 may include both an anti-reflection layer and a lens layer, or include one of the anti-reflection layer and the lens layer.

[0055] According to an embodiment, the optical function layer 50 may be continuously formed after a process of forming the display panel 10 and / or the input sensing layer 40. In an embodiment, no adhesive layer may be provided between the optical function layer 50 and the input sensing layer 40 and / or the display panel 10.

[0056] The display panel 10 , the input sensing layer 40 , and / or the optical function layer 50 may include an opening. Figure 2 , it is shown that the display panel 10, the input sensing layer 40 and the optical function layer 50 may include a first opening 10H, a second opening 40H and a third opening 50H, respectively, and the first opening 10H, the second opening 40H and the third opening 50H may overlap each other. The first opening 10H, the second opening 40H and the third opening 50H may be positioned to correspond to the opening area OP. According to another embodiment, at least one of the display panel 10, the input sensing layer 40 and the optical function layer 50 may not include an opening. For example, one or two selected from the display panel 10, the input sensing layer 40 and the optical function layer 50 may not include an opening. As Figure 3 As shown in , the display panel 10 , the input sensing layer 40 , and the optical function layer 50 may not include openings.

[0057] The opening area OP may be a component area (eg, a sensor area, a camera area, a speaker area, etc.) in which a component 30 for adding various functions to the display device 1 may be located. Figure 2 As shown in , the component 30 can be located in the first opening 10H, the second opening 40H and the third opening 50H. As another example, Figure 3 As shown in , the component 30 may be located below the display panel 10 .

[0058] The component 30 may include an electronic component. For example, the component 30 may be an electronic component that uses light or sound. For example, the electronic component may include a sensor that outputs or / and receives light (such as an infrared sensor), a camera that receives light and captures an image, a sensor that outputs and senses light or sound to measure distance or recognize fingerprints, a small lamp that outputs light, or a speaker that outputs sound. Electronic components that use light may use light of various wavelengths such as visible light, infrared light, and ultraviolet light. According to some embodiments, the opening area OP may be understood as a transmission area that is capable of transmitting light or / and sound that can be output from the component 30 to the outside or travel from the outside toward the component 30.

[0059] According to another embodiment, in the case where the display device 1 can be used as a smart watch or a dashboard for a car, the component 30 can be a member such as a pointer of a clock or a pointer indicating information (e.g., the speed of the vehicle). In the case where the display device 1 includes the pointer of a clock or a dashboard for a car, the component 30 is exposed to the outside through the window 60, and the window 60 may include an opening corresponding to the opening area OP.

[0060] As described above, the assembly 30 may include elements related to the functions of the display panel 10, or may include elements such as accessories that increase the aesthetics of the display panel 10. Figure 2 and Figure 3Although not shown in the figure, a layer including an optically transparent adhesive or the like may be located between the window 60 and the optical functional layer 50 .

[0061] Figure 4 is a schematic plan view of a display panel 10 according to an embodiment. Figure 5 is a schematic circuit diagram of a pixel P in the display panel 10 according to an embodiment.

[0062] Reference Figure 4 and Figure 5 , the display panel 10 may include the opening area OP as a first area, the first and second display areas DA1 and DA2 as second areas, the second non-display area NDA2 as a third area, and the first non-display area NDA1 as a fourth area.

[0063] The display panel 10 may include pixels P disposed in the first display area DA1 and the second display area DA2. Figure 5 As shown in , each pixel P may include a pixel circuit PC and an organic light emitting diode OLED as a display element connected to the pixel circuit PC. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel P may emit, for example, red light, green light, or blue light via the organic light emitting diode OLED, or may emit red light, green light, blue light, or white light.

[0064] The second thin film transistor T2, which may be a switching thin film transistor, may be connected to the scan line SL and the data line DL, and transmit a data voltage received via the data line DL to the first thin film transistor T1 based on a switching voltage received via the scan line SL. The storage capacitor Cst may be connected to the second thin film transistor T2 and the driving voltage line PL, and may store a voltage corresponding to a difference between a voltage received from the second thin film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0065] The first thin film transistor T1, which may be a driving thin film transistor, may be connected to the driving voltage line PL and the storage capacitor Cst, and may control a driving current flowing from the driving voltage line PL to the organic light emitting diode OLED according to a voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED may emit light having a specific brightness due to the driving current. A counter electrode (e.g., a cathode) of the organic light emitting diode OLED may receive a second power supply voltage ELVSS.

[0066] although Figure 5, the pixel circuit PC includes two thin film transistors and one storage capacitor, but the embodiment is not limited thereto. The number of thin film transistors and the number of storage capacitors may vary according to the design of the pixel circuit PC. For example, in addition to the aforementioned two thin film transistors, the pixel circuit PC may also include four or more thin film transistors.

[0067] In the first non-display area NDA1, a scan driver 1100 that can provide a scan signal to each pixel P, a data driver 1200 that can provide a data signal to each pixel P, and a main power wiring (not shown) that can provide a first power voltage ELVDD and a second power voltage ELVSS may be disposed. Figure 4 In the embodiment, the data driver 1200 may be located on one edge of the substrate 100. However, according to another embodiment, the data driver 1200 may be located on a flexible printed circuit board (FPCB) electrically connected to a pad disposed on one side of the display panel 10.

[0068] For example, a wiring portion may be provided in the first non-display area NDA1 to provide various signals and / or power that may be applied to the first display area DA1 and the second display area DA2. The wiring portion may include a driving circuit. For example, the driving circuit may include at least one of a scanning driving circuit (not indicated), a terminal portion (not shown), a driving power line (not shown), and a second wiring, and may also include a thin film transistor for controlling an electrical signal that may be applied to the first display area DA1 and the second display area DA2. In the first non-display area NDA1, a partition wall, a groove, etc. for stopping the flow of an organic layer that may be used when manufacturing a display device may also be provided.

[0069] Return to reference Figure 4 , according to a plan view, the second non-display area NDA2 may surround the opening area OP. The second non-display area NDA2 and the opening area OP may be areas in which display elements such as organic light emitting diodes may not be disposed. Signal lines that may provide signals to pixels P disposed around the opening area OP may cross the second non-display area NDA2.

[0070] Although not shown in the drawings, a special groove may be provided in the second non-display area NDA2 in addition to the signal line. The grooves may be included and may be spaced apart from each other in the second non-display area NDA2.

[0071] Figure 6 is a schematic cross-sectional view of a display panel 10 according to an embodiment. Figure 7 It is shown Figure 4 Schematic cross-sectional view of a first display area DA1 of a display panel 10. Figure 8 It is shown Figure 4 Schematic cross-sectional view of the second display area DA2 of the display panel 10.

[0072] Reference Figures 6 to 8 , the display panel 10 includes a display layer 200 disposed on the substrate 100. The display layer 200 may be disposed on the first display area DA1 and the second display area DA2.

[0073] The substrate 100 may include a glass material or may include a polymer resin. The substrate 100 may have a multi-layer structure. Figure 6 As shown in the enlarged view of FIG. 1 , the substrate 100 may include a first base layer 100 - 1 , a first barrier layer 100 - 2 , a second base layer 100 - 3 , and a second barrier layer 100 - 4 .

[0074] Each of the first base layer 100-1 and the second base layer 100-3 may include a polymer resin. For example, the first base layer 100-1 and the second base layer 100-3 may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose acetate propionate, or a combination thereof. The aforementioned polymer resin may be transparent.

[0075] Each of the first barrier layer 100-2 and the second barrier layer 100-4 may be a barrier layer that can prevent the penetration of external foreign materials, and thus may be a layer including an inorganic material (such as silicon nitride (SiN x ) or silicon oxide (SiO x )) single or multiple layers.

[0076] The display layer 200 may include pixels P. The display layer 200 may include a display element layer 200A and a pixel circuit layer 200B. The display element layer 200A may include display elements respectively disposed in the pixels P, and the pixel circuit layer 200B may include an insulating layer and a pixel circuit PC disposed in each pixel P. Each pixel circuit PC may include a thin film transistor and a storage capacitor Cst, and each display element may include an organic light emitting diode OLED.

[0077] The display element of the display layer 200 may be covered by an encapsulation member such as a thin film encapsulation layer 500. The thin film encapsulation layer 500 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In the case where the display panel 10 includes the substrate 100 including a polymer resin and the thin film encapsulation layer 500 including the inorganic encapsulation layer and the organic encapsulation layer, the flexibility of the display panel 10 may be improved.

[0078] The display panel 10 may include a first opening 10H that may penetrate the display panel 10. The first opening 10H may be located in the opening area OP. The opening area OP may be a type of opening area. Figure 6 2 shows that the substrate 100 and the thin film encapsulation layer 500 include through holes 100H and 500H, respectively, each corresponding to the first opening 10H of the display panel 10. The display layer 200 may include a through hole 200H corresponding to the opening area OP.

[0079] The display panel 10 may include a substrate 100 including a first display area DA1, a second display area DA2, and a non-display area, and a thin film encapsulation layer 500 encapsulating the first display area DA1, the second display area DA2, and the non-display area. As described above, the display panel 10 may include a display layer 200 and a thin film encapsulation layer 500.

[0080] The buffer layer 101 may be disposed (e.g., positioned) on the substrate 100, and may reduce or prevent penetration of foreign materials, moisture, or ambient air from below the substrate 100, and may provide a flat surface on the substrate 100. The buffer layer 101 may include an inorganic material (such as an oxide or a nitride), an organic material, or a mixture of an organic and an inorganic material, and may be formed as a single layer or multiple layers of an inorganic material and an organic material.

[0081] The first thin film transistor T1 may include a semiconductor layer A1, a first gate electrode G1, a source electrode S1, and a drain electrode D1, and the second thin film transistor T2 may include a semiconductor layer A2, a second gate electrode G2, a source electrode S2, and a drain electrode D2.

[0082] Now, a case where the first thin film transistor T1 and the second thin film transistor T2 may be of a top gate type will be illustrated and described. However, the embodiment is not limited thereto, and various types of thin film transistors such as a bottom gate type thin film transistor may be employed.

[0083] Although two thin film transistors T1 and T2 are shown below, the embodiment is not limited thereto. In an embodiment, the display device 1 may use at least two thin film transistors T1 and T2 for a single pixel P. In some embodiments, various modifications may be made to the first thin film transistor T1 and the second thin film transistor T2. For example, six or seven thin film transistors may be used for a single pixel P.

[0084] The semiconductor layers A1 and A2 may include amorphous silicon or polycrystalline silicon. According to another embodiment, the semiconductor layers A1 and A2 may include an oxide of at least one selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The semiconductor layers A1 and A2 may include a channel region and a source region and a drain region each having a carrier concentration higher than that of the channel region.

[0085] The first gate electrode G1 may be disposed on the semiconductor layer A1, and the first gate insulating layer 103 is located between the first gate electrode G1 and the semiconductor layer A1. The first gate electrode G1 may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or a combination thereof, and may be a single layer or multiple layers. For example, the first gate electrode G1 may be a single layer of Mo.

[0086] The first gate insulating layer 103 may insulate the semiconductor layer A1 from the first gate electrode G1 and may include silicon oxide (SiO 2 )、Silicon Nitride(SiN x )、Silicon Oxynitride (SiON), Aluminum Oxide (Al 2 O 3 ), titanium oxide (TiO 2 )、Tantalum oxide(Ta 2 O 5 )、HfO 2 )、ZnO 2 )wait.

[0087] The second gate electrode G2 may be disposed on the semiconductor layer A2, and the first gate insulating layer 103 and the second gate insulating layer 105 are located between the second gate electrode G2 and the semiconductor layer A2. The second gate electrode G2 may include a conductive material including, for example, molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or a combination thereof, and may be formed as a multilayer or a single layer including the foregoing materials. For example, the second gate electrode G2 may be a single layer of Mo or a multilayer of Mo / Al / Mo.

[0088] The second gate insulating layer 105 may include an inorganic material including oxide or nitride. For example, the second gate insulating layer 105 may include SiO 2 、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 、ZnO 2 wait.

[0089] The source electrodes S1 and S2 and the drain electrodes D1 and D2 may be disposed on the interlayer insulating layer 107. Each of the source electrodes S1 and S2 and the drain electrodes D1 and D2 may include a conductive material including Mo, Al, Cu, Ti, or a combination thereof, and may be a multilayer or a single layer including the foregoing materials. For example, each of the source electrodes S1 and S2 and the drain electrodes D1 and D2 may be formed as a multilayer of Ti / Al / Ti.

[0090] The interlayer insulating layer 107 may include silicon oxide (SiO x )、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 、ZnO 2 wait.

[0091] As described above, the first gate electrode G1 of the first thin film transistor T1 and the second gate electrode G2 of the second thin film transistor T2 may be disposed on different layers. Therefore, the driving ranges of the first thin film transistor T1 and the second thin film transistor T2 may be controlled differently.

[0092] The first electrode CE1 of the storage capacitor Cst and the first gate electrode G1 may be formed on the same layer. The first electrode CE1 of the storage capacitor Cst and the first gate electrode G1 may include the same material. The second electrode CE2 of the storage capacitor Cst may overlap with the first electrode CE1, and the second gate insulating layer 105 is located between the first electrode CE1 and the second electrode CE2. The second electrode CE2 and the second gate electrode G2 may be formed on the same layer and may include the same material.

[0093] exist Figure 7 and Figure 8 In the embodiment, the storage capacitor Cst is not overlapped with the first thin film transistor T1 and the second thin film transistor T2. However, the embodiment is not limited thereto. For example, the storage capacitor Cst may overlap with the first thin film transistor T1. In some embodiments, the first electrode CE1 of the storage capacitor Cst may be formed integrally with the first gate electrode G1. For example, the first gate electrode G1 of the first thin film transistor T1 may be used as the first electrode CE1 of the storage capacitor Cst.

[0094] The planarization layer 109 may be disposed on the source electrodes S1 and S2 and the drain electrodes D1 and D2, and the organic light emitting diode (OLED) 300 may be disposed on the planarization layer 109. The planarization layer 109 may be a single layer including an organic material or a multilayer formed by stacking single layers including an organic material. The organic material may include a commercial polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenolic group, an acryl polymer, an imide polymer, an acryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, a blend thereof, and the like. The planarization layer 109 may be a composite stack of an inorganic insulating layer and an organic insulating layer.

[0095] The OLED 300 may be disposed on the planarization layer 109 in the first display area DA1 and the second display area DA2 of the substrate 100. The OLED 300 may include a common layer. The common layer may be a layer that may be commonly formed in the first display area DA1 and the second display area DA2. For example, the common layer may include at least one of the layers included in the intermediate layer 320 (e.g., one of the remaining layers except the emission layer 322 among the layers included in the intermediate layer 320) and the counter electrode 330. The OLED 300 may include a pixel electrode 310, a counter electrode 330, and an intermediate layer 320 located between the pixel electrode 310 and the counter electrode 330.

[0096] The pixel electrode 310 may contact one of the source electrode S2 and the drain electrode D2 of the second thin film transistor T2 via an opening formed in the planarization layer 109, and may be electrically connected to the second thin film transistor T2. The pixel electrode 310 may be a reflective electrode. For example, the pixel electrode 310 may include a reflective layer formed of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a mixture thereof, and a transparent or semi-transparent electrode layer formed on the reflective layer. The transparent or semi-transparent electrode layer may include a layer formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), at least one selected from the group consisting of indium gallium oxide (IGO) and aluminum zinc oxide (AZO).

[0097] The pixel defining layer 112 may be disposed on the planarization layer 109. The pixel defining layer 112 defines pixels by including respective openings corresponding to sub-pixels (i.e., openings through which at least a central portion of the pixel electrode 310 may be exposed). The pixel defining layer 112 may prevent arcing from occurring on the edge of the pixel electrode 310 by increasing the distance between the edge of the pixel electrode 310 and the counter electrode 330 disposed above the pixel electrode 310. The pixel defining layer 112 may be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

[0098] The intermediate layer 320 may include an emission layer 322. The emission layer 322 may include an organic material including a fluorescent or phosphorescent material that may emit, for example, red, green, and blue light, and may be patterned according to the pixels P in the first display area DA1 and the second display area DA2. The intermediate layer 320 may include at least one functional layer among a first functional layer 321 between the emission layer 322 and the pixel electrode 310 and a second functional layer 323 between the emission layer 322 and the counter electrode 330.

[0099] The first functional layer 321 may include a hole injection layer (HIL) and / or a hole transport layer (HTL).

[0100] The HIL may allow the anode to easily emit holes, and the HTL may allow the holes of the HIL to be transferred to the emission layer 322 .

[0101] The HIL may include, but is not limited to, phthalocyanine compounds (such as copper phthalocyanine), DNTPD (N,N'-diphenyl-N,N'-bis-[4-(di(m-tolyl)-amino)-phenyl]-biphenyl-4,4'-diamine), m-MTDATA (4,4',4"-tris[(3-methylphenyl)phenylamino]triphenylamine), TDATA (4,4'4"-tris(N,N-diphenylamino)triphenylamine), 2T-NATA (4,4',4"-tris{N,-(2-naphthyl)-N-phenylamino}-triphenylamine), PEDOT / PSS (poly(3,4-ethylenedioxythiophene) / poly(4-styrenesulfonate)), PANI / DBSA (polyaniline / dodecylbenzenesulfonic acid), PANI / CSA (polyaniline / camphorsulfonic acid), PANI / PSS (polyaniline / poly(4-styrenesulfonate)), and the like.

[0102] The HTL may include, but is not limited to, triphenylamine-based materials such as carbazole derivatives (such as N-phenylcarbazole and polyvinylcarbazole), TPD (N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1,1'-biphenyl]-4,4'-diamine), NPB (N,N'-di(1-naphthyl)-N,N'-diphenylbenzidine), TCTA (4,4',4"-tris(N-carbazolyl)triphenylamine), or combinations thereof.

[0103] The second functional layer 323 may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0104] The EIL may allow the cathode to easily emit electrons, and the ETL may allow the electrons of the EIL to be transferred to the emission layer 322 .

[0105] ETL may include but is not limited to Alq 3 、BCP(2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline)、Bphen(4,7-diphenyl-1,10-phenanthroline)、TAZ(3-(4-biphenyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole)、NTAZ(4-(naphthalene-1-yl)-3,5-diphenyl-4H-1,2,4-triazole)、tBu-PBD(2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole)、BAlq(bis(2-methyl-8-hydroxyquinoline-N1,O8)-(1,1'-biphenyl-4-hydroxy)aluminum)、Bebq 2 (bis(benzoquinoline-10-hydroxy)beryllium), ADN (9,10-di(naphthalene-2-yl)anthracene), or a combination thereof.

[0106] The EIL may include but is not limited to LiF, NaCl, CsF, Li 2 O, BaO, Liq or a combination thereof.

[0107] The intermediate layer 320 is not limited to the above structure and may have any of various other structures. The intermediate layer 320 may include a single layer that may cover the pixel electrode 310 or may include patterned layers that correspond to the pixel electrodes 310, respectively. For ease of explanation, the case where the emission layer 322 may be patterned to correspond to each pixel electrode 310 and the first functional layer 321 and the second functional layer 323 may be disposed on the substrate 100 to cover the pixel electrode 310 will now be described.

[0108] The counter electrode 330 may extend over the first display area DA1 and the second display area DA2. Figure 7 and Figure 8As shown in , the counter electrode 330 may cover the first display area DA1 and the second display area DA2. In other words, the counter electrode 330 may be formed as a monomer constituting the OLED 300, and thus may correspond to the pixel electrode 310. According to another embodiment, the counter electrode 330 may extend over the first display area DA1, the second display area DA2, and a portion of the non-display area. For ease of explanation, a case where the counter electrode 330 may extend over the first display area DA1, the second display area DA2, and a portion of the non-display area will now be described.

[0109] The counter electrode 330 may be a transparent electrode. The counter electrode 330 may be a transparent or semi-transparent electrode and may be a metal thin film having a small work function including Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg or a combination thereof. For example, ITO, IZO, ZnO or In 2 O 3 A transparent conductive oxide (TCO) layer may be further disposed on the metal film.

[0110] Since the pixel electrode 310 may be a reflective electrode and the counter electrode 330 may be a transparent electrode, the display device 1 may be a top emission type in which light emitted by the intermediate layer 320 may be emitted toward the counter electrode 330. However, the embodiment is not limited thereto, and the display device 1 may be a bottom emission type in which light emitted by the intermediate layer 320 may be emitted toward the substrate 100. The pixel electrode 310 may be a transparent or semi-transparent electrode, and the counter electrode 330 may be a reflective electrode. The display device 1 according to the embodiment may be a dual emission type that emits light in two directions (i.e., toward the top and bottom surfaces of the display device 1).

[0111] The cap layer 400 may be disposed on the counter electrode 330. The cap layer 400 may contact (e.g., directly contact) the counter electrode 330. The cap layer 400 may have a refractive index lower than that of the counter electrode 330, and may have a refractive index higher than that of the first inorganic encapsulation layer 510. The cap layer 400 may improve light emitting efficiency by increasing the percentage by which light generated by the intermediate layer 320 including the emission layer 322 may be totally reflected and thus may not be emitted to the outside of the display panel 10.

[0112] The thickness of the first common layer disposed in the first display area DA1 and the thickness of the second common layer disposed in the second display area DA2 may be substantially the same as or different from each other. For example, the thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cap layer 400 is Figure 4The thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330 and the cover layer 400 provided in the first display area DA1 may be greater than the thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330 and the cover layer 400 provided in the second display area DA2. Specifically, one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330 and the cover layer 400 provided in the first display area DA1 may be formed by a deposition material that has completely passed through an opening of a mask to be described later, while one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330 and the cover layer 400 provided in the second display area DA2 may be formed by a deposition material that is partially or selectively blocked by the ribs of the mask.

[0113] The thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the capping layer 400 disposed in the second display area DA2 may be different in the width direction of the second display area DA2. The width direction of the second display area DA2 may be Figure 4direction between the X-axis and the Y-axis of the second display area DA2. Specifically, the width of the second display area DA2 can be measured in a direction perpendicular to the edge of the second display area DA2. The thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330 and the cover layer 400 provided in the second display area DA2 can be minimum at any point in the width direction of the second display area DA2. The thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330 and the cover layer 400 provided in the second display area DA2 can increase linearly in a direction from a point in the second display area DA2 to the edge of the second display area DA2, at which point the thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330 and the cover layer 400 provided in the width direction of the second display area DA2 can be minimum. Specifically, the thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 disposed on the edge of the second display area DA2 may be equal to or very similar to the thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 disposed in the first display area DA1. The point at which the thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 in the second display area DA2 may be the smallest may be the center of the width of the second display area DA2. In other words, the thickness of one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 may increase in a direction from the center of the width of the second display area DA2 to the edge of the second display area DA2.

[0114] The thin film encapsulation layer 500 may cover the first display area DA1 and the second display area DA2 and the non-display area to prevent the penetration of external moisture and oxygen. The thin film encapsulation layer 500 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. Figure 7 and Figure 8 The thin film encapsulation layer 500 may include two inorganic encapsulation layers (ie, a first inorganic encapsulation layer 510 and a second inorganic encapsulation layer 530) and a single organic encapsulation layer 520, but the order in which the layers 510 to 530 are stacked and the number of times the layers 510 to 530 can be stacked are not limited to Figure 7 and Figure 8 Embodiment of the invention.

[0115] The first inorganic encapsulating layer 510 may cover the counter electrode 330 and may include silicon oxide, silicon nitride, and / or silicon oxynitride. If necessary, as described above, other layers such as the capping layer 400 may be located between the first inorganic encapsulating layer 510 and the counter electrode 330. Figure 7 and Figure 8 As shown in , because the first inorganic encapsulating layer 510 may be formed along a structure located below the first inorganic encapsulating layer 510 , an upper surface thereof may be uneven.

[0116] The organic encapsulation layer 520 may cover the first inorganic encapsulation layer 510. In contrast to the first inorganic encapsulation layer 510, the organic encapsulation layer 520 may have an approximately flat upper surface. In detail, the organic encapsulation layer 520 may have an approximately flat upper surface at a portion corresponding to the first display area DA1. The organic encapsulation layer 520 may include at least one material among polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. The second inorganic encapsulation layer 530 may cover the organic encapsulation layer 520 and may include silicon oxide, silicon nitride, and / or silicon oxynitride.

[0117] As such, since the thin film encapsulation layer 500 may include the first inorganic encapsulation layer 510, the organic encapsulation layer 520, and the second inorganic encapsulation layer 530, even if the thin film encapsulation layer 500 is broken, due to the multi-layer structure, the break may not extend between the first inorganic encapsulation layer 510 and the organic encapsulation layer 520 or between the organic encapsulation layer 520 and the second inorganic encapsulation layer 530. Therefore, the formation of a path through which external moisture, oxygen, etc. penetrate into the first display area DA1 and the second display area DA2 and the non-display area can be prevented or minimized. The edge of the second inorganic encapsulation layer 530 outside the first display area DA1 and the second display area DA2 may contact the first inorganic encapsulation layer 510 so that the organic encapsulation layer 520 may not be exposed to the outside.

[0118] The partition wall 120 may be disposed in the non-display area of ​​the substrate 100 .

[0119] In the case where the organic encapsulation layer 520 of the thin film encapsulation layer 500 may be formed to encapsulate the first display area DA1 and the non-display area, the partition wall 120 may block the organic material from flowing toward the edge of the substrate 100 , thereby preventing the formation of an edge tail of the organic encapsulation layer 520 .

[0120] There may be one or more partition walls 120. In the case where a plurality of partition walls 120 are included, the partition wall 120 may include a first partition wall 120A and a second partition wall 120B spaced apart from each other.

[0121] At least one of the first partition wall 120A and the second partition wall 120B may be formed as a layer. Figure 7, the first partition wall 120A is shown as a stack of a first layer 121A and a second layer 123A. The first layer 121A and the planarization layer 109 may include the same material or be formed of the same material, and the second layer 123A and the pixel definition layer 112 may include the same material or be formed of the same material. The second partition wall 120B is shown as a stack of a first layer 121B and a second layer 123B. The first layer 121B and the planarization layer 109 may include the same material or be formed of the same material, and the second layer 123B and the pixel definition layer 112 may include the same material or be formed of the same material. However, the embodiment is not limited thereto. One of the first partition wall 120A and the second partition wall 120B may be a single layer, or each of them may have a double-layer structure or a three-layer structure. In this way, various modifications may be made to the structure of the first partition wall 120A and the second partition wall 120B. Additional partition walls spaced apart from the first partition wall 120A and the second partition wall 120B may be further included.

[0122] although Figure 7 and Figure 8 Although not shown, the spacer may be disposed on the flat portion of the pixel defining layer 112 and may protrude from the flat surface of the pixel defining layer 112 to the thin film encapsulation layer 500. The spacer may be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

[0123] Since the partition wall 120 may include a plurality of partition walls, overflow of an organic material in a case where the organic encapsulation layer 520 may be formed may be more effectively prevented.

[0124] Fig. 9 is a schematic cross-sectional view of a display panel 10 ′ according to another embodiment.

[0125] Reference Fig. 9 , the substrate 100 may not include a through hole corresponding to the opening area OP. The display layer 200 may include a through hole 200H corresponding to the opening area OP. The thin film encapsulation layer 500 may not include a through hole corresponding to the opening area OP. The opening area OP may not include the above-mentioned insulating layer.

[0126] The display panel 10' may include a first display area DA1, a second display area DA2, a first non-display area NDA1, and a second non-display area NDA2. Since the first display area DA1, the second display area DA2, the first non-display area NDA1, and the second non-display area NDA2 may be the same as those described above. Figures 1 to 8 Those described are the same or similar, so their detailed descriptions will be omitted here.

[0127] Fig.10is a schematic cross-sectional view of a display panel 10 ′ according to another embodiment.

[0128] Reference Fig.10 , the display layer 200 may not include the through hole 200H corresponding to the opening area OP, and the display element layer 200A may not be located in the opening area OP. The pixel circuit layer 200B included in the display layer 200 or the insulating layer included in the pixel circuit layer 200B may be disposed in the opening area OP. According to another embodiment, no special layer other than the substrate 100 may be disposed in the opening area OP.

[0129] The display panel 10' may include a first display area DA1, a second display area DA2, a first non-display area NDA1, and a second non-display area NDA2. Figures 1 to 8 Those described are the same or similar, so their detailed descriptions will be omitted here.

[0130] Fig.11 is a schematic cross-sectional view of a display panel 10 ′ according to another embodiment. Fig.12 yes Fig.11 Schematic cross-sectional view of a display panel 10 ′.

[0131] Reference Fig.11 and Fig.12 , which is different from the above-mentioned display panel 10 ′ which may include a thin film encapsulation layer 500, Fig.11 and Fig.12 The display panel 10 ′ may include an encapsulation substrate 500A and a sealing part 700 .

[0132] At least one of the substrate 100 , the display layer 200 , and the encapsulation substrate 500A may include through holes 100H, 200H, and 500AH corresponding to the open area OP. The display element layer 200A may not be disposed in the open area OP.

[0133] The substrate 100 may include glass or a polymer resin. Examples of the polymer resin may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose acetate propionate, or a combination thereof. The substrate 100 may have a multilayer structure (not shown) including a layer containing the aforementioned polymer resin and an inorganic layer. For ease of description, a case where the substrate 100 may be formed of glass will now be described.

[0134] The sealing portion 700 may be located between the substrate 100 and the encapsulation substrate 500A. The sealing portion 700 may be disposed in the second non-display area NDA2, and the sealing portion 700 disposed in the second non-display area NDA2 may surround (eg, completely surround) the opening area OP.

[0135] The encapsulation substrate 500A may face the substrate 100. The encapsulation substrate 500A and the substrate 100 may be formed of the same or similar material. Specifically, the encapsulation substrate 500A may be formed of glass. According to another embodiment, the encapsulation substrate 500A may include plastic. The encapsulation substrate 500A may include one or more layers including one or more resins.

[0136] While the source electrodes S1 and S2 and / or the drain electrodes D1 and D2 are being manufactured, the dummy wiring 220 may be disposed in the first and second non-display areas NDA1 and NDA2. Specifically, the dummy wiring 220 may be disposed on a portion of the substrate 100 on which the sealing part 700 may be disposed.

[0137] The sealing part 700 may firmly bond the substrate 100 to the package substrate 500A.

[0138] Because the first display area DA1, the second display area DA2, the first non-display area NDA1 and the second non-display area NDA2 can be the same as those mentioned above Figures 1 to 8 Those described are similar, so their detailed description will be omitted here.

[0139] Fig.13 is a schematic cross-sectional view of a display panel 10 ′ according to another embodiment.

[0140] Reference Fig.13 , the display panel 10' may include a through hole 500AH formed only in the package substrate 500A. The display element layer 200A may not be disposed in the opening region OP. The pixel circuit layer 200B may not be formed in the opening region OP. The through hole 500AH of the package substrate 500A may be formed by a removal member including a drill or the like.

[0141] Because the first display area DA1, the second display area DA2, the first non-display area NDA1 and the second non-display area NDA2 can be the same as those mentioned above Figures 1 to 8 Those described are similar, so their detailed description will be omitted here.

[0142] Fig.14 is a schematic cross-sectional view of a display panel 10 ′ according to another embodiment.

[0143] Reference Fig.14, the display panel 10' may not include a separate through hole located in the opening area OP. In the opening area OP, the pixel circuit layer 200B may be provided, and the display element layer 200A may not exist. The pixel circuit layer 200B included in the display layer 200 or the insulating layer included in the pixel circuit layer 200B may be provided in the opening area OP. According to another embodiment, no special layer may be provided in the opening area OP except the substrate 100. The sealing portion 700 may be provided only in the first non-display area NDA1.

[0144] Because the first display area DA1, the second display area DA2, the first non-display area NDA1 and the second non-display area NDA2 can be the same as those mentioned above Figures 1 to 8 Those described are similar, so their detailed description will be omitted here.

[0145] Fig.15 is a schematic cross-sectional view of an apparatus 800 for manufacturing the display apparatus 1 according to an embodiment. Fig.16 yes Fig.15 A schematic perspective view of a mask assembly 840 is shown in FIG. Fig.17 is along Fig.16 A schematic cross-sectional view of the mask sheet 842 taken along line CC'.

[0146] Reference Figures 15 to 17 , the apparatus 800 may include a chamber 810 , a first support 820 , a second support 830 , a mask assembly 840 , a source (hereinafter, also referred to as a source part) 860 , a pressure regulator 870 , and a vision part 880 .

[0147] The chamber 810 may have a space formed therein, and deposition may be performed in the space. An opening portion may be formed in the chamber 810, and a gate valve 811 may be provided in the opening portion to close or open the opening portion.

[0148] The first support member 820 may be disposed in the chamber 810 and may support the display substrate D. As described above Figure 7 , Figure 8 and Fig.12 As shown in the figure, the display substrate D may include a substrate 100, a buffer layer 101, a first gate insulating layer 103, a second gate insulating layer 105, an interlayer insulating layer 107, a planarization layer 109, a pixel defining layer 112, a pixel electrode 310, a first thin film transistor T1, a second thin film transistor T2 and a storage capacitor Cst.

[0149] The first support 820 may have various shapes. For example, the first support 820 may be fixed inside the chamber 810, and the display substrate D may be placed on the first support 820. According to another embodiment, the first support 820 may have a shuttle shape that may be linearly movable in the chamber 810. According to another embodiment, the first support 820 may have a fixture shape that may be set in the chamber 810 and may hold the display substrate D. According to another embodiment, the first support 820 may be set in the chamber 810, and may include an electrostatic chuck or an adhesive chuck that may support the display substrate D. The first support 820 is not limited thereto, and the first support 820 may include any device and structure that may support the display substrate D. However, for ease of description, a case where the first support 820 may be fixed to the inside of the chamber 810 and the display substrate D may be placed on the first support 820 will now be described.

[0150] The mask assembly 840 may be disposed on and supported by the second support 830. The second support 830 may adjust the position of the mask assembly 840. For example, the second support 830 may raise and lower the mask assembly 840 or rotate the mask assembly 840 a certain distance, and may also linearly move the mask assembly 840 in one direction.

[0151] The mask assembly 840 can selectively transmit the deposition material. The mask assembly 840 may include one or more openings 842a-1. For example, according to an embodiment, the mask assembly 840 may include an opening 842a-1 through which the deposition material may be transmitted. The deposition material that may have passed through the opening 842a-1 may be deposited on the area of ​​the display substrate D and thus a display area may be formed. According to another embodiment, the mask assembly 840 may include an opening 842a-1 through which the deposition material may be transmitted. The display substrate D may be divided into a plurality of areas, and the deposition material that may have passed through each of the openings 842a-1 may be deposited on each of the areas of the display substrate D and thus a display area may be formed in each of the areas. Specifically, after the deposition material may be deposited, the areas of the display substrate D may be separated from each other, so a single display device 1 may be manufactured. For ease of description, the case where the mask assembly 840 may include the opening 842a-1 will now be described.

[0152] According to an embodiment, the mask assembly 840 may include a mask sheet 842. According to another embodiment, the mask assembly 840 may include a mask frame 841 and a mask sheet 842. For ease of description, a case where the mask assembly 840 includes the mask frame 841 and the mask sheet 842 will now be described.

[0153] The mask frame 841 may include an opening 841a at the center thereof. The mask frame 841 may have a shape such as a window frame.

[0154] The mask sheet 842 may be disposed on the mask frame 841. One mask sheet 842 or a plurality of mask sheets 842 may be included. In the case where a plurality of mask sheets 842 are included, the plurality of mask sheets 842 may each be formed to have a plate shape and may be disposed on the mask frame 841 to be adjacent to each other. For example, the mask sheet 842 may be disposed along the longitudinal direction of the mask frame 841 (e.g., Fig.16 The X-axis direction) or along the width direction of the mask frame 841 (eg, Fig.16 However, for ease of description, a case where one mask sheet 842 can be formed will now be described.

[0155] The mask sheet 842 may include a body portion 842a, a shielding portion 842b, and a rib 842c.

[0156] The main body portion 842a may include openings 842a-1 that are respectively arranged to correspond to the regions of the display substrate D. Each of the openings 842a-1 may have a shape corresponding to the display region of each region of the display substrate D. The deposition material that may have passed through each opening 842a-1 may be deposited on each region of the display substrate D and thus may form a display region. After the display regions are respectively formed on the regions of the display substrate D, the regions of the display substrate D may be separated from each other, and thus a single display panel may be manufactured. According to another embodiment, the main body portion 842a may include a single opening 842a-1, and thus the deposition material may be guided to a single display region of the display substrate D. In this way, a single display panel may be manufactured. For ease of description, the case where the main body portion 842a includes the opening 842a-1 will now be described.

[0157] The shielding portion 842b may extend to the rib 842c so as to protrude toward the display substrate D. One side of the shielding portion 842b (or the end of the shielding portion 842b) may be disposed farther from the source 860 than one side of the rib 842c. The shielding portion 842b may have a planar shape that may correspond to the shape of the opening area OP as described above. For example, in the case where the opening area OP to be formed may be circular, the shielding portion 842b may be formed to have a circular planar shape. According to another embodiment, in the case where the opening area OP to be formed may be polygonal, the shielding portion 842b may be formed to have a polygonal planar shape. The shape of the shielding portion 842b is not limited thereto, and may be formed to correspond to the shape of the opening area OP according to the shape of the opening area OP.

[0158] The side of the shielding portion 842b facing the display substrate D may be disposed closer to the display substrate D than the side of the body portion 842a facing the display substrate D. The shielding portion 842b may be completely adhered to the display substrate D.

[0159] The rib 842c may be arranged with respect to the longitudinal direction of the mask sheet 842 (eg, Fig.16 X-axis direction) or relative to the width direction of the mask sheet 842 (for example, Fig.16 The Y-axis direction) extends diagonally, for example, Fig.16 In the embodiment, the rib 842c may extend along the DI1 axis in a plane defined by the DI1 axis and the DI2 axis. The rib 842c may be disposed in each opening 842a-1. In other words, the rib 842c may extend across the opening 842a-1. Fig.16 As shown in , the opening 842a-1 may have a rectangular shape, and the rib 842c may be disposed in a diagonal direction to face a vertex of the opening 842a-1.

[0160] A first distance I1 from one surface of the rib 842c opposite to the display substrate D to one surface of the shielding portion 842b opposite to the display substrate D may be equal to or greater than 2.7×10 -4 The first distance I1 can be less than 2.7×10 of the second distance I2. -4 times, the deposited material will be deposited on a portion of the display substrate D set on the rear surface of the shielding portion 842b, thereby forming a first functional layer 321, an emission layer 322, a second functional layer 323, a counter electrode 330 or a cover layer 400, thereby reducing the transmittance of the opening area OP.

[0161] The mask frame 841 and / or the mask sheet 842 may further include a magnetic body 843. In the case where the mask frame 841 includes the magnetic body 843, the mask frame 841 itself may be formed of the magnetic body. The magnetic body 843 may be included and may be disposed on the mask frame 841 to be separated from each other. In the case where the mask sheet 842 includes the magnetic body 843, the mask sheet 842 may be formed of the magnetic body. Fig.16 As shown in FIG. 8 , the magnetic body 843 may be included and may be disposed on the body portion 842a to be separated from each other. For convenience of description, a case where the mask sheet 842 includes the magnetic body 843 will now be described.

[0162] The mask frame 841 and / or the mask sheet 842 may include carbon fiber. According to an embodiment, the mask sheet 842 may be formed of carbon fiber, and the mask frame 841 may be formed of a magnetic body or an Invar material. According to another embodiment, the mask frame 841 and the main body portion 842a may be formed of a magnetic body or an Invar material, and the rib 842c and the shielding portion 842b may be formed of carbon fiber. The rib 842c may be fixed to the main body portion 842a by bolts or screws or by a special adhesive material (e.g., a torr seal such as a high vacuum leak sealant (VAC)). According to another embodiment, the mask frame 841, the main body portion 842a and the rib 842c may be formed of a magnetic body or an Invar material, and only the shielding portion 842b may be formed of carbon fiber. According to another embodiment, both the mask frame 841 and the mask sheet 842 may be formed of carbon fiber. For ease of description, the case where the mask sheet 842 may be integrated and may be formed of carbon fiber will now be described.

[0163] The apparatus 800 may further include a magnetic force generator 850 disposed in the chamber 810. The magnetic force generator 850 may or may not be included in the form of the mask assembly 840. However, for ease of description, a case where the apparatus 800 for manufacturing the display device 1 includes the magnetic force generator 850 will now be described.

[0164] The magnetic force generator 850 may be disposed in the chamber 810, and thus the mask assembly 840 may be forced to be closer to the display substrate D. The magnetic force generator 850 may include at least one of a magnet and an electromagnet that generates a magnetic force.

[0165] The source 860 can store the deposition material and can sublimate or evaporate the deposition material. The source 860 can include a heater to heat the deposition material. The source 860 can also include a crucible to store the deposition material. The source 860 can be maintained in a single position in the chamber 810, or can be linearly moved or reciprocated in one direction in the chamber 810. In the case where the source 860 moves, the chamber 810 may include a source drive (not shown) that can drive the source 860 to move linearly and reciprocate. The source drive may include a linear motor. However, for ease of description, the case where the source 860 can be fixed in the chamber 810 will now be described.

[0166] The vision part 880 may be disposed in the chamber 810, and may photograph at least one of the display substrate D and the mask assembly 840. The display substrate D and the mask assembly 840 may be disposed based on data obtained through photographing by the vision part 880.

[0167] The pressure regulator 870 may be connected to the chamber 810 and may adjust the internal pressure of the chamber 810. The pressure regulator 870 may include a conduit 871 connected to the chamber 810 and a vacuum pump 872 provided on the conduit 871 to adjust the internal pressure of the chamber 810. According to the operation of the vacuum pump 872, gas may be exhausted from the chamber 810, or a special gas may be supplied into the chamber 810.

[0168] When the apparatus 800 manufactures the display apparatus 1, the display substrate D may be disposed in the chamber 810. The mask assembly 840 may be disposed in the chamber 810.

[0169] The display substrate D may be disposed on the first support 820 , and the mask assembly 840 may be disposed on the second support 830 .

[0170] When the display substrate D and the mask assembly 840 are arranged as described above, the alignment mark of the display substrate D and the alignment mark of the mask assembly 840 can be photographed by the vision part 880 and compared with each other, so the display substrate D and the mask assembly 840 can be aligned. The second support member 830 can be capable of precisely adjusting the position of the mask assembly 840.

[0171] The magnetic force generator 850 may apply a magnetic force to the mask assembly 840. In the case where the magnetic force generator 850 applies the magnetic force as described above, the mask assembly 840 may move toward the display substrate D.

[0172] The shielding portion 842 b may be completely adhered to the display substrate D and thus may contact one surface of the display substrate D or may be close to the display substrate D.

[0173] The source 860 may operate to supply the deposition material into the chamber 810. At this time, the deposition material may pass through the opening 842a-1 and may be deposited on the display substrate D. The deposition material that may have passed through the opening 842a-1 may be deposited on the first display region and the second display region (not shown) of the display substrate D.

[0174] In the above case, a portion of the display substrate D may be exposed through the opening 842a-1, and another portion of the display substrate D may not be exposed due to a portion of the mask sheet 842 that does not have the opening 842a-1 formed therein, the rib 842c, and the shielding portion 842b. Therefore, the deposition material may be deposited on the exposed portion of the display substrate D.

[0175] Although the deposition material can be deposited as described above, the deposition material can also be blocked by the rib 842c (or selectively blocked by the rib 842c). However, because the deposition material ejected by the source 860 can be incident on the display substrate D at various angles, a portion of the deposition material can be deposited on a portion of the display substrate D that can be opposite to the rib 842c. In other words, a portion of the deposition material ejected by the source 860 that forms at least a specific angle relative to a surface of the display substrate D on which the deposition material can be deposited can be obliquely incident on the one surface of the display substrate D, and thus can reach a portion of the display substrate D that is set on the rear surface of the rib 842c. Specifically, because a portion of the deposition material ejected by the source 860 that has avoided the rib 842c can be deposited on the display substrate D, even in the case where the rib 842c can be set, the deposition material can also be deposited on the display area of ​​the display substrate D that is set on the rear surface of the rib 842c. The rib 842c can be set to be slightly separated from the display substrate D, so that the deposition of the deposition material on the portion of the display substrate D that is set on the rear surface of the rib 842c can not be interfered with.

[0176] When the deposition material may be deposited as described above, since the shielding portion 842b may be completely adhered to the display substrate D as described above, the deposition material may not be deposited on a portion of the display substrate D that may face the shielding portion 842b. Therefore, the deposition material may be deposited on the remaining area of ​​the display region of the display substrate D except for the shielding portion 842b. Since the deposition material may not be deposited on a portion of the display substrate D that faces the shielding portion 842b, a second non-display area NDA2 and an opening area OP where the deposition material may not be deposited may be formed in the display substrate D.

[0177] While the above-described operations may be performed, the vacuum pump 872 may be operated to exhaust gas from the chamber 810 .

[0178] In the case where the above-mentioned processes can be completed, the mask assembly 840 may be led out to the outside of the chamber 810. At this time, the vacuum pump 872 may be operated to adjust the internal pressure of the chamber 810 to be the same as or similar to the atmospheric pressure.

[0179] Thereafter, the display substrate D may be unloaded to the outside of the chamber 810. The above process may be repeated after a new display substrate D may be inserted into the chamber 810. In the display substrate D on which the deposition material may have been deposited as described above, a hole may be formed in the opening region OP via application of laser or mechanical abrasion, and thus some layers may be removed.

[0180] When the above-mentioned processes may be completed, a thin film encapsulation layer 500 may be formed on the display substrate D on which the deposition material has been deposited.

[0181] Therefore, in the apparatus 800 for manufacturing the display device 1 and the method for manufacturing the display device 1, the display device 1 in which the opening area OP is formed can be manufactured. In addition, in the apparatus 800 for manufacturing the display device 1 and the method for manufacturing the display device 1, deposition of the deposition material in the opening area OP can be prevented by a simple structure, and thus generation of foreign materials during formation of the opening area OP can be minimized.

[0182] Fig.18 yes Fig.15 Schematic cross-sectional view of another embodiment of a mask sheet 842.

[0183] Reference Fig.18 , the mask assembly 840 may include a mask sheet 842. The mask sheet 842 may include a main body portion 842a, a shielding portion 842b, and a rib 842c. The main body portion 842a, the shielding portion 842b, and the rib 842c may be the same as those described above. Figures 15 to 17 Those described are similar, so their detailed description will be omitted.

[0184] The side of the shielding portion 842b facing the display substrate D and the side of the main body portion 842a facing the display substrate D may be spaced apart from the display substrate D by substantially the same distance. The mask sheet 842 may be completely adhered to the display substrate D, and thus, even in the case where an external force may be applied to the mask sheet 842, deformation of the mask sheet 842 may be minimized. Specifically, the force that may be applied from the mask sheet 842 to the display substrate D may prevent deformation of the mask sheet 842. In addition, since the mask sheet 842 may be completely adhered to the display substrate D, deformation of the mask sheet 842 due to distortion of the mask sheet 842, etc., which may be caused by a high-temperature deposition material, may be prevented.

[0185] Fig.19 yes Fig.15 Schematic cross-sectional view of another embodiment of a mask sheet 842.

[0186] Reference Fig.19 , the mask assembly 840 may include a mask sheet 842. The mask sheet 842 may include a main body portion 842a, a shielding portion 842b, and a rib 842c. The main body portion 842a, the shielding portion 842b, and the rib 842c may be the same as those described above. Figures 15 to 17 Those described are similar, so their detailed description will be omitted.

[0187] The main body 842a and the rib 842c can be formed to be separated from each other. The main body 842a and the rib 842c can be formed of different materials. For example, the main body 842a can include a magnetic body or an Invar material, and the rib 842c can be formed of carbon fiber. The shielding part 842b can also be formed of carbon fiber.

[0188] A seating groove 842d on which an end of the rib 842c can be seated can be formed in the body portion 842a. An adhesive 844 can be provided between the rib 842c and the body portion 842a. The adhesive 844 can include a tor seal as described above.

[0189] The side of the shielding portion 842b facing the display substrate D and the side of the body portion 842a facing the display substrate D may be spaced apart from the display substrate D by substantially the same distance or different distances. The distance from the display substrate D to the side of the shielding portion 842b facing the display substrate D may be less than or equal to the distance from the display substrate D to the side of the body portion 842a facing the display substrate D.

[0190] Therefore, the shielding portion 842 b may prevent the deposition material from being deposited in a partial region of the display substrate D.

[0191] Fig. 20 It shows that you have passed through Figures 17 to 19 A schematic cross-sectional view of the deposition of the deposition material of the rib 842c on the display substrate D.

[0192] Reference Fig. 20 In the case where the deposition material DM may be deposited on the display substrate D via the mask assembly 840 , a portion of the deposition material DM may be blocked by the rib 842 c (or selectively blocked by the rib 842 c ) in a portion of the display substrate D facing the rib 842 c .

[0193] Because the deposition material DM supplied by a source (not shown) may be incident on one surface of the display substrate D at various angles or in various directions, another portion of the deposition material DM may not be blocked by the rib 842c and may reach a portion of the display substrate D facing the rib 842c.

[0194] The deposition material DM having passed through the edge portion of the rib 842c may reach a portion of the display substrate D at a center line CL crossing the center of the rib 842c, and the deposition material DM travelling from the edge of the rib 842c toward the center of the rib 842c may be blocked by the rib 842c (or selectively blocked by the rib 842c).

[0195] The thickness of the deposition material DM deposited on the display substrate D may increase linearly in a direction away from the center line CL crossing the center of the rib 842c. In other words, the thickness of the deposition material in the second display area DA2 formed by depositing the deposition material DM on the display substrate D may increase linearly in a direction from any point (e.g., the center point) of the second display area DA2 to the edge of the second display area DA2 (e.g., the boundary between the first display area DA1 and the second display area DA2). The thickness of the deposition material in the edge of the second display area DA2 may be the same or substantially the same as the thickness of the deposition material in the first display area DA1.

[0196] The display device according to the embodiment may have a uniform surface, and may prevent penetration of oxygen and moisture, thereby providing an increased lifespan.

[0197] In a method of manufacturing a display device, according to an embodiment, occurrence of defects in the display device can be minimized. In a method of manufacturing a display device, according to an embodiment, a display device having an increased lifespan can be manufactured.

[0198] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope defined by the claims (including any equivalents).

Claims

1. A device for manufacturing a display device, the device include: a chamber in which a display substrate and a mask assembly are disposed; A first support member, supporting the display substrate; a second support member, supporting the mask assembly to face the display substrate; as well as a source facing the mask assembly and spraying a deposition material onto the display substrate, wherein the mask assembly comprises a mask sheet, the mask sheet comprising an opening through which the deposition material passes, and The mask sheet further includes: a main body portion including the opening; a rib extending to the main body portion and dividing the opening into two areas; and a shielding portion extending to the rib, protruding from a surface of the rib toward the display substrate, and shielding the deposition material.

2. The device according to claim 1, in, The opening is rectangular, and The ribs are disposed in a diagonal direction to face a vertex of the opening.

3. The device according to claim 1, in, A first distance from a surface of the shielding portion facing the display substrate to a surface of the rib facing the display substrate is equal to or greater than 2.7×10 of a second distance from the source to a surface of the rib facing the source. -4 times.

4. The device according to claim 1, in, At least one of the body portion, the ribs, and the shielding portion includes carbon fiber.

5. The device according to claim 1, in, The ribs and the shielding portion each comprise carbon fibers, and The ribs are attached to the body portion by an adhesive material.

6. The device according to claim 5, in, The body portion includes a seating groove in which the rib is inserted and seated.

7. The device according to claim 1, in, The deposited material forms at least one of the following: a counter electrode, disposed throughout the first display region and the second display region of the display substrate; and at least one of the intermediate layers, the intermediate layer being disposed between the display substrate and the counter electrode, The thickness of the deposited material in the first display area is different from the thickness of the deposited material in the second display area.

8. The device according to claim 1, in, The mask sheet further includes a magnet disposed in the body portion.

9. A method for manufacturing a display device, the method The following steps are involved: Disposing a display substrate and a mask assembly in a chamber; aligning the display substrate with the mask assembly; supplying a deposition material from a source through the mask assembly to the display substrate; as well as forming an open area in the display substrate by selectively blocking the deposited material through the opening of the mask assembly, Wherein, the display substrate includes a first display area and a second display area in addition to the opening area, and A thickness of the deposited material in the first display area is different from a thickness of the deposited material in the second display area.

10. The method according to claim 9, in, The thickness of the deposited material in the first display area is greater than the thickness of the deposited material in the second display area.

11. The method according to claim 9, in, The thickness of the deposition material in the second display area varies in a width direction of the second display area.

12. The method according to claim 11, in, The thickness of the deposition material in the second display area decreases in a direction from an edge of the second display area to a center of the second display area.

13. The method according to claim 11, in, The first display area is rectangular, and The second display area is diagonally disposed to face a vertex of the first display area.

14. The method according to claim 11, in, The mask assembly includes a mask sheet, the mask sheet includes an opening, and The mask sheet also includes: a main body portion including the opening; a rib extending to the body portion and dividing the opening into two areas; and A shielding portion extends to the rib, protrudes from a surface of the rib toward the display substrate, and shields the deposition material.

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