Special solid wood floor protective film with high thermal conductivity and wear resistance

By using a protective film containing specific materials on solid wood floors, the problem of insufficient thermal conductivity and wear resistance of solid wood floors is solved, and faster and more uniform heat transfer and longer service life are achieved, while maintaining the natural appearance of the floor.

CN120041104APending Publication Date: 2025-05-27SHANDONG MUFU HOME FURNISHING CO LTD
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Patent Information

Application Number
CN202510364397.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-26
Publication Date
2025-05-27

AI Technical Summary

Technical Problem

Solid wood floors have shortcomings in thermal conductivity and wear resistance, resulting in uneven indoor temperatures, waste of energy and shortened floor service life.

Method used

A special protective film for solid wood flooring is used that includes a base material (polyimide, polytetrafluoroethylene, polyester), wear-resistant reinforcement (ceramic particles, metal powder), heat-resistant additives (graphite, inorganic filler) and adhesion layers (polyurethane, acrylic or epoxy resin).

Benefits of technology

It improves the thermal conductivity and wear resistance of solid wood floors, extends the service life of the floor, and maintains the natural beauty of the floor.

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Abstract

The invention relates to the technical field of floor film covering, in particular to a protective film special for solid wood floors, which has high thermal conductivity and wear resistance and comprises a substrate material including polymer materials such as polyimide, polytetrafluoroethylene, polyester and the like. Ceramic particles, aluminum oxide, silicon carbide or metal powder, titanium alloy and aluminum powder are adopted as wear-resistant reinforcing components, heat-resistant auxiliaries are added, graphite, inorganic filler and the like with heat stability are added, the high temperature resistance of the material is further improved, the surface of the adhesion layer is coated with a layer of adhesive, the adhesive force between the film material and the floor surface is enhanced, and the service life of the film material is prolonged. Through reasonable material selection and proportioning, the adhesive film disclosed by the invention can be used for remarkably improving the heat conductivity and the wear resistance of the solid wood floor and prolonging the service life of the floor.
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Description

Technical Field

[0001] The present invention relates to the technical field of floor laminating, and particularly to a special protective film for solid wood floors with high thermal conductivity and wear resistance. Background Art

[0002] As a preferred material for high-end home decoration, solid wood floors are favored by consumers for their natural beauty, comfortable texture, and strong durability. However, solid wood floors also face some challenges during use, especially in terms of thermal conductivity and wear resistance.

[0003] In terms of thermal conductivity, the thermal conductivity coefficient of solid wood floors is relatively low, resulting in a slow heating rate and uneven temperature distribution of the floors during the heating season. This not only affects the indoor comfort but also causes energy waste. To improve the thermal conductivity of solid wood floors, some geothermal floors using materials such as metals or graphite have emerged in the market. However, these materials often change the natural texture and beauty of solid wood floors and have a high cost.

[0004] In terms of wear resistance, although solid wood floors are durable, they are still prone to problems such as wear and scratches during long-term use, especially in areas with high foot traffic. This not only affects the beauty of the floors but also shortens their service life. To enhance the wear resistance of solid wood floors, the traditional approach is to apply coating treatments to the floor surface, such as using wear-resistant coatings like polyurethane and acrylic. However, these coating materials often have problems such as easy aging and peeling, and it is difficult to meet the requirements of high thermal conductivity and wear resistance simultaneously.

[0005] Therefore, there is an urgent need to provide a special protective film for solid wood floors with high thermal conductivity and wear resistance to solve the above problems. Summary of the Invention

[0006] To overcome the deficiencies of the prior art, the present invention provides a special protective film for solid wood floors with high thermal conductivity and wear resistance, which can transfer heat more effectively, enabling the solid wood floor to reach the required temperature faster and more evenly during heating, thereby improving the stability of the indoor temperature, having excellent wear resistance, and extending the service life of the solid wood floor.

[0007] The technical solution is as follows:

[0008] A special protective film for solid wood floors with high thermal conductivity and wear resistance, the raw materials of which include: a base material selected from one or more of polyimide, polytetrafluoroethylene, and polyester;

[0009] a wear resistance enhancing component selected from one or more of ceramic particles and metal powders;

[0010] The mass ratio of the base material to the wear resistance enhancing component is 1:2;

[0011] Heat-resistant additives, selected from one or more of graphite and inorganic fillers;

[0012] The adhesion layer is coated with an adhesive on the surface. The adhesive selects polyurethane, acrylic or epoxy resin as the base material, and a toughening agent, fillers and additives are added. The mass ratio of the base material, toughening agent, fillers and additives is 60:20:15:5.

[0013] Preferably, the adhesive selects polyurethane (PU), acrylic (ACRYLIC) or epoxy resin (EPOXY) as the base material, an appropriate amount of toughening agent is added, fillers (talc powder, silica) are added to enhance the mechanical strength and wear resistance of the adhesive, and an appropriate amount of additives such as antioxidants and tackifiers are added to improve the performance of the adhesive. The ratio of the base material: toughening agent: fillers: additives is 60:20:15:5 (weight ratio), and the specific ratio can be adjusted according to actual needs.

[0014] Preferably, the preparation method of the adhesive is as follows:

[0015] Step 1: Mix the polyurethane and the toughening agent in proportion and stir evenly.

[0016] Step 2: Gradually add inorganic fillers and continue to stir to ensure uniform dispersion of the fillers.

[0017] Step 3: Add additives and stir evenly to form a uniform mixture of the adhesive.

[0018] Step 4: Debubble the mixture to remove air bubbles. The debubbling treatment is carried out by vacuum debubbling or ultrasonic debubbling to obtain the final adhesive.

[0019] Preferably, the adhesion layer has a certain reversibility, which is convenient to remove during installation and replacement without leaving residual glue, avoiding damage to the floor surface.

[0020] Preferably, the preparation method of the special protection film for solid wood floors with high thermal conductivity and wear resistance is as follows:

[0021] S1. Select a base material, mix it with a wear-resistant strengthening component according to the weight ratio, and dissolve it in a solvent to form a uniform solution, and adjust the particle size and distribution of ceramic particles as needed to enhance the wear resistance of the film.

[0022] S2. Add heat-resistant additives such as graphite and an adhesive, and further stir evenly to ensure uniform distribution of all components. Use methods such as mechanical stirring and ultrasonic dispersion to ensure the uniformity of the materials.

[0023] S3. Uniformly coat the mixed solution on the surface of the substrate, and use the hot pressing or hot stretching process to enhance the structural strength of the film. The temperature during the hot pressing process is 100 - 200 °C to ensure the uniformity and adhesion of the film material.

[0024] S4. Conduct high-temperature curing treatment on the film material to ensure that the film material maintains stable performance at high temperatures, and at the same time improve its high-temperature resistance and wear resistance.

[0025] Compared with the prior art, the above technical solution conceived by the present invention has the following advantages:

[0026] 1. The selection of the base material and heat-resistant additive of this invention patent enables the film to maintain stable performance in high-temperature environments and will not be damaged due to thermal stress. The protective film has high thermal conductivity, can effectively transfer heat, and improve the heating efficiency of the floor heating system.

[0027] 2. Through reasonable material selection and proportioning, the film of this invention patent can significantly improve the thermal conductivity and wear resistance of solid wood floors, extend the service life of the floors. The protective film has excellent wear resistance, can effectively resist friction and impact in daily use, reduce the wear of solid wood floors, and extend the service life of the floors.

[0028] 3. The protective film of the present invention has high transparency. After installation, it does not change the original appearance of the floor and does not affect the natural beauty of the floor.

[0029] 4. The adhesion layer of the protective film of the present invention has weak adhesion, is convenient for installation and disassembly, leaves no glue marks, and the film layer is easy to clean and maintain simply.

[0030] 5. The present invention is applicable to various types of solid wood floors and can effectively play a role in the floor heating system, solving the problem that traditional floor films cannot balance thermal conductivity and wear resistance. Specific embodiments

[0031] The following further illustrates the special protective film for solid wood floors with high thermal conductivity and wear resistance of the present invention in conjunction with embodiments:

[0032] Embodiment 1

[0033] A special protective film for solid wood floors with high thermal conductivity and wear resistance, including:

[0034] Base material: 60% polyimide (PI), 20% polytetrafluoroethylene (PTFE), 20% polyester (PET);

[0035] Wear-resistant reinforcement component: 60% alumina ceramic particles (Al 2 O 3 ) and 40% silicon carbide ceramic particles (SiC);

[0036] Heat-resistant additive: 5% graphite powder, 85% inorganic filler (talc powder, silicate);

[0037] Adhesive: 60% polyurethane (PU) base material, 20% polyvinyl alcohol (PVA) toughening agent, 15% talc powder filler, 5% antioxidant (BHT).

[0038] The preparation method of the above protective film is as follows:

[0039] Step 1: Preparation of the substrate material:

[0040] Select polyimide (PI) as the substrate material to ensure its excellent high-temperature resistance. Mix polyimide, polytetrafluoroethylene (PTFE) and polyester (PET) in proportion and stir well to form a solution of the substrate material.

[0041] Step 2: Addition of wear-resistant reinforcing components:

[0042] Mix alumina ceramic particles (Al 2 O 3 ) and silicon carbide ceramic particles (SiC) in proportion and add them to the substrate material solution, then stir well. The size and distribution of the particles should be adjusted according to actual needs to enhance the wear resistance of the film.

[0043] Step 3: Addition of heat-resistant additive:

[0044] Add graphite powder and inorganic filler (talc powder, silicate) to the solution in proportion, and continue to stir to ensure uniform distribution. These components effectively improve the heat resistance of the film material.

[0045] Step 4: Preparation of the adhesive:

[0046] According to the weight ratio of 60% polyurethane (PU) base material, 20% polyvinyl alcohol (PVA) toughening agent, 15% talc powder, and 5% antioxidant (BHT), add these components to the solution in sequence. During the mixing process, use the vacuum degassing method to remove air bubbles to ensure the uniformity and quality of the film material, and stir well to ensure the uniformity of the adhesive.

[0047] Step 5: Coating and hot pressing of the film material:

[0048] Coat the well-mixed solution on the prepared substrate and use the hot pressing process for treatment. The hot pressing process uses a temperature of 100°C - 200°C and a pressure of 15 MPa to enhance the structural strength and adhesion of the film.

[0049] Step 6: Curing of the film material:

[0050] The coated film material is cured in a high-temperature environment of 250 °C to ensure that the film material has good high-temperature resistance and wear resistance.

[0051] Step Seven: Preparation of the adhesion layer:

[0052] A weakly adhesive adhesive (such as low-viscosity polyurethane or acrylate) is coated on the back of the film. This adhesive is reversible during the use of the film, facilitating the installation and replacement of the film and avoiding damage to the floor surface caused by adhesive residue.

[0053] Performance testing:

[0054] High-temperature resistance testing:

[0055] The prepared film material is placed in a high-temperature environment of 50 °C for a 24-hour durability test to observe the stability of the film layer. The test results show that the film material does not deform, peel, or damage at high temperatures, indicating excellent high-temperature resistance.

[0056] Wear resistance testing:

[0057] The film material is tested using a standard friction test method. The results show that after 24 hours of friction testing, the friction coefficient of the film surface remains below 0.08, and there is no obvious wear or peeling of the film layer, indicating good wear resistance.

[0058] Adhesion testing:

[0059] The adhesion layer is brought into contact with the floor surface and subjected to a tensile test. The test shows that the adhesion force is stable and does not peel off under high-temperature and friction conditions, demonstrating excellent adhesion performance.

[0060] Example 2

[0061] A special protective film for solid wood floors with high thermal conductivity and wear resistance, comprising:

[0062] Base material: 50% polyimide (PI), 30% polytetrafluoroethylene (PTFE), 20% polyester (PET);

[0063] Wear resistance enhancing component: 70% alumina ceramic particles (Al 2 O 3 ) and 30% metal powder (titanium alloy powder);

[0064] Heat-resistant additive: 7% graphite powder, 93% inorganic filler (talc powder), Adhesive: 70% acrylic (ACRYLIC) base, 20% polyvinyl alcohol (PVA) toughening agent, 10% talc powder filler.

[0065] Step One: Preparation of the base material:

[0066] Mix 50% polyimide (PI), 30% polytetrafluoroethylene (PTFE) and 20% polyester (PET) in proportion and stir evenly.

[0067] Step Two: Addition of wear-resistant reinforcing components:

[0068] Mix alumina ceramic particles (Al 2 O 3 ) and titanium alloy powder in proportion, add them to the solution, and continue to stir evenly. The particle size and distribution should be adjusted according to the wear-resistant requirements.

[0069] Step Three: Addition of heat-resistant additives:

[0070] Add graphite powder and talcum powder in proportion and stir evenly to enhance the high-temperature resistance of the film.

[0071] Step Four: Preparation of the adhesive:

[0072] Mix 70% acrylic base material, 20% polyvinyl alcohol toughening agent and 10% talcum powder filler. During the mixing process, use the method of ultrasonic degassing to remove air bubbles to ensure the uniformity and quality of the film material, and prepare an adhesive to ensure its good adhesion.

[0073] Step Five: Film coating and hot pressing:

[0074] Evenly coat the prepared solution on the surface of the substrate and perform hot pressing treatment, using

[0075] a temperature of 100°C - 200°C and 18 MPa.

[0076] Step Six: Curing and degassing:

[0077] Perform a curing treatment on the film material at 250°C to ensure its high-temperature resistance and wear resistance, and perform a degassing treatment to remove air bubbles to ensure that the film layer is uniform and defect-free.

[0078] High-temperature resistance test:

[0079] After testing for 24 hours in an environment of 50°C, the film layer shows no damage and maintains its original strength.

[0080] Wear resistance test:

[0081] After the friction test, the friction coefficient of the film layer is 0.07 and there is no obvious wear on the surface.

[0082] Through the above embodiments, the special protective film for solid wood floors with high thermal conductivity and wear resistance demonstrates its excellent performance and application potential, especially suitable for environments with high temperature and large friction, and can effectively protect the surface of solid wood floors and extend their service life.

[0083] Although the present disclosure has been shown and described with reference to specific exemplary embodiments thereof, those skilled in the art should understand that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents. Accordingly, the scope of the present disclosure should not be limited to the above-described embodiments, but should be determined not only by the appended claims but also by the equivalents of the appended claims.

Claims

1. A protective film for solid wood flooring with high thermal conductivity and wear resistance, characterized in that: Raw materials include : Base material, selected from one or more of polyimide, polytetrafluoroethylene, and polyester; Wear-resistant reinforcing components are selected from one or more of ceramic particles and metal powders; The mass ratio of the base material to the wear-resistant reinforcing component is 1:2; Heat-resistant additive, selected from one or more of graphite and inorganic filler; The adhesive layer is coated with an adhesive on the surface. The adhesive is made of polyurethane, acrylic acid or epoxy resin as a base material, and a toughening agent, a filler and an auxiliary agent are added. The mass ratio of the base material, the toughening agent, the filler and the auxiliary agent is 60:20:15:

5.

2. A protective film for solid wood flooring with high thermal conductivity and wear resistance as claimed in claim 1, characterized in that: The preparation method of the adhesive comprises: a) mixing polyurethane and toughening agent in proportion and stirring them evenly; b) gradually adding fillers and continuing stirring to ensure that the fillers are evenly dispersed; c) adding auxiliary agents and stirring them evenly to form a uniform mixture of adhesives; d) degassing the mixture to remove bubbles and obtain the final adhesive.

3. A protective film for solid wood flooring with high thermal conductivity and wear resistance as claimed in claim 2, characterized in that: The degassing treatment in step d) adopts vacuum degassing or ultrasonic degassing.

4. A protective film for solid wood flooring with high thermal conductivity and wear resistance, characterized in that: The preparation method comprises the following steps: S1. Select a base material, mix it with the wear-resistant enhancement component in a weight ratio, and dissolve it in a solvent to form a uniform solution, and adjust the particle size and distribution of the ceramic particles as needed to enhance the wear resistance of the film; S2, add heat-resistant additives and adhesives, and further stir to ensure uniform distribution of all ingredients; S3, coating the mixed solution evenly on the surface of the substrate, using hot pressing or hot stretching process to enhance the structural strength of the film and ensure the uniformity and adhesion of the film material; S4. Perform high temperature curing treatment on the membrane material to ensure that the membrane material maintains stable performance at high temperatures, while improving its high temperature resistance and wear resistance.

5. A protective film for solid wood flooring with high thermal conductivity and wear resistance as claimed in claim 4, characterized in that: The step S2 adopts mechanical stirring and ultrasonic dispersion methods to ensure the uniformity of the material.

6. A protective film for solid wood flooring with high thermal conductivity and wear resistance as claimed in claim 5, characterized in that: The hot pressing process uses a temperature of 100-200°C.