Manufacturing method of local nickel-plated corrosion nameplate

Abstract

The invention discloses a manufacturing method of a local nickel-plated corrosion nameplate, and relates to the technical field of metal processing. Comprising the following steps: manufacturing a dry film pattern transfer negative film and a secondary pattern transfer negative film; cleaning the substrate, performing dry film pattern transfer by adopting a dry film pattern transfer negative film to obtain a substrate with a local dry film, and performing chemical corrosion to obtain a substrate with characters and patterns; carrying out silk-screen printing on photosensitive solder resist ink on the substrate with the characters and the patterns, and curing; the substrate is exposed, developed and cured again through a secondary pattern transfer negative film, a substrate with a local protection layer is obtained, and the substrate with the local protection layer means that the part not needing nickel plating is provided with a protection layer; nickel plating; removing the protective layer; spraying paint; by adopting the secondary pattern transfer negative film and the photosensitive solder resist ink, the photosensitive solder resist ink is locally distributed at a part which does not need nickel plating to form a protective layer, so that the precision and accuracy of local nickel plating are ensured, and the method is more suitable for the condition that the precision of characters or patterns is required to be high.

Description

Technical Field

[0001] The present invention relates to the technical field of metal processing, and particularly relates to a manufacturing method for a locally nickel-plated and etched nameplate. Background Art

[0002] An etched nameplate, also known as an engraved nameplate, is an identification sign in which patterns or characters are etched into depressions or protrusions on the metal surface through chemical or physical methods, having a unique visual effect and high durability.

[0003] The manufacturing process of an etched nameplate generally includes steps such as photoplotting, material preparation, graphic transfer, chemical etching, painting, machining, etc. The method of using dry film graphic transfer is adopted to protect the parts of the nameplate that do not need to be etched. Other parts are etched to a certain depth by chemical etching to form a nameplate with raised characters. Generally, there is no requirement for plating on the character parts.

[0004] Recently, with the improvement of product protection requirements, some product etched nameplates require nickel plating on the character parts. The existing local protection methods usually spray or brush some coatings on the non-nickel-plated areas to protect the areas that do not need nickel plating by using their good chemical stability and corrosion resistance. However, this method cannot achieve the protection of the areas outside the characters. Generally, the line width of the characters is about 0.3 mm, and it is impossible to achieve precision when using coating spraying or brushing for protection. Therefore, there is a problem of low protection precision and it is impossible to achieve precise protection of the non-nickel-plated areas. Summary of the Invention

[0005] The present invention is to solve the technical problem that the existing technology for nickel plating on the character parts of an etched nameplate and using coatings to cover and protect the non-nickel-plated areas cannot achieve precise protection. The purpose is to provide a manufacturing method for a locally nickel-plated and etched nameplate, which uses a secondary graphic transfer negative and photosensitive solder resist ink to make the photosensitive solder resist ink locally distributed on the parts that do not need nickel plating to form a protective layer, ensuring the precision and accuracy of local nickel plating, and being more suitable for the situation where high precision is required for characters or patterns.

[0006] The present invention is achieved through the following technical solutions:

[0007] A manufacturing method for a locally nickel-plated and etched nameplate includes the following steps:

[0008] S1. Produce a dry film graphic transfer negative and a secondary graphic transfer negative;

[0009] S2. Clean the substrate, perform dry film graphic transfer using the dry film graphic transfer negative to obtain a substrate with local dry film, and then obtain a substrate with character graphics through chemical etching;

[0010] S3. Produce a local protective layer:

[0011] S31. Screen-print a photosensitive solder resist ink on the substrate with text graphics and cure it.

[0012] S32. Expose and develop the substrate using a secondary graphic transfer negative film, and then cure it again to obtain a substrate with a partial protective layer. The substrate with a partial protective layer refers to a substrate with a protective layer on the parts that do not require nickel plating.

[0013] S4. Nickel plating.

[0014] S5. Remove the protective layer.

[0015] S6. Spray paint.

[0016] Further, in step S31, after printing, cure at 80 - 120 °C for 5 - 10 min.

[0017] Further, in step S32, the developing temperature is 28 - 32 °C and the spray pressure is 1.5 - 3.0 Kg / cm2.

[0018] Further, in step S32, after developing, cure at 150 - 180 °C for 1 - 1.5 hours to fully cure the protective layer.

[0019] Further, in step S2, the substrate cleaning process includes:

[0020] Brush the board, ultrasonic cleaning, high-pressure water washing, secondary water washing, blotting, air drying, and baking.

[0021] Further, in step S2, the steps of dry film graphic transfer include:

[0022] Attach a dry film to the surface of the clean substrate, cover the dry film with a dry film graphic transfer negative film, and perform exposure and development in sequence to obtain a substrate with a partial dry film.

[0023] Further, in step S2, the chemical etching process includes:

[0024] Etch the substrate with a partial dry film in an acidic etching solution to remove the dry film and obtain a substrate with text graphics.

[0025] Further, in step S2, electroplating nickel is used for nickel plating.

[0026] Further, in step S5, a sodium hydroxide solution is used to remove the protective layer.

[0027] Further, in step S6, spray painting specifically refers to spraying a protective paint on the non-nickel-plated parts.

[0028] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0029] 1. The present invention makes a local protective layer on the nameplate after chemical corrosion, uses the photosensitive solder resist ink printed on the substrate to protect the parts that do not need to be nickel-plated, and through the designed secondary pattern transfer negative film, after exposure, development, and re-curing, a substrate with a local protective layer is obtained. On this substrate, due to the use of the secondary pattern transfer negative film, the photosensitive solder resist ink can be accurately distributed in the parts that do not need to be nickel-plated to form a protective layer. Then, through the nickel-plating process, nickel plating is carried out on the text parts that need to be nickel-plated, and finally, the protective layer is removed, realizing local nickel plating of the corroded nameplate.

[0030] 2. The present invention uses a secondary pattern transfer negative film to locally distribute the photosensitive solder resist ink and protect the parts that do not need to be nickel-plated. Compared with the method of protecting the non-nickel-plated area by spraying or brushing paint in the prior art, the present invention can be applied to the situation where high precision is required for text or patterns, and can ensure the accuracy and precision of local nickel plating. Brief Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings. In the drawings:

[0032] Figure 1 It is the process flow chart of Embodiment 1. Detailed Embodiments

[0033] To make the purpose, technical solutions, and advantages of the present invention clearer and more understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments and the drawings. Obviously, the illustrative embodiments and their descriptions of the present invention are only used to explain the present invention and do not serve as a limitation to the present invention.

[0034] The following will appropriately refer to the drawings to detail the embodiments of a method for manufacturing a locally nickel-plated corroded nameplate of the present invention. However, there will be cases where unnecessary details are omitted. For example, there are cases where the detailed description of well-known matters and repeated descriptions are omitted. This is to avoid the following description from becoming unnecessarily long and to facilitate the understanding of those skilled in the art.

[0035] The "range" disclosed in this application is defined in the form of a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, and the selected lower limit and upper limit define the boundary of a specific range. The range defined in this way can include the end values or not include the end values, and can be combined arbitrarily, that is, any lower limit can be combined with any upper limit to form a range.

[0036] Unless otherwise specified, all embodiments and optional embodiments of the present application can be combined with each other to form new technical solutions.

[0037] Unless otherwise specified, all technical features and optional technical features of the present application can be combined with each other to form new technical solutions.

[0038] Unless otherwise specified, the terms "comprising" and "including" mentioned in the present application mean open-ended, and can also be closed-ended. For example, the terms "comprising" and "including" can mean that other substances not listed can also be included, or can only include the substances listed.

[0039] Unless otherwise specified, all steps of the present application can be carried out in sequence or randomly, preferably in sequence. For example, the method includes steps (a) and (b), which means that the method can include steps (a) and (b) carried out in sequence, or can also include steps (b) and (a) carried out in sequence. For example, it is mentioned that the method can further include step (c), which means that step (c) can be added to the method in any order. For example, the method can include steps (a), (b) and (c), or can also include steps (a), (c) and (b), or can also include steps (c), (a) and (b), etc.

[0040] A method for manufacturing a locally nickel-plated and etched nameplate includes the following steps:

[0041] S1. Produce a dry film graphic transfer negative and a secondary graphic transfer negative;

[0042] S2. Clean the substrate, perform dry film graphic transfer using the dry film graphic transfer negative to obtain a substrate with a local dry film, and then perform chemical etching to obtain a substrate with text graphics;

[0043] S3. Produce a local protective layer:

[0044] S31. Screen-print a photosensitive solder resist ink on the substrate with text graphics and cure it;

[0045] S32. Expose and develop the substrate using the secondary graphic transfer negative, and then cure it again to obtain a substrate with a local protective layer. The substrate with a local protective layer refers to a substrate with a protective layer at the parts where nickel plating is not required;

[0046] S4. Nickel-plate;

[0047] S5. Remove the protective layer;

[0048] S6. Spray paint.

[0049] In the present invention, a local protective layer is made on the nameplate after chemical etching. The photosensitive solder resist ink printed on the substrate is used to protect the parts that do not need to be nickel-plated. Through the designed secondary pattern transfer negative film, after exposure, development, and re-curing, a substrate with a local protective layer is obtained. On this substrate, due to the use of the secondary pattern transfer negative film, the photosensitive solder resist ink can be accurately distributed in the parts that do not need to be nickel-plated to form a protective layer. Then, through the nickel-plating process, nickel plating is carried out on the text parts that need to be nickel-plated. Finally, the protective layer is removed, realizing local nickel plating on the etched nameplate.

[0050] The present invention uses a secondary pattern transfer negative film to locally distribute the photosensitive solder resist ink and protect the parts that do not need to be nickel-plated. Compared with the prior art method of protecting the non-nickel-plated area by spraying or brushing coatings, the present invention can be applied to the situation where high precision is required for text or patterns, and can ensure the accuracy and precision of local nickel plating.

[0051] Preferably, in step S31, after printing, it is cured at 80 - 120 °C for 5 - 10 min. The printing is operated by a screen printing machine. After the photosensitive solder resist ink is printed, curing is required to preliminarily cure the protective layer.

[0052] Preferably, in step S32, the developing temperature is 28 - 32 °C, and the spraying pressure is 1.5 - 3.0 Kg / cm 2 . When performing the developing process of the local protective layer, it is necessary to control the developing temperature at 28 - 32 °C and the spraying pressure at 1.5 - 3.0 Kg / cm 2 to ensure a good developing effect.

[0053] Preferably, in step S32, after developing, it is cured at 150 - 180 °C for 1 - 1.5 hours to completely cure the protective layer. In this step, after developing, the protective layer remaining on the substrate is further cured to form a protective layer, so as to achieve effective protection during the subsequent nickel plating.

[0054] Preferably, in step S2, the substrate cleaning process includes:

[0055] Brush plate, ultrasonic cleaning, high-pressure water washing, secondary water washing, drying, air drying, baking. The substrate is cleaned before the dry film pattern transfer to remove the oil stain and oxide film on the substrate surface and ensure the effect of dry film pattern transfer.

[0056] Preferably, in step S2, the steps of dry film pattern transfer include:

[0057] Stick a dry film on the clean substrate surface, and use a knife to remove the excess dry film around;

[0058] Cover the dry film pattern transfer negative on the dry film, and use an exposure machine for exposure. The dry film on the substrate covered by the black part of the negative will not be cured, while the uncovered part will be cured. Then, develop the substrate through a developing machine to remove the uncured dry film, and a substrate with a local dry film is obtained.

[0059] Further, in step S2, the process of chemical etching includes:

[0060] Etch the substrate with a local dry film in an acidic etching solution, stop etching after reaching a certain depth, and then use a sodium hydroxide solution to remove the dry film to obtain a substrate with text patterns.

[0061] Further, in step S2, nickel plating is carried out by electroplating nickel. The specific process of electroplating nickel includes processes such as degreasing, activation, electroplating nickel, water washing, pure water washing, air drying, and baking of the substrate with a local protective layer. A nickel layer is plated on the part that needs to be nickel plated, and there is no nickel layer on the part covered by the protective layer. The principle of the electroplating nickel is to use the workpiece to be plated as the cathode and a pure nickel plate as the anode, place them in the electrolyte solution, and through the action of direct current, nickel ions are deposited on the cathode surface to form a coating. In the present invention, there is no limitation on the specific type of electrolyte used in the electroplating nickel process. The electrolyte for electroplating nickel usually consists of nickel salts (such as nickel sulfate, nickel chloride), conductive salts, pH buffer agents, and wetting agents. Common types of nickel plating solutions include sulfate type, chloride type, sulfamate type, citrate type, and fluoroborate type. That is, the corresponding functions can be achieved by using common nickel plating solutions in the prior art.

[0062] Further, in step S5, a sodium hydroxide solution is used to remove the protective layer.

[0063] Further, in step S6, painting specifically refers to spraying a protective paint on the non-nickel plated parts.

[0064] The technical solution of the present invention will be further described in detail below in conjunction with embodiments.

[0065] It should be noted that the experimental methods used in the embodiments are all conventional methods unless otherwise specified. The materials, reagents, methods, and instruments used, unless otherwise specified, are all conventional materials, reagents, methods, and instruments in this field, and those skilled in the art can obtain them through commercial channels.

[0066] Example 1

[0067] A method for manufacturing a locally nickel-plated and etched nameplate includes the following steps:

[0068] S1. Photoplotting

[0069] Produce a photoplotting file according to the design software and draw a dry film pattern transfer negative. Produce a photoplotting file according to the pattern of local nickel plating and draw a secondary pattern transfer negative.

[0070] The specific steps are as follows:

[0071] S11. Developing

[0072] Develop the negative film with a developer to obtain the required dry film pattern transfer negative film and the secondary pattern transfer negative film;

[0073] S12. Fixing

[0074] Fix the dry film pattern transfer negative film and the secondary pattern transfer negative film with a fixer to ensure that the pattern negative film is clear;

[0075] S13. Washing

[0076] Wash off the residual fixer to ensure that the negative film is clean;

[0077] S14. Drying

[0078] Dry the dry film pattern transfer negative film and the secondary pattern transfer negative film under the condition of 40 - 50 °C.

[0079] S2. Preparing materials

[0080] Prepare the substrates on the plate shearing machine according to the planned quantity and the panel size, and check that the material name, model are consistent with the design requirements.

[0081] S3. Dry film pattern transfer

[0082] In this step, the substrates are cleaned to remove oil stains and oxide films, then laminated, the pattern transfer negative film is accurately aligned with the substrates, the dry film is exposed and developed, and the excess dry film is removed, leaving part of the dry film so that the parts on the substrates that need to be marked with text are covered and protected by the dry film.

[0083] The specific steps are as follows:

[0084] S31. Substrate cleaning

[0085] Load the plates, brush the plates, perform ultrasonic cleaning, high-pressure water washing, secondary water washing, suction drying, air drying, drying, and unload the plates to remove the oil stains and oxide films on the surface of the substrates through cleaning.

[0086] S32. Laminating

[0087] Check the surface of the substrates, ensure that the surface is clean, then stick the dry film on the substrate, and use a knife to remove the excess dry film around.

[0088] S33. Exposure

[0089] After accurately aligning the dry film pattern transfer negative film with the substrates through the alignment holes, fix them on the surface of the substrates with tape. After adjusting the energy and vacuum degree of the exposure machine, expose the substrates on the exposure machine. The dry film on the substrates covered by the black part of the negative film will not be cured, while the part not covered will be cured, that is, the dry film that needs to be retained on the substrates is cured.

[0090] S34. Development

[0091] After standing for 15 minutes, the substrate is developed by a developing machine to remove the uncured dry film, obtaining a substrate with a partial dry film, that is, the parts on the substrate where text needs to be made are covered and protected by the dry film.

[0092] S4. Chemical etching

[0093] The substrate with a partial dry film undergoes etching, fluffing, and film removal processes to obtain a text pattern.

[0094] The specific steps are as follows:

[0095] S41. Etching

[0096] After putting the substrate into an acidic etching solution (acidic copper chloride etching solution), the acidic etching solution etches away the parts of the substrate not protected by the dry film. When the etching depth reaches 0.1 mm, the etching stops. At this time, a text pattern is formed after etching.

[0097] S42. Fluffing and film removal

[0098] A chemical reaction occurs with the dry film in a sodium hydroxide solution, causing the dry film on the text pattern to fall off from the substrate, obtaining a substrate with a text pattern.

[0099] S5. Making a partial protective layer

[0100] Screen-print photosensitive solder resist ink on the substrate, perform solder resist exposure and development, remove the excess photosensitive solder resist ink, and leave part of the photosensitive solder resist ink after curing to form a protective layer, so that the surface of the substrate except the parts that need to be nickel-plated is covered and protected by the protective layer.

[0101] The specific steps are as follows:

[0102] S51. Screen-printing photosensitive solder resist

[0103] Use a screen printer to print a certain thickness of photosensitive solder resist ink on the whole board of the substrate, and cure it at 100 °C for 8 minutes for preliminary curing.

[0104] S52. Exposure

[0105] After accurately aligning the secondary pattern transfer negative film with the substrate through the alignment holes and fixing them on the substrate surface with tape, adjust the energy and vacuum degree of the exposure machine, and then expose the substrate on the exposure machine. The photosensitive solder resist ink on the substrate covered by the black part of the negative film will not cure, while the uncovered part will cure, that is, the photosensitive solder resist ink on the parts of the substrate that do not need to be nickel-plated cures.

[0106] S53. Development

[0107] After standing for 15 minutes, develop on the developing machine and etch away the uncured solder resist ink.

[0108] Developing temperature: 30°C; Spray pressure: 2.0 Kg / cm 2 .

[0109] S54. Curing

[0110] Cure at 175°C for 1 hour to completely cure the solder resist ink and obtain a substrate with a partial protective layer.

[0111] S6. Nickel plating

[0112] The substrate with a partial protective layer undergoes degreasing, activation, electroplating nickel, water washing, pure water washing, air drying, and drying processes for nickel plating to achieve nickel plating on the parts that need to be nickel plated, and there is no nickel layer on the parts covered by the protective layer.

[0113] S7. Removing the protective layer

[0114] After nickel plating is completed, put the substrate into sodium hydroxide solution to chemically react with the protective layer, so that the protective layer falls off from the substrate and exposes the non-nickel plated parts.

[0115] S8. Spraying paint

[0116] Spray protective paint on the non-nickel plated parts to prevent these parts from being corroded or contaminated in the subsequent processes, and at the same time improve the reliability and service life of the product.

[0117] S9. Machining

[0118] Further mill into individual parts to obtain a corroded nameplate with a partial nickel plating layer.

[0119] Example 2

[0120] The difference between this example and Example 1 is that in step S51, after printing, cure at 80°C for 10 min.

[0121] Example 3

[0122] The difference between this example and Example 1 is that in step S51, after printing, cure at 120°C for 5 min.

[0123] Example 4

[0124] The difference between this example and Example 1 is that in step S54, after printing, cure at 150°C for 1.5 min.

[0125] Example 5

[0126] The difference between this example and Example 1 is that in step S54, after printing, cure at 180°C for 1 min.

[0127] Finally, it should be noted that: The above specific embodiments are only used to elaborate in detail the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only the specific implementation manners of the present invention and is not used to limit the protection scope of the present invention; Although the present invention has been described in detail with reference to the foregoing specific embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements, improvements, etc. on some or all of the technical features; And these modifications, equivalent replacements and improvements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered by the scope of the claims and the description of the present invention.

Claims

1. A method for making a local nickel-plated corrosion nameplate, characterized in that: The following steps are involved: S1, making dry film pattern transfer film and secondary pattern transfer film; S2, cleaning the substrate, transferring the dry film pattern using a dry film pattern transfer film, obtaining a substrate with a partial dry film, and then chemically etching to obtain a substrate with text patterns; S3. Making a local protective layer: S31, screen printing a photosensitive solder resist ink on a substrate with text graphics, and curing the ink; S32, exposing the substrate using a secondary pattern transfer film, developing, and curing again to obtain a substrate with a partial protective layer, wherein the substrate with a partial protective layer refers to a substrate with a protective layer at a portion where nickel plating is not required; S4, nickel plating; S5, removing the protective layer; S6. Spray paint.

2. The method for making a local nickel-plated corrosion nameplate according to claim 1, characterized in that: In step S31, after printing is completed, curing is performed at 80-120°C for 5-10 minutes.

3. The method for making a local nickel-plated corrosion nameplate according to claim 1, characterized in that: In step S32, the developing temperature is 28-32°C and the spraying pressure is 1.5-3.0 Kg / cm 2 .

4. The method for making a local nickel-plated corrosion nameplate according to claim 1, characterized in that: In step S32, after the development is completed, the protective layer is cured at 150-180°C for 1-1.5 hours to completely cure the protective layer.

5. The method for making a local nickel-plated corrosion nameplate according to claim 1, characterized in that: In step S2, the substrate cleaning process includes: Brushing, ultrasonic cleaning, high-pressure water washing, two-stage water washing, sucking dry, blowing dry, and drying.

6. The method for making a local nickel-plated corrosion nameplate according to claim 1, characterized in that: In step S2, the step of transferring the dry film pattern includes: A dry film is pasted on the surface of a clean substrate, and the dry film pattern transfer film is covered on the dry film. Exposure and development are performed in sequence to obtain a substrate with a partial dry film.

7. The method for making a local nickel-plated corrosion nameplate according to claim 1, characterized in that: In step S2, the chemical etching process includes: The substrate with the local dry film is etched in an acidic etching solution to remove the dry film, thereby obtaining a substrate with text patterns.

8. The method for making a local nickel-plated corrosion nameplate according to claim 1, characterized in that: In step S2, the nickel plating is performed by electroplating nickel.

9. The method for making a local nickel-plated corrosion nameplate according to claim 1, characterized in that: In step S5, the protective layer is removed using a sodium hydroxide solution.

10. The method for making a local nickel-plated corrosion nameplate according to claim 1, characterized in that: In step S6, spraying paint specifically refers to spraying protective paint on non-nickel-plated parts.

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