Heat dissipation device and server
By designing a heat dissipation device for water inlet and water outlet that can be connected to the water inlet and outlet of different computing nodes, the problem that the heat dissipation device in the prior art needs to be frequently adjusted to adapt to the development speed of computing nodes, and the effect of reducing design and production costs and improving flexibility and reliability is achieved.
Patent Information
- Application Number
- CN202510527986.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2045-04-25
AI Technical Summary
In the prior art, as the development speed of computing nodes (especially GPU cards) accelerates, the cooling device needs to be frequently adjusted to adapt to new needs, resulting in increased design and production costs and serious waste of resources.
A heat dissipation device is designed, which includes a water inlet and water outlet that can be connected to the water inlet and water outlet of different computing nodes. Through the flexible arrangement and adjustment of the water inlet and water outlet of the water inlet and water outlet, it can adapt to the needs of different computing nodes without changing the heat dissipation device.
It reduces the design and production costs of the heat dissipation device, reduces the consumption of resources, improves the flexibility and reliability of the heat dissipation device, and makes it compatible with more computing nodes.
Smart Images

Figure CN120045042A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of electronic devices, and in particular, to a heat dissipation device and a server. Background Art
[0002] In the related art, it is pointed out that with the continuous progress of AI technology, the computing power and power consumption of a single GPU card continue to increase, making it particularly important to effectively dissipate heat from the GPU card in its server. In the design of an AI all-in-one cabinet, considering the development and changes of computing nodes (mainly GPU cards), the design of the all-in-one cabinet must also be adjusted accordingly to meet new requirements. The current practice is to integrate the power supply unit, the GPU server, and the cooling distribution unit (CDU) in the same cabinet, and usually use the cold plate liquid cooling method for heat dissipation.
[0003] Specifically, two liquid cooling pipelines are configured at the rear of the cabinet to provide channels for the incoming and outgoing coolant respectively. All server computing nodes are connected to the CDU located at the bottom of the cabinet through these two pipelines, and the CDU is responsible for providing secondary-side heat dissipation processing for the server. However, with the replacement of each generation of computing nodes, this design often requires re-designing and adapting to a new cabinet, resulting in increased costs and wasted resources. Because the development speed of computing nodes is significantly faster than the evolution speed of the cabinet, in most cases, the modification of the cabinet is only a passive adjustment made to meet the needs of new computing nodes. This situation not only increases the cost of designing a new cabinet but also consumes a large amount of human resources. Summary of the Invention
[0004] This application aims to at least solve one of the technical problems existing in the prior art. For this reason, this application proposes a heat dissipation device, which reduces the design cost and production cost, reduces the consumption of resources, ensures that the heat dissipation device can be compatible with more computing nodes, and improves the flexibility and reliability of the heat dissipation device.
[0005] This application also proposes a server with a heat dissipation device.
[0006] A heat dissipation device according to the first aspect of the present application, the heat dissipation device is used for dissipating heat from a computing node, and the heat dissipation device includes: a cabinet, the computing node is arranged in the cabinet, and each computing node has a water inlet and a water outlet; a cold quantity distribution unit, the cold quantity distribution unit is arranged in the cabinet; a water inlet assembly, the water inlet assembly is arranged on the cabinet, the water inlet assembly is connected between the cold quantity distribution unit and each computing node, the water inlet assembly includes a plurality of water inlet pipes, the plurality of water inlet pipes all extend in the vertical direction and are arranged at intervals in a first direction, and the water inlet of each computing node is communicated with at least one of the plurality of water inlet pipes; a water outlet assembly, the water outlet assembly is arranged on the cabinet, the water outlet assembly is connected between the cold quantity distribution unit and each computing node, the water outlet assembly includes a plurality of water outlet pipes, the plurality of water outlet pipes all extend in the vertical direction and are arranged at intervals in the first direction, and the water outlet of each computing node is communicated with at least one of the plurality of water outlet pipes.
[0007] According to the heat dissipation device of the present application, by providing a water inlet assembly and a water outlet assembly that can be connected and communicated with the water inlets and outlets of different computing nodes, even if the computing nodes are continuously improved, the heat dissipation device can be adapted to the computing nodes without adjustment, thereby reducing the design cost and production cost of the device, reducing the consumption of resources, ensuring that the heat dissipation device can be compatible with more computing nodes, and improving the flexibility and reliability of the heat dissipation device.
[0008] In some feasible embodiments of the present application, the plurality of water inlet pipes and the plurality of water outlet pipes are arranged in one-to-one correspondence, and each water inlet pipe and the corresponding water outlet pipe are arranged adjacent to each other to form a group.
[0009] In the above technical solution, the water inlet assembly and the water outlet assembly are adapted to be connected and communicated with different computing nodes. Even if different computing nodes are replaced, there is no need to replace the heat dissipation device, and there is no need to use long pipes for connection, ensuring that the structure of the heat dissipation device is simple, facilitating assembly and maintenance, and reducing the assembly difficulty and maintenance difficulty.
[0010] In some feasible embodiments of the present application, a truss is provided on the cabinet, and a plurality of adjusting parts are provided on the truss, and the upper ends of each water inlet pipe and the corresponding water outlet pipe are both connected to the corresponding adjusting part.
[0011] In the above technical solution, the water inlet pipe and / or the water outlet pipe in each installation position can be adjusted accordingly according to the positions of the water inlet and / or the water outlet on the computing node, so as to connect the computing node with the cold quantity distribution unit without changing the structure of the heat dissipation device, making the water inlet assembly and the water outlet assembly adapted to be connected and communicated with different computing nodes, improving the flexibility of the heat dissipation device, and reducing the design cost and production cost.
[0012] In some feasible embodiments of the present application, each of the adjusting parts is formed as an adjusting hole, and fixing rods are provided between each water inlet pipe and the cabinet body and between each water outlet pipe and the cabinet body. The fixing rods extend in a second direction perpendicular to the first direction and pass through the adjusting holes, and the position of the fixing rods in the adjusting holes along the first direction is adjustable.
[0013] In the above technical solution, by providing the adjusting holes and the fixing rods, the water inlet assembly and / or the water outlet assembly are connected to the cabinet body through the fixing rods passing through the adjusting holes, and the relative position with the cabinet body is adjustable, improving the flexibility and adaptability of the heat dissipation device, and enhancing the stability and reliability of the heat dissipation device.
[0014] In some feasible embodiments of the present application, an adjusting member is provided between each water inlet pipe and the corresponding water outlet pipe, and the adjusting member is used to adjust the distance between the water inlet pipe and the corresponding water outlet pipe.
[0015] In the above technical solution, by providing the adjusting member between the water inlet pipe and the water outlet pipe, precise adjustment of the position of the water inlet pipe and / or the water outlet pipe is achieved, improving the flexibility and adaptability of the heat dissipation device, simplifying the installation and maintenance steps, and enhancing the reliability and safety of the heat dissipation device.
[0016] In some feasible embodiments of the present application, the adjusting member is formed with two adjusting grooves arranged back to back, the two adjusting grooves respectively arrange one water inlet pipe and the corresponding water outlet pipe, and the distance between the two adjusting grooves is adjustable.
[0017] In the above technical solution, by forming two adjusting grooves arranged back to back on the adjusting member and the distance between the two adjusting grooves being adjustable, the adjustment flexibility of the water inlet assembly and / or the water outlet assembly is improved. The water inlet pipe and / or the water outlet pipe are arranged in the adjusting grooves, which not only plays a role in fixing the water inlet pipe and / or the water outlet pipe, but also facilitates adjusting the distance between the water inlet pipe and / or the water outlet pipe, or facilitating adjusting the relative position between the water inlet pipe and / or the water outlet pipe and the cabinet body, being suitable for assembling with computing nodes of different structures and models, thereby reducing the design cost and production cost of the heat dissipation device.
[0018] In some feasible embodiments of the present application, the adjusting member has an adjusting seat and two adjusting blocks. The two adjusting blocks are respectively arranged on both sides of the adjusting seat in the first direction. Each adjusting block is formed with one adjusting groove, and each adjusting block is formed with a first adjusting part, and the adjusting seat is formed with a second adjusting part. The distance between each adjusting block and the adjusting seat is adjusted by the cooperation of the first adjusting part and the second adjusting part.
[0019] In the above technical solution, adjustment slots are provided on each adjustment block, and the water inlet pipe and / or the water outlet pipe are fixed in the adjustment slots. Through the cooperation between the first adjustment part and the second adjustment part, the position of each adjustment block relative to the adjustment seat can be accurately adjusted, so as to realize the accurate adjustment of the water inlet pipe and the water outlet pipe, reducing the installation difficulty and maintenance difficulty of the heat dissipation device.
[0020] In some feasible embodiments of the present application, the heat dissipation device further includes: a flow splitting disk, which is arranged on the cabinet body and is communicated with the cold quantity distribution unit.
[0021] In the above technical solution, a flow splitting disk is arranged between the water inlet assembly and the cold quantity distribution unit and between the water outlet assembly and the cold quantity distribution unit. In this way, even if the position of the water inlet pipe of the water inlet assembly changes and / or the position of the water outlet pipe of the water outlet assembly changes, the flow splitting disk can still be communicated with the cold quantity distribution unit. The water inlet assembly and the water outlet assembly are suitable for being connected with different computing nodes, and there is no need to use long pipelines for connection, ensuring that the structure of the heat dissipation device is simple, facilitating assembly and maintenance, reducing the assembly difficulty and maintenance difficulty, and enhancing the adaptability and expandability of the heat dissipation device.
[0022] In some feasible embodiments of the present application, the water inlet assembly includes: a water inlet distributor, which is connected between the cold quantity distribution unit and each water inlet pipe, and each water inlet pipe is communicated with the water inlet distributor. The water inlet distributor is communicated with the cold quantity distribution unit and / or the flow splitting disk.
[0023] In the above technical solution, a water inlet distributor is arranged between the cold quantity distribution unit and the water inlet pipe, so that the refrigerant can be evenly distributed from the cold quantity distribution unit to each water inlet pipe, ensuring that each computing node can obtain the same or adjusted refrigerant flow according to requirements. By centrally managing the distribution of the refrigerant through the water inlet distributor, the complex pipeline layout is reduced, making the structure of the water inlet assembly simple and clear, facilitating assembly, daily maintenance and troubleshooting.
[0024] In some feasible embodiments of the present application, a first connecting pipe is connected between the water inlet distributor and each water inlet pipe, and a second connecting pipe is connected between the water inlet distributor and the cold quantity distribution unit and / or the flow splitting disk.
[0025] In the above technical solution, the water inlet distributor is communicated with each water inlet pipe through the first connecting pipe, and the first connecting pipe connects the water inlet distributor and the water inlet pipe, ensuring that the refrigerant can be accurately distributed to each computing node. Even if the position of the water inlet pipe is adjusted, it does not affect the connection between the water inlet pipe and the water inlet distributor. Even if different computing nodes are replaced, the water inlet assembly can still be connected to the computing nodes, improving the flexibility and convenience of the heat dissipation device.
[0026] In some feasible embodiments of the present application, the water outlet assembly includes: a water outlet distributor, which is connected between the cooling capacity distribution unit and each of the water outlet pipes, each of the water outlet pipes communicates with the water outlet distributor, and the water outlet distributor communicates with the cooling capacity distribution unit and / or the flow splitting plate.
[0027] In the above technical solution, a water outlet distributor is arranged between the cooling capacity distribution unit and the water outlet pipes, so that the heated refrigerant from each computing node can be centrally recovered, and the refrigerant is guided back to the cooling capacity distribution unit or the flow splitting plate for re-cooling, ensuring that the refrigerant can be uniformly and efficiently recovered. By centrally managing the recovery of the refrigerant through the water outlet distributor, the complex pipeline layout is reduced, making the structure of the water outlet assembly simple and clear, facilitating assembly, daily maintenance and troubleshooting.
[0028] In some feasible embodiments of the present application, a first connecting pipe is connected between the water outlet distributor and each of the water outlet pipes, and a second connecting pipe is connected between the water outlet distributor and the cooling capacity distribution unit and / or the flow splitting plate.
[0029] In the above technical solution, the water outlet distributor and each water outlet pipe are connected through the first connecting pipe, and the first connecting pipe connects the water outlet distributor and the water outlet pipes, ensuring that the refrigerant can be accurately and efficiently centralized. Even if the position of the water outlet pipe is adjusted, it does not affect the connection between the water outlet pipe and the water outlet distributor. Even if different computing nodes are replaced, the water outlet assembly can still be connected to the computing nodes, improving the flexibility and convenience of the heat dissipation device.
[0030] In some feasible embodiments of the present application, a third connecting pipe is connected between the water inlet pipe and the water inlet of the computing node, and between the water outlet pipe and the water outlet of the computing node.
[0031] In the above technical solution, the third connecting pipe is used to accurately connect the water inlet pipe with the water inlet of the computing node, and the water outlet pipe with the water outlet of the computing node, ensuring that the refrigerant can enter and leave each computing node accurately. The third connecting pipe can flexibly adjust the length and angle to meet different installation requirements.
[0032] In some feasible embodiments of the present application, a plurality of installation positions are provided on the cabinet body, and one water inlet pipe and / or one water outlet pipe is provided in each installation position.
[0033] The server according to the second aspect of the present application includes the heat dissipation device according to the first aspect of the present application.
[0034] The server according to the present application, by providing the heat dissipation device of the first aspect of the present application, thus has the same technical effect, that is, by providing a water inlet component and a water outlet component that can be connected and communicated with the water inlets and outlets of different computing nodes, even if the computing nodes are continuously improved, the heat dissipation device can adapt to the computing nodes without adjustment, which reduces the design cost and production cost of the device, reduces the consumption of resources, ensures that the heat dissipation device can be compatible with more computing nodes, and improves the flexibility and reliability of the heat dissipation device.
[0035] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Brief Description of the Drawings
[0036] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0037] Figure 1 Schematic diagram of a heat dissipation device provided for an embodiment of the present application; Figure 2 Partial enlarged schematic diagram of the heat dissipation device of the embodiment of the present application; Figure 3 Schematic diagram of a computing node in an embodiment of the present application; Figure 4 Schematic diagram of a computing node in another embodiment of the present application; Figure 5 Schematic diagram of a computing node in yet another embodiment of the present application; Figure 6 Schematic diagram of a computing node in still another embodiment of the present application; Figure 7 Schematic diagram of a computing node in yet another embodiment of the present application.
[0038] Among them, the above-mentioned drawings include the following reference numerals: 100, heat dissipation device; 1, cabinet; 2, cold quantity distribution unit; 3, water inlet component; 31, water inlet pipe; 32, water inlet distributor; 4, water outlet component; 41, water outlet pipe; 42, water outlet distributor; 5, truss; 51, adjustment hole; 6, fixing rod; 7. Adjusting member; 71. Adjusting seat; 72. Adjusting block; 73. Adjusting groove; 8. Shunt plate; 9. First connecting pipe; 10. Second connecting pipe; 11. Third connecting pipe; 200. Computing node; 201. Water inlet; 202. Water outlet; P1. First position; P2. Second position; P3. Third position. Detailed implementation manners
[0039] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.
[0040] It should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. The terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood in specific situations.
[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs; the terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above description of the drawings are intended to cover non-exclusive inclusion.
[0042] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "a plurality" is more than two, unless otherwise specifically defined.
[0043] Reference to "embodiment" herein means that a particular feature, structure or characteristic described in connection with the embodiment can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.
[0044] In the description of the embodiments of this application, the term "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.
[0045] In the description of the embodiments of this application, the term "a plurality" refers to more than two (including two).
[0046] As pointed out in the related art, with the continuous progress of AI technology, the computing power and power consumption of a single GPU card continue to increase, making it particularly important to effectively dissipate heat from the GPU cards in its servers. Currently, AI servers mainly use two cooling methods, air cooling and cold plate liquid cooling, to address this challenge. Since different models of GPU cards have different heat dissipation requirements, the design of the internal cooling system of its servers will also vary.
[0047] In the design of the AI full cabinet, considering the development and changes of computing nodes (mainly GPU cards), the design of the full cabinet must also be adjusted accordingly to meet new requirements. The current approach is to integrate the power supply unit, GPU servers, and the cooling distribution unit (CDU) within the same cabinet, and usually use cold plate liquid cooling for heat dissipation. Specifically, two liquid cooling pipelines are configured at the rear of the cabinet to provide channels for the incoming and outgoing coolant. All server computing nodes are connected to the CDU located at the bottom of the cabinet through these two pipelines, and the CDU is responsible for providing secondary side heat dissipation for the servers.
[0048] However, with the update of each generation of computing nodes, this design often requires re-designing and adapting to a new cabinet, resulting in increased costs and wasted resources. Because the development speed of computing nodes is significantly faster than the evolution speed of the cabinet, in most cases, the changes to the cabinet are only passive adjustments made to meet the requirements of new computing nodes. This current situation not only increases the cost of designing a new cabinet but also consumes a large amount of human resources. Therefore, how to reduce the production cost of the cabinet has become an urgent issue to be solved.
[0049] Based on the above considerations, in order to reduce the production cost of the cabinet, the applicant has designed a heat dissipation device through in-depth research. The following refers to Figures 1-7 Describe the heat dissipation device 100 according to the embodiment of the first aspect of the present application.
[0050] As Figures 1-7 shown, Figure 1 is a schematic diagram of a heat dissipation device provided according to an embodiment of the present application; Figure 2 is a partial enlarged schematic diagram of the heat dissipation device of the embodiment of the present application; Figure 3 is a schematic diagram of a computing node in an embodiment of the present application; Figure 4 is a schematic diagram of a computing node in another embodiment of the present application; Figure 5 is a schematic diagram of a computing node in yet another embodiment of the present application; Figure 6 is a schematic diagram of a computing node in still another embodiment of the present application; Figure 7 is a schematic diagram of a computing node in yet another embodiment of the present application.
[0051] The heat dissipation device 100 according to the embodiment of the first aspect of the present application is used to dissipate heat from the computing node 200. The heat dissipation device 100 includes: a cabinet 1, a cold quantity distribution unit 2, a water inlet assembly 3, and a water outlet assembly 4.
[0052] Specifically, the computing node 200 is disposed within the cabinet 1. Each computing node 200 has a water inlet 201 and a water outlet 202. The cooling capacity distribution unit 2 is disposed within the cabinet 1. The water inlet assembly 3 is disposed on the cabinet 1. The water inlet assembly 3 is connected between the cooling capacity distribution unit 2 and each computing node 200. The water inlet assembly 3 includes a plurality of water inlet pipes 31. The plurality of water inlet pipes 31 all extend in the vertical direction and are spaced apart in the first direction. The water inlet 201 of each computing node 200 is communicated with at least one of the plurality of water inlet pipes 31. The water outlet assembly 4 is disposed on the cabinet 1. The water outlet assembly 4 is connected between the cooling capacity distribution unit 2 and each computing node 200. The water outlet assembly 4 includes a plurality of water outlet pipes 41. The plurality of water outlet pipes 41 all extend in the vertical direction and are spaced apart in the first direction. The water outlet 202 of each computing node 200 is communicated with at least one of the plurality of water outlet pipes 41.
[0053] It can be understood that the cabinet 1, as the basic structure of the entire heat dissipation device 100, is used to accommodate the computing node 200, the cooling capacity distribution unit 2 (CDU), the water inlet assembly 3, the water outlet assembly 4, etc. The computing node 200 is installed within the cabinet 1, and each computing node 200 has a water inlet 201 and a water outlet 202. In this way, each computing node 200 can be connected and communicated with the cooling capacity distribution unit 2 through its own water inlet 201 and water outlet 202, thereby reducing the connection difficulty between the computing node 200 and the cooling capacity distribution unit 2.
[0054] The cooling capacity distribution unit 2 is located within the cabinet 1. The cooling capacity distribution unit 2 is used to provide power for the circulation of the refrigerant and regulate the temperature of the computing node 200. In this way, the cooling capacity distribution unit 2 conveys the refrigerant to the computing node 200. The refrigerant exchanges heat with the computing node 200. The refrigerant carrying heat after heat exchange flows back from the computing node 200 to the cooling capacity distribution unit 2, and the refrigerant is heat-exchanged again within the cooling capacity distribution unit 2 to reduce the temperature of the refrigerant.
[0055] The water inlet assembly 3 is located on the cabinet 1. The water inlet assembly 3 is used to distribute the refrigerant to the water inlets 201 of the respective computing nodes 200. The water inlet assembly 3 includes a plurality of water inlet pipes 31. Each water inlet pipe 31 extends in the vertical direction. The water inlet pipes 31 are spaced apart in the first direction (such as Figure 1 the first direction shown). Each water inlet 201 of the computing node 200 is communicated with at least one water inlet pipe 31. In this way, each computing node 200 can be connected to the water inlet assembly 3 and communicated with the cooling capacity distribution unit 2, ensuring that each computing node 200 can receive sufficient and uniform refrigerant supply. Thus, the water inlet assembly 3 can adapt to different numbers and layouts of computing nodes 200, which helps to reduce the cost of re-designing the cabinet 1 due to the replacement of the computing nodes 200.
[0056] The water outlet assembly 4 is located on the cabinet 1. The water outlet assembly 4 is used to collect the refrigerant flowing out from each computing node 200 and transport the refrigerant collected by each computing node 200 back into the cooling capacity distribution unit. The water outlet assembly 4 includes a plurality of water outlet pipes 41, and each water outlet pipe 41 extends in the vertical direction. The water inlet pipes 31 are arranged at intervals in the first direction (such as Figure 1 the first direction shown). The water outlet 202 of each computing node 200 is connected to at least one water outlet pipe 41. In this way, each computing node 200 can be connected to the water outlet assembly 4 and communicate with the cooling capacity distribution unit 2, ensuring that the refrigerant in each computing node 200 flows back to the cooling capacity distribution unit 2. Therefore, the water outlet assembly 4 can adapt to different numbers and layouts of computing nodes 200. The water outlet assembly 4 and the water inlet assembly 3 cooperate with each other, which helps to reduce the cost of updating the design of the cabinet 1 caused by the replacement of the computing nodes 200.
[0057] The working process of the heat dissipation device 100 of the present application will be described below: First, the refrigerant flows out from the cooling capacity distribution unit 2 and flows into the water inlet assembly 3. Then, the refrigerant flows from the water inlet assembly 3 into the computing node 200 through the water inlet 201. The refrigerant exchanges heat in the computing node 200. After heat exchange, the refrigerant carrying heat flows out from the computing node 200 and flows into the water outlet pipe 41 through the water outlet 202. Finally, the refrigerant carrying heat after heat exchange flows out from the water outlet pipe 41 and flows back to the cooling capacity distribution unit 2, thus ensuring the heat dissipation effect of the computing node 200.
[0058] In a specific embodiment, referring to Figure 1 as shown, both the computing node 200 and the cooling capacity distribution unit 2 are located in the cabinet 1. The water inlet assembly 3 and the water outlet assembly 4 are both located on the cabinet 1. The water inlet assembly 3 includes three water inlet pipes 31, and the water outlet assembly 4 includes three water outlet pipes 41. The water inlet pipes 31 and the water outlet pipes 41 both extend in the up and down direction. There are a first position P1, a second position P2, and a third position P3 on the cabinet 1. One water inlet pipe 31 and one water outlet pipe 41 are provided in the first position P1, and the water inlet pipe 31 and the water outlet pipe 41 are arranged adjacent to each other. One water inlet pipe 31 and one water outlet pipe 41 are provided in the second position P2, and the water inlet pipe 31 and the water outlet pipe 41 are arranged adjacent to each other. One water inlet pipe 31 and one water outlet pipe 41 are provided in the third position P3, and the water inlet pipe 31 and the water outlet pipe 41 are arranged adjacent to each other. In this way, even if different computing nodes 200 are replaced, there is no need to replace the heat dissipation device 100. The water inlet assembly 3 and the water outlet assembly 4 are suitable for being connected and communicating with different computing nodes 200, and there is no need to use long pipes for connection, ensuring that the structure of the heat dissipation device 100 is simple, facilitating assembly and maintenance, and reducing the assembly difficulty and maintenance difficulty.
[0059] That is to say, when the water inlet 201 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 within the first position P1. When the water outlet 202 of the computing node 200 is located at the first position P1, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 within the first position P1; When the water inlet 201 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 within the first position P1. When the water outlet 202 of the computing node 200 is located at the second position P2, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 within the second position P2; When the water inlet 201 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 within the first position P1. When the water outlet 202 of the computing node 200 is located at the third position P3, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 within the third position P3; When the water inlet 201 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 within the second position P2. When the water outlet 202 of the computing node 200 is located at the first position P1, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 within the first position P1; When the water inlet 201 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 within the second position P2. When the water outlet 202 of the computing node 200 is located at the second position P2, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 within the second position P2; When the water inlet 201 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 within the second position P2. When the water outlet 202 of the computing node 200 is located at the third position P3, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 within the third position P3; When the water inlet 201 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 within the third position P3. When the water outlet 202 of the computing node 200 is located at the first position P1, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 within the first position P1; When the water inlet 201 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 within the third position P3. When the water outlet 202 of the computing node 200 is located at the second position P2, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 within the second position P2; When the water inlet 201 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3. When the water outlet 202 of the computing node 200 is located at the third position P3, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3.
[0060] According to the heat dissipation device 100 of the embodiments of the present application, by providing the water inlet component 3 and the water outlet component 4 that can be connected and communicated with the water inlets 201 and water outlets 202 of different computing nodes 200, even if the computing node 200 is continuously improved, the heat dissipation device 100 can adapt to the computing node 200 without adjustment. This reduces the design cost and production cost of the device, reduces the consumption of resources, ensures that the heat dissipation device 100 can be compatible with more computing nodes 200, and improves the flexibility and reliability of the heat dissipation device 100.
[0061] In any embodiment of the present application, a plurality of water inlet pipes 31 and a plurality of water outlet pipes 41 are arranged in one-to-one correspondence. Each water inlet pipe 31 and the corresponding water outlet pipe 41 are arranged adjacent to each other to form a group. In this way, the water inlet component 3 and the water outlet component 4 are adapted to be connected and communicated with different computing nodes 200. Figure 1 As shown in combination, it can be understood that when the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3; When the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3. When the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3.
[0062] In some other embodiments of the present application, according to actual needs, the number of water inlet pipes and the number of water outlet pipes 41 may not be equal, that is, the number of water inlet pipes may be less than the number of water outlet pipes 41, or the number of water inlet pipes may be more than the number of water outlet pipes 41, and the positions of the water inlet pipes and the water outlet pipes 41 can be arranged according to actual needs to be applicable to more improved computing nodes 200.
[0063] In any embodiment of the present application, a truss 5 is provided on the cabinet body 1, and a plurality of adjusting parts are provided on the truss 5. The upper ends of each water inlet pipe 31 and the upper ends of the corresponding water outlet pipes 41 are both connected to the corresponding adjusting parts. Thereby, the flexibility and adaptability of the heat dissipation device 100 are improved. The water inlet pipe 31 and the water outlet pipe 41 adjust their positions through the corresponding adjusting parts, ensuring that all the computing nodes 200 can be connected to the water inlet pipe 31 and the water outlet pipe 41 through the truss 5.
[0064] It can be understood that each water inlet pipe 31 and the corresponding water outlet pipe 41 are connected to the truss 5 through the adjusting parts. In this way, the water inlet pipe 31 and / or the water outlet pipe 41 in each installation position can be adjusted accordingly according to the positions of the water inlet 201 and / or the water outlet 202 on the computing node 200. Thus, without changing the structure of the heat dissipation device 100, the computing node 200 is connected to the cold quantity distribution unit 2, making the water inlet assembly 3 and the water outlet assembly 4 suitable for being connected to different computing nodes 200, improving the flexibility of the heat dissipation device 100 and reducing the design cost and production cost.
[0065] Refer to Figure 1 As shown, the truss 5 is fixed on the cabinet body 1. There are three adjusting parts on the truss 5, and the three adjusting parts are respectively located in three installation positions. There is one adjusting part in the first position P1, one adjusting part in the second position P2, and one adjusting part in the third position P3. The water inlet pipe 31 and the water outlet pipe 41 in the first position P1 are both connected to the cabinet body 1 through the adjusting part in the first position P1. The adjusting part in the first position P1 is used to adjust the relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the first position P1 and the cabinet body 1 in the first direction. The water inlet pipe 31 and the water outlet pipe 41 in the second position P2 are both connected to the cabinet body 1 through the adjusting part in the second position P2. The adjusting part in the second position P2 is used to adjust the relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the second position P2 and the cabinet body 1 in the first direction. The water inlet pipe 31 and the water outlet pipe 41 in the third position P3 are both connected to the cabinet body 1 through the adjusting part in the third position P3. The adjusting part in the third position P3 is used to adjust the relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the third position P3 and the cabinet body 1 in the first direction.
[0066] In any embodiment of the present application, each adjusting part is formed as an adjusting hole 51. A fixing rod 6 is provided between each water inlet pipe 31 and the cabinet body 1 and between each water outlet pipe 41 and the cabinet body 1. The fixing rod 6 is along a second direction perpendicular to the first direction (such as Figure 2extends in the second direction shown and passes through the adjustment hole 51, and the position of the fixing rod 6 in the adjustment hole 51 in the first direction is adjustable. Thus, by providing the adjustment hole 51 and the fixing rod 6, the water inlet assembly 3 and / or the water outlet assembly 4 are connected to the cabinet body 1 through the fixing rod 6 passing through the adjustment hole 51, and the relative position with the cabinet body 1 is adjustable, improving the flexibility and adaptability of the heat dissipation device 100 and enhancing the stability of the heat dissipation device 100.
[0067] It can be understood that when the structures and sizes between different models or configurations of the computing nodes 200 are different, by adjusting the position of the fixing rod 6 in the adjustment hole 51, the positions of each water inlet pipe 31 and each water outlet pipe 41 relative to the cabinet body 1 can be accurately adjusted. When it is necessary to replace or upgrade the computing node 200, the heat dissipation device 100 can be reconfigured by simply adjusting the position of the fixing rod 6, without the need for large-scale modification of the entire heat dissipation device 100 or re-designing the structure of the heat dissipation device 100, reducing the production cost. Moreover, this can achieve an optimized pipeline layout within an effective space, avoid unnecessary space waste, help reduce the intersection and interference between different pipes, ensure the smooth operation of the heat dissipation device 100, and reduce the failure rate of the heat dissipation device 100.
[0068] For example, referring to Figure 1 and Figure 2 as shown, the adjustment hole 51 is formed as a long through hole extending in the first direction. The fixing rod 6 is provided between each water inlet pipe 31 and the cabinet body 1 and between each water outlet pipe 41 and the cabinet body 1. The fixing rod 6 extends in the second direction. One end of the fixing rod 6 is connected to the water inlet pipe 31 and / or the water outlet pipe 41, and the other end of the fixing rod 6 extends into and passes through the adjustment hole 51 and is connected to the cabinet body 1. When it is necessary to adjust the relative position between the water inlet pipe 31 and / or the water outlet pipe 41 and the cabinet body 1, the position of the fixing rod 6 in the adjustment hole 51 can be adjusted.
[0069] In any embodiment of the present application, an adjusting member 7 is provided between each water inlet pipe 31 and the corresponding water outlet pipe 41, and the adjusting member 7 is used to adjust the distance between the water inlet pipe 31 and the corresponding water outlet pipe 41. Thus, by providing the adjusting member 7 between the water inlet pipe 31 and the water outlet pipe 41, accurate adjustment of the position of the water inlet pipe 31 and / or the water outlet pipe 41 is achieved, improving the flexibility and adaptability of the heat dissipation device 100, simplifying the installation and maintenance steps, and enhancing the reliability and safety of the heat dissipation device 100.
[0070] Referring to Figure 1 and Figure 2As shown, an adjusting member 7 is provided between the water inlet pipe 31 and the water outlet pipe 41 in the first position P1. One end of the fixing rod 6 in the first position P1 is connected to the adjusting member 7, and the other end of the fixing rod 6 in the first position P1 is connected to the cabinet body 1. The adjusting member 7 in the first position P1 can adjust the distance between the water inlet pipe 31 and the water outlet pipe 41 in the first position P1; an adjusting member 7 is provided between the water inlet pipe 31 and the water outlet pipe 41 in the second position P2. One end of the fixing rod 6 in the second position P2 is connected to the adjusting member 7, and the other end of the fixing rod 6 in the second position P2 is connected to the cabinet body 1. The adjusting member 7 in the second position P2 can adjust the distance between the water inlet pipe 31 and the water outlet pipe 41 in the second position P2; an adjusting member 7 is provided between the water inlet pipe 31 and the water outlet pipe 41 in the third position P3. One end of the fixing rod 6 in the third position P3 is connected to the adjusting member 7, and the other end of the fixing rod 6 in the third position P3 is connected to the cabinet body 1. The adjusting member 7 in the third position P3 can adjust the distance between the water inlet pipe 31 and the water outlet pipe 41 in the third position P3.
[0071] In any embodiment of the present application, the adjusting member 7 is formed with two adjusting grooves 73 arranged back to back. One water inlet pipe 31 and the corresponding water outlet pipe 41 are respectively arranged in the two adjusting grooves 73, and the distance between the two adjusting grooves 73 is adjustable. Thus, by forming two adjusting grooves 73 arranged back to back on the adjusting member 7 and the distance between the two adjusting grooves 73 being adjustable, the adjustment flexibility of the water inlet assembly 3 and / or the water outlet assembly 4 is improved. The water inlet pipe 31 and / or the water outlet pipe 41 are arranged in the adjusting grooves 73, which not only plays a role in fixing the water inlet pipe 31 and / or the water outlet pipe 41, but also facilitates adjusting the distance between the water inlet pipe 31 and / or the water outlet pipe 41, or facilitating adjusting the relative position between the water inlet pipe 31 and / or the water outlet pipe 41 and the cabinet body 1, and is suitable for assembling with computing nodes 200 of different structures and models, thereby reducing the design cost and production cost of the heat dissipation device 100.
[0072] For example, referring to Figure 1 and Figure 2As shown, two adjusting grooves 73 are formed on the adjusting member 7 within the first position P1. The two adjusting grooves 73 are arranged at intervals in the first direction and have openings facing away from each other. The water inlet pipe 31 within the first position P1 is fixed within one adjusting groove 73, and the water outlet pipe 41 within the first position P1 is fixed within the other adjusting groove 73. The relative position between the water inlet pipe 31 and / or the water outlet pipe 41 within the first position P1 and the cabinet body 1 is adjusted by the adjusting member 7, or the distance between the water inlet pipe 31 and the water outlet pipe 41 within the first position P1 is adjusted by the adjusting member 7; two adjusting grooves 73 are formed on the adjusting member 7 within the second position P2. The two adjusting grooves 73 are arranged at intervals in the first direction and have openings facing away from each other. The water inlet pipe 31 within the second position P2 is fixed within one adjusting groove 73, and the water outlet pipe 41 within the second position P2 is fixed within the other adjusting groove 73. The relative position between the water inlet pipe 31 and / or the water outlet pipe 41 within the second position P2 and the cabinet body 1 is adjusted by the adjusting member 7, or the distance between the water inlet pipe 31 and the water outlet pipe 41 within the second position P2 is adjusted by the adjusting member 7; two adjusting grooves 73 are formed on the adjusting member 7 within the third position P3. The two adjusting grooves 73 are arranged at intervals in the first direction and have openings facing away from each other. The water inlet pipe 31 within the third position P3 is fixed within one adjusting groove 73, and the water outlet pipe 41 within the third position P3 is fixed within the other adjusting groove 73. The relative position between the water inlet pipe 31 and / or the water outlet pipe 41 within the third position P3 and the cabinet body 1 is adjusted by the adjusting member 7, or the distance between the water inlet pipe 31 and the water outlet pipe 41 within the third position P3 is adjusted by the adjusting member 7.
[0073] In any embodiment of the present application, the adjusting member 7 has an adjusting base 71 and two adjusting blocks 72. The two adjusting blocks 72 are respectively arranged on both sides of the adjusting base 71 in the first direction. One adjusting groove 73 is formed on each adjusting block 72, and a first adjusting portion is formed on each adjusting block 72. A second adjusting portion is formed on the adjusting base 71. The distance between each adjusting block 72 and the adjusting base 71 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion. Thus, by providing the adjusting groove 73 on each adjusting block 72 and fixing the water inlet pipe 31 and / or the water outlet pipe 41 within the adjusting groove 73, through the cooperation between the first adjusting portion and the second adjusting portion, the position of each adjusting block 72 relative to the adjusting base 71 can be precisely adjusted, thereby achieving precise adjustment of the water inlet pipe 31 and the water outlet pipe 41, and reducing the installation difficulty and maintenance difficulty of the heat dissipation device 100.
[0074] For example, referring to Figure 1 and Figure 2As shown, the adjusting member 7 in the first position P1 has an adjusting base 71 and two adjusting blocks 72. The two adjusting blocks 72 are arranged adjacent to each other in the first direction on both sides of the adjusting base 71. Each adjusting block 72 is formed with an adjusting groove 73, and each adjusting block 72 is formed with a first adjusting portion. The adjusting base 71 is formed with a second adjusting portion. The distance between each adjusting block 72 and the adjusting base 71 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion. The water inlet pipe 31 in the first position P1 is fixed in one adjusting groove 73, and the water outlet pipe 41 in the first position P1 is fixed in the other adjusting groove 73. The water inlet pipe 31 and / or the water outlet pipe 41 in the first position P1 adjusts the relative position with respect to the cabinet body 1 through the cooperation of the first adjusting portion and the second adjusting portion. Alternatively, the distance between the water inlet pipe 31 and the water outlet pipe 41 in the first position P1 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion; The adjusting member 7 in the second position P2 has an adjusting base 71 and two adjusting blocks 72. The two adjusting blocks 72 are arranged adjacent to each other in the first direction on both sides of the adjusting base 71. Each adjusting block 72 is formed with an adjusting groove 73, and each adjusting block 72 is formed with a first adjusting portion. The adjusting base 71 is formed with a second adjusting portion. The distance between each adjusting block 72 and the adjusting base 71 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion. The water inlet pipe 31 in the second position P2 is fixed in one adjusting groove 73, and the water outlet pipe 41 in the second position P2 is fixed in the other adjusting groove 73. The water inlet pipe 31 and / or the water outlet pipe 41 in the second position P2 adjusts the relative position with respect to the cabinet body 1 through the cooperation of the first adjusting portion and the second adjusting portion. Alternatively, the distance between the water inlet pipe 31 and the water outlet pipe 41 in the second position P2 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion; The adjusting member 7 in the third position P3 has an adjusting base 71 and two adjusting blocks 72. The two adjusting blocks 72 are arranged adjacent to each other in the first direction on both sides of the adjusting base 71. Each adjusting block 72 is formed with an adjusting groove 73, and each adjusting block 72 is formed with a first adjusting portion. The adjusting base 71 is formed with a second adjusting portion. The distance between each adjusting block 72 and the adjusting base 71 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion. The water inlet pipe 31 in the third position P3 is fixed in one adjusting groove 73, and the water outlet pipe 41 in the third position P3 is fixed in the other adjusting groove 73. The water inlet pipe 31 and / or the water outlet pipe 41 in the third position P3 adjusts the relative position with respect to the cabinet body 1 through the cooperation of the first adjusting portion and the second adjusting portion. Alternatively, the distance between the water inlet pipe 31 and the water outlet pipe 41 in the third position P3 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion.
[0075] For example, the first adjusting portion and the second adjusting portion can adopt meshing teeth for meshing connection to facilitate the adjustment of the distance between the adjusting block 72 and the adjusting base 71. The connection manner of the first adjusting portion and the second adjusting portion includes but is not limited to this.
[0076] In any embodiment of the present application, the heat dissipation device 100 further includes: a flow splitting plate 8, which is disposed on the cabinet 1 and is communicated with the cold quantity distribution unit 2. It can be understood that the flow splitting plate 8 is arranged between the water inlet assembly 3 and the cold quantity distribution unit 2 and between the water outlet assembly 4 and the cold quantity distribution unit 2. In this way, even if the position of the water inlet pipe 31 of the water inlet assembly 3 changes and / or the position of the water outlet pipe 41 of the water outlet assembly 4 changes, the flow splitting plate 8 can still be communicated with the cold quantity distribution unit 2. The water inlet assembly 3 and the water outlet assembly 4 are adapted to be connected to different computing nodes 200, and there is no need to use long pipelines for connection, ensuring that the structure of the heat dissipation device 100 is simple, facilitating assembly and maintenance, reducing the assembly difficulty and maintenance difficulty, and enhancing the adaptability and expandability of the heat dissipation device 100.
[0077] Furthermore, setting the flow splitting plate 8 also plays a role in regulating the refrigerant flow rate, ensuring that the refrigerant can be evenly distributed to each computing node 200, reducing the pressure loss of the refrigerant during transmission, and ensuring that the heat dissipation device 100 can operate efficiently at a relatively low pressure. The flow splitting plate 8 becomes a centralized interface point for centrally managing all pipeline connections to and from the cold quantity distribution unit 2, reducing potential leakage points, and improving the sealing performance and safety of the heat dissipation device 100.
[0078] Describe the working principle of the heat dissipation device 100 provided with the flow splitting plate 8: First, the refrigerant flows out from the cold quantity distribution unit 2 and flows into the flow splitting plate 8. The flow splitting plate 8 distributes the refrigerant to each water inlet pipe 31 according to a preset path, and the water inlet pipe 31 then guides the refrigerant to the corresponding computing node 200. Then, the refrigerant that has absorbed heat in the computing node 200 flows into the corresponding water outlet pipe 41 through the water outlet 202, returns to the flow splitting plate 8 through the water outlet pipe 41, and is then collected by the flow splitting plate 8 and guided back to the cold quantity distribution unit 2 for re-cooling to prepare for re-circulation into the computing node 200 for heat exchange.
[0079] In any embodiment of the present application, the water inlet assembly 3 includes: a water inlet distributor 32, which is connected between the cold quantity distribution unit 2 and each water inlet pipe 31. Each water inlet pipe 31 is communicated with the water inlet distributor 32, and the water inlet distributor 32 is communicated with the cold quantity distribution unit 2 and / or the flow splitting plate 8. It can be understood that the water inlet distributor 32 is arranged between the cold quantity distribution unit 2 and the water inlet pipe 31, so that the refrigerant can be evenly distributed from the cold quantity distribution unit 2 to each water inlet pipe 31, ensuring that each computing node 200 can obtain the same or adjusted refrigerant flow rate according to requirements. By centrally managing the distribution of the refrigerant through the water inlet distributor 32, the complex pipeline layout is reduced, making the structure of the water inlet assembly 3 simple and clear, facilitating assembly, daily maintenance, and troubleshooting.
[0080] For example, referring to Figure 1 and Figure 2 As shown, the water inlet diverter 32 is connected between the flow splitting plate 8 and each water inlet pipe 31. The lower ends of the three water inlet pipes 31 are all connected to the water inlet diverter 32, and the water inlet diverter 32 is in communication with the flow splitting plate 8. In this way, the refrigerant flows from the cooling capacity distribution unit 2 into the flow splitting plate 8, then flows from the flow splitting plate 8 into the water inlet diverter 32. Then, the refrigerant flows from the water inlet diverter 32 into each water inlet pipe 31, and finally flows into the computing node 200 through the water inlet 201 of the water inlet pipe 31 for heat exchange.
[0081] In some other embodiments, the water inlet diverter 32 is connected between the cooling capacity distribution unit 2 and each water inlet pipe 31. The lower ends of the three water inlet pipes 31 are all connected to the water inlet diverter 32, and the water inlet diverter 32 is in communication with the cooling capacity distribution unit 2. In this way, the refrigerant flows from the cooling capacity distribution unit 2 into the water inlet diverter 32. Then, the refrigerant flows from the water inlet diverter 32 into each water inlet pipe 31, and finally flows into the computing node 200 through the water inlet 201 of the water inlet pipe 31 for heat exchange. That is, in this embodiment, the flow splitting plate 8 is not provided, and the water inlet diverter 32 is directly connected to the cooling capacity distribution unit 2.
[0082] In any embodiment of the present application, a first connecting pipe 9 is connected between the water inlet diverter 32 and each water inlet pipe 31, and a second connecting pipe 10 is connected between the water inlet diverter 32 and the cooling capacity distribution unit 2 and / or the flow splitting plate 8. It can be understood that the water inlet diverter 32 is in communication with each water inlet pipe 31 through the first connecting pipe 9. The first connecting pipe 9 connects the water inlet diverter 32 and the water inlet pipe 31, ensuring that the refrigerant can be accurately distributed to each computing node 200. Even if the position of the water inlet pipe 31 is adjusted, it does not affect the connection between the water inlet pipe 31 and the water inlet diverter 32. Even if different computing nodes 200 are replaced, the water inlet assembly 3 can still be connected to the computing node 200, improving the flexibility and convenience of the heat dissipation device 100. The water inlet diverter 32 is connected to the cooling capacity distribution unit 2 and / or the flow splitting plate 8 through the second connecting pipe 10. The second connecting pipe 10 connects the water inlet diverter 32 and the cooling capacity distribution unit 2 and / or the flow splitting plate 8, ensuring that the refrigerant can flow from the cooling capacity distribution unit 2 and / or the flow splitting plate 8 into the second connecting pipe 10, which is convenient for assembly and maintenance.
[0083] For example, referring to Figure 1 and Figure 2As shown in the figure, the first connecting pipe 9 is connected between the water inlet distributor 32 and the water inlet pipe 31. The first connecting pipe 9 is connected to the lower end of the water inlet pipe 31. The second connecting pipe 10 is connected between the water inlet distributor 32 and the flow dividing plate 8. In this way, the refrigerant flows from the cooling capacity distribution unit 2 into the flow dividing plate 8, then flows from the flow dividing plate 8 into the water inlet distributor 32 through the second connecting pipe 10, then the refrigerant flows from the water inlet distributor 32 into the water inlet pipe 31 through the first connecting pipe 9, and finally flows from the water inlet pipe 31 into the computing node 200 through the water inlet 201 for heat exchange.
[0084] In some other embodiments, the first connecting pipe 9 is connected between the water inlet distributor 32 and the water inlet pipe 31. The first connecting pipe 9 is connected to the lower end of the water inlet pipe 31. The second connecting pipe 10 is connected between the water inlet distributor 32 and the cooling capacity distribution unit 2. In this way, the refrigerant flows from the cooling capacity distribution unit 2 into the water inlet distributor 32 through the second connecting pipe 10, then the refrigerant flows from the water inlet distributor 32 into the water inlet pipe 31 through the first connecting pipe 9, and finally flows from the water inlet pipe 31 into the computing node 200 through the water inlet 201 for heat exchange.
[0085] In any embodiment of the present application, the water outlet assembly 4 includes: a water outlet distributor 42, the water outlet distributor 42 is connected between the cooling capacity distribution unit 2 and each water outlet pipe 41, each water outlet pipe 41 communicates with the water outlet distributor 42, and the water outlet distributor 42 communicates with the cooling capacity distribution unit 2 and / or the flow dividing plate 8. It can be understood that a water outlet distributor 42 is arranged between the cooling capacity distribution unit 2 and the water outlet pipe 41, so that the heated refrigerant from each computing node 200 can be centrally recovered, and the refrigerant is guided back to the cooling capacity distribution unit 2 or the flow dividing plate 8 for re-cooling, ensuring that the refrigerant can be evenly and efficiently recovered. By centrally managing the recovery of the refrigerant through the water outlet distributor 42, the complex pipeline layout is reduced, making the structure of the water outlet assembly 4 simple and clear, facilitating assembly, daily maintenance and troubleshooting.
[0086] For example, referring to Figure 1 and Figure 2 As shown in the figure, the water outlet distributor 42 is connected between the flow dividing plate 8 and each water outlet pipe 41. The lower ends of the three water outlet pipes 41 are all connected to the water outlet distributor 42, and the water outlet distributor 42 communicates with the flow dividing plate 8. In this way, after heat exchange, the computing node 200 carrying heat flows into the water outlet pipe 41 through the water outlet 202, then the refrigerant carrying heat flows from the water outlet pipe 41 into the water outlet distributor 42, then flows from the water outlet distributor 42 into the flow dividing plate 8, and finally the refrigerant carrying heat flows from the flow dividing plate 8 into the cooling capacity distribution unit 2 for cooling to prepare for the next cycle.
[0087] In some other embodiments, the water outlet water distributor 42 is connected between the flow splitting plate 8 and each water outlet pipe 41. The lower ends of the three water outlet pipes 41 are all connected to the water outlet water distributor 42, and the water outlet water distributor 42 communicates with the cooling capacity distribution unit 2. In this way, the computing node 200 carrying heat after heat exchange flows into the water outlet pipe 41 through the water outlet 202, and then the refrigerant carrying heat flows from the water outlet pipe 41 into the water outlet water distributor 42. Then, the refrigerant carrying heat flows from the water outlet water distributor 42 into the cooling capacity distribution unit 2 for cooling to prepare for the next cycle.
[0088] In any one of the embodiments of the present application, a first connecting pipe 9 is connected between the water outlet water distributor 42 and each water outlet pipe 41, and a second connecting pipe 10 is connected between the water outlet water distributor 42 and the cooling capacity distribution unit 2 and / or the flow splitting plate 8. It can be understood that the water outlet water distributor 42 is communicated with each water outlet pipe 41 through the first connecting pipe 9. The first connecting pipe 9 connects the water outlet water distributor 42 and the water outlet pipe 41, ensuring that the refrigerant can be accurately and efficiently concentrated. Even if the position of the water outlet pipe 41 is adjusted, it does not affect the connection between the water outlet pipe 41 and the water outlet water distributor 42. Even if different computing nodes 200 are replaced, the water outlet assembly 4 can still be connected to the computing node 200, improving the flexibility and convenience of the heat dissipation device 100; the water outlet water distributor 42 is connected to the cooling capacity distribution unit 2 and / or the flow splitting plate 8 through the second connecting pipe 10. The second connecting pipe 10 connects the water outlet water distributor 42 and the cooling capacity distribution unit 2 and / or the flow splitting plate 8, ensuring that the refrigerant can flow from the second connecting pipe 10 into the cooling capacity distribution unit 2 and / or the flow splitting plate 8, which is convenient for assembly and maintenance.
[0089] For example, as shown in Figure 1 and Figure 2 shown, the first connecting pipe 9 is connected between the water outlet water distributor 42 and the water outlet pipe 41. The first connecting pipe 9 is connected to the lower end of the water outlet pipe 41, and the second connecting pipe 10 is connected between the water outlet water distributor 42 and the flow splitting plate 8. In this way, the refrigerant carrying heat after heat exchange in each computing node 200 flows into the water outlet pipe 41 through the water outlet 202, and then the refrigerant carrying heat flows from the water outlet pipe 41 into the water outlet water distributor 42 through the first connecting pipe 9. Then, the refrigerant carrying heat flows from the water outlet water distributor 42 into the flow splitting plate 8 through the second connecting pipe 10. Finally, the refrigerant carrying heat flows from the flow splitting plate 8 into the cooling capacity distribution unit 2.
[0090] In some other embodiments, the first connecting pipe 9 is connected between the water outlet water distributor 42 and the water outlet pipe 41. The first connecting pipe 9 is connected to the lower end of the water outlet pipe 41. The second connecting pipe 10 is connected between the water outlet water distributor 42 and the cooling capacity distribution unit 2. In this way, the refrigerant carrying heat after heat exchange in each computing node 200 flows into the water outlet pipe 41 through the water outlet 202, and then the refrigerant carrying heat flows from the water outlet pipe 41 into the water outlet water distributor 42 through the first connecting pipe 9. Finally, the refrigerant carrying heat flows from the water outlet water distributor 42 into the cooling capacity distribution unit 2 through the second connecting pipe 10.
[0091] In any one of the embodiments of the present application, a third connecting pipe 11 is connected between the water inlet pipe 31 and the water inlet 201 of the computing node 200, and between the water outlet pipe 41 and the water outlet 202 of the computing node 200. It can be understood that the third connecting pipe 11 is used to accurately connect the water inlet pipe 31 and the water inlet 201 of the computing node 200, and the water outlet pipe 41 and the water outlet 202 of the computing node 200, ensuring that the refrigerant can enter and leave each computing node 200 accurately. The third connecting pipe 11 can flexibly adjust the length and angle to meet different installation requirements, improving the flexibility, cooling efficiency and maintenance convenience of the heat dissipation device 100. It not only meets the current heat dissipation requirements, but also provides convenience for the future upgrade of the computing node 200, simplifies the installation and maintenance process of the heat dissipation device 100, and reduces the production cost.
[0092] For example, as shown in Figure 1 and Figure 2 A third connecting pipe 11 is connected between each water inlet pipe 31 and the water inlet 201 of each computing node 200, and a third connecting pipe 11 is connected between each water outlet pipe 41 and the water outlet 202 of each computing node 200. The refrigerant flows from the cooling capacity distribution unit 2 to the flow splitting disc 8, and then from the flow splitting disc 8 into the water inlet water distributor 32 through the second connecting pipe 10. Then the refrigerant flows from the water inlet water distributor 32 into the water inlet pipe 31 through the first connecting pipe 9. Finally, the refrigerant flows from the water inlet pipe 31 into the computing node 200 through the third connecting pipe 11 from the water inlet 201 for heat exchange.
[0093] In some other embodiments, the refrigerant flows from the cooling capacity distribution unit 2 into the water inlet water distributor 32 through the second connecting pipe 10. Then the refrigerant flows from the water inlet water distributor 32 into the water inlet pipe 31 through the first connecting pipe 9. Finally, the refrigerant flows from the water inlet pipe 31 into the computing node 200 through the third connecting pipe 11 from the water inlet 201 for heat exchange.
[0094] In summary, it should be noted that if the flow dividing plate 8 is provided in the heat dissipation device 100, the water inlet manifold 32 and the water outlet manifold 42 can be connected to the flow dividing plate 8 and / or the cold quantity distribution unit 2. If the flow dividing plate 8 is not provided in the heat dissipation device 100, the water inlet manifold 32 and the water outlet manifold 42 are connected to the cold quantity distribution unit 2.
[0095] In any embodiment of the present application, a plurality of installation positions are provided on the cabinet 1, and a water inlet pipe 31 and / or a water outlet pipe 41 is provided in each installation position. Refer to Figure 1 and Figure 2 As shown, there are three installation positions, namely the first position P1, the second position P2, and the third position P3. When the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3; when the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3; When the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3.
[0096] In this way, the water inlet pipe 31 and the water outlet pipe 41 can be adjusted to be connected to different computing nodes 200, improving the flexibility and adaptability of the heat dissipation device 100 and enhancing the stability of the heat dissipation device 100. In addition, according to actual needs, the number of water inlet pipes and the number of water outlet pipes 41 may not be equal, that is, the number of water inlet pipes may be less than the number of water outlet pipes 41, or the number of water inlet pipes may be more than the number of water outlet pipes 41, and the positions of the water inlet pipes and the water outlet pipes 41 can be arranged according to actual needs to be applicable to more improved computing nodes 200. The number of installation positions is not limited to this and can be one installation position, two installation positions, three installation positions, four installation positions, and so on.
[0097] The server according to the second aspect embodiment of the present application includes the heat dissipation device 100 according to the first aspect embodiment of the present application.
[0098] The server according to the embodiment of the present application is provided with the heat dissipation device 100 according to the first aspect embodiment of the present application. Therefore, it has the same technical effects, that is, by providing the water inlet component 3 and the water outlet component 4 that can be connected and communicated with the water inlet 201 and the water outlet 202 of different computing nodes 200, even if the computing node 200 is continuously improved, the heat dissipation device 100 does not need to be adjusted to adapt to the computing node 200. This reduces the design cost and production cost of the device, reduces the consumption of resources, ensures that the heat dissipation device 100 can be compatible with more computing nodes 200, and improves the flexibility and reliability of the heat dissipation device 100.
[0099] Although embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.
Claims
1. A heat dissipation device (100), characterized in that: The heat dissipation device (100) is used to dissipate heat from a computing node (200), and the heat dissipation device (100) comprises: A cabinet (1), wherein the computing nodes (200) are arranged in the cabinet (1), and each computing node (200) has a water inlet (201) and a water outlet (202); A cold distribution unit (2), wherein the cold distribution unit (2) is arranged in the cabinet (1); A water inlet component (3), the water inlet component (3) being arranged on the cabinet (1), the water inlet component (3) being connected between the cold distribution unit (2) and each of the computing nodes (200), the water inlet component (3) comprising a plurality of water inlet pipes (31), the plurality of water inlet pipes (31) all extending in a vertical direction and arranged at intervals in a first direction, the water inlet (201) of each of the computing nodes (200) being in communication with at least one of the plurality of water inlet pipes (31); A water outlet component (4), the water outlet component (4) being arranged on the cabinet (1), the water outlet component (4) being connected between the cold distribution unit (2) and each of the computing nodes (200), the water outlet component (4) comprising a plurality of water outlet pipes (41), the plurality of water outlet pipes (41) all extending in a vertical direction and arranged at intervals in a first direction, and the water outlet (202) of each of the computing nodes (200) being connected to at least one of the plurality of water outlet pipes (41).
2. The heat dissipation device (100) according to claim 1, characterized in that: The plurality of water inlet pipes (31) and the plurality of water outlet pipes (41) are arranged in one-to-one correspondence, and each of the water inlet pipes (31) and the corresponding water outlet pipe (41) are arranged adjacent to each other to form a group.
3. The heat dissipation device (100) according to claim 2, characterized in that: The cabinet (1) is provided with a truss (5), and the truss (5) is provided with a plurality of adjustment parts, and the upper end of each water inlet pipe (31) and the upper end of the corresponding water outlet pipe (41) are connected to the corresponding adjustment part.
4. The heat dissipation device (100) according to claim 3, characterized in that: Each of the adjustment portions is formed as an adjustment hole (51), and a fixing rod (6) is provided between each of the water inlet pipes (31) and the cabinet (1) and between each of the water outlet pipes (41) and the cabinet (1). The fixing rod (6) extends in a second direction perpendicular to the first direction and passes through the adjustment hole (51), and the position of the fixing rod (6) in the adjustment hole (51) along the first direction is adjustable.
5. The heat dissipation device (100) according to claim 4, characterized in that: An adjusting member (7) is provided between each water inlet pipe (31) and the corresponding water outlet pipe (41), and the adjusting member (7) is used to adjust the distance between the water inlet pipe (31) and the corresponding water outlet pipe (41).
6. The heat dissipation device (100) according to claim 5, characterized in that: The adjusting member (7) is formed with two adjusting grooves (73) arranged in opposite directions, and one water inlet pipe (31) and a corresponding water outlet pipe (41) are arranged in each of the two adjusting grooves (73), and the distance between the two adjusting grooves (73) is adjustable.
7. The heat dissipation device (100) according to claim 6, characterized in that: The adjusting member (7) comprises an adjusting seat (71) and two adjusting blocks (72), the two adjusting blocks (72) being respectively arranged on both sides of the adjusting seat (71) in a first direction, each adjusting block (72) being formed with an adjusting groove (73), each adjusting block (72) being formed with a first adjusting portion and a second adjusting portion on the adjusting seat (71), and the distance between each adjusting block (72) and the adjusting seat (71) being adjusted by the cooperation of the first adjusting portion and the second adjusting portion.
8. The heat dissipation device (100) according to claim 7, characterized in that: Also includes: A diverter plate (8), the diverter plate (8) is arranged on the cabinet (1), and the diverter plate (8) is connected to the cold distribution unit (2).
9. The heat dissipation device (100) according to claim 8, characterized in that: The water inlet assembly (3) comprises: a water inlet manifold (32), the water inlet manifold (32) being connected between the cold energy distribution unit (2) and each of the water inlet pipes (31), each of the water inlet pipes (31) being in communication with the water inlet manifold (32), and the water inlet manifold (32) being in communication with the cold energy distribution unit (2) and / or the diverter plate (8).
10. The heat dissipation device (100) according to claim 9, characterized in that: A first connecting pipe (9) is connected between the water inlet manifold (32) and each of the water inlet pipes (31), and a second connecting pipe (10) is connected between the water inlet manifold (32) and the cold energy distribution unit (2) and / or the diverter plate (8).
11. The heat dissipation device (100) according to claim 8, characterized in that: The water outlet assembly (4) comprises: a water outlet manifold (42), the water outlet manifold (42) being connected between the cold energy distribution unit (2) and each of the water outlet pipes (41), each of the water outlet pipes (41) being in communication with the water outlet manifold (42), and the water outlet manifold (42) being in communication with the cold energy distribution unit (2) and / or the diverter plate (8).
12. The heat dissipation device (100) according to claim 11, characterized in that: A first connecting pipe (9) is connected between the water outlet manifold (42) and each of the water outlet pipes (41), and a second connecting pipe (10) is connected between the water outlet manifold (42) and the cold energy distribution unit (2) and / or the diverter plate (8).
13. The heat dissipation device (100) according to claim 1, characterized in that: A third connecting pipe (11) is connected between the water inlet pipe (31) and the water inlet (201) of the computing node (200), and between the water outlet pipe (41) and the water outlet (202) of the computing node (200).
14. The heat dissipation device (100) according to any one of claims 1 to 13, characterized in that: The cabinet (1) is provided with a plurality of installation positions, and each of the installation positions is provided with a water inlet pipe (31) and / or a water outlet pipe (41).
15. A server, characterized in that: The heat dissipation device (100) comprises any one of claims 1 to 14.
Citation Information
Patent Citations
Heat dissipation system and method of whole cabinet server system
CN106604616A
Electrical automation control heat dissipation electrical cabinet
CN114256756A
Decoupling type data center cabinet and data center
CN117939839A
Heat dissipation plate for chip heat dissipation, server heat dissipation system and heating device
CN210805753U
Decoupling type data center cabinet and data center
CN221807379U