Chip sampling configuration parameter dynamic adjustment method, device, equipment and medium

Abstract

The invention discloses a chip sampling configuration parameter dynamic adjustment method and device, equipment and a medium. The method comprises the steps that a temperature sampling configuration array is initialized and updated; acquiring temperature information and setting a temperature change mark; judging whether a sampling configuration parameter under the current temperature value exists in a temperature sampling configuration array or not according to the setting condition and the temperature information; when the sampling configuration parameters exist, eMMC sampling configuration parameters are updated according to the sampling configuration parameters, and eMMC operation is executed after the temperature change mark is updated; when the sampling configuration parameters do not exist, the sampling configuration parameters are obtained through tuning, the eMMC sampling configuration parameters, the temperature sampling configuration array and the eMMC stability configuration partition are updated according to the sampling configuration parameters, and eMMC operation is executed after the temperature change mark is updated. The eMMC sampling configuration parameters are adjusted in real time, the working efficiency and stability of the system are improved, and the method can be widely applied to the technical field of computer control systems.

Description

Technical Field

[0001] The present invention relates to the technical field of computer control systems, and particularly to a method, device, equipment and medium for dynamically adjusting chip sampling configuration parameters. Background Art

[0002] With the wide application of multi-core heterogeneous systems on chips (SoC, System on Chip) in various devices, their designs are becoming more and more complex and the power consumption is getting higher and higher. In order to ensure that such products can operate under different temperature conditions, additional investments are required in aspects such as hardware design and software repair. However, the hardware design method is costly and the optimization space is limited, while the software repair method may not be able to run after the system reports an error, and the ability to improve the stability of the multi-core heterogeneous system is limited.

[0003] As a mainstream storage medium in a multi-core heterogeneous system, the Embedded Multi Media Card (eMMC) has a wide range of application scenarios, and the environmental temperature range in which it can work properly can reach -25°C - 85°C. However, the performance and stability of the eMMC are sensitive to the working environment temperature. Temperature changes may cause the sampling configuration parameters of the eMMC controller to be inaccurate, thereby causing data transmission errors and affecting the normal operation of the system. Therefore, when the temperature conditions change, the sampling configuration parameters of the eMMC controller need to be updated. The traditional solution updates the sampling configuration parameters through software tuning, but frequent tuning operations will occupy additional system resources and reduce the operating efficiency.

[0004] In addition, in a multi-core heterogeneous system, traditional mechanisms such as mailbox are usually used for inter-core communication. This mechanism needs to implement communication through interrupts or polling, and requires the core to immediately respond to requests from another core, which has the problem of interfering with the core operation. Summary of the Invention

[0005] An object of the present invention is to solve at least to some extent one of the technical problems existing in the prior art.

[0006] To this end, an object of an embodiment of the present invention is to provide a method for dynamically adjusting chip sampling configuration parameters, which can ensure that the system can operate under different temperature conditions by monitoring the temperature in real time, adjusting and persistently saving the eMMC sampling configuration parameters in real time, and at the same time realizes the transmission of temperature change information through a simple and efficient cross-domain communication mechanism, improving the working efficiency and stability of the system.

[0007] Another object of an embodiment of the present invention is to provide a device for dynamically adjusting chip sampling configuration parameters.

[0008] To achieve the above technical objectives, the technical solutions adopted in the embodiments of the present invention include:

[0009] In a first aspect, an embodiment of the present invention provides a method for dynamically adjusting chip sampling configuration parameters, including:

[0010] Initialize and update the temperature sampling configuration array;

[0011] Obtain temperature information, and determine whether to set the temperature change flag according to the temperature information;

[0012] Determine whether the temperature change flag is set;

[0013] When the temperature change flag is set, determine whether there are sampling configuration parameters at the current temperature value in the temperature sampling configuration array according to the temperature information;

[0014] When the sampling configuration parameters exist, update the eMMC sampling configuration parameters according to the sampling configuration parameters, update the temperature change flag, and then perform eMMC operations;

[0015] When the sampling configuration parameters do not exist, obtain the sampling configuration parameters through tuning, update the eMMC sampling configuration parameters, the temperature sampling configuration array, and the eMMC stability configuration partition according to the sampling configuration parameters, update the temperature change flag, and then perform eMMC operations.

[0016] Further, the initialization and update of the temperature sampling configuration array include:

[0017] Initialize the temperature sampling configuration array;

[0018] Obtain stability parameters according to the eMMC stability configuration partition;

[0019] Update the temperature sampling configuration array according to the stability parameters.

[0020] Further, the obtaining of the temperature information and the determination of whether to set the temperature change flag according to the temperature information include:

[0021] Monitor the temperature change through the security core to obtain the temperature information;

[0022] Obtain the temperature change amplitude according to the temperature information;

[0023] Determine whether the temperature change amplitude exceeds a preset first threshold;

[0024] When the temperature change amplitude exceeds the first threshold, set the temperature change flag to 1.

[0025] Further, when the temperature change flag is set, determining whether there is a sampling configuration parameter at the current temperature value according to the temperature information includes:

[0026] Obtaining the current temperature value according to the temperature information;

[0027] Determining whether there is the sampling configuration parameter at the current temperature value in the temperature sampling configuration array according to the current temperature value.

[0028] Further, when the sampling configuration parameter exists, updating the eMMC sampling configuration parameter according to the sampling configuration parameter, and updating the temperature change flag, and then performing the eMMC operation includes:

[0029] Obtaining the sampling configuration parameter corresponding to the current temperature value according to the temperature sampling configuration array;

[0030] Updating the eMMC sampling configuration parameter according to the sampling configuration parameter;

[0031] Setting the temperature change flag to 0;

[0032] Performing the eMMC operation.

[0033] Further, when the sampling configuration parameter does not exist, obtaining the sampling configuration parameter through tuning, updating the eMMC sampling configuration parameter, the temperature sampling configuration array, and the eMMC stability configuration partition according to the sampling configuration parameter, and updating the temperature change flag, and then performing the eMMC operation includes:

[0034] Updating the eMMC sampling configuration parameter according to the sampling configuration parameter;

[0035] Recording the current temperature value and the sampling configuration parameter corresponding to the current temperature value into the temperature sampling configuration array;

[0036] Updating the eMMC stability configuration partition according to the temperature sampling configuration array;

[0037] Setting the temperature change flag to 0;

[0038] Performing the eMMC operation.

[0039] Further, updating the eMMC stability configuration partition according to the temperature sampling configuration array includes:

[0040] Obtaining the stability parameter according to the temperature sampling configuration array;

[0041] Updating the eMMC stability configuration partition according to the stability parameter.

[0042] In a second aspect, an embodiment of the present invention further provides a device for dynamically adjusting chip sampling configuration parameters, including:

[0043] An initialization module, which is used to initialize and update a temperature sampling configuration array;

[0044] A temperature change flag setting module, which is used to obtain temperature information and determine whether to set the temperature change flag according to the temperature information;

[0045] A setting judgment module, which is used to judge whether the temperature change flag is set;

[0046] A parameter checking module, which is used to, when the temperature change flag is set, determine whether there is a sampling configuration parameter under the current temperature value in the temperature sampling configuration array according to the temperature information;

[0047] A parameter reading and updating module, which is used to, when the sampling configuration parameter exists, update the eMMC sampling configuration parameter according to the sampling configuration parameter, update the temperature change flag, and then perform an eMMC operation;

[0048] A parameter obtaining and updating module, which is used to, when the sampling configuration parameter does not exist, obtain the sampling configuration parameter through tuning, update the eMMC sampling configuration parameter, the temperature sampling configuration array, and the eMMC stability configuration partition according to the sampling configuration parameter, update the temperature change flag, and then perform an eMMC operation.

[0049] In a third aspect, an embodiment of the present invention provides a device, including:

[0050] At least one processor;

[0051] At least one memory, which is used to store at least one program;

[0052] When the at least one program is executed by the at least one processor, the at least one processor implements a method for dynamically adjusting chip sampling configuration parameters as described in any one of claims 1-7.

[0053] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, in which a program executable by a processor is stored, and the program executable by the processor is used to execute a method for dynamically adjusting chip sampling configuration parameters as described in any one of claims 1-7 when executed by the processor.

[0054] The advantages and beneficial effects of the present invention will be partially given in the following description, partially become apparent from the following description, or be understood through the practice of the present invention:

[0055] By monitoring the temperature change in real time and dynamically adjusting the sampling configuration parameters of the eMMC, the present invention avoids data transmission errors caused by inaccurate parameters, ensuring the stability of the system operation; by isolating the system into multiple hardware domains and restricting the temperature monitoring authority of the eMMC to the system security core, interference from the application core is avoided, improving the stability of the system; by using a temperature sampling configuration array and a stability configuration partition to achieve persistent storage of the sampling configuration parameters, while avoiding waste of system resources caused by frequent tuning, the adjustment speed of the eMMC sampling configuration parameters is accelerated, improving the efficiency and stability of the system; by using the temperature change flag in the general register to achieve cross-domain communication, the data transfer process between different hardware domains is simplified, eliminating the need to design complex communication protocols, reducing the implementation difficulty, ensuring instant transmission of temperature change information during cross-domain transmission, and improving the working efficiency and stability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 It is a step diagram of a method for dynamically adjusting chip sampling configuration parameters provided by an embodiment of the present invention;

[0057] Figure 2 It is a schematic diagram of a device for dynamically adjusting chip sampling configuration parameters provided by an embodiment of the present invention;

[0058] Figure 3 It is a schematic diagram of the structure of a device provided by an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0059] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention. For the step numbers in the following embodiments, they are only set for the convenience of explanation and no limitation is imposed on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0060] In the description of the present invention, the meaning of "a plurality of" is two or more. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence of the indicated technical features. In addition, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art of this technology field.

[0061] For ease of understanding, the nouns and technical terms that may appear in this specification are explained as follows:

[0062] Multi-core heterogeneous system: A computer system architecture that integrates multiple different types of processor cores. Taking the system-on-chip (SoC) with the ARM architecture as an example, it integrates high-performance A cores, low-power M cores, highly reliable R cores, and other dedicated processors on a single chip. By adopting different dynamic core scheduling strategies for different types of tasks, it can meet complex computing requirements while ensuring a balance between performance and power consumption, featuring high performance, low power consumption, and high flexibility.

[0063] Embedded Multimedia Card (eMMC): eMMC is a non-volatile memory that encapsulates flash memory and a controller. Its controller provides an interface for managing the flash memory to an external processor through the eMMC protocol, enabling the external processor to read and write the flash memory of the eMMC. According to the eMMC standard protocol, the flash memory of the eMMC is divided into four types of regions. Among them, the Boot Area is mainly used to store the bootloader, supporting the SoC to boot the system from the eMMC, and the User Data Area is used to store various types of user data, realizing the most important storage function. During the data read and write process, since the working frequency of the external processor may be different from that of the eMMC controller, to ensure accurate data transmission, the external processor needs to sample the data sent by the eMMC controller at specific moments. The sampling delay and the selection of the sampling point are affected by external environmental factors. When the working temperature changes, due to the characteristics of semiconductor materials and signal transmission media, the clock frequency and signal transmission delay may change, resulting in the original sampling configuration parameters being inaccurate under the current temperature conditions and affecting the stability of system operation.

[0064] eMMC tuning: When changes in the working environment cause changes in factors such as the clock offset, signal noise, and transmission delay between the external processor and the eMMC, it is necessary to update the sampling configuration parameters to compensate for these external changes to ensure system stability. The update process usually involves the external processor sending a set of test data to the eMMC and requesting the eMMC to return these data. By gradually adjusting the phase offset of the clock and the test data, different sampling points are tested, the data returned at different sampling points is evaluated, the sampling point with the best effect is selected, and the corresponding sampling configuration parameters are stored in the general-purpose register inside the eMMC for subsequent data transmission.

[0065] Figure 1 The step diagram of a method for dynamically adjusting chip sampling configuration parameters provided by an embodiment of the present invention, refer to Figure 1, an embodiment of the present invention provides a method for dynamically adjusting chip sampling configuration parameters, comprising:

[0066] Initialize and update the temperature sampling configuration array;

[0067] Obtain temperature information, and determine whether to set the temperature change flag according to the temperature information;

[0068] Determine whether the temperature change flag is set;

[0069] When the temperature change flag is set, it is determined whether there are sampling configuration parameters under the current temperature value in the temperature sampling configuration array according to the temperature information;

[0070] When the sampling configuration parameters exist, the eMMC sampling configuration parameters are updated according to the sampling configuration parameters, and the temperature change flag is updated, and then the eMMC operation is performed;

[0071] When the sampling configuration parameters do not exist, the sampling configuration parameters are obtained through tuning, and the eMMC sampling configuration parameters, the temperature sampling configuration array, and the eMMC stability configuration partition are updated according to the sampling configuration parameters, and the temperature change flag is updated to perform the eMMC operation.

[0072] Specifically, this embodiment is applied to a multi-core heterogeneous multi-hardware domain system that integrates multiple hardware components such as a central processing unit, a memory controller, and a graphics processor in a system on a chip SoC. These hardware resources are configured into multiple sets of different hardware components, defined as hardware domains, and each operating system can run independently in each corresponding hardware domain. This architecture enables each hardware domain to work independently, effectively preventing mutual interference or influence, and has the characteristics of high reliability, high stability, and strong anti-interference ability.

[0073] In this embodiment, the hardware domain includes a security domain configured with a system security core (R5) and an application domain configured with a large core (A55). Among them, the security domain focuses on processing tasks with high functional safety requirements. Compared with other hardware domains, it has a higher security level and undertakes security assurance functions in the entire system. For example, the security domain has the temperature sampling authority of the eMMC controller, while other hardware domains do not have this authority, thereby ensuring the independence and accuracy of key data collection and processing related to safety; and the application core can be set to one or more according to actual needs, which is used to process various applications with high computing performance requirements and complex application scenarios. In this embodiment, eMMC is used as the boot medium of the system. After the SoC is powered on, the boot program Bootloader is run through the R5 core to load various levels of boot images from the eMMC into the memory to complete the startup of the system.

[0074] In some optional embodiments, initializing and updating the temperature sampling configuration array includes:

[0075] Initialize the temperature sampling configuration array;

[0076] Obtain stability parameters according to the stability configuration partition of eMMC;

[0077] Update the temperature sampling configuration array according to the stability parameters..

[0078] Specifically, in this embodiment, a specific area in the eMMC is divided into a stability configuration partition, and stability parameters are stored therein. When the system starts, in addition to loading the startup image into the memory, the bootloader also initializes an eMMC temperature sampling configuration array at a fixed address in the memory, saves a set of parameters every ten degrees, and each set of parameters includes a temperature value and the eMMC sampling configuration parameters corresponding to this temperature value. After the initialization of the temperature sampling configuration array is completed, the stability parameters in the stability configuration partition of the eMMC are read, and the stored temperature value and the eMMC sampling configuration parameters corresponding to this temperature value are obtained after parsing the stability parameters, and these parameters are filled into the temperature sampling configuration array in the memory to complete the update of the temperature sampling configuration array.

[0079] In some alternative embodiments, obtaining temperature information and determining whether to set the temperature change flag according to the temperature information includes:

[0080] Monitor the temperature change through the secure core to obtain temperature information;

[0081] Obtain the temperature change range according to the temperature information;

[0082] Determine whether the temperature change range exceeds a preset first threshold;

[0083] When the temperature change range exceeds the first threshold, set the temperature change flag to 1.

[0084] Specifically, in this embodiment, after the system starts, a temperature monitoring process will run in the system secure core R5 to monitor the temperature change of the eMMC in real time and record the temperature value in the general register. When it is detected that the temperature change exceeds 10 degrees, the current temperature value is updated and the temperature change flag in the general register is set to 1.

[0085] In the application core A55, before each command operation of the eMMC driver, it will detect whether the temperature change flag flag in the general register is 1. When this flag is 1, it means that there is a large temperature change in the working environment of the eMMC, and its sampling configuration parameters may be inaccurate under the current temperature conditions. To ensure the stable operation of the system, it is necessary to update the sampling configuration parameters.

[0086] In some alternative embodiments, when the temperature change flag is set, it is determined whether there are sampling configuration parameters at the current temperature value in the temperature sampling configuration array according to the temperature information, including:

[0087] Obtain the current temperature value according to the temperature information;

[0088] Determine whether there are sampling configuration parameters at the current temperature value in the temperature sampling configuration array according to the current temperature value.

[0089] Specifically, in this embodiment, before the A55 core executes the eMMC operation, after detecting a temperature change through the temperature change flag in the general register, the current temperature value stored in the general register will be read, and then it will be determined whether there are corresponding eMMC sampling configuration parameters in the temperature sampling configuration array according to this temperature value.

[0090] In some alternative embodiments, when the sampling configuration parameters exist, update the eMMC sampling configuration parameters according to the sampling configuration parameters, and update the temperature change flag, and then execute the eMMC operation, including:

[0091] Obtain the sampling configuration parameters corresponding to the current temperature value according to the temperature sampling configuration array;

[0092] Update the eMMC sampling configuration parameters according to the sampling configuration parameters;

[0093] Set the temperature change flag to 0;

[0094] Execute the eMMC operation.

[0095] Specifically, in this embodiment, when it is detected that there are eMMC sampling configuration parameters corresponding to the current temperature value in the temperature sampling configuration array, the sampling configuration parameters will be stored in the internal register of the eMMC controller, and the temperature change flag will be set to 0 to complete the update of the sampling configuration of the eMMC controller, and then the eMMC operation will be executed.

[0096] In some alternative embodiments, when the sampling configuration parameters do not exist, obtain the sampling configuration parameters through tuning, update the eMMC sampling configuration parameters, the temperature sampling configuration array, and the eMMC stability configuration partition according to the sampling configuration parameters, and update the temperature change flag, and then execute the eMMC operation, including:

[0097] Update the eMMC sampling configuration parameters according to the sampling configuration parameters;

[0098] Record the current temperature value and the sampling configuration parameters corresponding to the current temperature value in the temperature sampling configuration array;

[0099] Update the eMMC stability configuration partition according to the temperature sampling configuration array;

[0100] Set the temperature change flag to 0;

[0101] Perform eMMC operations.

[0102] In some alternative embodiments, updating the eMMC stability configuration partition according to the temperature sampling configuration array includes:

[0103] Obtain stability parameters according to the temperature sampling configuration array;

[0104] Update the eMMC stability configuration partition according to the stability parameters.

[0105] Specifically, in this embodiment, when it is detected that there is no eMMC sampling configuration parameter corresponding to the current temperature value in the temperature sampling configuration array, it is necessary to obtain the sampling configuration parameter most suitable for the current temperature through eMMC tuning. Send a set of test data from A55 to eMMC and request eMMC to return these data. Gradually adjust the phase difference between this set of data and the clock frequency of A55 to test different sampling points. Evaluate the data returned at different sampling points, select the sampling point with the highest data transmission success rate as the optimal sampling point, store the sampling configuration parameter corresponding to this sampling point in the general-purpose register inside eMMC, complete the update of the eMMC sampling configuration, and at the same time synchronously store the current temperature value and the corresponding sampling configuration parameter in the temperature sampling configuration array in the memory and the stability configuration partition in eMMC, so as to quickly obtain the sampling configuration parameter that should be selected at the current temperature in subsequent work.

[0106] To sum up, the workflow of this embodiment is as follows: When the system starts, run the bootloader through the secure core R5, initialize a temperature sampling configuration array in the memory, fill the parameters in the eMMC stability configuration partition into this array, and then monitor the temperature change of eMMC in real time through the secure core. When it is detected that the temperature change amplitude exceeds 10 degrees, record the current temperature value and set the temperature change flag to 1. Before each eMMC operation by A55, check whether the temperature change flag is 1. When it is not 1, perform the eMMC operation normally. When it is 1, read the current temperature value, and judge whether there is a sampling configuration parameter at the current temperature value in the temperature sampling configuration array. If it exists, directly update the sampling configuration parameter of the eMMC controller and set the temperature change flag to 0. If it does not exist, generate a suitable sampling configuration parameter through eMMC tuning, update this sampling configuration parameter to eMMC, and at the same time save this temperature value and the corresponding sampling configuration parameter to the temperature sampling configuration array and the eMMC stability configuration partition, and reset the temperature change flag to 0 to complete the update of the eMMC sampling configuration.

[0107] It can be recognized that in this embodiment, by monitoring the temperature change in real time and dynamically adjusting the sampling configuration parameters of the eMMC, data transmission errors caused by inaccurate parameters are avoided, ensuring the stability of the system operation; by isolating the system into multiple hardware domains and restricting the temperature monitoring authority of the eMMC to the system security core, interference from the application core is avoided, improving the stability of the system; by using the temperature sampling configuration array and the stability configuration partition to achieve persistent storage of the sampling configuration parameters, frequent tuning is avoided, which not only prevents waste of system resources but also speeds up the adjustment speed of the eMMC sampling configuration parameters, improving the efficiency and stability of the system; by using the temperature change flag in the general register to achieve cross-domain communication, the data transfer process between different hardware domains is simplified, eliminating the need to design complex communication protocols, reducing the implementation difficulty, ensuring the immediate transmission of temperature change information during cross-domain transmission, and improving the operating efficiency and stability of the system.

[0108] Referring to Figure 2 , an embodiment of the present invention provides a device for dynamically adjusting chip sampling configuration parameters, including:

[0109] An initialization module, which is used to initialize and update the temperature sampling configuration array;

[0110] A temperature change flag setting module, which is used to obtain temperature information and determine whether to set the temperature change flag according to the temperature information;

[0111] A setting judgment module, which is used to judge whether the temperature change flag is set;

[0112] A parameter check module, which is used to, when the temperature change flag is set, judge whether there are sampling configuration parameters under the current temperature value in the temperature sampling configuration array according to the temperature information;

[0113] A parameter reading and updating module, which is used to, when the sampling configuration parameters exist, update the eMMC sampling configuration parameters according to the sampling configuration parameters, update the temperature change flag, and then perform eMMC operations;

[0114] A parameter obtaining and updating module, which is used to, when the sampling configuration parameters do not exist, obtain the sampling configuration parameters through tuning, update the eMMC sampling configuration parameters, the temperature sampling configuration array, and the eMMC stability configuration partition according to the sampling configuration parameters, update the temperature change flag, and then perform eMMC operations.

[0115] Referring to Figure 3 , an embodiment of the present invention provides a device, including:

[0116] At least one processor;

[0117] At least one memory for storing at least one program;

[0118] When the at least one program is executed by the at least one processor, the at least one processor is caused to implement the method for dynamically adjusting chip sampling configuration parameters described above.

[0119] The content in the method embodiments described above is applicable to the device embodiments of the present invention. The functions specifically implemented by the device embodiments of the present invention are the same as those of the method embodiments described above, and the beneficial effects achieved are also the same as those of the method embodiments described above.

[0120] The embodiments of the present invention also provide a computer-readable storage medium storing a program executable by a processor. When the program executable by the processor is executed by the processor, it is used to execute the method for dynamically adjusting chip sampling configuration parameters described above.

[0121] A computer-readable storage medium according to an embodiment of the present invention can execute the method for dynamically adjusting chip sampling configuration parameters provided by the method embodiments of the present invention, can execute any combination of the implementation steps of the method embodiments, and has the corresponding functions and beneficial effects of the method.

[0122] The embodiments of the present invention also disclose a computer program product or a computer program. The computer program product or the computer program includes computer instructions stored in a computer-readable storage medium. The processor of the computer device can read the computer instructions from the computer-readable storage medium, and when the processor executes the computer instructions, the computer device is caused to execute Figure 1 the method for dynamically adjusting chip sampling configuration parameters as shown.

[0123] In some alternative embodiments, the functions / operations mentioned in the block diagrams may not occur in the order mentioned in the operation diagrams. For example, depending on the functions / operations involved, two consecutive blocks shown may actually be executed substantially simultaneously or the blocks can sometimes be executed in the reverse order. In addition, the embodiments presented and described in the flowcharts of the present invention are provided by way of example for the purpose of providing a more comprehensive understanding of the technology. The disclosed method is not limited to the operations and logical flows presented herein. Alternative embodiments are contemplated in which the order of various operations is changed and sub-operations described as part of a larger operation are executed independently.

[0124] In addition, although the present invention has been described in the context of functional modules, it should be understood that, unless otherwise stated to the contrary, one or more of the above functions and / or features may be integrated in a single physical device and / or software module, or one or more functions and / or features may be implemented in separate physical devices or software modules. It should also be understood that a detailed discussion of the actual implementation of each module is not necessary for understanding the present invention. Rather, given the attributes, functions, and internal relationships of the various functional modules in the devices disclosed herein, the actual implementation of the modules will be understood within the ordinary skills of an engineer. Thus, those skilled in the art can implement the present invention as set forth in the claims without undue experimentation. It should also be understood that the specific concepts disclosed are merely illustrative and are not intended to limit the scope of the present invention, which is determined by the full scope of the appended claims and their equivalents.

[0125] If the above functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the above methods in various embodiments of the present invention. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical discs that can store program codes.

[0126] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, which can be specifically implemented in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.

[0127] More specific examples (nonexhaustive list) of computer-readable media include the following: an electrical connection (electronic device) having one or more wirings, a portable computer diskette (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable media can even be paper or other suitable media on which the above programs can be printed, because the above programs can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, deciphering, or otherwise processing as appropriate, and then storing them in a computer memory.

[0128] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application-specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

[0129] In the above description of this specification, the descriptions referring to the terms "one embodiment / example", "another embodiment / example", or "certain embodiments / examples", etc., mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0130] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the claims and their equivalents.

[0131] The above has specifically described the preferred embodiments of the present invention, but the present invention is not limited to the above embodiments. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A method for dynamically adjusting chip sampling configuration parameters, characterized in that: include: Initialize and update the temperature sampling configuration array; Acquire temperature information, and determine whether to set a temperature change flag according to the temperature information; Determining whether the temperature change flag is set; When the temperature change flag is set, judging whether there are sampling configuration parameters under the current temperature value in the temperature sampling configuration array according to the temperature information; When the sampling configuration parameter exists, updating the eMMC sampling configuration parameter according to the sampling configuration parameter, and updating the temperature change flag, and then performing the eMMC operation; When the sampling configuration parameter does not exist, the sampling configuration parameter is obtained through tuning, the eMMC sampling configuration parameter, the temperature sampling configuration array and the eMMC stability configuration partition are updated according to the sampling configuration parameter, and the temperature change flag is updated to perform the eMMC operation.

2. A chip sampling configuration parameter dynamic adjustment method according to claim 1, characterized in that: The initialization and updating of the temperature sampling configuration array includes: Initializing the temperature sampling configuration array; Acquire stability parameters according to the eMMC stability configuration partition; The temperature sampling configuration array is updated according to the stability parameter.

3. A chip sampling configuration parameter dynamic adjustment method according to claim 2, characterized in that: The acquiring of temperature information, and the determining of whether to set a temperature change flag based on the temperature information, include: Monitor temperature changes through the safety core to obtain the temperature information; Acquire a temperature variation amplitude according to the temperature information; Determining whether the temperature change amplitude exceeds a preset first threshold; When the temperature change amplitude exceeds the first threshold, the temperature change flag is set to 1.

4. A chip sampling configuration parameter dynamic adjustment method according to claim 2, characterized in that: When the temperature change flag is set, judging whether there are sampling configuration parameters under the current temperature value in the temperature sampling configuration array according to the temperature information includes: Acquire the current temperature value according to the temperature information; It is determined whether there are sampling configuration parameters under the current temperature value in the temperature sampling configuration array according to the current temperature value.

5. A chip sampling configuration parameter dynamic adjustment method according to claim 4, characterized in that: When the sampling configuration parameter exists, updating the eMMC sampling configuration parameter according to the sampling configuration parameter, and updating the temperature change flag, and then performing the eMMC operation, including: Acquire the sampling configuration parameter corresponding to the current temperature value according to the temperature sampling configuration array; Update the eMMC sampling configuration parameters according to the sampling configuration parameters; Setting the temperature change flag to 0; Perform eMMC operations.

6. A chip sampling configuration parameter dynamic adjustment method according to claim 4, characterized in that: When the sampling configuration parameter does not exist, the sampling configuration parameter is obtained by tuning, the eMMC sampling configuration parameter, the temperature sampling configuration array and the eMMC stability configuration partition are updated according to the sampling configuration parameter, and the temperature change flag is updated, and then the eMMC operation is performed, including: Update the eMMC sampling configuration parameters according to the sampling configuration parameters; Recording the current temperature value and the sampling configuration parameters corresponding to the current temperature value into the temperature sampling configuration array; Update the eMMC stability configuration partition according to the temperature sampling configuration array; Setting the temperature change flag to 0; Perform eMMC operations.

7. A chip sampling configuration parameter dynamic adjustment method according to claim 6, characterized in that: The updating of the eMMC stability configuration partition according to the temperature sampling configuration array includes: Acquire the stability parameter according to the temperature sampling configuration array; The eMMC stability configuration partition is updated according to the stability parameter.

8. A device for dynamically adjusting chip sampling configuration parameters, characterized in that: include: An initialization module, the initialization module is used to initialize and update the temperature sampling configuration array; A temperature change flag setting module, the temperature change flag setting module is used to obtain temperature information and determine whether to set a temperature change flag according to the temperature information; A setting judgment module, the setting judgment module is used to judge whether the temperature change flag is set; A parameter checking module, wherein the parameter checking module is used to determine whether there are sampling configuration parameters under the current temperature value in the temperature sampling configuration array according to the temperature information when the temperature change flag is set; A parameter reading and updating module, wherein the parameter reading and updating module is used to update the eMMC sampling configuration parameters according to the sampling configuration parameters when the sampling configuration parameters exist, and to update the temperature change flag, thereby performing the eMMC operation; A parameter acquisition and update module, wherein the parameter acquisition and update module is used to acquire the sampling configuration parameters through tuning when the sampling configuration parameters do not exist, update the eMMC sampling configuration parameters, the temperature sampling configuration array and the eMMC stability configuration partition according to the sampling configuration parameters, and update the temperature change flag, thereby performing eMMC operations.

9. A device, characterized in that: include: at least one processor; at least one memory for storing at least one program; When the at least one program is executed by the at least one processor, the at least one processor implements a method for dynamically adjusting chip sampling configuration parameters according to any one of claims 1 to 7.

10. A computer-readable storage medium storing a program executable by a processor, characterized in that: The processor-executable program is used to execute a chip sampling configuration parameter dynamic adjustment method according to any one of claims 1 to 7 when executed by the processor.

Images