Method for creating residual stress distribution simulation model of glass sealing electric connector
Through the simulation method of the thermal-structure coupling model, the residual stress distribution of the glass-sealed electrical connector is accurately simulated, solving the problem of inaccurate simulation in the prior art, and improving the reliability and performance of the product.
Patent Information
- Application Number
- CN202510169457.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2025-05-27
AI Technical Summary
Existing simulation models cannot accurately simulate the residual stress distribution of glass sealed electrical connectors in actual production, making it difficult to effectively control their reliability and performance.
By obtaining material parameters, building a three-dimensional geometric model and meshing, defining material type and contact relationship, applying initial conditions and boundary conditions, using a thermal-structure coupled model for simulation solution, and finally verifying the accuracy of the model.
The accurate simulation of the residual stress distribution of glass sealed electrical connectors is achieved, providing a basis for optimizing the glass composition system and electrical connector sealing process, and significantly improving product quality and reliability.
Smart Images
Figure CN120046344A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electrical connectors, and particularly relates to a method for creating a simulation model of the residual stress distribution of a glass-sealed electrical connector. Background Art
[0002] As an essential key component in electronic devices, glass-sealed electrical connectors are widely used in various electronic products such as smartphones, computers, communication base station equipment, etc. Their reliability and performance play a crucial role in ensuring the normal operation and long-term stability of electronic devices, and residual stress is one of the key factors affecting their reliability and performance.
[0003] Higher residual stress may cause microcracks to appear at the glass-sealed part, thereby reducing the airtightness of the connector, making it easy for external moisture, dust and other impurities to invade, affecting the stability of electrical connection, increasing the contact resistance, and even causing faults such as short circuits, seriously affecting the performance and reliability of electronic devices. Moreover, residual stress may also make the connector more likely to be damaged when subjected to mechanical vibration or impact, reducing its vibration resistance performance and shortening its service life. Therefore, in-depth research and effective control of the residual stress in glass-sealed electrical connectors are of extremely important significance for improving their reliability and performance in electronic devices, and are one of the key links to ensure the high-quality operation of electronic devices.
[0004] Currently, the research on the residual stress of glass-sealed electrical connectors mainly relies on experimental tests, such as X-ray diffraction method, optical path difference method, etc. However, experimental tests are costly, time-consuming, and it is difficult to comprehensively obtain the internal residual stress distribution. With the development of computer technology, numerical simulation has become an important means for researching residual stress, but the existing simulation models have deficiencies in accuracy and practicality, and cannot accurately simulate the residual stress distribution of glass-sealed electrical connectors during the actual production process. Summary of the Invention
[0005] In view of the above problems, the present invention provides a method for creating a simulation model of the residual stress distribution of a glass-sealed electrical connector to solve the problems existing in the prior art, achieve accurate simulation of the residual stress distribution of the glass-sealed electrical connector, and thus provide an effective basis for optimizing the glass composition system and the electrical connector sealing process (sealing temperature, cooling rate, etc.).
[0006] The technical solution adopted by the present invention is as follows: A method for creating a simulation model of the residual stress distribution of a glass-sealed electrical connector, comprising the following steps: Step 1: Obtain material parameters: Obtain the mechanical and thermal performance parameters of the materials constituting the electrical connector through instrument testing; Step 2: Construct a geometric model / mesh generation: According to the actual dimensions of the glass-sealed electrical connector, construct a three-dimensional geometric model and perform mesh generation; Step 3: Define material types: Import material parameters to define the material properties of each part of the glass-sealed electrical connector; Step 4: Define contact relationships: Set the contact relationships between the components of the glass-sealed electrical connector, such as friction, adhesion, contact heat transfer, etc.; Step 5: Apply initial conditions / boundary conditions: Define the initial conditions (such as initial temperature) of each component of the glass-sealed electrical connector, and apply corresponding boundary conditions (displacement constraints, thermal loads, concentrated forces, etc.) according to the production process; Step 6: Simulation solution: Select a suitable solver and convergence criterion to ensure the convergence and stability of the calculation. During the calculation process, monitor the change of residual stress in real time and adjust the calculation parameters to improve the calculation efficiency; Step 7: Model verification: Compare the experimental results with the simulation results to ensure the accuracy of the model. If there are deviations, repeat the correction and optimization of the model until the simulation results are in good agreement with the experimental results.
[0007] Preferably, in Step 1, since this simulation belongs to a thermal-structural coupling model, it is necessary to obtain the mechanical and thermal performance parameters of the materials constituting the electrical connector through instrument testing, such as Young's modulus, Poisson's ratio, coefficient of thermal expansion, thermal conductivity, specific heat, heat transfer coefficient, etc.
[0008] Preferably, in Step 2, according to the detailed design drawings of the glass-sealed electrical connector, construct a three-dimensional geometric model, including components such as a metal housing, a glass insulator, and metal pins. And according to the shape and size characteristics of the components, select hexahedral elements and a mesh size of 1 / 100 of the side length to ensure good mesh quality, so as to improve the calculation accuracy and efficiency. For key parts (such as the contact interface between the glass and the metal pin), appropriately refine the mesh.
[0009] Preferably, input or import the material parameters obtained in the preferred Step 1 into the geometric mesh and endow it with corresponding material properties, such as density, Young's modulus, Poisson's ratio, coefficient of thermal expansion, thermal conductivity, specific heat, heat transfer coefficient, etc.
[0010] Preferably, in Step 4, set the contact relationships between the metal pins and the glass insulator, and between the glass insulator and the metal housing as adhesion, considering the influence of factors such as adhesion and heat transfer at the contact interface on the distribution of residual stress.
[0011] Preferably, in step 5, initial conditions / boundary conditions are applied. Since residual stress only appears in the cooling stage of glass sealing, only the cooling process needs to be numerically simulated, and the initial temperature is set to the sealing temperature. Determine the peak temperature, cooling rate, etc. according to the actual process parameters of the glass sealing process, and apply reasonable constraint conditions, such as displacement constraints, acceleration, convective heat transfer, etc.
[0012] Preferably, in step 6, a suitable simulation solver is selected. The model uses the Full Newton-Raphson iterative method and the Updated Lagrange algorithm based on large strains to ensure the convergence and stability of model calculations. During the calculation process, monitor the changes in residual stress and temperature in real time, and adjust the calculation parameters to improve the calculation efficiency.
[0013] Preferably, in step 7, verify the accuracy of the model by comparing the experimental results with the simulation results. Conduct an experimental test on the residual stress of the glass-sealed electrical connector to obtain the residual stress values at key positions. Compare and analyze the experimental results with the simulation results. If there are deviations, correct and optimize the model, adjust material parameters, contact conditions, or loading methods, etc., until the simulation results are in good agreement with the experimental results.
[0014] The beneficial effect of the present invention is that the simulation model can quickly and accurately simulate the stress distribution under different process parameters, device materials, and design structures, effectively reducing the R & D cost and shortening the R & D cycle, providing strong support for product design optimization and process improvement. Ultimately, it significantly improves product quality and reliability, enhances the competitiveness of products in the market, and brings greater economic and social benefits to the enterprise. Description of the Drawings
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the prior art and the drawings required in the embodiments. Obviously, the drawings in the following description are only partial embodiments of the present invention. For those of ordinary skill in the art, even without creative efforts, they can obtain more other relevant drawings based on these drawings.
[0016] Figure 1 It is a flowchart for constructing a simulation model of the residual stress distribution of a glass-sealed electrical connector of the present invention; Figure 2 It is a material parameter diagram of each component of the electrical connector model; Figure 3 It is an analysis diagram of the influence of grid quality on simulation results; Figure 4 It is a cooling process curve diagram of the glass-sealed electrical connector; Figure 5 is the contour map of residual stress distribution; Figure 6 Model verification. Specific implementation manners
[0017] In order to fully demonstrate the purpose, technical solutions and advantages of the embodiments of the present application, next, in close combination with the accompanying drawings involved in the embodiments of the present application, the technical solutions covered by the embodiments of the present application will be elaborated in detail and thoroughly. It should be noted that the embodiments presented here are only a part of the overall embodiments of the present application and do not cover all embodiments.
[0018] The specific model construction process is shown in Figure 1 A method for creating a residual stress distribution simulation model of a glass-sealed electrical connector provided in this embodiment includes the following steps: Step 1, since this simulation belongs to a thermal-structural coupling model, mechanical and thermal performance parameters of the constituent materials of the electrical connector need to be obtained through instrument testing. The specific material parameters are shown in Figure 2 .
[0019] In Step 2, according to the detailed design drawings of the glass-sealed electrical connector, a professional finite element analysis software MSC.Marc is used to construct a three-dimensional geometric model, where the diameter of the metal pin is 4 mm, the thickness of the metal shell is 3 mm, and the thickness of the middle glass insulator is 5 mm. According to the shape and size characteristics of the components, hexahedral elements are selected and the mesh size is 1 / 100 of the thickness of the glass insulator to ensure good mesh quality and improve the calculation accuracy and efficiency. The influence of the mesh size on the calculation results is shown in Figure 3 . In addition, the mesh can be appropriately refined for key parts (such as the contact interface between the glass and the metal pin).
[0020] In Step 3, new materials are created through the "Geometric Properties" option in MSC.Marc. Then, according to Figure 2 , parameters such as Young's modulus, Poisson's ratio, coefficient of thermal expansion, thermal conductivity, and specific heat are input into the newly created material properties one by one. After the parameter input is completed, these materials with specific parameters are imported into the constructed geometric mesh, thereby endowing the geometric mesh with corresponding material properties.
[0021] In Step 4, the contact relationships between the metal pin and the glass insulator, and between the glass insulator and the metal shell are set as bonding, considering the influence of factors such as bonding and heat transfer at the contact interface on the residual stress distribution.
[0022] In Step 5, since the residual stress only appears in the cooling stage of the glass seal, only the cooling process needs to be numerically simulated. The specific cooling process curve is shown in Figure 4Set the initial temperature to 440 °C (sealing temperature), apply the thermal load on the outer unit surface, and impose displacement constraints on the nodes of the xz, yz, and xy planes according to the structural characteristics of the model.
[0023] In step 6, a coupling strategy of the Full Newton - Raphson iteration method and the Updated Lagrangian formulation based on large strains is adopted. Through the geometric nonlinear correction and the dynamic update mechanism of the stiffness matrix, the convergence problem under large deformation conditions is effectively solved. This hybrid algorithm synchronously updates the geometric configuration and the material constitutive state in each iteration, and combines the automatic step - size adjustment and the residual control technology to ensure the numerical stability of the complex nonlinear system.
[0024] In step 7, in the MSC.Marc software, use the "Model Plot" function in the "Results" option for visual analysis, and a complete contour map of the residual stress distribution of the model can be obtained (see Figure 5 ). And the data information of the specified nodes can be obtained through the "History Plot". In addition, the optical path method test is an effective method to obtain the internal residual stress of glass materials. Since the residual stress will cause changes in the optical properties inside the specimen, resulting in an optical path difference of the polarized light passing through the specimen, and according to the stress - optical path difference relationship formula in photoelasticity theory, the residual stress values at the key parts are calculated. Compare and analyze the measured experimental results with the simulation results. As Figure 6 shown, it can be seen that the error between the two is controlled within 10%, indicating that the constructed model is accurate. If there are deviations, correct and optimize the model, adjust the material parameters, contact conditions, or loading methods, etc., until the simulation results are in good agreement with the experimental results.
[0025] In the process of glass sealing of traditional electrical connectors, it often relies on a large number of experimental tests to obtain the residual stress distribution. This experimental method not only requires a large amount of human, material, and time costs, but also the experimental process is easily interfered by various external factors, resulting in certain errors and uncertainties in the results. For example, in actual operation, the accuracy limitations of experimental equipment, the slight changes in environmental temperature and humidity, and the individual differences of samples, etc., may all make the finally obtained data inaccurate and incomplete.
[0026] The residual stress distribution simulation model of the glass-sealed electrical connector of the present invention can effectively overcome many drawbacks of traditional experimental methods. By means of advanced computer simulation technology and based on accurate physical algorithms and material property parameter settings, it can accurately predict the residual stress distribution during the glass sealing process of the electrical connector. This simulation model can quickly simulate the stress distribution under various different process parameters and design structures, without the need for physical testing one by one as in traditional experiments. This not only provides strong support for product design optimization and process improvement, enabling R & D personnel to accurately evaluate and adjust product performance at the initial stage of design, but also significantly reduces R & D costs, avoids waste of resources caused by a large number of experimental failures, ultimately significantly improves product quality and reliability, enhances the competitiveness of products in the market, and brings greater economic and social benefits to the enterprise.
Claims
1. A method for creating a residual stress distribution simulation model of a glass-sealed electrical connector, comprising the following steps: Step 1, obtaining material parameters: obtaining mechanical and thermal performance parameters of the materials constituting the electrical connector through instrument testing; Step 2, constructing the geometric model / meshing: constructing a three-dimensional geometric model and performing meshing according to the actual size of the glass-sealed electrical connector; Step 3, define material type: import material parameters to define the material properties of each part of the glass-sealed electrical connector; Step 4, defining the contact relationship: setting the contact relationship between the glass-sealed electrical connector components, including but not limited to friction, bonding, and contact heat exchange; Step 5, applying initial conditions / boundary conditions: defining the initial conditions of each component of the glass-sealed electrical connector, and applying corresponding boundary conditions according to the production process; Step 6, simulation solution: select appropriate solver and convergence criteria to ensure the convergence and stability of the calculation. During the calculation process, monitor the changes of residual stress in real time and adjust the calculation parameters to improve the calculation efficiency. Step 7, model verification: Compare the experimental results with the simulation results to ensure the accuracy of the model. If there is a deviation, repeatedly correct and optimize the model until the simulation results are in good agreement with the experimental results.
2. The method for creating a residual stress distribution simulation model of a glass-sealed electrical connector according to claim 1, characterized in that: In step 1, the material characteristic parameters of the electrical connector include: Young's modulus, Poisson's ratio, thermal expansion coefficient, thermal conductivity, specific heat, and heat transfer coefficient.
3. The method for creating a residual stress distribution simulation model of a glass-sealed electrical connector according to claim 2, characterized in that: In step 2, a three-dimensional geometric model is constructed according to the detailed design drawings of the glass-sealed electrical connector, including but not limited to the metal shell, glass insulator, and metal pin components, and the hexahedral unit and the mesh size are selected to be 1 / 100 of the thickness of the glass insulator according to the shape and size characteristics of the components.
4. The method for creating a residual stress distribution simulation model of a glass-sealed electrical connector according to claim 3, characterized in that: The material parameters obtained in claim 2 are input or imported into the hexahedral unit grid of claim 3 to give it corresponding material properties.
5. The method for creating a residual stress distribution simulation model of a glass-sealed electrical connector according to claim 1, characterized in that: In step 4, the contact relationship between the metal pin and the glass insulator, and between the glass insulator and the metal shell is set to bonding, and the influence of bonding and heat transfer factors of the contact interface on the residual stress distribution is considered.
6. The method for creating a residual stress distribution simulation model of a glass-sealed electrical connector according to claim 1, characterized in that: In step 5, the initial conditions include initial temperature and relative density, and the constraint conditions include displacement constraint, acceleration, convection heat transfer, and concentrated force.
7. The method for creating a residual stress distribution simulation model of a glass-sealed electrical connector according to claim 1, characterized in that: In step 5, the initial conditions that need to be defined are the initial temperature and the glass sealing temperature, and the boundary conditions that need to be defined are the displacement constraints of the xz, yz, and xy plane nodes, and the temperature distribution of the external unit surface.
8. The method for creating a residual stress distribution simulation model of a glass-sealed electrical connector according to claim 1, characterized in that: In step 6, the model uses the Full Newton-Raphson iterative method and the Updated Lagrange algorithm based on large strain.
9. The method for creating a residual stress distribution simulation model of a glass-sealed electrical connector according to claim 1, characterized in that: In step 7, if the experimental results are in good agreement with the simulation results and the error is less than 10%, it means that the model is accurate and usable. If the error is greater than 10%, the model needs to be corrected and optimized, and the material parameters, contact conditions or loading methods need to be adjusted until the simulation results are in good agreement with the experimental results and the error is less than 10%.