Multifunctional gasket assembly for power interface of computer mainboard

Abstract

The invention discloses a multifunctional gasket assembly for a power interface of a computer mainboard, which comprises a gasket main body piece, the gasket main body piece comprises a bottom film and a conductive foam assembly, the bottom film is provided with an adhesive surface, the conductive foam assembly comprises a conductive foam block and conductive cloth arranged on one side of the conductive foam block, and the conductive cloth is arranged on the other side of the conductive foam block. The conductive cloth is arranged on the rubber surface of the bottom film, and the side, deviating from the conductive cloth, of the conductive foam block is a rubber surface and is used for being matched with a power interface; a release film is further arranged on the base film at the position of the conductive foam assembly, a part of the conductive cloth is in contact with the release film, and the release surface of the release film is in contact with the conductive cloth. The multifunctional gasket assembly can provide better buffering and damping functions, conductive functions and electromagnetic shielding functions, and can well meet the requirements of a computer mainboard power interface for the stability of electrical connection and the reliability of a mechanical structure.

Description

Technical Field

[0001] The present invention relates to the technical field of gasket products, and particularly to a multifunctional gasket assembly for a power interface of a computer motherboard. Background Art

[0002] The power interface of a computer motherboard is an important part of computer hardware. It is responsible for providing stable power supply to the motherboard to ensure the normal operation of the entire computer system. During the operation of the computer, the power interface will be subjected to certain mechanical stresses. Especially when plugging and unplugging the power cord, an impact force may be generated. In addition, the computer may also be subjected to vibrations during handling or use, which may damage the power interface and the motherboard. Moreover, in order to ensure good electrical connection between the power interface and the motherboard, a material that can provide stable conductive performance is required. At the same time, in some special cases, such as in an environment with strong electromagnetic interference, a material with certain electromagnetic shielding function is also required to be applied to the power interface of the computer motherboard. Therefore, a gasket for the power interface of a computer motherboard with buffering, shock absorption and conductive functions is highly needed. It can not only protect the interface from mechanical damage, but also provide stable electrical connection and electromagnetic shielding, and is one of the key components to ensure the stable operation of electronic devices such as computers.

[0003] The existing gaskets for electronic devices are difficult to simultaneously meet the better buffering, shock absorption and conductive functions, and cannot well meet the requirements of the power interface of the computer motherboard for the stability of electrical connection and the reliability of mechanical structure. Summary of the Invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a multifunctional gasket assembly for a power interface of a computer motherboard. The multifunctional gasket assembly can provide better buffering, shock absorption, conductive and electromagnetic shielding functions, and can well meet the requirements of the power interface of the computer motherboard for the stability of electrical connection and the reliability of mechanical structure.

[0005] To achieve the above technical purpose and reach the above technical effect, the present invention is realized through the following technical solutions:

[0006] A multifunctional gasket assembly for a power interface of a computer motherboard, comprising a gasket main body. The gasket main body includes a bottom film and a conductive foam assembly. The bottom film has an adhesive surface. The conductive foam assembly includes a conductive foam block and a conductive cloth disposed on one side of the conductive foam block. The conductive cloth is disposed on the adhesive surface of the bottom film. The side of the conductive foam block facing away from the conductive cloth is an adhesive surface for cooperating with the power interface. An isolation film is further provided on the bottom film at the position of the conductive foam assembly. A part of the conductive cloth is in contact with the isolation film, and the release surface of the isolation film is in contact with the conductive cloth.

[0007] Furthermore, the gasket main body is arranged on one side of the material tape, a roll material cushioning film is arranged on the other side of the material tape, and a heightening strip is provided on the side of the roll material cushioning film close to the material tape.

[0008] Furthermore, the width of the coiled material cushion film is greater than the width of the material strip, and both sides of the coiled material cushion film are provided with raising strips extending along the length of the coiled material cushion film.

[0009] Furthermore, the raising strip is a textured silicone raising strip, which is bonded to the coil cushion film through an adhesive layer.

[0010] Furthermore, the gasket main body is fixed to the material strip via an adhesive film strip.

[0011] Furthermore, the conductive foam component includes a plurality of conductive foam blocks, and the layout of the plurality of conductive foam blocks on the base film is adapted to the power interface of the power supply mainboard.

[0012] Furthermore, the conductive cloth is a single-sided conductive cloth with adhesive, and is bonded to the conductive foam block via the adhesive surface.

[0013] Furthermore, a conductive copper foil component is provided on the base film at a position close to the conductive foam component. The conductive copper foil component includes a conductive double-sided adhesive layer and a copper foil piece. The conductive double-sided adhesive layer is used to cooperate with the power interface of the computer motherboard.

[0014] Furthermore, the conductive copper foil assembly further comprises a silicone protective film, the silicone protective film having an adhesive surface cooperating with the copper foil piece, and a side of the silicone protective film facing away from the adhesive surface cooperating with the adhesive surface of the base film.

[0015] Furthermore, the base film is provided with positioning holes.

[0016] The beneficial effects of the present invention are:

[0017] The gasket body in the multifunctional gasket assembly of the present invention includes a base film and a conductive foam assembly, and the conductive foam assembly includes a conductive cloth and a conductive foam block; the conductive cloth and the conductive foam block cooperate to provide better and more stable conductive performance, provide a stable conductive path between the power interface and the motherboard, reduce contact resistance and lower impedance, and ensure a good electrical connection between the power interface and the motherboard; the conductive cloth and the conductive foam block cooperate to provide electromagnetic shielding function; the conductive foam block can provide better buffering and shock absorption function, and can protect the power interface from mechanical damage.

[0018] In the present invention, a release film is further provided on the bottom film at the conductive foam component. A part of the release film is in contact with the conductive foam component, and the release surface of the release film is in contact with the conductive foam component. Since the conductive foam block is made by foaming and has many pores, if the bottom film is directly bonded to the conductive foam component, when the bottom film is removed after the gasket is applied to the power interface, it is easy to cause the conductive foam block and the conductive cloth to delaminate, thus affecting the impedance and the conductive stability. By designing the partial contact between the release film and the conductive foam component, it can not only ensure the bonding between the conductive foam component and the bottom film, but also reduce the difficulty of removing the bottom film and avoid the delamination of the conductive cloth and the conductive foam block.

[0019] In order to further provide better conductive performance, the present invention also provides a conductive copper foil component. A silicone protective film is also provided between the conductive copper foil component and the bottom film. The conductive copper foil component is better attached to the bottom film through the silicone protective film. The adhesive surface of the bottom film is attached to the conductive foam component, and the adhesive surface of the silicone protective film is attached to the conductive copper foil component. The two films with different viscosities are specifically attached to the surfaces of different materials, which can achieve a better attachment effect.

[0020] The multifunctional gasket component of the present invention can simultaneously meet better buffer and shock absorption functions, conductive functions and electromagnetic shielding functions, so as to well meet the requirements of the power interface of the computer motherboard for the stability of electrical connection and the reliability of mechanical structure. In addition, when the multifunctional gasket component of the present invention is used, it is more convenient, time-saving and labor-saving, and saves costs. Brief Description of the Drawings

[0021] Figure 1 It is a schematic structural diagram of the multifunctional gasket component for the power interface of the computer motherboard according to the embodiment of the present invention.

[0022] Figure 2 It is a schematic structural diagram of the gasket main body part in the embodiment of the present invention.

[0023] Figure 3 It is an exploded structural diagram of the conductive foam component in the gasket main body part.

[0024] Figure 4 It is an exploded structural diagram of the conductive copper foil component in the gasket main body part.

[0025] Figure 5 It is a schematic structural diagram of the bottom film in the gasket main body part.

[0026] In the figure, 1: gasket main body part, 11: bottom film, 111: positioning hole, 112: opening, 12: conductive foam component, 121: conductive foam block, 122: conductive cloth, 13: release film, 14: conductive copper foil component, 141: conductive double-sided adhesive layer, 142: copper foil part, 143: silicone protective film; 2: adhesive film strip; 3: tape; 4: coiled material cushion film; 5: heightening strip. Detailed Implementation Manner

[0027] The following elaborates on the preferred embodiments of the present invention in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making the protection scope of the present invention more clearly defined.

[0028] As Figures 1 to 5 shown, the present invention provides a multi-functional gasket assembly for a power supply interface of a computer motherboard, which includes a gasket main body 1.

[0029] The multi-functional gasket assembly can be a roll stock product. Specifically, as Figure 1 shown, a plurality of gasket main bodies 1 are adhesively arranged on one side of a tape 3 through an adhesive film strip 2, and a roll stock cushion film 4 is arranged on the other side of the tape 3. The width of the roll stock cushion film 4 is greater than the width of the tape 3, and raised strips 5 extending along the length of the roll stock cushion film 4 are provided on both sides of the roll stock cushion film 4 close to the tape. Among them, the tape 3 is made of an antistatic release film material, and its release surface contacts the gasket main body 1. The raised strip 5 is a reticulated silicone raised strip, and it is adhesively attached to the roll stock cushion film 4 through an adhesive layer provided on one side. Through the design of the roll stock cushion film 4 and the raised strip 5, a certain isolation can be carried out between the roll stock layers during rolling, and the raised strip 5 raises the height so that the gasket main body 1 will not be extruded by external forces, avoiding deformation and thinning of the gasket main body.

[0030] The gasket main body 1 includes a bottom film 11 and a conductive foam assembly 12; one side of the bottom film 1 has an adhesive surface, and the bottom film 1 also has an opening 112 adapted to the power supply interface. The conductive foam assembly 12 includes a conductive foam block 121 and a conductive cloth 122 arranged on one side of the conductive foam block 121. The conductive foam block 121 is single-sidedly adhesive, that is, the side facing away from the conductive cloth 122 is the adhesive surface for cooperating with the power supply interface; the conductive cloth 122 is single-sidedly adhesive, that is, the side close to the conductive foam block 121 is the adhesive surface for adhesively attaching to the conductive foam block 121; the side of the conductive cloth 122 without the adhesive surface is adhesively attached to the adhesive surface of the bottom film 11. The adhesive surface of the conductive foam block 121 contacts the tape 3.

[0031] The cooperation of the conductive cloth 122 and the conductive foam block 121 can provide better and more stable conductive performance, provide a stable conduction path between the power supply interface and the motherboard, reduce the contact resistance and lower the impedance, and ensure good electrical connection between the power supply interface and the motherboard; the cooperation of the conductive cloth 122 and the conductive foam block 121 can also provide an electromagnetic shielding function; the conductive foam block 121 can provide better buffering and shock absorption functions, and can protect the power supply interface from mechanical damage.

[0032] There can be multiple conductive foam blocks 121 , and the layout of the multiple conductive foam blocks 121 on the bottom film 11 is compatible with the power interface of the power mainboard.

[0033] A release film 13 is also provided on the adhesive side of the bottom film 11 at the conductive foam component, and only a part of the structure of the conductive cloth 122 is in contact with the release film 13, and the release surface of the release film 13 is in contact with the conductive cloth 122. The release film 13 is in partial contact with the conductive foam component 12, which can ensure the adhesion of the conductive foam component 12 to the bottom film 11, and at the same time reduce the difficulty of removing the bottom film 11 during use, avoid the delamination of the conductive cloth 122 and the conductive foam block 121, ensure that the impedance is not affected, and improve the stability of conduction and electrical connection.

[0034] In order to further improve the conductive performance, a conductive copper foil component 14 is also provided on one side of the adhesive surface of the bottom film 11 at a position close to the conductive foam component; the conductive copper foil component 14 includes a conductive double-sided adhesive layer 141, a copper foil component 142 and a silicone protective film 143 arranged in sequence from top to bottom, and the conductive double-sided adhesive layer 141 is used to cooperate with the power interface of the computer motherboard. The silicone protective film 143 has an adhesive surface that cooperates with the copper foil component 142, and the side of the silicone protective film 143 that is away from the adhesive surface is attached to the adhesive surface of the bottom film 11. The silicone protective film 143 is provided so that the copper foil component 142 can be better attached to the bottom film 11.

[0035] In order to better coordinate with the power interface to position the gasket body 1 during use, a positioning hole 111 is further provided on the base film 1. The design position of the positioning hole 111 can be designed according to the power interface structure.

[0036] Example

[0037] like Figures 1 to 5 As shown, the multifunctional gasket assembly for the power interface of a computer motherboard of this embodiment includes a gasket main body 1.

[0038] In this embodiment, the multifunctional gasket assembly is a roll product. Figure 1 As shown, several gasket main bodies 1 are bonded and arranged on one side of a material strip 3 by adhesive film strips 2, and a roll material cushion film 4 is arranged on the other side of the material strip 3. The width of the roll material cushion film 4 is greater than the width of the material strip 3, and both sides of the roll material cushion film 4 are provided with heightening strips 5 extending along the length of the roll material cushion film 4 on the side close to the material strip.

[0039] Among them, the tape 3 is made of antistatic PET release film, with the model number T025-01YE, transparent in color, and 0.025 mm thick; the release surface of the tape 3 contacts the gasket main body 1, and its release force is 2 ± 1 g / 25 mm. The adhesive film strip 2 has adhesive on one side, with the model number SDKLV10033, adhesive force of 700 ± 100 g / in, and thickness of 0.04 mm. The coiled material cushion film 4 is made of PET double-sided antistatic film, with a thickness of 0.05 mm. The spacer strip 5 is a reticulated silicone spacer strip, which has an adhesive surface, and the spacer strip 5 is attached and bonded to the coiled material cushion film 4 through this adhesive surface. The model of the spacer strip 5 in this embodiment is SHE-800ES5R, with a thickness of 0.8 mm and an adhesive force of 500 ± 300 g / 25 mm.

[0040] The gasket main body 1 includes a bottom film 11 and a conductive foam component 12. One side of the bottom film 11 has an adhesive surface, and the bottom film 11 also has an opening 112 adapted to the power interface. For easy positioning during use, two positioning holes 111 are provided on the bottom film 11, which are respectively located on both sides of the opening. In this embodiment, the model of the bottom film 11 is SDK2296C, with an adhesive force of 40 ± 10 g / in and a thickness of 0.06 mm. The conductive foam component 12 includes a conductive foam block 121 and a conductive cloth 122 provided on one side of the conductive foam block 121. The conductive foam block 121 has adhesive on one side, that is, the side facing away from the conductive cloth is the adhesive surface, which is used to cooperate with the power interface; the model of the conductive foam block 121 in this embodiment is BZF7006, with an adhesive force ≥ 1.2 kg / sq inch (kilogram per square inch), surface impedance ≤ 0.13 Ω / sq inch (ohm per square inch), and thickness of 0.6 mm. In this embodiment, the number of conductive foam blocks 121 is 3. The conductive cloth 122 has adhesive on one side, that is, the side close to the conductive foam block is the adhesive surface, which is used to bond and attach to the conductive foam block 121; the model of the conductive cloth 122 in this embodiment is LH-952, adhesive force: ≥ 0.7 kg / inch, surface impedance: ≤ 0.05 Ω / sq inch, vertical impedance: ≤ 0.03 Ω / sq inch, thickness: 0.03 mm. The side of the conductive cloth 122 without the adhesive surface is attached to the adhesive surface of the bottom film 11; the adhesive surface of the conductive foam block 121 contacts the tape 3.

[0041] An additional release film 13 is provided on the adhesive surface side of the bottom film 11 at the position of the conductive foam component. Only a small part of the conductive cloth 122 in the conductive foam component 12 contacts this release film 13, and the release surface of the release film 13 contacts the conductive cloth 122. The model of the release film 13 in this embodiment is 28PP003W, with a release force of 3 ± 2 g / 25 mm and a thickness of 0.031 mm.

[0042] To further improve the electrical conductivity, a conductive copper foil assembly 14 is also provided on the adhesive side of the bottom film 11 near the conductive foam assembly. The conductive copper foil assembly 14 includes a conductive double-sided adhesive layer 141, a copper foil piece 142, and a silicone protective film 143 that are sequentially arranged from top to bottom. The conductive double-sided adhesive layer 141 is used to cooperate with the power interface of the computer motherboard. The silicone protective film 142 has an adhesive surface that cooperates with the copper foil piece. The side of the silicone protective film 143 facing away from this adhesive surface is attached to the adhesive surface of the bottom film 11. In this embodiment, the conductive double-sided adhesive layer 141 uses the model TESA 60384, with an adhesive force of 8.0 N / cm, a surface impedance ≤ 0.3 Ω / sq inch, and a thickness of 0.1 mm. The copper foil piece 142 uses the model C77000R, with a thickness of 0.1 mm. The silicone protective film 143 uses the model TR-5001-H4G, with an adhesive force of 110 ± 40 g / in and a thickness of 0.085 mm.

[0043] The length and width dimensions of the bottom film 11 of the gasket main body 1 and each part structure thereon are designed according to the size specifications of the power interface, and are not limited herein.

[0044] The usage method of the multifunctional gasket assembly of the present invention is as follows:

[0045] First, remove the winding pad film 4 and the padding strip 5 thereon, then remove the gasket main body 1 from the tape 3, position the positioning holes 111 on the bottom film 11 of the gasket main body 1 at the corresponding positions of the power interface, and then remove the bottom film 11, the release film 13, and the silicone protective film 143 at one time to complete the one-time fitting of the conductive foam assembly and the copper foil piece.

[0046] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention.

[0047] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multifunctional gasket assembly for a computer motherboard power interface, characterized in that: It includes a gasket main body, which includes a base film and a conductive foam component, the base film has a rubber surface, the conductive foam component includes a conductive foam block and a conductive cloth arranged on one side of the conductive foam block, the conductive cloth is arranged on the rubber surface of the base film, and the side of the conductive foam block facing away from the conductive cloth is the rubber surface, which is used to cooperate with the power interface; a release film is also provided on the base film at the conductive foam component, a part of the conductive cloth is in contact with the release film, and the release surface of the release film is in contact with the conductive cloth.

2. A multifunctional gasket assembly for a computer motherboard power interface according to claim 1, characterized in that: The gasket main body is arranged on one side of the material tape, a roll material cushion film is arranged on the other side of the material tape, and a padding strip is arranged on the side of the roll material cushion film close to the material tape.

3. A multifunctional gasket assembly for a computer motherboard power interface according to claim 2, characterized in that: The width of the coiled material cushion film is greater than the width of the material strip, and both sides of the coiled material cushion film are provided with padding strips extending along the length of the coiled material cushion film.

4. A multifunctional gasket assembly for a computer motherboard power interface according to claim 2, characterized in that: The heightening strip is a textured silicone heightening strip, which is bonded to the coil cushion film through an adhesive layer.

5. The multifunctional gasket assembly for a computer motherboard power interface according to claim 1, characterized in that: The gasket main body is fixed on the material strip by an adhesive film strip.

6. A multifunctional gasket assembly for a computer motherboard power interface according to claim 1, characterized in that: The conductive foam component includes a plurality of conductive foam blocks, and the layout of the plurality of conductive foam blocks on the base film is adapted to the power interface of the power supply mainboard.

7. A multifunctional gasket assembly for a computer motherboard power interface according to claim 1, characterized in that: The conductive cloth is a single-sided conductive cloth with adhesive, and is bonded to the conductive foam block via the adhesive surface.

8. The multifunctional gasket assembly for a computer motherboard power interface according to claim 1, characterized in that: A conductive copper foil component is also provided on the base film at a position close to the conductive foam component. The conductive copper foil component includes a conductive double-sided adhesive layer and a copper foil piece. The conductive double-sided adhesive layer is used to cooperate with the power interface of the computer motherboard.

9. A multifunctional gasket assembly for a computer motherboard power interface according to claim 8, characterized in that: The conductive copper foil assembly further comprises a silicone protective film, wherein the silicone protective film has an adhesive surface that matches the copper foil piece, and a side of the silicone protective film that is away from the adhesive surface matches the adhesive surface of the base film.

10. The multifunctional gasket assembly for a computer motherboard power interface according to claim 1, characterized in that: The bottom film is also provided with positioning holes.

Images