Plasma device

Abstract

The disclosure provides a kind of plasma equipment, it is related to the technical field of semiconductor equipment. Plasma equipment includes: chamber base, the top wall of chamber base is equipped with first opening;Dielectric cylinder, it is located above chamber base, and it is sealed with chamber base cooperation, so that the internal space of chamber base is communicated with the internal space of dielectric cylinder through first opening;Coil assembly, it is sleeved outside dielectric cylinder;Cooling cylinder, it is located between dielectric cylinder and coil assembly, and it has preset gap between dielectric cylinder;Cooling cylinder is provided with gas inlet hole for cooling gas to enter;Cooling cylinder has first layer cylinder wall and second layer cylinder wall, first layer cylinder wall is located at the inner side of second layer cylinder wall towards dielectric cylinder, and flow guide passage is formed between first layer cylinder wall and second layer cylinder wall;First layer cylinder wall is provided with a plurality of gas outlet holes, and gas outlet hole, gas inlet hole are communicated with flow guide passage respectively.The disclosure can dissipate heat to dielectric cylinder.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor equipment technology, and more particularly to a plasma device. Background Technology

[0002] In related technologies, ICP (Inductively Coupled Plasma Etcher) equipment and resist stripping equipment are important process equipment in semiconductor chip manufacturing, and remote plasma technology has been widely used in these devices. The purpose of remote plasma technology is to generate plasma in a region far from the wafer, and then process the wafer after the plasma reaches the wafer area. However, the process of generating plasma generates high temperatures. Summary of the Invention

[0003] This disclosure provides a plasma device capable of dissipating heat from a dielectric cylinder and reducing its temperature.

[0004] This disclosure provides a plasma device, comprising: a chamber substrate, the top wall of which has a first opening; a dielectric cylinder located above the chamber substrate and sealed to it, such that the internal space of the dielectric cylinder communicates with the internal space of the chamber substrate through the first opening; a coil assembly sleeved on the dielectric cylinder; and a cooling cylinder located between the dielectric cylinder and the coil assembly, with a predetermined gap between them; the cooling cylinder has an inlet for cooling gas to enter; the cooling cylinder has a first cylinder wall and a second cylinder wall. The first layer of the cylinder wall is located inside the second layer of the cylinder wall facing the medium cylinder, and a flow guiding channel is formed between the first layer of the cylinder wall and the second layer of the cylinder wall. The first layer of the cylinder wall is provided with a plurality of air outlets, and the air outlets and air inlets are respectively connected to the flow guiding channel. Some of the air outlets are distributed at intervals along the axial direction of the cooling cylinder, and some of the air outlets are distributed at intervals along the circumferential direction of the cooling cylinder. Under the guidance of the flow guiding channel, the cooling gas entering from the air inlet can flow to the plurality of air outlets, and after being discharged from the air outlets, it enters the preset gap to dissipate heat from the medium cylinder.

[0005] In some embodiments, the cooling cylinder includes a vertical section and a bent section, the vertical section extending axially along the cooling cylinder and connected to the bent section, the bent section extending in a direction away from the medium cylinder; the bent section is provided with the air inlet; at least a portion of the flow channel is located in the vertical section.

[0006] In some embodiments, the diameter of the vent gradually increases from bottom to top.

[0007] In some embodiments, the distribution density of the vents gradually increases from bottom to top.

[0008] In some embodiments, the diameter of the vent is less than or equal to 5 mm.

[0009] In some embodiments, the preset gap between the cooling cylinder and the medium cylinder is less than or equal to 5 mm.

[0010] In some embodiments, the cooling cylinder is provided with a plurality of elongated holes, the length direction of which is parallel to the axial direction of the cooling cylinder; at least two elongated holes are distributed at intervals along the circumference of the cooling cylinder; the first layer of cylinder wall is provided with the air outlet in the portion between two adjacent elongated holes along the circumference of the cooling cylinder.

[0011] In some embodiments, the cooling cylinder is made of a metal material; or, the cooling cylinder is made of a medium material.

[0012] In some embodiments, the cooling cylinder is detachably connected to the chamber substrate.

[0013] In some embodiments, the plasma device further includes: a cover plate covering one end of the medium cylinder away from the chamber substrate; and an air inlet device with an air inlet pipe passing through the cover plate.

[0014] The plasma device provided in this embodiment of the present disclosure provides a cooling gas that enters from the air inlet of the cooling cylinder, is guided through the flow channel to the air outlet, and is then discharged into the medium cylinder. This cooling gas can dissipate heat from the medium cylinder, reduce its temperature, and improve or even prevent the medium cylinder from melting due to high temperature. Furthermore, by reducing the temperature difference inside the medium cylinder, the temperature uniformity of the medium cylinder is improved, thus improving or even preventing the medium cylinder from cracking due to excessive temperature difference.

[0015] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0016] The accompanying drawings are provided to better understand this solution and do not constitute a limitation of this disclosure. Wherein:

[0017] Figure 1 This is a schematic diagram of the structure of the plasma device according to an embodiment of this disclosure;

[0018] Figure 2 This is a partial cross-sectional schematic diagram of the plasma device according to an embodiment of this disclosure;

[0019] Figure 3This is a three-dimensional structural diagram of the cooling cylinder according to an embodiment of this disclosure;

[0020] Figure 4 This is a cross-sectional schematic diagram of the cooling cylinder according to an embodiment of this disclosure.

[0021] Explanation of reference numerals in the attached drawings: 100-Cavity substrate; 200-Dielectric cylinder; 300-Coil assembly; 400-Cooling cylinder; 410-First cylinder wall; 411-Air inlet; 412-Flow guide channel; 413-Air outlet; 420-Second cylinder wall; 400a-Vertical section; 400b-Bent section; 430-Elongated hole; 440-Sealing ring; 500-Cover plate; 600-Air inlet device; 700-Vacuum pump; 800-Wafer. Detailed Implementation

[0022] The exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments to aid understanding, and should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0023] In related technologies, plasma equipment includes a chamber substrate, a dielectric cylinder, and a coil assembly. The chamber substrate contains a wafer region, the dielectric cylinder contains an ion excitation region, and the coil assembly is located outside the dielectric cylinder. There is a certain distance between the ion excitation region and the wafer region. To ensure the concentration of excited-state components on the wafer surface is achieved, a relatively high power is used to generate plasma. When energy is fed into the coil assembly, the region corresponding to the coils in the coil assembly has the highest plasma concentration. Ions bombard the dielectric cylinder, causing its temperature to rise and potentially leading to melting. Furthermore, because the coils are helical, they are not uniformly distributed relative to the dielectric cylinder, resulting in poor temperature uniformity and potentially causing the dielectric cylinder to crack.

[0024] To overcome the above problems, this embodiment provides a plasma device that uses a cooling cylinder outside the dielectric cylinder to dissipate heat from the dielectric cylinder by introducing cooling gas into the cooling cylinder, thereby reducing the temperature of the dielectric cylinder and improving or even preventing the problem of the dielectric cylinder melting due to high temperature. Furthermore, by reducing the temperature difference inside the dielectric cylinder, the temperature uniformity of the dielectric cylinder is improved, thus improving or even preventing the problem of the dielectric cylinder cracking due to excessive temperature difference.

[0025] The structure, function, and implementation process of the plasma device provided in this embodiment will be illustrated below with reference to the accompanying drawings.

[0026] Figure 1This is a cross-sectional schematic diagram of the plasma device in an embodiment of this disclosure (with the vertical plane passing through the central axis of the plasma device as the cutting plane); Figure 2 This is a partial cross-sectional schematic diagram of the coil assembly, cooling cylinder and dielectric cylinder in an embodiment of this disclosure; Figure 3 This is a three-dimensional structural diagram of the cooling cylinder in an embodiment of this disclosure; Figure 4 This is a cross-sectional schematic diagram of the cooling cylinder in an embodiment of this disclosure (with the vertical plane passing through the central axis of the plasma device as the cutting plane).

[0027] Please refer to Figures 1 to 4 This embodiment provides a plasma device, including: a chamber base 100, the top wall of which has a first opening; a dielectric cylinder 200, located above the chamber base 100 and sealed to the chamber base 100, such that the internal space of the chamber base 100 communicates with the internal space of the dielectric cylinder 200 through the first opening; a coil assembly 300, sleeved outside the dielectric cylinder 200; and a cooling cylinder 400, located between the dielectric cylinder 200 and the coil assembly 300, with a predetermined gap between them; the cooling cylinder 400 is provided with cooling gas. The air inlet 411 is for the body to enter; the cooling cylinder 400 has a first cylinder wall 410 and a second cylinder wall 420. The first cylinder wall 410 is located on the inner side of the second cylinder wall 420 facing the medium cylinder 200, and a flow channel 412 is formed between the first cylinder wall 410 and the second cylinder wall 420; the first cylinder wall 410 is provided with a plurality of air outlets 413, and the air outlets 413 and the air inlet 411 are respectively connected to the flow channel 412; some of the air outlets 413 are distributed at intervals along the axial direction of the cooling cylinder 400, and some of the air outlets 413 are distributed at intervals along the circumferential direction of the cooling cylinder 400.

[0028] Guided by the flow channel 412, the cooling gas entering from the air inlet 411 can flow to multiple air outlets 413, and after being discharged from the air outlets 413, it enters a preset gap so that it can be blown onto the medium cylinder 200 to dissipate heat from the medium cylinder 200.

[0029] The chamber substrate 100 is generally cylindrical or prismatic. The chamber substrate 100 has an internal space, the shape of which can be configured according to actual needs; for example, the internal space of the chamber substrate 100 is generally cylindrical or prismatic. The internal space of the chamber substrate 100 is used to accommodate the wafer 800. Generally, the internal space of the chamber substrate 100 is provided with a support device for supporting the wafer 800, which may include at least one of the following: a tray, a pin, or an air float, etc.

[0030] For ease of description, this embodiment will be described with the axial direction of the chamber base 100 as the vertical direction (or vertical direction) and the direction of the chamber base 100 toward the medium cylinder 200 as the top (or top).

[0031] The chamber base 100 has a top end and a bottom end spaced apart along its axial direction. A first opening is formed in the top wall of the chamber base 100, allowing gas to enter the interior space of the chamber base 100. The first opening can be a circular through-hole. In other examples, the first opening can also be polygonal, and its shape can be specifically set according to actual needs. Taking a cylindrical shape as an example, the diameter of the first opening can be approximately half the outer diameter of the chamber base 100.

[0032] A dielectric cylinder 200 is disposed above the chamber substrate 100. The dielectric cylinder 200 can be a hollow cylinder, and its internal space can provide space for ion generation. The dielectric cylinder 200 can be cylindrical. In other examples, the dielectric cylinder 200 can also be prismatic.

[0033] The medium cylinder 200 has a second opening, which corresponds to the first opening of the chamber base 100, so that the internal space of the medium cylinder 200 is connected to the internal space of the chamber base 100.

[0034] The medium cylinder 200 can be fixedly connected and sealed to the wall of the first opening. For example, the wall of the first opening can be stepped, and the first opening includes a first section and a second section, with the first section located above the second section. The diameter of the first section is larger than the diameter of the second section, thus forming a support surface at the connection between the first and second sections. The medium cylinder 200 is inserted into the first section and supported on the support surface. To improve sealing reliability, a sealing ring 440 can be provided between the outer wall of the medium cylinder 200 and the wall of the first section, or between the bottom surface of the medium cylinder 200 and the support surface.

[0035] The medium cylinder 200 also has a third opening located at the top of the medium cylinder 200. A cover plate 500 may be provided at the top of the medium cylinder 200 to seal the third opening. In other examples, the cover plate 500 may also be integrally formed with the medium cylinder 200.

[0036] The plasma device may also include an air inlet device 600, the air inlet pipe of which passes through the cover plate 500 to supply gas into the medium cylinder 200.

[0037] A coil assembly 300 is fitted over the dielectric cylinder 200. The coil assembly 300 is used to excite the gas inside the dielectric cylinder 200 to form plasma by means of radio frequency or microwave when energy is supplied. The power of the energy supplied to the coil assembly 300 can be set according to actual needs.

[0038] The coil assembly 300 may include a coil body and a coil mounting component, which is used to fix the coil body to other components of the plasma device. For example, the coil mounting component can fix the coil body to the chamber base 100; the structure of the coil mounting component can be configured according to actual needs.

[0039] A cooling cylinder 400 is disposed between the coil assembly 300 and the dielectric cylinder 200. The cooling cylinder 400 is used to deliver cooling gas to the dielectric cylinder 200 to cool the dielectric cylinder 200. The cooling cylinder 400 is relatively close to the dielectric cylinder 200 to ensure that the gas discharged from the cooling cylinder 400 can be blown towards the dielectric cylinder 200 as much as possible.

[0040] The cooling cylinder 400 is a cylindrical structure that can be fitted over the medium cylinder 200. There is a certain gap between the medium cylinder 200 and the cooling cylinder 400, allowing the cooling gas discharged from the cooling cylinder 400 to flow within this gap, increasing the contact area between the cooling gas and the medium cylinder 200. The shape of the cooling cylinder 400 can be consistent with the shape of the medium cylinder 200. For example, when the medium cylinder 200 is cylindrical, the cooling cylinder 400 can also be cylindrical, and the inner diameter of the medium cylinder 200 is slightly larger than its outer diameter.

[0041] The cooling cylinder 400 can be a double-layer structure. For example, the cooling cylinder 400 includes a first cylinder wall 410 and a second cylinder wall 420; the first cylinder wall 410 is located inside the second cylinder wall 420 facing the medium cylinder 200, that is, the first cylinder wall 410 is closer to the medium cylinder 200; a flow channel 412 is formed between the first cylinder wall 410 and the second cylinder wall 420. The first cylinder wall 410 is provided with multiple air outlets 413. The cooling cylinder 400 is also provided with an air inlet 411. The air outlets 413 and the air inlet 411 are respectively connected to the flow channel 412. Thus, cooling gas enters from the air inlet 411, is guided through the flow channel 412, and finally exits from the air outlet 413 and is blown towards the medium cylinder 200.

[0042] Some of the vent holes 413 are spaced apart along the axial direction of the cooling cylinder 400, while others are spaced apart along the circumferential direction. This allows for a larger number of vent holes 413 to be provided, and the distribution of the vent holes 413 is relatively uniform, which is beneficial for improving the cooling effect on the medium cylinder 200.

[0043] The cooling cylinder 400 is made of metal; in this case, the cooling cylinder 400 can also serve as a Faraday cylinder. Alternatively, the cooling cylinder 400 is made of a dielectric material; the dielectric material may include one of the following: ceramic or quartz.

[0044] The cooling cylinder 400 is detachably installed in the ionization device, facilitating its maintenance or replacement. For example, the bottom of the cooling cylinder 400 can be bolted or snapped to the chamber base 100 via intermediate connecting parts such as mounting brackets.

[0045] The plasma device provided in this embodiment, through the above-described configuration, allows the cooling gas entering from the air inlet 411 of the cooling cylinder 400 and guided through the flow channel 412 to the air outlet 413 and then discharged into the dielectric cylinder 200 to dissipate heat from the dielectric cylinder 200, reducing its temperature and improving or even preventing the dielectric cylinder 200 from melting due to high temperatures. Furthermore, by reducing the temperature difference inside the dielectric cylinder 200, the temperature uniformity of the dielectric cylinder 200 is improved, improving or even preventing the dielectric cylinder 200 from cracking due to excessive temperature differences. Moreover, the air inlet 411, flow channel 412, and air outlet 413 provided in this embodiment do not affect the vacuum environment inside the dielectric cylinder 200 and can reduce the impact on the feed efficiency of the coil assembly 300.

[0046] In some embodiments, the cooling cylinder 400 includes a vertical section 400a and a bent section 400b. The vertical section 400a extends axially along the cooling cylinder 400, and the bent section 400b extends radially along the cooling cylinder 400. Optionally, the bent section 400b may be arranged perpendicular to the vertical section 400a.

[0047] For example, to improve the overall integrity of the cooling cylinder 400, the vertical section 400a can be a hollow cylinder; the bottom end of the cylinder is connected to a structure extending in a direction away from the central axis of the cylinder, which forms a bent section 400b. The bent section 400b can be an annular structure; in other examples, the bent section 400b can include at least one block-shaped structure.

[0048] The bent section 400b is provided with an air inlet 411, and at least a portion of the guide channel 412 may be located in the vertical section 400a. For example, the air inlet 411 extends through the bent section 400b, and the guide channel 412 is located in the vertical section 400a; or, the air inlet 411 does not extend through the bent section 400b, then a portion of the guide channel 412 is located in the vertical section 400a and another portion is located in the bent section 400b, such that the guide channel 412 communicates with the air inlet 411.

[0049] In some examples, the bent section 400b is connected to the bottom end of the vertical section 400a. The bent section 400b is provided with an air inlet 411 connected to a cooling gas source. For example, the air inlet 411 is provided at the end of the bent section 400b opposite to the vertical section 400a, or in other words, the first layer of cylinder wall 410 is located on the end face of the bent section 400b opposite to the vertical section 400a, and together with the second layer of cylinder wall 420 located on the end face of the bent section 400b opposite to the vertical section 400a, they form the air inlet 411.

[0050] The cooling cylinder 400 may be provided with multiple rows of vent holes 413; wherein, a reference line is taken as one of the straight lines parallel to the axial direction of the cooling cylinder 400 that passes through the wall of the cooling cylinder 400 and through the vent holes 413, and the multiple vent holes 413 through which the reference line passes can be a row of vent holes 413.

[0051] An air inlet 411 is provided in the portion of the bent section 400b corresponding to at least two rows of opposite air outlets 413. Optionally, an air inlet 411 is provided in the portion of the bent section 400b corresponding to each row of air outlets 413, which helps to improve the uniformity of cooling effect. Alternatively, to simplify the structure, an air inlet 411 is provided in the portion of the bent section 400b corresponding to one of the two, three, or four air outlets 413. The number of air inlets 411 can be set according to actual needs.

[0052] Optionally, to mitigate the uneven cooling effect of the cooling cylinder 200 caused by energy loss during the upward flow of cooling gas, the diameter of the vent 413 gradually increases from bottom to top, thereby improving the uniformity of the cooling effect on the cooling cylinder 200. Specifically, as the axial length of the cooling cylinder 400 increases, the ratio between the diameter of the upper vent 413 and the diameter of the lower vent 413 also increases. This ratio can be set according to actual needs.

[0053] Optionally, to mitigate the uneven cooling effect of the medium cylinder 200 caused by energy loss during the upward flow of cooling gas, the distribution density of the vents 413 gradually increases from bottom to top, thereby improving the uniformity of the cooling effect on the medium cylinder 200. For example, the distance between two axially adjacent vents 413 gradually decreases from bottom to top. Specifically, as the axial length of the cooling cylinder 400 increases, the ratio between the distribution density of vents 413 in the upper region and the distribution density of vents 413 in the lower region also increases. The ratio between the distribution density of vents 413 in the upper region and the distribution density of vents 413 in the lower region can be set according to actual needs.

[0054] In other examples, the vertical segment 400a has an upper part, a lower part, and a middle part connecting the upper and lower parts; the bent segment 400b may also be connected to the middle or upper part of the vertical segment 400a.

[0055] In some embodiments, the diameter of the vent 413 is less than or equal to 5 mm. For example, the diameter of the vent 413 can be 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, or 5.0 mm, or any value between two of these. With the above configuration, the cooling cylinder 400 can have a relatively large number of vents 413, and can ensure that the velocity or pressure of the cooling gas flowing out of the vents 413 reaches a preset value, thereby ensuring the cooling effect on the medium cylinder 200.

[0056] In some embodiments, the preset gap between the cooling cylinder 400 and the medium cylinder 200 is less than or equal to 5 mm. For example, the preset gap between the cooling cylinder 400 and the medium cylinder 200 can be 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5 mm, 4.0 mm, 4.5 mm, or 5.0 mm, or any value between two of the above. This setting provides diffusion space for the cooling gas discharged from the vent 413 while preventing excessive diffusion of the cooling gas from affecting the cooling effect on the medium cylinder 200.

[0057] In some embodiments, to reduce weight and minimize the impact on the energy feed efficiency of the coil assembly 300, the cooling cylinder 400 is provided with a plurality of elongated holes 430, the length direction of which is parallel to the axial direction of the cooling cylinder 400. The elongated holes 430 may be located at least in the vertical section 400a of the cooling cylinder 400; for example, the elongated holes 430 may be located in the vertical section 400a; or, for example, most of the elongated holes 430 may be located in the vertical section 400a, and a small portion in the bent section 400b. Furthermore, when the cooling cylinder 400 is made of a metallic material such as aluminum alloy, the above-described arrangement also enables electrostatic shielding.

[0058] The elongated hole 430 can be provided through the thickness direction of the cooling cylinder 400. Alternatively, the elongated hole 430 includes: a blind hole provided in the first layer cylinder wall 410, the opening of which is located on the inner surface of the first layer cylinder wall 410; and / or, a blind hole provided in the second layer cylinder wall 420, the opening of which is located on the outer surface of the second layer cylinder wall 420. It is understood that when the elongated hole 430 is provided through the thickness direction of the cooling cylinder 400, the elongated hole does not communicate with the guide channel 412. The cooling cylinder 400 can be manufactured by 3D printing, injection molding, stamping, or other integral molding processes; or, the first layer cylinder wall 410 and the second layer cylinder wall 420 are fixedly connected by at least one of the following connection methods: bonding, snap-fitting, screwing, welding, etc.

[0059] Optionally, at least two elongated holes 430 are spaced apart along the circumference of the cooling cylinder 400. An air outlet 413 is provided between two adjacent elongated holes 430 along the circumference of the cooling cylinder 400. The elongated holes 430 and air outlets 413 are arranged in alternating rows. For example, one or more rows of air outlets 413 are provided between two adjacent elongated holes 430 along the circumference of the cooling cylinder 400. Or, for another example, one or more elongated holes 430 are provided between two adjacent rows of air outlets 413 along the circumference of the cooling cylinder 400.

[0060] In other examples, an elongated hole 430 may also be provided between two air outlets 413 spaced apart along the axial direction of the cooling cylinder 400; or, an elongated hole 430 may also be provided between two air outlets 413 spaced apart along the circumferential direction of the cooling cylinder 400.

[0061] In some embodiments, the plasma device may further include a recovery device for recovering the cooling gas located in the gap between the medium cylinder 200 and the cooling cylinder 400, so as to facilitate the timely discharge of the cooling gas after heat exchange with the medium cylinder 200 from the gap between the medium cylinder 200 and the cooling cylinder 400.

[0062] For example, the recovery device includes a recovery tray with a central hole that can mate with at least one of a cover plate 500, a medium cylinder 200, and a cooling cylinder 400. At least a portion of the recovery tray can be fitted over the medium cylinder 200, or at least a portion of the recovery tray can be fitted over the cooling cylinder 400, or at least a portion of the recovery tray can be fitted over the cover plate 500. The recovery tray has recovery holes that can extend along the inner circumference of the recovery tray, i.e., the inner wall of the central hole, or there can be multiple recovery holes evenly distributed along the inner circumference of the recovery tray. A recovery channel is provided inside the recovery tray, and the recovery channel communicates with each recovery hole. The recovery tray may also have an interface that communicates with the recovery channel and can be connected to a recovery pipeline; the recovery pipeline can be connected to a suction component or a component capable of containing gas. The cooled gas after heat exchange can enter the recovery tray through the recovery holes, be guided through the recovery channel, and then discharged into the recovery pipeline through the interface.

[0063] When the air inlet 411 of the cooling cylinder 400 is located at the bottom, the recovery tray can be disposed near the top of the cooling cylinder 400; for example, there is a preset distance between the top surface of the cooling cylinder 400 and the lower surface of the cover plate 500, and at least a portion of the recovery tray can be located between the top surface of the cooling cylinder 400 and the lower surface of the cover plate 500, or the gap between the top surface of the cooling cylinder 400 and the lower surface of the cover plate 500 communicates with the recovery hole of the recovery tray, so that the cooled gas after heat exchange can enter the recovery tray from the recovery hole.

[0064] Optionally, the gas source device providing the cooling gas may be equipped with a first valve; a second valve may be installed at the inlet of the recovery device, for example, the second valve may be installed at the interface of the recovery tray; the first valve and the second valve are respectively communicatively connected to the control device of the plasma equipment, and the control device is used to control the working state of the first valve and the second valve respectively, such as controlling the opening and closing of the valves and the opening degree. For example, the control device controls the first valve to open and controls the second valve to open at preset time intervals, so as to promptly discharge the cooling gas after heat exchange with the medium cylinder 200 from the gap between the medium cylinder 200 and the cooling cylinder 400. As another example, after the cooling of the medium cylinder 200 is completed, the control device controls the first valve to close, and controls the second valve to close after a preset time interval, to ensure that all the cooling gas in the gap between the medium cylinder 200 and the cooling cylinder 400 is discharged.

[0065] In some embodiments, a vacuum pump 700 is installed at the lower end of the chamber substrate 100. The vacuum pump 700 is communicatively connected to a control device and is used to process the internal space of the chamber substrate 100 into a vacuum environment.

[0066] It is understood that the other components and functions of the plasma device in this embodiment are known to those skilled in the art, and will not be described in detail here to reduce redundancy.

[0067] In the description of this specification, it should be understood that the terms "length", "width", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0068] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0069] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0070] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0071] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify the disclosure, specific examples of components and arrangements have been described above. Of course, these are merely examples and are not intended to limit the scope of this disclosure. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0072] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure, and these should all be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A plasma device, comprising: A chamber base, wherein the top wall of the chamber base is provided with a first opening; A medium cylinder is located above the chamber base and is sealed to the chamber base, so that the internal space of the medium cylinder is connected to the internal space of the chamber base through the first opening; The coil assembly is sleeved outside the dielectric cylinder; A cooling cylinder is located between the dielectric cylinder and the coil assembly, and has a preset gap with the dielectric cylinder; the cooling cylinder is provided with an air inlet for cooling gas to enter; the cooling cylinder has a first cylinder wall and a second cylinder wall, the first cylinder wall is located on the inner side of the second cylinder wall facing the dielectric cylinder, and a flow guiding channel is formed between the first cylinder wall and the second cylinder wall; the first cylinder wall is provided with a plurality of air outlets, and the air outlets and air inlets are respectively connected to the flow guiding channel; some of the air outlets are spaced apart along the axial direction of the cooling cylinder, and some of the air outlets are spaced apart along the circumferential direction of the cooling cylinder; Guided by the flow channel, the cooling gas entering from the air inlet can flow to the multiple air outlets, and after being discharged from the air outlets, it enters the preset gap to dissipate heat from the medium cylinder. The cooling cylinder is provided with a plurality of elongated holes, the length direction of which is parallel to the axial direction of the cooling cylinder; At least two of the elongated holes are distributed at circumferential intervals along the cooling cylinder; The first layer of the cylinder wall is located in the portion between two adjacent elongated holes along the circumference of the cooling cylinder, and is provided with the air outlet. The diameter of the air outlet gradually increases from bottom to top; or, the distribution density of the air outlet gradually increases from bottom to top.

2. The plasma device according to claim 1, wherein the cooling cylinder comprises a vertical section and a bent section, the vertical section extending axially along the cooling cylinder, the vertical section being connected to the bent section, the bent section extending in a direction away from the dielectric cylinder; the bent section being provided with the air inlet; and at least a portion of the flow guiding channel being located in the vertical section.

3. The plasma device according to claim 2, wherein the bottom end of the vertical section is connected to the bent section.

4. The plasma device according to claim 1, wherein the diameter of the gas outlet is less than or equal to 5 mm; And / or, the preset gap between the cooling cylinder and the medium cylinder is less than or equal to 5 mm.

5. The plasma device according to claim 1, wherein the cooling cylinder is made of a metal material; or, the cooling cylinder is made of a dielectric material.

6. The plasma device according to claim 1, wherein the cooling cylinder is detachably connected to the chamber substrate.

7. The plasma device according to claim 1, further comprising: A cover plate is installed on the end of the medium cylinder opposite to the chamber base; An air intake device, wherein the air intake pipe of the air intake device passes through the cover plate.

Images