Semiconductor Debonding Equipment

Abstract

The disclosed embodiment provides a semiconductor degumming device, including a reaction chamber, a carrier, a suction device and a controller. The suction device includes a suction component and a suction tube; the suction tube is provided with a controllable valve; the controllable valve includes a valve cavity, a valve plate and a cleaning component; the cleaning component is provided in the valve cavity and includes a plurality of cleaning ports for spraying a cleaning fluid; the cleaning component is configured to include at least a first posture that cooperates with the valve plate in the position of the conductive air path, so that the plurality of cleaning ports can face the surface of the valve plate at a first preset inclination angle; the cleaning port ejects a first oblique fluid that can peel off the attachments on the surface of the valve plate at the first preset inclination angle. The controller is communicatively connected to the suction component, the controllable valve, and the cleaning component; the controller responds to the working signal of the semiconductor degumming device, controls the valve plate to be in the position of the conductive air path of the suction tube, and starts the cleaning component and the suction component to work. This prevents the valve plate from being unable to rotate normally due to a large amount of impurities deposited on the surface.

Description

Technical Field

[0001] The present disclosure relates to the field of photoresist removal technology, and in particular to semiconductor photoresist removal equipment. Background Art

[0002] Plasma stripping is an important cleaning step in semiconductor single-wafer scanning, bottom film scanning, component packaging, chip manufacturing and other industries. Plasma stripping is not only simple to operate, but also has high stripping efficiency, a clean and smooth surface, no scratches, low cost and environmental protection. Photoresist is mainly removed by the reaction of oxygen nuclei and photoresist in a plasma environment. Since the basic component of photoresist is hydrocarbon polymer, under the action of radio frequency or microwave, oxygen is ionized into oxygen atoms and reacts chemically with photoresist to generate carbon monoxide, carbon dioxide and water, which are then vacuumed away by a pump to complete the removal of photoresist.

[0003] However, a valve body for controlling the connection or disconnection between the pump and the reaction chamber is usually provided on the pipeline connecting the pump and the reaction chamber. Therefore, when the valve body is in the on state, the products of the chemical reaction will partially adhere to the valve plate surface and the valve chamber wall in the valve body when being drawn away, and as time accumulates, the valve body opening will become unstable or stuck. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a semiconductor stripping device to solve the problems in the related art.

[0005] The first aspect of the present disclosure provides a semiconductor degumming device, comprising:

[0006] The reaction chamber includes a vent hole for introducing a plasma gas for forming a debonding process;

[0007] A carrying platform, arranged in the reaction chamber, for carrying the product to be debonded;

[0008] A suction device, comprising a suction component and a suction pipe; one end of the suction pipe is connected to the reaction chamber, and the other end is connected to the suction component, and is used to extract the product generated by the degumming process from the reaction chamber;

[0009] The suction pipe is provided with a controllable valve; the controllable valve comprises a valve cavity, a valve plate and a cleaning assembly; the valve plate is rotatably arranged in the valve cavity to block or conduct the air path of the suction pipe; the cleaning assembly is arranged in the valve cavity and comprises a plurality of cleaning ports for spraying a cleaning fluid; the cleaning assembly is arranged to include at least a first posture cooperating with the valve plate in a position conducting the air path, so that the plurality of cleaning ports can face the surface of the valve plate at a first preset inclination angle; the cleaning port ejects a first oblique fluid capable of stripping off attachments on the surface of the valve plate at the first preset inclination angle;

[0010] A controller is communicatively connected to the suction component, the controllable valve, and the cleaning component; the controller responds to the working signal of the semiconductor degumming equipment to control the valve plate of the controllable valve to be in a position to conduct the air path of the suction pipe, and starts the cleaning component and the suction component to work.

[0011] In an embodiment of the first aspect, the direction of the cleaning port is adjustable; the cleaning component also includes a second posture that cooperates with the valve cavity wall after the gas path is opened, so that the multiple cleaning ports can be oriented toward the valve cavity wall at a second preset inclination angle; the cleaning port ejects a second beveled fluid that can peel off the attachments on the valve cavity wall at the second preset inclination angle; wherein the cleaning port can be intermittently set to switch between the first posture and the second posture.

[0012] In an embodiment of the first aspect, the cleaning component includes a accommodating part, a plurality of cleaning tubes and an adjusting part; the accommodating part includes a accommodating cavity; each of the cleaning tubes is rotatably connected to the accommodating part, and one end of each of the cleaning tubes is connected to the accommodating cavity through a pipeline, and the other end forms the cleaning port; the adjusting part includes a plurality of linkage components and a telescopic component that drives and connects the plurality of linkage components; the telescopic component is communicatively connected to the controller; each of the linkage components is correspondingly connected to a cleaning tube; wherein, when the telescopic component is extended and retracted, the cleaning tube can be driven by the linkage component to intermittently tilt toward the valve cavity wall and the valve plate surface.

[0013] In an embodiment of the first aspect, when the valve plate rotates to connect the air path of the suction pipe, a portion of the cleaning port can swing toward different positions of the outer edge of the valve plate, and another portion intermittently tilts toward the valve cavity wall and the valve plate surface.

[0014] In an embodiment of the first aspect, the containing part is implemented in a ring shape, and the plurality of clearing tubes are rotatably connected to the containing part at intervals along the circumference of the containing part; the linkage component includes a plurality of driven wheels and an active column; each of the driven wheels is correspondingly connected to a clearing tube, the telescopic member is arranged between the plurality of driven wheels and the output end is connected to the active column, and the outer edge surface of the active column is connected to the outer edge surface of the plurality of driven wheels; wherein, when the telescopic member is extended and retracted, the plurality of clearing tubes are driven to intermittently tilt toward the valve plate surface and the valve chamber wall.

[0015] In an embodiment of the first aspect, the driven wheel is connected to the active column by a meshing connection or an abutment connection.

[0016] In an embodiment of the first aspect, the cleaning assembly includes a receiving member having a receiving cavity and a plurality of cleaning tubes; the receiving member is implemented as an annular shape, and the plurality of cleaning tubes are arranged at intervals along the circumference of the annular receiving member and are inclined toward the surface of the valve plate; one end of each cleaning tube communicates with the receiving cavity, and the other end forms the cleaning port.

[0017] In an embodiment of the first aspect, the controllable valve further includes a supply pipe; one end of the supply pipe is located outside the controllable valve, and the other end penetrates into the valve cavity and communicates with the receiving member.

[0018] In an embodiment of the first aspect, the cleaning assembly includes a receiving member, a plurality of cleaning tubes, and an adjusting member; the receiving member includes a receiving cavity; each cleaning tube is rotatably connected to the receiving member, and one end of each cleaning tube communicates with the receiving cavity through a pipeline, and the other end forms the cleaning port; the adjusting member is implemented to include a plurality of motors, and each motor is drivingly connected to one of the cleaning tubes.

[0019] In an embodiment of the first aspect, the controllable valve further includes a driving member drivingly connected to the valve plate; the driving member is communicatively connected to the controller, and the driving member is implemented as a servo motor; and / or, the controllable valve includes a first valve housing and a second valve housing detachably connected; the valve plate is disposed in the first valve housing, and the cleaning assembly is disposed in the second valve housing; and / or, the range of the first preset inclination angle is 30 degrees - 60 degrees.

[0020] As described above, the embodiment of the present disclosure provides a semiconductor degumming device, including a reaction chamber, a carrier, a suction device and a controller. The reaction chamber includes a vent hole for introducing a plasma gas for forming degumming. The carrier is arranged in the reaction chamber for carrying the product to be degummed. The suction device includes a suction component and a suction pipe; one end of the suction pipe is connected to the reaction chamber, and the other end is connected to the suction component, which is used to extract the product generated by degumming from the reaction chamber; the suction pipe is provided with a controllable valve; the controllable valve includes a valve cavity, a valve plate and a cleaning component; the valve plate is rotatably arranged in the valve cavity to block or conduct the gas path of the suction pipe; the cleaning component is arranged in the valve cavity and includes a plurality of cleaning ports for spraying a cleaning fluid; the cleaning component is arranged to include at least a first posture that cooperates with the valve plate in a position to conduct the gas path, so that the plurality of cleaning ports can face the surface of the valve plate at a first preset inclination angle; the cleaning port ejects a first oblique fluid that can peel off the attachments on the surface of the valve plate at the first preset inclination angle. The controller is communicatively connected to the suction component, the controllable valve, and the cleaning component; the controller responds to the working signal of the semiconductor degumming device to control the valve plate of the controllable valve to be in a position to conduct the air path of the suction pipe, and to start the cleaning component and the suction component to work. In the embodiment of the present disclosure, the plurality of cleaning ports arranged obliquely can emit a first oblique fluid obliquely directed toward the surface of the valve plate to separate impurities attached to the surface of the valve plate from the surface of the valve plate, thereby avoiding the situation where the valve plate cannot rotate normally due to a large number of impurities deposited on the surface, thereby avoiding the situation where the semiconductor degumming device cannot operate due to a malfunction of the controllable valve. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The figure shows a schematic diagram of the overall structure of the embodiment of the present disclosure;

[0022] Figure 2 A communication connection diagram of an embodiment of the present disclosure is shown in FIG.

[0023] Figure 3 , which is a cross-sectional schematic diagram of a controllable valve in an embodiment of the present disclosure;

[0024] Figure 4 , which is a cross-sectional schematic diagram of the controllable valve in another perspective of the embodiment of the present disclosure;

[0025] Figure 5 , which is a schematic diagram of the force components of the first oblique fluid in the embodiment of the present disclosure;

[0026] Figure 6 FIG. 1 is a cross-sectional schematic diagram of another embodiment of a cleaning tube in the disclosed embodiment;

[0027] Figure 7 The figure shows a cross-sectional schematic view of another embodiment of the cleaning component in the present disclosure;

[0028] Figure 8 As shown in the figure, it includes Figure 7 A cross-sectional schematic view of the control valve of the cleaning component in the example;

[0029] Figure 9 As shown in the figure Figure 7 A cross-sectional schematic view of the cooperation between the driven wheel and the output end of the telescopic member in the example;

[0030] Figure 10 The figure shows a structural schematic view of a computer device in an embodiment of the present disclosure.

[0031] Reference numerals:

[0032] 10. Reaction chamber; 101. Ventilation hole;

[0033] 20. Carrying platform;

[0034] 30. Suction device; 31. Suction component; 32. Suction pipe; 33. Control valve; 3301. Valve cavity; 33011. Inlet; 33012. Outlet; 331. Valve plate; 332. Cleaning component; 33201. Cleaning port; 3321. Accommodating component; 33211. Accommodating cavity; 3322. Cleaning pipe; 3323. Adjusting component; 33231. Linkage member; 332311. Driven wheel; 332312. Driving column; 33232. Telescopic member; 333. Driving member; 334. Supply pipe; 335. First valve housing; 336. Second valve housing;

[0035] 40. Controller; 401. Bus; 402. Processor; 403. Memory; 404. Communicator. Detailed implementation manners

[0036] The following uses specific examples to illustrate the implementation manners of the present disclosure. Those skilled in the art can easily understand other advantages and effects of the present disclosure from the information disclosed in the present disclosure. The present disclosure can also be implemented or applied through other different specific implementation manners. Various details in the present disclosure can also be modified or changed according to different viewpoints and application modules without departing from the spirit of the present disclosure. It should be noted that, without conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0037] The following takes the drawings as a reference and details the embodiments of the present disclosure so that those skilled in the art to which the present disclosure pertains can easily implement it. The present disclosure can be embodied in many different forms and is not limited to the embodiments described herein.

[0038] In the descriptions of the present disclosure, statements referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials, or characteristics represented in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. Moreover, the specific features, structures, materials, or characteristics represented may be combined in a suitable manner in any one or a group of embodiments or examples. In addition, without contradiction, those skilled in the art may combine and combine different embodiments or examples represented in the present disclosure and the features of different embodiments or examples.

[0039] In addition, the terms "first" and "second" are used for illustrative purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the descriptions of the present disclosure, the meaning of "a group" is two or more, unless otherwise specifically defined.

[0040] To clearly illustrate the present disclosure, devices irrelevant to the description are omitted, and the same or similar components throughout the specification are given the same reference numerals.

[0041] Throughout the specification, when it is said that a device is "connected" to another device, this includes not only the case of "direct connection", but also the case of "indirect connection" with other elements interposed therebetween. In addition, when it is said that a certain device "includes" a certain component, unless there is a particularly contrary record, it does not exclude other components, but means that other components may also be included.

[0042] Although in some examples the terms first, second, etc. are used herein to denote various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first interface and the second interface, etc. are indicated. Moreover, as used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms unless the context indicates otherwise. It should be further understood that the terms "comprise" and "include" indicate the presence of the stated features, steps, operations, elements, modules, items, kinds, and / or groups, but do not preclude the presence, occurrence, or addition of one or a group of other features, steps, operations, elements, modules, items, kinds, and / or groups. The term "or" and "and / or" used herein are interpreted as inclusive, or meaning any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition occurs only when the combination of elements, functions, steps, or operations is mutually exclusive in some way.

[0043] The technical terms used herein are only for referring to specific embodiments and are not intended to limit the present disclosure. The singular forms used herein also include the plural forms as long as the statements do not clearly indicate the contrary meaning. The meaning of "including" used in the specification is to embody specific features, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other features, regions, integers, steps, operations, elements and / or components.

[0044] Although not defined differently, including the technical terms and scientific terms used herein, all terms have the same meaning as generally understood by those skilled in the technical field to which the present disclosure pertains. Terms defined in commonly used dictionaries are additionally interpreted to have meanings consistent with the relevant technical literature and the currently presented information. As long as they are not defined, they shall not be over-interpreted as ideal or overly formulaic meanings.

[0045] The plasma ashing process is an important cleaning step in industries such as semiconductor single-chip ashing, bottom film ashing, before component packaging, and chip manufacturing. Plasma ashing not only has simple operation, high ashing efficiency, clean and smooth surface without scratches, low cost, and environmental protection. It mainly removes photoresist by the reaction of oxygen nuclei and photoresist in a plasma environment. Since the basic components of photoresist are hydrocarbon organic compounds, under the action of radio frequency or microwave, oxygen is ionized into oxygen atoms and reacts chemically with the photoresist to generate carbon monoxide, carbon dioxide, water, etc., which are then evacuated by a pump to complete the removal of the photoresist.

[0046] However, a valve body for controlling the conduction or disconnection between the pump and the reaction chamber is usually provided on the pipeline connecting the pump and the reaction chamber. Therefore, when the valve body is in the conducting state, when the reaction products are evacuated, some of them will adhere to the surface of the valve plate and the wall surface of the valve cavity inside the valve body, and over time, it will cause the valve opening to be unstable or stuck.

[0047] Based on the above problems, in the embodiments of the present disclosure, the plurality of inclined cleaning ports can emit a first beveled fluid that is obliquely incident on the surface of the valve plate to detach the impurities adhering to the surface of the valve plate, thereby avoiding the situation where the valve plate cannot rotate normally due to excessive impurities deposited on the surface, and thus avoiding the situation where the semiconductor ashing equipment cannot operate due to a failure of the controllable valve.

[0048] Figure 1 Shown in [the figure] is a schematic diagram of the overall structure of the embodiments of the present disclosure. Figure 2 Shown in [the figure] is a schematic diagram of the communication connection of the embodiments of the present disclosure. Figure 3 Shown in [the figure] is a cross-sectional view of the controllable valve in the embodiments of the present disclosure. Figure 4FIG. 1 is a cross-sectional schematic diagram of a controllable valve from another perspective in an embodiment of the present disclosure. Figure 1 , Figure 2 and Figure 3 , Figure 4 In the example, the semiconductor degumming equipment includes a reaction chamber 10, a carrier 20, a suction device 30 and a controller 40. The reaction chamber 10 includes an air vent 101 for introducing a plasma gas for forming degumming. The carrier 20 is disposed in the reaction chamber 10, and is used to carry the product to be degummed. The suction device 30 includes a suction component 31 and a suction pipe 32; one end of the suction pipe 32 is connected to the reaction chamber 10, and the other end is connected to the suction component 31, and is used to extract the product generated by degumming from the reaction chamber 10; the suction pipe 32 is provided with a controllable valve 33; the controllable valve 33 includes a valve cavity 3301, a valve plate 331 and a cleaning component 332; the valve plate 331 is rotatably disposed in the valve cavity 3301 to block or conduct the gas path of the suction pipe 32; the cleaning The cleaning component 332 is arranged in the valve cavity 3301 and includes a plurality of cleaning ports 33201 for spraying cleaning fluid; the cleaning component 332 is arranged to include a first posture that cooperates with at least the valve plate 331 in the position of conducting the gas path, so that the plurality of cleaning ports 33201 can face the surface of the valve plate 331 at a first preset tilt angle; the cleaning ports 33201 eject a first oblique fluid that can peel off the attachments on the surface of the valve plate 331 at the first preset tilt angle. The controller 40 is communicatively connected to the suction component 31, the controllable valve 33, and the cleaning component 332; the controller 40 controls the valve plate 331 of the controllable valve 33 to be in the position of conducting the gas path of the suction pipe 32 in response to the working signal of the semiconductor degumming equipment, and starts the cleaning component 332 and the suction component 31 to work.

[0049] The advantage of the above-mentioned arrangement is that the multiple obliquely arranged cleaning ports 33201 in the embodiment of the present disclosure can emit a first oblique fluid obliquely directed toward the surface of the valve plate 331 to separate impurities attached to the surface of the valve plate 331 from the surface of the valve plate 331, thereby avoiding the situation where the valve plate 331 cannot rotate normally due to a large amount of impurities deposited on the surface, thereby avoiding the situation where the semiconductor degumming equipment cannot operate due to a malfunction of the controllable valve 33.

[0050] Figure 5 The figure shows the force component of the first oblique fluid in the embodiment of the present disclosure. Figure 5As can be seen from the example, when flushing obliquely, the first beveled fluid acts on the impurities on the surface of the valve plate 331 at a certain angle. This angle causes the first beveled fluid to generate a horizontal component force that flows along the air passage direction on the surface of the valve plate 331 in addition to the impact force perpendicular to the surface of the valve plate 331. For impurities with a certain inclination angle or impurities with a large area and tightly fitting the surface of the valve plate 331, the horizontal component force of the first beveled fluid helps to push the impurities to slide on the surface of the valve plate 331, thus being more conducive to removing the impurities from the surface of the valve plate 331.

[0051] Exemplarily, the fluid can be implemented as a gas or a liquid. Exemplarily, the suction component 31 is implemented as a negative pressure pump.

[0052] In Figure 3 the example, the valve cavity 3301 includes an inlet 33011 and an outlet 33012. The inlet 33011 is communicated with the reaction chamber 10, and the outlet 33012 is communicated with the suction component 31. Exemplarily, the cleaning component 332 is arranged at the inlet 33011 of the valve cavity 3301. The advantage of such an arrangement is that the impurities stripped by the cleaning component 332 can directly flow along the air passage to the suction component 31.

[0053] Exemplarily, the cleaning component 332 includes a receiving component 3321 having a receiving cavity 33211 and a plurality of cleaning tubes 3322; the receiving component 3321 is implemented as a ring, and the plurality of cleaning tubes 3322 are arranged at intervals along the circumferential direction of the ring-shaped receiving component 3321 and are inclined towards the surface of the valve plate 331. One end of each cleaning tube 3322 is communicated with the receiving cavity 33211, and the other end forms the cleaning port 33201.

[0054] Exemplarily, the range of the first preset inclination angle is 30 degrees - 60 degrees; preferably, the first preset inclination angle is 45 degrees. In this way, the magnitude of the impact force perpendicular to the surface of the valve plate 331 is the same as the magnitude of the horizontal component force flowing along the air passage direction, thereby improving the cleaning effect of the impurities on the surface of the valve plate 331.

[0055] Figure 6 shown is a cross-sectional schematic view of another embodiment of the cleaning tube in the embodiment of the present disclosure. In Figure 6 the example, the inner diameter of the cleaning tube 3322 gradually decreases in the direction away from the receiving component 3321. Those skilled in the art can understand that the smaller inner diameter of the cleaning port 33201 can increase the flow rate of the first beveled fluid ejected through the cleaning port 33201, thereby further improving the cleaning effect of the first beveled fluid on the impurities on the surface of the valve plate 331.

[0056] Returning again to Figure 4 Figure 4

[0057] In other embodiments, the receiving member 3321 may also be implemented as an annular shape with a rectangular cross-section, and the length direction of the rectangle is parallel to the axial direction of rotation of the valve plate 331.

[0058] Exemplarily, the controllable valve 33 further includes a driving member 333 drivingly connected to the valve plate 331; the driving member 333 is communicatively connected to the controller 40. The driving member 333 is implemented as a servo motor.

[0059] Exemplarily, the controllable valve 33 further includes a supply pipe 334; one end of the supply pipe 334 is located outside the controllable valve 33 (communicating with an external fluid supply device), and the other end penetrates into the valve cavity 3301 and communicates with the receiving member 3321. For example, an installation hole (not shown in the figure) communicating with the valve cavity 3301 is formed on the controllable valve 33, and the other end of the supply pipe 334 passes through the installation hole into the valve cavity 3301 and communicates with the receiving cavity 33211 of the receiving member 3321. It should be noted that the supply pipe 334 is sealed with the installation hole.

[0060] Those skilled in the art can understand that when impurities flow through the controllable valve 33, they will not only adhere to the surface of the valve plate 331, but also adhere to the wall surface of the valve cavity 3301, especially when the valve plate 331 is in the position of conducting the air path, the area on the wall surface of the valve cavity 3301 that fits the outer edge surface of the valve plate 331. When more impurities adhere to this area, the valve plate 331 cannot smoothly rotate to the position of blocking the air path.

[0061] Figure 7 Shown therein is a cross-sectional schematic view of another embodiment of the cleaning assembly in the present disclosure. Figure 8 Shown therein is included Figure 7 A cross-sectional schematic view of the controllable valve of the cleaning assembly in the example. Combining Figure 7 and Figure 8It can be seen that the direction of the cleaning port 33201 is adjustable. The cleaning component 332 also includes a second posture that cooperates with the wall of the valve cavity 3301 after the gas path is connected, so that the multiple cleaning ports 33201 can face the wall of the valve cavity 3301 at a second preset tilt angle; the cleaning port 33201 emits a second oblique fluid that can peel off the attachments on the wall of the valve cavity 3301 at the second preset tilt angle; wherein the cleaning port 33201 can be intermittently set to switch between the first posture and the second posture.

[0062] It needs to be stated that Figure 7 In the example, only two of the cleaning pipes 3322 and the driven wheels on the same cross-sectional plane are shown, and the specific structures of the remaining cleaning pipes 3322 and the driven wheels are the same as those in the embodiment of the present invention. Figure 7 The same as shown in , but the distribution angle is different, so it is not shown here.

[0063] For example, the force analysis diagram of the second bevel fluid acting on the wall of the valve chamber 3301 is as follows: Figure 5 The examples are similar, so they are not shown here.

[0064] Because this application Figure 7 The cleaning port 33201 in the example can be intermittently switched between the first posture and the second posture to intermittently clean the impurities attached to the surface of the valve plate 331 and the wall surface of the valve cavity 3301. This avoids the situation where the valve plate 331 cannot be smoothly rotated to the position of blocking the gas path due to impurities attached to the area of the wall surface of the valve cavity 3301 that is in contact with the outer edge surface of the valve plate 331.

[0065] Exemplarily, the cleaning component 332 includes a accommodating part 3321, a plurality of cleaning tubes 3322 and an adjusting part 3323; the accommodating part 3321 includes a accommodating cavity 33211; each of the cleaning tubes 3322 is rotatably connected to the accommodating part 3321, and one end of each of the cleaning tubes 3322 is connected to the accommodating cavity 33211 through a hose, and the other end forms the cleaning port 33201; the adjusting part 3323 includes a plurality of linkage members 33231 and a telescopic member 33232 drivingly connected to the plurality of linkage members 33231; the telescopic member 33232 is communicatively connected to the controller 40; wherein, when the telescopic member 33232 is extended and retracted, the plurality of cleaning tubes 3322 can be driven to intermittently tilt toward the wall of the valve cavity 3301 and the surface of the valve plate 331 through the plurality of linkage members 33231.

[0066] exist Figure 7In the example, the accommodating member 3321 is implemented with an annular cross-section, and a plurality of the cleaning tubes 3322 are rotatably connected to the accommodating member 3321 at intervals along the circumferential direction of the accommodating member 3321; ( Figure 7 The schematic diagram of the connecting member provided between the cleaning tube 3322 and the accommodating member 3321 is shown by the dashed line in). The linkage member 33231 includes a plurality of driven wheels 332311 and a driving column 332312; each of the driven wheels 332311 is correspondingly connected to a cleaning tube 3322, the telescopic member 33232 is disposed between the plurality of driven wheels 332311 and the output end is connected to the driving column 332312, and the outer edge surface of the driving column 332312 is in contact with the outer edge surfaces of the plurality of driven wheels 332311; wherein, when the telescopic member 33232 expands and contracts, it drives the plurality of cleaning tubes 3322 to intermittently incline towards the surface of the valve plate 331 and the wall surface of the valve cavity 3301.

[0067] Exemplarily, the manner in which the driven wheel 332311 is connected to the driving column 332312 is implemented as a meshing connection or an abutting connection.

[0068] In Figure 7 In the example, the manner in which the driven wheel 332311 is connected to the output end of the driving column 332312 is implemented as an abutting connection, that is, the outer edge surface of the driven wheel 332311 abuts against the outer edge surface of the driving column 332312. It can be understood that when the telescopic member 33232 expands and contracts, it drives the plurality of driven wheels 332311 to rotate through the frictional force between the outer edge surface of the driving column 332312 and the outer edge surface of the driven wheel 332311, thereby driving the cleaning tube 3322 to rotate, so that the cleaning port 33201 can intermittently switch between the first posture and the second posture.

[0069] Figure 9 As shown in Figure 7 The cross-sectional schematic diagram of the cooperation between the driven wheel and the output end of the telescopic member in the example. In Figure 9 In the example, the outer edge surface of each of the driven wheels 332311 is implemented as an arc surface that fits the outer edge surface of the driving column 332312. The advantage of such a setting is that it can increase the contact area between the driven wheel 332311 and the driving column 332312 to increase the frictional force between the driving column 332312 and the driven wheel 332311. Further exemplarily, the outer edge surface of the driven wheel 332311 is provided with an anti-slip layer, such as a rubber layer, so as to further increase the frictional force between the driving column 332312 and the driven wheel 332311.

[0070] In other embodiments, the way the driven wheel is connected to the output end of the telescopic member 33232 is implemented as a meshing connection. That is, the outer edge surfaces of the driven wheel and the output end of the telescopic member 33232 are respectively provided with matching teeth.

[0071] Combined Figure 4 with Figure 7 the examples, when the valve plate 331 rotates to conduct the air path of the suction pipe 32, a part of the cleaning ports 33201 can swing towards different positions on the outer edge surface of the valve plate 331, and another part intermittently inclines towards the wall surface of the valve cavity 3301 and the surface of the valve plate 331. For example, in Figure 4 the example, when the valve plate 331 rotates to conduct the air path of the suction pipe 32, the two cleaning pipes 3322 facing the outer edge surface of the valve plate 331 on the valve plate 331 towards the cleaning assembly 332 face different positions on the outer edge surface of the valve plate 331 under the drive of the adjusting member 3323, while the multiple cleaning pipes 3322 not facing the outer edge surface of the valve plate 331 intermittently incline towards the surface of the valve plate 331 and the inner wall of the valve cavity 3301 under the drive of the adjusting member 3323.

[0072] Exemplarily, the telescopic member 33232 is implemented as an oil cylinder, a pneumatic cylinder or an electric cylinder. Further exemplarily, the stroke of the telescopic member 33232 is configured such that at the starting position, part of the cleaning ports 33201 are aligned with the area on the wall surface of the valve cavity 3301 that fits the outer edge surface of the valve plate 331; at the end position, part of the cleaning ports 33201 are aligned with the edge of the valve plate 331 close to the cleaning assembly 332. In other embodiments, at the end position, part of the cleaning ports 33201 can also cross the edge of the valve plate 331 close to the cleaning assembly 332.

[0073] In other implementations, the adjusting member 3323 is implemented to include a plurality of motors, and each motor is drivingly connected to a cleaning pipe 3322. It can be understood that the orientation of the cleaning ports 33201 is adjusted by the drive of the motors.

[0074] In another embodiment, the linkage member 33231 is implemented to include a plurality of pulleys, a plurality of pulling belts, and a plurality of torsion springs. Each of the pulleys is correspondingly connected to one of the cleaning pipes 3322. One end of each pulling belt is fixedly connected to the pulley groove of the pulley, and the other end is fixedly connected to the output end of the telescopic member 33232. A torsion spring for reverse rotation is provided between each cleaning pipe 3322 and the accommodating member 3321. For example, when the telescopic member 33232 retracts, the output end of the telescopic member 33232 drives the pulley to rotate through the pulling belt, thereby driving the cleaning pipe 3322 to rotate until the cleaning port changes from facing the surface of the valve plate 331 to facing the wall surface of the valve cavity 3301. During this process, the torsion spring stores energy; when the telescopic member 33232 extends, the pulling belt has no force transmission. During this process, the torsion spring releases its force to drive the cleaning pipe 3322 to rotate in the reverse direction until the cleaning port 33201 faces the surface of the valve plate 331 again, and the above process is intermittently repeated.

[0075] It should be noted that, in the above embodiment, the circuits of the driving member 333 and the telescopic member 33232 pass through the installation hole together with the supply pipe 334.

[0076] Exemplarily, the time for the intermittent conversion of the cleaning port 33201 is implemented as 30S. In other embodiments, the time for the intermittent conversion of the cleaning port 33201 is implemented as 1 min.

[0077] Exemplarily, fluid still sprays out when the cleaning port 33201 changes its orientation. Those skilled in the art can understand that during the process of the cleaning port 33201 changing from facing the surface of the valve plate 331 to facing the wall surface of the valve cavity 3301, the fluid sprayed from the cleaning port 33201 will successively hit different positions on the surface of the valve plate 331 and part of the wall surface of the valve cavity 3301, thereby improving the cleaning effect on the inside of the controllable valve 33.

[0078] Back to Figure 8 In the example, the controllable valve 33 includes a first valve housing 335 and a second valve housing 336 that are detachably connected; the valve plate 331 is arranged in the first valve housing 335, and the cleaning assembly 332 is arranged in the second valve housing 336. The advantage of the above arrangement is that the user can repair or replace the cleaning assembly 332 by separating the first valve housing 335 and the second valve housing 336.

[0079] Figure 10 Shown in the figure is a schematic structural diagram of a computer device in an embodiment of the present disclosure. In Figure 10 In the example,

[0080] The computer device includes a bus 401, a processor 402, and a memory 403. The processor 402 and the memory 403 can communicate through the bus 401. Program instructions can be stored in the memory 403. The above-mentioned controller 40 can be implemented by the computer device instead. The processor 402 realizes the steps of the controller 40 in the figures of the previous embodiments by running the program instructions in the memory 403.

[0081] The bus 401 can be a Peripheral Component Interconnect (PCI) bus 401 or an Extended Industry Standard Architecture (EISA) bus 401, etc. The bus 401 can be divided into an address bus 401, a data bus 401, a control bus 401, etc. For the sake of convenience in representation, although only a thick line is used in the figure, it does not mean that there is only one bus 401 or one type of bus 401.

[0082] In some embodiments, the processor 402 can be implemented as a Central Processing Unit (CPU), a Microcontroller Unit (MCU), a System On Chip, or a Field Programmable Gate Array (FPGA), etc. The memory 403 can include a volatile memory for temporarily storing data when running a program, such as a Random Access Memory (RAM).

[0083] The memory 403 can also include a non-volatile memory for data storage, such as a Read-Only Memory (ROM), a flash memory, a Hard Disk Drive (HDD), or a Solid-State Disk (SSD).

[0084] In some embodiments, the computer device may further include a communicator 404. The communicator 404 is used for external communication. In a specific example, the communicator 404 may include one or a group of wired and / or wireless communication circuit modules. For example, the communicator 404 may include one or more of, for example, a wired network card, a USB module, a serial interface module, etc. The wireless communication protocols followed by the wireless communication module include: for example, one or more of Near Field Communication (NFC) technology, Infrared (IR) technology, Global System for Mobile communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Bluetooth (BT), Global Navigation Satellite System (GNSS), etc.

[0085] In summary, the embodiment of the present disclosure provides a semiconductor degumming device, including a reaction chamber, a carrier, a suction device and a controller. The reaction chamber includes a vent hole for introducing a plasma gas for forming degumming. The carrier is arranged in the reaction chamber for carrying the product to be degummed. The suction device includes a suction component and a suction pipe; one end of the suction pipe is connected to the reaction chamber, and the other end is connected to the suction component, which is used to extract the product generated by degumming from the reaction chamber; the suction pipe is provided with a controllable valve; the controllable valve includes a valve cavity, a valve plate and a cleaning component; the valve plate is rotatably arranged in the valve cavity to block or conduct the gas path of the suction pipe; the cleaning component is arranged in the valve cavity and includes a plurality of cleaning ports for spraying a cleaning fluid; the cleaning component is arranged to include a first posture that cooperates with at least the valve plate in a position to conduct the gas path, so that the plurality of cleaning ports can face the surface of the valve plate at a first preset inclination angle; the cleaning port ejects a first oblique fluid that can peel off the attachments on the surface of the valve plate at the first preset inclination angle. The controller is communicatively connected to the suction component, the controllable valve, and the cleaning component; the controller responds to the working signal of the semiconductor degumming device to control the valve plate of the controllable valve to be in a position to conduct the air path of the suction pipe, and to start the cleaning component and the suction component to work. In the embodiment of the present disclosure, the plurality of cleaning ports arranged obliquely can emit a first oblique fluid obliquely directed toward the surface of the valve plate to separate impurities attached to the surface of the valve plate from the surface of the valve plate, thereby avoiding the situation where the valve plate cannot rotate normally due to a large number of impurities deposited on the surface, thereby avoiding the situation where the semiconductor degumming device cannot operate due to a malfunction of the controllable valve.

[0086] The above embodiments are merely illustrative of the principles and effects of the present disclosure, and are not intended to limit the present disclosure. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present disclosure. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present disclosure shall still be covered by the protection scope of the present disclosure.

Claims

1. A semiconductor degumming device, characterized in that, include: The reaction chamber includes a vent hole for introducing a plasma gas for forming a debonding process; A carrying platform, arranged in the reaction chamber, for carrying the product to be debonded; A suction device, comprising a suction component and a suction pipe; one end of the suction pipe is connected to the reaction chamber, and the other end is connected to the suction component, and is used to extract the product generated by the degumming process from the reaction chamber; The suction pipe is provided with a controllable valve; the controllable valve comprises a valve cavity, a valve plate and a cleaning assembly; the valve plate is rotatably arranged in the valve cavity to block or conduct the air path of the suction pipe; the cleaning assembly is arranged in the valve cavity and comprises a plurality of cleaning ports for spraying a cleaning fluid; the cleaning assembly is arranged to include at least a first posture cooperating with the valve plate in a position conducting the air path, so that the plurality of cleaning ports can face the surface of the valve plate at a first preset inclination angle; the cleaning port ejects a first oblique fluid capable of stripping off attachments on the surface of the valve plate at the first preset inclination angle; A controller is communicatively connected to the suction component, the controllable valve, and the cleaning component; the controller controls the valve plate of the controllable valve to be in a position to conduct the air path of the suction pipe in response to the working signal of the semiconductor degumming device, and starts the cleaning component and the suction component to work; The direction of the cleaning port is adjustable; the cleaning component also includes a second posture that cooperates with the valve cavity wall after the gas path is opened, so that the multiple cleaning ports can be oriented toward the valve cavity wall at a second preset inclination angle; the cleaning port ejects a second oblique fluid that can peel off the attachments on the valve cavity wall at the second preset inclination angle.

2. The semiconductor de-bonding device according to claim 1, wherein The purge port is provided so as to be intermittently switchable between the first posture and the second posture.

3. The semiconductor de-glueing device according to claim 1, wherein The cleaning assembly includes a accommodating part, a plurality of cleaning tubes and an adjusting part; the accommodating part includes a accommodating cavity; each of the cleaning tubes is rotatably connected to the accommodating part, and one end of each of the cleaning tubes is connected to the accommodating cavity through a pipeline, and the other end forms the cleaning port; the adjusting part includes a plurality of linkage components and a telescopic component that drives and connects the plurality of linkage components; the telescopic component is communicatively connected to the controller; each of the linkage components is correspondingly connected to a cleaning tube; wherein, when the telescopic component is extended and retracted, the cleaning tube can be driven by the linkage component to intermittently tilt toward the valve cavity wall and the valve plate surface.

4. The semiconductor stripping device according to claim 3, wherein When the valve plate rotates to connect the air path of the suction pipe, a part of the cleaning port can swing toward different positions of the outer edge of the valve plate, and another part intermittently tilts toward the valve cavity wall and the valve plate surface.

5. The semiconductor de-gluing device according to claim 3, wherein, The accommodating member is implemented as a ring, and a plurality of the cleaning pipes are rotatably connected to the accommodating member at intervals along the circumferential direction of the accommodating member; the linkage member includes a plurality of driven wheels and a driving column; each of the driven wheels is correspondingly connected to one of the cleaning pipes, the telescopic member is disposed between the plurality of driven wheels and the output end thereof is connected to the driving column, and the outer edge surface of the driving column is in contact with the outer edge surfaces of the plurality of driven wheels; wherein, when the telescopic member expands and contracts, it drives the plurality of cleaning pipes to intermittently incline towards the surface of the valve plate and the wall surface of the valve cavity.

6. The semiconductor de-bonding device according to claim 5, wherein, The way that the driven wheel is in contact with the driving column is implemented as meshing connection or abutting connection.

7. The semiconductor de-bonding device according to claim 1, wherein The cleaning assembly includes an accommodating member having an accommodating cavity and a plurality of cleaning pipes; the accommodating member is implemented as a ring, the plurality of cleaning pipes are arranged at intervals along the circumferential direction of the ring-shaped accommodating member, and are inclined towards the surface of the valve plate; one end of each cleaning pipe communicates with the accommodating cavity, and the other end forms the cleaning port.

8. The semiconductor degumming device according to claim 3 or 7, characterized in that, The controllable valve further includes a supply pipe; one end of the supply pipe is located outside the controllable valve, and the other end penetrates into the valve cavity and communicates with the accommodating member.

9. The semiconductor degumming device according to claim 1, characterized in that, The cleaning assembly includes an accommodating member, a plurality of cleaning pipes and an adjusting member; the accommodating member includes an accommodating cavity; each cleaning pipe is rotatably connected to the accommodating member, and one end of each cleaning pipe communicates with the accommodating cavity through a pipeline, and the other end forms the cleaning port; the adjusting member is implemented as including a plurality of motors, and each motor is drivingly connected to one of the cleaning pipes.

10. The semiconductor degumming device according to claim 1, wherein The controllable valve further includes a driving member drivingly connected to the valve plate; the driving member is communicatively connected to the controller, and the driving member is implemented as a servo motor; and / or, the controllable valve includes a first valve housing and a second valve housing detachably connected; the valve plate is disposed in the first valve housing, and the cleaning assembly is disposed in the second valve housing; and / or, the range of the first preset inclination angle is 30 degrees - 60 degrees.

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